BD7J200EFJ-LBE2

Datasheet Isolated Flyback Converter IC With Integrated Switching MOSFET BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB General Description Key Specifications This is the product guarantees long time support in Industrial market. This IC is an optocoupler-less isolated flyback converter. It is not necessary to use any optocouplers and feedback circuits by a third winding of transformers; these have been ever required to obtain a stable output voltage in former applications. Furthermore, adoption of the original adapted type technology that controls on time makes the external phase compensation parts unnecessary, reduces a lot of parts number and minimalizes applications, which realizes the designs of isolated power supply application with high reliability. ◼ Operation Supply Voltage Range VIN Pin: 8 V to 80 V SW Pin: 120 V (Max) ◼ Over Current Detection Current: 1.75 A (Typ) ◼ Switching Frequency: 400 kHz (Typ) ◼ Reference Voltage Accuracy: ±1.5 % ◼ Current at Shutdown: 0 μA (Typ) ◼ Operation Current at Switching: 2.8 mA (Typ) ◼ Operation Temperature Range: -40 °C to +125 °C Packages HSON8 (BD7J200HFN-LB) Features W (Typ) x D (Typ) x H (Max) 2.9 mm x 3.0 mm x 0.6 mm HTSOP-J8 4.9 mm x 6.0 mm x 1.0 mm (BD7J200EFJ-LB BD7J200UEFJ-LB) ◼ Long Time Support Product for Industrial Applications ◼ No Need of Any Optocoupler and Third Winding of Transformer ◼ Set Output Voltage with Two External Resistor and Ratio of Transformer Turns ◼ Adopt of Original Adapted Type Technology that Controls On Time. ◼ No Need of External Phase Compensation Parts by High-speed Load Response ◼ Low Output Ripple by Fixed Switching Frequency (At normal operation) ◼ High Efficient Light Load Mode (At PFM operation) ◼ Shutdown and Enable Control ◼ Built-in 120 V Switching MOSFET ◼ Soft Start Function ◼ Load Compensation Function ◼ Various Protection Function Input Under Voltage Lockout (VIN UVLO) Over Current Protection (OCP) Over Voltage Protection (OVP) Short Circuit Protection (SCP) Thermal Shutdown (TSD) Battery Short Protection (BSP) HSON8 HTSOP-J8 Application ◼ Isolated Power Supply for Industrial Equipment Typical Application Circuit VIN SDX/EN SW L_COMP AGND 〇Product structure : Silicon integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 REF FB PGND 〇This product has no designed protection against radioactive rays. 1/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Pin Configurations (TOP VIEW) (TOP VIEW) AGND 1 8 VIN SDX/EN 2 7 SW L_COMP 3 6 PGND REF 4 AGND 1 8 VIN SDX/EN 2 7 SW L_COMP 3 6 PGND 5 FB 5 FB EXP-PAD REF 4 HSON8 EXP-PAD HTSOP-J8 Pin Descriptions Pin No. Pin Name Function 1 AGND 2 SDX/EN Shutdown and enable control pin 3 L_COMP Setting pin of the load current compensation value 4 REF Setting pin of the output voltage 5 FB Setting pin of the output voltage 6 PGND 7 SW Switching output pin 8 VIN Power supply input pin - EXP-PAD Analog system GND pin Power system GND pin Connect EXP-PAD to both of the AGND and PGND pins Block Diagram 8 VIN 5 7 FB SW Current Monitor INTERNAL REGULATOR SCP OVP VINTREF COMPARATOR Shutdown Enable 2 SDX/EN VIN UVLO VINTREF SOFT START TSD ADAPTIVE ON-TIME CONTROLLER Switching MOSFET DRIVER OCP BSP LOAD COMPENSATION AGND 1 4 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 REF 3 L_COMP 2/38 PGND 6 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Description of Blocks 1 INTERNAL REGULATOR This is the regulator block for internal circuits. This block also shuts itself down at the shutdown status of the SDX/EN pin voltage ≤ VSDX. The SDX/EN pin voltage becomes VEN1 or more, the IC becomes enable status and the output voltage rises slowly by the soft start function. The SDX/EN pin voltage becomes VEN2 or less, the IC becomes disable status and stops the switching operation. VIN pin voltage VEN1 VEN2 SDX/EN pin voltage tSS Setting output voltage Setting output voltage × 0.9 Output voltage Switching ON Figure 1. Startup and Stop Timing Chart In the control method of this IC, it is necessary to operate in the status that the duty is DMAX or less. and stop, set the VIN pin voltage VIN to meet the next formula. 𝑉𝐼𝑁 > 𝑁𝑃 1 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) ( − 1) 𝑁𝑆 𝐷𝑀𝐴𝑋 At the startup [V] Where: 𝑉𝐼𝑁 is the VIN pin voltage. 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑉𝐹 is the forward voltage of the secondary output diode. 𝐷𝑀𝐴𝑋 is the maximum duty. In the case that the SDX/EN pin is shorted to the VIN pin the duty becomes DMAX or more at startup and stop, and there may be occur the output voltage without intending. Refer to Application Examples: 6 Enable Voltage and Disable Voltage for the enable control by the VIN pin. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Description of Blocks – continued 2 VIN UVLO This is the input low voltage protection block. When the VIN pin voltage becomes VUVLO1 or less, the IC detects VIN UVLO and stops the switching operation because of the high impedance in the SW pin. When the VIN pin voltage becomes VUVLO2 or more, the IC automatically reset via the soft start. VIN pin voltage VUVL O2 VUVL O1 0V tSS Setting output voltage Setting output voltage × 0.9 Output voltage Switching ON ON Figure 2. VIN UVLO Timing Chart 3 SOFT START When the status becomes enable that the SDX/EN pin voltage VEN1 or more, the comparison voltage in the comparator block transits slowly 0 V to VINTREF. This operation pretend the IC from rushing current at the rising edge of the output voltage or overshooting. The soft start time is fixed to t SS in the IC. 4 COMPARATOR In this block, the IC compare the reference voltage to the REF pin voltage that is the feedback voltage of the SW pin voltage. This IC is superior to the response for fluctuation in load because it constitutes the feedback group by the comparator. 5 ADAPTIVE ON TIME CONTROLLER This block is corresponded to the original adapted type technology that controls on time. Stable load current: Fluctuating load current: Light load: Operates in the PWM control and fix the on time. Operates in the on time control and realizes a high-speed load response by fluctuates the switching frequency. Decrease the switching frequency and realizes a high efficiency. When the load current fluctuates, the frequency becomes high. shortening the off time and raises the secondary current. The IC raises the average of primary current by Output voltage Primary coil current SW pin voltage Switching Frequency Stable ope ration High Freque ncy Stabilize grad ually Figure 3. Transient Response Timing Chart www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Description of Blocks – continued 6 DRIVER This block drives the switching MOSFET. 7 LOAD COMPENSATION This block compensates the fluctuation of output voltage caused by the fluctuation of VF characteristic in the secondary output diode corresponded to load current. This block monitors the current flowed to the switching MOSFET and pulls the current corresponded to the quantity of compensation determined by the external resistor and capacitor at the L_COMP pin and time constant from the REF pin. The decline of the REF pin voltage by the drop of feedback current flowing in the external resistor at the REF pin rises the output voltage and it is compensated. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Description of Blocks – continued 8 OCP, BSP This is the block of the over current protection and battery short protection. 8.1 OCP (Over Current Protection) At the switching MOSFET on, the IC detects the OCP when the peak current becomes I LIMIT or more. At this moment, the switching MOSFET is turned off. Because of detecting per switching cycles and restricting on duty, the output voltage drops. In addition, to prevent detection error, the detection of OCP is invalidated for tMASK1 after the switching MOSFET is turned on Output voltage ILIMIT Primary coil current SW pin voltage tMASK1 Normal IC status Normal OCP Figure 4. OCP Timing Chart 8.2 BSP (Battery Short Protection) If the SW pin is connected to high electric potential with low impedance, current flows when the switching MOSFET turned on and it may destroy the IC. To prevent this, the IC has a built-in BSP. When the SW pin voltage becomes VBSP or more at the switching MOSFET on, the IC detects BSP. At this moment, the switching operation is stopped. After t RESTART from the stop, the IC operates the soft start and resets. tSS Setting output voltage Setting output voltage × 0.9 Output voltage SW pin voltage VBSP Switching ON tRES TART ON Figure 5. BPS Timing Chart www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Description of Blocks – continued 9 SCP, OVP This is the block of the short circuit protection and over voltage protection. 