Datasheet
Optocoupler-less
Isolated Flyback Converter
BD7F100HFN-LB BD7F100EFJ-LB
Key Specifications
General Description
Supply Voltage of Operation:
3V to 40V
SW Terminal Operating Voltage:
50V (Max)
Over Current Limit:
1.25A (Typ)
Switching Frequency:
400kHz (Typ)
Reference Voltage Accuracy:
±1.5%
Quiescent Current:
0µA (Typ)
Operating Current:
2mA (Typ)
Junction Temperature of Operation: -40°C to +125°C
This product guarantees long time supply availability in
the industrial instrumentation market.
BD7F100 is an optocoupler-less Isolated Flyback
Converter. An optocoupler or the tertiary winding
feedback circuit which was needed to obtain a stable
output voltage isolated by a transformer in the
conventional application becomes unnecessary, thus,
the number of parts is reduced drastically, producing a
small-sized and high-reliability application isolated type
power supply.
Packages
HSON8
HTSOP-J8
Furthermore, a highly by the use of the Original
Adapted-Type ON-Time Control Technology, it makes
the external phase compensation parts become
unnecessary, therefore a highly efficient isolated type
power supply application can easily be produced.
W(Typ)
D(Typ)
H(Max)
2.90mm x 3.00mm x 0.60mm
4.90mm x 6.00mm x 1.00mm
Features
Guaranteed long time supply availability for
Industrial Applications.
No need for an optocoupler or a transformer tertiary
winding.
The output voltage can be set by two external
resistors and the transformer turns ratio.
Uses Original Adapted Type ON-Time Control
Technology.
High-speed load response is realized and external
phase compensation parts are unnecessary.
Fixed switching frequency and low output ripple
Highly efficient light load mode available (PFM
operation)
Shutdown / Enable Control
Built-in N-Channel MOSFET
Soft start function
Output load compensation function
Protection functions:
VIN Under Voltage Lock-Out (VIN UVLO)
Over Current Protection (OCP)
Thermal Shutdown Protection (TSD)
HTSOP-J8
HSON8
Application
Industrial equipment Isolated Power Supply
O Product structure : silicon monolithic integrated circuit
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O This product has no designed protection against radioactive rays
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BD7F100HFN-LB BD7F100EFJ-LB
Typical Application Circuit
VOUT+
VIN
VIN
SDX/EN
VOUT-
SW
BD7F100HFN-LB
FB
COMP
AGND
REF
PGND
Pin Configuration
(TOP VIEW)
AGND
1
8
VIN
SDX/EN
2
7
SW
COMP
3
6
PGND
REF
4
5
FB
Pin Descriptions
Pin No.
Pin Name
Function
1
AGND
2
SDX/EN
3
COMP
4
REF
Output voltage setup
5
FB
Output voltage setup
6
PGND
Power system GND
7
SW
Switching Output
8
VIN
Power supply
Analog system GND
Shutdown/Enable control
Load Current Compensation of the output voltage set up
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Block Diagram
VIN
FB
SW
INTERNAL
REGULATOR
VREF
COMPARATOR
Shutdown
VREF
Enable
SDX/EN
ADAPTIVE
ON-TIME
CONTROLLER
VIN UVLO
SOFT
START
N-Channel
MOSFET
DRIVER
TSD
OCP
LOAD
COMPENSATION
AGND
REF
COMP
Current Monitor
PGND
Description of Blocks
1. INTERNAL REGULATOR
This is the regulator block for internal circuits.
Also includes a reference voltage generating block (VREF).
This block is in the shutdown state when the SDX/EN terminal is below 0.9V (Typ).
2. VIN UVLO
This is the input low-voltage-protection block.
If the power supply input voltage, VIN, falls to below 2.5V (Typ), it will be detected and this block will be in the protection
state and the SW terminal becomes Hi-Z.
When the power supply input voltage (VIN) rises to 2.65V (Typ), it automatically recovers thorough the soft start.
(Hysteresis voltage: 0.15V (Typ).)
3. SOFT START
When the SDX/EN terminal is in the enable state with more than 2.0V (Typ), this block prevents inrush current and
overshoot in the rising of the output voltage by making the reference voltage of the COMPARATOR block rise slowly from
0V to VREF voltage.
