BD8LB600FS-CE2

Datasheet IPD series for Automotive 8ch Low-side switch BD8LB600FS-C Features ■ Monolithic power IC that has a built-in control part (CMOS) and a power MOS FET on 1chip ■ 8ch Low-side switch for driving resistive, inductive, capacitive load ■ 16bit Serial peripheral interface(SPI) for diagnostics and control ■ Built-in Open Load Detection circuit in output-off state ■ Built-in Self restart Over Current Protection circuit (OCP) ■ Built-in Over Voltage Protection for Output circuit ■ Built-in Self restart Over Heating Protection circuit (TSD） ■ Low On resistance of RON=600mΩ(VIN=5V, Tj=25°C, IDn=0.2A) ■ Surface mount SSOP-A24 Package ■ AEC-Q100 Qualified(1) Product Summary Digital part Operating voltage Analog part Operating voltage On-state resistance(25°C,Typ) Over current limit(Typ) Active clamp energy(25°C) 3.0V to 5.5V 4.0V to 5.5V 600mΩ 1.80A 70mJ Package SSOP-A24 10.00mm x 7.80mm x 2.10mm (1)Grade 1 Overview BD8LB600FS-C is an Automotive 8ch Low-Side switch. It has a built-in Over Current Protection circuit, Thermal Shutdown circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has a Diagnostic Output(SO) function during abnormal detection. SSOP-A24 Application 8ch Low-side switch for driving resistive, inductive, capacitive load Basic Application Circuit (Recommendation) Product configuration: Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○The product is not designed for radiation resistance. 1/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Pin Descriptions Pin Symbol I/O(1) 1 GND - Function GND 2 GND - GND 3 OUT1 O Channel 1 output 4 OUT2 O Channel 2 output 5 OUT3 O Channel 3 output 6 OUT4 O Channel 4 output 7 OUT5 O Channel 5 output 8 OUT6 O Channel 6 output 9 OUT7 O Channel 7 output 10 OUT8 O Channel 8 output 11 GND - GND 12 GND - GND 13 VDD - Digital power supply 14 IN4(IN8) I PD Control input for Channel 4 and 8 (DIR=L) / Control input for Channel 8 (DIR=H) 15 IN3(IN7) I PD Control input for Channel 3 and 7 (DIR=L) / Control input for Channel 7 (DIR=H) 16 IN2(IN6) I PD Control input for Channel 2 and 6 (DIR=L) / Control input for Channel 6 (DIR=H) 17 IN1(IN5) I PD Control input for Channel 1 and 5 (DIR=L) / Control input for Channel 5 (DIR=H) 18 DIR I PD SPI mode, DIR mode change input terminal 19 SO 20 SCLK(IN4) I PD Serial clock (DIR=L) / Control input for Channel 4 (DIR=H) 21 RST_B(IN3) I PD Reset terminal (DIR=L) / Control input for Channel 3 (DIR=H) 22 SI(IN2) I PD Serial data input (DIR=L) / Control input for Channel 2 (DIR=H) 23 CS_B(IN1) 24 VDDA (1) (2) O I Serial data output terminal PU/PD(2) SPI - enable input (DIR=L) / Control input for Channel 1 (DIR=H) Analog power supply O：Output terminal, I：Input terminal PD：Pull Down terminal, PU：Pull Up terminal Pull Up at DIR=Low setting, Pull Down at DIR=High Pin Configurations SSOP-A24 (TOP VIEW) 1.GND 24.VDDA 2.GND 23.CS_B(IN1) 22.SI(IN2) 3.OUT1 4.OUT2 21.RST_B(IN3) 5.OUT3 20.SCLK(IN4) 6.OUT4 19.SO 7.OUT5 18.DIR 8.OUT6 17.IN1(IN5) 9.OUT7 16.IN2(IN6) 10.OUT8 15.IN3(IN7) 11.GND 14.IN4(IN8) 12.GND 13.VDD www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Absolute Minimum Ratings Item Symbol Limit values Unit V DS 45(Internally limited) V DRAIN-SOURCE voltage 7 (1) Power supply voltage (Logic) V DD V Power supply voltage (Analog) V DDA 7 Diagnostic output voltage V SO -0.3 to +7 V V (2) Output current (DC) I OUT 1.0(Internally limited) Output current (Pulse) I OP Internally limited (3) A Input voltage