9.1 SCP (Short Circuit Protection) The REF pin obtains the secondary output voltage data from the primary flyback voltage. When the REF pin voltage becomes VSCP or less at the switching MOSFET off, the IC detects SCP. At this moment, the switching operation is stopped. After tRESTART from the stop, the IC operates the soft start and resets. To prevent detection error, the detection of SCP is invalidated for tMASK2 after the switching MOSFET is turned off and for tMASK3 at the startup by the soft start. In the case that the primary flyback voltage is not output correctly, SCP is not detected even if the secondary output voltage drops. tSS Setting output voltage Setting output voltage × 0.9 Output voltage SW pin voltage VSCP REF pin voltage Switching ON tRES TART ON Figure 6. SCP Timing Chart 9.2 OVP (Over Voltage Protection) The REF pin obtains the secondary output voltage data from the primary flyback voltage. When the REF pin voltage becomes VOVP or more at the switching MOSFET off, the IC detects OVP. At this moment, the switching operation is stopped. After tRESTART from the stop, the IC operates the soft start and resets. To prevent detection error, the detection of OVP is invalidated for tMASK2 after the switching MOSFET is turned off. In the case that the primary flyback voltage is not output correctly, OVP is not detected even if the secondary output voltage rises. tSS Setting output voltage Setting output voltage × 0.9 Output voltage SW pin voltage VOVP REF pin voltage Switching ON tRES TART ON Figure 7. OVP Timing Chart www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Absolute Maximum Ratings (Ta = 25 °C) Parameter VIN Pin Voltage Unit VIN_MAX 100 V VSW_MAX 120 V 100 V VFB_MAX VIN + 0.3 V VREF_MAX 7 V VL_COMP_MAX 7 V Tjmax 150 °C Tstg -55 to +150 °C FB Pin Voltage REF Pin Voltage L_COMP Pin Voltage Rating VSDX/EN_MAX SW Pin Voltage SDX/EN Pin Voltage Symbol Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit HSON8 Junction to Ambient θJA 265.1 66.1 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 17 9 °C/W θJA 206.4 45.2 °C/W ΨJT 21 13 °C/W HTSOP-J8 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. Recommended Operating Conditions Parameter Symbol Min Typ Operation Power Supply Voltage Range 1 VIN 8 Operation Power Supply Voltage Range 2 VSW - Operation Power Supply Voltage Range 3 VL_COMP_MAX2 - - Topr -40 - Operation Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/38 Max Unit 48 80 V The VIN pin voltage - 110 V The SW pin voltage 0.5 V The L_COMP pin voltage +125 °C Conditions TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Electrical Characteristics （Unless otherwise specified VIN = 48 V, VSDX/EN = 2.5 V, Ta = 25 °C） Parameter Symbol Min Typ Max Unit Conditions IST - 0 10 μA VSDX/EN = 0 V VREF = 0.85 V (At PFM operation) Power Supply Block Current at Shutdown Current at Switching Operation ICC - 2.8 6.0 mA UVLO Detection Voltage 1 VUVLO1 4.1 5.0 6.0 V At VIN falling UVLO Detection Voltage 2 VUVLO2 - 5.2 - V At VIN rising UVLO Voltage Hysteresis VUVLO_HYS 0.1 0.2 0.3 V Shutdown Voltage VSDX - - 0.3 V Enable Voltage 1 VEN1 1.7 2.0 2.3 V At VSDX/EN rising Enable Voltage 2 VEN2 - 1.8 - V At VSDX/EN falling VEN_HYS 0.1 0.2 0.3 V SDX/EN Pin Inflow Current ISDX/EN 1.6 2.5 3.9 μA SDX/EN Pin Clamp Voltage VCLPEN - 5.3 - V SDX/EN Pin Pull-down Resistance 1 RSDX/EN1 - 815 - kΩ SDX/EN Pin Pull-down Resistance 2 RSDX/EN2 - 190 - kΩ VINTREF 0.768 0.780 0.792 V IREF - 390 - μA On Resistance RON 0.25 0.50 1.00 Ω Over Current Detection Current ILIMIT 1.40 1.75 2.10 A Shutdown and Enable Control Block Enable Voltage Hysteresis Reference Voltage Block Reference Voltage REF Pin Current Switching Block Between the SW and PGND pins Switching Frequency fSW - 400 - kHz At PWM operation (Duty = 40 %) On Time tON 0.75 1.00 1.25 μs At PWM operation (Duty = 40 %) Minimum On Time tON_MIN 260 350 440 ns Minimum Off Time tOFF_MIN 335 450 565 ns Maximum Off Time tOFF_MAX 14 20 26 μs Soft Start Time tSS 1.2 2.5 5.0 ms Maximum Duty DMAX - 50 - % Minimum Duty DMIN - 20 - % Short Protection Detection Voltage VSCP - 0.50 - V Over Voltage Protection Detection Voltage VOVP - 0.95 - V From rise-up to VREF x 90 % Protection Function Block Battery Short Protection Detection Voltage Restart Time Over Current Protection Mask Time Short and Over Voltage Protection Mask Time Short Protection Mask Time at Startup VBSP - 2.0 - V tRESTART - 2.0 - ms tMASK1 - 280 - ns tMASK2 - 400 - ns tMASK3 - 600 - μs RINTCOMP - 50 - kΩ K - 0.004 - % Load Compensation Block Internal Resistor at L_COMP Pin Compressor Magnification in Current Monitor www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves (Reference Data) 10.0 Current at Switching Operation: ICC [mA] Current at Shutdown: IST [μA] 10.0 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Figure 8. Current at Shutdown vs Temperature Temperature [°C] Figure 9. Current at Switching Operation vs Temperature 6.0 UVLO Detection Voltage 