Datasheet
For Automotive 45 V 150 mA
Fixed/Adjustable Output
Nano CapTM LDO Regulators
BD9xxN1-C Series
General Description
The BD9xxN1-C series are linear regulators using the
Nano CapTM topology (Note 1) designed as low current
consumption products for power supplies in various
automotive applications requiring a direct connection to the
battery.
These products are designed for up to 45 V as an absolute
maximum voltage and to operate until 150 mA for the
output current with low current consumption 28 μA (Typ).
These can regulate the output with a very high accuracy
±2.0 %.
The output capacitor 100 nF (Typ) or more can be used for
this product series, and it can realize a brilliant transient
characteristic even with small capacitance.
The output voltage line-up are 3.3 V, 5.0 V and Adjustable
type by an external resistive divider. The output voltage
can be adjusted between 1.0 V and 18 V by an external
resistive divider connected to the ADJ pin.
Enable feature is integrated in the devices. A logical “HIGH”
at the EN pin turns on the device, and the devices are
controlled to disable by a logical “LOW” input to the EN pin
(Note 2).
The devices feature the integrated Over Current Protection
to protect the device from a damage caused by a shortcircuiting or an overload. These products also integrate
Thermal Shutdown Protection to avoid the damage by
overheating and Under Voltage Lock Out to avoid false
operation at low input voltage.
Furthermore, low ESR ceramic capacitors are sufficiently
applicable for the phase compensation.
(Note 1) Nano Cap™ is a combination of technologies which allow stable
operation even if output capacitance is connected with the range of nF unit.
(Note 2) Applicable for product with Enable Function
Packages
◼SSOP5
◼HTSOP-J8
Key Specifications
◼Wide Temperature Range (Tj):
-40 °C to +150 °C
◼Wide Operating Input Range:
◼Output Voltage:
3 V to 42 V
3.3 V / 5.0 V / Adjustable
◼Low Current Consumption (Note 3):
◼Output Current Capability:
◼High Output Voltage Accuracy (Note 4):
28 μA (Typ)
150 mA
±2.0 %
(Note 3) It does not contain the current of external feedback resistance.
(Note 4) The effect of external feedback resistor is not included.
Features
◼Nano CapTM Topology (Note 1)
◼QuiCurTM Topology (Note 5)
◼AEC-Q100 (Note 6)
◼Automotive grade
◼Over Current Protection (OCP)
◼Thermal Shutdown Protection (TSD)
◼Under Voltage Lock Out (UVLO)
(Note 5) QuiCurTM is a combination of technologies that provides
high-speed load response.
(Note 6) Grade 1
Applications
◼Automotive (Power Train, Body ECU)
◼Car Infotainment system, etc.
W (Typ) x D (Typ) x H (Max)
2.90 mm x 2.80 mm x 1.25 mm
4.9 mm x 6.0 mm x 1.0 mm
SSOP5
HTSOP-J8
Nano CapTM and QuiCurTM are a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit
.www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays.
1/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Application Circuits1 (Output voltage fixed type)
Components Externally Connected
Capacitor: 0.047 μF ≤ CIN (Min), 0.05 μF ≤ COUT (Min) (Note 1)
(Note 1) Electrolytic capacitor, tantalum capacitor and ceramic capacitors can be used.
In case of using electrolytic capacitor or ceramic capacitor with large ESR (> 500 mΩ), note that ceramic capacitor with 0.05 μF and more
must be connected near VOUT pin in parallel.
Applicable for product with Enable Function
Input
Voltage
VIN
CIN
Applicable for product without Enable Function
Output
Voltage
VOUT
Input
Voltage
Output
Voltage
VOUT
CIN
COUT
EN
VIN
COUT
GND
GND
Enable
Voltage
Typical Application Circuits2 (Output voltage adjustable type)
Components Externally Connected
Capacitor: 0.047 μF ≤ CIN (Min), 0.05 μF ≤ COUT (Min) (Note 2)
Resistor: 5 kΩ ≤ R1 ≤ 200 kΩ (Note 3)
VADJ (Typ): 0.65 V
𝑅2 = 𝑅1 (
𝑉𝑂𝑈𝑇
− 1)
𝑉𝐴𝐷𝐽
(Note 2) Electrolytic capacitor, tantalum capacitor and ceramic capacitors can be used.
In case of using electrolytic capacitor or ceramic capacitor with large ESR (> 500 mΩ), note that ceramic capacitor with 0.05 μF and more
must be connected near VOUT pin in parallel.
(Note 3) The value of a feedback resistor R1 must be within this range.
R2 value is defined by following the formula using the limitation of R1.
Error occurs due to the resistance value used and the ADJ terminal input current.
