Datasheet
Synchronous Buck-Boost DC/DC Converter
with 2 A Switches (VIN = 2.0 V to 5.5 V, 1ch)
BD83070GWL
Key Specifications
General Description
The BD83070GWL is a synchronous buck-boost DC/DC
convertor providing 3.3 V or 2.5 V output from single-cell
Li-ion battery or other input between 2.0 V and 5.5 V. It
has the capability to support up to 1 A output over input
voltage range of 2.7 V to 5.5 V. It seamlessly changes
between buck and boost operations depending on the
input voltage.
It is based on pulse width modulation (PWM) and
provides high efficiency for heavy load. While in PWM
operation, internal FETs switch at fixed frequency 1.5
MHz typical. It automatically changes over control
system to hysteresis pulse frequency modulation (PFM)
to suppress switching loss and current consumption
during light load. Battery drain fall down to only 2.8 μA
typical at no load current. It is possible to disable
auto-PFM/PWM mode by the MODE pin for suppressing
output ripple and fixed frequency switching.
The device is packaged in a 1.2 mm x 1.6 mm WLCSP
package.
Package
UCSP50L1C (12Pin)
2.0 V to 5.5 V
2.5 V or 3.3 V
1 A(Max)
1.5 MHz(Typ)
2.8 μA(Typ)
-40 °C to +85 °C
W(Typ) x D(Typ) x H(Max)
1.20 mm × 1.60 mm × 0.57 mm
Applications
Single Cell Li-ion or 3 Cell NiMH Battery-Powered
Portable Products
Tablet Terminal Device
Smartphone
Features
Input Voltage Range:
Output Voltage:
Output Current:
Switching Frequency:
Quiescent VIN Current:
Operating Temperature Range:
Synchronous Buck-Boost DC/DC Converter
Automatic PFM/PWM Transition
Output Current: Up To 1 A (VIN > 2.7 V, VOUT = 3.3 V)
Selectable Output Voltage: 2.5 V or 3.3 V
Efficiency: Up To 95 %
UVLO Detection: 1.61 V(Max)
Built-in Thermal, Over Voltage, And Over Current
Protection
Typical Application Circuit
L1: 1.5 μH
VIN
2.0 V to 5.5 V
LX1
LX2
PVIN
VOUT
C1: 10 μF
FB
VOUT
3.3 V (up to 1 A)
C2: 22 μF
VIN
ON
EN
OFF
VSEL
Forced-PWM
Auto-PFM/PWM
MODE
GND
REF
PGND
C3: 0.47 μF
Figure 1. Typical Application Circuit
〇Product structure : Silicon integrated circuit
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BD83070GWL
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 4
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 5
Electrical Characteristics................................................................................................................................................................. 5
Detailed Descriptions ...................................................................................................................................................................... 7
Typical Performance Curves ........................................................................................................................................................... 8
Application Examples ................................................................................................................................................................... 15
I/O Equivalence Circuits................................................................................................................................................................ 16
Operational Notes ......................................................................................................................................................................... 17
Ordering Information ..................................................................................................................................................................... 19
Marking Diagram .......................................................................................................................................................................... 19
Physical Dimension and Packing Information ............................................................................................................................... 20
Revision History ............................................................................................................................................................................ 21
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Pin Configuration
1
2
3
EN
GND
REF
FB
MODE
VIN
C
VOUT
VSEL
PVIN
D
LX2
PGND
LX1
Top View
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
A1
EN
A2
GND
A3
REF
B1
FB
B2
MODE
B3
VIN
C1
VOUT
C2
VSEL
C3
PVIN
D1
D2
D3
LX2
PGND
LX1
Function
Enable pin of the DC/DC converter. Inputting high (≥ 1.2 V) the EN pin turns on the regulator.
Inputting low (≤ 0.4 V) or open the EN pin turns off the regulator.
Ground for sensing
Linear regulator output for power supply of internal circuits. Connect ceramic capacitor (0.47
μF) between this pin and the GND pin for output stability. Do not connect the other devices.
Voltage feedback pin. Connect this pin to the VOUT pin.
Mode selection pin. Low (≤ 0.4 V): Auto-PFM/PWM mode. High (≥ 1.2 V): Forced-PWM mode.
Do not leave this pin floating.
Power supply input of controller. Connect this pin to the PVIN pin.
Output pin of the DC/DC converter. Connect ceramic capacitor (22 μF recommended) between
this pin and the PGND pin for output stability.
