Datasheet
Serial-in Parallel-out LED Driver
12ch LED Driver IC
with 3-line Serial Interface
BD8379FV-M
General Description
Key Specifications
The BD8379FV-M is a serial-in parallel-out controlled
LED driver with 35V output voltage rating.
With the input of 3-line serial data, it turns the 12ch
open drain output on/off.
Due to its compact size, it is optimal for small space.
Features
Open Drain Output.
3-line Serial Control + Enable Signal.
Cascade Connection Compatible.
SSOP-B20 Package.
Internal 12ch Power Transistor.
Output Slew Rate Typical 20V/μs
(for Low EMC Noise).
AEC-Q100 Qualified.
Input voltage range:
Output voltage range:
DC Output Current (per CH):
Output ON Resistance:
Standby current:
Operating temperature range:
Package
SSOP-B20
3.0V to 5.5V
35V (Max.)
50mA(Max.)
6Ω(Typ.)
0μA (Typ.)
-40℃ to +105℃
W(Typ.) x D(Typ.) x H(Max.)
6.50mm x 6.40mm x 1.45mm
Applications
For indicator of Cluster Panel.
SSOP-B20
Typical Application Circuit
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Pin Configurations
Pin Descriptions
Pin No.
Symbol
1
VCC
2
SERIN
3
D0
Drain output 0
4
D1
Drain output 1
5
D2
Drain output 2
6
D3
Drain output 3
7
D4
Drain output 4
8
D5
Drain output 5
Serial data input
9
RST_B
Reset invert input (Low:FF data 0)
10
OEN_B
Output enable (High:Output OFF)
11
Figure 2. Pin Configuration
Function
Power supply voltage input
SEROUT Serial data output
12
LATCH
Latch signal input (High:Data latch)
13
D6
Drain output 6
14
D7
Drain output 7
15
D8
Drain output 8
16
D9
Drain output 9
17
D10
Drain output 10
18
D11
Drain output 11
19
CLK
Clock input
20
GND
GND
Block Diagram
VCC
D0
D1
CLK
D2
Latch & Control Logic
Shift Register
SERIN
SEROUT
LATCH
D3
D4
D5
D6
D7
RST_B
D8
OEN_B
D9
D10
D11
GND
Figure 3. Block Diagram
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Absolute Maximum Ratings
Item
Symbol
Value
Unit
VCC
7
V
VDmax
35
V
Input Voltage
VIN
-0.3 to VCC
V
Power Dissipation
Pd
940 *1
mW
Operating Temperature Range
Topr
-40 to +105
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Drive Current (DC)
IomaxD
50
mA
Drive Current (Pulse)
IomaxP
150 *2
mA
Junction Temperature
Tjmax
150
℃
Power Supply Voltage
Output Voltage
*1
Pd decreased at 7.5mW/℃ for temperatures above Ta=25℃, mounted on 70x70x1.6mm Glass-epoxy PCB.