Applicable for product with Enable Function
Input
Voltage
VIN
Output Input
Voltage Voltage
VOUT
R2
CIN
Applicable for product without Enable Function
EN
ADJ
GND
VIN
R2
CIN
COUT
ADJ
GND
R1
Output
Voltage
VOUT
COUT
R1
Enable
Voltage
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Contents
General Description ........................................................................................................................................................................ 1
Key Specifications .......................................................................................................................................................................... 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Packages ....................................................................................................................................................................................... 1
Typical Application Circuits1 (Output voltage fixed type) ................................................................................................................ 2
Typical Application Circuits2 (Output voltage adjustable type) ....................................................................................................... 2
Pin Configurations .......................................................................................................................................................................... 4
Pin Descriptions .............................................................................................................................................................................. 4
Block Diagram ................................................................................................................................................................................ 6
Description of Blocks ...................................................................................................................................................................... 8
Absolute Maximum Ratings ............................................................................................................................................................ 9
Thermal Resistances .................................................................................................................................................................. 10
Operating Conditions .................................................................................................................................................................... 11
Electrical Characteristics............................................................................................................................................................... 12
Electrical Characteristics (Applicable for product with Enable Function) (Note6) .............................................................................. 13
Typical Performance Curves 5 V Output ...................................................................................................................................... 14
Typical Performance Curves 3.3 V Output.................................................................................................................................... 22
Measurement Circuit for Typical Performance Curves ................................................................................................................. 28
Application and Implementation .................................................................................................................................................... 30
Selection of External Components ............................................................................................................................................ 30
Input Pin Capacitor ................................................................................................................................................................ 30
Output Pin Capacitor ............................................................................................................................................................. 30
Typical Application ..................................................................................................................................................................... 31
Surge Voltage Protection for Linear Regulators ........................................................................................................................ 32
Positive Surge to the Input..................................................................................................................................................... 32
Negative Surge to the Input ................................................................................................................................................... 32
Reverse Voltage Protection for Linear Regulators .................................................................................................................... 32
Protection against Reverse Input/Output Voltage .................................................................................................................. 32
Protection against Input Reverse Voltage .............................................................................................................................. 33
Protection against Reverse Output Voltage when Output Connect to an Inductor................................................................. 34
Power Dissipation ......................................................................................................................................................................... 35
■SSOP5 .................................................................................................................................................................................... 35
■HTSOP-J8 ............................................................................................................................................................................... 35
Thermal Design ............................................................................................................................................................................ 36
I/O Equivalence Circuit ................................................................................................................................................................. 38
Operational Notes ......................................................................................................................................................................... 40
1.
Reverse Connection of Power Supply ........................................................................................................................ 40
2.
Power Supply Lines ..................................................................................................................................................... 40
3.
Ground Voltage ............................................................................................................................................................. 40
4.
Ground Wiring Pattern ................................................................................................................................................. 40
5.
Operating Conditions ................................................................................................................................................... 40
6.
Inrush Current............................................................................................................................................................... 40
7.
Thermal Consideration ................................................................................................................................................ 40
8.
Testing on Application Boards .................................................................................................................................... 40
9.
Inter-pin Short and Mounting Errors ........................................................................................................................... 40
10.
Unused Input Pins ........................................................................................................................................................ 40
11.
Regarding the Input Pin of the IC ................................................................................................................................ 41
12.
Ceramic Capacitor ........................................................................................................................................................ 41
13.
Thermal Shutdown Protection Circuit (TSD) .............................................................................................................. 41
14.
Over Current Protection Circuit (OCP) ....................................................................................................................... 41
Ordering Information ..................................................................................................................................................................... 42
Lineup ........................................................................................................................................................................................... 42
Marking Diagrams......................................................................................................................................................................... 43
Physical Dimension and Packing Information ......................................................................................................................... 44
Revision History ............................................................................................................................................................................ 46
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Pin Configurations
SSOP5
(TOP VIEW)
5
HTSOP-J8
(TOP VIEW)
8 7 6 5
4
EXP-PAD
1
2
3
1
2
3
4
Pin Descriptions
(SSOP5) BD9xxN1G-C, BD9xxN1WG-C (xx = 33, 50, 00)
Pin No.
1
2
3
Pin Name
Function
(ADJ)
(Adjustment Pin
For Output
Voltage)
GND
(EN)
Ground Pin
(Control Output
ON / OFF Pin)
Descriptions
Connect an external resistor between VOUT pin and ADJ pin and
between ADJ pin and GND pin to adjust output voltage.
Output voltage fixed type, this pin is not connected (N.C.) to the chip.
(Note 1)
Ground.
A logical “HIGH” (VEN ≥ 2.0 V) at the EN pin enables the device and
“LOW” (VEN ≤ 0.8 V) at the EN pin disables the device.
Although the output is turned off when the EN pin is open, it is
recommended to connect it to GND with low impedance to prevent
incorrect operation.
Without enable function, this pin is not connected (N.C.) to the chip.
(Note 1)
4
VIN
Input Supply
Voltage Pin
5
VOUT
Output Voltage Pin
Set a capacitor with a capacitance of 0.047 μF (Min) or higher
between the VIN pin and GND. The selecting method is described in
Selection of External Components. If the inductance of power
supply line is high, please adjust input capacitor value.
Set a capacitor with a capacitance of 0.05 μF (Min) or higher between
the VOUT pin and GND. The selecting method is described in
Selection of External Components.
