BD87007FJ-E2

Datasheet Built-in Low Consumption and High Accuracy Shunt Regulator High Efficiency, Low Standby Power and CCM Corresponding Secondary Side Synchronous Rectification Controller IC BD87007FJ Key Specifications General Description     BD87007FJ is synchronous rectification controller to be used in the secondary side output. It has a built-in low consumption and high accuracy shunt regulator, which reduces standby power. At continuous conduction mode (CCM) operation, further space saving can be realized when operating without the input switching synchronizing signal of the primary side. BD87007FJ also features a wide operating supply voltage of 2.7 V to 32.0 V for various output applications. In addition, by adopting the high voltage 120 V (Max) process, it is possible to monitor the drain voltage directly. Supply Voltage 2.7 V to 32.0 V Circuit Current (No Switching): 800 µA (Typ) DRAIN Monitor Pin Absolute Voltage: 120 V (Max) Operating Temperature Range: -40 °C to +105 °C Package W(Typ) x D(Typ) x H(Max) 4.90 mm x 6.00 mm x 1.65 mm SOP-J8 Features  Built-in Low Consumption and High Accuracy Shunt Regulator, which Reduces Standby Power  120 V (Max) High Voltage Process DRAIN Monitor Pin  Wide Supply Voltage Range of 2.7 V to 32.0 V  Supports Drive Type: PWM, QR Controller etc.  No Input Required on the Primary-Side at CCM  Built-in Over Voltage Protection for SH_IN and VCC Pin  Built-in Thermal Shutdown Function Applications  AC/DC Output Power Conversion Applications: Charger, Adapter, Household Appliance, etc. Typical Application Circuits RVCC RSH_OUT2 RSH_OUT1 RDRAIN1 VCC RFB1 PC1 RDRAIN2 DRAIN D1 SH_IN CFB1 RFB2 CFB2 Primary Controler VOUT CVCC SH_OUT NC SR_GND GATE LFB + COUT - R1 C1 MAX_TON RMAX_TON GND M1 Flyback Application Circuit (Low side FET) 〇Product structure : Silicon integrated circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Pin Configuration (TOP VIEW) 8 DRAIN 7 SR_GND 6 GATE 5 4 NC 3 SH_OUT 2 SH_IN 1 VCC MAX_TON Pin Description Pin No. Pin Name 1 VCC 2 SH_IN 3 SH_OUT 4 NC 5 MAX_TON 6 GATE 7 SR_GND 8 DRAIN Function Power supply input pin Shunt regulator reference input pin Shunt regulator power supply input / output pin Non connection (Do not connect this pin to any potential and keep it open.) Set maximum on time pin Secondary side FET GATE drive pin GND pin Secondary side FET DRAIN monitor pin Block Diagram VOUT + - GND Primary Side Controller SR_GND SH_OUT SH_IN GATE DRAIN VCC SHUNT REGULATOR LDO BLOCK + DRAIN COMP Driver + VCC x 1.4 (Typ) SET COMP - S Q 0.800 V (Typ) PROTECTION BLOCK ・SH_IN_OVP ・VCC_OVP ・TSD Timer Auto Restart + MAX_TON -100 mV (Typ) R MAX_TON BLOCK RESET COMP + - Compulsion OFF Time -6 mV (Typ) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Description of Block 1. SET COMP Block Monitors the DRAIN pin voltage, and outputs a signal to turn on the FET if the DRAIN pin voltage is -100 mV (Typ) or less. 2. RESET COMP Block Monitors the DRAIN pin voltage, and outputs a signal to turn off the FET if the DRAIN pin voltage is -6 mV (Typ) or more. 3. Compulsion OFF Time Block When the FET is turned OFF due to RESET COMP detection, resonance waveforms appear on the DRAIN pin. To prevent the resonance waveforms from turning on the FET, an OFF state should be forced for a certain time. Operation sequence of each block is shown on the figure below. VOUT Secondary Side 0V DRAIN -6 mV -6 mV -100 mV SET COMP 0 V -6 mV -100 mV -100 mV ON -6 mV -100 mV ON RESET RESET RESET COMP 0 V Secondary side 0V GATE OFF ON Compulsion OFF Time 0 V OFF Time ON OFF Time Figure 1. Operation Sequence About Maximum Input Frequency The Maximum Operating Frequency of the IC depends on the Compulsion OFF Time. For example, BD87007FJ Compulsion OFF Time is equal to 3.850 μs. Considering a variation of 9.09 %, the maximum input frequency is given by the following: 1 𝑓𝑀𝐴𝑋 = 3.850(µ𝑠)×1.0909 ≈ 238 [kHz] However, because the frequency largely fluctuates depending on the input voltage, load conditions, etc., it will be different for each application. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Description of Block – continued 4. MAX_TON Block MAX_TON block sets the maximum ON time. It starts the counting when the DRAIN pin voltage is on the rising edge of the output voltage VCC x 1.4 V (Typ) or more. In addition, the FET will be forced OFF after the set time has elapsed. The relationship between the resistance value (RMAX_TON) and set time (tMAX_ON) is described as follows: 𝑡𝑀𝐴𝑋_𝑇𝑂𝑁 [µs] × 10 [kΩ/µs] = 𝑅𝑀𝐴𝑋_𝑇𝑂𝑁 [kΩ] Calculation Example: If you want to set the maximum ON time to 10 µs, the value of RMAX_TON is as follows: 10 [µs] × 10 [kΩ/µs] = 100 [kΩ] However, the formula above is for an ideal approximation only. It is strongly advised that the operation of the actual application should be verified. By setting this time, it becomes possible to prevent the simultaneous ON operation of the primary side and the secondary side in CCM. The drive sequence in CCM operation is shown in the figure below: VOUT I2 + - VF I1 GND (1) VG1 0V I1 0A I2 0A (1) (3) LFB VG1 Primary Side Controller VG2 RDRAIN2 RDRAIN1 D1 GATE SR_GND DRAIN VCC VDS2 LDO BLOCK VCC x 1.4 DRAIN COMP Driver + VCC x 1.4 (Typ) VDS2 SET COMP 0V + -100 mV (Typ) RMAX_TON VG2 MAX_TON timer RESET COMP + - 0V Compulsion OFF Time (2) -6 mV (Typ) tMAX_ON Timer Start MAX_TON BLOCK (6) -VF (4) R MAX_TON -100mV -100 mV Q (5) tMAX_ON Compulsion OFF S Timer Start R1 Compulsion OFF - C1 Period allotted for VG1 and VG2 to avoid concurrent ON state at CCM. Figure 2. The Drive Sequence in CCM Operation (1) (2) (3) (4) (5) (6) Primary side FET = ON. Current I1 flows to the primary side FET. Secondary side drain voltage VDS2 rises. The VDS2 = VCC x 1.4 detects the rise edge of the threshold, MAX_TON timer start. Primary side FET = OFF. Current I2 flows through the Body Diode of the secondary side FET (OFF state). Secondary side drain voltage VDS2 ≤ -100 mV by current I2, Secondary side FET = ON. Elapsed the set time in the MAX_TON pin, the secondary side FET = compulsion OFF. Since the I2 current flows through the Body Diode, VF voltage occurs. In order to reduce the influence of the switching noise as much as possible, capacitor C1 and resistor R1 in series should be connected to the MAX_TON pin. It is recommended that the capacitance be about 1000 pF and the resistance value be about 1 kΩ. This also serves as phase compensation of the MAX_TON pin and therefore should be connected. For quasi-resonance (QR) application, this function is unnecessary because it basically does not operate in CCM. At this time, the setting method of the MAX_TON pin is invalidated by setting RMAX_TON which is sufficiently large (300 kΩ or less) so that the minimum time of one period on the primary side including variation etc. tMAX_ON). 𝑅𝑀𝐴𝑋_𝑇𝑂𝑁 < 10×103 (1+𝛥𝑡𝑀𝐴𝑋_𝑂𝑁 +𝛥𝑅+𝛥𝑓𝑀𝐴𝑋 )×(𝑓𝑀𝐴𝑋 +𝑓𝐽𝐼𝑇𝑇𝐸𝑅 ) Frequency Variation Ratio [kΩ] Maximum Frequency Value where: fMAX is the primary side of the maximum frequency [kHz] ∆fMAX is the primary side of the maximum frequency accuracy [%] fJITTER is the primary side of the jitter frequency [kHz] ∆tMAX_ON is Secondary side MAX_TON timer time accuracy [%] ∆R is Secondary side MAX_TON When the connection resistance accuracy [%] 2. Calculation Example 𝑅𝑀𝐴𝑋_𝑇𝑂𝑁 < 10×103 (1+0.06+0.01+0.05)×(100+8) = 82.67 [kΩ] fMAX is the primary side of the maximum frequency 100[kHz] ∆fMAX is the primary side of the maximum frequency accuracy 5[%] fJITTER is the primary side of the jitter frequency 8[kHz] ∆tMAX_ON is Secondary side MAX_TON timer time accuracy 6[%] ∆R is Secondary side MAX_TON When the connection resistance accuracy 1[%] With these conditions, MAX_TON Resistor (RMAX_TON) should be set to 82 kΩ or less. In addition, it is recommended that the temperature characteristics of each component should also be taken into account. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ I/O Equivalence Circuits Pin 1: VCC / Pin 6: GATE / Pin 7: SR_GND Pin 8: DRAIN Internal REG 8.DRAIN 1.VCC SR block 6.GATE 7.SR_GND 7.SR_GND Pin 2: SH_IN / Pin 3: SH_OUT Pin 5: MAX_TON 1.VCC Internal REG 3.SH_OUT 2.SH_IN 7.SR_GND 5.MAX_TON 7.SR_GND www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Notes on the Layout RVCC RSH_OUT1 VOUT RSH_OUT2 PC1 (1) (5) CVCC (6) (2) VCC DRAIN RFB1 SH_IN + COUT - SR_GND CFB1 RFB2 SH_OUT GATE R1 C1 (3) (8) RDRAIN2 MAX_TON RDRAIN1 RMAX_TON NC D1 CFB2 (5) M1 LFB GND Rsnb Csnb (7) (4) Figure 16. Flyback Application Circuit (Low Side FET) (1) (2) (3) (4) (5) (6) (7) (8) VCC line may malfunction under the influence of switching noise. Therefore, it is recommended to insert a capacitor CVCC between the VCC and SR_GND pin. The SH_IN pin is a high impedance line. To avoid crosstalk, electrical wiring should be as short as possible and not in parallel with the switching line. The MAX_TON pin has a 0.4 V output. Therefore, there is a possibility that compulsion OFF time is affected by the switching operation. We recommend connecting RMAX_TON, R1, C1 just before the MAX_TON pin output as much as possible and connecting to the SR_GND pin with independent wiring. It is also recommended to use an independent electrical wiring in connection with the SR_GND pin. The synchronous rectification controller IC must accurately monitor the V DS generated in the FET. Accordingly, the electrical wiring between the DRAIN to DRAIN and SR_GND to SOURCE of the IC and FET respectively should be connected independently. The feedback resistors of VOUT are recommended to be connected to the GND of the output with an independent electrical wiring. The DRAIN pin is a switching line. Use a narrow wiring and connect as short as possible. Use an independent wiring if connecting a snubber circuit between the DS of the FET. The connection of the transformer output and the SOURCE of the FET should be thick and short as possible. Due to the DRAIN pin detects the small voltage, a malfunction which the switch turns ON/OFF caused by the surge voltage may occur. So that, the filters such as the ferrite bead are recommended for alleviating the surge voltage. Select LFB with high impedance type in the frequency range (1 MHz to 10 MHz). If the ferrite bead is unnecessary, short the wiring. Configuration example(Note 6): D1 (a schottky barrier diode): RB751VM-40 (ROHM) RDRAIN1 (a filter resistor for the FET turn off): 0.3 kΩ to 2 kΩ RDRAIN2 (a current limiting resistor to the DRAIN pin): 150 Ω (Note 6) The value is not a guaranteed value, but for reference. Please choose the optimum values of the components after sufficient evaluations based on the actual application. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 17. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Ordering Information B D 8 7 0 Part Number 0 7 F J - Package FJ: SOP-J8 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP-J8 (TOP VIEW) Part Number Marking 8 7 0 0 7 LOT Number Pin 1 Mark www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Physical Dimension and Packing Information Package Name www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SOP-J8 19/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 BD87007FJ Revision History Date Revision 11.Jul.2019 001 Changes New Release www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/20 TSZ02201-0F2F0A200350-1-2 11.Jul.2019 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. 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Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001