BD8316GWL-E2

Datasheet Single-chip Type with Built-in FET Switching Regulator Series Step-up and inverted 2-channel DC/DC converter with Built-in Power MOSFET BD8316GWL ●Description The BD8316GWL is step-up and inverted 2-channel switching regulator with integrated internal high-side MOSFET. With wide input range from 2.5~5.5V ,it suitable for application of portable item. In addition,The small package design is ideal for miniaturizing the power supply. ●Features ■ Wide input voltage range of 2.5V to 5.5 V ■ High frequency operation 1.6MHz ■ Incorporates Nch FET of 230mΩ/22V and Pch Pow FET of 230mΩ/15V ■ Incorporates Soft Start (4.2msec(typ))and hight side switch of boost channel ■ Independent ON/OFF signal(STB). Built-in discharge SW for step up channel ■ Small package UCSP50L1( 1.8mm×1.5mm, 4× 3 grid, 11pin, WLCSP) ■ Circuits protection OCP,SCP,UVLO,TSD ●Important Specifications ■ Input voltage range 2.5～5.5 [V] ■ Output boost voltage Input voltage(max)~18 [V] ■ Output inverted voltage -9.0～-1.0 [V] ■ Maximum current 1[A](max) ■ Operating frequency 1.6 [MHz] (typ.) ■ Nch FET ON resistance 230[mΩ] ■ Pch FET ON resistance 230[mΩ] ■ Standby current 1[μA](max) ●Package UCSP50L1 (WLCSP) 1.8mm×1.5mm×0.5mm, 4×3glid,11pin, ●Application ■ LCD battery ■ CCD battery ■ Portable items that are represented by mobile phone and DSC ●Typical Application Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA 0.1uF/10V 10kΩ 56kΩ Vout1: -5.6V/200mA 4.7uF/10V VREF Vin→ 2.5～5.5V NON1 LX1 4.7uH VDD 4.7uF/10V DIS1 EN CH1→ STB1 EN CH２→ STB2 HS2L 4.7uH GND INV2 Vout2: 5.6V/200mA LX2 4.7uF/10V 180kΩ 30kΩ Fig.1 Application schematic www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Pin Description C B A 1 2 3 4 Fig.2 Pin assignment (Bottom view) Pin No. Pin Name Function A-1 VDD Power input voltage pin. Connect to input ceramic capacitor bigger than 0.47uF. A-2 HS2L Load SW output pin .Connect to inductor A-3 LX2 Boost channel drain Nch Power MOS. Connect to diode and inductor. A-4 GND Ground connection B-1 LX1 B-3 STB1 B-4 STB2 C-1 DIS1 C-2 VREF C-3 NON1 C-4 INV2 PchPowerMOS drain of boost channel. Connect to diode and inductor Enable pin of inverted channel. ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ)) Enable pin of boost channel. ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ)) Discharge SW of inverted channel. Connect to output of inverted channel. STB1 disable , Output pin voltage is discharged by 100Ω(typ) Reference voltage of inverted channel. 1.0V(typ) is included in error amp offset Feedback pin of inverted channel. Connect to feedback resistance and set output voltage. The method of output voltage setting is P16/20. When inverted cannel is disable , the pin is discharged by integrated resistance (150Ω(typ)) Feedback pin of boost channel. Connect to feedback resistance and set output voltage. The method of output voltage setting is P16/20. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Block Diagram Fig.3 Block diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 3/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Function blacks description 1.Voltage Reference This block generates ERROR AMP reference voltage. The reference voltage of CH1 is 1.0V, The reference voltage of CH2 is 0.8V. 2.UVLO Circuit for preventing malfunction at low voltage input. This circuit prevents malfunction at the start of DC/DC converter and low input voltage .The function monitors VCC pin voltage and if VCC voltage is lower than 2.2V, function turns off all output of FETs and DC/DC converter , and reset the timer latch of the internal SCP circuit and soft-start circuit. 