2: VUVLO2 [V] UVLO Detection Voltage 1: VUVLO1 [V] 6.0 5.5 5.0 4.5 4.0 5.5 5.0 4.5 4.0 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 10. UVLO Detection Voltage 1 vs Temperature Figure 11. UVLO Detection Voltage 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) Figure 12. UVLO Voltage Hysteresis vs Temperature Figure 13. SDX/EN Pin Clamp Voltage vs Temperature Figure 14. Enable Voltage 1 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 15. Enable Voltage 2 vs Temperature 11/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued 0.40 10.0 0.35 9.0 SDX/EN Pin Inflow Current: ISDX/EN [μA] Enable Voltage Hysteresis: VEN_HYS [V] (Reference Data) 0.30 0.25 0.20 0.15 0.10 0.05 0.00 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100120140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 16. Enable Voltage Hysteresis vs Temperature Figure 17. SDX/EN Pin Inflow Current vs Temperature 1.0 0.9 On Resistance: RON [Ω] Reference Voltage: VINTREF [V] 0.90 0.85 0.80 0.75 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.70 0.0 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 18. Reference Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 19. On Resistance vs Temperature 12/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) 600 Switching Frequency: fSW [kHz] Over Current Detection Current: ILIIMIT [A] 2.50 2.00 1.50 1.00 0.50 0.00 500 400 300 200 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 20. Over Current Detection Current vs Temperature Figure 21. Switching Frequency vs Temperature 600 Minimum On Time: tON_MIN [ns] 2.0 1.8 On Time: tON [μs] 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 550 500 450 400 350 300 250 200 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 22. On Time vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 23. Minimum On Time vs Temperature 13/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) 30.0 Maximum Off Time: tOFF_MAX [μs] Minimum Off Time: tOFF_MIN [ns] 600 500 400 300 25.0 20.0 15.0 10.0 200 5.0 0.0 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 24. Minimum Off Time vs Temperature Figure 25. Maximum Off Time vs Temperature Short Protection Detection Voltage: VSCP [V] 5.00 Soft Start Time: tSS [ms] 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 -40 -20 0 20 40 60 80 100 120 140 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.55 0.50 0.45 0.40 -40 -20 0 20 40 60 80 100120140 Temperature [°C] Figure 26. Soft Start Time vs Temperature 0.60 Temperature [°C] Figure 27. Short Protection Detection Voltage vs Temperature 14/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) 2.50 Battery Short Protection Detection Voltage: VBSP [V] Over Voltage Protection Detection Voltage: VOVP [V] 1.10 1.05 1.00 0.95 0.90 2.30 2.10 1.90 1.70 1.50 -40 -20 0 20 40 60 80 100120140 -40 -20 0 20 40 60 80 100120140 Temperature [°C] Temperature [°C] Figure 29. Battery Short Protection Detection Voltage vs Temperature 600 Short and Over Voltage Protection Mask Time: tMASK2 [ns] Over Current Protection Mask Time: tMASK1 [ns] Figure 28. Over Voltage Protection Detection Voltage vs Temperature 500 400 300 600 500 400 300 200 200 -40 -20 0 20 40 60 80 100120140 -40 -20 0 20 40 60 80 100120140 Temperature [°C] Temperature [°C] Figure 30. Over Current Protection Mask Time vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 31. Short and Over Voltage Protection Mask Time vs Temperature 15/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) 5.0 900 Restart Time: tRESTART [ms] Short Protection Mask Time at Startup: tMASK3 [μs] 1000 800 700 600 500 400 300 200 4.0 3.0 2.0 1.0 100 0 0.0 -40 -20 0 20 40 60 80 100120140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 32. Short Protection Mask Time at Startup vs Temperature Figure 33. Restart Time vs Temperature 600 Switching Frequency (IOUT = 420 mA): fSW [kHz] Secondary Output Voltage (IOUT = 420 mA): VOUT [V] 13.0 12.5 12.0 11.5 500 400 300 200 11.0 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 34. Secondary Output Voltage vs Temperature (IOUT = 420 mA) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 35. Switching Frequency vs Temperature (I OUT = 420 mA) 16/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued 100 13.0 90 12.8 80 12.6 Output Voltage [V] Efficiency [%] (Reference Data) 70 60 50 40 30 12.4 12.0 with compensation 11.8 11.6 20 11.4 10 11.2 0 without compensation 12.2 11.0 0 200 400 600 800 1000 0 Load Current [mA] 200 400 600 800 1000 Load Current [mA] Figure 36. Efficiency vs Load Current Figure 37. Output Voltage vs Load Current