Datasheet
4 ch Current Driver Integrated, Built-in MOS for Boost, Boost DC/DC Converter
White LED Driver for Automotive
BD83A04EFV-M
General Description
Key Specifications
This IC is a white LED driver for LCD backlight.
It has MOS for boost and 4 ch current drivers for LED drive,
making it ideal for high brightness LED drive. LED pin
maximum voltage is 50 V, making it suitable for driving
medium LCD panels.
The dimming is controlled by the PWM signal and can be
set up to 20,000: 1@100 Hz. It also supports analog
dimming and can accommodate even higher brightness
ranges by combining with PWM dimming. DC/DC
converters can be controlled for boost applications, and the
input operating voltage range is 4.5 V to 48 V.
◼ Input Operating Voltage Range:
4.5 V to 48 V
◼ Output LED Current Absolute Accuracy:
±5.0 %@80.1 mA
Ta = -40 °C to +125 °C
◼ DC/DC Oscillation Frequency:
200 kHz to 2420 kHz
◼ Operating Temperature:
-40 °C to +125 °C
◼ LED Maximum Current:
120 mA/ ch
◼ LED Maximum Dimming Ratio:
20,000: 1@100 Hz
◼ LED1 to LED4 Pin Maximum Voltage:
50 V
Package
W (Typ) x D (Typ) x H (Max)
HTSSOP-B24
7.8 mm x 7.6 mm x 1.0 mm
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
AEC-Q100 Qualified(Note 1)
Functional Safety Supportive Automotive Products
Built-in 4 ch Current Driver for LED Drive
Built-in MOS for Boost
Current Mode Boost DC/DC Converter
Load Switch (M1) Control Pin
PWM Dimming
(20,000: 1@100 Hz, 100 Hz to 25 kHz)
Spread Spectrum Function
DC/DC Converter Oscillation Frequency External
Synchronization Function
LSI Protect Functions (UVLO, OVP, TSD, OCP)
LED Anode/Cathode Short Circuit Protection Function
LED Open/Short Protection Function
Applications
◼
◼
◼
◼
◼
Automotive CID (Center Information Display) Panel
Navigation
Cluster Panel
HUD (Head Up Display)
Other Small and Medium Sized LCD Panel for
Automotive
(Note 1) Grade 1
Typical Application Circuit
VCC
CVCC
VREG
CREG
1
REG
VCC 24
2
GND
CSH 23
EN
3
EN
PWM
4
PWM
SYNC
5
SYNC
6
RT
LDSW
RCSH
M1
22
D1
CIN
L1
N.C. 21
SW
D2
RRT
CCOMP RCOMP
EXP-PAD
VOUT
20
COUT
PGND 19
7
COMP
8
ADIM
9
ISET
10
LGND
11
LED1
LED4 14
12
LED2
LED3 13
ROVP2
OVP 18
RFAIL
VREG
FAIL
17
VREG
VFAIL
RISET
PLSET 16
ROVP1
CPLSET
N.C.
15
Figure 1. Boost Application Circuit Diagram
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
○This product is protected by U.S. Patent No.7,235,954, No.7,541,785 and No.7,944,189.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 5
Description of Blocks ...................................................................................................................................................................... 6
Absolute Maximum Ratings .......................................................................................................................................................... 10
Thermal Resistance ...................................................................................................................................................................... 10
Recommended Operating Conditions ........................................................................................................................................... 11
Operating Conditions (External Constant Range) ......................................................................................................................... 11
Electrical Characteristics............................................................................................................................................................... 12
Typical Performance Curves ......................................................................................................................................................... 15
Function Descriptions ................................................................................................................................................................... 17
PCB Application Circuit Diagram .................................................................................................................................................. 28
List of External Components ......................................................................................................................................................... 29
Application Components Selection Method .................................................................................................................................. 31
Precautions for PCB Layout.......................................................................................................................................................... 37
Power Consumption Calculation Example .................................................................................................................................... 38
Application Circuit Example .......................................................................................................................................................... 40
I/O Equivalence Circuit ................................................................................................................................................................. 41
Operational Notes ......................................................................................................................................................................... 42
Ordering Information ..................................................................................................................................................................... 44
Marking Diagram .......................................................................................................................................................................... 44
Physical Dimension and Packing Information ............................................................................................................................... 45
Revision History ............................................................................................................................................................................ 46
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Pin Configuration
(TOP VIEW)
REG
1
24
VCC
GND
2
23
CSH
EN
3
22
LDSW
PWM
4
21
N.C.
SYNC
5
20
SW
RT
6
19
PGND
COMP
7
18
OVP
ADIM
8
17
FAIL
ISET
9
16
PLSET
LGND
10
15
N.C.
LED1
11
14
LED4
LED2
12
13
LED3
EXP-PAD
Figure 2. Pin Configuration
Pin Descriptions
Pin No. Pin Name
Signal Type
Function
(Note 1)
1
REG
A
Internal reference voltage: Used as the reference voltage for the internal circuit. 5 V (Typ) is
generated and output by setting the EN pin to High. Connect a capacitance of 2.2 μF for
phase compensation.
2
GND
A
Small signal ground: Use this for the ground of external components connected to the REG,
RT, COMP, ADIM, ISET, PLSET, OVP, and VCC pins.
3
EN
I
Enable input: The EN pin is turned High to activate the internal circuit. The internal circuit
stops and the standby state is set by setting to Low.
4
PWM
I
PWM dimming signal: The LED current can be controlled according to On Duty of the
input PWM signal.
5
SYNC
I
External synchronization frequency input / SSCG setting: The internal oscillation
frequency can be externally synchronized by inputting an external clock signal to the SYNC
pin before the Self Diagnosis is completed. When using spread spectrum mode (SSCG),
short the SYNC pin and the REG pin beforehand.
6
RT
A
Resistor connection for oscillation frequency setting: The oscillation frequency (fOSC) of
DC/DC converter can be set by connecting a resistor (RRT) between the RT pin and the GND
pin.
7
COMP
A
Phase compensating capacitor connection: The reference voltage and LED pin voltage
generated by REF Voltage block are compared and output by Error AMP. Connect a filter for
phase compensation.
8
ADIM
A
DC dimming setting: ISET pin voltage can be changed according to the voltage input to the
ADIM pin. When using only PWM dimming, short the ADIM pin with the REG pin.
9
ISET
A
Resistor connection for LED current setting: LED current (ILED) can be set by connecting a
resistor (RISET) between the ISET pin and the GND pin.
10
LGND
P
Large current ground 1: GND of the current driver (the LED1, LED2, LED3, and LED4 pins).
11
LED1
P
LED cathode connection 1: Open drain output of the current driver ch 1 for LED drive.
Connect to the LED cathode.
12
LED2
P
LED cathode connection 2: Open drain output of the current driver ch 2 for LED drive.
Connect to the LED cathode.
13
LED3
P
LED cathode connection 3: Open drain output of the current driver ch 3 for LED drive.
Connect to the LED cathode.
14
LED4
P
LED cathode connection 4: Open drain output of the current driver ch 4 for LED drive.
Connect to the LED cathode.
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, P: Large current signal susceptible to impedance, including transient
current.
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Pin Descriptions – continued
Pin No. Pin Name
15
N.C.
Signal Type
Function
(Note 1)
-
Not connected internally.
16
PLSET
A
Switching pulse number setting: Pulse addition function is provided to stabilize DC/DC
converter output voltage even when PWM Duty is low. The number of switching pulses to be
added can be set by the capacitance value connected between the PLSET pin and the GND
pin.
17
FAIL
O
Error output flag: Outputs the status of protective operation from the FAIL pin. Since this pin
is an open drain output, use a resistor to pull it up to the REG pin, etc.
18
OVP
A
Overvoltage protection and short circuit protection detection input: When OVP pin
voltage rises to 1.21 V or more, the overvoltage protection (OVP) is activated, and DC/DC
converters are switched OFF. If OVP pin voltage is 0.1 V or less for 3.56 ms, Short Circuit
Protection (SCP) is activated, and both DC/DC converter and the current driver are turned
OFF.
19
PGND
P
Large current ground 2: GND of DC/DC converter. Use it for COUT ground.
20
SW
P
FET drain signal for boost: Switching signal output of DC/DC converter. Connect the SW
pin to the node between the inductor and the rectifier diode.
21
N.C.
-
Not connected internally.
22
LDSW
P
Output for driving the load switch gate: The signal output for driving the gate of the load
switch. When the input overcurrent protection is activated, the load switch is turned OFF as
LDSW pin voltage = VCC pin voltage.
23
CSH
A
Input current detection input: The input current is converted to voltage by the input current
detection resistor (RCSH) connected between the VCC-CSH pin and detected by the CSH pin.
Turns the load switch OFF when the input overcurrent protection is activated.
24
VCC
P
Power supply voltage input: The input operating voltage range is 4.5 V to 48 V, but when
the IC is started, start it with VCC ≥ 5.5 V. The decoupling capacitor (CVCC) between the VCC
pin and the GND pin should be as close to the IC pin as possible.
-
EXPPAD
-
The EXP-PAD should be connected to the board ground.
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, O: Output signal to other units, P: Large current signal susceptible to
impedance, including transient current.
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Block Diagram
CSH
VCC
EN
LDSW
LDSW
Driver
VREF
REG
PROTECT
Low side FET /
Pre Driver
PROTECT
PLSET
Additional
Pulse
OSC
RT
SLOPE
DC/DC
Control
LOGIC
+
REG
SW
－
SSCG
PWM
COMP
PGND
SYNC
Error
AMP
COMP
Soft
Start
LDSW
Driver
－
－
+
LED1
Minimum
Channel
Selector
PROTECT
UVLO
FAIL
TSD
SCP
OCPH
ISET SCP
OCPL
FAIL
DC/DC
Control
LOGIC
LED2
LED3
LED4
OVP
OPEN Det
SHORT Det
OVP
Current
Driver
Internal
CLK
PWM
REF
Voltage
Dimming
Control
VCC
ADIM
ISET
CH1 CH2 CH3 CH4
ISET
Current Driver
GND
LGND
Figure 3. Internal Block Diagram
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Description of Blocks
Unless otherwise stated, the value in the sentence is the typical value.
1 VREF
Internal reference voltage circuit. By setting the EN pin to High, 5 V is generated and output to the REG pin. REG voltage
is used as the power supply for the internal circuit. Also, this is used to fix each input pin to High voltage outside the IC.
Connect REG capacitance (CREG = 2.2 μF) to the REG pin for the phase compensation. Note that if CREG is not connected,
unstable operation such as oscillation will occur.
2 LDSW Driver
Input overcurrent protection circuit. If the voltage between the VCC-CSH pin is 0.1 V or more and continues for 10 μs or
more, the input overcurrent protection is activated, and the load switch (M1) is turned OFF as LDSW pin voltage = VCC
pin voltage. Then, after 3.56 ms elapses, the load switch is turned ON. At this time, if the voltage between the VCC-CSH
pin is 0.1 V or more, the load switch is turned OFF again. If the voltage between the VCC-CSH pin is less than 0.1 V, Self
Diagnosis is performed and restarted. When the input overcurrent protection is detected, the FAIL pin goes Low. The VCCLDSW pin is connected by a 3 MΩ resistor inside the IC. Do not connect a resistor between the VCC-LDSW pin because
connecting a resistor between the VCC-LDSW pin outside the IC may prevent the load switch from being turned ON.
When the VCC voltage is turned ON setting the EN pin to Low, the voltage between the VCC-LDSW pins may open
momentarily and an inrush current may flow depending on the VCC startup speed and the type of load switch used. Be
sure to check with the actual application.
3 OSC (Oscillator)
Oscillation frequency generator. The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a resistor
for oscillation frequency setting (RRT) between the RT pin and ground. In addition, the oscillation frequency of DC/DC
converter can be externally synchronized by inputting the external synchronization frequency (fSYNC) to the SYNC pin.
4 SSCG (Spread Spectrum Clock Generator)
Spread spectrum circuit. The spread spectrum function (SSCG) is activated by shorting the SYNC pin and the REG pin.
Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the
frequency due to SSCG is from 100 % to 92 % of the set oscillation frequency. The oscillation frequency fluctuation period
is 2.3 kHz.
5 SLOPE
This circuit generates a saw wave that serves as the source of the switching pulse of DC/DC converter. SLOPE output
signal and COMP pin voltage are compared, and a switching pulse is generated.