(Note 1) N.C. pin can be either left floated or for connect to GND.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Pin Descriptions – continued
(HTSOP-J8) BD9xxN1EFJ-C, BD9xxN1WEFJ-C (xx = 33, 50, 00)
Pin No.
Pin Name
Function
1
VOUT
Output Voltage Pin
2
(ADJ)
(Adjustment Pin
For Output
Voltage)
Descriptions
Set a capacitor with a capacitance of 0.05 μF (Min) or higher between
the VOUT pin and GND. The selecting method is described in
Selection of External Components.
Connect an external resistor between VOUT pin and ADJ pin and
between ADJ pin and GND pin to adjust output voltage.
Output voltage fixed type, this pin is not connected (N.C.) to the chip.
(Note 1)
3
N.C.
-
This pin is not connected (N.C.) to the chip. (Note 1)
4
N.C.
-
This pin is not connected (N.C.) to the chip. (Note 1)
5
GND
Ground Pin
6
N.C.
-
7
(EN)
(Control Output
ON / OFF Pin)
Ground.
This pin is not connected (N.C.) to the chip. (Note 1)
A logical “HIGH” (VEN ≥ 2.0 V) at the EN pin enables the device and
“LOW” (VEN ≤ 0.8 V) at the EN pin disables the device.
Although the output is turned off when the EN pin is open, it is
recommended to connect it to GND with low impedance to prevent
incorrect operation.
Without enable function, this pin is not connected (N.C.) to the chip.
(Note 1)
8
VIN
Input Supply
Voltage Pin
-
EXP-PAD
Heat Dissipation
Set a capacitor with a capacitance of 0.047 μF (Min) or higher
between the VIN pin and GND. The selecting method is described in
Selection of External Components. If the inductance of power
supply line is high, please adjust input capacitor value.
It is recommended to connect EXP-PAD on the back side to external
Ground pattern in order to make heat dissipation better.
(Note 1) N.C. pin can be either left floated or for connect to GND.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Block Diagram
Applicable for product output voltage fixed type with Enable Function
･BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50)
VIN
PREREG
EN_SIG
UVLO
EN_SIG
EN
EN
OCP
OCP
VREF
EN_SIG
EN
TSD
AMP
TSD
OCP
Power Tr.
DRIVER
TSD
EN
TSD
DISCHARGE
VOUT
GND
Applicable for product output voltage fixed type without Enable Function
･BD9xxN1G-C, BD9xxN1EFJ-C (xx = 33, 50)
VIN
PREREG
UVLO
OCP
OCP
VREF
AMP
TSD
TSD
OCP
Power Tr.
DRIVER
TSD
TSD
DISCHARGE
VOUT
GND
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
6/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Block Diagram – continued
Applicable for product output voltage adjustable type with Enable Function
･BD900N1WG-C, BD900N1WEFJ-C
VIN
PREREG
EN_SIG
UVLO
OCP
OCP
EN_SIG
EN
VREF
EN
EN_SIG
EN
TSD
AMP
TSD
OCP
Power Tr.
DRIVER
TSD
EN
TSD
DISCHARGE
VOUT
ADJ
GND
Applicable for product output voltage adjustable type without Enable Function
･BD900N1G-C, BD900N1EFJ-C
VIN
PREREG
UVLO
OCP
OCP
VREF
AMP
TSD
TSD
OCP
Power Tr.
DRIVER
TSD
TSD
DISCHARGE
VOUT
ADJ
GND
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
7/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Description of Blocks
BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50, 00)
Block Name
Function
EN
Enable Input
PREREG
Internal Power Supply
Description of Blocks
A logical “HIGH” (VEN ≥ 2.0 V) at the EN pin enables the device
and “LOW” (VEN ≤ 0.8 V) at the EN pin disables the device.
Power supply for internal circuit.
TSD
Thermal Shutdown
Protection
In case maximum power dissipation exceeds or when the junction
temperature rises and the chip temperature (Tj) exceeds the heating
protection set temperature. The TSD protection circuit detects this
and forces the gate of output MOSFET to turn off in order to protect
the device from overheating. (Typ: 175 °C) When the junction
temperature decreases to low, the thermal Shutdown protection is
released and the output turns on automatically.
VREF
Reference Voltage
Generate the reference voltage.
AMP
Error Amplifier
DRIVER
Output MOSFET Driver
OCP
Over Current Protection
DISCHARGE
Output Discharge Function
UVLO
Under Voltage Lock Out
The fixed output voltage product compares the voltage obtained by
dividing the output voltage with the reference voltage, and the variable
output voltage product compares the ADJ voltage with the reference
voltage, and controls the output power transistor via the DRIVER.
Drive the output MOSFET.
If the output current increases higher than the maximum output
current, it is limited by Over Current Protection in order to protect the
device from a damage caused by an over current. (Typ: 280 mA)
While this block is operating, the output voltage may decrease
because the output current is limited.
If an abnormal state is removed and the output current value returns
to normal, the output voltage also returns to normal state.
Output pin is discharged by the internal resistance when EN = LOW
input or TSD is detected.
