Datasheet
For Automotive
1A, 8.0V Output LDO Regulator
BD80C0AFPS-C
General Description
Key Specifications
The BD80C0AFPS-C is a low-saturation regulator which is
8.0V output voltage and 1A output current capability.
Electrolytic, tantalum and ceramic capacitors can be used
as output capacitor to prevent oscillation. The IC has a
built-in over current protection circuit that prevents the
destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal
damage due to overloading.
Temperature Range (Ta):
-40°C to +125°C
Operating Input Range:
9.0V to 26.5V
Circuit Current:
0.6mA (Typ)
Output Current Capability:
1A
High Output Voltage Accuracy: ±1%(Ta = +25 °C)
±3%(-40 °C ≤ Ta ≤ +125 °C)
Package
Features
W(Typ) x D(Typ) x H(Max)
TO252S-3
6.50mm x 9.50mm x 1.30mm
AEC-Q100 Qualified(Note 1)
Over Current Protection (OCP)
Thermal Shutdown Protection (TSD)
(Note 1) Grade 1
Applications
Power Train
Body
Audio System
Navigation System
Typical Application Circuit
VCC and VO pin capacitors: 1 μF ≤ CIN (Min), 1 μF ≤ CO (Min)
Please refer to the "Application and Implemention".
VCC
VCC
VO
Co
CIN
GND
Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configurations .......................................................................................................................................................................... 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 3
Description of Blocks ...................................................................................................................................................................... 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Thermal Resistance ........................................................................................................................................................................ 5
Operating Conditions ...................................................................................................................................................................... 6
Electrical Characteristics................................................................................................................................................................. 6
Typical Performance Curves........................................................................................................................................................... 7
Figure 1. Circuit Current vs Supply Voltage................................................................................................................................. 7
Figure 2. Output Voltage vs Supply voltage ................................................................................................................................ 7
Figure 3. Output Voltage vs Supply voltage ................................................................................................................................ 7
Figure 4. Output Voltage vs Output Current (OCP characteristic) ............................................................................................... 7
Figure 5. Dropout Voltage ........................................................................................................................................................... 8
Figure 6. Ripple Rejection ........................................................................................................................................................... 8
Figure 7. Output Voltage vs Junction Temperature ..................................................................................................................... 8
Figure 8. Circuit Current vs Output Current ................................................................................................................................. 8
Figure 9. Output Voltage vs Junction Temperature (Thermal Shutdown Circuit Characteristic) .................................................. 9
Measurement Circuit for Typical Performance Curves ................................................................................................................. 10
Application and Implementation .................................................................................................................................................... 11
Selection of External Components ............................................................................................................................................ 11
Input Pin Capacitor ................................................................................................................................................................ 11
Output pin capacitor............................................................................................................................................................... 12
Linear Regulators Surge Voltage Protection ............................................................................................................................. 13
Positive surge to the input ..................................................................................................................................................... 13
Negative surge to the input .................................................................................................................................................... 13
Linear Regulators Reverse Voltage Protection.......................................................................................................................... 13
Protection against Input Reverse Voltage ................................................................................................................................. 14
Protection against Reverse Output Voltage when Output Connect to an Inductor .................................................................... 15
Power Dissipation ......................................................................................................................................................................... 16
TO252S-3 .................................................................................................................................................................................. 16
Thermal Design ............................................................................................................................................................................ 17
Calculation Example (TO252S-3) .............................................................................................................................................. 17
I/O Equivalence Circuit ................................................................................................................................................................. 18
Operational Notes ......................................................................................................................................................................... 19
1. Reverse Connection of Power Supply ................................................................................................................................... 19
2. Power Supply Lines............................................................................................................................................................... 19
3. Ground Voltage ..................................................................................................................................................................... 19
4. Ground Wiring Pattern........................................................................................................................................................... 19
5. Operating Conditions............................................................................................................................................................. 19
6. Inrush Current ....................................................................................................................................................................... 19
7. Thermal Consideration .......................................................................................................................................................... 19
8. Testing on Application Boards ............................................................................................................................................... 19
9. Inter-pin Short and Mounting Errors ...................................................................................................................................... 19
10. Unused Input Pins ............................................................................................................................................................... 19
11. Regarding the Input Pin of the IC ........................................................................................................................................ 20
12. Ceramic Capacitor............................................................................................................................................................... 20
13. Thermal Shutdown Protection Circuit(TSD) ........................................................................................................................ 20
14. Over Current Protection Circuit (OCP) ................................................................................................................................ 20
Physical Dimension and Packing Information ............................................................................................................................... 21
Ordering Information ..................................................................................................................................................................... 22
Marking Diagram .......................................................................................................................................................................... 22
Revision History ............................................................................................................................................................................ 23
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BD80C0AFPS-C
Pin Configurations
TO252S-3
(TOP VIEW)
1
2
3
Pin Descriptions
Pin No.