6 Minimum Channel Selector
Selector circuit for detecting LED pin voltages. Selects the lowest pin voltage among LED1 to LED4 pin voltages and inputs
it in Error AMP.
7 Error AMP (Error Amplifier)
This is an error amplifier that takes LED control voltage and the smallest value of the LED1 to LED4 pin voltages as input.
Phase compensation can be set by connecting a resistor and a capacitor to the COMP pin.
8 Soft Start
Soft start circuit for DC/DC converters. This function is used to suppress a steep increase in the inductor current at startup
and an overshoot in the output voltage. Controls the change in switching Duty by limiting the rising edge of the output of
Error AMP (COMP pin voltage) with the soft start function.
9 PWM COMP (PWM Comparator)
This comparator compares COMP pin voltage, which is the output of Error AMP, with SLOPE output signal. Controls the
Duty of the switching pulse of DC/DC converter.
10 Additional Pulse
This circuit adds switching pulses of DC/DC converter. With the pulse addition function, the LED current can be supplied
stably even when the PWM dimming ratio decreases.
11 DC/DC Control LOGIC
This circuit generates the logic of the built-in Low side FET for boost output from the SW pin.
12 Low side FET / Pre Driver
Built-in Low side FET for boost output from the SW pin and its driving circuit.
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Description of Blocks - continued
13 Internal CLK
This circuit generates the internal reference clock. It is a clock of 2.3 MHz and used as a counter.
14 Dimming Control
This circuit controls the dimming rate during PWM dimming.
15 Current Driver / ISET
Current driver circuit for lighting LED. LED current can be set by connecting a resistor to the ISET pin.
16 PROTECT
Outputs the status of protective operation from the FAIL pin. Since this pin is an open drain output, connect it to the REG
pin with a resistor. If the status of protective operation is not monitored, turn the FAIL pin to OPEN or connect to the GND
pin.
16.1
UVLO (Under Voltage Lockout)
Under Voltage Lockout. When VCC pin voltage is 4.10 V or less or REG pin voltage is 3.95 V or less, Under
Voltage Lockout (UVLO) is activated, and the load switch (M1), DC/DC switching, and current driver turn OFF.
When VCC pin voltage is 4.25 V or more and REG pin voltage is 4.10 V or more, UVLO is released and the IC
restarts from Self Diagnosis. When UVLO is detected, output of the FAIL pin does not change. When the FAIL pin
is pulled up to REG, FAIL pin voltage will also drop as REG decreases.
16.2
TSDLED (Thermal Shutdown for Current Driver)
This is a temperature protection circuit that monitors the vicinity of the current driver on the chip. Prevents chip
temperature from rising due to output current fault. When the chip temperature rises to 175 °C or more, the
temperature protection circuit (TSDLED) is activated, the load switch (M1), DC/DC switching, and current driver
are turned OFF. When the chip temperature falls 150 °C or less, TSDLED is released, the IC restarts from Self
Diagnosis. When TSDLED is detected, the output of the FAIL pin does not change.
16.3
TSDREG (Thermal Shutdown for REG)
This is a temperature protection circuit that monitors the vicinity of the REG pin on the chip. Prevents chip
temperature rising due to the REG pin failure. When the chip temperature rises to 175 °C or more, the temperature
protection circuit (TSDREG) is activated, and REG pin voltage, load switch (M1), DC/DC switching, and current
driver turn OFF. When the FAIL pin is pulled up to the REG pin, FAIL pin voltage drops as REG pin voltage is
turned OFF, and it is output to Low. When the FAIL pin is pulled up to an external power supply, the FAIL pin is
output to High. When the chip temperature falls 150 °C or less, TSDREG is released and the IC restarts from Self
Diagnosis.
16.4
OCPL (Over Current Protection for Low side)
When the current flowing through Low side FET (the SW pin) becomes 3.6 A or more, the overcurrent protection
(OCPL) is activated and only DC/DC switching is stopped. If the current is less than 3.6 A, the overcurrent
protection is released, and switching is resumed. When OCPL is detected, output of the FAIL pin does not change.
16.5
OVP (Over Voltage Protection)
Output overvoltage protection circuit. When OVP pin voltage (resistor division of DC/DC converter output voltage)
becomes to 1.21 V or more, the overvoltage protection circuit (OVP) activates and only DC/DC switching is
stopped. When OVP pin voltage falls 1.16 V or less, OVP is released. When OVP is detected, the output of the
FAIL pin goes Low.
16.6
OPEN Det (LED Open Detection)
LED open protection circuit. When any of LED1 to LED4 pin voltages is 0.2 V or less and OVP pin voltage is 1.21
V or more, LED open protection (OPEN Det) is activated, and the current driver is latched OFF only for the LED
row that is open. OPEN Det is released when VEN = Low or UVLO is detected. When OPEN Det is detected, the
FAIL pin goes Low.
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16 PROTECT – continued
16.7
SHORT Det (LED Short Detection)
LED short protection circuit. When LED pin voltage is 5 V or more for 3.56 ms (counter), LED short protection
(SHORT Det) is activated, and the current driver is latched OFF only for the corresponding LED row. However,
the counter is reset when LED pin voltage does not satisfy the detection condition prior to SHORT Det being
activated. SHORT Det is released when VEN = Low or UVLO is detected. Since the 3.56 ms counter is counted up
only when PWM = High, the time until SHORT Det is detected varies depending on PWM Duty. When SHORT
Det is detected, the FAIL pin goes Low. SHORT Det can be detected when the PWM pulse width is 20 μs (MIN)
or more.
16.8
SCP (Short Circuit Protection)
Short Circuit Protection circuit. If any of the LED1 to LED4 pin voltages are 0.2 V or less or OVP pin voltage is 0.1
V or less for 3.56 ms (counter), the Short Circuit Protection (SCP) is activated, and the load switch (M1), DC/DC
switching, and current driver turn OFF. However, the counter is reset when each pin voltage does not satisfy the
condition prior to SCP being activated. The SCP is released when VEN = Low or UVLO is detected. When SCP is
detected, the FAIL pin goes Low. Also, DC/DC converter attempts to output higher voltage because the grounded
LED pin voltage (lowest LED pin voltage) is controlled to be VLEDCTL. Depending on the power supply voltage and
the load condition, OVP pin voltage may become 1.21 V or more prior to SCP being activated, and LED open
protection may be activated first. In this case, current driver turns OFF only for the grounded LED pin, but the LED
continues to light in a state where the current control is lost because it has been grounded. Even when LED open
protection is detected, the FAIL pin goes Low. Therefore, abnormality can be detected by monitoring this.
16.9
OCPH (Over Current Protection for High side) / LDSW Driver
Input overcurrent protection circuit. If a condition in which the voltage between the VCC-CSH pin is 0.1 V or more
continues for 10 μs or more, the input overcurrent protection (OCPH) is activated. It becomes LDSW pin voltage
= VCC pin voltage and the load switch (M1), DC/DC switching, and current driver turn OFF. Then, after 3.56 ms
(counter) elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.1 V or more,
the load switch, DC/DC switching, and current driver are turned OFF again. Also, if the voltage between VCCCSH is less than 0.1 V, Self Diagnosis is performed and restarted. When OCPH is detected, the FAIL pin goes
Low. The components on the overcurrent path may generate current again with restart, resulting in heat generation.
Check the calorific value on the actual device.
16.10 ISET Pin Fault (ISET-GND Short Protection)
ISET pin fault protection circuit. When the resistance value connected to the ISET pin falls 3.5 kΩ or less (when
ADIM = REG), ISET pin fault protection is activated, and the load switch (M1), DC/DC switching, and current driver
are turned OFF. If the resistance value connected to the ISET pin is more than 3.5 kΩ (when ADIM = REG), ISET
pin fault protection is released, and the load switch, DC/DC switching, and current driver are turned ON. When
ISET pin fault is detected, the FAIL pin goes Low.
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Description of Blocks – continued
Detect Conditions and Operation at Detection of Each Protection Function (All values in the table are Typ values)
Operation at Detection
Detect Condition
Protection Function
No.
Load
DC/DC
Current
FAIL
(Block Name)
[Detect]
[Release]
Switch Switching
Driver
Under Voltage
VCC ≤ 4.10 V
VCC ≥ 4.25 V
High
OFF
OFF
1
Lockout
or
and
OFF
(Note 5)
(UVLO)
VREG ≤ 3.95 V
VREG ≥ 4.10 V
2
Thermal Shutdown
LED
(TSDLED)
Tj ≥ 175 °C
Tj ≤ 150 °C
OFF
OFF
OFF
3
Thermal Shutdown
REG
(TSDREG)
Tj ≥ 175 °C
Tj ≤ 150 °C
OFF
OFF
OFF
4
Overcurrent
Protection
(OCPL)
ISW ≥ 3.6 A
ISW < 3.6 A
ON
OFF
ON
(Note 5)
5
Overvoltage
Protection
(OVP)
VOVP ≥ 1.21 V
VOVP ≤ 1.16 V
ON
OFF
ON
Low
6
LED Open
Protection
(OPEN Det)
VLEDn ≤ 0.2 V(Note 1)
and
VOVP ≥ 1.21 V
VEN = Low
or
Detects UVLO
ON
ON
7
LED Short
Protection
(SHORT Det)
Detects VLEDn ≥ 5.0 V
for 3.56 ms or more(Note 2)
VEN = Low
or
Detects UVLO
ON
ON
8
Short Circuit
Protection
(SCP)(Note 3)
VEN = Low
or
Detects UVLO
OFF
OFF
OFF
Latch
Low
9
Input Overcurrent
Protection
(OCPH)(Note 3)
OFF
OFF
OFF
Low
OFF
OFF
OFF
Low
10
ISET-GND
Short Protection
(ISET Pin Fault)
High
(Note 5)
High
(Note 5)
(Note 6)
Detects
VLEDn ≤ 0.2 V
or
VOVP ≤ 0.1 V
for 3.56 ms or more
Detects
voltage between the
VCC-CSH pin ≥ 0.1 V
for 10 μs or more
ISET resistor ≤ 3.5 kΩ
(when ADIM = REG)
Voltage between the
VCC-CSH pin < 0.1 V
Only
detection
LED pin
is OFF
Only
detection
LED pin
is OFF
High
Latch
Low
Latch
Low
(Note 4)
ISET resistor
> 3.5 kΩ
(when ADIM = REG)
(Note 1) LEDn indicates one of the LED1 to LED4 pins.
(Note 2) LED pin voltage of at least 1channel shall be less than VLEDCTL(MIN) x 1.2. When LED pin voltages of all channels are 2.4 V or more, the LED short protection
does not operate. Since the 3.56 ms counter is counted up only when PWM = High, the time until SHORT Det is detected varies depending on PWM Duty.
(Note 3) When Short Circuit Protection (SCP) and Input Overcurrent Protection (OCPH) are detected at the same time, the operation of Input Overcurrent Protection
takes precedence.
(Note 4) When 3.56 ms elapses after the load switch is turned OFF, the load switch turns ON. At this time, when the voltage between VCC-CSH ≥ 0.1 V, the load
switch, DC/DC switching, and current driver are turned OFF again. Also, when the voltage between VCC-CSH < 0.1 V, Self Diagnosis is performed and
restarted.
(Note 5) When pulled up to any voltage, it becomes High output.
