Datasheet
2.7V to 5.5V, 2A 1ch
Synchronous Buck Converter integrated FET
BD89630EFJ
BD89630JEFJ
●General Description
ROHM’s high efficiency step-down switching regulator
BD89630EFJ and BD89630JEFJ are power supplies
designed to produce a low voltage including 1 volts
from 5.5/3.3 volts power supply line. Offer high
efficiency with synchronous rectifier. Employ a current
mode control system to provide fast transient response
to sudden change in load.
●Key Specification
◼ Input voltage range:
◼ Output voltage range:
◼ Average output Current:
◼ Switching frequency:
◼ Pch FET ON resistance:
◼ Nch FET ON resistance:
◼ Standby current:
◼ Operating temperature range:
●Features
◼ Offers fast transient response with current mode
PWM control system.
◼ Offers highly efficiency for all load range with
synchronous rectifier (Nch/Pch FET)
◼ Incorporates soft-start function.
◼ Incorporates thermal protection and UVLO
functions.
◼ Incorporates short-current protection circuit with
time delay function.
◼ Incorporates shutdown function
●Package
HTSOP-J8
2.7V to 5.5V
1.0V to 2.5V
2A(Max.)
1MHz(Typ.)
145mΩ(Typ.)
80mΩ(Typ.)
5μA (Typ.)
-25℃ to +85℃
(Typ.)
(Typ.)
(Max.)
4.90mm x 6.00mm x 1.00mm
●Applications
Power supply for LSI including DSP, Micro computer
and ASIC
HTSOP-J8
●Typical Application Circuit
VCC
Cin
L
EN
VADJ
VCC
SW
VOUT
ADJ
COMP
RFB1
GND
RCOMP
VADJ
CO
RFB2
CCOMP
Fig.1 Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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●Pin configuration(TOP VIEW)
COMP
ADJ
GND
N.C
EN
SW
VCC
SW
Fig.2 Pin configuration
●Pin Description
Pin No.
Pin name
PIN function
1
COMP
GmAmp output pin/phase compensation pin
2
GND
3
EN
Enable pin(Active High, Open Active)
4
VCC
VCC power supply input pin
5
SW
Pch/Nch FET drain output pin
6
SW
Pch/Nch FET drain output pin
7
N.C
Non Connect
8
ADJ
Output voltage detect pin
Ground
●Block Diagram
VCC
SW
SW
GND
Fig.3 Block Diagram
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●Absolute Maximum Ratings
Parameter
VCC Voltage
EN Voltage
Symbol
Ratings
Unit
VCC
-0.3 to +7 *1
V
VEN
-0.3 to +7
V
VSW,VCOMP
-0.3 to +7
V
Pd1
0.5*2
W
Power Dissipation 2
Pd2
3.76*3
W
Operating temperature range
Topr
-25 to +85
℃
Tstg
-55 to +150
℃
Tjmax
+150
℃
SW,COMP Voltage
Power Dissipation 1
Storage temperature range
Maximum junction temperature
*1
*2
*3
Pd should not be exceeded.
Reduced by 4.0mW for increase in Ta of 1℃ above 25℃.
Reduced by 30.0mW for increase in Ta of 1℃ above 25℃.
(when mounted on a board 70.0mm × 70.0mm × 1.6mm Glass-epoxy PCB(Copper foil density 3%))
●Recommended Operating Ratings (Ta=-25 to +85℃)
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Vcc Voltage
VCC
2.7 *5
5.0
5.5
V
EN Voltage
VEN
0
-
Vcc
V
-
2.5*4
V
-
2.0*5
A
Output voltage range
SW average output current
*4
*5
VOUT
Isw
1.0
-
In case set output voltage 1.6V or more, VccMin. = Vout +2.25V
Pd should not be exceeded.
●Electrical Characteristics (Unless otherwise specified , Ta=25℃ VCC=5V, EN=VCC, R1=20kΩ, R2=7.5kΩ)
Limit
Parameter
Symbol
Unit
Min.
Typ.
Max.