The Under Voltage Lock Out protection detects when VIN voltage
becomes less than 2.4 V (Typ), it forces AMP to turn off in order to
avoid any false operation at low input voltage.
BD9xxN1G-C, BD9xxN1EFJ-C (xx = 33, 50, 00)
Block Name
Function
PREREG
Internal Power Supply
Description of Blocks
Power supply for internal circuit.
TSD
Thermal Shutdown
Protection
In case maximum power dissipation exceeds or when the junction
temperature rises and the chip temperature (Tj) exceeds the heating
protection set temperature. The TSD protection circuit detects this
and forces the gate of output MOSFET to turn off in order to protect
the device from overheating. (Typ: 175 °C) When the junction
temperature decreases to low, the thermal Shutdown protection is
released and the output turns on automatically.
VREF
Reference Voltage
Generate the reference voltage.
AMP
Error Amplifier
DRIVER
Output MOSFET Driver
OCP
Over Current Protection
DISCHARGE
Output Discharge Function
UVLO
Under Voltage Lock Out
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
The fixed output voltage product compares the voltage obtained by
dividing the output voltage with the reference voltage, and the variable
output voltage product compares the ADJ voltage with the reference
voltage, and controls the output power transistor via the DRIVER.
Drive the output MOSFET.
If the output current increases higher than the maximum output
current, it is limited by Over Current Protection in order to protect the
device from a damage caused by an over current. (Typ: 280 mA)
While this block is operating, the output voltage may decrease
because the output current is limited.
If an abnormal state is removed and the output current value returns
to normal, the output voltage also returns to normal state.
Output pin is discharged by the internal resistance when TSD is
detected.
The Under Voltage Lock Out protection detects when V IN voltage
becomes less than 2.4 V (Typ), it forces AMP to turn off in order to
avoid any false operation at low input voltage.
8/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Absolute Maximum Ratings
Symbol
Ratings
Unit
Voltage (Note 1)
Parameter
VIN
-0.3 to +45
V
EN Pin Voltage (Note 2)
VEN
-0.3 to +45
V
VOUT Pin Voltage
VOUT
-0.3 to +20 (≤ VIN + 0.3)
V
VADJ
-0.3 to +7
V
Junction Temperature Range
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
ESD Withstand Voltage (HBM) (Note 4)
VESD_HBM
±2000
V
ESD Withstand Voltage (CDM) (Note 5)
VESD_CDM
±750
V
Supply
ADJ Pin
Voltage (Note 3)
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance and power dissipation taken
into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax.
(Note 2) Applicable for product with BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50, 00)
The start-up orders of power supply (VIN) and the VEN do not influence if the voltage is within the operation power supply voltage range.
(Note 3) Applicable for product with BD900N1G-C, BD900N1WG-C, BD900N1EFJ-C, BD900N1WEFJ-C.
(Note 4) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF).
(Note 5) ESD susceptibility Charged Device Model “CDM”; base on AEC-Q100-011.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Thermal Resistances
Parameter
Symbol
Thermal Resistance (Typ)(Note 1)
1s
2s2p
(Note 3)
(Note 4)
Unit
SSOP5
Junction to Ambient
θJA
271.3
146.7
°C/W
Parameter(Note 2)
ΨJT
46
37
°C/W
Junction to Ambient
θJA
157.2
36.2
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
32
11
°C/W
Junction to Top Characterization
HTSOP-J8
(Note 1) Based on JESD51-2A (Still-Air), using a BD950N1G-C, BD950N1EFJ-C Chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
2 Internal Layers
Bottom
Top
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of 1,2,4 layers. Placement follows the land pattern.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Operating Conditions(-40 °C ≤ Tj ≤ +150 °C)
Parameter
Input Voltage (Note 1) (Note 2)
Start-Up Voltage
Output Voltage (Note 3)
Feedback Resistor ADJ vs GND (Note 3)
Enable Input
Voltage (Note 4)
Output Current
Input Capacitor (Note 5) (Note 6)
Output Capacitor
(Note 6)
Output Capacitor Equivalent Series
Resistance (Note 7)
Operating Temperature Ratings
Symbol
Min
Max
Unit
4.5
42.0
V
VOUT (Max) + ΔVD (Max)
42.0
V
VIN Start-Up
3.0
-
V
VOUT
1.0
18.0
V
R1
5
200
kΩ
VEN
0
42
V
IOUT
0
150
mA
CIN
0.047
-
μF
COUT
0.05
470
μF
ESR (COUT)
-
500
mΩ
Ta
-40
+125
°C
VIN
(Note 1) Please consider that the output voltage would be dropped (Dropout voltage ΔVd) by the output current.
(Note 2) Apply 4.5V or VOUT (Max) + ΔVd (Max), whichever is higher.
(Note 3) Applicable for product with BD900N1G-C, BD900N1WG-C, BD900N1EFJ-C, BD900N1WEFJ-C.
(Note 4) Applicable for product with BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50, 00)
(Note 5) If the inductance of power supply line is high, please adjust input capacitor value in order to lower the input impedance.
A lower input impedance can bring out the ideal characteristic of IC as much as possible.
It also has the effect of preventing the voltage-drop at the input line.