Output voltage selection pin. High (VIN): 3.3 V. Low (GND): 2.5 V. Connect this pin to either the
VIN pin or the GND pin.
Power supply input of the DC/DC converter and LX1 side gate drivers. Connect ceramic
capacitor (≥ 10 μF) between this pin and the PGND pin for power supply noise reduction.
Inductor connection pin. Connect inductor (1.5 μH) between this pin and the LX1 pin.
Ground of power FET, discharge, and gate drivers.
Inductor connection pin. Connect inductor (1.5 μH) between this pin and the LX2 pin.
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Block Diagram
LX1
LX2
D3
D1
PVIN C3
C1 VOUT
Current
Sense Amp.
Gate
Driver
Gate
Driver
PGND
Zero Cross
Comparator
PGND
PGND
Control
Logic
OVP
DCDC_EN
+
VIN B3
H: VREF + 1.5 %
L: VREF + 0.5 %
+
B1 FB
+
+
-
VREF
UVLO
VREF
C2 VSEL
-
UVLO
+
Current Limit
Ramp
Generator
GND
IMIN Clamper
DCDC_EN
EN A1
Thermal
Shutdown
LDO
TSD
A3 REF
REFOK
MODE B2
GND
PGND
A2
D2
GND
PGND
Figure 3. Block Diagram
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Ratings
Unit
VMAXVIN, VMAXPVIN, VMAXVOUT,
VMAXFB, VMAXEN, VMAXMODE
-0.3 to +6.0
V
VMAXLX1, VMAXLX2
-1.0 to +7.0
V
Voltage Range in Pin: REF
VMAXREF
-0.3 to +2.1
V
Voltage Range in Pin: PGND
VMAXPGND
-0.3 to +0.3
V
Tjmax
150
°C
Tstg
-55 to +125
°C
Voltage Range in Pins:
VIN, PVIN, VOUT, FB, EN, MODE
Voltage Range in Pins: LX1, LX2
(Note 1)
Maximum Junction Temperature
Storage Temperature Range
(Note 1) Voltage transients on the LX1 or the LX2 pins beyond the DC limits specified in the absolute maximum ratings are non-disruptive to normal operation
when using good layout practices as described elsewhere in the data sheet and application notes and as seen on the product demo board.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
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(Note 2)
Thermal Resistance
Parameter
Thermal Resistance (Typ)
Symbol
1s
(Note 3)
(Note 3)
2s2p
Unit
UCSP50L1C
θJA
Junction to Ambient
-
186.6
°C/W
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) Using a PCB board based on JESD51-9.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.5 mm x 101.5 mm x 1.6 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.5 mm x 101.5 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
99.5 mm x 99.5 mm
35 μm
99.5 mm x 99.5 mm
70 μm
Recommended Operating Conditions
Parameter
Power Supply Voltage
Operating Temperature
REF Connection Capacitor
(Note 1)
Symbol
Min
Typ
Max
Unit
VIN
2.0
3.6
5.5
V
Topr
-40
+25
+85
°C
CREF
0.22
0.47
1.00
μF
(Note 1) The minimum value capacitance must be met this specification over full operating condition. Ceramic capacitors are recommended for input/output
capacitors.