The default soft start time, tSS, is designed to be 6ms (Typ) internally.
The min off time is 750ns (Typ) when the output voltage is below 50% of the set voltage.
4. COMPARATOR
This is the block which compares the reference voltage VREF with the REF terminal voltage which is the feedback
voltage of the SW terminal voltage.
Since the feedback loop is structured by a comparator is established, it has excellent response to load fluctuation.
5. ADAPTIVE ON-TIME CONTROLLER
This is the block corresponding to the original adapted type ON-Time control technology.
Switching frequency is fixed at 400kHz (Typ) under PWM Control when the load is stable.
Under On-Time Control, when the load varies, fast load response is enabled by changing the switching frequency.
During light load, the highly efficient PFM will operate and the self-power dissipation is suppressed by decreasing the
switching frequency.
6. DRIVER
This is the block which drives the built-in N-Channel MOSFET.
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Description of Blocks - continued
7. LOAD COMPENSATION
This is the block which compensates the output voltage regulation by VF characteristic fluctuation of the secondary side
output diode according to the load current.
The current which flows into the built-in N-Channel MOSFET is monitored, and the current according to the compensation
quantity and the time constant which are determined by the external resistor and the capacitor of the COMP terminal is
drawn from the REF terminal. The output voltage rises and is rectified when feedback current which flows into the external
resistor of the REF terminal decreases and the REF terminal voltage falls.
8. TSD
This is the temperature protection block.
If the chip’s junction temperature, Tj, inside the IC is above 175°C (Typ), it will be detected and this block will be in the
protection state and the SW terminal becomes Hi-Z.
If Tj falls to below 150°C (Typ), it will return automatically through soft start.
9. OCP
This is the over-current protection block.
If the peak current during the ON-Time of the built-in N-Channel MOSFET reaches 1.25A (Typ), it will be detected and the
N-Channel MOSFET is turned OFF.
If output voltage goes to 50% or less of the setting voltage, the peak detection current of OCP will be controlled by 0.625A
(Typ).The min off time is 1.5μs (Typ) when the OCP is operated under the condition where the output voltage is 50% of
the set voltage.
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
VIN Input Power Voltage
Symbol
(Note 1)
SW Terminal Voltage
Rating
BD7F100HFN-LB
BD7F100EFJ-LB
Unit
VIN
45
V
VSW
60
V
VSDX/EN
VIN
V
FB Terminal Voltage
VFB
VIN-0.3V to lower value of VIN+0.3V or 45V
V
REF Terminal Voltage
VREF
7
V
SDX/EN Terminal Voltage
COMP Terminal Voltage
Power Dissipation
VCOMP
7
1.75
Pd
Storage Temperature Range
Maximum Junction Temperature
V
(Note 2)
3.75
(Note 3)
W
Tstg
-55 to +150
°C
Tjmax
150
°C
(Note 1) Not to exceed Power Dissipation (Pd).
(Note 2) Reduced by 14.0mW/°C for temperatures above 25°C (when mounted on a one-layer glass-epoxy board with 70mm × 70mm × 1.6mm dimension,
65% copper foil density)
(Note 3) Reduced by 30.0mW/°C for temperatures above 25°C (when mounted on four-layer glass-epoxy board with 70mm × 70mm × 1.6mm dimension.)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Limit
Min
Typ
Max
3
24
40
Unit
VIN Input Power Voltage
VIN
SW Terminal Voltage
VSW
-
-
50
V
Tj
-40
-
+125
°C
Junction Temperature
(Note4)
V
(Note 4) Life time is derated at junction temperature greater than 125°C.
