BD82A26MUF-ME2

Nano CapTM Datasheet 6ch White LED Driver Built-in Current Driver Boost DC/DC Converter for Automotive BD82A26MUF-M General Description Key Specifications This IC is a white LED driver for LCD backlight. It has 6ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50 V, making it suitable for driving large LCD panels. The dimming is controlled by the PWM signal and can be set up to 20,000: 1@100 Hz. It also supports analog dimming, and can accommodate even higher brightness ranges by combining with PWM dimming. DC/DC converters can be controlled for boost applications, and the input operating voltage range is 3.0 V to 48 V. ◼ Input Operating Voltage Range: 3.0 V to 48 V ◼ Output LED Current Absolute Accuracy: ±5.0 %@80 mA ◼ DC/DC Oscillation Frequency: 200 kHz to 2420 kHz ◼ Operating Temperature: -40 °C to +125 °C ◼ LED Maximum Current: 150 mA/ch ◼ LED Maximum Dimming Ratio: 20,000: 1@100 Hz ◼ LED1 to LED6 Pin Maximum Voltage: 50 V Package Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ W (Typ) x D (Typ) x H (Max) VQFN32FBV050 Nano CapTM Integrated(Note 1) AEC-Q100 Qualified(Note 2) Functional Safety Supportive Automotive Products Current Driver for LED Drive 6ch Current Mode Boost DC/DC Converters Load Switch (M1) Control Pin PWM Dimming (20,000: 1@100 Hz, 100 Hz to 25 kHz) Analog + PWM Mix Dimming Available Spread Spectrum Function DC/DC Converter Oscillation Frequency External Synchronization Function LSI Protect Functions (UVLO, OVP, TSD, OCPL) LED Anode/Cathode Short Circuit Protection Function LED Open/Short Protection Function 5.0 mm x 5.0 mm x 1.0 mm Applications ◼ ◼ ◼ ◼ ◼ Automotive CID (Center Information Display) Panel Navigation Cluster Panel HUD (Head Up Display) Other Small and Medium Sized LCD Panels for Automotive (Note 1) Nano CapTM is a trademark or a registered trademark of ROHM Co., Ltd. Nano Cap™ is a combination of technologies which allow stable operation even if output capacitance is connected with the range of nF unit. (Note 2) Grade 1 Typical Application Circuit M1 CCP1 CIN CCP2 5 PWM 6 CSH EN VCC CP 24 OVP 23 FAIL2 22 SHT 21 PD 20 PLSET PGND 19 7 COMP OUTL 18 8 GND CSL 17 LED5 LED6 EXP-PAD 9 10 11 12 13 14 15 16 RFAIL2 VREG PD ROVP1 ROVP2 L1 D2 M2 VOUT RG RCSL EXP-PAD RISET RDIMSEL1 CPP VDISC EXP-PAD RDIMSEL2 EXP-PAD COUT2 SYNC 25 FAIL1 4 LDSW RT 26 LED4 CPC RPC RPLSET1 3 27 LED3 PWM REG50 28 LED2 RPLSET2 2 29 LED1 SYNC RRT REG25 30 ISET CREG50 1 31 DIMSEL CREG25 CPM 32 EXP-PAD D1 COUT1 RCSH EN REG50 RFAIL1 VCC CVCC Figure 1. Boost Application Circuit Diagram 〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays. ○This product is protected by U.S. Patent No.7,235,954, No.7,541,785, No.7,944,189 and No.10,068,511. www.rohm.com TSZ02201-0T2T0B200380-1-2 © 2021 ROHM Co., Ltd. All rights reserved. 1/45 15.Mar.2022 Rev.003 TSZ22111 • 14 • 001 BD82A26MUF-M Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Descriptions .............................................................................................................................................................................. 3 Block Diagram ................................................................................................................................................................................ 5 Description of Blocks ...................................................................................................................................................................... 6 Absolute Maximum Rating ............................................................................................................................................................ 11 Thermal Resistance ...................................................................................................................................................................... 11 Recommended Operating Conditions ........................................................................................................................................... 12 Operating Conditions (External Constant Range) ......................................................................................................................... 12 Electrical Characteristics............................................................................................................................................................... 13 Typical Performance Curves......................................................................................................................................................... 17 Functional Descriptions ................................................................................................................................................................ 19 PCB Application Circuit Diagram .................................................................................................................................................. 36 List of External Components ......................................................................................................................................................... 37 Power Consumption Calculation Example .................................................................................................................................... 39 I/O Equivalence Circuit ................................................................................................................................................................. 40 Operational Notes ......................................................................................................................................................................... 41 Ordering Information ..................................................................................................................................................................... 43 Marking Diagram .......................................................................................................................................................................... 43 Physical Dimension and Packing Information ............................................................................................................................... 44 Revision History ............................................................................................................................................................................ 45 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M CPP CP EN VCC CSH LDSW FAIL1 EXP-PAD (TOP VIEW) CPM Pin Configuration 32 31 30 29 28 27 26 25 EXP-PAD REG25 1 24 VDISC REG50 2 23 OVP RT 3 22 FAIL2 SYNC 4 21 SHT PWM 5 20 PD PLSET 6 19 PGND COMP 7 18 OUTL GND 8 17 CSL 10 11 12 13 14 15 16 DIMSEL LED1 LED2 LED3 LED4 LED5 LED6 Pin Descriptions 9 ISET EXP-PAD EXP-PAD Signal type EXP-PAD Pin No. Pin Name 1 REG25 A Internal reference voltage 1: Used as the reference voltage for the internal circuit and charge pump. 2 REG50 A Internal reference voltage 2: Used as the reference voltage for the internal circuit. 5 V is generated and output by setting the EN pin to High. Connect a capacitance of 2.2 μF for phase compensation. 3 RT A Resistor connection for oscillation frequency setting: The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a resistor (RRT) between the RT pin and the GND pin. Function (Note 1) 4 SYNC I External synchronization frequency input / SSCG setting: The internal oscillation frequency can be externally synchronized by inputting an external clock signal to the SYNC pin before the Self Diagnosis is completed. When using spread spectrum mode (SSCG), short the SYNC pin and the REG50 pin beforehand. 5 PWM I PWM dimming signal: The LED current can be controlled according to On Duty of the input PWM signal. 6 PLSET A Switching pulse number setting: Addition pulse function is provided to stabilize DC/DC converter output voltage even when PWM Duty is low. The number of switching pulses to be added can be set by the resistance value connected to the PLSET pin. 7 COMP A Phase compensation capacitor connection: The reference voltage and LED pin voltage generated by REF Voltage block are compared and output by Error AMP. Connect a filter for phase compensation. 8 GND A Small Signal Ground: Use to ground for the external components connected to the REG25, REG50, RT, PLSET, COMP, ISET, DIMSEL, PD, SHT, and OVP pins. 9 ISET A Resistor connection for LED current setting: LED current (ILED) can be set by connecting a resistor (RISET) between the ISET pin and the GND pin. 10 DIMSEL A DC dimming setting: The point at which PWM dimming and DC dimming are switched can be set by the resistor connected between the DIMSEL pin and the GND pin. When using only PWM dimming, short the DIMSEL pin with the GND pin. 11 LED1 P LED cathode connection 1: Open drain output of the current driver ch1 for LED drive. Connect to the LED cathode. 12 LED2 P LED cathode connection 2: Open drain output of the current driver ch2 for LED drive. Connect to the LED cathode. 13 LED3 P LED cathode connection 3: Open drain output of the current driver ch3 for LED drive. Connect to the LED cathode. (Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units P: High current signal susceptible to impedance, including transient current. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Pin Descriptions – continued Signal type Pin No. Pin Name 14 LED4 P LED cathode connection 4: Open drain output of the current driver ch4 for LED drive. Connect to the LED cathode. 15 LED5 P LED cathode connection 5: Open drain output of the current driver ch5 for LED drive. Connect to the LED cathode. 16 LED6 P LED cathode connection 6: Open drain output of the current driver ch6 for LED drive. Connect to the LED cathode. 