*2
Do not however exceed Pd. Time to impress ≦ 200msec.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Ratings
Item
Symbol
Value
Unit
Power Supply Voltage
VCC
3.0 to 5.5
V
Operational Temperature
Topr
-40 to 105
℃
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Electrical Characteristics
(Unless specified, Ta=-40 to 105℃ VCC=3.0 to 5.5V)
Standard Value
Item
Symbol
Min
Typ
Max
Unit
Condition
【Output D0～D11】(Pin 3～8, Pin 13～18)
ON Resistor1
RON1
-
6
12
Ω
ID=20mA,VCC=4.5 to 5.5V
ON Resistor2
RON2
-
9
18
Ω
ID=20mA,VCC=3.0 to 4.5V
IDL1
-
-
0.3
μA
VD=34V, Ta=-40~125℃
-
-
V
VCC=4.5 to 5.5V
-
-
V
VCC=3.0 to 4.5V
V
VCC=4.5 to 5.5V
V
VCC=3.0 to 4.5V
VCC=5.0, OEN_B PIN
Output leakage current1
【Logic input】(Pin 2,9,10,12,19)
Upper limit threshold voltage1
VTH1
Upper limit threshold voltage2
VTH2
VCC
×0.5
VCC
×0.6
Bottom limit threshold voltage1
VTL1
-
-
Bottom limit threshold voltage2
VTL2
-
-
VCC
×0.2
VCC
×0.3
OEN_B Hysteresis width
VHYS
0.15
0.30
0.50
V
Serial clock frequency
FCLK
-
-
1.25
MHz
Input leakage Current L
IINLL
-5
0
-
μA
VIN=0V
Input leakage Current H
IINLH
-
0
5
μA
VIN=5V
【WHOLE】
Circuit Current
ICC
-
0.05
1
mA
Serial Data Input,
VCC=5V, CLK=500KHz,
VTH=VCC, VTL=0V
SEROUT=OPEN
Static Current
ISTN
-
0
50
μA
SEROUT=OPEN
Output Voltage High1
VOH1
4.6
4.8
-
V
VCC=5V,ISO=-4mA
Output Voltage Low1
VOL1
-
0.2
0.4
V
VCC=5V,ISO=4mA
Output Voltage High2
VOH2
2.7
3.0
-
V
VCC=3.3V,ISO=-4mA
Output Voltage Low2
VOL2
-
0.3
0.6
V
VCC=3.3V,ISO=4mA
【SEROUT】(Pin 11)
* This product is not designed for protection against radioactive rays.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
4/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Reference data (unless otherwise specified, Ta=25℃)
100
105℃
80
SUPPLY CURRENT : ICC[μA]
SUPPLY CURRENT：ICC[μA]
100
25℃
105℃
-40℃
60
25℃
-40℃
40
20
80
5.5V
60
5.0V
40
4.5V
20
3.6V
3.3V
3.0V
0
0
0
1
2
3
4
SUPPLY VOLTAGE：VCC[V]
5
-40
Figure 4. Circuit current
(VCC characteristic)
Figure 5. Circuit current
(Temperature characteristic)
12
10
OUTPUT ON RESISTANCE ： RON [Ω]
12
OUTPUT ON RESISTANCE ：RON [Ω]
-15
10
35
60
85
AMBIENT TEMPERATURE ： Ta [℃ ]
105℃
8
25℃
6
-40℃
4
2
0
3.0V
3.3V
3.6V
10
8
6
4.5V
5.0V
5.5V
4
2
0
3.0
3.5
4.0
4.5
5.0
SUPPLY VOLTAGE ： VCC[V]
5.5
-40
Figure 6. Output ON resistance
(VCC characteristic @ ID=20mA)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-15
10
35
60
85
AMBIENT TEMPERATURE ： Ta [℃ ]
Figure 7. Output ON resistance
(Temperature characteristic @ ID=20mA)
5/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
400
6.0
350
5.5
300
OUTPUT VOLTAGE ： VOH [V]
OUTPUT VOLTAGE ： VOUT [mV]
BD8379FV-M
3.0V
3.3V
3.6V
250
200
4.5V
5.0V
5.5V
150
100
5.0
-40℃
25℃
4.5
105℃
4.0
3.5
3.0
2.5
50
2.0
0
10
20
30
40
INPUT CURRENT ： ID [m A]
3.0
50
5.5
Figure 9. SEROUT high side voltage
(VCC characteristic @ ISO=-4mA)
Figure 8. Output ON resistance
(ID characteristic)
0.30
5.5
5.5V
5.0
5.0V
4.5
4.5V
4.0
3.6V
3.5
3.3V
3.0
OUTPUT VOLTAGE ： VOL [V]
OUTPUT VOLTAGE ： VOH [V]
3.5
4.0
4.5
5.0
SUPPLY VOLTAGE ： VCC[V]
0.25
0.20
105℃
0.15
25℃
-40℃
0.10
0.05
3.0V
0.00
2.5
-40
3.0
-15
10
35
60
85
AMBIENT TEMPERATURE ： Ta [℃ ]
5.5
Figure 11. SEROUT low side voltage
(VCC characteristic @ ISO=4mA)
Figure 10. SEROUT high side voltage
(Temperature characteristic @ ISO=-4mA)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3.5
4.0
4.5
5.0
SUPPLY VOLTAGE ： VCC[V]
6/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
OUTPUT VOLTAGE ： VOL [V]
0.30
0.25
3.0V
3.3V
3.6V
0.20
0.15
4.5V
5.0V
5.5V
0.10
0.05
0.00
-40
-15
10
35
60
85
AMBIENT TEMPERATURE ： Ta [℃ ]
Figure 12. SEROUT low side voltage
(Temperature characteristic @ ISO=4mA)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Serial Communication
The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a register to
store those signals with a LATCH signal. The registers are reset by applying a voltage below VTL to the RST_B terminal, and
D11 to D0 become open. To prevent erroneous LED lighting, please apply voltage below VTL to RST_B during start-up.