V IN -0.3 to +7 V Power consumption Pd 1.0(SSOP-A24) (4) W Operating temperature range T opr -40 to +150 °C Storage temperature range T stg -55 to +150 °C Maximum junction temperature T jmax 150 °C 70 (5) mJ (6) mJ (T j(0) = 25°C) Active clamp energy (single pulse) E AV (T j(0) = 150°C) 50 A (1) However、VDD < VDDA + 0.3V (2) However, exceed neither Pd nor ASO. (3) Internally limited by the overcurrent limiting circuit. (4) IC mounted on ROHM standard board (70×70*1.6[mm], glass epoxy 1 layer board). Derate by 8.0mW/℃ above 25℃. (5) Min Active clamp energy at T j ( 0 ) = 25°C, using single non-repetitive pulse of 0.5A (6) Min Active clamp energy at T j ( 0 ) =150°C, using single non-repetitive pulse of 0.5A. Not 100% tested. Operating Voltage Ratings Item Code Limit values Unit Digital part Operating voltage V DD 3.0 to 5.5 V Analog part Operating voltage V DDA 4.0 to 5.5 V Heat Dissipation Characteristic Pd［W］ 2.0 1.5 1.0 0.5 0 25 50 75 100 125 150 Ta［°C］ (SSOP-A24) IC mounted on ROHM standard board (70×70*1.6[mm], glass epoxy 1 layer board). Derate by 8.0mW/°C above 25°C. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Electrical Characteristics（unless otherwise specified, VDDA=5V,VDD=5V,-40°C ≤Tj ≤+150°C ） Min Limit values Typ Max IDDAS - 0 20 μA IDDS - 0 20 μA VDDA Operating current) IDDA - 2 5 mA VDDA=VDD=5V VDD Operating current) IDD - 0.5 1 mA VDDA=VDD=5V VPORA - - 4.0 V VPOR - - 2.7 V VINL 0 - VDD×0.2 V H level input voltage VINH VDD×0.7 - VDD V Input Hysteresis VHYS 0.1 0.3 0.5 V L level input current 1 (RST_B,DIR,IN1 to IN4,SCLK,SI) IINL1 -10 0 10 μA RST_B=DIR=IN1 to IN4=SCLK =SI=0V L level input current 2(CS_B) IINL2 -100 -50 -25 μA CS_B(DIR=L)=0V H level input current 1 (RST_B,DIR,IN1 to IN4,SCLK,SI) IINH1 25 50 100 μA RST_B=DIR=IN1 to IN4=SCLK =SI=5V H level input current 2(CS_B) IINH2 -10 0 10 μA CS_B(DIR=L)=5V - 0.6 0.8 Ω - 1.1 1.4 Ω - 10 20 μA VDD=VDDA=5V, IDS=0.2A, Tj=25°C VDD=VDDA=5V, IDS=0.2A, Tj=150°C VDS=30V, Tj=25°C - 15 40 μA VDS=30V, Tj=150°C IOL 25 50 100 μA VDS=40V tON - 20 50 μs tOFF - 20 50 μs Slew rate on dV/dtON 0.3 1 3 V/μs Slew rate off -dV/dtOFF 0.3 1 3 V/μs PWM Output range fPWM - - 1.2 kHz Output clamp voltage VCL 45 50 55 V IDS=1mA(at Output turn off) VDS(S) 31 - - V INn(1)=5V,RL=0Ω Item [Power Supply Block] VDDA Standby current (All output on standby mode) VDD Standby current (All output on standby mode) VDDA power on reset Threshold Voltage VDD power on reset Threshold Voltage [Input PIN] L level input voltage Symbol Unit Condition VDDA=VDD=5V, CS_B=5V, RST_B=0V VDDA=VDD=5V, CS_B=5V, RST_B=0V [Power MOS Output] Output ON resistance Output sink current Output leak current (Open load detected) RDS(ON) IL(OFF) Switching time Minimum Output Voltage (Load short-circuited） VDD=VDDA=5V,CS_B=0V/5V, RL=60Ω,VB=12V VDD=VDDA=5V,CS_B=0V/5V, RL=60Ω,VB=12V VDD=VDDA=5V,CS_B=0V/5V, RL=60Ω,VB=12V VDD=VDDA=5V,CS_B=0V/5V, RL=60Ω,VB=12V VDD=VDDA=5V,INn=0V/5V, RL=60Ω,VB=12V (1) n means ch number www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Electrical Characteristics（unless otherwise specified, VDDA=5V,VDD=5V,-40°C ≤Tj ≤+150°C ） Item Symbol Min Limit values Typ Max Unit Condition [Serial Output] L level output voltage VSOL - 0.3 0.6 V ISO=1mA H level output voltage VSOH VDD-0.6 VDD-0.3 - V ISO=-1mA Serial out output leak current [Protect circuit] Over current detection current ISO(OFF) -5 0 5 μA IOCP(ON) 1.00 1.80 3.00 A Over current release current IOCP(OFF) 0.70(1) 