V IN: 20 V/Div V IN: 20 V/Div V SDX/EN: 2 V/Div V SDX/EN: 2 V/Div V OUT: 2 V/Div V OUT: 2 V/Div V SW : 40 V/Div V SW : 40 V/Div Figure 38. Startup Waveform (The SDX/EN Pin Control) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 39. Shutdown Waveform (The SDX/EN Pin Control) 17/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Typical Performance Curves – continued (Reference Data) V IN: 20 V/Div V IN: 20 V/Div V SDX/EN: 2 V/Div V SDX/EN: 2 V/Div V OUT: 2 V/Div V OUT: 2 V/Div V SW : 40 V/Div V SW : 40 V/Div Figure 40. Startup Waveform (The VIN Pin Control) Figure 41. Shutdown Waveform (The VIN Pin Control) Ma xi mum Output Power [W] 20 IOUT: 500 mA/Div V OUT: 500 mV/Div 18 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 VIN Pi n Voltage [V] Figure 42. Load Transient Response (IOUT = 0.1 A to 0.83 A) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 43. Maximum Output Power vs VIN Pin Voltage 18/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Application Examples 1 Output Voltage When the internal switching MOSFET is off, the SW pin voltage becomes higher than the VIN pin voltage. The secondary output voltage is calculated by the primary flyback voltage, which is described by the difference between this SW pin voltage and VIN pin voltage. The SW pin voltage at turn off is calculated by the formula below. 𝑉𝑆𝑊 = 𝑉𝐼𝑁 + 𝑁𝑃 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 + 𝐼𝑆 × 𝐸𝑆𝑅) 𝑁𝑆 [V] Where: 𝑉𝑆𝑊 is the SW pin voltage. 𝑉𝐼𝑁 is the VIN pin voltage. 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑉𝐹 is the forward voltage of the secondary output diode. 𝐼𝑆 is the secondary transformer current. 𝐸𝑆𝑅 is the secondary total impedance (secondary transformer winding resistance and PCB impedance). The external resistor RFB between the FB and SW pins converts the primary flyback voltage into the FB pin inflow current IRFB. The FB pin inflow current IRFB is calculated by the formula below because the FB pin voltage is nearly equal to the VIN pin voltage by the IC’s internal circuit. 𝐼𝑅𝐹𝐵 = = 𝑉𝑆𝑊 − 𝑉𝐹𝐵 𝑅𝐹𝐵 𝑁 𝑉𝐼𝑁 + 𝑁𝑃 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 + 𝐼𝑆 × 𝐸𝑆𝑅) − 𝑉𝐹𝐵 𝑆 𝑅𝐹𝐵 𝑁𝑃 (𝑉 𝑁𝑆 × 𝑂𝑈𝑇 + 𝑉𝐹 + 𝐼𝑆 × 𝐸𝑆𝑅) = 𝑅𝐹𝐵 [A] Where: 𝐼𝑅𝐹𝐵 is the FB pin inflow current. 𝑉𝐹𝐵 𝑅𝐹𝐵 is the FB pin voltage. is the external resistor between the FB and SW pins. Furthermore, the REF pin voltage is calculated by the formula below because the FB pin inflow current flows into the external resistor RREF between the REF and AGND pins. 𝑉𝑅𝐸𝐹 = 𝑅𝑅𝐸𝐹 𝑁𝑃 × × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 + 𝐼𝑆 × 𝐸𝑆𝑅) 𝑅𝐹𝐵 𝑁𝑆 [V] Where: 𝑉𝑅𝐸𝐹 is the REF pin voltage. 𝑅𝑅𝐸𝐹 is the external resistor between the REF and AGND pins. The resistor RREF is necessary to be set as the current flowing in the REF pin becomes I REF when the REF pin voltage is equal to VINTREF. This IC’s internal circuit is designed as RREF = 2 kΩ according to the formula below. 𝑅𝑅𝐸𝐹 = 𝑉𝐼𝑁𝑇𝑅𝐸𝐹 𝐼𝑅𝐸𝐹 [Ω] Where: 𝑉𝐼𝑁𝑇𝑅𝐸𝐹 is the REF pin voltage. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 1 Output Voltage – continued The REF pin voltage is input to the comparator with the reference voltage in the IC. By the internal circuit, the REF pin voltage becomes equal to the reference voltage. Therefore, the output voltage and the REF pin voltage is calculated by the formula below. 𝑉𝑂𝑈𝑇 = 𝑅𝐹𝐵 𝑁𝑆 × × 𝑉𝑅𝐸𝐹 − 𝑉𝐹 − 𝐼𝑆 × 𝐸𝑆𝑅 𝑅𝑅𝐸𝐹 𝑁𝑃 [V] The output voltage is set by the number of winding ratio of the primary and secondary transformer and the resistance ratio of RFB and RREF. In addition, VF and ESR is factor of the error in the output voltage. According to the relational expression in above, the external resistor between the FB and SW pins RFB is calculated by the formula below. 𝑅𝐹𝐵 = 𝑅𝑅𝐸𝐹 𝑁𝑃 × × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 + 𝐼𝑆 × 𝐸𝑆𝑅) 𝑉𝑅𝐸𝐹 𝑁𝑆 [Ω] VF VIN IS NP/NS IRFB RFB FB SW COMPARATOR VINTREF ADAPTIVE ON-TIME CONTROLLER VL_COMP IL_COMP REF RREF VOUT DRIVER IP Current Monitor PGND L_COMP CL_COMP RL_COMP Figure 44. Control Block Diagram www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Application Examples – continued 2 Transformer 2.1 Number of Winding Ratio The number of winding ration is the parameter with which the output voltage, maximum output electric power, duty and the SW pin voltage is set. The duty of flyback converter is calculated by the formula below. 𝑁𝑃 (𝑉 ) 𝑁𝑆 × 𝑂𝑈𝑇 + 𝑉𝐹 𝐷𝑢𝑡𝑦 = 𝑁 𝑉𝐼𝑁 + 𝑁𝑃 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) 𝑆 [%] Where: 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑉𝐹 is the forward voltage of the secondary output diode. 