Pin Name
1
VCC
2
VCC(Note 1)
3
VO
FIN
GND
Function
Power Supply Pin
Pin 2 is connected to Pin 1 inside
Output Pin
GND Pin
(Note 1) the connection at the outside is unnecessary.
Block Diagram
FIN
GND
VREF
AMP
DRIVER
Power Tr.
OCP
TSD
1
2
3
VCC
VCC
VO
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Description of Blocks
Block Name
Function
Description of Blocks
TSD
Thermal Shutdown Protection
In case maximum power dissipation is exceeded or the ambient
temperature is higher than the Maximum Junction Temperature,
overheating causes the chip temperature (Tj) to rise. The TSD
protection circuit detects this and forces the output to turn off in
order to protect the device from overheating.
VREF
Reference Voltage
Generate the Reference Voltage
The Error Amplifier amplifies the difference between the internal
voltage reference(VREF) and the sensed feedback voltage from
the output, and regulates the output MOS-FET(Power Tr.) via the
DRIVER.
AMP
Error Amplifier
DRIVER
Output MOS-FET Driver
Drive the Output MOS-FET (Power Tr.)
OCP
Over Current Protection
If the output current increases higher than the maximum Output
Current, the output current is limited in order to protect the device
from damage caused by over current.
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BD80C0AFPS-C
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
VCC
-0.3 to +35.0
V
Output Voltage
VO
-0.3 to +16.0
V
Operating Ambient Temperature Range
Ta
-40 to +125
°C
Tstg
-55 to +150
°C
Tjmax
+150
°C
Supply
Voltage(Note 1)
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance and power dissipation taken
into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax.
Thermal Resistance(Note 1)
Thermal Resistance(Typ)
Parameter
Symbol
1s(Note 3)
2s2p(Note 4)
Unit
TO252S-3
Junction to Ambient
θJA
155.4
24.3
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
8
3
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-5, 7.
Thermal Via(Note 5)
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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BD80C0AFPS-C
Operating Conditions(-40°C ≤ Ta ≤ +125°C)
Parameter
Symbol
Min
Max
Unit
Supply Voltage
VCC
9.0
26.5
V
Startup Voltage (Io = 0 mA)
VCC
3.8
-
V
Output Current
IO
0
1.0
A
Input Capacitor
CIN
1.0
-
µF
Output Capacitor
CO
1.0
1000
µF
ESR(CO)
-
20
Ω
Output Capacitor Equivalent Series Resistance
Electrical Characteristics
Unless otherwise specified, -40 °C ≤ Ta ≤ +125 °C, VCC = 13.5 V, IO = 0 mA
Paremeter
Symbol
Guaranteed Limit
Unit
Conditions
Min
Typ
Max
-
0.6
2.5
mA
7.92
8.00
8.08
V
IO = 500 mA, Ta = +25 °C
7.76
8.00
8.24
V
IO = 500 mA
Circuit Current
Ib
Output Voltage
VO
Dropout Voltage
ΔVd
-
0.3
0.5
V
VCC = 7.6V, IO = 500 mA
Ripple Rejection
R.R.