3.SCP Short-circuit protection function based on timer latch system. When the voltage of NON1 pin is higher than 0V or INV2 pin voltage is lower than 0.8V, the internal SCP circuit starts counting. SCP circuit detects output of Error AMP. Since internal Error AMP has highly gain as high as 80dB or more, if input erroramp voltage cross reference voltage ,the output voltage of Error AMP goes high and detects SCP . The internal counter is in synch with OSC, the latch circuit activates after the counter counts oscillations to turn off DC/DC converter output (about 40.9 msec ). To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. 4.OSC This function determine oscillation frequency . Oscillation frequency of DC/DC converter set at 1.6MHz. 5.ERROR AMP Error amplifier watch output voltage and output PWM control signals. The internal reference voltage for Error AMP of ch1 is set at 0V. The internal reference voltage for Error AMP of ch2 is set at 0.8V. 6.Timing Control Voltage-pulse width converter for controlling output voltage corresponding to input voltage. Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and outputs to the driver. Max Duties of ch1 and ch2 are set at 86%. 7.SOFT START Circuit for preventing in-rush current at the start of DC/DC converter by bringing the output voltage. Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 4.2m sec. 8.OCP Circuit for preventing malfunction at over current. Under input current over electrical characteristics , it supply minimum duty to DC/DC converter and IC stop safety by SCP detected. 9.TSD Circuit for preventing malfunction at high Temperature . When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150℃), it turns OFF all Output FET, and turns OFF DC/DC Comparator Output. 10. ON/OFF Voltage applied on STB pin to control ON/OFF channel of each channel. Turned ON when a voltage of 1.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 800 kΩ pull-down resistance. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 4/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ○Absolute maximum ratings(T=25℃) Parameter Symbol Rating Unit VDD －0.3～7 V Maximum power supply voltage STB1,STB2 －0.3～7 V IHS2L 1.0 A Maximum input current ILX1 1.0 A ILX2 1.0 A VDD-LX1 15 V LX2 22 V Maximum input voltage NON1 -0.3～7 V INV2 -0.3～7 V DIS1 -9～0.3 V Power dissipation Pd 730 mW Operating temperature range Topr －35～+85 ℃ Storage temperature range Tstg －55～+150 ℃ Junction temperature Tjmax +150 ℃ ((*1) When mounted on 74.2×74.2×1.6mm and operated over 25℃ Pd reduces by 4.96mW/℃. ○Recommended operating conditions Parameter Symbol Power supply voltage Inverted output voltage Step up output voltage VDD VO1 VO2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 MIN 2.5 -9.0 VCC 5/20 Standard value TYP MAX － 5.5 － -1.0 18 Units V V V TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ○Electrical characteristics（Ta=25℃, VDD=3.6V） Parameter MIN Standard value TYP MAX 50 2.2 100 2.35 150 V mV 1.44 82 82 1.6 86 86 1.76 90 90 MHz % % VO1 -6.072 -6.000 -5.928 V DVLi VINV INON1 IINV2 TSS1 TSS2 0.792 -50 -50 3.7 3.7 4.0 0.800 0 0 4.2 4.2 12.5 0.808 50 50 4.7 4.7 mV V nA nA ms ms RON1p RDIS1 RNON1 RON2p RON2n Iocp1 Iocp2 IleakH1 I leak1 I leak2 1.2 1.2 -1 -1 -1 300 100 150 150 300 2.4 2.4 0 0 0 480 160 240 240 480 1 1 1 mΩ Ω Ω mΩ mΩ A A uA uA uA VSTBH VSTBL RSTB1 1.5 -0.3 500 800 5.5 0.3 1400 V V kΩ ISTB - - 1 uA Symbol 【Low voltage input malfunction preventing circuit】 Detect threshold voltage VUV Hysteresis voltage ΔVUVhy 【Oscillator】 Oscillating frequency Fosc LX1 Max Duty Dmax1 LX2 Max Duty Dmax2 【Error AMP, VREF】 CH1output voltage VREF line regulation INV threshold voltage NON1 input bias current INV2 input bias current CH1 Soft start time CH2 Soft start time 【Internal FET】 LX1 PMOS ON resistance DIS1discharge resistance NON1 discharge resistance LX2HighsideSW ON resistance LX2 NMOS ON resistance LX1 OCP threshold LX2 OCP threshold HS2L leak current LX1 leak current LX2 leak current 【STB】 Active STB pin Control voltage Non-active STB pin pull down resistance 【Circuit current】 Standby current Unit Conditions