(Note 6) Set capacitor value which do not fall below the minimum value. This value needs to consider the temperature characteristics and DC device
characteristics. For applications where the output voltage is 1.5 V or less, it is recommended to use an output capacitor of 0.22 μF or more because
the output capacitor holds less charge, increasing the amount of voltage fluctuation during transient response.
(Note 7) It is recommended to use ceramic capacitors that have low ESR characteristics for output phase compensation.
In case of using electrolytic capacitor or ceramic capacitor with large ESR (>500 mΩ), note that ceramic capacitor with 0.05μF and more must be
connected near VOUT pin in parallel.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Electrical Characteristics
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, COUT = 0.1 μF
VOUT setting = 5 V, R1 = 10 kΩ, R2 = 67 kΩ
Typical values are defined at Tj = 25 °C, VIN = 13.5 V
Parameter
Symbol
Current Consumption (Note 1)
ICC
Limits
Unit
Conditions
Min
Typ
Max
-
28
48
μA
IOUT = 0 mA, Tj ≤ 125 °C
-
28
60
μA
IOUT = 0 mA, Tj ≤ 150 °C
6.0 V ≤ VIN ≤ 42 V, Tj = -40 °C to +150 °C
0 mA ≤ IOUT ≤ 100 mA,
V
or
6.5 V ≤ VIN ≤ 42 V, Tj = -40 °C to +150 °C
0 mA ≤ IOUT ≤ 150 mA
4.5 V ≤ VIN ≤ 42 V, Tj = -40 °C to +150 °C
0 mA ≤ IOUT ≤ 100 mA,
V
or
4.9 V ≤ VIN ≤ 42 V, Tj = -40 °C to +150 °C
0 mA ≤ IOUT ≤ 150 mA
4.5 V ≤ VIN ≤ 42 V,
V
Tj = -40 °C to +150 °C,
0 mA ≤ IOUT ≤ 150 mA
VIN = 4.75 V (VOUT ≥ 5 V)
mV
IOUT = 100 mA
VIN = 3.135 V (VOUT ≥ 3.3 V)
mV
IOUT = 100 mA
Output Voltage (Note 2)
VOUT
4.900
5.000
5.100
Output Voltage (Note 3)
VOUT
3.234
3.300
3.366
Reference Voltage (Note 4)
VADJ
0.637
0.650
0.663
ΔVD1
-
420
1000
ΔVD2
-
500
1200
ΔVD3
-
650
1500
mV
VIN = 4.75 V (VOUT ≥ 5 V)
IOUT = 150 mA
ΔVD4
-
780
1800
mV
VIN = 3.135 V (VOUT ≥ 3.3 V)
IOUT = 150 mA
R.R.
-
70
-
dB
f = 1kHz, VRipple = 1 Vrms
IOUT = 10 mA
Reg.I1
-
0.05
0.20
%
VOUT + 1.5V ≤ VIN ≤ 42 V
(VOUT ≥ 3.0 V)
Reg.I2
-
2
6
mV
Reg.L1
-
0.1
0.3
%
0 mA ≤ IOUT ≤ 150 mA
(VOUT ≥ 3.0 V)
Reg.L2
-
3
9
mV
0 mA ≤ IOUT ≤ 150 mA
(VOUT < 3.0 V)
IADJ
-
0
15
nA
VADJ = 1 V
Dropout Voltage
Ripple Rejection (Note 5)
Line Regulation
Load Regulation
ADJ Input Current (Note 4)(Note 5)
4.5 V ≤ VIN ≤ 42 V
(VOUT < 3.0 V)
(Note 1) Adjustable output voltage type does not contain the current of R1 and R2.
(Note 2) BD950N1G-C, BD950N1WG-C, BD950N1EFJ-C, BD950N1WEFJ-C.
(Note 3) BD933N1G-C, BD933N1WG-C, BD933N1EFJ-C, BD933N1WEFJ-C.
(Note 4) BD900N1G-C, BD900N1WG-C, BD900N1EFJ-C, BD900N1WEFJ-C.
(Note 5) Not all devices are measured for shipment.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Electrical Characteristics – continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, COUT = 0.1 μF
VOUT setting = 5 V, R1 = 10 kΩ, R2 = 67 kΩ
Typical values are defined at Tj = 25 °C, VIN = 13.5 V
Parameter
Symbol
Limits
Min
Typ
Max
Unit
Conditions
UVLO fall threshold
VUVLOF
1.8
2.4
2.8
V
VIN falling
UVLO rise threshold
VUVLOR
2.0
2.6
3.0
V
VIN rising
VUVLOHYS
-
0.2
-
V
Over Current Protection
IOCP
151
280
400
mA
VOUT = 0 V
Thermal Shutdown Temperature
TTSD
151
175
-
°C
-
TTSDHYS
-
15
-
°C
-
UVLO hysteresis
Thermal Shutdown Hysteresis
Electrical Characteristics (Applicable for product with Enable Function) (Note6)
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, COUT = 0.1 μF, VEN = 5 V
VOUT setting = 5 V, R1 = 10 kΩ, R2 = 67 kΩ
Typical values are defined at Tj = 25 °C, VIN = 13.5 V
Parameter
Symbol
Limits
Min
Typ
Max
Unit
Conditions
Shutdown Current
ISHUT
-
1.0
4.8
μA
VEN = 0 V
Tj ≤ 125 °C
Enable ON threshold Voltage
VENTH
1.05
1.45
2.00
V
VEN rising
Enable OFF threshold Voltage
VENTL
0.80
1.27
1.70
V
VEN falling
Enable Hysteresis Voltage
VENHYS
-
0.18
-
V
-
IEN
-
4
8
μA
VEN = 5 V
RDSC
2.6
6.5
11.0
kΩ
VEN = 0 V
Enable Bias Current
VOUT Discharge Resistance
(Note 6) BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50, 00).
