Single-chip Type with Built-in FET Switching Regulators
High-efficiency Step-up Switching Regulator with Built-in Power MOSFET
BD8314NUV
No.11027EDT09
●Description ROHM’s High-efficiency Step-up Switching Regulator Built-in Power MOSFET BD8314NUV generates step-up output including 8 V or 10 V from 4 batteries, batteries such as Li1cell or Li2cell etc. or a 5 V fixed power supply line. This IC allows easy production of small and a wide range of output current, and is equipped with an external coil/capacitor downsized by high frequency operation of 1.2 MHz, built-in 2.5 A rated 80 mΩ Nch FET SW, and flexible phase compensation system on board. ●Features 1) Incorporates Nch FET capable of withstanding 2.5 A/14 V. 2) Incorporates phase compensation device between input and output of ERROR AMP. 3) Small coils and capacitors to be used by high frequency operation of 1.2 MHz 4) Input voltage 3.0 V ~ 12 V 5) Output current 600 mA (3.5 V ~ 10 V) at 10 V 600 mA (3.0 V ~ 8 V) at 8 V 6) Incorporates soft-start function. 7) Incorporates timer latch system short protecting function. 8) As small as 3 mm×3 mm, SON 10-pin package VSON010V3030 ●Application General portable equipment like DSC/DVC powered by 4 dry batteries or Li2cell ●Absolute Maximum Ratings Parameter Maximum applied power voltage Maximum input voltage Maximum input current Power dissipation Operating temperature range Storage temperature range Junction temperature Symbol VCC, LX SWOUT, INV Iinmax Pd Topr Tstg Tjmax Ratings 14 14 2.5 700* -25 to +85 -55 to +150 +150 Unit V V A mW °C °C °C
* When used at Ta = 25°C or more installed on a 74.2 × 74.2 × 1.6t mm board, the rating is reduced by 5.6 mW/°C.
●Operating Conditions (Ta = 25°C) Parameter Power supply voltage Output voltage Symbol VCC VOUT Ratings 3.0 to 12 4.0 to 12 Unit V V
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2011.08 - Rev.D
BD8314NUV
●Electrical Characteristics (Unless otherwise specified, Ta = 25 °C, VCC = 7.4 V) Parameter Symbol Limits Min. Typ. Max. Unit
Technical Note
Conditions
[Low voltage input malfunction preventing circuit] Detection threshold voltage Hysteresis range [Oscillator] Oscillation frequency [Regulator] Output voltage [ERROR AMP] INV threshold voltage Input bias current Soft-start time [PWM comparator] LX Max Duty [SWOUT] ON resistance [Output] LX NMOS ON resistance LX leak current [STB] STB pin control voltage Operation No-operation VSTBH VSTBL RSTB 2.5 -0.3 250 400 VCC 0.3 700 V V kΩ RON Ileak -1 80 0 150 1 mΩ µA RONSWOUT 50 100 Ω Dmax1 77 85 93 % VINV IINV Tss 0.99 -50 5.3 1.00 0 8.8 1.01 50 12.2 V nA msec Vcc=11.0V , VINV=5.5V VREG 4.65 5.0 5.35 V fosc 1.1 1.2 1.3 MHz VUV ΔVUVhy 50 2.4 100 2.6 200 V mV VREG monitor
STB pin pull-down resistance [Circuit current] Standby current VCC Circuit current at operation VCC
Not designed to be resistant to radiation
ISTB Icc
-
600
1 900
µA µA VINV=1.2V
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2/15
2011.08 - Rev.D
BD8314NUV
●Description of Pins
Technical Note
Pin No. 1 GND VCC VREG LX LX SWOUT INV STB PGND PGND 2 3 4~5 6~7 8 9 10
Pin Name GND VCC VREG Lx PGND STB INV SWOUT
Function Ground terminal Control part power input terminal 5 V output terminal of regulator for internal circuit Coil connecting terminal Power transistor ground terminal ON/OFF terminal ERROR AMP input terminal STBSW for split resistance
Fig.1 Pin layout
●Block Diagram
STB
VREG
VCC
STBY_IO VREG OSC 1.2MHz
FB H
5V REG
Reference
VREF
UVLO
SCP
OSC×16000 count
Lx
VREG
GND
STOP
PWM CONTROL
PRE DRIVER
80mΩ
PGND
+ + -
ERROR_AMP
VREF Soft Start
STB
SWOUT
50Ω
INV
Fig.2 Block diagram
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3/15
2011.08 - Rev.D
BD8314NUV
●Description of Blocks 1. VREF This block generates ERROR AMP reference voltage. The reference voltage is 1.0 V.
