BD83740HFP-MTR

Datasheet Constant Current LED Drivers 50V 500mA 1ch Source Driver for Automotive BD83740HFP-M BD83740EFJ-M General Description Key Specifications     BD8374HFP-M and BD8374EFJ-M are 50V-withstanding LED source drivers. Most suitably for Automotive LED driving, it can control light through PWM of constant current output. Having LED open detective function and overvoltage mute function integrated, it can deliver high reliability. Also by utilizing our patented PBUS function, it is possible to turn OFF all LEDs in case where a row of LEDs are opened if multiple rows of LEDs are driven through multiple number of the ICs. Input Voltage Range: 4.5V to 42V Max Output Current: 500mA (Max) Output Current Accuracy: ±5% (Max) Operating Temperature Range: -40°C to +125°C Packages HRP7 HTSOP-J8 W(Typ) x D(Typ) x H(Max) 9.395mm x 10.540mm x 2.005mm 4.90mm x 6.00mm x 1.00mm Features       AEC-Q100 Qualified(Note1) Variable form Constant-Current Source Driver PWM Dimming Function CR Timer for PWM Dimming Function Integrated LED Open detective Function Integrated Overvoltage Mute and Temperature Protection Functions Integrated  Abnormal Output Detection and Output Functions (PBUS) (Note1: Grade 1) Application HRP7  On-board Exterior Lamp (Rear Lamp, Turn Lamp, DRL/Position Lamp, Fog Lamp, etc.)  On-board Interior Lamp (Air Conditioner Lamp, Interior Lamp, Cluster Light, etc.) HTSOP-J8 Basic Application Circuit D1 RVIN_F VIN_F IOUT PWM_in ZD1 CVIN CIOUT VIN D2 D3 CRT DC_in +B CCRT BD83740HFP-M BD83740EFJ-M RCRT DISC FIN RPBUS PBUS GND Figure 1. Typical Application Circuit ○Product configuration: Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○ The product is not designed for radiation resistance. 1/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Pin Configurations (TOP VIEW) (TOP VIEW) VIN_F 1 8 IOUT VIN 2 7 CRT N.C. 3 6 DISC GND 4 5 PBUS EXP-PAD 1 2 3 4 5 6 7 PBUS DISC CRT GND IOUT VIN_F VIN EXP-PAD Figure 2. HRP7 Package Pin Configuration Figure 3. HTSOP-J8 Package Pin Configuration Pin Descriptions HRP7 Package HTSOP-J8 Package Pin No. Pin Name Error detection I/O 1 VIN_F DISC Discharge setting 2 VIN Power supply input 3 CRT PWM dimming timer setting 3 N.C. N.C. 4 GND GND 4 GND GND 5 IOUT Current output 5 PBUS Error detection I/O 6 VIN_F Output current detection 6 DISC Discharge setting 7 VIN Power supply input 7 CRT PWM dimming timer setting - EXP-PAD Connect to GND 8 IOUT Current output - EXP-PAD Pin No. Pin Name 1 PBUS 2 Function Function Output current detection Connect to GND Block Diagram IOUT VIN_F VIN VREF VREF VIN-0.180V (Typ) ON/OFF CRT OSC LED OPEN DET DISC PBUS VIN0.05V (Typ) GND PBUS Figure 4. Block Diagram www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Rating Unit VIN -0.3 to +50 V VVIN_F,VCRT,VDISC,VIOUT,VPBUS -0.3 to VIN+0.3 V Supply Voltage VIN_F,CRT,DISC,IOUT,PBUS Terminal Voltage Power Dissipation HRP7 2.29(Note1) HTSOP-J8 1.10(Note2) Pd W Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax 150 °C IOUT 500 mA Junction Temperature IOUT Output Maximum Current (Note1) (Note2) HRP7 Derate by 18.4mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board(70mm x 70mm x 1.6mm) 2 layer copper foil(15mm x 15mm)). HTSOP-J8 Derate by 8.8mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board(70mm x 70mm x 1.6mm) 2 layer copper foil(15mm x 15mm)). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Rating Unit Supply Voltage(Note1) VIN 4.5 to 42.0 V Operating Temperature Range Topr -40 to +125 °C RVIN_F 0.36 to 3.6 Ω C IOUT_MIN 0.1 μF CRTIMER Frequency Rage F PW M 100 to 5000 Hz PWM Minimum Pulse Width T MIN 20 µs Current Setting Resistor Minimum capacitor connecting IOUT terminal (Note1) Pd, ASO should not be exceeded www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Electrical Characteristics(Unless otherwise specified Ta=-40 to +125°C, VIN= 13V, RVIN_F=0.47Ω, RPBUS=10kΩ) Parameter Symbol Min Typ Max UNIT Condition Circuit Current IVIN - 2.1 6.0 mA IOUT Terminal Output Current Accuracy 373 383 393 mA Ta=25°C IOUT 364 383 402 mA Ta=-40°C to +125°C VIN – IOUT Drop Voltage VDR_IOUT - 0.45 1.0 V IOUT Terminal OFF Current IIOUT_OFF - - 1 μA VIN_F Terminal Voltage VIN_F_REF 0.171 0.180 0.189 V ＿RELEASE V IN -0.15 V IN -0.300 V IN -0.050 V IN -0.150 V IN -0.020 V IN -0.060 CRT Terminal Charge Current I CRT_SO 29.75 35.00 40.25 μA CRT Terminal Charge Voltage V CRT_CHA 0.990 1.10 1.21 V V CRT_DIS1 2.7 3.0 3.3 V V CRT_DIS2 3.6 4.0 4.4 V R CHA 51.6 54.3 57.0 kΩ R CHA =(V CRT_DIS1 － V CRT_CHA ) / I CRT_SO R D1 - 50.0 100 Ω V CRT =3.4V R D2 2.5 5.0 10 kΩ V CRT =5V V IH_PBUS 4.0 - V IN +0.20 V V IL_PBUS GND -0.20 - 2.0 V V OL_PBUS - - 1.5 V I PBUS =2mA I IN_PBUS - 38.0 100 μA V PBUS =13V V IN_ OVPMUTE 27 29 33 V IOUT Voltage at LED Open Detection IOUT Voltage at LED Open Detection Release CRT Terminal Discharge Voltage 1 CRT Terminal Discharge Voltage 2 CRT Terminal Charge Resistance DISC Terminal Discharge Resistance 1 DISC Terminal Discharge Resistance 2 PBUS Terminal Input Voltage High PBUS Terminal Input Voltage Low PBUS Terminal Low Voltage PBUS Terminal Input Current Overvoltage Mute VIOUT_OPEN VIOUT_OPEN I OUT =383mA V IOUT =2V, V CRT =0.7V Ta=25°C V IN_F_REF =V IN -V IN_F V V V CRT =0.9V R D1 R D2 ( Note1) V IOUT =6V (Note) This product is not designed for use in radioactive environments. (Note1) Refer to Functional Description www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Typical Performance Curves (Reference Data) (Unless otherwise specified Ta=25°C, VIN=VIN_F=13V) 500 450 400 IOUT[mA] 350 300 250 200 150 100 ΔIOUT=(IOUT/(0.18V/RVIN_F)-1)×100[%] 50 0 0.0 0.5 1.0 1.5 2.0 2.5 RVIN_F[Ω] 3.0 3.5 4.0 Figure 6. RVIN_F vs ΔIOUT 0.190 0.20 0.188 0.18 0.186 0.16 0.184 0.14 0.182 VIN_F_REF[V] VIN_F_REF[V] Figure 5. RVIN_F vs IOUT 0.180 0.178 0.176 0.12 0.10 0.08 0.06 0.174 0.04 0.172 0.02 0.170 -50 -25 0 25 50 75 Temp[°C] 0.00 100 125 150 0 20 30 40 50 VIN[V] Figure 8. VIN vs VIN_F_REF Figure 7. Temperature vs VIN_F_REF www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10 5/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 40 7.00 39 ICRT_SO[µA] 37 CCRT=0.033μF, RCRT=3.9kΩ (On-Duty 6.7% setting) 6.90 Ta=-40°C Ta=25°C Ta=125℃ PWM ON-Duty[%] 38 6.95 36 35 34 33 6.85 6.80 6.75 6.70 6.65 32 6.60 31 6.55 6.50 30 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 VCRT[V] Figure 9. VCRT vs ICRT_SO (VCRT:CRT Terminal Voltage) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 -25 0 25 50 75 Temp[°C] 100 125 150 Figure 10. Temperature vs PWM ON Duty 6/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Functional Description (Unless otherwise specified, Ta=25°C, VIN=13V, IOUT=6V and RVIN_F=0.47Ω. Numbers are "Typical" values.) 