𝑉𝐼𝑁 is the VIN pin voltage. The feedback voltage is monitored at the SW pin. In addition, it is necessary to set the duty to DMAX or less for the stable control. By the restriction of the minimum on time, the minimum duty is determined to D MIN and the number of winding ratio has to meet the requirements below. 𝐷𝑀𝐼𝑁 𝑉𝐼𝑁 𝑁𝑃 𝑉𝐼𝑁 × < < 1 − 𝐷𝑀𝐼𝑁 𝑉𝑂𝑈𝑇 + 𝑉𝐹 𝑁𝑆 𝑉𝑂𝑈𝑇 + 𝑉𝐹 Where: 𝐷𝑀𝐼𝑁 is the minimum duty. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 2 Transformer – continued 2.2 Primary Inductance The right half plane zero point occurs in the feedback group of flyback converter. The phase delays 90 ° by this, it is necessary to set the right half plane zero frequency f RHP_ZERO to the switching frequency fSW or less. The right half plane zero frequency fRHP_ZERO is calculated by the formula below. 2 𝑁 2 ( 𝑁𝑃 ) × { 𝑆 𝑓𝑅𝐻𝑃_𝑍𝐸𝑅𝑂 = 𝑉𝐼𝑁 } × 𝑅𝑂𝑈𝑇 𝑁𝑃 𝑉𝐼𝑁 + 𝑁 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) 𝑆 𝑁𝑃 (𝑉 ) 𝑁𝑆 × 𝑂𝑈𝑇 + 𝑉𝐹 2𝜋 × × 𝐿𝑃 𝑁𝑃 (𝑉 ) 𝑉𝐼𝑁 + 𝑁 × 𝑂𝑈𝑇 + 𝑉𝐹 𝑆 [Hz] Where: 𝑓𝑅𝐻𝑃_𝑍𝐸𝑅𝑂 is the right half plane zero frequency. 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑉𝐼𝑁 is the VIN pin voltage. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑉𝐹 is the forward voltage of the secondary output diode. 𝑅𝑂𝑈𝑇 is the load resistance. 𝐿𝑝 is the primary inductance. For the insurance of stability, the right half plane zero frequency f RHP_ZERO has to be set to more than one quarter of the switching frequency fSW. From this, the condition below is required. 𝑓𝑅𝐻𝑃_𝑍𝐸𝑅𝑂 > 1 × 𝑓𝑆𝑊 4 2 × 𝐷𝑢𝑡𝑦 × 𝑉𝐼𝑁 2 𝐿𝑝 < (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) × 𝐼𝑂𝑈𝑇_𝑀𝐴𝑋 × 𝜋 × 𝑓𝑆𝑊 [H] Where: 𝑓𝑆𝑊 is the switching frequency. 𝐼𝑂𝑈𝑇_𝑀𝐴𝑋 is the maximum value of the output current. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 2.2 Primary Inductance – continued The minimum value of primary inductance can be found by the relation of in/output electric power. If the L P becomes lower, the peak current of primary transformer becomes higher. Because the necessary output voltage cannot be obtained if the peak current value becomes the over current detection current or more, the lower limit of necessary primary inductance value corresponding to maximum load is calculated by the conditional expression below. 𝐿𝑝 > 1 𝑉𝐼𝑁 2 × 𝑡𝑆 × 𝐷𝑢𝑡𝑦 2 × 𝜂 × 2 𝐼𝐿𝐼𝑀𝐼𝑇_𝑀𝐼𝑁 × 𝐷𝑢𝑡𝑦 × 𝑉𝐼𝑁 × 𝜂 − 𝑉𝑂𝑈𝑇_𝑀𝐴𝑋 × 𝐼𝑂𝑈𝑇_𝑀𝐴𝑋 [H] Where: 𝑡𝑆 is the cycle of switching. 𝜂 is the efficiency. 𝐼𝐿𝐼𝑀𝐼𝑇_𝑀𝐼𝑁 is the minimum value of over current detection current. 𝑉𝑂𝑈𝑇_𝑀𝐴𝑋 is the maximum value of output voltage. According to the above, the primary inductance is necessary to meet the requirements below. 1 𝑉𝐼𝑁 2 × 𝑡𝑆 × 𝐷𝑢𝑡𝑦 2 × 𝜂 × 2 𝐼𝐿𝐼𝑀𝐼𝑇_𝑀𝐼𝑁 × 𝐷𝑢𝑡𝑦 × 𝑉𝐼𝑁 × 𝜂 − 𝑉𝑂𝑈𝑇_𝑀𝐴𝑋 × 𝐼𝑂𝑈𝑇_𝑀𝐴𝑋 2 × 𝐷𝑢𝑡𝑦 × 𝑉𝐼𝑁 2 < 𝐿𝑝 < (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) × 𝐼𝑂𝑈𝑇_𝑀𝐴𝑋 × 𝜋 × 𝑓𝑆𝑊 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/38 [H] TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 2 Transformer – continued 2.3 Leak Inductance The leak inductance of transformer causes the ringing at the SW pin at the moment the internal switching MOSFET is turned off. Insert the snubber circuit not to exceed the absolute maximum rating of the SW pin voltage. It is necessary to settle down within tMASK2 for the prevention of the error in the secondary output voltage. In addition, it is important to consider that it is not exceeded the rating voltage of secondary output diode at the moment the internal switching MOSFET is turned on. Voltage VSW_MAX So set the disable voltage 𝑁𝑃 × (𝑉𝑂𝑈𝑇 + 𝑉𝐹 ) [V] 𝑁𝑆 Where: 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑉𝐹 is the forward voltage at the secondary output diode. VIN R1 SDX/EN VIN RSDX/EX1 R2 AGND RSDX/EX2 Figure 46. Position of Resistors Connected to the SDX/EN Pin www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Application Examples – continued 7 Minimum Load Current This IC stables the secondary output voltage isolated with the transformer by the primary flyback voltage at the internal switching MOSFET turned off. Therefore, it operates with the minimum on time tON_MIN and maximum off time tOFF_MAX even if the status is light load. By this operation, the output voltage may rise in the case of the low load current because a little energy is supplied to the secondary output. To prevent the rise of output voltage, secure the minimum load current with adding such as the dummy resistor RDUMMY. The necessary minimum load current IOUT_MIN is calculated by the formula below. 2 𝐼𝑂𝑈𝑇_𝑀𝐼𝑁 (𝑉𝐼𝑁 × 𝑡𝑂𝑁_𝑀𝐼𝑁 ) 1 = × 2 𝐿𝑃 × 𝑉𝑂𝑈𝑇 × (𝑡𝑂𝑁_𝑀𝐼𝑁 + 𝑡𝑂𝐹𝐹_𝑀𝐴𝑋 ) [A] Where: 𝐼𝑂𝑈𝑇_𝑀𝐼𝑁 is the minimum output current. 