17 CSL A Overcurrent protection detection input: The current flowing through Low side FET (M2) is converted to voltage by the low side current detection resistor (R CSL) and detected by the CSL pin. When the overcurrent protection (OCPL) is activated, DC/DC converters are switched OFF. 18 OUTL P Low side FET gate signal: Switching signal output of DC/DC converter. The OUTL pin should be connected to Low side FET (M2) gate. 19 PGND P Large current ground: Use for ground for external components connected to the CSL and OUTL pins. 20 PD A Phase Delay setting: Connect the PD pin to the REG50 pin when using the Phase Delay function. Connect the PD pin to the GND pin when the phase delay function is not used. 21 SHT A Resistor connection for LED short protection setting: LED short detection voltage can be set by connecting a resistor (RSHT) between the SHT pin and the GND pin. When LED short protection is activated, the current driver is turned OFF only for the corresponding LED column. 22 FAIL2 O Error output flag 2: Outputs the status of protective operation from the FAIL1 pin and the FAIL2 pin. Since these pins are open drain outputs, pulling up to the REG50 pin is recommended. Function (Note 1) 23 OVP A Overvoltage protection and short circuit protection detection input: When OVP pin voltage rises to 1.0 V or more, overvoltage protection (OVP) is activated, and DC/DC converters are switched OFF. If OVP pin voltage is 0.3 V or less for 13.1 ms, Short Circuit Protection (SCP) is activated, and both DC/DC converter and the current driver are turned OFF. 24 VDISC P VOUT discharge: Connects to the output of DC/DC converters. When UVLO, TSD, or SCP protective operation is performed, or when PWM Low section is monitored and the operation OFF status is detected, DC/DC output voltage is discharged from the VDISC pin. 25 FAIL1 O Error output flag 1: Outputs the status of protective operation from the FAIL1 pin and the FAIL2 pin. Since these pins are open drain outputs, we recommend pulling them up to the REG50 pin. 26 LDSW P Output for driving the load switch gate: This is the signal output for driving the gate of the load switch. When the input overcurrent protection (OCPH) is activated, the load switch is turned OFF as LDSW pin voltage = VCC voltage. 27 CSH A Input current detection input: The input current is converted to voltage by the input current detection resistor (RCSH) connected between the VCC-CSH pin, and detected by the CSH pin. Turns the load switch OFF when the input overcurrent protection is activated. 28 VCC P Power supply voltage input: The input operating voltage range is 3.0 V to 48 V, but when the IC is started, VCC ≥ 5.0 V should be used. The decoupling capacitor (C VCC) between the VCC pin and the GND pin should be close to the IC pin. 29 EN I Enable input: The EN pin is turned High to activate the internal circuit. The EN pin is judged as Low level at 0.5 V or less, and judged as High level at 2.3 V or more. Avoid using a constant two state input (0.5 V ≤ VEN ≤ 2.3 V). 30 CP P Charge pump output: Connect a capacitance (CCP1) between the CP pin and the PGND pin. 31 CPP P Flying capacitor connection + side: Connect a capacitance (CCP2) between the CPP pin and the CPM pin. 32 CPM P Flying capacitor connection - side: Connect a capacitance (CCP2) between the CPP pin and the CPM pin. - EXPPAD - The center EXP-PAD should be connected to the board ground. The center EXP-PAD and corner EXP-PAD are shorted inside the packaging. (Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, O: Output signal to other units, P: High current signal susceptible to impedance, including transient current. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Block Diagram CSH VCC EN VOUT Discharge LDSW Driver VREF REG50 LDSW VDISC PROTECT REG25 Additional Pulse PLSET OSC RT PROTECT SLOPE DC/DC Control LOGIC + REG50 OUTL － SSCG PWM COMP PGND CSL SYNC Error AMP COMP Soft Start LDSW Driver － － + LED1 LED2 Minimum Channel Selector PROTECT UVLO FAIL1 FAIL2 SHT 　　　　　　　　　　　　　　　　FAIL TSD SCP OCPH ISET SCP OCPL OPEN Det SHORT Det Internal CLK PD PWM DC/DC Control LOGIC LED3 LED4 LED5 LED6 OVP TW OVP Current Driver REF Voltage Phase Delay CP Dimming Control DIMSEL ISET CPP ISET CH1 CH2 CH3 CH4 CH5 CH6 Charge Pump CPM Current Driver CP GND www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Description of Blocks Unless otherwise stated, the value in the sentence is the typical value. 1 VREF Internal reference voltage circuit. By setting the EN pin to High, 5 V is generated and output to the REG50 pin. REG50 voltage is used as the power supply for the internal circuit. Also, this is used to fix each input pin to High voltage outside the IC. Connect CREG50 = 2.2 μF to the REG50 pin as the capacitance for the phase compensation. Note that if CREG50 is not connected, unstable operation such as oscillation will occur. 2 LDSW Driver Input overcurrent protection circuit. If the voltage between the VCC-CSH pin is 0.2 V or more and continues for 10 μs or more, the input overcurrent protection is activated, and the load switch (M1) is turned OFF as LDSW pin voltage = VCC voltage. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.2 V or more, the load switch is turned OFF again. If the voltage between VCC-CSH is 0.2 V or less, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". Only the FAIL2 pin goes Low when the input overcurrent protection is detected. 3 VOUT Discharge Output voltage discharge circuit. The LEDs may flicker if activated with charges remaining on VOUT. Therefore, VOUT must be discharged at startup. Discharge times may be prolonged only by discharge paths such as the resistor for OVP setting, so an output voltage discharge circuit (VOUT discharge function) is provided. Residual charges in the output are discharged when DC/DC converters are turned OFF (when the EN falls or the protective function is activated). 4 OSC (Oscillator) Oscillation frequency generator. The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a resistor for oscillation frequency setting (RRT) between the RT pin and ground. In addition, the oscillation frequency of DC/DC converter can be externally synchronized by inputting the external synchronization frequency (fSYNC) to the SYNC pin. Input the clock signal to be input from the SYNC pin before the Self Diagnosis is completed. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". 5 SSCG (Spread Spectrum Clock Generator) Spread spectrum circuit. The spread spectrum function (SSCG) is activated by shorting the SYNC pin and the REG50 pin. Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the frequency due to SSCG is from 100 % to 92 % of the set oscillation frequency. The oscillation frequency fluctuation cycle is 128/set oscillation frequency. 6 SLOPE This circuit generates a saw wave that serves as the source of the switching pulse of DC/DC converter. SLOPE output signal and COMP pin voltage are compared and a switching pulse is generated. 7 Minimum Channel Selector Selector circuit for detecting LED pin voltages. Selects the lowest pin voltage among LED1 to LED6 pin voltages and input it in Error AMP. 8 Error AMP (Error Amplifier) This is an error amplifier that takes the smallest values of the LED1 to LED6 pin voltage and LED control voltage as inputs. Phase compensation can be set by connecting a resistor and a capacitor to the COMP pin. 9 Soft Start Soft start circuit for DC/DC converters. This function is used to suppress a steep increase in the coil current at startup and an overshoot in the output voltage. Controls the change in switching Duty by limiting the rising edge of the output of Error AMP (COMP pin voltage). 10 PWM COMP (PWM Comparator) This comparator compares COMP pin voltage, which is the output of Error AMP, with SLOPE output signal. Controls the duty of the switching pulse of DC/DC converter. 11 Additional Pulse This circuit adds switching pulses for DC/DC converters. With the Additional pulse function, the LED current can be supplied stably even when the PWM dimming ratio decreases. 12 DC/DC Control LOGIC This circuit generates the final logic of Low side FET gate signal output from the OUTL pin. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Description of Blocks - continued 13 Internal CLK This circuit generates the internal reference clock. It is a clock of 20 MHz and used as a counter or sampling frequency. 14 Phase Delay This circuit shifts the phase of LED pin output during PWM dimming. Phase Delay function can be used by shorting the PD pin to the REG50 pin. 15 Dimming Control This circuit controls the dimming ratio during PWM dimming. PWM dimming and DC dimming can be automatically switched PWM dimming and DC dimming can be automatically switched and controlled by applying a voltage (resistor division of REG50) to the DIMSEL pin. This provides both minute dimming (PWM dimming) at low brightness levels and support for high brightness ranges (DC dimming). 16 Charge Pump Charge pump circuit. The charge pump output voltage is used for the output drive voltage of the current driver, and can output a stable LED current even when the VCC input voltage is low. By connecting the capacitance (CCP1) between the CP pin and ground and the capacitance (CCP2) between the CPP-CPM pin, a voltage twice the REG25 pin voltage can be output from the CP pin. 10 μF is recommended for CCP1 and 2.2 μF is recommended for CCP2. When the charge pump function is not used, do not connect capacitance between the CPP-CPM pin and short-circuit the CP pin with the REG50 pin. 17 Current Driver / ISET Current driver circuit for lighting the LED. The LED current can be set by connecting a resistor to the ISET pin. 18 PROTECT Outputs the status of protective operation from the FAIL1 pin and the FAIL2 pin. Since these pins are open drain outputs, connect them to the REG50 pin with resistors. If the protection status is not monitored, turn the FAIL1 pin and the FAIL2 pin to OPEN or connect to the GND pin. 18.1 UVLO (Under Voltage Lockout) Under Voltage Lockout. When the VCC is 2.8 V or less or the REG50 pin voltage is 2.7 V or less, Under Voltage Lockout (UVLO) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. When VCC becomes 3.2 V or more and the REG50 pin voltage becomes 3.1 V or more, UVLO is released and the IC restarts from Self Diagnosis. When a UVLO is detected, the outputs of the FAIL1 pin and the FAIL2 pin do not change. When the FAIL1 pin and the FAIL2 pin are pulled up to REG50, FAIL1 pin and FAIL2 pin voltage will also drop as REG50 decreases. 