1. Output Current Setting LED Current IOUT can be set as below depending on values of current setting resistance RVIN_F. IOUT  (VIN VIN_F) VIN_F_REF  [A] RVIN_F RVIN_F where: VIN_F_REF is 0.18V (Typ) RVIN_F IOUT VIN_F IOUT CIOUT PWM_in VIN VREF VIN-0.180V (Typ) +B GND Figure 11. Output Current Setting 2. Table of Operations PWM dimming mode switches to linear control depending on CRT terminal voltage. When CRT terminal voltage surpasses VCRT_DIS2 (4.0V(Typ)), Dimming mode turns to Linear Control, and discharge resistance of DISC terminal changes from RD1(50Ω(Typ)) to RD2(5kΩ(Typ)). LED open detection is activated depending on IOUT terminal voltage status, and output current is turned OFF. Output current is also turned OFF when Low signal is input to PBUS terminal. Operation Mode CRT Terminal IOUT Terminal Voltage (VIOUT) Output Current (IOUT) PBUS Terminal Linear Control 4.0V(Typ)≤VCRT - 50mA to 500mA Hi-Z PWM dimming See Features Description, 3. PWM Dimming Operation - See Features Description, 3 PWM Dimming Operation Hi-Z LED Open - VIOUT ≥ VIN - 0.050V(Typ) 1μA(Max) Low Output PBUS Control OFF - - 1μA(Max) Low Input www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 3. PWM Dimming Operation PWM Dimming is performed if CRT terminal is the following circuit. Dimming cycle and Duty width can be set through external resistance value and capacity. CR timer function in IC is activated if DC_in is OPEN. In order to perform PWM light control of LED current, triangular waveform is generated at CRT terminal. Output is controlled so that LED current is turned OFF while CRT voltage is ramping up, and LED current is turned ON while CRT voltage is ramping down. Ramp up/down time of CRT voltage can be set by values of external components (CCRT, RCRT). VIN_F IOUT IOUT PWM_in VIN VREF DC_in ICRT=35µA(Typ) ON/OFF +B VIN-0.180V (Typ) OSC CRT CCRT RCRT DISC GND 50Ω(Typ) CRT Voltage Ramp-up CRT電圧立上り VCRT_DIS1 CRT Voltage Ramp-down CRT電圧立下り 3.0V CRT CRT Terminal 端子波形 Waveform ΔVCRT VCRT_CHA 1.1V T1 (1) T1 = T2 ΔVCRT × CCRT (2) T2 = － CCRT × (RCRT + RD1 ) × ln ( ICRT_SO VCRT_CHA VCRT_DIS1 ) IOUT IOUT Waveform IOUT 波形 0 LED OFF LED ON Figure 12. PWM Dimming Operation (1) CRT Ramp up Time T1 CRT ramp up time can be obtained from the following equations: T1  ΔVCRT  CCRT  RCHA  CCRT [s] ICRT_SO where: ICRT_SO is the CRT Terminal Charge Current 35μA (Typ) RCHA is the CRT Terminal Charge Resistance 54.3kΩ(Typ) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M (2) CRT Ramp down Time T2 CRT ramp down time is defined by discharge period due to external capacity CCRT and resistance (RCRT + RD1). (CRT Terminal Charge Current is OFF at CRT ramp down) Make sure that T2 is set at not smaller than Min. pulse width 20μs(Min).  VCRT_CHA  T2  CCRT  ( RCRT  RD1)  ln   [s]  VCRT_DIS1 where: RD1 is the CRT Terminal Discharge Resistance 1 50Ω (Typ) VCRT_CHA is the CRT Terminal Charge ON Voltage 1.1V (Typ) VCRT_DIS1 is the CRT Terminal Discharge ON Voltage 3.0V (Typ) (3) Dimming Frequency fPWM PWM frequency is defined by T1 and T2. f PWM  (4) 1 T1 T 2 [Hz] ON Duty (DON) Like the above, PWM ON duty is defined by T1 and T2. DON  T2 T 1 T 2 (Ex) In case of fPWM = 518Hz and 6.7% Duty (Typ), From fPWM=518Hz; T1 + T2 = 1 / fPWM = 1 / 518Hz = 1931μs From ON Duty = 6.7%; CRT ramp up time T1 is T1 = (T1 + T2) × 0.933 = 1801.6μs External capacity CCRT is; CCRT = T1 × (ICRT / ΔVCRT) = 1801.6μs × 35μA / 1.9V ≒ 0.033μF CRT ramp down time T2 is; T2 = (T1 + T2) × 0.067 = 129μs External resistance RCRT