𝑉𝐼𝑁 is the VIN pin voltage. 𝑡𝑂𝑁_𝑀𝐼𝑁 is the minimum on time. 𝐿𝑃 is the primary inductance. 𝑉𝑂𝑈𝑇 is the output voltage. 𝑡𝑂𝐹𝐹_𝑀𝐴𝑋 is the maximum off time. VF VIN IS NP/NS IRFB RFB FB VINTREF ADAPTIVE ON-TIME CONTROLLER VL_COMP IL_COMP RREF VOUT SW COMPARATOR REF RDUMMY DRIVER IP Current Monitor PGND L_COMP CL_COMP RL_COMP Figure 47. Position of RDUMMY www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Application Examples – continued 8 Infection Point of Switching Frequency This IC realizes the efficiency by fluctuating the switching frequency corresponding to the load current at light load. The load current IOUT_fSW, from which the switching frequency fSW starts to drop, is calculated by the formula below. 𝐼𝑂𝑈𝑇_ 𝑓𝑆𝑊 1 𝑓𝑆𝑊 × (𝑉𝐼𝑁 × 𝑡𝑂𝑁_𝑀𝐼𝑁 ) = × 2 𝐿𝑃 × 𝑉𝑂𝑈𝑇 2 [A] Where: 𝐼𝑂𝑈𝑇_ 𝑓𝑆𝑊 is the load current, from which the switching frequency starts to drop. 𝑓𝑆𝑊 is the switching frequency. 𝑉𝐼𝑁 is the VIN pin voltage. 𝑡𝑂𝑁_𝑀𝐼𝑁 is the minimum on time. 𝐿𝑃 is the primary inductance. 𝑉𝑂𝑈𝑇 is the output voltage. In addition, the switching frequency becomes the minimum switching frequency fSW_MIN at the switching operation with the minimum on time tON_MIN and maximum off time tOFF_MAX and it is calculated by the formula below. 𝑓𝑆𝑊_𝑀𝐼𝑁 = 1 𝑡𝑂𝑁_𝑀𝐼𝑁 + 𝑡𝑂𝐹𝐹_𝑀𝐴𝑋 [Hz] Where: 𝑓𝑆𝑊_𝑀𝐼𝑁 is the minimum switching frequency. 𝑡𝑂𝐹𝐹_𝑀𝐴𝑋 is the maximum off time. Switching Frequency fSW fSW_MIN IOUT_MIN IOUT_fSW IOUT Figure 48. Switching Frequency vs IOUT www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Application Examples – continued 9 Load Compensation Function The load regulation is worsen by VF and ESR. In the application gotten worse by these factors, it is enable to make the fluctuation of the output voltage caused by the load current alteration small by using the load compensation function. In addition to above, short the L_COMP pin to the GND to invalidate this function. VF VIN IS NP/NS IRFB VOUT RFB FB SW COMPARATOR VINTREF ADAPTIVE ON-TIME CONTROLLER DRIVER IP VL_COMP Current Monitor IL_COMP REF RINTCOMP L_COMP RREF CL_COMP PGND RL_COMP Figure 49. Block Diagram of Load Compensation tS tON SW pin voltage IP_MAX IP_MIN Primary transformer current I P Primary transformer current I S Figure 50. Switching Operation or Continuous Mode Output voltage with load compensation without load compensation Gradient: RVF + ESR Output Current Figure 51. Image of Load Compensation www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 9 Load Compensation Function – continued 9.1 Setting of Amount of Load Compensation This function compensates the drop of output voltage VOUT corresponding to the average current of primary transformer current IP. The amount of load compensation is adjusted by the external capacitor C L_COMP and external resistor RL_COMP at the L_COMP pin because the primary transformer current IP and secondary transformer current IS have the relation of the formula below. The reference value of CL_COMP is 0.1 μF. 𝐼𝑃 = 𝑁𝑃 × 𝐼𝑆 𝑁𝑆 [A] Where: 𝐼𝑃 is the primary transformer current. 𝑁𝑃 is the number of winding at the primary transformer. 𝑁𝑆 is the number of winding at the secondary transformer. 𝐼𝑆 is the secondary transformer current. 9.1.1 Setting of External Resistor at the L_COMP Pin RL_COMP It is necessary to calculate the L_COMP pin current IL_COMP following the formula below for the setting of the external resistor at the L_COMP pin RL_COMP. 𝐼𝐿_𝐶𝑂𝑀𝑃 = 𝑉𝐿_𝐶𝑂𝑀𝑃 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 [A] Where: 𝐼𝐿_𝐶𝑂𝑀𝑃 is the L_COMP pin current. 𝑉𝐿_𝐶𝑂𝑀𝑃 is the L_COMP pin voltage. 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 is the internal resistor at the L_COMP pin VL_COMP mentioned in the formula above is the value converted the current which calculated by K x I P flowing from Current Monitor Block to the L_COMP pin by the external resistor at the L_COMP pin R L_COMP. It becomes IL_COMP in the inside and compensates the REF pin current. It is necessary to meet VL_COMP ≤ 0.5 V because the operational voltage’s upper limit of VL_COMP is restricted by the internal circuit. In addition, Connect the external capacitor at the L_COMP pin CL_COMP because the rapid fluctuation of IL_COMP may make the VL_COMP unstable. Than the above, VL_COMP should meet the conditions below. 𝑉𝐿_𝐶𝑂𝑀𝑃 = 𝐾 × 𝑅𝐿_𝐶𝑂𝑀𝑃 × 𝐼𝑃_𝐴𝑉𝐸 ≤ 0.5 = 𝐾 × 𝑅𝐿_𝐶𝑂𝑀𝑃 × 𝐼𝑃_𝑀𝐼𝑁 + 𝐼𝑃_𝑀𝐴𝑋 𝑡𝑂𝑁 × ≤ 0.5 2 𝑡𝑆 [V] Where: 𝐾 is the compressor magnification in Current Monitor Block. 𝑅𝐿_𝐶𝑂𝑀𝑃 is the external resistor at the L_COMP pin. 𝐼𝑃_𝐴𝑉𝐸 is the average value of primary transformer current IP. 𝐼𝑃_𝑀𝐼𝑁 is the minimum value of primary transformer current IP. 