Figure 13. Block Diagram of Serial Communication
1）Serial Communication Timing
The 12-bit serial data input from SERIN is taken into the shift register by the rising edge of the CLK signal, and is
recorded in the register by the rising edge of the LATCH signal. The recorded data is valid until the next rising edge of
the LATCH signal.
2）Serial Communication Data
The serial data input configuration of SERIN terminal is shown below:
First →
d11 d10 d9
d8
d7
d6
d5
→Last
d4
d3
d2
d1
d0
Data
Terminal
D11
D10
D9
D8
…
D3
D2
D1
D0
Output
Condition d11 d10 d9
Data
d8
d7
d6
d5
d4
d3
d2
d1
d0
ON
1
*
*
*
*
*
*
*
*
*
*
*
OFF
0
*
*
*
*
*
*
*
*
*
*
*
ON
*
1
*
*
*
*
*
*
*
*
*
*
OFF
*
0
*
*
*
*
*
*
*
*
*
*
ON
*
*
1
*
*
*
*
*
*
*
*
*
OFF
*
*
0
*
*
*
*
*
*
*
*
*
ON
*
*
*
1
*
*
*
*
*
*
*
*
OFF
*
*
*
0
*
*
*
*
*
*
*
*
…
…
…
…
…
…
…
…
…
…
…
…
…
ON
*
*
*
*
*
*
*
*
1
*
*
*
OFF
*
*
*
*
*
*
*
*
0
*
*
*
ON
*
*
*
*
*
*
*
*
*
1
*
*
OFF
*
*
*
*
*
*
*
*
*
0
*
*
ON
*
*
*
*
*
*
*
*
*
*
1
*
OFF
*
*
*
*
*
*
*
*
*
*
0
*
ON
*
*
*
*
*
*
*
*
*
*
*
1
*
*
*
*
*
*
*
*
*
*
*
0
OFF
* indicate Don’t care
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
3）Enable Signal
By applying voltage at least VTH or more to the OEN_B terminal, D11 to D0 become open forcibly.
D11 to D0 become PWM operation by having the PWM signal to the OEN_B terminal.
OEN_B
L
VIH
H
VIL
(Input)
D11 to D0
VBAT
LED OFF
(Output)
LED ON
ILED
LED ON
VOL
LED OFF
OFF
Figure 14. PWM Signal
4）SEROUT
A cascade connection can be made (connecting at least 2 or more IC’s in serial).
Serial signal input from SERIN is transferred into receiver IC by the falling edge of the CLK signal.
Since this functionality gives enough margins for the setup time prior to the rising edge of the CLK signal on the receiver IC
(using the exact same CLK signal of sender IC), the application reliability can be improved as cascade connection
functionality.
Figure 15. SEROUT Output Signal
Cascade Connection
By using (at least) 2 ICs, each IC’s D11 to D0, at (at least) 24ch, can be controlled by the 24-bit SERIN signal.
The serial data input to the sender IC can be transferred to the receiver IC by inputting 12 CLK to the CLK terminal.