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Electrical Characteristics (Unless otherwise specified Ta = 25°C, VIN = 24V, and VSDX/EN = 2.5V.)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Power Supply
Quiescent Current
IST
-
0
10
µA
Operating Current
ICC
-
2
4
mA
UVLO Detection Voltage
VUVLO
2.3
2.5
2.7
V
UVLO Hysteresis Voltage
VUVLO_HYS
0.1
0.15
0.2
V
VSDX
0.3
0.9
1.5
V
VSDX/EN = 0V
VSDX/EN = 2.5V
VREF = 2V (at PFM operation)
VIN falling
SDX/EN Control
Shutdown Voltage
Enable Voltage
VEN
1.9
2.0
2.1
V
Enable Hysteresis Voltage
VEN_HYS
0.15
0.2
0.25
V
SDX/EN Input Current
ISDX/EN
-
0
1
µA
VREF
0.768
0.78
0.792
V
ON-Resistance
RON
-
0.5
-
Ω
Over Current Limit
ILIMIT
1
1.25
1.5
A
fSW
-
400
-
kHz
tON_MIN
-
350
-
ns
Minimum OFF Time
tOFF_MIN
-
300
-
ns
Maximum OFF Time
tOFF_MAX
-
20
-
µs
tSS
-
6
-
ms
VSDX/EN rising
VSDX/EN=2V
Reference Voltage
Reference Voltage
Switch Characteristics
Switching Frequency
Minimum ON Time
Soft Start Time
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Between SW - PGND terminals
At PWM operation (Duty=40%)
0V to (VREF×90%)
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Typical Performance Curves
8
Restriction by the
current limit 1A (Min)
(W)
POWER
OUTPUT
MAXIMUM
Maximum
[W]
Output
Power
7
Restriction by the SW
terminal voltage 50V (Max)
6
5
4
Maximum output power is restricted in general by a current
limit and the maximum operating voltage of SW terminal.
Furthermore, it also changes with the characteristics of
external parts (Transformer, Schottky barrier diode,
Snubber circuit, etc.).
3
2
1
0
0
5
10
15
20
25
30
35
40
45
50
VIN VOLTAGE
Voltage [V](V)
VIN
Figure 1. Maximum Output Power vs VIN Voltage
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Typical Performance Curves
1
2.5
0.9
2
0.7
Operating Current [mA]
Quiescent Current [μA]
0.8
0.6
0.5
0.4
SDX/EN=0V
0.3
0.2
1.5
1
REF=2V
COMP=0V
0.5
0.1
0
0
0
10
20
30
40
0
10
VIN Voltage [V]
30
40
VIN Voltage [V]
Figure 2. Quiescent Current vs VIN Voltage
Figure 3. Operating Current vs VIN Voltage
40
500
450
35
400
30
Switching Frequency [KHz]
SDX/EN Input Current [μA]
20
25
20
15
10
5
350
300
250
200
150
100
50
0
0
0
5
10
15
20
25
30
35
40
SDX/EN Voltage [V]
25
30
35
40
45
50
Duty [%]
Figure 4. SDX/EN Input Current vs SDX/EN Voltage
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Figure 5. Switching Frequency vs Duty
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100
5.25
90
5.2
80
5.15
70
5.1
Output Voltage [V]
Efficiency [%]
Typical Performance Curves
60
50
40
30
5.05
5
4.95
4.85
10
4.8
0
200
400
600
800
1000
Load Current [mA]
No load
compensation
4.9
20
0
With load
compensation
RCOMP=43kΩ
4.75
0
200
400
600
800
1000
Load Current [mA]
Figure 7. Output Voltage vs Load Current
(24V Input, 5V Output)
Figure 6. Efficiency vs Load Current
(24V Input, 5V Output)
5
4.95
Output Voltage [V]
4.9
4.85
IOUT: 500mA/Div
4.8
4.75
4.7
VOUT: 500mV/Div
IOUT=1A
No load
compensation
4.65
4.6
4.55
4.5
-50
0
50
100
150
Time: 1ms/Div
Ambient Temperature [°C]
Figure 8. Output Voltage vs Ambient Temperature
(24V Input, 5V Output)
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Figure 9. Load Transient Response
(24V Input, 5V Output, with Load Compensation,
and IOUT = 300mA 1A)
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Typical Performance Curves
VIN: 20V/Div
VIN: 20V/Div
SDX/EN: 2V/Div
SDX/EN: 2V/Div
VOUT: 2V/Div