Electrical Characteristics (Unless otherwise specified VIN=PVIN=EN=VSEL=3.6 V, CREF=0.47 μF, Ta=25 °C)
Parameter
Limit
Symbol
Unit
Conditions
Min
Typ
Max
fSW
1.35
1.50
1.65
MHz
MODE=VIN
DMAX
80
87
95
%
MODE=VIN
RON1H
-
50
-
mΩ
RON1L
-
60
-
mΩ
RON2H
-
55
-
mΩ
VOUT=3.3 V
RON2L
-
65
-
mΩ
VOUT=3.3 V
IOCP
2.0
-
-
A
PVIN=3.6 V
Output Voltage 1
VOUT1
3.267
3.300
3.333
V
Output Voltage 2
VOUT2
2.468
2.500
2.532
V
Load Regulation
VLR
-
0.5
-
mV
DC/DC Converter
Switching Frequency
during PWM
Maximum Duty
LX1 High Side FET
ON Resistance
LX1 Low Side FET
ON Resistance
LX2 High Side FET
ON Resistance
LX2 Low Side FET
ON Resistance
Over Current Protection
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MODE=VIN, VSEL=VIN,
No Load
MODE=VIN, VSEL=0 V,
No Load
MODE=VIN, VSEL=VIN
IOUT=0 mA to 1000 mA
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BD83070GWL
Electrical Characteristics - continued (Unless otherwise specified VIN=PVIN=EN=VSEL=3.6 V, CREF=0.47 μF,
Ta=25 °C)
Parameter
Limit
Symbol
Unit
Min
Typ
Max
Conditions
DC/DC Converter - continued
Detect
VOVPDET
5.3
5.5
5.7
V
VOUT voltage increasing
Release
VOVPRST
5.2
5.4
5.6
V
VOUT voltage decreasing
Startup Delay Time
tST
-
4.9
-
ms
Startup Slew Rate
SRST
2.5
5.0
10.0
mV/μs
Discharge Resistance
RDCG
40
85
200
Ω
EN=0 V
Detect
VSCPDET
1.3
1.4
1.5
V
FB voltage decreasing
Release
VSCPRST
1.51
1.61
1.71
V
FB voltage increasing
Up
VUVLOUP
-
1.740
1.990
V
VIN voltage increasing
Down
VUVLODN
1.51
1.56
1.61
V
VIN voltage decreasing
ON
VENH
1.2
-
5.5
V
OFF
VENL
-0.3
-
+0.4
V
IEN
-
200
500
nA
High
VMODEH
1.2
-
5.5
V
Low
VMODEL
-0.3
-
+0.4
V
High
VVSELH
VIN-0.3
-
VIN+0.3
V
Low
VVSELL
-0.3
-
+0.3
V
VREF
1.45
1.50
1.55
V
IREF=-100 μA
Quiescent VIN Current
IVIN
-
2.8
5.6
μA
MODE=0 V, FB=3.5 V
Quiescent FB Current
IFB
-
0.2
0.4
μA
MODE=0 V, FB=3.5 V
Shutdown VIN Current
ISHD
-
0.1
1.0
μA
EN=0 V
Over Voltage
Threshold
Short Circuit
Threshold
From EN=High to VOUT=100 mV
Main Controller
Under Voltage
Lockout Threshold
EN Pin Control
Voltage
EN Pin Input Current
MODE Pin Control
Voltage
VSEL Pin Control
Voltage
REF Output Voltage
Whole Device
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Detailed Descriptions
1. Startup and Shutdown Control
When the EN pin goes from low (input under 0.4 V or open) to high (input over 1.2 V), the BD83070GWL turns on
internal LDO, REF, and the DC/DC converter. There is typically 4.9 ms delay from the EN high edge to startup of DC/DC
converter (tST). It has a soft-start structure and ramps up the output voltage in 5 mV/μs typically (SRST). On the other
hand, when the EN pin goes from high to low, it disables the internal LDO and DC/DC immediately. While in shutdown, it
turns discharge switch on to pull VOUT to ground through 85 Ω typically. If the EN pin goes again from low to high during
discharge sequence, the output voltage is ramped up from remaining voltage to target voltage in 5 mV/μs(Typ).
EN
tST
tST
VOUT
SRST
Figure 4. Startup Sequence
2. MODE Pin
In the case of the MODE pin is pulled high (over 1.2 V), the BD83070GWL operates in forced PWM mode and uses fixed
frequency 1.5 MHz regardless its loads. If the MODE pin is pulled low (under 0.4 V), it operates in automatic PFM-PWM
mode and automatically changes over form PWM to hysteresis PFM operation depending on its loads. Do not leave this
pin floating because it is neither pulled down nor up, internally.
3. Output Voltage Setting
The BD83070GWL has internal feedback resistors. It is possible to select target output voltage from either 2.5 V or 3.3 V
by the VSEL pin. If the VSEL pin is connected to ground, the nominal output voltage is 2.5 V. On the other hand when
the VSEL is connected to VIN, the nominal output voltage is 3.3 V. It is not recommended to change while in EN is logic
high.
4. Maximum Load Current
The maximum load current varies depending on PVIN voltage and output voltage setting. When using the
recommended application, the maximum load current becomes as follows.
VOUT = 2.5 V Setting
Maximum Load Current [mA]
Maximum Load Current [mA]
VOUT = 3.3 V Setting
1000 mA
600 mA
300 mA
1.8 V
2.3 V
2.7 V
PVIN voltage [V]
5.5 V
1000 mA
800 mA
400 mA
1.8 V
2.3 V
2.7 V
PVIN voltage [V]
5.5 V
Figure 5. Maximum Load Current
5. Current Limit Protection
The BD83070GWL has a current limit protection circuit to prevent excessive electric stress on itself and external
inductor at overload condition.