(Note 6) REG is also turned OFF during TSDREG, so if pulled up to the REG pin, FAIL pin voltage drops with REG pin voltage.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VCC, LDSW, CSH, SW Pin Voltage
VCC, VLDSW, VCSH, VSW
-0.3 to +50.0
V
Voltage Between VCC-LDSW, VCC-CSH Pin
VCC-VLDSW, VCC-VCSH
-0.3 to +7.0
V
LED1, LED2, LED3, LED4 Pin Voltage
VLED1, VLED2, VLED3, VLED4
-0.3 to +50.0
V
RT, COMP, ISET, PLSET,
OVP, ADIM, FAIL Pin Voltage
VRT, VCOMP, VISET,
VPLSET, VOVP, VADIM, VFAIL
-0.3 to VREG
V
VEN, VREG, VSYNC, VPWM
-0.3 to +7.0
V
Tstg
-55 to +150
°C
Tjmax
150
°C
EN, REG, SYNC, PWM Pin Voltage
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
HTSSOP-B24
Junction to Ambient
θJA
90.9
30.1
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
6
4
°C/W
(Note 1) Based on JESD51-2A (Still-Air). The BD83A04EFV-M chip is used.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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BD83A04EFV-M
Recommended Operating Conditions
Parameter
Operating Range
Symbol
Min
Max
Unit
Power Supply Voltage(Note 1)
VCC
4.5
48.0
V
DC/DC Oscillation Frequency Range
(SSCG = OFF)
fOSC
200
2420
kHz
PWM Frequency Range(Note 2)
fPWM
0.1
25.0
kHz
ADIM Input Voltage Range(Note 3)
VADIM
0.4
VREG
V
External Synchronized Frequency Range(Note 4)
fSYNC
Higher of
200 or fOSC x 0.9
Lower of
700 or fOSC x 1.1
kHz
External Synchronized Pulse Duty Range(Note 5)
fSDUTY
40
60
%
LED Current Setting Range(Note 6)
ILED
20
120
mA
Operating Temperature
Topr
-40
+125
°C
(Note 1) When IC is started, the voltage must be UVLO release voltage or more. Therefore, consider the power supply drop caused by the parasitic resistor
and start the IC at VCC ≥ 5.5 V.
VCC(MIN) = 4.5 V is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set depends on
the connected LED load and external components.
(Note 2) Generally, flickering of LEDs is easier to see when the dimming frequency is set lower than 100 Hz. Set after confirming with the actual device evaluation.
(Note 3) Even if 1.21 V or more is input to the ADIM pin, it is fixed at 1.21 V inside the IC.
(Note 4) When the external synchronization function is not used, connect the SYNC pin to VREG (SSCG = ON) or GND (SSCG = OFF).
(Note 5) When using the external synchronization function, switching from the external synchronization state to the internal oscillation frequency is not possible
during stable operation.
(Note 6) The amount of current per channel. Set the LED current so that the maximum junction temperature (Tjmax) is not exceeded.
Operating Conditions (External Constant Range)
Parameter
Operating Range
Symbol
Unit
Min
Typ
Max
REG Capacitance
CREG
1.0
2.2
4.7
μF
LED Current Setting Resistor
RISET
11
-
53
kΩ
RRT
4.6
-
51.0
kΩ
PLSET Capacitance
CPLSET
-
-
10
nF
Input Capacitance 1
CVCC
1(Note 7)
-
-
μF
Input Capacitance 2
CINVCC(Note 8)
10(Note 7)
-
-
μF
Output Capacitance
COUT
20(Note 7)
-
100
μF
Oscillation Frequency Setting Resistor
(Note 7) Set the capacitance so that it does not fall below the minimum value in consideration of temperature characteristics, DC bias characteristics, etc.
(Note 8) CINVCC means the total capacitance of CIN and CVCC.
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BD83A04EFV-M
Electrical Characteristics
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit Current
ICC
-
-
10
mA
VEN = 5 V, VSYNC = 0 V,
VPWM = 0 V, CIN = 10 μF,
RT = OPEN, ISET = OPEN,
VADIM = VREG,
Resistance between
LEDn-GND = 10 kΩ
Standby Current
IST
-
0
10
μA
VEN = Low
VREG
4.7
5.0
5.3
V
IREG = -5 mA, CREG = 2.2 μF
SW Pin ON Resistor
RON_SW
-
0.2
0.4
Ω
ISW = 50 mA
LED Control Voltage
VLEDCTL
0.66
0.76
0.86
V
COMP Sink Current
ICOMPSINK
150
220
290
μA
COMP Source Current
ICOMPSOURCE
-290
-220
-150
μA
Oscillation Frequency 1
fOSC1
306
340
374
kHz
RRT = 33.3 kΩ
DUTY_MAX1
95
-
-
%
RRT = 33.3 kΩ
Oscillation Frequency 2
fOSC2
1980
2200
2420
kHz
RRT = 4.6 kΩ
PLSET Charge Current
IPLSET
35
50
65
μA
VPLSET = 0 V
PLSET Set Voltage
VPLSET
0.4
0.5
0.6
V
[VREF]
Reference Voltage
[DC/DC Converter]
Max Duty 1
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RISET = 15.1 kΩ,
VADIM = VREG
RISET = 15.1 kΩ,
VCOMP = 1.0 V,
VLED = 1.5 V,
VADIM = VREG
RISET = 15.1 kΩ,
VCOMP = 1.0 V,
VLED = 0 V,
VADIM = VREG
TSZ02201-0T2T0B200390-1-2
18.Aug.2022 Rev.006
BD83A04EFV-M
Electrical Characteristics – continued
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
[Current Driver]
RISET = 15.1 kΩ,
VADIM = VREG
RISET = 15.1 kΩ,
VADIM = VREG
ILEDn
76.1
80.1
84.1
mA
ILEDREL
0
-
5
%
RISETLIM
-
3.5
-
kΩ
VADIM = VREG
IADIM
-1.0
0
+1.0
μA
VADIM = 5 V
tPWMMIN
0.5
-
-
μs
fPWM = 100 Hz to 25 kHz,
ILED = 80.1 mA
PWM Dimming Frequency
fPWM
0.1
-
25.0
kHz
PWM Low Section Detect Time
tPWML
21.4
28.5
35.6
ms
Input High Voltage
VINH1
2.1
-
-
V
Input Low Voltage
VINL1
-
-
0.5
V
Input Resistor
RIN1
50
100
150
kΩ
Input High Voltage
VINH2
2.1
-
-
V
Input Low Voltage
VINL2
-
-
0.5
V
Input Resistor
RIN2
50
100
150
kΩ
LED Current Absolute Variation
LED Current Relative Variation
(Note 1)
ISET-GND Short Protection
Resistor
ADIM Pin Input Current
PWM Dimming Minimum Pulse
Width
[Logic Input (EN)]
VEN = 5 V
[Logic Input (PWM, SYNC)]
VPWM = VSYNC = 5 V
(Note 1) ILEDREL = (ILEDn(MAX) – ILEDn(MIN)) / ILEDn(Ave) x 100
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BD83A04EFV-M
Electrical Characteristics – continued
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)
Standard Value
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
[PROTECT]
VCCUVLO Detect Voltage
VUVLOVCC1
3.90
4.10
4.30
V
VCC = Sweep down
VCCUVLO Release Voltage
VUVLOVCC2
4.05
4.25
4.45
V
VCC = Sweep up
REGUVLO Detect Voltage
VUVLOREG1
3.75
3.95
4.15
V
VREG = Sweep down
REGUVLO Release Voltage
VUVLOREG2
3.90
4.10
4.30
V
VREG = Sweep up
OVP Detect Voltage
VOVPDET
1.16
1.21
1.26
V
VOVP = Sweep up
OVP Detect Voltage
Hysteresis Width
VOVPHYS
-
50
-
mV
VOVP = Sweep down
Input OCP Detect Voltage
VOCPH
80
100
120
mV
VCC-VCSH = Sweep up
LDSW Operation Voltage
at Input OCP Release
VLDSW
4.4
5.4
6.4
V
OCPL Detect Current
IOCPL
3.14
3.60
4.06
A
LED Open Protection Detect
Voltage
VOPEN
0.1
0.2
0.3
V
VLED = Sweep down
VOVP ≥ VOVPDET
LED Anode SCP Detect Voltage
VSCP1
0.05
0.10
0.15
V
VOVP = Sweep down
VSCP2
0.1
0.2
0.3
V
VLED = Sweep down
tSCP1
2.67
3.56
4.45
ms
tSCP2
2.67
3.56
4.45
ms
VSHORT
4.7
5.0
5.3
V
Initial Check Time
tINICK
5.34
7.12
8.90
ms
FAIL Pin ON Resistor
RFAIL
-
1.0
2.0
kΩ
LED Cathode SCP Detect
Voltage
LED Anode SCP Detect
Delay Time
LED Cathode SCP Detect
Delay Time
LED Short Protection Detect
Voltage
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VCSH = VCC
VCC-VLDSW
VLED = Sweep up
IFAIL = 1 mA
TSZ02201-0T2T0B200390-1-2
18.Aug.2022 Rev.006
BD83A04EFV-M
Typical Performance Curves
(Reference data, unless otherwise specified VCC = 12 V)
10
5.3
Reference Voltage : VREG [V]
Circuit Current : ICC [mA]
8
6
4
2
5.1
5.0
4.9
4.8
0
4.7
4
15
26
37
Power Supply Voltage : VCC [V]
48
-40 -20
Figure 4. Circuit Current vs Power Supply Voltage
0
20 40 60 80
Temperature : Ta [°C]
100 120
Figure 5. Reference Voltage vs Temperature
380
2.42
Oscillation Frequency 2 : fOSC2 [MHz]
Oscillation Frequency 1 : fOSC1 [kHz]
5.2
370
360
350
340
330
320
310
300
2.31
2.20
2.09
1.98
-40 -20
0
20 40 60 80 100 120
Temperature : Ta [°C]
-40 -20
Figure 6. Oscillation Frequency 1 vs Temperature
(RRT = 33.3 kΩ)
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0
20 40 60 80 100 120
Temperature : Ta [°C]
Figure 7. Oscillation Frequency 2 vs Temperature
(RRT = 4.6 kΩ)
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BD83A04EFV-M
Typical Performance Curves – continued
(Reference Data)
84
1.2
83
1.0
0.9
LED Current : ILED [mA]
LED Control Voltage : VLEDCTL [V]
1.1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
82
81
80
79
78
77
0.1
76
0.0
20
40
60
80
100
LED Current : ILED [mA/ch]
-40
120
0
20 40 60 80
Temperature : Ta [°C]
100 120
Figure 9. LED Current vs Temperature
100
100
90
90
Efficiency 2 : η [%]
Efficiency 1 : η [%]
Figure 8. LED Control Voltage vs LED Current
-20
80
70
80
70
60
60
50
50
8
10
12
14
Power Supply Voltage : VCC [V]
8
16
Figure 10. Efficiency 1 vs Power Supply Voltage
(RRT = 33.3 kΩ, RISET = 15.1 kΩ,
Number of LED Series = 10, Number of LED Parallels = 4)
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10
12
14
Power Supply Voltage : VCC [V]
16
Figure 11. Efficiency 2 vs Power Supply Voltage
(RRT = 4.6 kΩ, RISET = 15.1 kΩ,
Number of LED Series = 10, Number of LED Parallels = 4)
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BD83A04EFV-M
Function Descriptions
Unless otherwise stated, the value in the sentence is the Typ value.
1 Current Driver
This model has a built-in 4 ch current driver. The LED current setting range per channel is 20 mA to 120 mA, and the LED
current can be adjusted by the resistance value between the ISET pin and GND.
1.1 How to Set LED Current
1.4 PWM Low Section Detect Function
1.2 When Using Analog Dimming
1.5 LED Pin Handling of Unused Channels
1.3 When Using PWM Dimming
1.6 When Setting the LED Current Above 120 mA
1.1 How to Set LED Current
The LED current ILED can be calculated using the following equation.
𝑉
𝐼𝐿𝐸𝐷 = 𝑅𝐼𝑆𝐸𝑇 × 106
[mA]
Resistance Value Setting Example (VADIM = VREG)
𝐼𝑆𝐸𝑇
𝐼𝐿𝐸𝐷 : Output current per channel (LED current)
(Recommended operating condition:
20 mA to 120 mA)
𝑉𝐼𝑆𝐸𝑇 : ISET pin voltage 1.21 V
(When ADIM pin voltage VADIM = VREG)
𝑅𝐼𝑆𝐸𝑇 : LED current setting resistor
(Recommended operating condition:
11 kΩ to 53 kΩ)
ISET Resistor [kΩ]
LED Current [mA]
53
22.8
30
40.3
15.1
80.1
11
110.0
When RISET ≤ 3.5 kΩ, ISET pin short protection detect is
activated and, output of the LED current is stopped.
120
110
LED Current : ILED [mA]
100
90
80
70
60
50
40
30
20
11
16
21
26
31
36
ISET Resistor : RISET [kΩ]
41
46
51
Figure 12. ILED vs RISET (VADIM = VREG)
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BD83A04EFV-M
1 Current Driver – continued
1.2 When Using Analog Dimming
ISET pin voltage can be adjusted according to the voltage input to the ADIM pin. The LED current ILED can be calculated
from the following equation as described above.