VOUT: 2V/Div
SW: 20V/Div
SW: 20V/Div
Time: 4ms/Div
Time: 4ms/Div
Figure 11. Shutdown Waveforms (SDX/EN control)
(24V Input, 5V Output, SDX/EN=2.5V->0V)
Figure 10. Start Up Waveforms (SDX/EN control)
(24V Input, 5V Output, SDX/EN=0V->2.5V)
VIN: 20V/Div
VIN: 20V/Div
SDX/EN: 2V/Div
VOUT: 2V/Div
SDX/EN: 2V/Div
VOUT: 2V/Div
SW: 20V/Div
SW: 20V/Div
Time: 4ms/Div
Time: 4ms/Div
Figure 13. Shutdown Waveforms (VIN control)
(24V Input, 5V Output, VIN=24V->0V, R1=1MΩ, R2=120kΩ)
Figure 12. Start Up Waveforms (VIN control)
(24V Input, 0V Output, VIN=0V->24V, R1=1MΩ, R2=120kΩ)
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100
15.5
90
15.4
80
15.3
70
15.2
Output Voltage [V]
Efficiency [%]
Typical Performance Curves
60
50
40
30
15.1
No load
compensation
15
14.9
14.8
20
14.7
10
14.6
0
With load compensation
RCOMP=9.1kΩ
14.5
0
100
200
300
400
Load Current [mA]
0
100
200
300
400
Load Current [mA]
Figure 14. Efficiency vs Load Current
(24V Input, ±15V Output)
Figure 15. Output Voltage vs Load Current
(24V Input, ±15V Output)
15.5
15.4
Output Voltage [V]
15.3
15.2
15.1
15
14.9
14.8
IOUT=330mA
(±total)
No load compensation
14.7
14.6
14.5
-50
0
50
100
150
Ambient Temperature [°C]
Figure 16. Output Voltage vs Ambient Temperature
(24V Input, ±15V Output)
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Application Examples
Exercise caution with the actual system since the characteristic changes with the board layout and the types of external parts
mounted, and etc.
T1
3:1
VIN
24V
10µF
D2
Z1
VIN
1000pF 63µH
SDX/EN
47µF
FB
PGND
REF
80.6kΩ
VOUT-
T1 : Sumida Electric CEP1311D-2405051R
Z1 : ROHM KDZ18B
D1 : ROHM 1SS400SM
D2 : ROHM RB160M-40
3.9kΩ
Figure 17. 24V Input, 5V Output
T1
1:1:1
VIN
24V
10µF
VIN
Z1
BD7F100HFN-LB
D1
SDX/EN
4700pF
50µH 10µF
REF
RDUMMY
4.7kΩ
COM
470Ω
50µH
D3
FB
PGND
VOUT+
15V,165mA
D2
50µH
SW
COMP
AGND
RDUMMY
330Ω
SW
COMP
AGND
7µH
1kΩ
D1
BD7F100HFN-LB
VOUT+
5V, 1A
10µF
RDUMMY
4.7kΩ
VOUT-15V, -165mA
T1 : Sumida Electric CEP1311D-2415052R
Z1 : ROHM KDZ18B
D1 : ROHM 1SS400SM
D2,D3 : ROHM RB160M-90
76.8kΩ
3.9kΩ
Figure 18. 24V Input, ±15V Output
T1
1:2
VIN
5V
10µF
VIN
Z1
BD7F100HFN-LB
D1
D2
1000pF
SDX/EN
40µH
RDUMMY
22µF 1kΩ
1kΩ
VOUT-
SW
COMP
FB
AGND
10µH
VOUT+
5V, 200mA
REF
PGND
13.3kΩ
T1 : Sumida Electric CEP911B-0505051R
Z1 : ROHM KDZ5.6B
D1 : ROHM 1SS400SM
D2 : ROHM RB160M-40
3.9kΩ
Figure 19. 5V Input, 5V Output
Table1. Recommended Transformers
Size (W×L×H)
[mm]
LP
[μH]
NP : NS
Vendor
CEP1311D-2405051R
13.5×20.0×12.5
63
3:1
CEP911B-2405051R
10.0×10.0×11.5
63
3:1
CEP1311D-2415052R
13.5×20.0×12.5
50
CEP911B-0505051R
10.0×10.0×11.5
10
Part Number
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TSZ22111・15・001
Target Applications
VIN [V]
VOUT [V]
Sumida Electric
24
5
1
Sumida Electric
24
5
0.8
1:1:1
Sumida Electric
24
±15
0.165
1:2
Sumida Electric
5
5
0.2
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IOUT [A]
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Application Information
1. Outline Operation
This product is an isolated type flyback converter without an optocoupler. An optocoupler or a transformer’s tertiary winding
feedback circuit which was needed to obtain a stable output voltage isolated by a transformer in the conventional
application becomes unnecessary, thus, the number of parts is reduced drastically, producing a small-sized and
high-reliability application isolated type power supply.