Figure 16. Cascade Connection
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
9/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
INPUT SIGNAL’S TIMING CHART
TCK
50%
CLK
TCKH
TSEST
TCKL
TSEHD
50%
SERIN
TLADZ
TSEW
TLAH
50%
LATCH
Figure 17. Timing Chart of Input Signal
INPUT SIGNAL’S TIMING RULE（Ta=-40 to 105℃ VCC=3.0 to 5.5V）
Parameter
Symbol
Min
Unit
TCK
800
ns
CLK high pulse width
TCKH
380
ns
CLK low pulse width
TCKL
380
ns
SERIN high and low pulse width
TSEW
780
ns
SERIN setup time prior to CLK rise
TSEST
150
ns
SERIN hold time after CLK rise
TSEHD
150
ns
TLAH
380
ns
TLADZ
200
ns
CLK period
LATCH high pulse time
Last CLK rise to LATCH rise
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
OUTPUT SIGNAL’S DELAY CHART
Figure 18. Delay Chart of Output Signal
OUTPUT SIGNAL’S DELAY TIME（Ta=-40 to 105
Parameter
VCC=3.0 to 5.5V）
Symbol
Min.
Typ.
Max.
Unit
OEN_B Switching Time (L→H)
TDOENH
-
-
3000
ns
OEN_B Switching Time (H→L)
TDOENL
-
-
2000
ns
LATCH Switching Delay Time
TDLAH
-
-
3000
ns
SEROUT Propagation Delay Time (L→H)
TDSOH
-
-
350
ns
SEROUT Propagation Delay Time (H→L)
TDSOL
-
-
350
ns
Rising Slew Rate
SRRISE
-
20
-
V/μs
Falling Slew Rate
SRFALL
-
20
-
V/μs
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/16
Condition
Ta=25℃,VCC=5V,
RL=500Ω,VBAT=10V
Ta=25℃,VCC=5V,
RL=500Ω,VBAT=10V
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Power dissipation Pd [W]
Power Dissipation
Note 1 : Power dissipation calculated when mounted on 70mm X 70mm X 1.6mm glass epoxy substrate.
Note 2 : Power dissipation changes with copper foil density of the board. This value represents only observed values, not guaranteed
values.
Figure 19. SSOP-B20 Power Dissipation
I/O equivalence circuits
2PIN (SERIN)
9PIN (RST_B)
10PIN (OEN_B)
12PIN (LATCH)
19PIN (CLK)
3PIN (D0), 4PIN (D1), 5PIN (D2),
6PIN (D3), 7PIN (D4), 8PIN (D5),
13PIN (D6), 14PIN (D7), 15PIN (D8),
16PIN (D9), 17PIN (D10), 18PIN (D11)
VCC
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11PIN (SEROUT)
VCC
12/16
VCC
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
Ordering Information
B
D
8
3
7
9
F
V
ME2
Package
FV : SSOP-B20
Part Number
Packaging and forming specification
M: High reliability
E2: Embossed tape and reel
Physical Dimension Tape and Reel Information
SSOP-B20
6.5 ± 0.2
11
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
20
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
10
0.1± 0.1
1.15 ± 0.1
0.15 ± 0.1
0.1
0.65
0.22 ± 0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Marking Diagram (TOP VIEW)
SSOP-B20(TOP VIEW)
Part Number Marking
B D 8 3 7 9
LOT Number
1PIN MARK
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Datasheet
BD8379FV-M
●Revision History
Date
Revision
10 Jun. 2013
001
07 Oct. 2014
002
25 Nov. 2015
003
Changes
New Release of Specification.
P1 Add AEC-Q100 Qualified
P4 Output Leakage Current1: Change spec from 5μA to 0.3μA, Added Ta=-40~125 in
condition
Output Leakage Current2: Delete
P3. Add Caution about Absolute Maximum Rating
P13-14. Modify Operational Notes
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/16
TSZ02201-0G1G0C500150-1-2
04.Dec.2015 Rev.003
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ROHM Semiconductor:
BD8379FV-ME2
工商网监
湘ICP备2023018690号