Technical Note
2.
UVLO Circuit for preventing low voltage malfunction Prevents malfunction of the internal circuit at activation of the power supply voltage or at low power supply voltage. Monitors VREG pin voltage to turn off all output FET and DC/DC converter output when VREG voltage is lower than 2.4 V, and reset the timer latch of the internal SCP circuit and soft-start circuit. This threshold contains 100 mV hysteresis. SCP Timer latch system short-circuit protection circuit When the INV pin is the set 1.0 V or lower voltage, the internal SCP circuit starts counting. The internal counter is in synch with OSC; the latch circuit activates after a lapse of 13.3 msec after the counter counts about 16000 oscillations and then, turn off DC/DC converter output. To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. OSC Circuit for oscillating saw tooth waves with an operation frequency fixed at 1.2 MHz ERROR AMP Error amplifier for detecting output signals and outputting PWM control signals The internal reference voltage is set at 1.0 V. A primary phase compensation device of 200 pF, 62 kΩ is built in between the inverting input terminal and the output terminal of this ERROR AMP. PWM COMP Voltage-pulse width converter for controlling output voltage corresponding to input voltage Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width to the output to the driver. Max Duty is set at 85%. SOFT START Circuit for preventing in-rush current at startup by bringing the output voltage of the DC/DC converter into a soft-start Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 10000 oscillations. PRE DRIVER CMOS inverter circuit for driving the built-in Nch FET. STBY_IO Voltage applied on STB pin (8 pin) to control ON/OFF of IC Turned ON when a voltage of 2.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 400 kΩ pull-down resistance.
3.
4. 5.
6.
7.
8. 9.
10. Nch FET SW Built-in SW for switching the coil current of the DC/DC converter. Incorporates an 80 mΩ NchFET SW capable of withstanding 14 V. Since the current rating of this FET is 2.5 A, it should be used within 2.5 A including the DC current and ripple current of the coil.
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4/15
2011.08 - Rev.D
BD8314NUV
●Reference Data (Unless otherwise specified, Ta = 25°C, VCC = 7.4 V)
1.02
Technical Note
1.02
5.3 5.2
INV THRESHOLD [V]
INV THRESHOLD [V]
1.01
1.01
VREG VOLTAGE [V] 5.1 5.0 4.9
1.00
1.00
0.99
0.99
4.8
0.98 -40 -20 0 20 40 60 80 100 120 TEMPERATURE [℃]
0.98 0 5 VCC [V] 10
4.7 -40 0 40 TEMPERAT URE [℃] 80 120
Fig.3. INV threshold temperature property
8 7 1.4
Fig.4. INV threshold power supply property
1.4
Fig.5. VREG output temperature property
VREG[V]
5 4 3 2 1 0 0 2 4 6 8 VCC [V] 10 12 14
FREQUENCY [ MHz ]
6
FREQUENCY [MHz]
1.3
1.3
1.2
1.2
1.1
1.1
1.0 -40 0 40 80 TEMPERATURE [℃] 120
1.0 3 6 9 VCC [V] 12 15
Fig.6. VREG output power supply property