1.26(1) 2.10(1) A Over current detection time tOCP 50 250 600 μs VOLD(ON) 0.70 1.50 2.70 V INn(2)=0V VOLD(OFF) 1.00 1.75 3.00 V INn(2)=0V tOLD 50 300 600 μs INn(2)=0V Open Load release voltage Open load detection threshold voltage Open load detection time (1) (2) Not 100% tested n means ch number Definition Figure 1. Definition www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Measurement Circuit Figure 2. Output ON Resistance Measuring Circuit Diagram Figure 3. Switching Time Measuring Circuit Diagram Figure 4. Output Clamp Voltage Measuring Circuit Diagram www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 5. Open Detection Measuring Circuit Diagram 6/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C DIR(Direct)mode Diagnostic Output Truth Table VIN OUTPUT Tj mode VSO Output state ID ≤ 1.8A(Typ) Normal L ON ID > 1.8A(Typ) Over current detection H OFF - - Thermal shut down H OFF H (3.0Vor more) - Normal L OFF L (1.5V(Typ) or less) - Open load detection H OFF VDS Tj < 175°C(Typ) - H Tj ≥ 175°C(Typ) L - ID www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Characteristic Data (Reference Data) (VDD=5V, VDDA=5V, IN=5V, Tj=25°C unless otherwise is specified） 1200 1200 1100 1000 1000 900 900 800 800 RON(DS) [mΩ] RDS(ON) [mΩ] 1100 700 600 500 700 600 500 400 400 300 300 200 200 100 100 0 0 -50 -25 0 25 50 75 100 125 150 3.0 3.5 4.0 Ｔｊ [°C] 5.0 5.5 6.0 VDD ,VDDA[V] Figure 6. Output ON Resistance Characteristic [Temperature Characteristic] Figure 7. Output ON Resistance Characteristic [Source Voltage Characteristic] 10 10 8 8 6 6 IDDSA [μA] IDDS [µA] 4.5 4 2 4 2 0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VDDA[V] VDD [V] Figure 8. Standby Current Characteristic (VDD) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.0 Figure 9. Standby Current Characteristic (VDDA) 8/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C 20.0 60.0 10.0 50.0 0.0 40.0 -10.0 ICS_B [μA] IIN [μA] 70.0 30.0 -20.0 20.0 -30.0 10.0 -40.0 -50.0 0.0 0 1 2 3 4 VIN [V] 5 6 0 7 2 3 4 VCS_B [V] 5 6 7 Figure 11. Input current Characteristic (CS_B) Figure 10. Input current Characteristic (IN1 to 4, DIR, SCLK, SI, RST_B) 100.0 3.0 90.0 2.8 80.0 2.6 70.0 2.4 60.0 2.2 VINH/VINL [V] IIN [μA] 1 50.0 40.0 2.0 1.8 30.0 1.6 20.0 1.4 10.0 1.2 0.0 VINH VINL 1.0 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 12. Input current Characteristic [Temperature Characteristic] (IN1 to 4, DIR, SCLK, SI, RST_B=5V, CS_B=0V) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 13. Input Voltage Threshold Characteristic [Temperature Characteristic] 9/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet 45.0 45.0 40.0 40.0 35.0 35.0 30.0 30.0 tOFF [μs] tON [μs] BD8LB600FS-C 25.0 20.0 25.0 20.0 15.0 15.0 10.0 10.0 5.0 5.0 0.0 0.0 -50 -25 0 25 50 Tj [°C] 75 -50 100 125 150 -25 2.0 2.0 1.5 1.5 1.0 0.5 0.0 0.0 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 16. Slew Rate (at ON) [Temperature Characteristic] www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 75 100 125 150 1.0 0.5 -50 25 50 Tj [°C] Figure 15. Switching Time (tOFF) [Temperature Characteristic] -dV/dTOFF [V/μs] dV/dTON [V/μs] Figure 14. Switching Time (tON) [Temperature Characteristic] 0 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 17. Slew Rate (at OFF) [Temperature Characteristic] 10/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet 10.0 50.0 8.0 40.0 6.0 30.0 IOL [μA] IL(OFF) [μA] BD8LB600FS-C 4.0 20.0 10.0 2.0 0.0 0.0 -50 -25 