VDD sweep down NON1 feedback resistance 20kΩ, 120kΩ VDD=2.5～5.5V STB1=3.6V, NON1=-0.2V INV2=1.2V VSTB1=0V, IDIS1=-1mA VSTB1=0V, INON1=1mA STB1=STB2=3.6V NON1=-0.2V, INV2=1.2V ◎This product is not designed for normal operation within a radioactive environment. Circuit current of operation VDD IDD www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 - 450 6/20 650 uA TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Reference data (unless otherwise specified Ta=25℃, VCC=3.6V) 0.850 INV THRESHOLD[V] 1.030 1.020 VREF [V] 1.010 VCC=2.5V VCC=3.6V VCC=5.5V 1.000 0.990 0.840 0.830 0.820 0.810 0.800 0.790 VCC=2.5V 0.780 VCC=3.6V 0.770 0.980 VCC=5.5V 0.760 0.970 0.750 TEMPERATURE[℃] 0 50 100 -50 150 -50 Fig.4 VREF vs temp 0 TEMPERATURE[℃] 50 100 150 Fig.5 INV2 threshold vs temp 1.700 2.400 VCC=3.6V 1.600 UVLO threshold voltage[V] FREQUENCY[MHz] VCC=5.5V VCC=2.5V 1.500 1.400 1.300 2.300 Detect threshold 2.200 Reset threshold 2.100 2.000 0 2 4 6 8 -50 VCC[V] Fig.6 Oscillation frequency vs temp www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 0 50 100 TEMPERATURE[℃] 150 Fig.7 UVLO detect threshold Vs temp 7/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL 1.4 1.4 VCC=7.0V 1.2 1.2 VCC=2.5V 0.8 VCC=3.6V STB OFF thresholdt[mV] STB ON thresholdt[mV] VCC=7.0V 1.0 VCC=5.5V 0.6 0.4 0.2 0.8 VCC=2.5V VCC=3.6V 0.6 VCC=5.5V 0.4 0.2 0.0 0.0 -50 0 50 100 150 -50 50 100 150 TEMPERATURE[℃] Fig.8 STB ON threshold voltage vs temp Fig.9 STB OFF threshold voltage vs temp 500 500 450 450 400 400 350 300 250 200 Ta=150deg Ta=25deg 150 Ta=-60deg 100 350 300 100 0 6 8 0 VCC[V] 2 4 6 8 VCC[V] Fig.11 LX2 high side FET ON registance vs VCC Fig.10 LX1 high side FET ON registance vs VCC www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Ta=-60deg 150 50 4 Ta=25deg 200 0 2 Ta=150deg 250 50 0 0 TEMPERATURE[℃] ON RESISTANCE[mΩ] ON RESISTANCE[mΩ] 1.0 8/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL 300 500 450 250 ON RESISTANCE[Ω] ON RESISTANCE[mΩ] 400 350 300 250 Ta=150deg 200 Ta=25deg 150 Ta=-60deg 100 200 150 100 Ta=150deg Ta=25deg Ta=-60deg 50 50 0 0 0 2 4 6 8 0 VCC[V] 2 4 6 8 VCC[V] Fig.13 DIS1 discharge SW ON registance vs VCC Fig.12 HS2L high side FET ON registance vs VCC 1,000 300 900 800 VCC CURRENT[uA] ON RESISTANCE[Ω] 250 200 150 100 Ta=150deg Ta=25deg Ta=-60deg 50 700 600 Ta=25deg 500 400 300 200 100 0 0 0 2 4 6 0 8 2 3 4 5 VCC[V] VCC[V] Fig.15 VCC input current vs VCC (STB ON) Fig.14 NON1 discharge SW ON registance vs VCC www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 9/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL PVCC CURRENT[uA] 20 15 10 VCC=5.5V 5 VCC=3.6V VCC=2.5V 0 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPURTURE[℃] Fig.16 VCC input current vs Temp (STB OFF) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 10/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Example of Application1 Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA 4.7μF/10V (GRM21BB31A475K) 0.1μF/10V (GRM155B11A104K) 56kΩ 180kΩ 30kΩ 10kΩ 30V/1A (RSX101VA-30) 4.7μH (NR3015T4R7M) 4.7μH (NR3015T4R7M) 30V/1A (RSX101VA-30) 1μF/10V 4.7μF/10V (GRM21BB31A475K) (GRM188B11A105K) Fig.17 Example of Application1 ●Example of Application2 Input: :2.5~5.5 V ch1 output: -9V / 30mA 4.7μF/25V ch2output : 180kΩ 430kΩ 20kΩ 20kΩ 18V/ 30mA 0.1μF/10V 30V/1A 4.7μH 1μF/10V 4.7μH 30V/1A 4.7μF/16V Fig.18 Example of Application2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 11/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Example of Board Layout ROHM SMD Evaluation Board Fig.19 Assembly Layer Fig.20 Bottom Layer www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 12/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Typical Performance Characteristic (Unless otherwise specified, Ta = 25°C, VCC = 3.6V) (Example of application 1) 90 90 80 80 CH2 Total Efficiency[%] 100 CH1Total Efficiency[%] 