Furthermore, a highly efficient isolated type power supply application can easily be produced the use of the Original
Adapted-Type ON-Time Control Technology which eliminates the need for external phase compensation parts.
The off time is determined by comparing the reference voltage inside the IC with the information which was obtained by the
feedback of the secondary output voltage through primary flyback voltage.
Adapted-type ON time control,
(1) Switching frequency is fixed at 400kHz (Typ) for PWM operation when the load stabilizes.
(2) During load current fluctuation, the ON-Time Control will operate and the switching frequency will change, thus a
high-speed load response is obtained.
(3) During light load, high efficiency is obtained because the switching frequency decreases.
2. Timing Chart
(1)Start-up/Shut-down
Output voltage gradually turns ON through the soft start function when SDX/EN terminal rises to above 2.0V(Typ) (Enable
state) .When SDX/EN terminal falls below 1.8V (Typ), output voltage turns OFF (Disable state).
VIN
SDX/EN
(Note1)
(Note1)
2V
1.8V
tss
VOUT×0.9
VOUT
Figure 20. Start-up/Shut-down Timing Chart
(Note 1) In the control system of this IC, it has to be operated where duty is below 50%. When turning ON/OFF the IC,
control the SDX/EN terminal as enable/disable under the condition where V IN fulfills below equation.
V IN
NP
VO U TV F
NS
[V ]
where:
VIN is the VIN input power voltage
Np is the number of turns in the transformer primary side
Ns is the number of turns in the transformer secondary side
VOUT is the output voltage
VF is the forward voltage of the output diode in the secondary side
If SDX/EN terminal is connected to VIN terminal, duty could be more than 50% and unexpected output voltage might occur
when turning ON/OFF. Please refer to ”8. Enable Voltage” on page 16 of the application information for the enable control
with VIN terminal.
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(2) VIN Under Voltage Lock-Out (VIN UVLO)
When the input voltage (VIN) falls below 2.5V (Typ), it will be detected, followed by SW terminal becomes Hi-Z then output
turns OFF.
When the input voltage (VIN) rises to above 2.65V (Typ), it automatically recovers thorough the soft start.
(Hysteresis voltage: 0.15V (Typ))
VIN UVLO
OFF
VIN UVLO
ON
VIN
2.65V
2.5V
0V
tss
VOUT
VOUT×0.9
SW
Figure 21. VIN UVLO Timing Chart
(3) Thermal Shutdown Protection (TSD)
When the internal chip (Junction) temperature exceeds Tj=175°C (Typ) ,it will be detected, followed by SW terminal
becomes Hi-Z, then output turns OFF.
When Tj decreases below 150°C (Typ), it automatically recovers through the Soft Start.
Note that the thermal shutdown circuit is designed to shutdown the IC from thermal runaway under abnormal circumstances
with the temperature exceeding Tjmax = 150°C. It is not designed to protect or guarantee the application set. Please refrain
from using this function as a protection design of the application set.
TSD ON
TSD OFF
Tj=175℃
Tj=150℃
Tj
tss
VOUT
VOUT×0.9
VIN
SW
Figure 22. TSD Timing Chart
(4) Over Current Protection (OCP)
When the peak current reaches 1.25A (Typ) during the built-in N-channel MOSFET is ON, it will be detected, followed SW
terminal becomes Hi-Z, then N-channel MOSFET turns OFF. It is detected per switching cycle, and output voltage
decreases as ON duty is limited.
VOUT
ILIMIT=1.25A
IP
(Primary Transformer
Current)
SW
IOUT
(Load Current)
Normal
Over Current
Normal
Figure 23. OCP Timing Chart
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3.Output Voltage
SW terminal voltage is higher than input voltage (VIN) when the built-in N-Channel MOSFET is OFF.
This primary flyback voltage (the gap between SW terminal voltage and V IN) contains the information of the secondary
VF
output voltage.