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
1000
800
700
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +125 ˚C
Tj = +150 ˚C
50
Circuit Current: ICC [μA]
900
Circuit Current: ICC [μA]
60
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +125 ˚C
Tj = +150 ˚C
600
500
400
300
200
40
30
20
10
100
0
0
5
0
10 15 20 25 30 35 40 45
Input Voltage: VIN [V]
Figure 1. Circuit Current vs Input Voltage
(5 V output)
400
100
Tj = +25 ˚C
90
Tj = +150 ˚C
80
Ground Current: IGND [μA]
Ground Current: IGND [μA]
300
250
200
150
100
50
0
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
45
Figure 2. Circuit Current vs Input Voltage
*magnification of Figure 1 at narrow range circuit current
(5 V output)
Tj = -40 ˚C
350
0
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +150 ˚C
70
60
50
40
30
20
10
0
25
50
75
100
125
Output Current: IOUT [mA]
0
0.0001
150
Figure 3. Ground Current vs Output Current
(5 V output)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.001
0.01
0.1
Output Current: IOUT [mA]
1
Figure 4. Ground Current vs Output Current
*magnification of Figure 3 at low output current
(5 V output)
14/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
60
5.10
5.08
5.06
Output Voltage: VOUT [V]
Circuit Current: ICC [μA]
50
40
30
20
5.04
5.02
5.00
4.98
4.96
4.94
10
4.92
0
-40
10
60
110
Junction Temperature: Tj [˚C]
4.90
160
Figure 5. Circuit Current vs Junction Temperature
(5 V output)
1000
160
Tj = -40 ˚C
Tj = +25 ˚C
100
Tj = +150 ˚C
Ripple Rejection: R.R. [dB]
Dropout Voltage: ΔVD [mV]
120
Tj = +25 ˚C
800
10
60
110
Junction Temperature: Tj [˚C]
Figure 6. Output Voltage vs Junction Temperature
(5 V output)
Tj = -40 ˚C
900
-40
700
600
500
400
300
200
Tj = +150 ˚C
80
60
40
20
100
0
0
25
50
75
100 125
Output Current: IOUT [mA]
0
150
Figure 7. Dropout Voltage vs Output Current
(5 V output, VIN = 4.75 V)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10
100
1K
10K 100K
Frequency [Hz]
1M
10M
Figure 8. Ripple Rejection vs Frequency
(5 V output, VRipple = 1 Vrms, IOUT = 10 mA)
15/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
6.00
5.10
Tj = -40 ˚C
5.08
Tj = +25 ˚C
4.00
Tj = +25 ˚C
Tj = +150 ˚C
5.06
Tj = -40 ˚C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
5.00
Tj = +150 ˚C
3.00
2.00
5.04
5.02
5.00
4.98
4.96
4.94
1.00
4.92
0.00
0
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
4.90
45
Figure 9. Output Voltage vs Input Voltage
(5 V output)
6.00
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
45
Figure 10. Output Voltage vs Input Voltage
*magnification of Figure 9 at narrow range output voltage
(5 V output)
Tj = -40 ˚C
Tj = +25 ˚C
5.00
Output Voltage: VOUT [V]
0
Tj = +150 ˚C
4.00
3.00
2.00
VIN
Falling
1.00
0.00
0
1
VIN
Rising
2
3
4
Input Voltage: VIN [V]
5
6
Figure 11. Output Voltage vs Input Voltage
*magnification of Figure 9 at low input voltage
(5 V output)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
5.05
Tj = +25 ˚C
5.04
5.00
Tj = +150 ˚C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
6.00
Tj = -40 ˚C
5.03
5.02
5.01
5.00
Tj = +25 ˚C
4.00
Tj = +150 ˚C
3.00
2.00
1.00
0
25
50
75
100 125
Output Current: IOUT [mA]
0.00
150
Figure 12. Output Voltage vs Output Current
(5 V output, Load Regulation)
6.00
0
50
100 150 200 250 300
Output Current: IOUT [mA]
350
Figure 13. Output Voltage vs Output Current
(5 V output, Over Current Protection)
Temperature
Rising
5.00
Output Voltage: VOUT [V]
Tj = -40 ˚C
4.00
3.00
2.00
1.00
0.00
Temperature
Falling
100
120
140
160
180
Junction Temperature: Tj [˚C]
200
Figure 14. Output Voltage vs Junction Temperature
(5 V output)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
5.00
0.665
Shutdown Current: ISHUT [μA]
Adjustment Voltage: VADJ [V]
0.660
0.655
0.650
0.645
0.640
0.635
-40
10
60
110
Junction Temperature: Tj [˚C]