18.2 TSDLED (Thermal Shutdown for Current Driver) This is a temperature protection circuit that monitors the vicinity of the current driver on the chip. Prevents chip temperature from rising due to abnormal output current. When the chip temperature rises to 175 °C or more, the temperature protection circuit (TSDLED) is activated, the load switch (M1), DC/DC converter, and current driver are turned OFF, and only the FAIL2 pin is turned Low. When the chip temperature falls 150 °C or less, TSDLED is released, the IC restarts from Self Diagnosis, and the FAIL2 pin returns to High. 18.3 TSDREG (Thermal Shutdown for REG50) This is a temperature protection circuit that monitors the vicinity of the REG50 pin on the chip. Prevents chip temperature rising due to the REG50 pin failure. When the chip temperature rises to 175 °C or more, the temperature protection circuit (TSDREG) is activated, and REG50 pin voltage, load switch (M1), DC/DC converter, and current driver turn OFF. When the FAIL1 pin and the FAIL2 pin are pulled up to the REG50 pin, FAIL1 pin and FAIL2 pin voltages drop as REG50 pin voltage is turned OFF, and both are output to the Low level. When the FAIL1 pin and the FAIL2 pin are pulled up to an external power supply, both the FAIL1 pin and the FAIL2 pin are output to High. When the chip temperature falls 150 °C or less, TSDREG is released and the IC restarts from Self Diagnosis. 18.4 TW (Thermal Warning) Thermal Warning Circuit. When the chip temperature rises to 140 °C or more, the Thermal Warning Circuit (TW) activates and only the FAIL1 pin goes Low. When the chip temperature falls 130 °C or less, the TW is released and the FAIL1 pin returns to High. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 18. PROTECT – continued 18.5 OCPL (Over Current Protection for Low side) The voltage is detected by the low side current detection resistor (RCSL) for the current flowing through Low side FET (M2). When CSL pin voltage rises to 0.3 V or more, the overcurrent protection (OCPL) is activated and only the switching of DC/DC converter is stopped. If CSL pin voltage falls less than 0.3 V, the overcurrent protection is released and switching resumes. When the OCPL is detected, the outputs of the FAIL1 pin and the FAIL2 pin do not change. 18.6 OVP (Over Voltage Protection) Output overvoltage protection circuit. When OVP pin voltage (resistor division of DC/DC converter output voltage) becomes 1.0 V or more, the output overvoltage protection circuit (OVP) activates and only the switching of DC/DC converter is stopped. When OVP pin voltage falls 0.95 V or less, OVP is released. Only the FAIL1 pin goes Low when OVP is detected. 18.7 OPEN Det (LED Open Detection) LED open protection circuit. When any of LED1 to LED6 pin voltages is 0.3 V or less and OVP pin voltage is 1.0 V or more, the LED open protection (OPEN Det) is activated and the current driver is latched OFF only for the corresponding LED column. LED open protection is released when VEN = Low or UVLO is detected. When LED open is detected, only the FAIL2 pin goes Low. 18.8 SHORT Det (LED Short Detection) LED short protection circuit. When LED pin voltage is higher than the threshold set by the SHT pin for 13.1 ms, the LED short protection (SHORT Det) is activated and the current driver is latched OFF only for the corresponding LED column. The counter is reset when LED pin voltage does not satisfy the detection condition prior to the LED short protection being activated. 10 times the voltage input to the SHT pin becomes the short detection threshold. When the SHT pin is connected to GND, the short detection threshold is 4.5 V. Short the SHT pin to GND or set to the voltage application state and do not set it to OPEN status. LED short protection is released when VEN = Low or a UVLO is detected. Counters of 13.1 ms are counted up only when Duty of LED current is ON. Therefore, the duration until LED short protection is detected varies depending on the input PWM Duty and PWM-DC dimming switching point. Only the FAIL2 pin goes Low when LED short protection is detected. LED short protection is detectable when ON pulse width of the LED current is 20 μs or more. 18.9 SCP (Short Circuit Protection) Short Circuit Protection circuit. If any of the LED1 to LED6 pin is 0.3 V or less or OVP pin voltage is 0.3 V or less for 13.1 ms, the Short Circuit Protection (SCP) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. However, the counters are reset when each pin voltage no longer satisfies the requirement prior to the SCP is activating. The SCP is released when VEN = Low or a UVLO is detected. When SCP is detected, only the FAIL2 pin goes Low. DC/DC converters also attempt to output a higher voltage because the grounded LED pin voltage (lowest LED pin voltage) is controlled to be VLEDCTL. Depending on the power supply voltage and load conditions, the OVP pin may become 1.0 V or more prior to the SCP being activated, and the LED open protection may be activated first. In this case, the current driver will be turned OFF only in the grounded LED pin, but the LEDs will remain lighting with the current control lost because of a short circuit as well. Even when LED open protection is detected, the FAIL2 pin goes Low. Abnormality can be detected by monitoring this. 18.10 OCPH (Over Current Protection for High side) / LDSW Driver Input overcurrent protection circuit. If a condition in which the voltage between the VCC-CSH pin is 0.2 V or more continues for 10 μs or more, the input overcurrent protection (OCPH) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.2 V or more, the load switch, DC/DC converter, and current driver are turned OFF again. If the voltage between VCC-CSH is less than 0.2 V, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". When the input overcurrent protection is detected, the FAIL2 pin goes Low. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 18 PROTECT – continued 18.11 ISET Pin Fault Protection (ISET-GND Short Circuit Protection) ISET pin fault protection circuit. When the resistance value connected to the ISET pin becomes 1 kΩ or less, ISET error protection is activated, and the load switch (M1), DC/DC converter, and current driver are turned OFF. When the resistor connected to the ISET pin becomes 15 kΩ or more, ISET error protection is released, and the load switch (M1), DC/DC converter, and current driver turn ON. When ISET-GND short protection is detected, only the FAIL2 pin goes Low. 18.12 OVP Pin Fault Protection OVP pin fault protection circuit. If OVP pin voltage is 2.3 V or more or 0.2 V or less or VDISC pin voltage is 47.5 V or more in the Self Diagnosis status after the EN pin starts, OPEN/SHORT error of the resistor connected to OVP is detected and OVP pin fault protection is activated. At this time, the load switch (M1), DC/DC converter, and current driver turn OFF. When VEN = Low or a UVLO is detected, OVP pin fault protection is released. When OVP pin fault protection is detected, both the FAIL1 pin and the FAIL2 pin are set to Low. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Description of Blocks - continued Detect Conditions and Operation at Detection of Each Protection Function (All values in the table are typical values) Detect Operation Detect Condition No. 1 2 3 4 5 6 Function Under Voltage Lockout (UVLO) Thermal Shutdown (TSDLED) Thermal Shutdown(Note 2) (TSDREG) Thermal Warning (TW) Overcurrent Protection (OCPL) Overvoltage Protection (OVP) [Detect] [Release] Load Switch DC/DC Switching Current Driver FAIL1 FAIL2 (Note 1) (Note 1) VCC ≤ 2.8 V or VREG50 ≤ 2.7 V VCC ≥ 3.2 V and VREG50 ≥ 3.1 V OFF OFF OFF High High Tj ≥ 175 °C Tj ≤ 150 °C OFF OFF OFF High Low Tj ≥ 175 °C Tj ≤ 150 °C OFF OFF OFF Low Low (Note 2) (Note 2) Tj ≥ 140 °C Tj ≤ 130 °C ON ON ON Low High VCSL ≥ 0.3 V VCSL < 0.3 V ON OFF ON High High VOVP ≥ 1.0 V VOVP ≤ 0.95 V ON OFF ON Low High VLEDn ≤ 0.3 V and VOVP ≥ 1.0 V(Note 6) Detects VEN = Low or UVLO ON Detect LED Pin OFF High Latch Low ON ON Detect LED Pin OFF High Latch Low OFF OFF OFF High Latch Low VCC-VCSH < 0.2 V OFF OFF OFF (Note 5) (Note 5) High Low RISET ≤ 1.0 kΩ RISET ≥ 15 kΩ OFF OFF OFF High Low At Self Diagnosis VOVP ≥ 2.3 V or VOVP ≤ 0.2 V or VVDISC ≥ 47.5 V Detects VEN = Low or UVLO OFF OFF OFF Latch Low Latch Low 7 LED Open Protection (OPEN Det) 8 LED Short Protection (SHORT Det) Detects VLEDn ≥ VSHT x 10 and VLEDn ≥ 4.5 V for 13.1 ms or more(Note 3)(Note 6) 9 Short Circuit Protection (SCP)(Note 4) Detects VLEDn ≤ 0.3 V or VOVP ≤ 0.3 V for 13.1 ms or more(Note 6) 10 11 12 Input Overcurrent Protection (OCPH)(Note 4) ISET Pin Fault Protection (ISET SCP) OVP Pin Fault Protection Detects VCC-VCSH ≥ 0.2 V for 10 μs or more Detects VEN = Low or UVLO Detects VEN = Low or UVLO ON (Note 1) When the EN pin is Low, if FAIL1, FAIL2 is pulled up to the REG50 pin, FAIL1 = Low, FAIL2 = Low. When FAIL1, FAIL2 is pulled up to an external power supply, FAIL1 = High, FAIL2 = High. (Note 2) Thermal shutdown (TSDREG) detects heat generation in the event of the REG50 pin failure and turns all circuit OFF, including the REG50 pin. When FAIL1, FAIL2 is pulled up to the REG50 pin, FAIL1 = Low, FAIL2 = Low. When FAIL1, FAIL2 is pulled up to an external power supply, FAIL1 = High, FAIL2 = High. (Note 3) LED pin voltage of at least 1ch shall be less than VLEDCTL(Min) x 1.1. When LED pin voltages of all channels are 1.4 V or more, the LED short protection does not operate. In addition, since the 13.1 ms counter is counted up only when Duty of the LED current is ON, the time until SHORT Det is detected varies depending on PWM Duty. (Note 4) When Short Circuit Protection (SCP) and input overcurrent protection (OCPH) are detected at the same time, the operation of input overcurrent protection takes precedence. (Note 5) When 13.1 ms elapses after the load switch is turned OFF, the load switch turns ON. At this time, when the voltage between VCC-CSH ≥ 0.2 V, the load switch is turned OFF again. When the voltage between VCC-CSH < 0.2 V, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". (Note 6) n = 1 to 6 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Absolute Maximum Rating (Ta = 25 °C) Parameter Symbol Rating Unit OVP, VDISC, LDSW, CSH, VCC Pin Voltage VOVP, VVDISC, VLDSW, VCSH, VCC -0.3 to +50 V VCC - VLDSW -0.3 to +7.0 V -0.3 to +50 V -0.3 to VREG50 V VREG25, VREG50 -0.3 to +7.0 V VSYNC, VPWM, VPD, VSHT, VFAIL2, VFAIL1, VEN, VCP, VCPP, VCPM -0.3 to +7.0 V Tstg -55 to +150 °C Tjmax 150 °C Voltage Between VCC-LDSW Pin LED1, LED2, LED3, LED4, LED5, LED6 Pin Voltage RT, PLSET, COMP, ISET, DIMSEL, CSL, OUTL Pin Voltage VLED1, VLED2, VLED3, VLED4, VLED5, VLED6 VRT, VPLSET, VCOMP, VISET, VDIMSEL, VCSL, VOUTL REG25, REG50 Pin Voltage SYNC, PWM, PD, SHT, FAIL2, FAIL1, EN, CP, CPP, CPM Pin Voltage Storage Temperature Range Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit VQFN32FBV050 Junction to Ambient θJA 97.3 30.7 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 10.0 7.0 °C/W (Note 1) Based on JESD51-2A (Still-Air). The BD82A26MUF-M chip is used. (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Recommended Operating Conditions Parameter Operating Range Symbol Min Max Unit Power Supply Voltage(Note 1) VCC 3.0 48 V DC/DC Oscillation Frequency Range fOSC 200 2420 kHz PWM Frequency Range(Note 2) fPWM 0.1 25 kHz fSYNC Higher of 200 or fOSC x 0.8 Lower of 2420 or fOSC kHz fSDUTY 40 60 % LED Current Setting Range(Note 5) ILED 50 150 mA Operating Temperature Topr -40 +125 °C External Synchronized Frequency Range(Note 3) External Synchronized Pulse Duty Range(Note 4) (Note 1) When IC are started, VCC ≥ 5.0 V should be set. VCC (Min) = 3.0 V is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set varies depending on the connected LED load and external components. (Note 2) Generally, flickering of LEDs is easier to see when the dimming frequency is set lower than 100 Hz. Check with the actual application evaluation. (Note 3) When the external synchronization function is not used, connect the SYNC pin to the REG50 pin (SSCG = ON) or connect to the GND pin (SSCG = OFF) or OPEN (SSCG = OFF). (Note 4) When using the external synchronous function, switching from the external synchronous state to the internal oscillation frequency is not possible during stable operation. (Note 5) The amount of current per channel. Set the LED current so that the maximum junction temperature (Tjmax) is not exceeded. Operating Conditions (External Constant Range) Parameter Operating Range Symbol Min Typ Max Unit REG25 Capacitance CREG25 0.10 0.22 0.47 μF REG50 Capacitance CREG50 1.0 2.2 4.7 μF LED Current Setting Resistor RISET 18.0 31.2 50.0 kΩ Oscillation Frequency Setting Resistor RRT 4.0 33.3 45.0 kΩ Input Capacitance 1 CVCC 1(Note 6) - - μF Input Capacitance 2 CINVCC(Note 7) 10(Note 6) - - μF Output Capacitance CVOUT 20(Note 6) - 100 μF Charge Pump Capacitance 1 CCP1 4.7 10.0 20.0 μF Charge Pump Capacitance 2 CCP2 1.0 2.2 4.7 μF Resistor for the OVP Pin Setting (Low Side) ROVP1 10 - 20 kΩ Resistor for the OVP Pin Setting (High Side) ROVP2 300 - 800 kΩ RLED1 10 20 30 kΩ RLED2 40 100 180 kΩ Resistor for Unused Channels Setting (Low Side)(Note 8) Resistor for Unused Channels Setting (High Side)(Note 8) (Note 6) Set the capacitance so that it does not fall below the minimum value in consideration of temperature characteristics, DC bias characteristics, etc. (Note 7) CINVCC means the sum of CIN and CVCC. If a capacity of 10 μF or more is connected to CVCC, the capacity of CIN is not required. (Note 8) The ratio of RLED1 to RLED2 should be between 1:4 and 1:6. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Electrical Characteristics (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Standard Value Parameter Symbol Min Typ Max VCC Voltage at Startup Unit Conditions VCC_start 5.0 12.0 48.0 V VCC_active 3.0 12.0 48.0 V Circuit Current ICC - - 20 mA VEN = 5 V, VSYNC = 0 V, VPWM = 0 V, CVCC = 10 μF, RRT = OPEN, RISET = OPEN Standby Current IST - 0 20 μA VEN = Low VREG50 4.5 5.0 5.5 V IREG50 = 5 mA load, CREG50 = 2.2 μF OUTL Pin High Side ON Resistor RONLH 3.7 7.5 15.0 Ω IOUTL = 10 mA load OUTL Pin Low Side ON Resistor RONLL 1.2 2.5 5.0 Ω IOUTL = 10 mA input LED Control Voltage 1 VLEDCTL1 0.4 0.5 0.6 V RISET = 50 kΩ LED Control Voltage 2 VLEDCTL2 0.68 0.83 0.98 V RISET = 18 kΩ COMP Sink Current ICOMPSINK 170 250 330 μA RISET = 18 kΩ, VCOMP = 1.0 V, VLEDn = 1.5 V (n = 1 to 6) COMP Source Current ICOMPSOURCE -330 -250 -170 μA RISET = 18 kΩ, VCOMP = 1.0 V, VLEDn = 0.0 V (n = 1 to 6) Oscillation Frequency 1 fOSC1 270 300 330 kHz RRT = 33.3 kΩ Oscillation Frequency 2 fOSC2 1980 2200 2420 kHz RRT = 4.0 kΩ DUTY_MAX 96.5 98.0 - % RRT = 33.3 kΩ tSWOFF - 67 130 ns RRT = 33.3 kΩ Charge Pump Frequency fCP 250.0 312.5 375.0 kHz CCP2 = 2.2 μF Charge Pump Output Voltage VCP 4.5 5.0 5.5 V Operating VCC Voltage(Note 1) [REGURATOR] Reference Voltage [DC/DC Converter] Max Duty(Note 2)(Note 3) Switching OFF Time(Note 3) [Charge Pump] CCP1 = 10 μF, CCP2 = 2.2 μF, VREG50 = 3.0 V (Note 1) The minimum value of 3.0 V for VCC is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set varies depending on the connected LED load and external components. (Note 2) For the switching Duty required for applications, refer to the 2.13 Switching Duty Required for Applications. (Note 3) Max Duty can be calculated using (1-tSWOFF) x fOSC. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Standard Value Parameter Symbol Min Typ Max Unit Conditions [PROTECT] UVLO Release Voltage (VCC) VUVLOVCC1 3.00 3.20 3.40 V VCC: Sweep up UVLO Detect Voltage (VCC) VUVLOVCC2 2.65 2.80 2.95 V VCC: Sweep down UVLO Release Voltage (REG50) VUVLOREG1 2.90 3.10 3.30 V VREG50: Sweep up UVLO Detect Voltage (REG50) VUVLOREG2 2.55 2.70 2.85 V VREG50: Sweep down OCP Detect Voltage VOCPL 0.27 0.30 0.33 V VCSL: Sweep up Input OCP Detect Voltage VOCPH 0.17 0.20 0.23 V VCC-VCSH: Sweep down LDSW Operation Voltage at Input OCP Release VLDSW 4.4 5.4 6.4 V VCSH = VCC VCC-VLDSW OVP Detect Voltage 1 VOVP1 0.95 1.00 1.05 V VOVP = Sweep up VOVP1HYS 0.03 0.05 0.07 V VOVP = Sweep down VOVP2 45 47 49 V VVDISC = Sweep up VOPEN 0.2 0.3 0.4 V VLEDn = Sweep down (n = 1 to 6), VOVP > 2.0 V LED Anode SCP Detect Voltage VSCP1 0.2 0.3 0.4 V VOVP = Sweep down LED Cathode SCP Detect Voltage VSCP2 0.2 0.3 0.4 V VLEDn = Sweep down (n = 1 to 6) tSCP1 10.5 13.1 15.7 ms tSCP2 10.5 13.1 15.7 ms VSHORT1 4.2 4.5 4.8 V VSHORT2 9 10 11 V tSHORT 10.5 13.1 15.7 ms FAIL1 Pin ON Resistor RFAIL1 - - 2.0 kΩ FAIL2 Pin ON Resistor RFAIL2 - - 2.0 kΩ OVP Detect Voltage 1 Hysteresis Width OVP Detect Voltage 2 (VDISC Pin) LED Open Voltage Protection Detect LED Anode SCP Detect Delay Time LED Cathode SCP Detect Delay Time LED Short Voltage 1 Protection Detect LED Short Voltage 2 Protection Detect LED Short Delay Time Protection Detect www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/45 SHT = GND, VLEDn = Sweep up (n = 1 to 6) SHT = 1 V, VLEDn = Sweep up (n = 1 to 6) PWM = 100 % DIMSEL = GND TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Standard Value Parameter Symbol Min Typ Max Unit Conditions [Current Driver] LED Current Absolute Variation 1 RISET = 31.2 kΩ, PWM = 100 %(Note 2) RISET = 31.2 kΩ, PWM = 100 %(Note 2) ILEDn(Note 3) 76.0 80.0 84.0 mA ILEDREL 0 - 3.0 % RISETLIM - 1.0 - kΩ DIMSEL = GND tPWMMIN 0.5 - - μs fPWM = 100 Hz to 25 kHz, ILEDn = 50 mA to 150 mA (n = 1 to 6) fPWM 0.1 - 25.0 kHz tPD - 10 - μs tPWML 10.5 13.1 15.7 ms No Additional Pulse Setting Voltage VPLSET0 GND Additional 2 Pulse Setting Voltage VPLSET2 Additional 4 Pulse Setting Voltage VPLSET4 Additional 8 Pulse Setting Voltage VPLSET8 VREG50 x 0.15 VREG50 x 0.35 VREG50 x 0.55 VREG50 x 0.75 Additional 12 Pulse Setting Voltage VPLSET12 VREG50 x 0.25 VREG50 x 0.45 VREG50 x 0.65 VREG50 x 0.85 VREG50 x 0.10 VREG50 x 0.30 VREG50 x 0.50 VREG50 x 0.70 VREG50 x 0.90 VREG50 V IPLSET -1 0 +1 µA VDIMSEL1 GND VREG50 x 0.25 VREG50 x 0.65 VREG50 x 0.85 VREG50 x 0.10 VREG50 x 0.30 VREG50 x 0.70 VREG50 x 0.90 VREG50 x 0.15 VREG50 x 0.35 VREG50 x 0.75 VREG50 V -1 0 +1 µA LED Current Relative Variation 1(Note 1) ISET-GND Short Protection Resistor PWM Dimming Minimum Pulse Width PWM Dimming Frequency Phase Delay Time PWM Low Section Detect Time VPD = 5 V [PLSET Pin] PLSET Pin Inrush Current V V V V [DIMSEL Pin] Setting Voltage for PWM Dimming only PWM-DC Switching 12.5 % Setting Voltage PWM-DC Switching 25 % Setting Voltage PWM-DC Switching 50 % Setting Voltage DIMSEL Pin Inrush Current VDIMSEL2 VDIMSEL3 VDIMSEL4 IDIMSEL V V V (Note 1) ILEDREL = (Maximum value of ILED1 to ILED6 - Minimum value of ILED1 to ILED6) / (Maximum value of ILED1 to ILED6 + Minimum value of ILED1 to ILED6) x 100 (Note 2) When PWM Duty is lower than 100 %, it is larger than the variation described. (Note 3) n = 1 to 6 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Standard Value Parameter Symbol Min Typ Max Unit Conditions [EN Pin] Input High Voltage (EN) VINH1 2.3 - - V Input Low Voltage (EN) VINL1 - - 0.5 V Input Resistor (EN) RIN1 50 100 150 kΩ Input High Voltage (PWM, SYNC) VINH2 2.3 - - V Input Low Voltage (PWM, SYNC) VINL2 - - 0.5 V Input Resistor (PWM, SYNC) RIN2 50 100 150 kΩ VEN = 5 V [PWM, SYNC Pin] www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/45 VPWM = 5 V, VSYNC = 5 V TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Typical Performance Curves (Reference data, unless otherwise specified VCC = 12 V) 20 5.5 5.4 Circuit Current : ICC [mA] 16 Reference Voltage : VREG50 [V] Ta = -40 ˚C Ta = +25 ˚C Ta = +125 ˚C 12 8 4 5.3 5.2 5.1 5.0 4.9 4.8 4.7 4.6 0 4.5 3 12 21 30 39 Power Supply Voltage : VCC [V] 48 Figure 2. Circuit Current vs Power Supply Voltage 0 20 40 60 80 Temperature : Ta [°C] 100 120 2.42 Oscillation Frequency 2 : fOSC2 [MHz] Oscillation Frequency 1 : fOSC1 [kHz] -20 Figure 3. Reference Voltage vs Temperature 330 320 310 300 290 280 270 -40 -40 -20 0 20 40 60 80 Temperature : Ta [°C] 2.34 2.30 2.26 2.22 2.18 2.14 2.10 2.06 2.02 1.98 100 120 -40 -20 0 20 40 60 80 100 120 Temperature : Ta [°C] Figure 4. Oscillation Frequency 1 vs Temperature (RRT = 33.3 kΩ) www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2.38 Figure 5. Oscillation Frequency 2 vs Temperature (RRT = 4.0 kΩ) 17/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Typical Performance Curves – continued 90 82.4 80 82.0 81.6 70 LED Current : ILEDn [mA] LED Current : ILEDn [mA] (Reference data, unless otherwise specified VCC = 12 V) 60 50 40 30 20 80.8 80.4 80.0 79.6 79.2 78.8 78.4 10 0 81.2 78.0 0.0 0.2 0.4 0.6 0.8 1.0 LED Voltage : VLEDn [V] 1.2 77.6 1.4 100 100 95 95 90 90 85 80 100 120 85 80 75 75 70 0 20 40 60 80 Temperature : Ta [°C] Figure 7. LED Current vs Temperature (RISET = 31.2 kΩ, n = 1 to 6) Efficiency 2 [%] Efficiency 1 [%] Figure 6. LED Current vs LED Voltage (Ta = 25 °C, RISET = 31.2 kΩ, n = 1 to 6) -40 -20 50 60 70 80 90 100 110 LED Current : ILEDn [mA/ch] 70 120 Figure 8. Efficiency 1 vs LED Current (Ta = 25 °C, RRT = 33.3 kΩ, n = 1 to 6, Number of LED Series = 12, Number of LED Parallel = 6) www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 50 60 70 80 90 100 110 LED Current : ILEDn [mA/ch] 120 Figure 9. Efficiency 2 vs LED Current (Ta = 25 °C, RRT = 4.0 kΩ, n = 1 to 6, Number of LED Series = 12, Number of LED Parallel = 6) 18/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Functional Descriptions 1 Current Driver This model has a built-in 6ch current driver. The LED current setting range per channel is 50 mA to 138 mA, and the LED current can be adjusted by the resistance value between the ISET pin and GND. 1.1 How to Set LED Current 1.3 Phase Delay Function 1.2 Dimming Control of LED Current 1.4 LED Pin Handling of Unused Channels 1.2.1 When Using only PWM Dimming 1.5 PWM Low Section Detect Function 1.2.2 When Switching Between PWM Dimming and 1.6 When Setting the LED Current Above 150 mA DC Dimming Automatically 1.1 How to Set LED Current The LED current ILED can be calculated using the following equation. 𝐼𝐿𝐸𝐷 = 2.5 × 106 /𝑅𝐼𝑆𝐸𝑇 [mA] RISET represents the resistance value that is connected between the ISET pin and the GND pin. A resistor of 18 kΩ to 50 kΩ is recommended for RISET. When RISET ≤ 1.0 kΩ, ISET pin short protection is activated and the output of the LED current is stopped. ILED vs RISET Resistance Setting Example LED Current RISET Value [kΩ] [mA] 50.0 50 150 140 130 80 120 25.0 100 110 20.8 120 18.0 138 ILED [mA] 31.2 100 90 80 70 60 50 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 RISET [kΩ] Figure 10. ILED vs RISET www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 1 Current Driver – continued 1.2 Dimming Control of LED Current The LED current can be controlled by On Duty of the pulse signal (input PWM signal) input to the PWM pin from the outside of the IC. Changing the input PWM frequency is prohibited because it may cause operation failure. When using Phase Delay function (PD = High) alternatively, when using DC dimming, the input PWM signal is sampled synchronously with the IC Internal CLK = 20 MHz (Typ). Sampling of Input PWM Signal (Synchronization with IC Internal CLK) or Not Do Not Use Phase Delay Use Phase Delay Function Function. Synchronized with IC Internal Without Synchronization Use only PWM Dimming CLK Use PWM Dimming and DC Synchronized with IC Internal Synchronized with IC Internal Dimming CLK CLK To prevent flickering due to sampling, if the input PWM pulse width changes within ±2 CLK of the IC Internal CLK, the change will not be reflected. In the example shown below, even if the input PWM width changes within the range of A, since the sampled input PWM signal changes within ±2 CLK, the change is not reflected. A Input PWM from External IC 50 ns (Typ) IC Internal CLK PWM Signal after Sampling +2 CLK -2 CLK Figure 11. Section That Does Not Accept Changes in Input PWM Width Also, if PWM = High is detected for twice the PWM period, the IC recognizes that PWM = 100 % is input, and the LED current is always ON. The current dimming control can be selected from the following two methods. 1.2.1 When Using only PWM Dimming When using only PWM dimming, short the DIMSEL pin with GND pin. The LED current can be controlled according to On Duty of the input PWM signal. However, in the area where the LED current ON time is less than 0.5 μs or OFF time is less than 0.5 μs, the pulse time is shorter than the PWM dimming minimum pulse width, so it cannot be used regularly. It is okay to use this area transiently, so it is also possible to set PWM Duty = 0 % and 100 %. The step width of the input PWM Duty should be 0.25 μs or more. If the step width of the input PWM Duty is less than 0.25 μs, the LEDs may flicker. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 1.2 Dimming Control of LED Current – continued 1.2.2 When Switching Between PWM Dimming and DC Dimming Automatically Dimming control can be performed by automatically switching between PWM dimming and DC dimming. The point for switching between PWM dimming and DC dimming is selected from three types: 50 %, 25 %, or 12.5 %. The point at which PWM dimming and DC dimming are switched can be set using DIMSEL pin voltages as shown in the table below. If the switching point for PWM-DC dimming is 12.5 %, Duty of the output LED current is 8 times the input PWM Duty, 4 times for 25 %, and 2 times for 50 %. When the LED current ON time is less than 0.5 μs or the OFF time is less than 0.5 μs, the pulse time is shorter than the PWM dimming minimum pulse width, and therefore it cannot be used regularly. For example, if the switching point for PWM-DC dimming is 12.5 % and the PWM frequency is 200 Hz, the operation may become unstable if a PWM Duty within 625 μs ±0.5 μs (the range where the ON time of the LED current is less than 0.5 μs) is constantly input. There is no problem with using this area transiently. PWM-DC Dimming Switching Point Setting Resistance Example PWM-DC Dimming RDIMSEL1 RDIMSEL2 Switching Point DIMSEL-GND Shorting PWM Dimming only 39 kΩ 91 kΩ 12.5 % 91 kΩ 39 kΩ 25 % DIMSEL-REG50 Shorting LED Current （When "No DC dimming" is set to 1） 1 IC REG50 RDIMSEL2 RDIMSEL1 DIMSEL Dimming Control Current Driver PWM 50 % Figure 12. How to Set PWM-DC Dimming Switching Point LED Current （When "No DC dimming" is set to 1） 1 LED Current （When "No DC dimming" is set to 1） 1 PWM Dimming PWM Dimming LED1 ~ LED6 PWM Dimming 0.5 0.25 DC Dimming 0 50 100 Input PWM Duty [%] Switch at 50 % 0 DC Dimming 50 DC Dimming 0.125 100 Input PWM Switch at 25 % 0 50 Duty [%] 100 Input PWM Duty [%] Switch at 12.5 % Figure 13. PWM-DC Dimming Switching Points 50 %, 25 %, and 12.5 % www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 1 Current Driver – continued 1.3 Phase Delay Function This model has a built-in Phase Delay function that can shift the phase of the timing when LED1 to LED6 current during PWM dimming. The timing chart for Phase Delay is shown below. (∆t = 10 μs) When using Phase Delay function, short the PD pin to the REG50 pin. When not using Phase Delay function, connect the PD pin to the GND pin. Phase Delay function is available when the PWM frequency is 10 kHz or less. PWM t1 LED1 Current t1 Δt LED2 Current t1 Δt LED3 Current t1 Δt LED4 Current t1 Δt LED5 Current t1 Δt LED6 Current t1 DC/DC Switching Figure 14. Phase Delay Operation t1 PWM t1 LED1 Current Δt LED2 Current t1 Δt t1 LED3 Current Δt LED4 Current t1 Δt LED5 Current t1 Δt LED6 Current t1 DC/DC Switching Figure 15. Phase Delay Operation for PWM Min Duty PWM t1 LED1 Current t1 Δt LED2 Current t1 Δt LED3 Current t1 Δt LED4 Current Δt t1 LED5 Current t1 Δt LED6 Current t1 DC/DC Switching Figure 16. Phase Delay Operation for PWM Max Duty www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 1 Current Driver – continued 1.4 LED Pin Handling of Unused Channels This model has six built-in constant current circuits. By setting the PWM pin to High, current can be supplied to the LED pin and LED current can be set by inserting a resistor between the ISET pin and the GND pin. The LED current setting that can be supplied per row is 50 mA to 150 mA. For unused channels, pull up the LED pin (LED1 to LED6) to REG50 with 100 kΩ and pull down to GND with 20 kΩ. To select unused channels definitely, the capacitance value to be connected to the LED pin should be 470 pF or less. REG50 100 kΩ LED6 LED5 20 kΩ LED4 LED3 LED2 LED1 Figure 17. To Set LED6 to Unused 1.5 PWM Low Section Detect Function The Low section of PWM input is counted in VEN = High status. When PWM Low section reaches 13.1 ms, operation is regarded as OFF state, and DC/DC output voltage is discharged from the VDISC pin. When the PWM input is turned High, switching operation is restarted. 1.6 When Setting the LED Current Above 150 mA LED1 to LED6 pins can be used in bundles. For example, as shown in the figure on the right, if LED1, LED2, LED3, LED4, LED5, and LED6 are shorted, 6 times the current set by the ISET pin can be passed. To short each LED pin, short the PD pin to the GND pin. Please do not use a function for a Phase Delay. (For Phase Delay function, refer to "1.3 Phase Delay Function".) LED6 LED5 LED4 LED3 LED2 LED1 Figure 18. Application Example When the LED Pin Is Shorted www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Functional Descriptions – continued 2 DC/DC Converters Detects the lowest voltage among LED1 to LED6 pin voltages (LED cathode voltages) in Minimum Channel Selector block and inputs it to Error AMP. The reference voltage of Error AMP is generated in REF Voltage block based on RISET resistance value, which becomes LED pin control voltage. The output of Error AMP is compared with the output of SLOPE block by PWM COMP block. A switching signal is output to the OUTL pin through DC/DC Control LOGIC. 