Boost DC/DC Converter IC for TV tuner
BD8924G
General Description
Key Specifications
Input Voltage Range:
Output Voltage
Output Current:
Switching Frequency:
Operating Temperature Range:
Boost DCDC converter IC for TV tuner output 31V from
5V input voltage. It is possible to contribute to no
adjustment and miniaturization of the set.
Features
Over Current Protection.
Small Package.
Built-in UVLO(Under voltage Lockout).
STB.
Personal Medical Products.
Package
4.5V to 5.5V
31V
4mA(Max)
400kHz(Typ)
-30°C to +85°C
W(Typ) x D(Typ) x H(Max)
2.80mm x 2.90mm x 1.25mm
SSOP5
Applications
TV tuner(Analog・Digital).
TV.
Blue-ray Disc.
STB.
Personal Medical Products
Typical Application Circuit
VCC=5V
L1
C1
10uF
47uH
OUTPUT
Di(RB501V-40)
VIN SW
R1
VOUT
OUTPUT (RC filter)
C2
1.0uF
Control Circuit
C3
R2
250kΩ
R1
18kΩ
GND
〇Product structure : Silicon monolithic integrated circuit
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BD8924G
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration(s) ........................................................................................................................................................................ 3
Pin Description(s) ........................................................................................................................................................................... 3
Input-Output Equivalent Circuit ....................................................................................................................................................... 3
Block Diagram(s) ............................................................................................................................................................................ 4
Description of Block(s) .................................................................................................................................................................... 4
Absolute Maximum Ratings (Ta = 25°C) ......................................................................................................................................... 5
Recommended Operating Conditions ............................................................................................................................................. 5
Electrical Characteristics(Unless otherwise specified Ta=25℃、VIN=5V) ...................................................................................... 5
Typical Performance Curves ........................................................................................................................................................... 6
Figure 1. VIN vs ICC
Figure 2. VIN vs Frequency .............................................................................................................. 6
Figure 3. IOUT vs Efficiency
Figure4. IOUT vs VOUT........................................................................................................ 6
Application Example1 ..................................................................................................................................................................... 8
Selection1 of Components Externally Connected ........................................................................................................................... 8
Application Example2 ..................................................................................................................................................................... 9
Selection2 of Components Externally Connected ........................................................................................................................... 9
Power Dissipation ......................................................................................................................................................................... 10
About board layout ........................................................................................................................................................................ 10
Operational Notes ......................................................................................................................................................................... 11
Ordering Information ..................................................................................................................................................................... 13
Marking Diagrams ......................................................................................................................................................................... 13
Physical Dimension, Tape and Reel Information ........................................................................................................................... 14
Revision History ............................................................................................................................................................................ 15
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Pin Configuration(s)
VIN
GND
5
4
GND
3
4
VIN
1
2
SW
GND
5
VOUT
TOP VIEW
1
2
3
SW
GND
VOUT
SSOP5
Pin Description(s)
Symbol
Pin No.
Function
1
2
3
4
5
Inductor connection terminal
GND
Boost voltage output
GND
Power supply input
SW
GND
VOUT
GND
VIN
Terminal
circuit
B
C
A
C
D
Input-Output Equivalent Circuit
I/O equivalent circuit diagram is as follows.
A
D
C
B
PAD
PAD
PAD
PAD
A
PAD
B
C
PAD
PAD
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D
PAD
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BD8924G
Block Diagram(s)
VIN
SW
VOUT
OPEN PROTECT
UVLO
PWM comp.
S
Q1
Q
Control
R
Current
Sense
+
+
+
ERRAMP
OSC
GND
Description of Block(s)
1) Under voltage Lockout (UVLO)
DCDC converter stops the boost action when power-supply voltage drops to detect voltage.
UVLO release automatically when power-supply voltage rise, Release voltage is 3.2V to 4.2V.
2) Over Current Protection
Over current protection circuit work when over current run to Q1.
3) Open Protect
Q1 is OFF and prevent over current when VOUT terminal is Open.
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Maximum applied voltage 1
Maximum applied voltage 2
Power dissipation
Operating temperature range
Storage temperature range
*1
Symbol
Vmax1
Vmax2
Pd
Topr
Tstr
Ratings
7
36
674.9 (*1)
-30 ～ +85
-55 ～ +150
Unit
V
mW
mW
o
C
o
C
Condition
It applies to VIN terminal
It applies to SW, VOUT terminals
At single unit
Pd derated at 5.4mW/℃ for temperature above Ta=25℃,mounted on 70mm×70mm×1.6mm glass-epoxy PCB.