40
50
-
dB
f = 120 Hz,
ein = 1 Vrms,
IO = 100 mA
Line Regulation
Reg.I
-
20
80
mV
9.0 V ≤ VCC ≤ 26.5 V
-
VO
× 0.010
VO
× 0.020
V
Load Regulation
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Typical Performance Curves
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, VCC=13.5V, IO=0mA
1.2
10
9
Output Voltage:Vo [V]
Circit Current:Ib [mA]
1.0
0.8
0.6
0.4
Ta=-40℃
0.2
8
7
6
5
4
3
Ta=-40℃
2
Ta=+25℃
Ta=+25℃
1
Ta=+125℃
0.0
Ta=+125℃
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
Supply Voltage:Vcc [V]
Figure 2. Output Voltage vs Supply voltage
(Io=0mA)
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
Figure 1. Circuit Current vs Supply Voltage
7
6
5
4
3
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Ta=-40℃
7
6
5
4
3
2
Ta=+25℃
2
1
Ta=+125℃
1
Ta=-40℃
Ta=+25℃
Ta=+125℃
0
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
Figure 3. Output Voltage vs Supply voltage
(Io=500mA)
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400
800
1200
1600
2000
2400
Output Current:Io [mA]
Supply Voltage:Vcc [V]
Figure 4. Output Voltage vs Output Current
(OCP characteristic)
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Typical Performance Curves - continued
1000
80
Ta=-40℃
Ta=-40℃
70
Ta=+25℃
800
Ripple Rejection:R.R. [dB]
Dropout Voltage : ΔVd [mV]
900
Ta=+125℃
700
600
500
400
300
200
60
Ta=+125℃
50
40
30
20
10
100
0
0
0
200
400
600
800
1000
10
100
1000
10000
Output Current:Io [mA]
Frequency: f [Hz]
Figure 5. Dropout Voltage
(VCC=VO×0.95V=7.6V)
Figure 6. Ripple Rejection
(ein=1Vrms, IO=100mA)
8.20
100000 1000000
1.0
Circuit Current:Ib [mA]
8.15
Output Voltage: Vo [V]
Ta=+25℃
8.10
8.05
8.00
7.95
0.8
0.6
0.4
Ta=-40℃
7.90
0.2
Ta=+25℃
7.85
Ta=+125℃
0.0
7.80
-40
-20
0
20
40
60
80
100
0
120
400
600
800
1000
Output Current:Io [mA]
Junction Temperature: Tj [℃]
Figure 7. Output Voltage vs Junction Temperature
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Figure 8. Circuit Current vs Output Current
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Typical Performance Curves - continued
10
Output Voltage:Vo [V]
9
8
7
6
5
4
3
2
1
0
130
140
150
160
170
180
190
Junction Temperature:Tj [℃]
Figure 9. Output Voltage vs Junction Temperature
(Thermal Shutdown Circuit Characteristic)
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Measurement Circuit for Typical Performance Curves
VCC
VO
VCC
1 µF
VO
1 µF
1 µF
1 µF
GND
GND
Measurement Setup
for Figure 1
Measurement Setup
for Figure 2
VCC
VCC
VO
1 µF
VO
1 µF
1 µF
1 µF
13.5 V
GND
GND
500 mA
Measurement Setup
for Figure 3
VCC
Measurement Setup
for Figure 4
VO
VCC
ein=
1Vrms
1 µF
1 µF
VO
1 µF
1 µF
7.6 V
GND
100 mA
GND
13.5V
Measurement Setup
for Figure 6
Measurement Setup
for Figure 5
VCC
VCC
VO
1 µF
VO
1 µF
1 µF
1 µF
13.5V
13.5V
GND
GND
Measurement Setup
for Figure 7, 9
Measurement Setup
for Figure 8
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Application and Implementation
Notice: The following information is provided only as reference for application and implementation, and does not guarantee
its operation on specific function, accuracy or the external components in the application. On application, after a
thorough confirmation such as of characteristics of the capacitor, conduct the appropriate verification necessary in
the actual application and design with sufficient margin.
Selection of External Components
Input Pin Capacitor
Inserting capacitors with a capacitance of 1 μF or higher between the VCC and GND pin is necessary and can realize
stable IC operation. We recommend using ceramic capacitor generally featuring good high frequency characteristic.
When selecting a ceramic capacitor, please consider about temperature and DC-biasing characteristics. Place
capacitors as close as possible between the VCC and GND pin.