2.1 LED Pin Control Voltage VLEDCTL 2.2 VCC Input Voltage and Series Number of LED Elements 2.3 LED Variation and Series Number 2.4 Overvoltage Protection Function OVP 2.5 DC/DC Converter Oscillation Frequency fOSC 2.6 Setting the low side current detection resistor (RCSL) 2.7 Setting the Coil Constant 2.8 Setting the high side current detection resistor (RCSH) 2.9 Additional Pulse Function 2.10 External Synchronization / Spread Spectrum Function (SSCG) 2.11 LSDET Function 2.12 VOUT Discharge Function 2.13 Switching Duty Rquired for Applications 2.14 Fluctuation of LED urrent due to ripple voltage during PWM dimming 2.1 LED Pin Control Voltage VLEDCTL The relation between LED pin control voltage (VLEDCTL) and RISET resistance is shown in the table below. Relation Between LED Pin Control Voltage (VLEDCTL) and RISET RISET [kΩ] LED Pin Control Voltage VLEDCTL [V] 50.0 0.50 31.2 0.50 25.0 0.60 20.8 0.72 18.0 0.83 VLEDCTL [V] 0.83 0.50 18.0 (138 mA/ch) 31.2 (80 mA/ch) 50.0 (50 mA/ch) RISET [kΩ] (LED current setting value) Figure 19. Relation Between LED Pin Control Voltage (VLEDCTL) and RISET 2.2 VCC Input Voltage and Series Number of LED Elements To drive the boost DC/DC converter, the LED elements must be selected so that the output voltage (VOUT) is higher than the input voltage (VCC). 𝑉𝐶𝐶(𝑀𝐴𝑋) < 𝑉𝑂𝑈𝑇(𝑀𝐼𝑁) 𝑉𝐶𝐶(𝑀𝐴𝑋) < 𝑁 × 𝑉𝑓(𝑀𝐼𝑁) + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿 (𝑀𝐼𝑁) 𝑉𝐶𝐶 : Input voltage 𝑉𝑂𝑈𝑇: DC/DC converter output voltage 𝑁 : Number of LED series 𝑉𝑓 : LED Vf voltage 𝑉𝐿𝐸𝐷𝐶𝑇𝐿 : LED control voltage Select the number of LED series and Vf characteristics that satisfy the above equation. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC Converters – continued 2.3 LED Variation and Series Number When operating multiple LED outputs, the LED anode voltages in each channel are commonly connected to DC/DC converter output VOUT. LED pin voltage (LED cathode voltage) in the channels where the Vf voltage of the LED is highest is lowest, and this is controlled to be VLEDCTL. Therefore, other LED pin outputs have higher voltages by Vf variation. Select the number of LED series and Vf characteristics so that the LED short protection does not malfunction. 𝑁 × (𝑉𝑓(𝑀𝐴𝑋) − 𝑉𝑓(𝑀𝐼𝑁) ) < 𝑉𝑆𝐻𝑂𝑅𝑇(𝑀𝐼𝑁) − 𝑉𝐿𝐸𝐷𝐶𝑇𝐿 (𝑀𝐴𝑋) 𝑉𝑆𝐻𝑂𝑅𝑇 : LED short protection voltage LED short detection voltage can be set as shown in the table below depending on the voltage applied to the SHT pin. Relationship between SHT pin voltage and LED short protection voltage SHT pin voltage [V] LED short protection voltage [V] 0 4.5 0.5 5.0 1.0 10 1.2 12 For example, a voltage can be applied to the SHT pin by dividing the resistance from the REG50 pin. When the SHT pin is connected to GND, the LED short detection threshold becomes 4.5 V. Please refer to 18.8 SHORT Det (LED Short Detection) for details. 2.4 Overvoltage Protection Function OVP Inputs the resistor division of the output voltage VOUT in the OVP pin. When OVP pin voltage rises to 1.0 V or more, overvoltage protection is activated. Switching of DC/DC converter is turned OFF. After that, OVP is released when the OVP pin voltage drops to 0.95 V. The setting range of ROVP1 is 10 kΩ to 20 kΩ, and it is recommended to set the OVP pin voltage within the range of 0.6 V to 0.8 V. Also, the VOUT voltage during OVP detection should not exceed 45 V, which is the minimum value of overvoltage protection detect voltage 2 (VDISC pin). VOUT ROVP2 OVP + 　 - ROVP1 1.00 V/0.95 V Figure 20. OVP Peripheral Circuit Diagram OVP Pin Voltage Setting Sample 𝑉𝑂𝑈𝑇𝑂𝑉𝑃 = {(𝑅𝑂𝑉𝑃1 + 𝑅𝑂𝑉𝑃2 ) ∕ 𝑅𝑂𝑉𝑃1 } × 1.05 < 45 𝑉𝑂𝑈𝑇𝑂𝑉𝑃 [V] : DC/DC converter output voltage (VOUT) during overvoltage protection operation www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC Converters – continued 2.5 DC/DC Converter Oscillation Frequency fOSC The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a RRT between the RT pin and the GND. The oscillation frequency of DC/DC converter is generated by the OSC-block. Set the resistor of RRT referring to the data and theoretical formula below. 𝑓𝑂𝑆𝐶 = (107 ∕ 𝑅𝑅𝑇 ) × 𝛼 𝑓𝑂𝑆𝐶 107 𝑅𝑅𝑇 𝛼 [kHz] : Oscillation frequency of DC/DC converters : Constants determined internally by the circuit : RT pin connecting resistor : Correction factor For the relation between fOSC and RRT, refer to fOSC vs RRT below. Note that operation cannot be guaranteed if fOSC setting value exceeds the recommended range of 200 kHz to 2420 kHz. Example Resistance Value for fOSC Setting fOSC vs RRT RRT [kΩ] α 45.0 1.004 33.3 1.000 1800 20.0 0.985 1600 10.0 0.958 4.0 0.888 2400 2200 fOSC [kHz] 2000 1400 1200 1000 800 600 400 200 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 RRT [kΩ] Figure 21. fOSC vs RRT www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC Converters – continued 2.6 Setting the low side current detection resistor (RCSL) The low side current detection resistor (RCSL) allows to set the overcurrent protection detection current. Set to satisfy the following formula. 𝐼𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) = 𝑉𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) ⁄ 𝑅𝐶𝑆𝐿 > 𝐼𝐿(𝑀𝐴𝑋) 𝐼𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) 𝑉𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) 𝑅𝐶𝑆𝐿 𝐼𝐿(𝑀𝐴𝑋) : Overcurrent protection detection current minimum value : Overcurrent protection detection voltage minimum value (0.27 V) : CSL pin connection resistance : Coil peak current maxmum value 2.7 Setting the Coil Constant To ensure stable operation of DC/DC converters, the following conditions are recommended for the coil inductance value. 𝑅𝑅𝑇 × 𝑅𝐶𝑆𝐿 × (𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) − 𝑉𝐶𝐶(𝑀𝐼𝑁) ) ⁄ 𝐿 ≤ 5.16 × 109 𝑅𝑅𝑇 𝑅𝐶𝑆𝐿 𝑉𝑂𝑈𝑇 𝑉𝐶𝐶 𝐿 : RT pin connecting resistor : CSL pin connecting resistor : DC/DC converter output voltage : Input voltage : Inductance value Lowering the value on the left side increases stability, but decreases responsiveness. Take the dispersion of inductance value into consideration and set it with sufficient margin. 2.8 Setting the high side current detection resistor (RCSH) The high side current detection resistor (RCSH) allows to set the input overcurrent protection detection current. Set to satisfy the following formula. 𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) = 𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) ⁄ 𝑅𝐶𝑆𝐻 > 𝐼𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) = 𝑉𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) ⁄ 𝑅𝐶𝑆𝐿 𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Input overcurrent protection detection current minimum value 𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Input overcurrent protection detection voltage minimum value (0.17 V) 𝑅𝐶𝑆𝐻 : CSH pin connection resistance 𝐼𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) : Overcurrent protection detection current maxmum value 𝑉𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) : Overcurrent protection detection voltage maxmum value (0.33 V) 𝑅𝐶𝑆𝐿 : CSL pin connection resistance www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC Converters – continued 2.9 Additional Pulse Function A pulse addition function is provided to output a stable DC/DC converter output voltage and LED current even when PWM Duty is low. The output voltage can be held by outputting additional switching of several pulses after the falling edge of the PWM input signal, and the LED can be turned on normally. PWM Additional Pulse OUTL VOUT VOUT Hold ILED Stable LED Current Figure 22. Pulse Addition Function The number of switching pulses to be added is set by the resistance value connected to the PLSET pin. As shown in the figure below, it can connect RPLSET1, RPLSET2 and set the number of switching pulses to be added by the resistance ratio. Examples of resistance values are shown in the table below. Example of Resistance Value When Setting Additional Pulse Number RPLSET1 RPLSET2 PLSET-GND Shorting Number of Additional Pulses 0 Pulse 39 kΩ 91 kΩ 2 Pulses 100 kΩ 100 kΩ 4 Pulses 91 kΩ 39 kΩ 8 Pulses PLSET-REG50 Shorting REG50 RPLSET2 RPLSET1 PLSET DC/DC Control LOGIC Additional Pulse Output OUTL 12 Pulses Figure 23. Additional Pulse Number Setting Method The setting of the number of switching pulses to be added is performed immediately after the EN pin voltage is turned on and prior to starting. It is not possible to change the setting of the number of switching pulses to be added after startup. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC Converters – continued 2.10 External Synchronization / Spread Spectrum Function (SSCG) Three switching modes can be selected according to the voltage input to the SYNC pin. The input to the SYNC pin must precede the input to the EN pin. Mode VSYNC DC/DC Switching Frequency 1 GND or OPEN Fixed Frequency Mode Determined by RRT 2 VREG50 Spread Spectrum Mode of the Frequency Determined by RRT 3 Pulse Input Mode to Synchronize with the Frequency Input to the SYNC Pin Mode 1: When the SYNC pin is GND or OPEN, the DC/DC converter switches at a fixed frequency determined by the RRT. Mode 2: By shorting the SYNC pin and the REG50 pin, operation in spread spectrum mode (SSCG) is enabled. Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the frequency due to SSCG is -8 % of the set oscillation frequency from the set oscillation frequency. The oscillation frequency fluctuation cycle (tSSCG) is 128 / set oscillation frequency. Note that operating SSCG may change noise levels other than the oscillation frequency. VCC VEN VSYNC VPWM Self Diagnosis PWM = High Detection 1.0 V Pre-boost VOVP VOUTL Δf = -8 % (Typ) fOSC tSSCG = 128/fOSC (Typ) Figure 24. Spread Spectrum Function Timing Chart 𝛥𝑓 : Fluctuation range of the oscillation frequency by SSCG 𝑓𝑂𝑆𝐶 : DC/DC oscillation frequency 𝑡𝑆𝑆𝐶𝐺 : Modulating period of the oscillation frequency by SSCG 𝛥𝑓 = 𝑓𝑂𝑆𝐶 × 0.08 𝑡𝑆𝑆𝐶𝐺 = 128 𝑓𝑂𝑆𝐶 The amount of noise reduction during SSCG S [dB] can be roughly estimated by the following equation. 