Recommended Operating Conditions
Parameter
Operation power supply voltage
Symbol
VCC
Ratings
4.5～5.5
Unit
V
Condition
VIN terminal voltage
Electrical Characteristics(Unless otherwise specified Ta=25℃、VIN=5V)
Parameter
Circuit current 1
Oscillation frequency
Maximum output current1
Maximum output current2
Output voltage range
Symbol
Min.
Typ.
Max.
Unit
ICC1
fsw
Iomax1
Iomax2
Vomax
250
2.0
4.0
30.0
1.0
400
31.0
2.0
600
32.0
mA
kHz
mA
mA
V
Vst
4.2
-
-
V
Eff
-
58.4
-
%
Ron
Clim
LoadR
LineR
-
3.2
270
100
50
-
Ω
mA
mV
mV
Oscillation beginning
power-supply voltage
Efficiency
ON Resistance
Over Current Limiter Value
Load Regulation
Line Regulation
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Condition
Vout=35V force
L1=47uH, C2=1uF
L1=68uH, C2=1uF, C4≧15uF
Io=0mA
VIN Terminal Voltage
The oscillation is confirmed with
SW pin.
L=47uH, Io=2mA
SW = 100mA force
0mA to 2mA
4.5V to 5.5V
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BD8924G
Typical Performance Curves
Cu r r e n t Co n s u m p t i o n I CC (V O UT = 7 . 0 V )
S wi t c h i n g Fr e q u e n c y
This is only VIN current.
Not include SW current.
500
1.4
1.2
105℃
Freqency [MHz]
Icc(VIN)[mA]
0.8
-50℃
0.6
105
450
25℃
1
25℃
400
-
0.4
350
0.2
0
300
0
1
2
3
4
5
6
7
4
4.5
VIN [V]
5
5.5
VIN [V]
Figure 1. VIN vs ICC
Figure 2. VIN vs Frequency
Lo a d R e g u l a t i o n
E ffi c i e n c y
100
31
80
30.8
5.5V
VOUT [V]
5.0V
60
Eff [%]
4.5V
40
20
30.6
5 .5 V
30.4
5 .0 V
4 .5 V
30.2
0
30
0
0.5
1
1.5
2
2.5
3
3.5
4
0
Iout [mA]
2
3
4
Iout [mA]
Figure 3. IOUT vs Efficiency
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Figure4. IOUT vs VOUT
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Typical Performance Curves
– continued
INPUT
VOLTAGE
5V/div
OUTPUT
VOLTAGE
10V/div
INDUCTOR
CURRENT
200mA/div
200usec/div
Fig5. EXITING SHUTDOWN
(Condition:Vin=5V, VOUT=31V, Iload=0mA)
100msec/div
Fig6. ENTERING SHUTDOWN
(Condition:Vin=5V, VOUT=31V, Iload=0mA)
OUTPUT
VOLTAGE
10mV/div
SW
VOLTAGE
20V/div
INDUCTOR
CURRENT
50mA/div
1usec/div
Fig7. LIGHT-ROAD SWITCHING WAVEFORM
(Condition:Vin=5V, VOUT=31V, Iload=0mA)
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1usec/div
Fig8. ILOAD SWITCHING WAVEFORM WITHOUT
RCFILTER
(Condition:Vin=5V, VOUT=31V, Iload=2mA)
TSZ02201-0Q1Q0AC00260-1-2
26.Jan.2015 Rev.001
BD8924G
Application Example1
In the case of Iomax ≦ 2mA
< Recommend Circuit >
VCC=5V
L1
C1
10uF
47uH
OUTPUT
Di(RB501V-40)
VIN SW
R1
VOUT
OUTPUT (RC filter)
C2
1.0uF
Control Circuit
C3
R2
250kΩ
R1
18kΩ
GND
Selection1 of Components Externally Connected
Recommend RC filter when TV reception is bad with noise.
Parts No.
L1
C1
C2
C3
R1
Name
Inductance
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Resistance
Value
47uH
10uF～
1uF～
-
Use
For Boost
Input decoupling
Output decoupling
LPF
LPF
< About external parts >
(1) Input decoupling capacitor (C1)
Please connect the ceramic capacitor of 10uF or more nearest of LSI for low the impedance of VIN (power supply terminal).