𝑉
𝐼𝐿𝐸𝐷 = 𝑅𝐼𝑆𝐸𝑇 × 106
𝐼𝐿𝐸𝐷 : Output current per channel (LED current)
(Recommended operating condition:
20 mA to 120 mA)
𝑉𝐼𝑆𝐸𝑇 : ISET pin voltage 1.21 V
(ADIM pin voltage VADIM = VREG )
𝑅𝐼𝑆𝐸𝑇 : LED current setting resistor
(Recommended operating conditions:
11 kΩ to 53 kΩ)
𝑉𝐴𝐷𝐼𝑀 : ADIM pin Input voltage
(Recommended operating conditions:
0.40 V to VREG)
[mA]
𝐼𝑆𝐸𝑇
However, VISET can be adjusted according to ADIM pin
voltage VADIM as follows:
𝑉𝐼𝑆𝐸𝑇 = 1.21 [V] (1.21 V ≤ VADIM ≤ VREG)
𝑉𝐼𝑆𝐸𝑇 = 𝑉𝐴𝐷𝐼𝑀 [V] (0.40 V < VADIM < 1.21 V)
Note that ILED set by RISET and VADIM can’t be set to less than 20 mA.
100
90
80
ILED [mA]
70
60
50
40
30
20
10
0
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
VADIM [V]
Figure 13. ILED vs VADIM (RISET = 15.1 kΩ)
1.3 When Using PWM Dimming
The LED current can be controlled according to On Duty of the PWM signal input to the PWM pin. However, in the region
where the ON time of the LED current is less than 0.5 μs or the OFF time is less than 0.5 μs, the pulse time is shorter than
PWM dimming minimum pulse width, so it cannot be used regularly. It is okay to use this region transiently, so it is also
possible to set PWM Duty = 0 % and 100 %.
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BD83A04EFV-M
1 Current Driver – continued
1.4 PWM Low Section Detect Function
Counting starts when PWM = High is switched to Low in the VEN = High state. When PWM Low section reaches 28.5 ms,
the operation is regarded as OFF state. After that, when PWM input is turned High, switching operation (pre-boost) is
restarted.
1.5 LED Pin Handling of Unused Channels
This model has four built-in constant current circuits.
The current can be supplied to the LED by setting the
PWM pin to High, and the LED current can be set by
inserting a resistor between the ISET pin and GND. The
LED current that can be supplied per row is 20 mA to
120 mA.
Pull down the LED pin of the unused channel to GND
with 10 kΩ.
VOUT
10 kΩ
LED4
LED3
LED2
LED1
Figure 14. When Setting LED4 Unused
1.6 When Setting the LED Current Above 120 mA
The LED1 to LED4 pins can be used in bundles.
For example, as shown in the figure on the right, if
LED1, LED2, LED3, and LED4 are shorted, 4 times the
current set by the ISET pin can be passed.
When using only 2 channels in a bundle, mount a
resistor for each LED pin for unused channels (2
channels).
When connected to multiple LED pins with a resistor,
the voltage may deviate from the set value and may not
be recognized as an unused channel. In this case, the
unintentional protection function may be activated, so
perform the LED pin handling correctly.
VOUT
LED4
LED3
LED2
LED1
Figure 15. Application Example When LED Pins are Shorted
VOUT
VOUT
10 kΩ
10 kΩ
LED4
LED4
10 kΩ
LED3
LED3
LED2
LED2
LED1
LED1
Figure 16. Correct LED Pin Handling When Multiple
Channels are Unused
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Figure 17. Wrong LED Pin Handling When Multiple
Channels are Unused
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BD83A04EFV-M
Functional Descriptions – continued
Unless otherwise stated, the value in the sentence is the Typ value.
2 DC/DC Converter
Detects the lowest voltage among LED1 to LED4 pin voltages (LED cathode voltages) in Minimum Channel Selector block
and inputs it to Error AMP. The reference voltage of Error AMP is generated in REF Voltage block based on R ISET resistance
value, which becomes LED pin control voltage. The output of Error AMP is compared with the output of SLOPE block by
PWM COMP block, and a switching signal is output to the SW pin through DC/DC Control LOGIC.
2.1 LED Pin Control Voltage VLEDCTL
2.5 DC/DC Converter Oscillation Frequency fOSC
2.2 VCC Input Voltage and Number of LED Series
2.6 Pulse Addition Function
2.3 LED Variation and Series Number
2.7 External Synchronization / Spread Spectrum
2.4 Overvoltage Protection Function OVP
Function (SSCG)
2.8 LSDET Function
2.1 LED Control Voltage VLEDCTL
DC/DC converter operates so that the lowest voltage among LED1 to LED4 pin voltages (LED cathode voltages) is equal
to the LED control voltage (VLEDCTL). Power dissipation can be minimized by optimizing the LED control voltage (V LEDCTL)
according to the LED current (ILED).
LED Control Voltage Reference Value (ADIM = REG)
LED Current
ILED [mA]
LED Control
Voltage
VLEDCTL [V]
53
22.8
0.42
30
40.3
0.52
15.1
80.1
0.76
11
110.0
0.93
1.1
LED Control Voltage : VLEDCTL [V]
ISET Resistor
RISET [kΩ]
1.2
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
20
40
60
80
100
LED Current : ILED [mA/ch]
120
Figure 18. VLEDCTL vs ILED
2.2 VCC Input Voltage and Number of LED Series
To drive the boost DC/DC converter, the LED must be selected so that the output voltage (VOUT) is higher than the input
voltage (VCC).
𝑉𝐶𝐶(𝑀𝐴𝑋) < 𝑉𝑂𝑈𝑇(𝑀𝐼𝑁)
𝑉𝐶𝐶(𝑀𝐴𝑋) < 𝑉𝑓(𝑀𝐼𝑁) × 𝑁 + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿 (𝑀𝐼𝑁)
Select the number of LED series and Vf characteristics that satisfy
the above equation.
𝑉𝐶𝐶
𝑉𝑂𝑈𝑇
𝑁
𝑉𝑓
𝑉𝐿𝐸𝐷𝐶𝑇𝐿
: Input voltage
: DC/DC converter output voltage
: Number of LED series
: LED Vf voltage
: LED control voltage
2.3 LED Variation and Series Number
When operating multiple LED outputs, the LED anode voltages in each row are commonly connected to DC/DC converter
output VOUT. LED pin voltage (LED cathode voltage) in the row where the Vf voltage of the LED is the highest is the lowest,
and this is controlled to be VLEDCTL. Therefore, the voltage of other LED pin outputs will be higher by the amount of Vf
variation. Select the number of LED series and Vf characteristics so that the LED short protection (V LEDn ≥ 5.0 V) does not
operate.
𝑁 × (𝑉𝑓(𝑀𝐴𝑋) − 𝑉𝑓(𝑀𝐼𝑁) ) < 𝑉𝑆𝐻𝑂𝑅𝑇(𝑀𝐼𝑁) − 𝑉𝐿𝐸𝐷𝐶𝑇𝐿 (𝑀𝐴𝑋)
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𝑉𝑆𝐻𝑂𝑅𝑇
: LED short protection voltage
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2 DC/DC Converter – continued
2.4 Overvoltage Protection Function OVP
Inputs the resistor division of the output voltage VOUT
in the OVP pin. When OVP pin voltage rises the
overvoltage protection detect voltage VOVP (1.21 V) or
more, the overvoltage protection is activated, and the
switching of DC/DC converter is turned OFF. After that
when OVP pin voltage drops to 1.16 V, OVP is released.
VOUT
ROVP2
OVP
+
ROVP1
1.21 V /
1.16 V
Figure 19. OVP Pin Voltage Setting Sample
𝑉𝑂𝑈𝑇𝑂𝑉𝑃 = {(𝑅𝑂𝑉𝑃1 + 𝑅𝑂𝑉𝑃2 ) ∕ 𝑅𝑂𝑉𝑃1 } × 𝑉𝑂𝑉𝑃 [V]
𝑉𝑂𝑈𝑇𝑂𝑉𝑃
𝑉𝑂𝑉𝑃
: DC/DC converter output voltage (VOUT) during overvoltage protection operation
: Overvoltage protection detect voltage
2.5 DC/DC Converter Oscillator Frequency fOSC
The oscillation frequency (fOSC) of DC/DC converter can be set by connecting RRT between the RT pin and GND. The
oscillator frequency of DC/DC converter is generated in the OSC block. Set the resistor of RRT referring to the data and
theoretical formula below.
𝑓𝑂𝑆𝐶 = (1.132 × 107 ∕ 𝑅𝑅𝑇 ) × 𝛼
𝑓𝑂𝑆𝐶
: Oscillation frequency of DC/DC converter
1.132 × 107 : Constants determined inside the circuit
𝑅𝑅𝑇
: RT pin connecting resistor
𝛼
: Correction factor
[kHz]
α is the correction factor. For the relation between f OSC and RRT including the correction factor, refer to fOSC vs RRT below.
Note that operation cannot be guaranteed if f OSC setting value exceeds the recommended range of 200 kHz to 2420 kHz.
Determine fOSC setting value in consideration of the variation in electrical characteristics, variation in R RT, and ON/OFF of
spread spectrum
fOSC vs RRT
2400
Example of Resistance Value for fOSC Setting
2200
α
51
1.013
33.3
1.000
20
0.980
10
0.947
4.6
0.894
2000
1800
fOSC [kHz]
RRT [kΩ]
1600
1400
1200
1000
800
600
400
200
4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52
RRT [kΩ]
Figure 20. fOSC vs RRT
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2 DC/DC Converter – continued
2.6 Pulse Addition Function
A pulse addition function is provided to output a stable DC/DC converter output voltage and LED current even when PWM
Duty is low. The output voltage can be held by outputting additional switching of several pulses after the falling edge of the
PWM input signal, and the LED can be turned on normally. When the pulse addition function is not used, set the PLSET
pin to OPEN
VPWM
0.5 V
VPLSET
Additional
Pulse Time
tPLSET
VSW
VOUT
VOUT Hold
Stable LED Current
ILED
Figure 21. Pulse Addition Function
The number of additional switching pulses is set in the capacitance value CPLSET connected to the PLSET pin. The additional
pulse time tPLSET is calculated as follows:
𝑡𝑃𝐿𝑆𝐸𝑇 = 1010 × 𝐶𝑃𝐿𝑆𝐸𝑇
𝑡𝑃𝐿𝑆𝐸𝑇
𝐶𝑃𝐿𝑆𝐸𝑇
[µs]
: Additional pulse time
: PLSET pin capacitance
Additional Pulse Time : tPLSET [μs]
1000
100
10
1
0
0.1
1.0
10.0
PLSET Pin Capacity : CPLSET [nF]
Figure 22. tPLSET vs CPLSET
The additional pulse time required to hold the output voltage VOUT varies depending on various factors such as PWM
frequency, output voltage, output capacitance, LED current, as well as the minimum value of PWM Duty used for dimming.
Contact your sales representative when you request design verification of the required additional pulse time for your usage
conditions.
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2 DC/DC Converter – continued
2.7 External Synchronization /Spread Spectrum Function (SSCG)
Three switching modes can be selected
Mode
VSYNC
DC/DC Switching Frequency
according to the voltage input to the
SYNC pin.
1
Low
Fixed Frequency Mode Determined by RRT
2
High (= VREG)
3
Pulse Input
Spread Spectrum Mode of the Frequency
Determined by RRT
Mode to Synchronize with the Frequency Input to
the SYNC Pin
Mode 1:
When the SYNC pin is fixed Low, DC/DC converter switches at a fixed frequency determined by RRT.
Mode 2:
By shorting the SYNC pin and the REG pin, operation in spread spectrum mode (SSCG) is enabled. With SSCG, noise
peaks can be reduced by periodically changing the oscillation frequency. The fluctuation range (Δf) of the frequency due to
SSCG is -8 % of the set oscillation frequency from the set oscillation frequency. The oscillation frequency fluctuation period
(tSSCG) is 1/(2.3 kHz).