6. Short Circuit Protection
If FB voltage drops less than 1.4 V(Typ), the current limit value is reduced to about half of the normal that. The current
limit value returns to the normal that when the FB voltage exceeds 1.61 V(Typ).
7. Over Voltage Protection
The BD83070GWL has an over voltage comparator. When the FB pin becomes open, the output voltage rises beyond
target voltage. If the VOUT pin reaches 5.5 V(Typ), it stops switching to prevent over voltage stress on its power FETs. If
the VOUT pin voltage falls lower than 5.4 V(Typ), it restarts switching.
8. Under Voltage Lockout (UVLO)
The BD83070GWL has a UVLO comparator to turn the device off and prevent malfunction when the input voltage is too
low. As same as UVLO, it has a REFOK comparator to monitor REF voltage, internal LDO output, and turns the device
off when the REF voltage is too low.
9. Thermal Shutdown
The BD83070GWL has a Thermal Shutdown Circuit (TSD Circuit). When the temperature of its chip is higher than
175 °C typical, the TSD circuit turns off the DC/DC converter. There is the hysteresis width of 20 °C between the
detection point and release point to prevent malfunctions from temperature fluctuations. Because TSD Circuit is only
designed for protecting the device from thermal over load, it is not recommended to design the application as TSD
working in normal condition.
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100
100
95
90
90
80
85
70
Efficiency [%]
Efficiency [%]
Typical Performance Curves
80
75
VIN=4.2 V
70
65
60
55
50
0.01
VIN=3.8 V
60
50
VIN=3.6 V
VIN=3.6 V
VIN=3.0 V
20
VIN=3.0 V
VIN=2.4 V
10
VIN=2.4 V
0.1
1
10
100
Output Current:IOUT [mA]
0
0.01
1000
VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]
1000
Figure 7. Efficiency vs Output Current
(VSEL=High, MODE=High: Forced-PWM)
100
100
95
90
90
80
85
70
Efficiency [%]
Efficiency [%]
Figure 6. Efficiency vs Output Current
(VSEL=High, MODE=Low: Auto-PFM/PWM)
80
75
65
VIN=3.8 V
30
VIN=1.8 V
VIN=4.2 V
70
VIN=4.2 V
40
VIN=3.8 V
60
50
VIN=4.2 V
40
VIN=3.8 V
VIN=3.6 V
30
VIN=3.6 V
60
VIN=3.0 V
20
VIN=3.0 V
55
VIN=2.4 V
10
VIN=2.4 V
50
0.01
VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]
0
0.01
1000
Figure 8. Efficiency vs Output Current
(VSEL=Low, MODE=Low: Auto-PFM/PWM)
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VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]
1000
Figure 9. Efficiency vs Output Current
(VSEL=Low, MODE=High: Forced-PWM)
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BD83070GWL
2.60
3.40
2.55
3.35
2.50
3.30
Output Voltage 1:VOUT1 [V]
Output Voltage 2:VOUT2 [V]
Typical Performance Curves - continued
2.45
2.40
2.35
2.30
2.25
VIN=4.2 V
2.20
VIN=3.6 V
VIN=2.4 V
2.15
3.10
3.05
VIN=4.2 V
3.00
VIN=3.6 V
0
2000
2.55
3.35
2.50
3.30
Output Voltage 1:VOUT1 [V]
3.40
2.45
2.40
2.35
2.30
VIN=4.2 V
2.20
VIN=3.6 V
VIN=2.4 V
2.15
500
1000
1500
Output Current:IOUT [mA]
2000
Figure 11. Output Voltage 1 vs Output Current
(“Load Regulation”, VSEL=High, MODE=High: Forced-PWM)
2.60
2.25
VIN=2.4 V
2.90
Figure 10. Output Voltage 2 vs Output Current
(“Load Regulation”, VSEL=Low, MODE=High: Forced-PWM)
Output Voltage 2:VOUT2 [V]
3.15
VIN=1.8 V
VIN=1.8 V
500
1000
1500
Output Current:IOUT [mA]
3.20
2.95
2.10
0
3.25
3.25
3.20
3.15
3.10
3.05
VIN=4.2 V
3.00
VIN=3.6 V
VIN=2.4 V
2.95
VIN=1.8 V
VIN=1.8 V
2.10
2.90
0
500
1000
1500
Output Current:IOUT [mA]
2000
0
Figure 12. Output Voltage 2 vs Output Current
(“Load Regulation”, VSEL=Low, MODE=Low:
Auto-PFM/PWM)
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500
1000
1500
Output Current:IOUT [mA]
2000
Figure 13. Output Voltage 1 vs Output Current