is; RCRT = －T2 / (CCRT × ln(VCRT_CHA / VCRT_DIS)) － RD1 = －129μsec / (0.033μF × ln(1.1 / 3.0)) – 50Ω ≒ 3.9kΩ In case where PWM signal is applied from external; It is possible to directly input PWM signal from external microcomputer for Dimming. Input PWM signal to CRT terminal. In that case, ’High’ level voltage of PWM signal should be equal to or higher than VCRT_DIS2( 4.4V(Max)) and ’Low’ level voltage of PWM signal should be equal to or less than VCRT_CHA(0.99V(Min)). +B VIN_F IOUT VIN VREF VIN-0.180V (Typ) OSC CRT GND PWM Signal Input Figure 13. External Input of PWM Signal www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 4. LED Setting Range Number of LED connections N should meet the following conditions: Vf_led × N ≤ +B – Vf_diode –VIN_F_REF –VDR_IOUT where: +B is the Battery Voltage Vf_diode is the Reverse Connection Preventing Diode Vf VIN_F_REF is the VIN_F Terminal Voltage (VIN – VIN_F) VDR_IOUT is the IOUT Terminal Drop Voltage Vf_led is the LED Vf N is the Number of LED Levels Ex) If you want to supply constant current to LED at 9V or higher Battery Voltage (+B) (Supposing that V f_diode is 0.5V), Vf_led × N ≤ +B – Vf_diode － VIN_F_REF － VDR_IOUT = 9V –0.5V –0.189V(Max) – 1.0V(Max) = 7.311V (Sum of Vf of LED connected to IOUT terminal is set to be 7.311V Max.) VIN_F_REF Vf_diode IOUT D1 RVIN_F VIN_F IOUT PWM_in ZD1 CVIN VIN CIOUT D2 Vf_led × N D3 BD83740HFP-M BD83740EFJ-M CRT DC_in +B CCRT RCRT DISC RPBUS PBUS GND Figure 14. LED Setting Range Schematic 5. Overvoltage Mute If 29V (Typ) ≤ VIN, Overvoltage Mute is activated to restrict output current in order to suppress heat generated from IC. IOUT attenuates by 3.2%/V(Typ). Iomax IIOUT -3.2%/V 0V 13V Output current is muted by power supply overvoltage 29V 50V VIN Figure 15. Overvoltage Mute Performance www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 6. Detective Function In this IC integrated is a function for Detection from LED open, and it is possible to detect abnormal condition at PBUS terminal. (1) LED Open Detective Function In case where LED connected to IOUT terminal is opened, it is detected due to overvoltage of IOUT terminal. During the detection, PBUS terminal is switched to Low to notify the trouble. VIN_F IOUT VIN Current Control VREF PBUS VIN-0.05V (Typ) PBUS - OPEN + GND Figure 16. LED Open Detection www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M (2) About Active zone of LED Open Detective Function and IOUT Terminal Hi-Z zone Active zone of LED Open Detective Function is different from Linear Control Mode and PWM dimming Mode.(Refer to Figure16.) Linear Control Mode ：Function is active at All zone. PWM dimming Mode ：LED Open Detective Function is active only Fall time of VCRT. (In case LED open is detected during rise time of VCRT, PBUS keeps high until next lighting (output) timing. When output becomes ON, PBUS becomes low (open detect). There is IOUT Terminal Hi-Z zone at PWM dimming Mode. To prevent fluctuation of IOUT terminal voltage by noise(Note1), It is necessary to connect Capacitor(more than 0.1μF(Note2)) between IOUT terminal and GND terminal nearby terminal (ROHM Recommended Value : CIOUT=0.1μF GCM188R11H104KA42 murata) (Note1) Conducted noise, Radiated noise, Interference of connecter and PCB pattern etc… (Note2) If connect more than 0.1μF, please evaluate the time of VIN on to IIOUT on. Linear Control Mode PWM dimming Mode VIN VIN 0V 0V VCRT VCRT 0V VIOUT VIOUT 0V 0V IIOUT IIOUT 0mA 0mA IOUT Terminal Hi-Z zone None IOUT Terminal Hi-Z zone LED Open Detective Function Active LED Open Detective Function Figure 17. Hi-Z Hi-Z Active Hi-Z Active Active About Active zone of LED Open Detective Function and IOUT Terminal Hi-Z zone D1 RVIN_F VIN_F IOUT PWM_in ZD1 CVIN VIN CIOUT D2 D3 CRT DC_in +B CCRT BD83740HFP-M BD83740EFJ-M RCRT DISC RPBUS PBUS Figure 18. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 GND About the capacitor of connecting IOUT terminal 12/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Evaluation example(IIOUT pulse width at PWM Dimming operation) Condition：+B=13V Ta=25°C LED 3Strings RCRT=560Ω CCRT=0.033μF PWM Dimming Mode CIOUT=0.1μF RVIN_F=3.6Ω (IIOUT=50mA) RVIN_F=0.91Ω (IIOUT=198mA) CIOUT=0.47μF VCRT (1.0V/div) VCRT (1.0V/div) VIOUT (2.0V/div) VIOUT (2.0V/div) IIOUT (20mA/div) IIOUT (20mA/div) VCRT (1.0V/div) VCRT (1.0V/div) VIOUT (2.0V/div) VIOUT (2.0V/div) IIOUT (50mA/div) IIOUT (50mA/div) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 7. PBUS Function PBUS terminal is an input/output terminal for outputting trouble and inputting trouble detection. In case where a trouble occurred due to LED open, it is possible to notify the trouble outside by switching PBUS terminal output from High (Note1) to Low. It is possible to turn OFF output current by externally controlling PBUS from High→Low. (Note1) PBUS terminal is an open drain terminal. Even when used separately, please be pulled up(10kΩ) to power supply voltage. In case where you use multiple number of this LSI to drive multiple LEDs, as shown in the drawing below, it is possible to turn off all rows of LEDs even if some LEDs are opened by connecting PBUS terminal of each CH. VIN VIN VIN_F CRT LED OPEN IOUT CH1 PBUS IOUT CH2 LED OFF CRT IOUT CH3 Trouble 異常発生 GND OPEN LED OFF PBUS GND PBUS Hi-Z ⇒Low CRT VIN_F PBUS GND +B VIN VIN_F Occurs PROTECT　BUS 一括してLED OFF制御が可能 Possible to turn OFF all LEDs 各CHのPBUSを接続する Connect PBUS of each CH Figure 19. PBUS Function ▼Example of Protective Operation by LED Open LED Open LEDオープン Connect PBUS of each CH VIN VIOUT_OPEN VIOUT Output voltage is brought up ①LEDオープンになることで when LED Open occurs. 出力電圧が持ち上がる GND CH1 IOUT IOUT ②LED電流がOFFする LED current turns OFF. OFF VPBUS Hi-Z Hi-z Low  PBUS output become Low. ③PBUSがLow出力となる Low Clamp to 1.4V OFF時は1.4Vに during OFF クランプする VIOUT  Turns OFF LED current of ④他CHのLED電流をOFFする other CH. GND CH2 IOUT IOUT OFF Clamp to 1.4V OFF時は1.4Vに during OFF クランプする VIOUT GND CH3 IOUT IOUT OFF Figure 20. Example of Protective Operation If LED OPEN occurs, PBUS of CH1 is switched from Hi-z to Low output. As PBUS becomes Low, LED drivers of other CH detect the trouble and turns OFF their own LEDs. VIOUT clamps to 1.4V (Typ) during the OFF period, in order to prohibit ground fault detection. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M 8. Caution of driving IC used multi-power supply Each Input terminal is built- in ESD protection diodes. (Refer to I/O equivalence circuits) If VIN terminal is not supplied voltage and Input terminal (without VIN) is supplied voltage, IC may occur malfunction(abnormal operation mode, abnormal LED lighting ) due to arise VIN terminal voltage . The Application Example of accidental operation is below. H TAIL L TAIL STOP VIN VIN L VIN_F STOP A B CRT PBUS DISC PBUS GND GND VIN (B) VPBUS (B) VCRT (B) VIN (A) GND H L H L H L H L ⇒Due to Voltage arises VIN(A), CRT(B) is not triangle wave output Figure 21. Application Example (Operational Explanation) Only input Tail : Arise VIN terminal voltage of IC A from ESD protection Diode between VIN terminal and PBUS terminal of IC A. Due to connect VIN terminal of IC A and CRT terminal of IC B across Diode, DC voltage inputs CRT terminal of IC B, so it is possible to operate ICB DC mode. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Timing Chart IOUT VIN_F PWM_in VIN VREF VREF VIN-0.180V (Typ) ON/OFF CRT DC_in OSC LED OPEN DET B+ DISC PBUS VIN0.05V (Typ) FIN GND PBUS LED OPEN LED OPEN PWM_in DC_in ON OFF ON OFF VCRT VIOUT IOUT VPBUS ① ③ ① ② ③ Figure 22. Timing Chart  If PWM_in is switched ON, VCRT will start oscillation, and according to its waveform LED current I OUT is output. (PWM light control mode)  If DC_in is switched ON, VCRT will be fixed at High (VIN-Vf). LED current IOUT will be continuously output. (Linear control mode)  If LED becomes OPEN, LED current IOUT will stop. At the same time, VPBUS falls to Low. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Guaranteed Range of Current Accuracy and LED Open Detection Range Guaranteed range of current accuracy and LED open detection range can be obtained from the following equation: PBUS output becomes Low if IOUT terminal output (VIOUT) is higher than the LED open detection range during power ON/OFF. Therefore, pay attention to respective setting range during power ON/OFF, and consider operating voltage range of the set. Guaranteed Range of Current Accuracy VIN ≥ Vf_led × N + VIN_F_REF + VDR_IOUT [V] Where: VIN is the VIN Terminal Voltage Vf_led is the LED Vf N is the: Number of LED Levels VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F) VDR_IOUT is the IOUT Terminal Drop Voltage LED Open Detection Voltage VIOUT = VIN - 50mV(Typ) LED Open Detection Release Voltage VIOUT = VIN - 150mV(Typ) VIN > Vf_led × N + VIN_F_REF + VDR_IOUT VIN Guaranteed Range of current accuracy VIOUT < VIN -150mV(Typ) LED Open Detection Area VIOUT VIN VIOUT_OPEN VIOUT_OPEN_RELEASE VIOUT < VIN -50mV(Typ) LED Open Detection Area VIOUT ILED VPBUS PBUS Low Output High(Hi-Z) PBUS Low Output Low Figure 23. Guaranteed Range of Current Accuracy and LED Open Detection Range www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M How to Connect LED In case of connected LED to IOUT terminal as shown in the following, note that protective detection becomes possible/impossible depending on connection patterns. IOUT IOUT IOUT 1st Level ・・・ ・・・ 2nd Level 3rd Level 2nd Row 1st Row (1 series) Nth Row (2 or more parallels) (2 parallels or more, matrix connection) Figure 24. LED Connection Patterns (Note1) (Note2) Connection Pattern LED OPEN detection 1 Series Detectable 2 parallels or more Non-detectable (Note 1) 2 parallels or more (Matrix Connection) Non-detectable (Note 2) : Detectable only when one or more LEDs become open in all rows. : Detectable only when all LEDs on the same level become open. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Recommended Application Circuit D1 RVIN_F VIN_F IOUT PWM_in ZD1 CVIN VIN CIOUT D2 D3 CRT DC_in +B CCRT BD83740HFP-M BD83740EFJ-M RCRT DISC FIN RPBUS PBUS GND Figure 25. Recommended Application Circuit ▼Corresponding EMC Test Items ・ISO11452-2 ・ISO11452-4 ・ISO7637-2 (pulse1, pulse 2a,2b, pulse 3a,3b) No. 1 2 3 4 5 6 7 8 9 10 Component Name Component Value Product Name Company D1 RFN1L6S ROHM RFN1L6S ROHM RFN1L6S ROHM ZD1 - TNR12H-220K NIPPON CHEMICON CVIN 4.7µF GCM32ER71H475KA40 murata RVIN_F 0.91Ω MCR10 Series ROHM RPBUS 10kΩ MCR03 Series ROHM CCRT 0.033µF GCM188R11H333KA40 murata RCRT 3.9kΩ MCR03 Series ROHM CIOUT 0.1µF GCM188R11H104KA42 murata D2 D3 Table 1. PWM_in DC_in Low Low Mode OFF High Low Low High PWM Dimming Mode (Note1,Note2) (13.25mA 6.7% ON duty@518Hz) Linear Control Mode (Note2) (197.8mA 100% ON duty) High Linear Control Mode (Note2) (197.8mA 100% ON duty) High BOM List 197.8mA peak current 6.7% ON Duty (Note1) See Functional Description "3. PWM Dimming Operation." (Note2) See Functional Description "2. Table of Operations." Table 2. Table of Operations www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 26. Example of Waveform Measurement 19/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Thermal Loss VIN_F_REF Vf_diode IOUT D1 RVIN_F VIN_F IOUT PWM_in ZD1 CVIN VIN CIOUT D2 Vf_led × N D3 CRT DC_in +B CCRT BD83740HFP-M BD83740EFJ-M RCRT DISC FIN RPBUS PBUS GND Figure 27. Application Circuit Diagram for Thermal Description Thermal design should meet the following equation: Pd > Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N)×IOUT + IVIN×VIN Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc) where: Pd is the Power Dissipation Pc is the Power Consumption +B is the Battery Voltage Vf_diode is the Reverse Connection Preventing Diode Vf VIN_F_REF is the VIN_F Terminal Voltage (VIN-VIN_F) Vf_led is the LED Vf N is the Number of LED Levels IOUT is the Output Current IVIN is the Circuit Current VIN is the Power Supply Voltage θja is the Thermal Resistance between Tj and Ta θjc is the Thermal Resistance between Tj and Tc Tjmax is the Max Joint Temperature (150°C) Ta is the Ambient Temperature Tc is the Case Surface Temperature www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M HRP7 Package 5.0 2 layer copper foil 50mm x 50mm θja = 30℃/W 4.16W Power dissipation Pd [W] 4.0 2 layer copper foil 15mm x 15mm θja = 54.4℃/W 1 layer θja = 78.1℃/W 3.0 2.3W 2.0 1.6W 1.0 0.0 0 25 50 75 100 125 150 Temp Ta [℃] HTSOP-J8 Package 2.0 2 layer copper foil 50mm x 50mm θja = 69℃/W Power dissipation Pd [W] 1.81W 2 layer copper foil 15mm x 15mm θja = 113.6℃/W 1 layer θja = 153.2℃/W 1.1W 1.0 0.82W 0.0 0 25 50 75 100 125 150 Temp Ta [℃] (Caution1) (Caution2) (Caution3) When mounted with 70.0mm X 70.0mm X 1.6mm glass epoxy substrate. Above copper foil area indicates backside copper foil area. Value changes according to number of substrate layers and copper foil area. Note that this value is a measured value, not a guaranteed value. Figure 28. Thermal Dissipation Curve www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Thermal Design for Few Number of LED Lamps If there are few LED lamps, insert resistance between IOUT terminal and LED to reduce heat generation from IC and dissipate heat. (This does not apply where amperage is low.) In that case, note that guaranteed range of current accuracy will be as shown in the following equation: +B ≥ Vf_diode + Vf_led × N + VIN_F_REF + VDR_IOUT +IOUT×R1 Vf_diode is the Reverse Connection Preventing Diode Vf Vf_led is the LED Vf N is the Number of LED Levels VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F) VDR_IOUT is the IOUT Terminal Drop Voltage IOUT is the Output Current R1 is the Thermal