Noise Level
VCC
VEN
VSYNC
VPWM
1.21 V
Self Diagnosis
Δｆ = fOSC x 0.08
Noise
reduction
Pre-boost
VOVP
VSW
fOSC
Δf = -8 %
tSSCG = 1/(2.3 kHz)
Frequency
Band
Figure 24. Spread Spectrum Function
fOSC x 0.92
Figure 23. Spread Spectrum Function Timing Chart
𝛥𝑓 = 𝑓𝑂𝑆𝐶 × 0.08
𝑡𝑆𝑆𝐶𝐺 = 1/(2.3 𝑘𝐻𝑧)
𝛥𝑓
𝑓𝑂𝑆𝐶
𝑡𝑆𝑆𝐶𝐺
fOSC
: Fluctuation range of the oscillation frequency by SSCG
: DC/DC oscillation frequency
: The oscillation frequency fluctuation period by SSCG
When not using SSCG function, short the SYNC pin and the GND pin.
SSCG function cannot be turned ON/OFF during operation.
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2.7 External Synchronization / Spread Spectrum Function (SSCG) – continued
Mode 3:
By inputting an external clock signal to the SYNC pin, the internal oscillation frequency can be externally synchronized.
However, note the following points.
·Since Mode is judged during Self Diagnosis (Initial Check), input the clock signal to the SYNC pin prior to turning the EN
pin to High.
·After the clock signal is input to the SYNC pin and the EN pin is turned High, it is not possible to switch between internal
oscillation and external synchronization. Operation may become unstable. Similarly, after turning the EN pin to High, the
frequency of external synchronization cannot be switched.
·When using the external synchronization function, connect an RC filter with a cutoff frequency equivalent to the input
external synchronization frequency to the SYNC terminal as a countermeasure against interference with the RT terminal.
Be sure to check whether the output voltage of the RC filter satisfies the input threshold of the SYNC pin.
·When using external synchronization, SSCG cannot be used.
·For the external synchronization frequency, input a frequency within ±10 % of the theoretical value of the oscillation
frequency fOSC set by the RT pin.
Internal SYNC
VEN
4.0 V
VREG
REG
MODE
1.0 V
VSYNC
4.0 V
Internal
VSYNC
SSCG: ON, SYNC: OFF
Selector
SYNC
SSCG: OFF, SYNC: ON
1.0 V
SSCG: OFF, SYNC: OFF
7.12 ms
SSCG block
To OSC
Initial Check
Figure 25. Synchronous Signal (VSYNC) Input and
Mode Check (Initial Check) Timing
Figure 26. SYNC Pin Equivalence Circuit
2.8 LSDET Function
When the lowest LED pin voltage among LED pins is 2.4 V
or more, DC/DC converter is turned OFF, and COMP voltage
is held. DC/DC converter resumes switching when the lowest
LED pin voltage is less than VLEDCTL x 1.2.
LSDET function is intended to reduce the voltage quickly
when the output is over boosted. It also prevents the LEDs
from flickering by resuming the switching of DC/DC converter
just before returning to normal operation.
① The LED4 pin becomes open and LED4 pin voltage
becomes 0.2 V or less (Ⓐ).
DC/DC converter output begins boosting further to raise
LED4 pin voltage. In conjunction with this, OVP pin
voltage also rises (Ⓑ).
② When OVP pin voltage reaches 1.21 V (Ⓒ) due to the
boost of DC/DC converter, the LED open protection is
activated.
When the LED open protection is activated, the LED4
pin that was open is pulled up to REG pin voltage VREG
inside the IC (Ⓓ).
LSDET function operates because LED4 pin voltage,
which is the lowest LED pin voltage in the LED pins, is
2.4 V or more (Ⓓ).
LSDET function turns OFF DC/DC converters and holds
COMP voltage (Ⓔ).
③ DC/DC converter turns OFF, the output voltage drops,
and OVP pin voltage also drops (Ⓕ).
④ When the lowest LED pin voltage is less than VLEDCTL x
1.2 (Ⓖ), DC/DC converter resumes switching (Ⓗ).
LSDET
OFF
LSDET
ON
LSDET
OFF
VPWM
VSW
VCOMP
1.21 V
VOVP
VLED1 to
VLED3
VLEDCTL
VLEDCTL x 1.2
REG Pull Up (VREG )
VLED4
VLEDCTL
2.4 V
0.2 V
LED4
Open
LED4
Open
Detection
ILED1
to
ILED3
ILED4
Figure 27. LSDET Function When LEDs are Open
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Functional Descriptions – continued
Unless otherwise stated, the value in the sentence is the Typ value.
3 Starting Sequence and Effective Section of Each Protection Function
The timing chart at startup and the effective section of each protection function are shown in the figure below.
① Power ON
: Input EN voltage after the VCC voltage is input.
② Self Diagnosis
: After inputting EN voltage, this IC becomes the Self Diagnosis status, determines the channel to
(Initial check)
be used, and sets the external synchronization / spread spectrum function, etc. Self Diagnosis is
completed after 7.12 ms, and the diagnostic status is latched.
③ Pre-boost
: After Self Diagnosis, pre-boost starts at VPWM = High, and after 7.12 ms, pre-boost is completed.
④ Stable operation : The LED current flows according to On Duty of the PWM signal input to the PWM pin. The output
transition section voltage of DC/DC converter with switching turned OFF drops according to the load current.
⑤ Stable state
: When LED voltage (the lowest voltage in LED1 to LED4) drops to LED control voltage x 1.2, DC/DC
converter switches again.
VCC
VEN
VREG
4.1 V
(UVLO Release)
VPWM
Self Diagnosis
7.12 ms
VOVP
After Self Diagnosis,
pre-boost starts with VPWM = High
・Determination of CH to use
・Setting external
synchronization
・Setting spread spectrum
・OVP pin fault detection
・ISET pin fault detection
Stable Operation
Transition Section
Pre-boost
7.12 ms
Stable State
1.21 V
VSW
ILED
LED Setting Current Output Section
VLED
LED Control Voltage × 1.2
LED Control Voltage
During Self Diagnosis
FAIL is Low
VFAIL
DC/DC Converter Operating Section
Current Driver Operating Section
Under Voltage Lockout (UVLO) Effective when EN = High
Thermal Shutdown REG (TSDREG) Effective when EN = High
Thermal Shutdown LED (TSDLED) Effective when EN = High
Overcurrent Protection (OCPL) Effective when UVLO is released
Overvoltage Protection (OVP) Effective when UVLO is released
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is OFF
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released
ISET-GND Short Protection / FAIL Flag Effective when Self Diagnosis is completed
LED Open Protection / FAIL Flag Effective when pre-boost is completed
LED Short Protection / FAIL Flag Effective when pre-boost is completed
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is completed
Figure 28. Timing Chart at Startup and Effective Section of Each Protection Function
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3 Starting Sequence and Effective Section of Each Protection Function – continued
Unless otherwise stated, the value in the sentence is the Typ value.
3.1 Self Diagnosis (Initial Check)
The contents of Self Diagnosis are as follows.
3.1.1 LED Pin Used/Unused Check
It is possible to check whether the LED pin is used or not by LED pin voltage at the end of Self Diagnosis. If LED pin
voltage is 0.2 V or more and 2.0 V or less during Self Diagnosis, the LED pin is diagnosed as unused. If it is diagnosed
as unused, the LED pin does not operate and is pulled up to REG pin voltage VREG inside the IC. To select unused
channels correctly, the capacitance value to be connected to the LED pin should be 470 pF or less.
3.1.2 SYNC Pin Setting Check
ON/OFF of the external synchronization or spread spectrum function can be set by SYNC pin voltage at the end of Self
Diagnosis.
3.1.3 FAIL Pin Connection Check
During Self Diagnosis, the FAIL pin can check the connection between the monitor pin of MCU and the FAIL pin by
turning ON the open drain output (ON resistor = 1 kΩ). Determine the pull up voltage and pull up resistor according to
FAIL detection voltage on the MCU. Also, be careful of startup failure when starting by pulling up to the external power
supply, not REG pin voltage. The pull up resistor must satisfy the following conditions.
Pull Up Voltage (V)
Example of
External Power Supply
Minimum Value of Pull Up Resistor (kΩ)
REG Pin
Voltage
5.0
3.3
5.0
20
10
10
3.1.4 ISET-GND Short Check
In Self Diagnosis, ISET-GND Short Check is done under the same conditions as ISET pin fault (ISET-GND short
protection). When ISET-GND short is confirmed, the load switch, DC/DC switching, and current driver are latched OFF.
It is reset when VEN = Low or UVLO is detected.
3.1.5 OVP Pin Setting Check
Self Diagnosis checks OVP pin setting. The OVP pin during Self Diagnosis is pulled down with IC built-in resistor of 1
MΩ. When an open failure of the OVP pin occurs, OVP pin voltage falls to 0.1 V or less, and the load switch, DC/DC
switching, and the current driver latch OFF. It is reset when VEN = Low or UVLO is detected.
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Functional Descriptions – continued
4 Stopping Sequence and Effective Section of Each Protection Function
The figure below shows the timing chart when stopping and the effective section of each protection function.
⑤ Stable state
: When LED voltage (the lowest voltage in LED1 to LED4) drops to the LED control voltage x 1.2,
DC/DC converter is switched again.
⑥ Standby state : Decrease EN voltage prior to the VCC voltage falling. Internal circuit is stopped by falling EN
voltage, and IC is in standby state.
VCC
VEN
VREG
REG output
function is OFF
when EN = Low
VPWM
⑤ Stable State
⑥ Standby State
VOVP
VOUTL
DCDC converter operation is OFF
when EN = Low
ILED
Current driver operation is OFF
when EN = Low
VLED
LED Control Voltage
VFAIL
DC/DC Converter Operating Section
Current Driver Operating Section
Under Voltage Lockout (UVLO) Effective when EN = High
Thermal Shutdown REG (TSDREG) Effective when EN = High
Thermal Shutdown LED (TSDLED) Effective when EN = High
Overcurrent Protection (OCPL) Effective when UVLO is released
By setting EN = Low,
the state is set to standby
and all functions are stopped.
Overvoltage Protection (OVP) Effective when UVLO is released
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is OFF
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released
ISET-GND Short Protection / FAIL Flag Effective when Self Diagnosis is completed
LED Open Protection / FAIL Flag Effective when pre-boost is completed
LED Short Protection / FAIL Flag Effective when pre-boost is completed
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is completed
Figure 29. Timing Chart at Stopping and Effective Section of Each Protection Function
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PCB Application Circuit Diagram
L1
B+
CM
CB2
CCSH
CVCC3
RCSH2
RCSH1
CB1
CVCC2 CVCC1
B-
RCSH3
M1
REG
L2
REG
CREG
EN
SYNC
RFL
CFL
RSYNCU
REG
VCC
GND
CSH
EN
PWM
N.C.
SYNC
SW
RT
RSYNCD
COMP
RRT1
CCOMP2
RRT2
RCOMP1
CCOMP1
REG
RISET1
RISET2
VOUT
CLDSW
CIN1
LDSW
PWM
D2
CIN2
D1
COUT1 COUT2 COUT3 COUT4
ROVP3
ROVP2
PGND
OVP
ADIM
FAIL
ISET
PLSET
LGND
N.C.
LED1
LED4
LED2
LED3
RFAIL
REG
FAIL
COVP
ROVP1
CPLSET1 CPLSET2
VOUT
LED4
RADIM3
CLED1U CLED2U CLED3U CLED4U
LED3
LED2
RADIM2
LED1
ADIM
RADIM1
CLED1D CLED2D CLED3D CLED4D
RLED1 RLED2 RLED3 RLED4
Figure 30. PCB Application Circuit Diagram
Place the current detect resistor RCSH1, RCSH2 VCC pin capacitors CVCC1, CVCC2, and the load switch M1 so that they are
shortest. Also, place the input filters RCSH3, CCSH for detecting the input current close to the CSH pin (pin 23). They can be
placed on the opposite side of the IC and connected with a via.
② Place the input capacitors CIN1, CIN2 and the Diode D1 so that they are as short as the components of both the inductor L2
and the load switch M1. Connect the ground of CIN1, CIN2, D1 to the PGND pin via EXP-PAD on the surface layer
③ To reduce high frequency noises, the wires of the boost "Loop" must be as short as possible. Do not widen the wiring width
more than necessary.
·Place the SW pin (pin 20), the inductor L2 and the anodes of the diode D2 so that they are the shortest.
·Place the cathode of D2 and the output decoupling capacitors COUT1, COUT2, COUT3, and COUT4 so that they are the
shortest.