0 25 50 Tj [°C] 75 -50 100 125 150 25 50 Tj [°C] 75 100 125 150 Timing Chart with Inductive Load Figure 21. Timing Chart with inductive Load Figure 20. Switching Time www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 19. Output Leak Current (Open detect) [Temperature Characteristic](VDS=40V) Figure 18. Output Leak Current [Temperature Characteristic](VDS=30V) Switching Time Measurement -25 11/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C I/O Equivalent Circuits Pin Symbol 1,2, 11,12 GND I/O Equivalent Circuits x9 3 to 10 OUT1 to OUT8 13 VDD 14 to 17 18 20 to 22 IN4(IN8), IN3(IN7), IN2(IN6), IN1(IN5), DIR, SCLK(IN4), RST_B(IN3), SI(IN2) x2 IN4(IN8), IN3(IN7), IN2(IN6), IN1(IN5), DIR, SCLK(IN4), RST_B(IN3), SI(IN2) 50Ω 100kΩ 50Ω 19 SO 100kΩ 50Ω 23 1kΩ CS_B 100kΩ 24 VDDA www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C SPI mode(DIR=L) When CS_B=H, OR signal (ERR) of SI and abnormal signal (TER, TSD, OCP, OLD) is output to SO terminal. When CS_B=L, Internal state (TSD, OCP, OLD) is latched at falling edge of CS_B, and output to SO at rising edge of SCLK. SI is taken in register at falling edge of SCLK. Output corresponding to each resister input is controlled at rising edge of CS_B. Definitions of SI and SO signals are shown below. SI signals Initial:0x0000 States of output and protective circuits OCP TSD Bits INn 15:14, 13:12, 11:10, 9:8, 7:6, 5:4, 3:2, 1:0 00 OFF disable disable disable 01 ON/OFF (1) enable/disable enable/disable disable/enable 10 ON enable enable disable 11 OFF disable disable enable Output OLD (1) When INn=01, output is controlled by IN terminal. Output controlled by each input is shown below. Input Controlled output IN1(IN5) OUT1 IN2(IN6) OUT2 IN3(IN7) OUT3 IN4(IN8) OUT4 IN1(IN5) OUT5 IN2(IN6) OUT6 IN3(IN7) OUT7 IN4(IN8) OUT8 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C SO signals When CS_B=H, OR signal (ERR) of abnormal signal (SI, TER, TSD, OCP, OLD) is output to SO terminal. When CS_B=L, Explanation of each Bit is shown below. Bits 16 Data STATE 0 (1) 15,13,11 9,7,5 3,1 14,12 10,8,6 4,2,0 Correspondence just after reset and normal operation 1 Correspondence error of last time 0 Normal operation 1 Load open 0 Normal operation 1 OCP or TSD (1) TER bit outputs logical sums of TER signal and input signal of this device with SI signal in the interval from fall of CS_B to rise of SCLK as shown below. Block diagram and timing chart are shown below. CS_B SCLK S SO TER MSB 14 13 12 11 10 9 8 7 6 5 4 3 2 1 LSB In order to select whether TER signal is output or SPI data output (OLn, Dn) signal is output, “S” signal is generated within IC and output is switched. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Daisy Chain Plurality of devices can be connected as shown in the diagram below. CS_B signal and SCLK signal connects common signal. SI/SO line can connect SO of Device 1 to SI of Device 2 as shown in the diagram below. Timing chart when 8 devices are connected is shown below. Figure 22. Timing chart when 8 devices are connected SPI RST_B releasing sequence Figure 23. RST_B Releasing Sequence Item Signal time(1) ( 2) tRST_B (lead) tCS_B (en) RST_B lead CS_B enable time(1) Minimum Standard Minimum 1 10 - - Unit ms μs (1) Not 100% tested (2) RST_B L time and H time must be over 10μs www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C SPI timing chart Figure 24. SPI Timing Chart Item SCLK frequency SCLK cycle length SCLK high time SCLK lo