When input impedance is high, e.g. in case there is distance from battery, line voltage drop needs to be prevented by
large capacitor. Choose the capacitance according to the line impedance between the power smoothing circuit and the
VCC pin. Selection of the capacitance also depends on the applications. Verify the application and allow sufficient
margins in the design.
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Application and Implementation - continued
Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the VO and GND pin. It is necessary to use a
capacitor with a capacitance of 1μF (Min) or higher. Electrolytic, tantalum and ceramic capacitors can be used. When
selecting the capacitor ensure that the capacitance of 1μF or higher is maintained at the intended applied voltage and
temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly resulting in
oscillation.
For selection of the capacitor refer to the graph. As described in the graph, this product is designed to achieve stable
and regulated operation with capacitance value from 1µF to 1000µF and with ESR value within approximately 0Ω to
20Ω.The stable operating range in the graph is given by the measurement data with a standalone IC and resistive load.
For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and
load impedance. Therefore the electrostatic capacity and other characteristics should be dimensioned in accordance
and should be verified in the real application and the final operating environment that the output stability requirements
are fulfilled.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly fluctuation of input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification. Place capacitors as close as possible the VO pin.
25
Unstable Operating Area
ESR [Ω]
20
15
Stable Operating Area
1.0μF ≤ CO ≤ 1000μF
ESR(CO) ≤ 20Ω
10
5
0
0.1
1
10
100
1000
Output Capacitance CO [μF]
ESR vs Output Capacitance CO,Stable Available Area
(-40°C ≤ Ta ≤ +125 °C, 9V ≤ VCC ≤ 35V, IO = 0mA to 1A)
VCC
VCC
VO
CIN
Co
RL(Io)
GND
ESR
Measurement Circuit Figure
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Application and Implementation - continued
Linear Regulators Surge Voltage Protection
The following provides instructions on surge voltage exceeding absolute maximum ratings polarity protection for ICs.
Positive surge to the input
If there is any potential risk that positive surges higher than absolute maximum ratings 35V will be applied to the input, a
Zener Diode should be inserted between the VCC and the GND to protect the device as shown in the Figure 10.
VCC
VCC
D1
VO
GND
CIN
VO
CO
Figure 10. Surges Higher than 35V will be Applied to the Input
Negative surge to the input
If there is any potential risk that negative surges below the absolute maximum ratings -0.3V will be applied to the input, a
Schottky Diode should be inserted between the VCC and the GND to protect the device as shown in the Figure 11.
VCC
VCC
D1
CIN
VO
GND
VO
CO
Figure 11. Surges Lower than -0.3 V will be Applied to the Input
Linear Regulators Reverse Voltage Protection
A linear regulator integrated circuit (IC) requires that the input voltage to be always higher than the output voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations. In such
circumstances reverse voltage and current may cause damage to the IC. A reverse polarity connection of power supply or
certain inductor components can also cause a polarity reversal between the input and output pins. The following provides
instructions on reversed voltage polarity protection for ICs.
Reverse Input /Output Voltage
In MOS type linear regulator, a parasitic body diode exists in the drain-source junction region of its internal power
MOS-FET. Reverse input/output voltage triggers the reverse current flow from the output to the input through the body
diode. The inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the
parasitic body diode is usually disregarded for the regulator behavior (see Figure 12).
reverse current
VO
VCC
Error
AMP.
VREF
Figure 12. Reverse Current Path in an MOS Linear Regulator
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Application and Implementation – continued
An effective solution to this is an external bypass diode connected between the input and output to prevent the reverse
current flow inside the IC (see Figure 13). Note that the bypass diode must be turned on prior to the IC’s internal circuit.
Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage V F. Some ICs are
configured with current-limit thresholds to shutdown high reverse current. However even when the output is off, if
reverse leakage current of bypass diode is high, leakage current flow from the input to the output; therefore, it is
necessary to choose diode with small reverse current. Specifically, select a diode with a rated peak reverse voltage
greater than the input to output voltage differential and with rated forward current greater than the reverse current in
actual application.
D1
VCC
VCC
VO
VO
GND
CIN
CO
Figure 13. Bypass Diode for Reverse Current Diversion
The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the
main drawback is in their relatively high reverse current (IR). In case of selecting Schottky barrier diodes, it is
recommended to select product with low reverse current. The VR-IR characteristics have positive temperatures
characteristic, which the details shall be checked with the datasheet of the products.