VIN
SW terminal voltage can be calculated as follows:
V SW V IN
N
P VO U TV F I S E S R
NS
[V ]
IS
NP/NS
VIN
VOUT
IRFB
RFB
FB
where:
VSW is the SW terminal voltage
IS is the transformer current in the secondary side
ESR is the total impedance in the secondary side
(transformer wirewound resistance of the secondary side,
PCB impedance, and etc.)
SW
COMPARATOR
VREF
0.78V
Adaptive
On-Time
Controller
VCOMP
ICOMP
Driver
IP
Current
Monitor
25kΩ
REF
COMP
RREF
CCOMP
PGND
RCOMP
Figure 24. Control Block Diagram
This primary flyback voltage is converted to the current I RFB by RFB resistor. As FB terminal voltage almost equals to VIN
voltage due to the differential circuit of VIN, IRFB can be expressed by following equation:
V SW V FB
RFB
NP
VOUT V F I S ESR
NS
R FB
I RFB
[A ]
where:
IRFB is the FB input current
VFB is the FB terminal voltage
RFB is the external resistance between the FB-SW terminals
REF terminal voltage can be expressed as follows since IRFB flows into RREF resister.
V REF
R REF N P
VO U TV F I S E S R
R FB N S
[V]
where:
VREF is the REF terminal voltage
RREF is the external resistance between the REF–AGND terminals
(The IC is designed on the assumption that this value is 3.9kΩ.)
The REF terminal voltage is input into the comparator and compared with the IC internal reference voltage (0.78V(Typ)).
Since the loop gain of the whole system is high, the REF terminal voltage can be equal to the reference voltage in the IC.
Therefore, the output voltage VOUT and the REF terminal voltage VREF are as follows:
VOUT
R FB N S
V R E F V F I S E S R
RR E F N P
[V ]
That is, the output voltage VOUT can be set by the primary and secondary side turns ratio of the transformer, and the ratio of
the resistances RFB and RREF. VF and ESR cause an output voltage error.
The feedback resistor RFB can be expressed as follows from the relative quation with V OUT :
RFB
RR E F N P
VO U TV F I S E S R
VR E F N S
[Ω]
VSW
Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 32. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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17.Apr.2017 Rev.003
BD7F100HFN-LB BD7F100EFJ-LB
Ordering Information
B
D
7
F
1
0
0
H
Part
Number
F
N
-
Package
HFN:HSON8
EFJ:HTSOP-J8
LBTR
Product class
LB: For industrial applications
Packing, forming specification
TR: Embossed tape and reel
2500pcs (HSON8)
HR: Embossed tape and reel
250pcs (HSON8)
E2: Embossed tape and reel
3000pcs (HTSOP-J8)
H2: Embossed tape and reel
250pcs (HTSOP-J8)
Marking Diagrams
HSON8 (TOP VIEW)
HTSOP-J8(TOP VIEW)
Part Number Marking
D7F
Part Number Marking
D 7 F 1 0 0
LOT Number
1 0 0
LOT Number
1PIN MARK
1PIN MARK
Line up
Package
HSON8
HTSOP-J8
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Orderable Part Number
BD7F100HFN-LBTR
BD7F100HFN-LBHR
BD7F100EFJ-LBE2
BD7F100EFJ-LBH2
25/28
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BD7F100HFN-LB BD7F100EFJ-LB
Physical Dimension, Tape and Reel Information
Package Name
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
HSON8
26/28
TSZ02201-0J1J0AJ00910-1-2
17.Apr.2017 Rev.003
BD7F100HFN-LB BD7F100EFJ-LB
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
HTSOP-J8
27/28
TSZ02201-0J1J0AJ00910-1-2
17.Apr.2017 Rev.003
BD7F100HFN-LB BD7F100EFJ-LB
Revision History
Date
Revision
4.Sep.2015
001
29.Jun.2016
002
17.April.2017
003
Changes
New production
P.8 Typical Performance Curves Figure.9 modification
P.9 Typical Performance Curves Figure.11 modification
P.14 Output Voltage feedback resistance RFB formula modification
P.15 (2) Primary Side Inductance LP addition
P.22 I/O equivalent circuits 3.COMP, 4.REF, 5.FB update
P.4 Modified FB terminal absolute voltage
P.25 Add small lots format
P.26 P.27 Add small lots format
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001