𝑆𝑆𝐶𝐺 𝑓 /128 𝑆 = −10 × 𝑙𝑜𝑔 𝑓 𝑂𝑆𝐶×0.08 𝑂𝑆𝐶 𝑆 = 10 [dB] Noise Level 1 𝑆 = −10 × 𝑙𝑜𝑔 𝛥𝑓×𝑡 [dB] ｆ ＝ fOSC × 0.08 S[dB] [dB] When not using SSCG function, short the SYNC pin and the GND pin. SSCG function cannot be turned ON/OFF during operation. fOSC × 0.92 fOSC Frequency Band Figure 25. Spread Spectrum Function www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2.10 External Synchronization / Spread Spectrum Function (SSCG) – continued Mode 3: By inputting an external clock signal to the SYNC pin, the internal oscillation frequency can be externally synchronized. Input the clock signal to SYNC pin before the Self Diagnosis is completed. (For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function") Internal oscillation and external synchronization cannot be switched on the way. Operation may become unstable. When using external synchronization, SSCG cannot be used. 2.11 LSDET Function When the lowest LED pin voltage among the LED pins exceeds 1.5 V (Typ), the DC/DC converter is turned OFF and the COMP voltage is held. DC/DC converter resumes switching when the lowest LED pin VPWM voltage drops VLEDCTL x 1.1 or less. LSDET function is intended to reduce the voltage quickly when the output is over boosted. It also prevents the LEDs from VOUTL flickering by restarting the switching of DC/DC converters just before returning to normal operation. LSDET function is enabled only when Duty of the LED current is ON. The following is an VCOMP example when LED6 becomes open. ① ② ③ ④ The LED6 pin is open and LED6 pin voltage is 0.3 V (Typ) or less. (Ⓐ) DC/DC converter output begins to boost LED6 pin voltage further. In conjunction with this, OVP pin voltage also rises. (Ⓑ) When OVP pin voltage reaches 1.0 V (Ⓒ) due to the boost of DC/DC converter, the LED open protection is activated. When the LED open protection is activated, the LED6 pin that was open is pulled up to REG50 pin voltage V REG50 inside the IC. (Ⓓ) LSDET function operates because LED6 pin voltage, which is the lowest LED pin voltage among the LED pins, exceeds 1.5 V (Typ). (Ⓓ) LSDET function turns OFF DC/DC converters and holds COMP voltage. (Ⓔ) DC/DC converter turns OFF, the output voltage drops, and OVP pin voltage also drops. (Ⓕ) When the lowest LED pin voltage is VLEDCTL x 1.1 (Typ) or less (Ⓖ) the DC/DC converters resume switching. (Ⓗ) LSDET OFF LSDET ON LSDET OFF 1.0 V VOVP VLED1 to VLED5 VLEDCTL VLEDCTL x 1.1 REG50 Pull Up (VREG 50 ) VLED6 VLEDCTL 1.5 V (Typ) 0.3 V (Typ) LED6 Open ILED1 to ILED5 LED6 Open Detection ILED6 Figure 26. LSDET Function When LEDs Are Open 2.12 VOUT Discharge Function The LEDs may flicker if activated with charges remaining on VOUT. Therefore, discharging of VOUT is required at startup. However, discharging of the charge may take a long time only by the discharge path such as the resistor for OVP setting. Therefore, an output voltage discharging circuit (VOUT discharge function) is provided in this model. When DC/DC circuit is OFF (when EN pin voltage falls or PWM Low section is detected), residual charges in the output are discharged. The discharge time tDISC is expressed by the following equation. 𝑡𝐷𝐼𝑆𝐶 = 3 × 𝐶𝑂𝑈𝑇 × 𝑉𝑂𝑈𝑇 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 [s] 30/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 2 DC/DC converters – continued 2.13 Switching Duty Required for Applications As an application of DC/DC converters, the switching duty required for stable operation can be roughly estimated by the following equations. 𝑆𝑊𝐷𝑈𝑇𝑌 = (𝑉𝑂𝑈𝑇 + 𝑉𝑓𝐷1 − 𝑉𝐶𝐶)/(𝑉𝑂𝑈𝑇 + 𝑉𝑓𝐷1 − 𝑉𝐷𝑀2 ) 𝑆𝑊𝐷𝑈𝑇𝑌 𝑉𝑂𝑈𝑇 𝑉𝑓𝐷1 𝑉𝐶𝐶 𝑉𝐷𝑀2 : Required switching Duty : DC/DC converter output voltage : Vf voltage of the boosting diode (D1) : Input voltage : Drain voltage when FET (M2) for boosting is ON The above values are approximate values. The switching Duty actually required depends on the characteristics and operating conditions of the application components. Finally, check the actual operation. 2.14 Fluctuation of LED current due to ripple voltage during PWM dimming During PWM dimming, the LED current does not flow and the LED pin voltage (VLED) becomes high in the PWM = Low section, and the VLED is controlled by the VLEDCTL in the PWM = High section.Depending on the settings of external components such as the LED current setting and the capacity of the output capacitor, the V LED may undershoot at the start of PWM. Due to this undershoot, the LED current may drop momentarily as shown in the figure below. When the LED current setting value of each CH is 65 mA or more, it is recommended that the undershoot amount (ΔVdrop) of V LED at PWM = High is 50 mV or less. However, even if the LED current drops momentarily due to undershoot, the LED may not appear to flicker. Be sure to evaluate on the actual board and check from a visual point of view. PWM VLED undershoot (ΔVdrop) 50 mV LED pin Control voltage (VLEDCTL) ILED VLED and ILED timing chart during PWM dimming www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Functional Descriptions - continued 3 Startup Characteristics and Effective Section of Each Protection Function 3.1 When PWM Duty Is 100 % The timing chart at startup and the effective section of each protection function are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, determines whether or not to use Phase Delay, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: When PWM = High has elapsed 13.1 ms, it recognizes that PWM = 100 % and begins the startup. ④ Pre-boost(Note 1): Outputs switching until the OVP pin voltage reaches 1.0 V and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component conditions. Contact us for details. VCC VEN VREG50 VDIMSEL 3.1 V (Typ) (UVLO Release) 0 V (PWM DImming Only) VPWM Self Diagnosis 13.1 ms (Typ) VOVP VOUTL ・Determination of CH to use ・Setting phase delay ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection PWM Signal Detection 13.1 ms Pre-boost 　 Stable Operation Transition Section Stable State 1.0 V ILED LED Setting Current Output Section VLED LED Control Voltage × 1.1 LED Control Voltage During Self Diagnosis FAIL1, FAIL2 are Low VFAIL1 VFAIL2 DC/DC Converter Operating Section Current Driver Operating Section Under Voltage Lockout (UVLO) Effective when EN = High Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released Overvoltage Protection (OVP) Effective when UVLO is released Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts LED Open Protection / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 3 Startup Characteristics and Effective Section of Each Protection Function – continued 3.2 When Using only PWM Dimming The timing chart at startup and the effective section of each protection function when only PWM dimming is used are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, determines whether or not to use Phase Delay, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: Begins the startup at the first rising edge of PWM. ④ Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component conditions. Contact us for details. VCC VEN VREG50 VDIMSEL 3.1 V (Typ) (UVLO Release) 0 V (PWM Dimming Only) VPWM Self Diagnosis 13.1 ms (Typ) VOVP ・Determination of CH to use ・Setting phase delay ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection PWM Signal Detection Pre-boost 　 Stable Operation Transition Section Stable State 1.0 V VOUTL ILED LED Setting Current Output Section VLED LED Control Voltage × 1.1 During Self Diagnosis FAIL1, FAIL2 are Low LED Control Voltage VFAIL1 VFAIL2 DC/DC Converter Operating Section Current Driver Operating Section Under Voltage Lockout (UVLO) Effective when EN = High Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released Overvoltage Protection (OVP) Effective when UVLO is released Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts LED Open Protection / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 33/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 3 Startup Characteristics and Effective Section of Each Protection Function – continued 3.3 When Switching Between PWM Dimming and DC Dimming The timing chart at startup and the effective section of each protection function when switching between PWM dimming and DC dimming are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, determines whether or not to use Phase Delay, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: Begins the startup at the fourth rising edge of PWM after Self Diagnosis. ④ Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre-boost may not be completed depending on operating conditions and component conditions. Contact us for details. VCC ① VEN VREG50 3.1 V (Typ) (UVLO Release) VDIMSEL REG50*RDIMSEL1/(RDIMSEL1+RDIMSEL2) (PWM+DC Dimming) (1)　　 (2)　　　 (3)　　　 (4) VPWM ② Self Diagnosis 13.1 ms (Typ) VOVP ・Determination of CH to use ・Setting phase delay ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection ③ PWM Signal Detection After Self Diagnosis, pre-boost starts at the fourth rising edge of PWM ④ Pre-boost 　⑤ Stable Operation Transition Section ⑥ Stable State 1.0 V VOUTL ILED LED Setting Current Output Section VLED LED Control Voltage × 1.1 LED Control Voltage During Self Diagnosis FAIL1, FAIL2 are Low VFAIL1 VFAIL2 DC/DC Converter Operating Section Current Driver Operating Section Under Voltage Lockout (UVLO) Effective when EN = High Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released Overvoltage Protection (OVP) Effective when UVLO is released Overvoltage Protection (OVP) FAIL Flag Effective when LSDET is released Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts LED Open Protection / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 34/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M 3 Startup Characteristics and Effective Section of Each Protection Function – continued 3.4 Timing Chart When Stopped (When Pulling Up FAIL1 and FAIL2 to REG50) The figure below shows the timing chart when stopped (EN = Low) when FAIL1 and FAIL2 are pulled up to REG50. VCC VEN VREG50 After EN = Low, VREG 50 gradually decreases The time