3.5 UVLO THRESHOLD VOLTAGE [ V ] 3.4 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 2.5 -40 -20 0 25 50 85 100 120 TEMPARATURE [℃] 0.00 0.25
Fig.7. fosc temperature property
160 140
ヒステリシス電圧 Vhys [V] 0.20
Fig.8. fosc voltage property
120
UVLO release
ON RESISTANCE [ mO ]
ID=500mA
ID=500mA 100 ON RESISTANCE [ mO] 80 60 40 20 0
120 100 80 60 40 20 0 -40 0 40 80 TEMPARATURE [℃] 120
Hysteresis width
0.15
UVLO detection
0.10
0.05
3
6
9 VCC [V]
12
15
Fig.9. UVLO threshold temperature property
2.5
Fig.10. Nch FET ON resistance temperature property
100
Fig.11. Nch FET ON resistance power supply property
100
ID=1mA
SWOUT ON Resistance [Ω ]
ID=1mA
SWOUT ON Resistance [Ω ] 80
80
ON
STB Voltage [V] 2.0
60
60
40
40
1.5
20
20
OFF
1.0 -50 0 50 VCC [V] 100 150
0 -40 0 40 80 120 TEMPARATURE [℃]
0 3 6 9 VCC [V] 12 15
Fig.12. STB threshold temperature property
Fig.13. SWOUT ON resistance temperature property
Fig.14. SWOUT ON resistance power supply property
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2011.08 - Rev.D
BD8314NUV
Technical Note
95
95
2.5
90 Lx Max Duty [ % ] Lx Max Duty [%]
90 STB Voltage [V] 3 6 9 VCC [V] 12 15 2.0
85
85
1.5
80
80
75 -40 0 40 80 TEMPARATURE [℃] 120
75
1.0 -50 0 50 VCC [V] 100 150
Fig.15. Lx Max duty temperature property
1000
Fig.16. Lx Max duty power supply property
Fig.17. Circuit current temperature property
800
ICC [uA]
600
400
200
0 0 2 4 6 8 VCC [V] 10 12 14
Fig.18. Circuit current power supply property
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6/15
2011.08 - Rev.D
BD8314NUV
●Example of Application Input: 3.0 to 10 V, output: 10 V / 500 mA
RSX201L-30 (ROHM) 10V/500mA
Technical Note
22μF GRM32EB31C226KE16 (Murata) 4.7μH DE3518E(TOKO)
6
PGND
Lx
5
VBAT=2.5~4.5V
10p
7
ON/OFF
PGND
Lx
4 3 2 1
200k
10k
8 9
STB
VREG
10μF GRM31CB31E106KA75L(Murata) 1μF GRM188B11A105KA61(Murata)
100k 22k
INV
VCC
1μF GRM21BB11C105KA01(Murata)
3.3~5.0V
10
SWOUT
GND
Fig.19 Reference application diagram ●Reference Application Data 1
100
100 100
VCC=10V
80 EFFICIENCY [%] EFFICIENCY [%]
80
VCC=6.0V
EFFICIENCY [%]
80
VCC=4.0V
60
VCC=7.4V VCC=8.4V
60
60
VCC=4.8V
40
VCC=3.5V
40
40
20
20
20
0 1 10 100 1000 10000 OUTPUT CURRENT [mA]
0 1 10 100 1000 10000
0 1 10 100 1000 10000
OUTPUT CURRENT [mA]
OUTPUT CURRENT [mA]
Fig.20 Power conversion efficiency 1
Fig.21 Power conversion efficiency 2
Fig.22 Power conversion efficiency 3
15 14 13
10.5 10.4 10.3
10.5 10.4
VCC=10V
OUTPUT VOLTAGE [V]
10.3 10.2 10.1 10.0 9.9 9.8 9.7 9.6 9.5
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
12 11 10 9 8 7 6 5 0 2 4
Io=100mA
10.2 10.1 10.0 9.9 9.8 9.7 9.6 9.5
VCC=8.4V
VCC=4.8V
VCC=7.4V VCC=6.0V
VCC=4.0V VCC=3.5V
Io=500mA
6
8
10
12
1
10
100
1000
10000
1
10
100
1000
10000
INPUT VOLTAGE [V]
OUTPUT CURRENT [mA]
OUTPUT CURRENT [mA]
Fig.23 Line regulation
Fig.24 Load regulation 1
Fig.25 Load regulation 2