Standby Current
ISTB
-
5
20
µA
Bias Current
ICC
-
350
600
µA
Conditions
EN=GND
EN Low Voltage
VENL
-
GND
0.3
V
Stand-by Mode
EN High Voltage
VENH
2.0
VCC
-
V
Active Mode
EN Input Current
IEN
-
1.25
10
µA
VEN=5V
Oscillation Frequency
FOSC
0.8
1
1.2
MHz
Pch FET ON Resistance
RONP
-
145
290
mΩ
VCC=5V
Nch FET ON Resistance
RONN
-
80
160
mΩ
VCC=5V
ADJ Reference Voltage
VADJ
0.788
0.800
0.812
V
COMP SINK Current
ICOSI
10
25
-
µA
VADJ=1.0V
COMP Source Current
ICOSO
10
25
-
µA
VADJ=0.6V
UVLO Detect Voltage
VUVLO1
2.400
2.500
2.600
V
Vcc=5V→0V
UVLO Release Voltage
VUVLO2
2.425
2.550
2.700
V
Vcc=0V→5V
TSS
0.5
1
2
ms
TLATCH
1
2
4
ms
VSCP
-
VOUT×0.5
VOUT×0.7
V
Soft Start Time
Timer Latch Time
Output Short circuit Threshold Voltage
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●Typical Performance Curves
Fig.5 VEN-Vout
Fig.4 Vcc-Vout
Fig. 7 Ta-VOUT
Fig.6 IOUT-VOUT
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BD89630EFJ
100
90
EFFICIENCY[%]
80
BD89630JEFJ
【VOUT=1.1V】
VCC=5.0V
Ta=25℃
70
60
50
40
30
20
10
0
10
100
1000
OUTPUT CURRENT:IOUT[mA]
10000
Fig.8 Efficiency
Fig.9 Ta-FOSC
Fig.11 Ta-VEN
Fig.10 Ta-RONN, RONP
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Fig.12 Ta-ICC
Fig.13 Vcc-FOSC
Fig.15 SW waveform Io=10mA
Fig.14 Soft start waveform
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Fig. 16 Transient response
Io=0.5A→1.5A(10µs)
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Fig. 17 Transient response
Io=1.5A→0.5A(10µs)
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Application Information
●Operation
○Synchronous rectifier
It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC,
and its P.N shoot-through protection circuit limits the shoot-through current during operation, by which the power
dissipation of the set is reduced.
○Current mode PWM control
Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback.
・PWM (Pulse Width Modulation) control
The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a P-channel MOS FET (while a
N-channel MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp)
receives two signals, a current feedback control signal (SENSE: Voltage converted from IL) and a voltage feedback
control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the
P-channel MOS FET (while a N-channel MOS FET is turned ON) for the rest of the fixed period. The PWM control
repeat this operation.
SENSE
Current
Comp
RESET
VOUT
Level
Shift
R Q
FB
SET
Gm Amp.
COMP
S
IL
Driver
Logic
VOUT
SW
Load
OSC
Fig.18 Diagram of current mode PWM control
PVCC
Current
Comp
SENSE
Current
Comp
FB
SET
GND
SET
RESET
GND
RESET
SW
GND
SW
IL
IL(AVE)
VOUT
VOUT(AVE)
VOUT
Fig.19 PWM switching timing chart
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●Description of operations
・Soft-start function
EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited
during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current.
・Shutdown function
With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference
voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 5µA (Typ.).
・UVLO function
Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied.
of 50mV (Typ.) is provided to prevent output chattering.
And the hysteresis width
Hysteresis 50mV
VCC
EN
VOUT
Tss
Tss
Tss
Soft start
Standby mode
Standby
mode
Operating mode
Operating mode
UVLO
UVLO
Standby
mode
Operating mode
EN
Standby mode
UVLO
Fig.20 Soft start, Shutdown, UVLO timing chart
・Short-current protection circuit with time delay function
Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for
the fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking
UVLO.
EN
Output OFF
latch
Output Short circuit
Threshold Voltage
VOUT
IL Limit
IL
t1 IRMS(max.)
IOUT
When Vcc is twice the VOUT, IRMS=
Fig.28 Input capacitor
2
If VCC=5V, VOUT=1.1V, and IOUTmax.= 2A, (BD89630EFJ BD89630JEFJ)
√1.1×(5-1.1)
=0.828[ARMS]
35
.
A low ESR 22µF/10V ceramic capacitor is recommended to reduce3 ESR dissipation of input capacitor for better efficiency.
IRMS=2×
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4. Determination of RCOMP, CCOMP that works as a phase compensator
As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area
due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high
frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the
power amplifier output with C and R as described below to cancel a pole at the power amplifier.
fp(Min.)
1
2π×RO×CO
1
fz(ESR)=
2π×ESR×CO
fp=
A
Gain
[dB]
fp(Max.)
0
fz(ESR)
IOUTMin.
Phase
[deg]
Pole at power amplifier
When the output current decreases, the load resistance Ro
increases and the pole frequency lowers.
IOUTMax.
0
-90
fp(Min.)=
1
[Hz]←with light load
2π×ROMax.×CO
fp(Max.)=
1
2π×ROMin.×CO
Fig.29 Open loop gain characteristics
A
fz(Amp.)
[Hz] ←with heavy load
Zero at power amplifier
Increasing capacitance of the output capacitor lowers the pole
frequency while the zero frequency does not change. (This is
because when the capacitance is doubled, the capacitor ESR
reduces to half.)