to decrease is determined by the external capacitance (CREG 50 ) FAIL1 remains High and decreases as REG50 decreases VFAIL1 VFAIL2 FAIL2 is Low while REG50 is decreasing When REG50 deacreases to a voltage at which the internal circuit does not operate, FAIL2 becomes High and decreases as REG50 decreases After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance (CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL1 = High and VFAIL2 = Low are output. VFAIL1 decreases as VREG50 decreases because it is pulled up to VREG50. While the VREG50 is still high enough, VFAIL2 = Low will continue to be output, but when VREG50 decreases to a level where Low of VFAIL2 cannot be output, VFAIL2 = High. After that, VFAIL2 decreases as VREG50 decreases 3.5 Timing Chart When Stopped (When Pulling Up FAIL1 and FAIL2 to an External Power Supply) The figure below shows the timing chart when stopped (EN = Low) when FAIL1 and FAIL2 are pulled up to an external power supply. VCC VEN VREG50 After EN = Low, VREG 50 gradually decreases The time to decrease is determined by the external capacitance (CREG 50 ) FAIL1 remains High VFAIL1 VFAIL2 FAIL2 is Low while REG50 is decreasing When REG50 deacreases to a voltage at which the internal circuit does not operate, FAIL2 becomes High After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance (CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL1 = High and VFAIL2 = Low are output. VFAIL1 holds the High voltage because it is pulled up to an external power supply. While the VREG50 is still high enough, VFAIL2 = Low will continue to be output, but when VREG50 decreases to a level where Low of VFAIL2 cannot be output, VFAIL2 = High. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M PCB Application Circuit Diagram VCC RCSH CVCC2 REN2 REN1 PWM 5 PWM 6 VCC 22 SHT 21 PD 20 PLSET PGND 19 7 COMP OUTL 18 8 GND CSL 17 9 10 11 12 LED5 EXP-PAD LED6 CPC1 EXP-PAD LED3 RPC 23 FAIL2 LED2 CPC2 24 OVP LED1 RPLSET1 VDISC ISET PLSET EXP-PAD 13 14 15 16 FAIL2 SHT VREG RFAIL2 COVP JP_SHT ROVP1 ROVP2 VOUT D1 VREG JP_PD1 L2 JP_PD2 RG M2 RSNB2 CSNB2 + COUT5 SYNC 25 COUT3 4 26 COUT4 SYNC 27 COUT2 RT 28 COUT1 3 29 FAIL1 REG50 30 LDSW REG25 2 31 DIMSEL RPLSET2 1 RRT CREG50 CPM 32 REG25 FAIL1 CCP2 EXP-PAD CREG25 CIN2 RFAIL1 CP CCP1 REG50 CIN1 VREG CSH B- M1 CVCC3 LED4 CVCC1 CP L1 EN CB1 CB2 CPP B+ RSNB1 RCS CCS RCSL CSNB1 EXP-PAD VOUT RDIMSEL2 DIMSEL RISET CLED1U CLED2U CLED3U CLED4U CLED5U CLED6U LED6 LED5 RDIMSEL1 LED4 LED3 LED2 CLED1D CLED2D CLED3D CLED4D CLED5D CLED6D LED1 Place RRT closest to the RT pin and do not add capacitance. Place RISET closest to the ISET pin and do not add capacitance. Place CVCC3, CREG50, CREG25 decoupling capacitors as close as possible to the IC pin. A large current may flow through PGND, so lower the impedance. Be careful that the ISET pin, the RT pin and the COMP pin do not get noisy. The PWM pin, the OUTL pin, the SYNC pin and the LED1 pin to the LED6 pin are switched. Be careful not to affect the peripheral patterns. The wires from the OUTL pin and the CSL pin to the components should be the shortest and minimum impedance. There is a heat dissipation PAD on the back side of the package. Solder the heat dissipation PAD to the ground of the board. For noise reduction, consider the shortest and minimum impedance board layout for the boost loop (D1 → C OUT → PGND → RCSL → M2 → D1). Inserting RG can reduce ringing, but larger RG may be less efficient. When using it, carefully evaluate it and determine the resistance value. Both ends of RCSH and RCSL should be wired as short as possible. Longer wires may lead to false detection of input overcurrent protection (OCPH) or overcurrent protection (OCPL) due to inductance components. Connect VOUT to the anode of the LED panel as short as possible. Depending on the parasitic inductance component, the LED current may become unstable. The connection from the LED1 pin to the LED6 pin to the cathode of the LED panel should be as short as possible. Depending on the parasitic inductance component, the LED current may become unstable. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 36/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M List of External Components Serial No. Component Name Component Value Manufacturer - Product Name - 1 CB1 2 CB2 - - 3 - L1 - - 4 CVCC1 - - 5 CVCC2 - - - 6 CVCC3 0.1 μF GCM155R71H104KE37 murata 7 REN1 - - - 8 REN2 - - - - - 9 RCSH 39 mΩ LTR18 Series Rohm 10 M1 - RD3L140SPFRA Rohm 11 C IN1 10 μF C IN2 - GCM32EC71H106KA03 - murata 12 13 L2 10 μH CLF10060NIT-100M-D TDK 14 M2 - RD3L080SNFRA Rohm 15 RCSL 68 mΩ LTR18 Series Rohm - 16 D1 - RB088LAM-60TF Rohm 17 COUT1 0.01 μF GCM155R71H103KA55 murata 18 COUT2 0.1 μF GCM155R71H104KE02 murata 19 COUT3 - - - 20 COUT4 - - - 21 COUT5 22 µF GYA1H220MCQ1GS nichicon 22 CREG25 0.22 μF GCM155R71C224KE02 murata 23 CREG50 2.2 μF GCM188C71A225KE01 murata 24 RRT 33 kΩ MCR01 Series Rohm 25 RPLSET1 100 kΩ MCR01 Series Rohm 26 RPLSET2 100 kΩ MCR01 Series Rohm 27 RPC 51 Ω MCR01 Series Rohm 28 CPC1 1 μF GCM188R71C105KA49 murata 29 CPC2 - - - 30 RISET 33 kΩ MCR01 Series Rohm 31 RDIMSEL1 SHORT - - 32 RDIMSEL2 OPEN - - 33 CLED1D murata CLED2D 470pF 470pF GCM155R11H471KA01 34 GCM155R11H471KA01 murata 35 CLED3D 470pF GCM155R11H471KA01 murata 36 CLED4D 470pF GCM155R11H471KA01 murata 37 CLED5D 470pF GCM155R11H471KA01 murata 38 CLED6D 470pF GCM155R11H471KA01 murata www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 37/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M List of External Components – continued Serial No. Component Name Component Value Product Name Manufacturer 39 CLED1U - - - 40 CLED2U - - - 41 CLED3U - - - 42 CLED4U - - - 43 CLED5U - - - 44 CLED6U - - - 45 RCS Short - - 46 CCS - - - 47 RG 10 Ω MCR01 Series Rohm 48 JP_PD1 Short - - 49 JP_PD2 - - - 50 JP_SHT Short - - 51 RFAIL2 100 kΩ MCR01 Series Rohm 52 ROVP1 10 kΩ MCR01 Series Rohm 53 ROVP2 360 kΩ MCR01 Series Rohm 54 COVP - - - 55 RFAIL1 100 kΩ MCR01 Series Rohm 56 CCP1 10 μF GCM32EC71H106KA03 murata 57 CCP2 2.2 μF GCM188C71A225KE01 murata 58 RSNB1 - - - 59 CSNB1 - - - 60 RSNB2 - - - 61 CSNB2 - - - Note: The component constants vary depending on the operating conditions and the load used. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 38/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Power Consumption Calculation Example (1) Circuit power 𝑃𝐶 = 𝐼𝐶𝐶 × 𝑉𝐶𝐶 +𝐶𝐼𝑆𝑆1 × 𝑉𝑅𝐸𝐺50 × 𝑓𝑂𝑆𝐶 × 𝑉𝑅𝐸𝐺50 (2) Low side FET drive stage power +{𝑉𝐿𝐸𝐷 × 𝑀 + ∆𝑉𝑓 × (𝑀 − 1)} × 𝐼𝐿𝐸𝐷 (3) Current driver power 𝑃𝐶 : IC power consumption 𝐼𝐶𝐶 : Circuit current 𝑉𝐶𝐶 : Power supply voltage 𝐶𝐼𝑆𝑆1 : Low side FET gate capacitance 𝑉𝑅𝐸𝐺50 : REG50 Voltage 𝑓𝑂𝑆𝐶 : Oscillation Frequency 𝑉𝐿𝐸𝐷 : LED control voltage 𝑀 : Number of LED Parallels ∆𝑉𝑓 : LED Vf variation per row 𝐼𝐿𝐸𝐷 : LED output current Assuming ICC = 10 mA, VCC = 12 V, CISS1 = 2000 pF, VREG50 = 5 V, fOSC = 2200 kHz, VLED = 0.83 V, ILED = 150 mA, M = 6 columns and ΔVf = 0.2 V, 𝑃𝑐 = 10 𝑚𝐴 × 12 𝑉 +2000 𝑝𝐹 × 5 𝑉 × 2200 𝑘𝐻𝑧 × 5 𝑉 +{0.83 𝑉 × 6𝑐ℎ + 0.2 𝑉 × (6𝑐ℎ − 1)} × 150 𝑚𝐴 = 1.127 [W] From thermal resistance θja = 30.7 °C/W, the maximum calorific value ΔtMAX can be estimated by the following equation. 𝛥𝑡𝑀𝐴𝑋 = 𝑃𝑐 × 𝜃𝑗𝑎 = 1.127 𝑊 × 30.7 = 34.6 [°C] When the ambient temperature is 85 °C, the maximum chip temperature t CMAX is: 𝑡𝐶𝑀𝐴𝑋 = 85 ℃ + 34.6 ℃ = 119.6 [°C] Make sure that tCMAX calculated here is less than Tjmax = 150 °C. The above is a simple calculation example only. The value of thermal resistance varies depending on the actual board conditions and layout. Please check it as a guide for thermal design. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 39/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M I/O Equivalence Circuit 1.REG25 3.RT 2.REG50 VCC VCC REG25 REG50 GND REG50 GND 7.COMP 8.GND, 19.PGND 10 kΩ REG50 PGND 10 kΩ PWM 100 kΩ 10 kΩ GND 6.PLSET 10 kΩ SYNC RT GND 5.PWM 4.SYNC 10 kΩ PLSET COMP 100 kΩ GND 400 Ω GND GND GND 9.ISET 11 - 16.LED1 - LED6 10.DIMSEL REG50 REG50 REG50 ISET 10 kΩ REG50 20 kΩ LED1 LED2 LED3 LED4 LED5 LED6 10 kΩ DIMSEL 17.CSL 10 kΩ 12 kΩ 10 kΩ CSL GND GND 2Ω GND 18.OUTL 21.SHT 20.PD GND 22.FAIL2 REG50 REG50 PD OUTL FAIL2 10 kΩ 100 kΩ GND GND GND PGND 24.VDISC 23.OVP 50 kΩ FAIL1 1.2 MΩ 1 MΩ 10 kΩ 26.LDSW VDISC 1 MΩ 10 kΩ OVP 25.FAIL1 VCC REG50 10 kΩ SHT 100 kΩ 1 kΩ 1 kΩ VCC 2 MΩ LDSW GND GND 31.9 kΩ 2 MΩ GND GND 30.CP, 31.CPP 29.EN 27.CSH 32.CPM CP VCC REG25 VCC 1 pF CSH 25 kΩ EN CPP 7 kΩ CPM 100 kΩ GND REG25 GND GND GND Note: All values are Typ values. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 40/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 41/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND N Region close-by GND Figure 27. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 14. Functional Safety “ISO 26262 Process Compliant to Support ASIL-*” A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in the datasheet. “Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)” A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet. “Functional Safety Supportive Automotive Products” A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety. Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 42/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Ordering Information B D 8 2 A 2 6 M U F - Package MUF: VQFN32FBV050 ME2 Product rank M: for Automotive Packaging and forming specifications E2: Embossed tape and reel Marking Diagram VQFN32FBV050 (TOP VIEW) BD82A Part Number Marking 26MUF LOT Number Pin 1 Mark www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 43/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Physical Dimension and Packing Information Package Name www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN32FBV050 44/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 BD82A26MUF-M Revision History Date Revision 15.Mar.2022 003 Changes New Release www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 45/45 TSZ02201-0T2T0B200380-1-2 15.Mar.2022 Rev.003 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001