Tj = +25 ˚C
Output Voltage: VOUT [V]
EN Bias Current: IEN [μA]
Tj = +150 ˚C
5.00
4.00
3.00
2.00
0
0
5
10 15 20 25 30 35 40
EN Input Voltage: VEN [V]
5
10 15 20 25 30 35 40 45
Input Voltage: VIN [V]
Tj = -40 ˚C
Tj = +25 ˚C
4.00
Tj = +150 ˚C
3.00
2.00
VEN
Falling
1.00
1.00
0.00
1.00
5.00
Tj = +125 ˚C
6.00
2.00
6.00
Tj = -40 ˚C
7.00
3.00
Figure 16. Shutdown Current vs Input Voltage
(VEN = 0 V)
Figure 15. Adjustment Voltage vs Junction Temperature
8.00
4.00
0.00
160
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +125 ˚C
Tj = +150 ˚C
0.00
45
0
VEN
Rising
1
2
3
4
EN Input Voltage: VEN [V]
5
Figure 18. Output Voltage vs EN Input Voltage
(5 V output)
Figure 17. EN Bias Current vs EN Input Voltage
(5 V output)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 10 V/Div
VIN: 10 V/Div
VOUT: 100 mV/Div [offset: 5 V]
VOUT: 100 mV/Div [offset: 5 V]
Tr = 1 μs
Tf = 1 μs
IOUT: 1 mA to 150 mA
IOUT: 100 mA/Div
IOUT: 150 mA to 1 mA
IOUT: 100 mA/Div
10 μs/Div
10 μs/Div
Figure 20. Load Transient 150 mA to 1 mA
(5 V output, Tf = 1 μs)
Figure 19. Load Transient 1 mA to 150 mA
(5 V output, Tr = 1 μs)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 8 V to 16 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VIN: 16 V to 8 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VOUT: 100 mV/Div [offset: 5 V]
VOUT: 100 mV/Div [offset: 5 V]
20 μs/Div
20 μs/Div
Figure 21. Line Transient 8 V to 16 V
(5 V output, IOUT = 0 mA)
Figure 22. Line Transient 16 V to 8 V
(5 V output, IOUT = 0 mA)
VIN: 8 V to 16 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VIN: 16 V to 8 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VOUT: 100 mV/Div [offset: 5 V]
VOUT: 100 mV/Div [offset: 5 V]
20 μs/Div
20 μs/Div
Figure 23. Line Transient 8 V to 16 V
(5 V output, IOUT = 150 mA)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Figure 24. Line Transient 16 V to 8 V
(5 V output, IOUT = 150 mA)
20/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 5 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 0 V to 16 V
VIN: 5 V/Div
VIN: 0 V to 16 V
VIN: 5 V/Div
Slew rate: 2 V/μs
Slew rate: 2 V/μs
VOUT: 2 V/Div
VOUT: 2 V/Div
200 μs/Div
200 μs/Div
Figure 25. VIN Startup Waveform
VIN: 0 V to 16 V
(5 V output, IOUT = 0 mA)
Figure 26. VIN Startup Waveform
VIN: 0 V to 16 V
(5 V output, IOUT = 150 mA)
VEN: 2 V/Div
VEN: 2 V/Div
VOUT: 2 V/Div
VOUT: 2 V/Div
100 μs/Div
1.0 ms/Div
Figure 27. EN Startup Waveform
(5 V output, IOUT = 1 mA)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Figure 28. EN Shutdown Waveform
(5 V output, IOUT = 1 mA)
21/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
1000
800
700
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +125 ˚C
Tj = +150 ˚C
50
Circuit Current: ICC [μA]
900
Circuit Current: ICC [μA]
60
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +125 ˚C
Tj = +150 ˚C
600
500
400
300
200
40
30
20
10
100
0
0
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
0
45
Figure 29. Circuit Current vs Input Voltage
(3.3 V output)
400
90
Ground Current: IGND [μA]
Ground Current: IGND [μA]
100
300
250
200
150
100
50
0
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
45
Figure 30. Circuit Current vs Input Voltage
*magnification of Figure 29 at narrow range circuit current
(3.3 V output)
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +150 ˚C
350
0
80
Tj = -40 ˚C
Tj = +25 ˚C
Tj = +150 ˚C
70
60
50
40
30
20
10
0
25
50
75
100
125
Output Current: IOUT [mA]
0
0.0001
150
Figure 31. Ground Current vs Output Current
(3.3 V output)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.001
0.01
0.1
Output Current: IOUT [mA]
1
Figure 32. Ground Current vs Output Current
*magnification of Figure 31 at low output current
(3.3 V output)
22/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