time SCLK setup time SCLK hold time CS_B lead time CS_B lag time Transfer delay time Data setup time Data hold time SPI Output enable time(1) SPI Output disable time(1) SPI Output Data delay time(1) ERR Output Through delay time(1) Signal Minimum Standard Minimum Unit fSCLK TSCLK(P) TSCLK(H) TSCLK(L) TSCLK(su) TSCLK(hd) TCS_B(lead) TCS_B(lag) TCS_B(td) TSI(su) TSI(h) TSO(en) TSO(dis) TSO(dd) TSO(td) 0 200 50 50 50 50 250 250 250 20 20 － － － － － － － － － － － － － － － － － － － 5 － － － － － － － － － － 200 250 100 200 MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns (1) Not 100% tested. When SO terminal capacity=10pF. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C DIR (direct) mode Transition to direct mode is brought about by switching DIR terminal to High. Output controlled for each input is shown below. Further, SPI input and RST_B input are not accepted during direct mode. Input Controlled Output CS_B(IN1) OUT1 SI(IN2) OUT2 RST_B(IN3) OUT3 SCLK(IN4) OUT4 IN1(IN5) OUT5 IN2(IN6) OUT6 IN3(IN7) OUT7 IN4(IN8) OUT8 DIR (direct) mode timing chart (1) Figure 25. DIR Mode Timing Chart (1) Item DIR lead time(1) INn enable time(1) Signal tDIR(lead) tINn (en) Minimum Standard Minimum 1 10 - - Unit ms μs (1) Not 100% tested. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C DIR (direct) mode timing chart (2) (1) OCP is internal signal of device Figure 26. DIR Mode Timing Chart (2) Direct mode operation current (IDDA + IDD) state transition All CH off 1CH on All CH off All CH on (2) Figure 27. Operation Current State Transition Diagram (2) Sum of P.4 VDDA operation current (when all outputs are on) and VDD operation current (when all outputs are on). www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Power source ON/OFF sequence (3) (3) VDD VDD VDDA VDDA (1)tON > 0s (2)tOFF > 0s (3)VDD < VDDA+0.3V (1) tOFF(2) tON Figure 28. Power Source ON/OFF Sequence Detection functions  Overcurrent protection When current of no less than 1.8 A (Typ) is flown in output transistor of from OUT1 to OUT8 in 250 μs (Typ), error flag is output. Figure 29. Overcurrent Protection Timing Chart  Overheat protection Junction temperature of from OUT1 to OUT8 reaches 175°C (Typ) or above, output is turned off. It is automatically turned on at 150°C (Typ) or below Figure 30. Overheat Protection Timing Chart www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C  Open detection In case of enable at Open detection function(1), when output current of from OUT1 to OUT8 falls below 1.5 V (Typ), open detection is detected and error flag is output. (1) As for the DIR mode, OLDENn=H(open detection function becomes effective) in OUTENn =L. As for the SPI mode, Please refer to “SI Signals” ( Page 13/24). “n” shows the channel number. Figure 31. Open Detection Protection Timing Chart www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Physical Dimension, Tape and Reel Information Package Name SSOP-A24 Tape Embossed carrier tape Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 21/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Operational Notes 1) Absolute Minimum Ratings Operating the IC over the absolute Minimum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the absolute Minimum ratings. 