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7/15
2011.08 - Rev.D
BD8314NUV
●Reference Application Data 2 (VCC = 3.0 V, 6.0 V, 8.4 V, VOUT = 10 V)
60 40 20 Gain [dB] 0 -20 -40 -60 100 100 180 120 60 Phase [deg] 0
Technical Note
60
Phase
180 120 60 Phase [deg]
Gain [dB]
60 40 20 0
180
Phase
40 20 Gain [dB] 0 -20 -40 -60 100 100 1000 1k 10000 10k
Phase
120 60 0 Phase [deg]
Gain
0 -60 -120 -180 100000 1M 1000000 100k
Gain
-60 -120 -180 1M 1000000
Gain
-20 -40 - 60 100 1k 100 1000 10k 10000 100k 100000 Frequency [Hz] -60 -120 -180 1M 1000000
1k 1000
10k 10000
100k 100000
Frequency [Hz]
Frequency [Hz]
Fig.26 Frequency response property 1 (VCC = 3.0 V, Io = 200 mA)
60 40 180 120
Fig.27 Frequency response property 2 (VCC = 6.0 V, Io = 200 mA)
60 40 20 180
Fig.28 Frequency response property 3 (VCC = 8.4 V, Io = 200 mA)
60 40 20
Phase [deg]
180 Phase 120 60 0 Gain -60 -120 -180 100000 1M 1000000 100k Phase [deg]
Phase
120 60
Phase
20 Gain [dB] 0 -20 -40 -60 100 1000 100 1k 10000 10k 100000 100k Frequency [Hz] 60 Phase [deg]
Gain [dB]
Gain [dB]
0
0
0
0 -20 -40 -60 100 100 1000 1k 10000 10k
Gain
-20 -40 -60 100 100 1000 1k 10000 10k -60 -120 -180 100000 1M 1000000 100k
Gain
-60 -120 -180 1000000 1M
Frequency [Hz]
Frequency [Hz]
Fig.29 Frequency response property 4 (VCC = 3.0 V, Io = 500 mA) ●Reference Board Pattern
Fig.30 Frequency response property 5 (VCC = 6.0 V, Io = 500 mA)
Fig.31 Frequency response property 6 (VCC = 8.4 V, Io = 500 mA)
VOUT
GND
Lx
VBAT
・The radiation plate on the rear should be a GND flat surface of low impedance in common with the PGND flat surface. ・It is recommended to install a GND pin in another system as shown in the drawing without connecting it directly to this PGND
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8/15
2011.08 - Rev.D
BD8314NUV
Technical Note
●Limits of the lowest power supply voltage to start up When using configuration of inputting VCC voltage from output voltage of DC/DC converter, the input voltage as power supply for the IC drops by Vf voltage of external Diode. The worst condition is shown as below. VCC terminal voltage - Vf voltage of external diode ≧ the worst voltage of UVLO reset voltage(=2.8V) Please judge this IC is useable or not considering needed start up voltage and load current.
3.2
VOUT=10V, typ
3.0
VBAT [ V ]
2.8
-35℃
2.6
2.4
85℃
25℃
2.2 0.1 1.0 10.0 100.0
Io [mA]
Fig.32 start up voltage Vs load current
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9/15
2011.08 - Rev.D
BD8314NUV
●Selection of Part for Applications (1) Inductor A shielded inductor that satisfies the current rating (current value, Ipecac as shown in the drawing below) and has a low DCR (direct resistance component) is recommended. Inductor values affect inductor ripple current, which will cause output ripple. Ripple current can be reduced as the coil L value becomes larger and the switching frequency becomes higher.