Dissipation Resistance Thermal design should meet the following equation when inserting thermal dissipation resistance: Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc) Pd > Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N – IOUT × R1)×IOUT + IVIN×VIN Pd is the Power Dissipation Pc is the Power Consumption +B is the Battery Voltage Vf_diode is the Reverse Connection Preventing Diode Vf VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F) Vf_led is the LED Vf N is the Number of LED Levels IOUT is the Output Current R1 is the Thermal Dissipation Resistance IVIN is the Circuit Current VIN is the Power Supply Voltage θja is the Thermal Resistance between Tj and Ta θjc is the Thermal Resistance between Tj and Tc Tjmax is the Max Joint Temperature (150°C) Ta is the Ambient Temperature Tc is the Case Surface Temperature VIN_F_REF Vf_diode Thermal Dissipation Resistance IOUT D1 RVIN_F R1 VIN_F IOUT PWM_in ZD1 CVIN VIN CIOUT D2 D3 CRT DC_in +B CCRT BD83740HFP-M BD83740EFJ-M RCRT Vf_led × N DISC RPBUS PBUS GND Figure 29. Example of How to Connect Thermal Dissipation Resistance www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M I/O equivalence circuits (HRP7 Package) Number Terminal Name Equivalence Circuit VIN (7pin) 1 5V(Typ) 200kΩ(Typ) PBUS (1pin) PBUS GND (4pin) VIN (7pin) 2 DISC (2pin) DISC RD1= 50Ω(Typ) RD2= 5kΩ(Typ) GND (4pin) 5V(Typ) VIN (7pin） 5V(Typ) 5V(Typ) 10kΩ (Typ) 3 CRT CRT (3pin） GND (4pin） 4 40kΩ (Typ) GND VIN (7pin) 5 5V(Typ) IOUT VIN_F (6pin) 10kΩ (Typ) IOUT (5pin) 6 VIN_F 200kΩ (Typ) GND (4pin) 7 VIN www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 - 23/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Operational Notes – continued 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 30. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Ordering Information B D 8 3 7 4 0 H F P - Package HFP:HRP7 B D 8 3 7 4 0 E F Package EFJ:HTSOP-J8 MTR Packaging and forming specification M: High Reliability Design TR: Embossed tape and reel (HRP7) J - ME2 Packaging and forming specification M: High Reliability Design E2: Embossed tape and reel (HTSOP-J8) Marking Diagrams HRP7 (TOP VIEW) Part Number Marking BD83740HFP LOT Number Pin 1 Mark HTSOP-J8(TOP VIEW) Part Number Marking D 8 3 7 4 0 LOT Number Pin 1 Mark www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Physical Dimension, Tape and Reel Information(BD83740HFP-M) Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HRP7 27/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Physical Dimension, Tape and Reel Information(BD83740EFJ-M) Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSOP-J8 28/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 BD83740HFP-M BD83740EFJ-M Revision History Date Revision 25.Feb.2015 06.Sep.2016 001 002 Changes New Release Page 8 PWM Dimming Operation Figure11 Line4 CRT -> DC_in Page 9 Line19 1800.7μs -> 801.6μs Line23 －129μsec / 0.033μF × ln(1.1 / 3.0) – 50Ω -> －129μsec / (0.033μF × ln(1.1 / 3.0)) – 50Ω Page 16 Figure21 revise Page 19 D1,D2,D3 Product Name RF201L2S -> RFN1L6S Page 22 Line16 Pd > Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N – IOUT × R1)×IOUT + IVIN×VIN Page 23 27.Apr.2018 003 I/O equivalence circuits CRT Add revise Add data of BD83740EFJ-M www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/29 TSZ02201-0T3T0B300170-1-2 27.Apr.2018 Rev.003 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001