The capacity value should be made big according to the state of the output noise and the substrate.
(2) About Inductor (L1)
The inductor must use 47uH one. The characteristic that the direct current resistance is small, and the big one of the
current rating is excellent is obtained about the selection of the inductor. It decides about the current rating of the inductor
depending on the output voltage and the current that is necessary.
Moreover, the current of up to 270mA flows to the inductor when the inductor is in saturated region though a current limiter
is built into BD8924G. Please inquire details about current rush of the inductor manufacturer.
(3) Output capacitor (C2)
Please use the ceramic capacitor of 1uF or more for an output smooth ripple. The voltage of 32V or more add to this
capacitor. Please it joins and notices the resisting pressure and considers it is possible to pull out capacity by the temperature
characteristic and the direct current bias characteristic about the capacitor. Especially, please note that the change in the
direct current bias characteristic is large about the capacitor with small size of the case.
Please arrange this capacitor in nearest LSI as well as C1.
(4) LPF
Please compose LPF of R3 and C3, and cut the noise. (Especially needs in analog tuner.)
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BD8924G
Application Example2
In the case of 2mA ＜ Iomax ≦ 4mA
< Recommend Circuit >
VCC=5V
L1
C1
10uF
68uH
OUTPUT
Di(RB501V-40)
VIN SW
R1
VOUT
OUTPUT (RC filter)
C2
1.0uF
Control Circuit
C3
+ C4
15uF
R2
250kΩ
R1
18kΩ
GND
Selection2 of Components Externally Connected
Recommend RC filter when TV reception is bad with noise.
Parts No.
L1
C1
C2
C3
C4
R1
Name
Inductance
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Aluminum Electrolytic Capacitor
Resistance
Value
68uH
10uF～
1uF～
15uF～
-
Use
For Boost
Input decoupling
Output decoupling
LPF
Output decoupling
LPF
< About external parts >
(1) Input decoupling capacitor (C1)
Please connect the ceramic capacitor of 10uF or more nearest of LSI for low the impedance of VIN (power supply terminal).
The capacity value should be made big according to the state of the output noise and the substrate.
(2) About Inductor (L1)
The inductor must use 68uH one. The characteristic that the direct current resistance is small, and the big one of the
current rating is excellent is obtained about the selection of the inductor. It decides about the current rating of the inductor
depending on the output voltage and the current that is necessary.
Moreover, the current of up to 270mA flows to the inductor when the inductor is in saturated region though a current limiter
is built into BD8924G. Please inquire details about current rush of the inductor manufacturer.
(3) Output capacitor (C2 and C4)
Please use the ceramic capacitor of 1uF or more and Aluminum Electrolytic Capacitor of 15uF or more for an output
smooth ripple. The voltage of 32V or more add to these capacitors. Please it joins and notices the resisting pressure and
considers it is possible to pull out capacity by the temperature characteristic and the direct current bias characteristic about
the capacitor. Especially, please note that the change in the direct current bias characteristic is large about the capacitor with
small size of the case.
Please arrange these capacitors in nearest LSI as well as C1.
(4) LPF
Please compose LPF of R3 and C3, and cut the noise. (Especially needs in analog tuner.)
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BD8924G
Power Dissipation
In the heat design, please operate it in the following condition.
(Please consider the margin etc. because the following temperature is a guarantee temperature.)
1. Surrounding temperature Ta must be 85℃ or less.
2. Loss of IC must be permissible loss Pd or less.
The allowable dissipation (Pd) characteristics are described below.
0.8
POWER DISSIPATION : Pd(W)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
TEMPARATURE : Ta(℃)
About board layout
BD8924G is switching DCDC converter, so characteristics of noise and etc changing by board layout. Please note the
following respect besides a general board layout matter when you make PCB.
VOUT
VOUT
VIN
Coil
VIN
Coil
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground
at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using
electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure xx. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD8924G
Ordering Information
B
D
8
9
2
4
Part Number
G
-
Package
G:SSOP5
GTR
Packaging and forming specification
G: Halogen free
TR: Embossed tape and reel
(HRP7)
Marking Diagrams
SSOP5(TOP VIEW)
D
0
Part Number Marking
LOT Number
Part Number Marking
Package
Orderable Part Number
D0
SSOP5
BD8924G-GTR
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Physical Dimension, Tape and Reel Information
Package Name
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SSOP5
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BD8924G
Revision History
Date
Revision
26.Jan.2015
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.004