𝐼𝑃_𝑀𝐴𝑋 is the maximum value of primary transformer current IP. 𝑡𝑆 is the switching cycle. 𝑡𝑂𝑁 is the on time. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB 9.1.1 Setting of External Resistor at the L_COMP Pin RL_COMP – continued By the load compensation function, the feedback current decreases IL_COMP from its original current value flowing at RREF. As the result, the High level of VSW rises for compensating this drop and it compensates the dropped output voltage VOUT. The output voltage at operating the load compensation function is calculated by the formula below. 𝑉𝑂𝑈𝑇 = 𝑁𝑆 𝑉𝑅𝐸𝐹 ×( + 𝐼𝐿_𝐶𝑂𝑀𝑃 ) × 𝑅𝐹𝐵 − 𝑉𝐹 − 𝐼𝑆_𝐴𝑉𝐸 × 𝐸𝑆𝑅 𝑁𝑃 𝑅𝑅𝐸𝐹 [V] Where: 𝑉𝑂𝑈𝑇 is the output voltage. 𝑁𝑆 is the number of winding at the secondary transformer. 𝑁𝑃 is the number of winding at the primary transformer. 𝑉𝑅𝐸𝐹 is the REF pin voltage. 𝑅𝑅𝐸𝐹 is the external resistor between the REF and AGND pins. 𝐼𝐿_𝐶𝑂𝑀𝑃 is the L_COMP pin current. 𝑅𝐹𝐵 is the external resistor between the FB and SW pins. 𝑉𝐹 is the forward voltage at the secondary output diode. 𝐼𝑆_𝐴𝑉𝐸 is the average value of the secondary transformer current IS. Reference: The output voltage VOUT at normal operation 𝑉𝑂𝑈𝑇 = 𝑁𝑆 𝑅𝐹𝐵 × × 𝑉𝑅𝐸𝐹 − 𝑉𝐹 − 𝐼𝑆_𝐴𝑉𝐸 × 𝐸𝑆𝑅 𝑁𝑃 𝑅𝑅𝐸𝐹 [V] According to the formula above, it is necessary to establish the next formula to remove the forward voltage at the secondary output diode VF and ESR by the L_COMP pin current IL_COMP. 𝐼𝐿_𝐶𝑂𝑀𝑃 × 𝑁𝑆 × 𝑅𝐹𝐵 = 𝑉𝐹 + 𝐼𝑆_𝐴𝑉𝐸 × 𝐸𝑆𝑅 𝑁𝑃 [A] Next, calculate the RL_COMP by making the linear approximation RVF of the fluctuation of the forward voltage at the secondary output diode corresponding to the secondary transformer current IS. 𝐾 × 𝑅𝐿_𝐶𝑂𝑀𝑃 × 𝐼𝑃_𝐴𝑉𝐸 𝑁𝑆 × × 𝑅𝐹𝐵 = 𝐼𝑆_𝐴𝑉𝐸 × 𝑅𝑉𝐹 + 𝐼𝑆_𝐴𝑉𝐸 × 𝐸𝑆𝑅 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 𝑁𝑃 𝐾 × 𝑅𝐿_𝐶𝑂𝑀𝑃 𝑁𝑆 2 1 − 𝐷𝑢𝑡𝑦 × ( ) × 𝑅𝐹𝐵 = (𝑅𝑉𝐹 + 𝐸𝑆𝑅) × 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 𝑁𝑃 𝐷𝑢𝑡𝑦 Than the above, 𝑅𝐿_𝐶𝑂𝑀𝑃 𝑅𝑉𝐹 + 𝐸𝑆𝑅 𝑁𝑆 2 1 − 𝐷𝑢𝑡𝑦 = 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 × ×( ) × 𝐾 × 𝑅𝐹𝐵 𝑁𝑃 𝐷𝑢𝑡𝑦 [Ω] Where: 𝐾 is the compressor magnification in Current Monitor Block. 𝑅𝐿_𝐶𝑂𝑀𝑃 is the external resistor at the L_COMP pin. 𝐼𝑃_𝐴𝑉𝐸 is the average value of primary transformer current IP. 𝑅𝐼𝑁𝑇𝐶𝑂𝑀𝑃 is the internal resistor at the L_COMP pin The values of RVF, ESR, and RFB depend on the operating environment such as use parts and mounting boards. When set the RL_COMP actually, adjust them monitoring the output voltage VOUT in the range of using load current certainly. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB I/O Equivalence Circuit 1 AGND 2 SDX/EN 3 L_COMP 4 REF Internal Supply VIN REF SDX/EN L_COMP AGND AGND 5 FB 6 AGND AGND 7 PGND SW VIN 8 SW FB VIN PGND AGND AGND AGND PGND www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 33/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 52. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 34/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Ordering Information B D 7 J 2 0 0 x Production Line NONE:Production Line A U:Production Line B x x x Package HFN: HSON8 EFJ: HTSOP-J8 - LBxx Product Class LB for Industrial Applications Packaging and Forming Specification TR: Embossed Tape and Reel (HSON8) E2: Embossed Tape and Reel (HTSOP-J8) Lineup Product Name Part Number Marking Orderable Part Number Package Remarks BD7J200HFN-LB D7J200 BD7J200HFN-LBTR HSON8 - BD7J200EFJ-LB D7J200 BD7J200EFJ-LBE2 HTSOP-J8 Production Line A(Note 1) BD7J200UEFJ-LB U7J200 BD7J200UEFJ-LBE2 HTSOP-J8 Production Line B(Note 1) (Note 1) For the purpose of improving production efficiency, Production Line A and B have a multi-line configuration. Electrical characteristics noted in Datasheet does not differ between Production Line A and B. Production Line B is recommended for new product. Marking Diagrams HTSOP-J8 (TOP VIEW) HSON8 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Pin 1 Mark Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HSON8 36/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Physical Dimension and Packing Information – continued Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSOP-J8 37/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 BD7J200HFN-LB BD7J200EFJ-LB BD7J200UEFJ-LB Revision History Date Revision Changes 20.Aug.2019 001 New Release 20.Mar.2023 002 Add BD7J200UEFJ-LB www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 38/38 TSZ02201-0F1F0BZ00010-1-2 20.Mar.2023 Rev.002 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. 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Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001