·Place the output decoupling capacitors COUT1, COUT2, COUT3, COUT4 and the PGND pin (pin 19) so that they are the
shortest.
·Place the IC and each component on the same surface layer of the board and make connections in the same layer.
④ Place the ground plane on the layer closest to the surface layer where the IC is placed.
⑤ Connect the EXP-PAD to the board ground. Wire the ground pattern connected from the EXP-PAD as wide as possible to
improve heat dissipation and connect it to the ground plane with many vias. To ensure heat dissipation according to power
loss, place the required number of thermal vias directly under the EXP-PAD and connect them to the ground plane.
⑥ There is no problem if the GND pin (pin 2), the LGND pin (pin 10) and the PGND pin (pin 19) are connected via the EXPPAD. However, the power system ground such as the ground of the output decoupling capacitor and the PGND pin contains
the noise component of the switching frequency. To reduce this noise component, it is recommended to connect to the
ground plane using many vias in the ground pattern around the power system ground.
⑦ Place the bypass capacitor (CREG) between the REG pin (pin 1) and the GND pin as close to pin as possible.
⑧ The connection from VOUT to the anode of the LED panel and the connection from the cathode of the LED panel to the
LED1, LED2, LED3, LED4 pins should be as short as possible. Depending on the parasitic inductance component, the LED
current may become unstable.
⑨ Do not run the wiring from the cathode of the LED panel to the LED1, LED2, LED3, LED4 pins in parallel with other active
lines. Also, place the noise reduction capacitors (CLED1D, CLED2D, CLED3D, CLED4D) so that they are as short as the LED pin.
RLED1, RLED2, RLED3, RLED4 are pull-down resistors connected to the LED pin of unused channel and is required to generate
LED pin voltage that is judged to be unused.
⑩ When using the PWM function, the PWM pin (pin 4) is the active line, so keep it away from other sense lines.
⑪ When using the external synchronization function, the SYNC pin (pin 5) is an active line, so keep it away from other sense
lines. Also, when using the external synchronization function, connect an RC filter with a cutoff frequency equivalent to the
input external synchronization frequency to the SYNC terminal as a countermeasure against interference with the RT
terminal. Be sure to check whether the output voltage of the RC filter satisfies the input threshold of the SYNC pin.
⑫ Place R and C connected to the RT pin (pin 6), the COMP pin (pin 7), the ADIM pin (pin 8), the ISET pin (pin 9), the PLSET
pin (pin 16), and the OVP pin (pin 18) as close to the IC as possible. They can be placed on the opposite side of the IC and
connected with a via.
⑬ Since OVP pin voltage must be 0.1 V or more during Self Diagnosis, when installing the COVP, use about 1000 pF as a guide.
⑭ When the VCC voltage is turned ON with setting the EN pin to Low,, the voltage between the VCC-LDSW pins may open
momentarily and an inrush current may flow depending on the VCC startup speed and the type of load switch (M1) used.
Be sure to check with the actual application.
①
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List of External Components
Serial No.
Component Name
Component Value
Product Name
Manufacturer
1
CB1
-
-
-
2
CM
Short
-
-
3
CB2
-
-
-
4
L1
Short
-
-
5
CVCC1
1 μF
GCM21BR71H105KA03
murata
6
CVCC2
-
-
-
7
CVCC3
1 μF
GCM21BR71H105KA03
murata
8
RCSH1
15 mΩ
LTR18 Series
Rohm
9
RCSH2
-
-
-
10
RCSH3
100 Ω
MCR03 Series
Rohm
11
CCSH
100 pF
GCM1882C1H101JA01
murata
12
CLDSW
-
-
-
13
M1
60 V / 36 A
SQJ457EP
VISHAY
14
CIN1
10 μF
GCM32EC71H106KA03L
murata
15
CIN2
10 μF
GCM32EC71H106KA03L
murata
16
D1
60 V / 1 A
RBR1MM60ATF
Rohm
17
L2
22 μH
CLF10060NIT-220M-D
TDK
18
D2
60 V / 5 A
RB088LAM-60TF
Rohm
19
COUT1
10 μF
GCM32EC71H106KA03L
murata
20
COUT2
10 μF
GCM32EC71H106KA03L
murata
21
COUT3
-
-
-
22
COUT4
33 μF
GYA1H330MCQ1GS
nichicon
23
ROVP1
10 kΩ
MCR03 Series
Rohm
24
ROVP2
330 kΩ
MCR03 Series
Rohm
25
ROVP3
Short
-
-
26
COVP
1000 pF
GCM1882C1H102JA01
murata
27
RFAIL
100 kΩ
MCR03 Series
Rohm
28
CPLSET1
1000 pF
GCM1882C1H102JA01
murata
29
CPLSET2
-
-
-
30
RLED1
-
-
-
31
RLED2
-
-
-
32
RLED3
-
-
-
33
RLED4
-
-
-
34
CLED1U
-
-
-
35
CLED2U
-
-
-
36
CLED3U
-
-
-
37
CLED4U
-
-
-
38
CLED1D
-
-
-
39
CLED2D
-
-
-
40
CLED3D
-
-
-
41
CLED4D
-
-
-
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List of External Components – continued
Serial No.
Component Name
Component Value
Product Name
Manufacturer
42
CREG
2.2 μF
GCM21BR71C225KA49
murata
43
RFL
-
-
-
44
CFL
-
-
-
45
RSYNCU
-
-
-
46
RSYNCD
100 kΩ
MCR03 Series
Rohm
47
RRT1
33 kΩ
MCR03 Series
Rohm
48
RRT2
Short
-
-
49
RCOMP1
200 Ω
MCR03 Series
Rohm
50
CCOMP1
0.1 μF
GCM155R11C104KA40D
Murata
51
CCOMP2
-
-
-
52
RISET1
15 kΩ
MCR03 Series
Rohm
53
RISET2
Short
-
-
54
RADIM1
100 kΩ
MCR03 Series
Rohm
55
RADIM2
Short
-
-
56
RADIM3
-
-
-
Note: The component constants vary depending on the operating conditions and the load used.
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BD83A04EFV-M
Application Components Selection Method
Unless otherwise stated, the values in sentences are the values in continuous mode.
Select the application components according to the following procedure.
1. Derivating Maximum Input (Inductor) Peak Current IL(MAX)
Feedbacks the L value
NG
2. Selecting Inductor Constant
3. Setting Input Current Detect Resistor (RCSH)
4. Selecting PLSET Capacitance
5. Selecting Output Capacitance
6. Selecting Input Capacitance
7. Setting Overvoltage Protection (OVP)
8. Checking Rated Voltage/Current of Inductor (L), Diode (D1, D2), MOSFET
(M1), Resistor (RCSH), and Capacitance (CIN, COUT)
9. Setting Phase Compensation Circuit
10. Operation Check on Actual Device
Figure 31. Application Components Selection Procedure
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BD83A04EFV-M
Application Components Selection Method – continued
1 Derivating Maximum Input (Inductor) Peak Current IL(MAX)
VCC
CVCC
RCSH
CSH
LDSW
M1
D1
CIN
L1
D2
SW
VOUT
COUT
Figure 32. Output Application Circuit Diagram
1.1 Calculating Maximum Output Voltage VOUT(MAX)
Calculates VOUT(MAX) in consideration of LED Vf variation and the number of LED stages.
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝑉𝑓(𝑀𝐴𝑋) × 𝑁 + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
1.2 Calculating Maximum Output Current IOUT(MAX)
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝐼𝐿𝐸𝐷(𝑀𝐴𝑋) × 𝑀
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋)
𝑉𝑓(𝑀𝐴𝑋)
𝑁
𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
: Maximum output voltage
: Maximum value of LED Vf voltage
: Number of LED series
: Maximum value of LED control voltage
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋)
𝐼𝐿𝐸𝐷(𝑀𝐴𝑋)
: Maximum output current
: Maximum value of LED current per
channel
: Number of LED parallels
𝑀
1.3 Calculating Maximum Input (Inductor) Peak Current IL(MAX)
1
𝐼𝐿(𝑀𝐴𝑋) = 𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋) + ∆𝐼𝐿(𝑀𝐴𝑋)
2
𝐼𝐿(𝑀𝐴𝑋)
𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋)
𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋)
∆𝐼𝐿(𝑀𝐴𝑋) =
IOUT(MAX)
= 𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) ×
𝜂 × 𝑉𝐶𝐶(𝑀𝐼𝑁)
𝑉𝐶𝐶(𝑀𝐼𝑁)
𝐿(𝑀𝐼𝑁)
×𝑓
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1
𝑂𝑆𝐶(𝑀𝐼𝑁)
×
VOUT(MAX) −𝑉𝐶𝐶(𝑀𝐼𝑁)
VOUT(MAX)
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∆𝐼𝐿(𝑀𝐴𝑋)
𝑉𝐶𝐶(𝑀𝐼𝑁)
𝜂
𝐿(𝑀𝐼𝑁)
𝑓𝑂𝑆𝐶(𝑀𝐼𝑁)
: Maximum input (inductor) peak
current
: Maximum input (inductor) average
current
: Maximum input (inductor) current
amplitude
: Minimum power supply voltage
: Efficiency (about. 85 %)
: Minimum value of inductance
: Minimum value of DC/DC oscillator
frequency
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BD83A04EFV-M
Application Components Selection Method – continued
2 Selecting Inductor Constant
To maintain stable continuous operation of the current mode DC/DC converter, the L (inductance) value must satisfy the
following requirements:
𝑉𝑂𝑈𝑇−𝑉𝐶𝐶
𝐿×106
153.3𝑘
≤
𝑉𝑂𝑈𝑇
𝑉𝐶𝐶
𝐿
𝑅𝑅𝑇
𝑅𝑅𝑇
: Output voltage
: Power supply voltage
: Inductance value
: RT pin connecting resistor
Rewriting about L is as follows
𝐿≥
(𝑉𝑂𝑈𝑇−𝑉𝐶𝐶)×𝑅𝑅𝑇
153.3𝑘×106
Consider the variation of the L value and set it with sufficient margin.
3 Setting Input Current Detect Resistor (RCSH)
𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) =
𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁)
𝑅𝐶𝑆𝐻(𝑀𝐴𝑋)
> 4.06𝐴 +
𝑉𝐶𝐶(𝑀𝐴𝑋)
× 𝑡𝑂𝐶𝑃𝐿
𝐿(𝑀𝐼𝑁)
Select the RCSH value so that it will be as above.
𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Minimum value of input overcurrent
protection detect current
𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Minimum value of input overcurrent
protection detect voltage
𝑅𝐶𝑆𝐻(𝑀𝐴𝑋) : Maximum value of input current detect
resistor
: OCPL detect delay time (MAX = 150 ns)
𝑡𝑂𝐶𝑃𝐿
4 Selecting PLSET Capacitance
𝐼𝑂𝐹𝐹𝐿𝑂𝐴𝐷(𝑀𝐴𝑋) =
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋)
𝑅𝑂𝑉𝑃(𝑀𝐼𝑁)
+ 𝐼𝑆𝐵𝐷(𝑀𝐴𝑋)
𝑄𝑂𝐹𝐹𝐿𝑂𝑆𝑆(𝑀𝐴𝑋) = 𝐼𝑂𝐹𝐹𝐿𝑂𝐴𝐷(𝑀𝐴𝑋) × 𝑡𝑃𝑊𝑀𝑂𝐹𝐹(𝑀𝐴𝑋)
𝑄𝑃𝑊𝑀𝑅𝐼𝑆𝐸 = 𝑓
2.5
𝑂𝑆𝐶(𝑀𝐼𝑁)
𝑄𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁) =
× 𝐼𝑂𝑈𝑇(𝑀𝐼𝑁)
𝑉𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁) ×𝐶𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁)
𝐼𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋)
× 𝐼𝑂𝑈𝑇(𝑀𝐼𝑁)
𝑄𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁) > 𝑄𝑂𝐹𝐹𝐿𝑂𝑆𝑆(𝑀𝐴𝑋) + 𝑄𝑃𝑊𝑀𝑅𝐼𝑆𝐸
Select the CPLSET value so that it will be as above.