2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 3) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) Source (GND) Voltage The voltage of the Source (GND) pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib Tjmax : Minimum junction temperature=150°C, Ta : Peripheral temperature[°C] , θja : Thermal resistance of package-ambience[°C /W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8) Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches 175°C (25°C hysteresis). It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 9) Over voltage protection (active clamp) There is a built-in over voltage protection circuit (active clamp) to absorb the induced current when inductive load is off (Power MOS = off). During active clamp and when IN=0V, TSD will not function so keep IC temperature below 150°C. 10) Over current protection circuit (OCP) The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current (without latching) in the event of more than 1.5A (Typ) flow, such as from a large capacitor or other component connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and unexpected current surges. The IC should not be used in applications where the over current protection circuit will be activated continuously. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 12) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.   Resistor Transistor (NPN) Pin A  Pin B C  Pin A  + N  P  N  + P  P  N  E  Parasitic  N  P+  P substrate  Parasitic element  GND  Pin B  B  N  B  C  + P  P  N  E  P substrate GND  Parasitic element GND  Parasitic  GND  Other adjacent elements  Example of monolithic IC structure 13) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 14) Back electromotive force (BEMF) There is a possibility that the BEMF is changed by using the operating condition, environment and the individual characteristics of motor. Please make sure there is no problem when operating the IC even though the BEMF is changed. 15) Rush Current When power is supplied to the IC, inrush current may flow instantaneously. It is possible that the charge current from the parasitic capacitance of the internal logic may be unstable. Therefore, give a special consideration with the power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Datasheet BD8LB600FS-C Revision History Date Revision Changes 06.Sep.2013 002 New Release 03.Apr.2015 003 P1 Add “AEC-Q100 qualified” to Features P3 active clamp energy condition added P4 Limit(Typ) of VDDA Operating current changed P4 Limit values of L level input current 2(CS_B) changed P5 Condition of “Open Load release voltage”, “Open load detection threshold voltage” and “Open load detection time” added P6 Modify Figure 5. P7 Modify DIR(Direct)mode Diagnostic Output Truth Table P9 Characteristic Data of L level input current 2(CS_B) changed P11 Timing Chart with Inductive Load changed P12 I/O Equivalent Circuits changed P13 initial value of INn added P15 add note to SPI RST_B sequence P16 SPI timing chart and add note changed P17 DIR (direct) mode timing chart (1) and note changed P18 Figure 26. and note changed P18 Figure 27. changed P19 timing chart of  Overcurrent protection and  Overheat protection changed explanation of error flag release changed P20  Open detection changed P22 “7) Operation Under Strong Electromagnetic Field” added P23 “15) FIN” deleted Whole page all unit changed to SI unit 08.Jun.2017 004 P4 Max value of PWM Output range was changed from 5kHz to 1.2kHz. P4 “DIR=5V” was removed at Condition of PWM Output range. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/24 TSZ02201-0G3G0BD00050-1-2 08.Jun.2017 Rev.004 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001