Ipeak IOUT VOUT / VIN /η ΔIL / 2 [ A ]
Technical Note
Δ IL
Fig.33 Inductor current
・・・(1)
ΔIL
VIN VOUT VIN 1 [A] L VOUT f
・・・(2)
(η: Efficiency, ∆IL: Output ripple current, f: Switching frequency) As a guide, inductor ripple current should be set at about 20 to 50% of the maximum input current. * Current over the coil rating flowing in the coil brings the coil into magnetic saturation, which may lead to lower efficiency or output oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. (2) Output capacitor A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple. There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into consideration. Output ripple voltage is obtained by the following equation. VPP IOUT VOUT VIN IOUT RESR [ V ] f CO VOUT ・・・(3)
Setting must be performed so that output ripple is within the allowable ripple voltage. (3) Output voltage setting The internal reference voltage of the ERROR AMP is 1.0 V. Output voltage is obtained by Equation (4) of Fig. 33, but it should be designed taking about 50 Ω, an error of NMOS ON resistance of SWOUT into consideration.
VOUT ERROR AMP INV R2 VREF 1.0V SWOUT STB
R1
VO
R1 R2 1.0 [ V ]
R2
・・・(4)
Fig.34
Setting of voltage feedback resistance
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10/15
2011.08 - Rev.D
BD8314NUV
Technical Note
(4) DC/DC converter frequency response adjustment system Condition for stable application The condition for feedback system stability under negative feedback is that the phase delay is 135 °or less when gain is 1 (0 dB). Since DC/DC converter application is sampled according to the switching frequency, the bandwidth GBW of the whole system (frequency at which gain is 0 dB) must be controlled to be equal to or lower than 1/10 of the switching frequency. In summary, the conditions necessary for the DC/DC converter are: - Phase delay must be 135°or lower when gain is 1 (0 dB). - Bandwidth GBW (frequency when gain is 0 dB) must be equal to or lower than 1/10 of the switching frequency. To satisfy above two items, R1, R2, R3, DS and RS in Fig. 34 should be set as follows. [1] R1, R2, R3 BD8314NUV incorporates phase compensation devices of R4=62 kΩ and C2=200pF. These C2 and R1, R2, and R3 values decide the prim ary pole that determines the bandwidth of DC/DC converter. Primary pole point frequency
fp=
VOUT R1 Cs Rs R2 R3 FB Inside of IC R4 C2
1 2π A×( R1・R2 R1+R2 ・・・・(1) +R3)×C2 Fig.35 Example of phase compensation setting A B VIN VOUT : ERROR AMP Gain About 100dB = 105 : Oscillator amplification = 0.5 : Input voltage : Output voltage
DC/DC converter DC Gain 1 VOUT DC Gain A ・・・・(2) B VOUT VIN
By Equations (1) and (2), the frequency fsw of point 0 dB under limitation of the bandwidth of the DC gain at the primary pole point is as shown below.
fSW fp DC Gain
1 1 VOUT ・・・・(3) R1 R2 B VOUT VIN 2πC2 R3 R1 R2
It is recommended that fsw should be approx.10 kHz. When load response is difficult, it may be set at approx. 20 kHz. By this setting, R1 and R2, which determine the voltage value, will be in the order of several hundred kΩ. Therefore, if an appropriate resistance value is not available and routing may cause noise, the use of R3 enables easy setting.
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11/15
2011.08 - Rev.D
BD8314NUV
Technical Note
[2]Cs and Rs setting In the step-up DC/DC converter, the secondary pole point is caused by the coil and capacitor as expressed by the following equation. 1 D fLC ・・・・(4) 2π LC
D: ON Duty = ( VOUT - VIN ) / VOUT
This secondary pole causes a phase rotation of 180°. To secure the stability of the system, put zero points in 2 places to perform compensation. Zero point by built-in CR
fz1 1 13 kHz 2πR 4C2 ・・・・(5)
Zero point by Cs
fz1
1 2πR1 R3 CS
・・・・(6)
Setting CS2 to be half to 2 times a frequency as large as fLC provides an appropriate phase margin. It is desirable to set Rs at about 1/20 of (R1+R3) to cancel any phase boosting at high frequencies. Those pole points are summarized in the figure below. The actual frequency property is different from the ideal calculation because of part constants. If possible, check the phase margin with a frequency analyzer or network analyzer, etc.. Otherwise, check for the presence or absence of ringing by load response waveform and also check for the presence or absence of oscillation under a load of an adequate margin.