Gain
[dB]
0
0
Phase
[deg]
fz(Amp.)=
-90
1
2π×RITH×CITH
Fig.30 Error amp phase compensation characteristics
VCC
Cin
EN
VADJ
VCC
L
SW
VOUT
ADJ
COMP
RFB
1
GND
CO
RCOMP
VADJ
RFB
2
CCOMP
Fig.31 Typical application
Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load
resistance with CR zero correction by the error amplifier.
fz(Amp.)= fp(Min.)
1
2π×RCOMP×CCOMP
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2π×ROMax.×CO
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5. Determination of output voltage
The output voltage VOUT is determined by the equation (6):
VOUT=(R2/R1+1)×VADJ・・・(6) VADJ: Voltage at ADJ terminal (0.8V Typ.)
With R1 and R2 adjusted, the output voltage may be determined as required.
5
L
6
Output
SW
Co
R2
8
Adjustable output voltage range : 1.0V to 2.5V
ADJ
R1
Fig.32 Determination of output voltage
If a resistor of the resistance higher than 100 kΩ is used, check the assembled set
The lower limit of input voltage depends on the output voltage.
Basically, it is recommended to use in the condition :
VCCmin = VOUT+2.25V.
Fig.33. shows the necessary output current value at the lower limit of
input voltage. (DCR of inductor : 0.05Ω)
This data is the characteristic value, so it’ doesn’t guarantee the
operation range,
4.7
Input Voltage : Vcc [V]
Use 1 kΩ to 100 kΩ resistor for R1.
carefully for ripple voltage, etc.
Vo=2.5V
4.2
3.7
Vo=2.0V
3.2
Vo=1.8V
2.7
0
0.5
1
1.5
Outcurrent : Iout [A]
2
Fig.33 minimum input voltage in each output voltage
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●Cautions on PC Board layout
VCC
①
Vout
L1
①5
SW
VCC
SW
EN
6
②,④
7
R2
GND
ADJ
COMP
①,③
3
C3
2
①,③
②,④
1
R3
C2
①,③
8
N.C
4
⑥
R1
C1
⑤
Fig.34 Layout diagram
①To avoid conduction loss, please keep Black thick line as short and thick as possible.
②Don't close to switching current loop.
③Close to IC pin as possible.
④Keep PCB trace as short as possible.
⑤Use single point ground structure to connect with Pin2.
⑥Close to C2 as possible.
※ HTSOP-J8 (BD89630EFJ BD89630JEFJ) has thermal PAD on the reverse of the package.
The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area
of PCB.
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Top Silkscreen Overlay
Top Layer
Middle Layer
Bottom Layer
Bottom Silkscreen Overlay
Fig.35 Reference PCB Layout Pattern
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●Recommended components Lists on above application
Symbol
Part
L
Coil
CIN
Ceramic capacitor
CO
Ceramic capacitor
CCOMP
RCOMP
Ceramic capacitor
Resistance
Value
Manufacturer
1.5µH
Series
TDK
VLC6045T-1R5N
Vcc-VOUT>3V
10µF
Kyocera
CM316X5R106M10A
Vcc-VOUTTerminal A (at resistor side), or GND>Terminal B (at transistor side); and
○if GND>Terminal B (at NPN transistor side),
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
Resistor
Transistor (NPN)
Pin A
Pin B
C
B
Pin B
E
Pin A
N
+
N
P
N
+
P
P
N
P substrate
Parasitic element
GND
P+
Parasitic
element
B
N
C
+
P
P
N
E
P substrate
Parasitic element
GND
GND
GND
Parasitic
element
Other adjacent elements
Fig.37 Simplified structure of monorisic IC
8. Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
9. Selection of inductor
It is recommended to use an inductor with a series resistance element (DCR) 0.1Ω or less. Especially, in case output
voltage is set 1.6V or more, note that use of a high DCR inductor will cause an inductor loss, resulting in decreased
output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit
protection will be activated and output will be latched OFF. When using an inductor over 0.1Ω, be careful to ensure
adequate margins for variation between external devices and this IC, including transient as well as static characteristics.
Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is within operation range.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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●Ordering Information
B
D
8
9
6
3
0
x
Production
Line NOTE
None :
Production
Line A
“J” :
Production
Line B
Product Name
Package
Remarks
BD89630EFJ-E2
Production Line A(Note 1)
BD89630JEFJ-E2
Production Line B(Note 1)
E
F
J
Package
EFJ: HTSOP-J8
-
E2
Packaging and forming specification
E2: Embossed tape and reel
(Note 1) For the purpose of improving production efficiency, Production Line A and B have a multi-line configuration.
Electric characteristics noted in Datasheet does not differ between Production Line A and B.
Production Line B is recommended for new product.
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Physical Dimension and Packing Information
Package Name
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●Marking Diagram
HTSOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
Part Number
D89630
BD89630EFJ-E2
89630J
BD89630JEFJ-E2
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●Revision History
Date
Revision
28.Aug.2012
28.Mar.2022
001
002
Changes
New Release
Add BD89630JEFJ
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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