(“Load Regulation”, VSEL=High, MODE=Low:
Auto-PFM/PWM)
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Typical Performance Curves - continued
2000
Maximum Output Current:IMAX [mA]
4.0
Output Voltage 1:VOUT1 [V]
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1800
1600
1400
1200
1000
800
600
400
0.0
0
0
1
2
3
4
5
Power Supply Voltage:VIN [V]
6
Figure 14. Output Voltage 1 vs Power Supply Voltage
(“Line Regulation”, EN=VSEL=High, MODE=Low:
Auto-PFM/PWM, 3.3 kΩ resistive load)
1.5
2.0
2.5
3.0
Power Supply Voltage:VIN [V]
3.5
Figure 15. Maximum Output Current vs Power Supply Voltage
2.0
7
Ta=-50 ˚C
Ta=+25 ˚C
Ta=+125 ˚C
Quiescent VIN Current:IVIN [μA]
Shutdown VIN Current:ISHD [μA]
VSEL=Low
VSEL=High
200
1.5
1.0
0.5
0.0
6
VSEL=Low
VSEL=High
5
4
3
2
1
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:V IN [V]
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:V IN [V]
Figure 16. Shutdown VIN Current vs Power Supply Voltage
(EN=MODE=Low, No load)
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Figure 17. Quiescent VIN Current vs Power Supply Voltage
(MODE=Low: Auto-PFM/PWM, FB=3.5 V, No load)
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BD83070GWL
2.0
200
1.9
180
1.8
160
Ripple Voltage [mV]
Switching Frequency:fSW [MHz]
Typical Performance Curves - continued
1.7
1.6
1.5
1.4
1.3
1.2
MODE=Low: Auto-PFM/PWM
MODE=High: Forced-PWM
140
120
100
80
60
40
VSEL=Low
1.1
20
VSEL=High
1.0
0
0.01
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:VIN [V]
Figure 18. Switching Frequency vs Power Supply Voltage
(MODE=High: Forced-PWM, No load)
0.1
1
10
100
Output Current:IOUT [mA]
1000
Figure 19. Ripple Voltage vs Output Current
(VIN=3.6 V, VSEL=High)
ch1:MODE [2 V/div]
ch1:VSEL [2 V/div]
ch2:VOUT [100 mV/div, offset=3.3 V]
ch2:VOUT [500 mV/div, offset=2.9 V]
ch3:Icoil [200 mA/div]
ch3:Icoil [200 mA/div]
Time[500 μs/div]
Time[500 μs/div]
Figure 20. Transient Response
(“Mode Change”, VIN=3.6 V, VSEL=High,
MODE=LowHigh, Output current 50 mA)
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Figure 21. Transient Response
(“Output Voltage Change”, VIN=2.9 V, VSEL=LowHigh,
MODE=Low: Auto-PFM/PWM, Output current 50 mA)
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Typical Performance Curves - continued
ch4:IOUT [200 mA/div]
ch4:IOUT [200 mA/div]
ch1:VOUT [200 mV/div, offset=3.31 V]
ch1:VOUT [200 mV/div, offset=3.31 V]
ch3:PVIN [1 V/div, offset=2.3 V]
ch3:PVIN [1 V/div, offset=2.3 V]
Time[50 μs/div]
Time[50 μs/div]
Figure 22. Transient Response
(VIN=2.3 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 20 mA->600 mA)
Figure 23. Transient Response
(VIN=2.3 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 600 mA->20 mA)
ch4:IOUT [300 mA/div]
ch4:IOUT [300 mA/div]
ch1:VOUT [300 mV/div, offset=3.31 V]
ch1:VOUT [300 mV/div, offset=3.31 V]
ch3:PVIN [1 V/div, offset=3.6 V]
ch3:PVIN [1 V/div, offset=3.6 V]
Time[50 μs/div]
Time[50 μs/div]
Figure 24. Transient Response
(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 50 mA->1000 mA)
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Figure 25. Transient Response
(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 1000 mA->50 mA)
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Typical Performance Curves - continued
ch1:VIN [1 V/div]
ch1:VIN [1 V/div]
ch2:VOUT [100 mV/div, offset=3.3 V]
ch2:VOUT [100 mV/div, offset=3.3 V]
Time[100 μs/div]
Time[100 μs/div]
Figure 26. Transient Response
(VIN=2.7 V->5.5 V, VSEL=High, MODE=Low:
Auto-PFM/PWM, Output current 300 mA)
Figure 27. Transient Response
(VIN=5.5 V->2.7 V, VSEL=High, MODE=Low:
Auto-PFM/PWM, Output current 300 mA)