(5) (6)
(3) (4)
Fig. 36 Example of DC/DC converter frequency property (Measured with FRA5097 by NF Corporation)
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12/15
2011.08 - Rev.D
BD8314NUV
●I/O Equivalence Circuit
Technical Note
FB
VREG VREG
INV
VCC VREG
FB
INV
VREG
SWOUT
VCC
VCC
VCC
VREG
SWOUT
STB
VCC VCC
Lx, PGND
Lx
STB
PGND
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13/15
2011.08 - Rev.D
BD8314NUV
Technical Note
●Notes for Use 1) Absolute Maximum Rating We dedicate much attention to the quality control of these products, however the possibility of deterioration or destruction exists if the impressed voltage, operating temperature range, etc., exceed the absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. If a special mode exceeding the absolute maximum rating is expected, please review matters and provide physical safety means such as fuses, etc. 2) GND Potential Keep the potential of the GND pin below the minimum potential at all times. 3) Thermal Design Work out the thermal design with sufficient margin taking power dissipation (Pd) in the actual operation condition into account. 4) Short Circuit between Pins and Incorrect Mounting Attention to IC direction or displacement is required when installing the IC on a PCB. If the IC is installed in the wrong way, it may break. Also, the threat of destruction from short-circuits exists if foreign matter invades between outputs or the output and GND of the power supply. 5) Operation under Strong Electromagnetic Field Be careful of possible malfunctions under strong electromagnetic fields. 6) Common Impedance When providing a power supply and GND wirings, show sufficient consideration for lowering common impedance and reducing ripple (i.e., using thick short wiring, cutting ripple down by LC, etc.) as much as you can. 7) Thermal Protection Circuit (TSD Circuit) This IC contains a thermal protection circuit (TSD circuit). The TSD circuit serves to shut off the IC from thermal runaway and does not aim to protect or assure operation of the IC itself. Therefore, do not use the TSD circuit for continuous use or operation after the circuit has tripped. 8) Rush Current at the Time of Power Activation Be careful of the power supply coupling capacity and the width of the power supply and GND pattern wiring and routing since rush current flows instantaneously at the time of power activation in the case of CMOS IC or ICs with multiple power supplies. 9) IC Terminal Input This is a monolithic IC and has P+ isolation and a P substrate for element isolation between each element. P-N junctions are formed and various parasitic elements are configured using these P layers and N layers of the individual elements. For example, if a resistor and transistor are connected to a terminal as shown on Fig.37: ○The P-N junction operates as a parasitic diode when GND > (Terminal A) in the case of a resistor or when GND > (Pin B) in the case of a transistor (NPN) ○Also, a parasitic NPN transistor operates using the N layer of another element adjacent to the previous diode in the case of a transistor (NPN) when GND > (Pin B). The parasitic element consequently rises under the potential relationship because of the IC’s structure. The parasitic element pulls interference that could cause malfunctions or destruction out of the circuit. Therefore, use caution to avoid the operation of parasitic elements caused by applying voltage to an input terminal lower than the GND (P board), etc. Resistor (Pin A) (Pin B) Transistor (NPN)
~ ~
C
B
E GND
N P+ N P N P+ P N N
+
N P Substrate
N GND
Parasitic Element
P Substrate Parasitic Element GND
Parasitic Element
GND
Fig.37 Example of simple structure of Bipolar IC
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14/15
2011.08 - Rev.D
~ ~
P
(Pin A)
P+
BD8314NUV
●Ordering part number
Technical Note
B
D
8
Part No.
3
1
4
N
U
V
-
E
2
Part No.
Package NUV: VSON010V3030
Packaging and forming specification E2: Embossed tape and reel
VSON010V3030
3.0±0.1
3.0±0.1
Tape Quantity
S
(0.22)
Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
1.0MAX
1PIN MARK
0.08 S 2.0±0.1 0.5
0.4±0.1
C0.25
1.2±0.1
1 5
10
6
+0.03 0.02 -0.02
Direction of feed
( reel on the left hand and you pull out the tape on the right hand
)
0.5
+0.05 0.25 -0.04
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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15/15
2011.08 - Rev.D
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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R1120A