100 70 60 Vin=2.5V 50 Vin=3.6V 40 30 Vin=4.5V 20 70 60 Vin=4.5V 40 30 20 10 0 0 10 100 Output Current [mA] Vin=2.5V 50 10 1 Vin=3.6V 1 1000 10 100 Output Current[mA] Fig.21 CH1 Power conversion efficiency vs output current Fig.22 CH2 Power conversion efficiency vs output current ‐5.400  5.800  ‐5.450  5.750  Vin=2.5V ‐5.500  Output Voltage [V] Output Voltage [V] 1000 ‐5.550  ‐5.600  ‐5.650  Vin=4.5V Vin=3.6V ‐5.700  ‐5.750  5.700  Vin=2.5V 5.650  5.600  5.550  Vin=4.5V Vin=3.6V 5.500  5.450  ‐5.800  5.400  0 50 100 150 200 0 Output Current [A] 100 150 200 Output Current [A] Fig.23 CH1 Output voltage vs Output Current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 50 Fig.24 CH2 Output voltage vs Output Current 13/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ‐5.4 5.8 5.75 ‐5.5 Output Voltage [V] Output Voltage [V] ‐5.45 ‐5.55 ‐5.6 ‐5.65 Io=10mA ‐5.7 ‐5.75 5.7 5.65 5.6 5.55 Io=10mA 5.5 5.45 ‐5.8 2.5 3.5 4.5 5.4 5.5 2.5 Input Voltage[V] 3.5 5.5 Input Voltage[V] Fig.25 CH1 Output voltage vs Input voltage Fig.26 CH2 Output voltage vs Input voltage 5msec/div 5msec/div Vo1=100mV/div Vo2=100mV/div Io=100mA/div Io=100mA/div Fig.27 CH1 Output current response (output current : 10mA ⇔ 100mA) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 4.5 Fig.28 CH2 Output current response (output current : 10mA ⇔ 100mA) 14/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL 1msec/div 1msec/div STB1=2V/div STB=2V/div Vo2=2V/div Vo1=2V/div Fig.30 CH2 Soft start waveform Fig.29 CH1 Soft start waveform 500usec/div STB1=2V/div Vo1=2V/div Fig.31 CH1 Discharge waveform [500usec/div] (STB1:High → Low) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 15/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Selection of Parts for Applications (1)Output inductor A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low DCR (direct current resistance component) is recommended. Inductor values affect output ripple current greatly. Ripple current can be reduced as the inductor L value becomes larger and the switching frequency becomes higher as the equations shown below. Δ IL I peak = I peak Vin − Vout + V f Vin × I out + Vin × (−Vout + V f ) 1 × 2 L × f × (Vin − Vout + V f ) I × Vout 1 Vin × (Vout − Vin ) = out + × Vin × η 2 L × f × Vout 　(Inverted channel) Fig. 32 Ripple current 　 (Boost channel) η: Efficiency( (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○When GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other elements in the proximity of the aforementioned parasitic diode. Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements Induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be careful not to use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the GND (P-board) to the input terminal. E GND N P ＋ P N N P-board P ＋ ＋ P P N P N Ｎ Parasitic element Parasitic element N P-board Parasitic element （Terminal A） ＋ ～ ～ C ～ Transistor (NPN) B Resistor （Terminal B） （Terminal A） GND GND Fig.36 Simplified structure of a Bipolar IC www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 19/20 TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet BD8316GWL ●Ordering part number B D 8 Part No. 3 1 6 G Part No. W L Package GWL: USCP50L1 - E2 Packaging and forming specification E2: Embossed tape and reel ●External information Lot No. 1.5±0.05 1PIN MARK 8316 1.8±0.05 UCSP50L1 (BD82103GWL) (BD8316GWL) 0.1±0.05 1.8±0.05 A 0.05 A B Tape Embossed carrier tape Quantity 3000pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.35±0.05 0.08 S 11-φ0.2±0.05 (φ0.15)INDEX POST 0.55MAX 1.5±0.05 1PIN MARK B C A 1 0.3±0.05 2 3 P=0.4×3 4 P=0.4×2 B 1pin (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Reel 20/20 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0Q1Q0AJ00170-1-2 2012.08.03 Rev. 003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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