ch1:EN [3 V/div]
ch1:EN [3 V/div]
ch2:VOUT [1 V/div]
ch2:VOUT [1 V/div]
ch3:IPVIN+IVIN [500 mA/div]
ch3:IPVIN+IVIN [500 mA/div]
Time[1 ms/div]
Time[2 ms/div]
Figure 28. Startup Waveform
(VIN=2.4 V, VSEL=High, MODE=High: Forced-PWM,
5.5 Ω resistive load)
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Figure 29. Startup Waveform
(VIN=3.6 V, VSEL=High, MODE=High: Forced-PWM,
3.3 Ω resistive load)
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Typical Performance Curves - continued
ch1:EN [2 V/div]
ch1:EN [2 V/div]
ch2:VOUT [1 V/div]
ch2:VOUT [1 V/div]
Time[2 ms/div]
Time[2 ms/div]
Figure 30. Shutdown Waveform
(VIN=3.6 V, VSEL=Low, MODE=Low: Auto-PFM/PWM, No
load)
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Figure 31. Shutdown Waveform
(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM, No
load)
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BD83070GWL
Application Examples
VSEL = VIN (VOUT = 3.3 V setting)
L1
LX1
VIN
LX2
PVIN
VOUT
C1
FB
VOUT
3.3 V
C2
VIN
ON
EN
OFF
VSEL
Forced-PWM
MODE
GND
Auto-PFM/PWM
REF
PGND
C3
Figure 32. 3.3V Output Application Circuit
VSEL = GND (VOUT = 2.5 V setting)
L1
LX1
VIN
LX2
PVIN
VOUT
C1
FB
VOUT
2.5 V
C2
VIN
ON
EN
OFF
VSEL
Forced-PWM
Auto-PFM/PWM
MODE
GND
REF
PGND
C3
Figure 33. 2.5 V Output Application Circuit
Parts Number
Description
Supplier
L1
1239AS-H-1R5M
(1.5 μH, 2.5 mm x 2.0 mm x 1.2 mm)
muRata
C1
EMK212ABJ106KD (10 μF, 16 V, X5R, 0805)
Taiyo Yuden
(Note 1)
JMK107BBJ226MA (22 μF, 6.3 V, X5R, 0603)
Taiyo Yuden
EMK105ABJ474KV-F (0.47 μF, 16 V, X5R, 0402)
Taiyo Yuden
C2
C3
(Note 1) The effective load capacitance value considering accuracy, temperature characteristic and DC bias characteristic of output capacitors should not be less than
22 μF. The amount of output capacitance will have a significant effect on the output ripple voltage.
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BD83070GWL
I/O Equivalence Circuits
Pin
Name
Pin
Name
Equivalence circuit
Equivalence circuit
LX2
VIN
EN
VOUT
GND
GND
GND
RDCG
GND
GND
VIN
REF
PVIN
PGND
GND
GND
VOUT
FB
LX2
GND
GND
PGND
PVIN
VOUT
VIN
MODE
VSEL
PGND
GND
GND
GND
GND
PVIN
VIN
LX1
GND
PGND
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BD83070GWL
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD83070GWL
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 34. Example of Monolithic IC Structure
11.
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that
will prevent the chip from being exposed to light.
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TSZ22111 • 15 • 001
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BD83070GWL
Ordering Information
B
D
8
3
0
7
0
G
W
L
Package
GWL: UCSP50L1C
Part Number
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TOP VIEW
UCSP50L1C (BD83070GWL)
Pin 1 Mark
ADQ
Part Number Marking
LOT Number
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BD83070GWL
Physical Dimension and Packing Information
Package Name
UCSP50L1C(BD83070GWL)
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
3,000pcs
Direction of feed
E2
The direction is the pin 1 of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
1234
1234
Reel
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TSZ22111 • 15 • 001
1234
1234
1pin
20/21
1234
1234
Direction of feed
TSZ02201-0Q3Q0A900570-1-2
09.Oct.2018 Rev.001
BD83070GWL
Revision History
Date
Revision
09.Oct.2018
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD83070GWL - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD83070GWL
UCSP50L1C (12Pin)
3000
3000
Taping
inquiry
Yes
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