Even in case input/output voltage is inverted, if VCC is open circuit as shown in the following Figure 14, the only current
that flows in the reverse current path is the bias current of the IC. In this case a reverse current bypass diode is not
required as the amperage is too low to damage or deteriorate the parasitic element.
ON→OFF
IBIAS
VCC
VCC
VO
VO
GND
CIN
CO
Figure 14. Open VCC
Protection against Input Reverse Voltage
Accidental reverse polarity at the input connection applies a large current to the ESD protection diode for between the input
pin of the IC and the GND pin, which may destroy the IC (see Figure 15).
A Schottky barrier diode or rectifier diode connected in series to the power supply as shown in Figure 16 is the simplest
solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by batteries because there
is a power loss calculated as VF × IO, as the forward voltage VF of the diode drops forward direction connection. The lower VF
of a Schottky barrier diode contributes to rather smaller power loss than rectifier diodes. Because diodes generate heat
select diode with enough margin in power dissipation. At reverse connection diode allows a reverse current however for
negligible amount.
VCC
VCC
VO
VO
D1
CIN
GND
VCC
CO
CIN
+
GND
VO
VO
GND
CO
GND
Figure 15. Current Path in Reverse Input Connection
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Figure 16. Protection against Reverse Polarity 1
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Application and Implementation - continued
Figure 17 shows a circuit in which a P-channel MOS-FET is connected in series to the power. The body diodeQ1 (parasitic
element) is located in the drain-source junction area of the MOS-FET. The voltage drop in a forward connection is calculated
from the on state resistance of the MOS-FET times the output current IO. Therefore it is smaller than the voltage drop by the
diode (see Figure 17) and results in less of a power loss. No current flows in a reverse connection where the MOS-FET
remains off such as Figure 17.
If the gate-source voltage exceeds max rating of MOS-FET gate-source junction with derating curve in consideration, reduce
the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 18.
Q1
VCC
Q1
VCC
VCC
CIN
.
GND
VO
VO
VO
VCC
R1
CO
R2
VO
GND
CIN
CO
Figure 18. Protection against Reverse Polarity 3
Figure 17. Protection against Reverse Polarity 2
Protection against Reverse Output Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground when the output
voltage is turned off. IC integrates ESD protection diodes between the IC output and ground pins, which a large current may
flows in such condition finally resulting on destruction of the IC. To prevent this situation, connect a Schottky barrier diode in
parallel to the diode (see Figure 19).
Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the waveform on an
oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for a motor load that is
affected by its counter electromotive force, as it produces an electrical current in a similar way.
VCC
VCC
VO
VO
GND
CIN
CO
GND
D1
XLL
GND
Figure 19. Current Path in Inductive Load (Output: Off)
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BD80C0AFPS-C
Power Dissipation
TO252S-3
IC mounted on ROHM standard board based on JEDEC.
1 : 1-layer PCB
(Copper foil area on the reverse side of PCB: 0mm × 0mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.57mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint
+ wiring to measure, 2 oz. copper.
6.0
Power Dissipation: Pd[W]
②5.14 W
4.0
2.0
①0.80 W
0.0
0
25
50
75
100
125
150
2 : 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2mm × 74.2mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.60mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint
+ wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB:
74.2mm × 74.2mm, 1 oz. copper.
Copper foil area on the reverse side of PCB:
74.2mm × 74.2mm, 2 oz. copper.
Ambient Temperature: Ta [°C]
Condition 1 : θJA = 155.4°C/W, ΨJT (top center) = 8°C/W
Condition 2 : θJA = 24.3°C/W, ΨJT (top center) = 3°C/W
Figure 20. Power Dissipation (TO252S-3)
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TSZ02201-0G1G1A600030-1-2
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BD80C0AFPS-C
Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement. The power consumption
of the IC is decided by the dropout voltage condition, the load current and the circuit current. Refer to power dissipation
curves illustrated in Figure 20 when using the IC in an environment of Ta ≥ +25°C. Even if the ambient temperature Ta is at
+25°C, depending on the input voltage and the load current, chip junction temperature can be very high. Consider the design
to be Tj ≤ Tjmax = +150°C in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = +150°C rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is
based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient
margins in the thermal design by the following method to calculate the junction temperature Tj. Tj can be calculated by either
of the two following methods.