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𝐼𝑂𝐹𝐹𝐿𝑂𝐴𝐷(𝑀𝐴𝑋) : Maximum value of load current when
PWM = OFF
: Minimum value of overvoltage protection
𝑅𝑂𝑉𝑃(𝑀𝐼𝑁)
detect resistor
: Maximum value of rectifier diode leakage
𝐼𝑆𝐵𝐷(𝑀𝐴𝑋)
current
𝑄𝑂𝐹𝐹𝐿𝑂𝑆𝑆(𝑀𝐴𝑋) : Maximum value of consumed charge
when PWM = OFF
𝑡𝑃𝑊𝑀𝑂𝐹𝐹(𝑀𝐴𝑋) : Maximum value of PWM = OFF time
: Insufficient charge after PWM rise
𝑄𝑃𝑊𝑀𝑅𝐼𝑆𝐸
: Minimum value of additional pulse output
𝑄𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁)
supply charge
: Minimum value of PLSET threshold
𝑉𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁)
voltage
: Minimum value of PLSET pin capacitance
𝐶𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁)
: Maximum value of PLSET charging
𝐼𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋)
current
: Minimum output current
𝐼𝑂𝑈𝑇(𝑀𝐼𝑁)
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BD83A04EFV-M
Application Components Selection Method – continued
5 Selecting Output Capacitance
The capacitor COUT used for the output is determined by the allowable amount of VOUTPP which is the ripple voltage of
VOUT.
𝑉𝑂𝑈𝑇𝑃𝑃(𝑀𝐴𝑋) =
𝑉𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋) ×𝐶𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋) ×𝐼𝑂𝑈𝑇(𝑀𝐴𝑋)
𝐼𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁) ×𝐶𝑂𝑈𝑇(𝑀𝐼𝑁)
𝑉𝑂𝑈𝑇𝑃𝑃(𝑀𝐴𝑋) : Maximum value of VOUT ripple voltage
𝐼
𝐷
+ 𝐶𝑂𝑈𝑇(𝑀𝐴𝑋)××𝑓 𝑂𝑁(𝑀𝐴𝑋) + 𝐼𝐿(𝑀𝐴𝑋) × 𝑅𝐸𝑆𝑅(𝑀𝐴𝑋)
𝑂𝑈𝑇(𝑀𝐼𝑁)
𝑉𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋)
𝐶𝑃𝐿𝑆𝐸𝑇(𝑀𝐴𝑋)
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋)
𝐶𝑂𝑈𝑇(𝑀𝐼𝑁)
: Minimum value of PLSET charging
current
: Maximum output current
: Minimum value of VOUT capacitance
𝐼𝐿(𝑀𝐴𝑋)
: Maximum input (inductor) peak current
𝑅𝐸𝑆𝑅(𝑀𝐴𝑋)
𝐼𝑃𝐿𝑆𝐸𝑇(𝑀𝐼𝑁)
𝐷𝑂𝑁(𝑀𝐴𝑋)
𝑓𝑂𝑆𝐶(𝑀𝐼𝑁)
𝑂𝑆𝐶(𝑀𝐼𝑁)
: Maximum value of PLSET threshold
voltage
: Maximum value of PLSET pin capacitance
: Maximum value of DCDC-Duty
: Minimum value of DC/DC oscillator
frequency
: Maximum value of equivalence serial
resistor for output capacitance COUT
The actual VOUT ripple voltage is affected by board layout and component characteristics. Be sure to check on the actual
device and set the capacitance value considering sufficient margin so that it will be within the allowable ripple voltage.
The maximum value of COUT that can be set is 100 μF.
6 Selecting Input Capacitance
A ceramic capacitor with an input capacitance of 10 μF or more and a low ESR is recommended. If a capacitor outside
this range is selected, an excessive ripple voltage may be superimposed on the input voltage, causing IC malfunction.
In addition, the capacitor CIN used for the input is determined by the allowable amount of VINPP which is the ripple voltage
of VIN.
7 Setting Overvoltage Protection (OVP)
Overvoltage protection (OVP) is set by an external resistors ROVP1,
ROVP2. When the OVP pin becomes 1.21 V or more, it detects
overvoltage and stops DC/DC switching. Also, when the OVP pin is
1.21 V or more and the LED1 to LED4 pin voltage is 0.2 V or less,
the open state is detected, and the circuit is latched off (Reference
protection function).
To prevent an open false detection, the resistor division voltage of
the maximum value of the output voltage must be below the minimum
value of open detection voltage.
Set ROVP1, ROVP2 so that they satisfy the following formulas.
VOUT
ROVP2
OVP
+
ROVP1
1.21 V /
1.16 V
Figure 33. OVP Application Circuit Diagram
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) ×
𝑅𝑂𝑉𝑃1
< 𝑉𝑂𝑉𝑃𝐷𝐸𝑇(𝑀𝐼𝑁)
(𝑅𝑂𝑉𝑃1 + 𝑅𝑂𝑉𝑃2 )
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋)
𝑅𝑂𝑉𝑃1
(1)
𝑅𝑂𝑉𝑃2
: Maximum output voltage
: Overvoltage protection detect
resistor (GND side)
: Overvoltage protection detect
resistor (VCC side)
: Minimum value of overvoltage
protection detect voltage
e.g.) When using 8 series of LEDs with RISET = 15.1 kΩ and Vf = 3.2
V ±0.2 V.
𝑉𝑂𝑉𝑃𝐷𝐸𝑇(𝑀𝐼𝑁)
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) = (3.2 + 0.2) × 8 + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
: Resistor for LED current setting
𝑅𝐼𝑆𝐸𝑇
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) : Maximum output voltage
𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋) : Maximum value of LED control
voltage
: Overvoltage protection detect
𝑅𝑂𝑉𝑃1
resistor (GND side)
: Overvoltage protection detect
𝑅𝑂𝑉𝑃2
resistor (VCC side)
𝑉𝑂𝑉𝑃𝐷𝐸𝑇(𝑀𝐼𝑁) : Minimum value of overvoltage
protection detect voltage
= 28.06 [V]
𝑉𝑂𝑉𝑃𝐷𝐸𝑇(𝑀𝐼𝑁) = 1.16 [V]
If ROVP1 = 20 kΩ, it is necessary to set ROVP2 > 464 kΩ from equation
(1).
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BD83A04EFV-M
Application Components Selection Method – continued
8 Checking Rated Voltage/Current of Inductor (L), Diode (D1, D2), MOSFET (M1), Resistor (RCSH), and Capacitance
(CIN, COUT)
(Note 1)
Rated Current
Rated Voltage
Power Dissipation
Current Detect Resistor RCSH
-
-
> IOCPH(MAX)2 x RCSH(MIN)
MOSFET M1
> IOCPH(MAX)(Note 2)
> VCC(MAX)(Note 3)
-
Diode D1(Note 3)
(Note 4)
> VCC(MAX)
-
Input Capacitance CIN
-
> VCC(MAX)
-
(Note 5)
Inductor L
> IA(MAX)
-
-
Diode D2
> IA(MAX)(Note 5)
> VOUTOVP(MAX)(Note 6)
-
Output Capacitance COUT
-
> VOUTOVP(MAX)
-
(Note 1) Consider the variation of external components and make setting with sufficient margin.
(Note 2)𝐼𝑂𝐶𝑃𝐻(𝑀𝐴𝑋) = 𝑉𝑂𝐶𝑃𝐻(𝑀𝐴𝑋) /𝑅𝐶𝑆𝐻(𝑀𝐼𝑁)
(Note 3) If diode D1 is not mounted, ringing will occur on the drain side of MOSFET M1 when MOSFET M1 is turned OFF due to input overcurrent
protection. Ringing causes the drain side of MOSFET M1 to have a negative potential, which may cause the IC to malfunction.
It is recommended to mount the diode D1 when using the input overcurrent protection function
(Note 4) Set so that the rated value of the peak forward surge current > D1 generated current when input overcurrent protection is detected.
When the input overcurrent protection is detected, check the D1 generated current on the actual device.
𝑉𝐶𝐶(𝑀𝐴𝑋)
(Note 5)𝐼𝐴(𝑀𝐴𝑋) = 𝐼𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) +
× 𝑡𝑂𝐶𝑃𝐿
𝑡𝑂𝐶𝑃𝐿 : OCPL detect delay time (MAX = 150 ns)
𝐿(𝑀𝐼𝑁)
Since the inductor current reaches IOCPL at startup, the recommended setting is Rated Current > IA (MAX).
However, it is possible to set Rated Current > IL(MAX) after confirming that no damage occurs in the actual device.
(Note 6) DC reverse voltage
9 Setting Phase Compensation Circuit
About application stability conditions
The stability conditions of the LED voltage feedback system are as follows.
(1) Phase delay when gain is 1 (0 dB) is 150° or less (i.e., phase margin is 30° or more)
(2) Frequency (unity gain frequency) when gain is 1 (0 dB) is 1/10 or less of switching frequency
By inserting phase lead fz near the unity gain frequency,
stability can be ensured by phase compensation.
The phase delay fp1 is determined by COUT and the
output impedance RL. Each is as follows.
Phase lead
VOUT
𝑓𝑧 = 1/(2𝜋 × 𝑅𝑃𝐶 × 𝐶𝑃𝐶 ) [Hz]
Phase delay
𝑓𝑝1 = 1/(2𝜋 × 𝑅𝐿 × 𝐶𝑂𝑈𝑇 ) [Hz]
* Output impedance calculated by
𝑅𝐿 = 𝑉𝑂𝑈𝑇/𝐼𝑂𝑈𝑇
Good results can be obtained by setting fz from 1 kHz to
10 kHz. Substitute the value at maximum load for RL.
LED1 to
LED 4
Error
AMP
－
COMP
+
RCOMP
PWM
COMP
CCOMP
Figure 34. Error AMP Block Application Circuit Diagram
In addition, this setting is a simple calculation and is not calculated exactly, so it may be necessary to make adjustments
on the actual device. Also, these characteristics will change depending on the board layout, load conditions, etc., so
when designing for mass production, make sure to check the actual device before setting.
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Application Components Selection Method – continued
10 Operation Check on Actual Device
Select the constant according to the above procedure and precautions regarding constant setting. In addition, since this
selection is calculated by theoretical calculation, it does not include variations in external components or changes in their
characteristics and is not guaranteed. The parameters that affect the characteristics of the product will change depending
on the actual layout pattern, such as power supply voltage, LED current / number of lamps, inductor, output capacitance,
and switching frequency, so be sure to check with the actual device.
Additional Components for EMC Countermeasure
The figure below shows the examples of EMC countermeasure components.
(1) Capacitor for built-in FET current loop noise reduction
(2) Capacitor for output current loop noise reduction
(3) Capacitor for power line high frequency noise reduction
(4) Low-pass filter for power line noise reduction
(5) Common mode filter for power line noise reduction
(6) Snubber circuit for built-in FET high frequency noise reduction
(7) Snubber circuit for ringing reduction during built-in FET switching
5
4
3
RCSH
M1
VCC
CVCC
1
1
REG
VCC 24
2
GND
CSH
23
EN
3
EN
LDSW
22
PWM
4
PWM
SYNC
5
SYNC
6
RT
VREG
CREG
D1
CIN
L1
7
VOUT
N.C. 21
6
SW
20
PGND
19
2
RRT
CCOMP RCOMP
EXP-PAD
7
COMP
8
ADIM
FAIL
17
9
ISET
PLSET
16
10
LGND
11
LED1
LED4
12
LED2
LED3 13
D2
COUT
ROVP2
OVP 18
RFAIL
VREG
VREG
VFAIL
RISET
ROVP1
CPLSET
N.C. 15
14
Figure 35. Application Circuit Diagram Reference Example (including EMC countermeasure components)
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BD83A04EFV-M
Precautions for PCB Layout
PCB layout patterns have a significant impact on efficiency and ripple
characteristics, so care must be taken when designing. In the boost
configuration, there is a "Loop" as shown in the figure on the right.
Place the components in the Loop as close as possible (e.g., place
GND of COUT and PGND as close together).
Also, make sure that the wiring in each loop is as low impedance as
possible.
Refer to "page 28 PCB Application Circuit Diagram" for other detailed
precautions regarding PCB layout.