1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta.
𝑇𝑗 = 𝑇𝑎 + 𝑃𝐶 × 𝜃𝐽𝐴
Where:
Tj
Ta
PC
θJA
is the Junction Temperature
is the Ambient Temperature
is the Power Consumption
is the Thermal Resistance
(Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature TT.
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇
Where:
Tj
TT
PC
ΨJT
is the Junction Temperature
is the Top Center of Case’s (mold) Temperature
is the Power consumption
is the Thermal Resistance
(Junction to Top Center of Case)
3. The following method is used to calculate the power consumption Pc (W).
𝑃𝑐 = (𝑉𝐶𝐶 − 𝑉𝑂 ) × 𝐼𝑂 + 𝑉𝐶𝐶 × 𝐼𝑏
Where:
PC
VCC
VO
IO
Ib
is the Power Consumption
is the Input Voltage
is the Output Voltage
is the Load Current
is the Quiescent Current
Calculation Example (TO252S-3)
If VCC = 13.5V, VO = 8.0V, IO = 500mA, Ib = 0.65mA, the power consumption Pc can be calculated as follows:
𝑃𝐶 = (𝑉𝐶𝐶 − 𝑉𝑂 ) × 𝐼𝑂 + 𝑉𝐶𝐶 × 𝐼𝑏
= (13.5𝑉 – 8.0𝑉) × 500𝑚𝐴 + 13.5𝑉 × 0.65𝑚𝐴
= 2. 759𝑊
At the ambient temperature Ta = +80°C, the thermal impedance (Junction to Ambient) θJA = 23.0 °C / W(4-layer PCB)
𝑇𝑗 = 𝑇𝑎 + 𝑃𝐶 × 𝜃𝐽𝐴
= 80°𝐶 + 2.759𝑊 × 24.3°𝐶 / 𝑊
= 147.0°𝐶
When operating the IC, the top center of case’s (mold) temperature TT = +100°C, ΨJT = 3°C / W(4-layer PCB)
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇
= 100°𝐶 + 2.759𝑊 × 3°𝐶 / 𝑊
= 108.3°𝐶
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pads.
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TSZ22111 • 15 • 001
17/23
TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
BD80C0AFPS-C
I/O Equivalence Circuit
VCC
VCC
VO
VO
VCC
20.0 kΩ
(Typ)
48.3 kΩ
(Typ)
VO
5.0 kΩ
(Typ)
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TSZ02201-0G1G1A600030-1-2
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BD80C0AFPS-C
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the operating conditions. The
characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input and
output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not
exceed the Pd rating.
If Junction temperature is over Tjmax (=+150°C), IC characteristics may be worse due to rising chip temperature. Heat
resistance in specification is measurement under PCB condition and environment recommended in JEDEC. Ensure that
heat resistance in specification is different from actual environment.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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TSZ22111 • 15 • 001
19/23
TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
BD80C0AFPS-C
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Protection Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not
be used in applications characterized by continuous operation or transitioning of the protection circuit.
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TSZ22111 • 15 • 001
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TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
BD80C0AFPS-C
Physical Dimension and Packing Information
Package Name
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TSZ22111 • 15 • 001
TO252S-3
21/23
TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
BD80C0AFPS-C
Ordering Information
B
Parts
Number
D
8
0
C
Output Voltage
80: 8.0V
0
A
F
Output Current
C0A: 1A
P
S
Package
FPS: TO252S-3
－
C E2
Product Grade
C: for Automotive
Packaging and Forming Specification
E2: Embossed Tape and Reel
Marking Diagram
TO252S-3
(TOP VIEW)
Part Number Marking
80C0 ACS
LOT Number
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TSZ22111 • 15 • 001
22/23
TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
BD80C0AFPS-C
Revision History
Date
Revision
22.Dec.2017
001
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TSZ22111 • 15 • 001
Changes
New Release
23/23
TSZ02201-0G1G1A600030-1-2
22.Dec.2017 Rev.001
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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