VCC
VCC
CVCC
CSH
LDSW
RCSH
M1
D1
CIN
SW
Loop
L1
D2
VOUT
COUT
PGND
Figure 36. Circuit of DC/DC Block
Loop
COUT
D2
Figure 37. BD83A04EFV-M PCB TOP-layer
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Power Consumption Calculation Example
The maximum value of IC power consumption can be easily calculated by the following procedure. Take heat dissipation
measures so that the rise in chip temperature due to this power consumption does not exceed Tjmax under the environmental
conditions (ambient temperature, heat dissipation fins, etc.) used by the customer.
𝑃𝐶(𝑀𝐴𝑋) = 𝐼𝐶𝐶(𝑀𝐴𝑋) × 𝑉𝐶𝐶(𝑀𝐼𝑁)
(1) Circuit power
+𝐶𝐼𝑆𝑆(𝑀𝐴𝑋) × 𝑉𝑅𝐸𝐺(𝑀𝐴𝑋) × 𝑓𝑂𝑆𝐶(𝑀𝐴𝑋) × 𝑉𝑅𝐸𝐺(𝑀𝐴𝑋)
(2) SW FET drive stage power
+{𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋) × 𝑀 + (𝑉𝑓(𝑀𝐴𝑋) − 𝑉𝑓(𝑀𝐼𝑁) ) × 𝑁 × (𝑀 − 1)} × 𝐼𝐿𝐸𝐷(𝑀𝐴𝑋)
(3) Current driver power
+
(𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) −𝑉𝐶𝐶(𝑀𝐼𝑁) )
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋)
× 𝑅𝑂𝑁_𝑆𝑊(𝑀𝐴𝑋) × 𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋) × 𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋)
(4) Power during SW FET ON
1
+𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋) × 𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) × × (𝑇𝑟(𝑀𝐴𝑋) + 𝑇𝑓(𝑀𝐴𝑋) ) × 𝑓𝑂𝑆𝐶(𝑀𝐴𝑋)
6
(5) SW FET switching power
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝑉𝑓(𝑀𝐴𝑋) × 𝑁 + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝐼𝐿𝐸𝐷(𝑀𝐴𝑋) × 𝑀
𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋) = 𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) × 𝐼𝑂𝑈𝑇(𝑀𝐴𝑋) /(𝜂 × 𝑉𝐶𝐶(𝑀𝐼𝑁) )
(6) Output voltage
(7) Output current
(8) Input (inductor) average current
𝑁
𝐼𝐿𝐸𝐷(𝑀𝐴𝑋)
𝑅𝑂𝑁_𝑆𝑊(𝑀𝐴𝑋)
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋)
: Number of LED series
: Maximum value of LED current per channel
: Maximum value of SW pin ON resistor
: Maximum output voltage
𝑓𝑂𝑆𝐶(𝑀𝐴𝑋)
𝑉𝑅𝐸𝐺(𝑀𝐴𝑋)
𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
𝑀
: Maximum value of IC power consumption
: Maximum value of circuit current
: Minimum value of power supply voltage
: Maximum value of SW FET gating
capacitance
: Maximum value of oscillation frequency
: Maximum value of reference voltage
: Maximum value of LED control voltage
: Number of LED parallels
𝑇𝑟(𝑀𝐴𝑋)
𝑇𝑓(𝑀𝐴𝑋)
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋)
𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋)
𝑉𝑓(𝑀𝐴𝑋)
𝑉𝑓(𝑀𝐼𝑁)
: Maximum value of LED Vf voltage
: Minimum value of LED Vf voltage
𝜂
: Maximum value of SW rise time
: Maximum value of SW fall time
: Maximum value of output current
: Maximum value of input (inductor) average
current
: Efficiency (about 85 %)
𝑃𝐶(𝑀𝐴𝑋)
𝐼𝐶𝐶(𝑀𝐴𝑋)
𝑉𝐶𝐶(𝑀𝐼𝑁)
𝐶𝐼𝑆𝑆(𝑀𝐴𝑋)
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Power Consumption Calculation Example – continued
Calculate IC power consumption using the following conditions as an example.
𝐼𝐶𝐶(𝑀𝐴𝑋)
𝑉𝐶𝐶(𝑀𝐼𝑁)
𝐶𝐼𝑆𝑆(𝑀𝐴𝑋)
𝑓𝑂𝑆𝐶(𝑀𝐴𝑋)
𝑉𝑅𝐸𝐺(𝑀𝐴𝑋)
𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
𝑀
Maximum value of circuit current
Minimum value of power supply
voltage
Maximum value of SW FET gating
capacitance
Maximum value of oscillation
frequency
Maximum value of reference
voltage
Maximum value of LED control
voltage
Number of LED parallels
10 mA
𝑉𝑓(𝑀𝐴𝑋)
Maximum value of LED Vf voltage 3.4 V
10.5 V
𝑉𝑓(𝑀𝐼𝑁)
Minimum value of LED Vf voltage
3.0 V
100 pF
𝑁
Number of LED series
8 stages
374 kHz
𝐼𝐿𝐸𝐷(𝑀𝐴𝑋)
5.3 V
𝑅𝑂𝑁_𝑆𝑊(𝑀𝐴𝑋)
Maximum value of LED current per
65 mA
channel
Maximum value of SW pin ON
0.4 Ω
resistor
0.74 V
𝑇𝑟(𝑀𝐴𝑋)
SW rise time
20 ns
4 rows
𝑇𝑓(𝑀𝐴𝑋)
SW fall time
20 ns
𝜂
Efficiency (about 90 %)
0.9
From equation (6),
𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝑉𝑓(𝑀𝐴𝑋) × 𝑁 + 𝑉𝐿𝐸𝐷𝐶𝑇𝐿(𝑀𝐴𝑋)
= 3.4 𝑉 × 8 + 0.74 𝑉
= 27.94 [V]
From equation (7),
𝐼𝑂𝑈𝑇(𝑀𝐴𝑋) = 𝐼𝐿𝐸𝐷(𝑀𝐴𝑋) × 𝑀
= 65 𝑚𝐴 × 4
= 260 [mA]
Substituting the values obtained in equations (6) and (7) into equation (8),
𝐼𝐿𝐴𝑉𝐺(𝑀𝐴𝑋) = 𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) × 𝐼𝑂𝑈𝑇(𝑀𝐴𝑋) /(𝜂 × 𝑉𝐶𝐶(𝑀𝐼𝑁) )
= 27.94 𝑉 × 260 𝑚𝐴/(0.9 × 10.5 𝑉)
= 0.77 [A]
Therefore, the maximum value of IC power consumption PC(MAX) is calculated as follows:
𝑃𝐶(𝑀𝐴𝑋) = 10 𝑚𝐴 × 10.5 𝑉
+100 𝑝𝐹 × 5.3 𝑉 × 374 𝑘𝐻𝑧 × 5.3 𝑉
+{0.74 𝑉 × 4 + (3.4 𝑉 − 3.0 𝑉) × 8 × (4 − 1)} × 65 𝑚𝐴
+{(27.9 𝑉 − 10.5 𝑉)/27.9 𝑉} × 0.4 𝛺 × 0.77 𝐴 × 0.77 𝐴
+0.77 𝐴 × 27.9 𝑉/6 × (20 𝑛𝑠 + 20 𝑛𝑠) × 374 𝑘𝐻𝑧
= 1.12 [W]
From thermal resistance θja = 30.1 °C/W, the maximum calorific value Δt(MAX) can be estimated by the following equation.
𝛥𝑡(𝑀𝐴𝑋) = 𝑃𝐶(𝑀𝐴𝑋) × 𝜃𝑗𝑎 = 1.12 𝑊 × 30.1 ℃/𝑊 = 33.7
[°C]
When the ambient temperature is 85 °C, the maximum chip temperature tC(MAX) is following.
𝑡𝐶(𝑀𝐴𝑋) = 85 ℃ + 33.7 ℃ = 118.7 [°C]
Make sure that tC(MAX) calculated here is less than Tjmax = 150 °C.
The above is a simple calculation example only. The value of thermal resistance varies depending on the actual board
conditions and layout. Confirm the calculation here as a guide for thermal design.
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Application Circuit Example
1 Peripheral Circuit When PMOS Is Not Used
When the load switch M1 is not required, such as when using FUSE on the input side, connect the CSH pin and inductor
L1 and open the LDSW pin.
Also, set FUSE rating to IFUSE or more.
𝐼𝐹𝑈𝑆𝐸 > 4.06 𝐴 +
𝑉𝐶𝐶(𝑀𝐴𝑋)
𝐿(𝑀𝐼𝑁)
𝐼𝐹𝑈𝑆𝐸
𝑉𝐶𝐶(𝑀𝐴𝑋)
𝐿(𝑀𝐼𝑁)
𝑡𝑂𝐶𝑃𝐿
× 𝑡𝑂𝐶𝑃𝐿
: FUSE rated current
: Maximum value of power supply voltage
: Minimum value of inductance
: OCPL detect delay time (MAX = 150 ns)
VCC
CVCC
1
REG
VCC 24
2
GND
CSH 23
EN
3
EN
PWM
4
PWM
N.C. 21
SYNC
5
SYNC
SW 20
6
RT
VREG
CREG
LDSW
22
M1
Nonmounted
D1
L1
CIN
D2
RRT
CCOMP RCOMP
7
COMP
8
ADIM
EXP-PAD
VOUT
COUT
PGND 19
ROVP2
OVP 18
RFAIL
VREG
FAIL
17
9
ISET
10
LGND
N.C. 15
11
LED1
LED4 14
12
LED2
LED3 13
ROVP1
VREG
VFAIL
RISET
PLSET 16
CPLSET
2 Monitoring the Status of the FAIL Pin with Microcontroller
OCPH function starts operation again after stopping operation for the specified timer time. Therefore, the FAIL pin
periodically outputs the detect/release flag until the error is cleared. In the case of a system configuration that monitors the
FAIL pin with a microcontroller, there is a possibility that it will be erroneously determined as a normal state even though it
is in an abnormal state. By adding CFAIL as shown below, it is possible to fix the FAIL output to Low in an abnormal state.
VCC
CVCC
VREG
CREG
1
REG
VCC 24
2
GND
CSH 23
EN
3
EN
PWM
4
PWM
SYNC
5
SYNC
6
RT
LDSW
RCSH
M1
22
D1
CIN
L1
N.C. 21
SW
D2
RRT
CCOMP RCOMP
EXP-PAD
VOUT
20
COUT
PGND 19
7
COMP
8
ADIM
9
ISET
10
LGND
11
LED1
LED4 14
12
LED2
LED3 13
ROVP2
OVP 18
RFAIL
VREG
FAIL
17
RISET
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N.C.
CPLSET
CFAIL
VREG
VFAIL
ROVP1
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I/O Equivalence Circuit
2.GND, 10.LGND,
19.PGND
1.REG, 24.VCC
VCC
3.EN
PGND
EN
REG
363 kΩ
150 kΩ
50 kΩ
GND
150 kΩ
LGND
4.PWM, 5.SYNC
30 kΩ
360 kΩ
GND
150 kΩ
GND
6.RT
7.COMP
REG
10 kΩ
10 kΩ
PWM
SYNC
RT
10 kΩ
COMP
400 Ω
100 kΩ
GND
GND
8.ADIM
GND
11 – 14.LED1 - LED4
9.ISET
REG
REG
REG
40 kΩ
10 kΩ
10 kΩ
ADIM
10 kΩ
ISET
LED1
LED2
LED3
LED4
10 kΩ
650 kΩ
2Ω
100 kΩ
GND
GND
16.PLSET
17.FAIL
REG
10 kΩ
PLSET
200 kΩ
LGND
18.OVP
REG
REG
FAIL
OVP
10 kΩ
10 kΩ
10 kΩ
1 kΩ
100 kΩ
GND
20.SW
GND
GND
22.LDSW
23.CSH
VCC
SW
VCC
1 pF
3 MΩ
LDSW
CSH
GND
GND
25 kΩ
PGND
All values are Typ values.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes - continued
10.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 38. Example of Monolithic IC Structure
11.
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12.
Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13.
Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14.
Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD83A04EFV-M
Ordering Information
B
D
8
3
A
0
4
E
F
V
Package
EFV: HTSSOP-B24
-
ME2
Product rank
M: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HTSSOP-B24 (TOP VIEW)
Part Number Marking
D83A04EF
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
17.Feb.2022
005
18.Aug.2022
006
Changes
New Release
P.6, 28
Added a note about the possibility of inrush current flowing when VCC is turned on with
EN=L.
P.24, 28
Changed description about RC filter for external synchronization and corrected typos.
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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