60
3.38
3.36
Output Voltage: VOUT [V]
Circuit Current: ICC [μA]
50
40
30
20
10
0
3.32
3.30
3.28
3.26
3.24
-40
10
60
110
Junction Temperature: Tj [˚C]
3.22
160
Figure 33. Circuit Current vs Junction Temperature
(3.3 V output)
1400
10
60
110
Junction Temperature: Tj [˚C]
120
Tj = +25 ˚C
160
Tj = -40 ˚C
Tj = +25 ˚C
100
Ripple Rejection: R.R. [dB]
Tj = +150 ˚C
1000
800
600
400
Tj = +150 ˚C
80
60
40
20
200
0
-40
Figure 34. Output Voltage vs Junction Temperature
(3.3 V output)
Tj = -40 ˚C
1200
Dropout Voltage: ΔVD [mV]
3.34
0
25
50
75
100 125
Output Current: IOUT [mA]
0
150
Figure 35. Dropout Voltage vs Output Current
(3.3 V output, VIN = 3.135 V)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10
100
1K
10K 100K
Frequency[Hz]
1M
10M
Figure 36. Ripple Rejection vs Frequency
(3.3 V output, VRipple = 1 Vrms, IOUT = 10 mA)
23/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
3.50
3.36
Tj = +25 ˚C
Tj = +25 ˚C
2.50
2.00
1.50
1.00
0
5
3.30
3.26
10 15 20 25 30 35 40 45
Input Voltage: VIN [V]
3.36
5
10
15 20 25 30 35
Input Voltage: VIN [V]
40
45
3.50
Tj = -40 ˚C
Tj = +25 ˚C
3.34
0
Figure 38. Output Voltage vs Input Voltage
*magnification of Figure 37 at narrow range output voltage
(3.3 V output)
Figure 37. Output Voltage vs Input Voltage
(3.3 V output)
Tj = -40 ˚C
3.00
Tj = +150 ˚C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
3.32
3.28
0.50
3.32
3.30
3.28
3.26
Tj = +150 ˚C
3.34
Tj = +150 ˚C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
3.00
0.00
Tj = -40 ˚C
Tj = -40 ˚C
Tj = +25 ˚C
2.50
Tj = +150 ˚C
2.00
1.50
1.00
0.50
0
25
50
75
100 125
Output Current: IOUT [mA]
0.00
150
Figure 39. Output Current vs Output Voltage
(3.3 V output, Load Regulation)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0
50
100 150 200 250 300
Output Current: IOUT [mA]
350
Figure 40. Output Current vs Output Voltage
(3.3 V output, Over Current Protection)
24/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 10 V/Div
VIN: 10 V/Div
VOUT: 100 mV/Div [offset: 3.3 V]
VOUT: 100 mV/Div [offset: 3.3 V]
Tr = 1 μs
Tf = 1 μs
IOUT: 1 mA to 150 mA
IOUT: 100 mA/Div
IOUT: 150 mA to 1 mA
IOUT: 100 mA/Div
10 μs/Div
10 μs/Div
Figure 41. Load Transient 1 mA to 150 mA
(3.3 V output, Tr = 1 μs)
Figure 42. Load Transient 150 mA to 1 mA
(3.3 V output, Tf = 1 μs)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
25/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 8 V to 16 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VIN: 16 V to 8 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
VOUT: 100 mV/Div [offset: 3.3 V]
VOUT: 100 mV/Div [offset: 3.3 V]
20 μs/Div
20 μs/Div
Figure 43. Line Transient 8 V to 16 V
(3.3 V output, IOUT = 0 mA)
Figure 44. Line Transient 16 V to 8 V
(3.3 V output, IOUT = 0 mA)
VIN: 8 V to 16 V
VIN: 5 V/Div [offset: 8 V]
VIN: 16 V to 8 V
VIN: 5 V/Div [offset: 8 V]
Slew rate: 1 V/μs
Slew rate: 1 V/μs
VOUT: 100 mV/Div [offset: 3.3 V]
VOUT: 100 mV/Div [offset: 3.3 V]
20 μs/Div
20 μs/Div
Figure 46. Line Transient 16 V to 8 V
(3.3 V output, IOUT = 150 mA)
Figure 45. Line Transient 8 V to 16 V
(3.3 V output, IOUT = 150 mA)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
26/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Typical Performance Curves 3.3 V Output - continued
Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA, VEN = 5 V, COUT = 0.1 μF
VIN: 16 V to 0 V
VIN: 5 V/Div
VIN: 16 V to 0 V
VIN: 5 V/Div
Slew rate: 2 V/μs
Slew rate: 2 V/μs
VOUT: 2 V/Div
VOUT: 2 V/Div
100 μs/Div
100 μs/Div
Figure 47. VIN Startup Waveform
VIN: 0 V to 16 V
(3.3 V output, IOUT = 0 mA)
Figure 48. VIN Startup Waveform
VIN: 0 V to 16 V
(3.3 V output, IOUT = 150 mA)
VEN: 2 V/Div
VEN: 2 V/Div
VOUT: 1 V/Div
VOUT: 1 V/Div
40 μs/Div
400 μs/Div
Figure 49. EN Startup Waveform
(3.3 V output, IOUT = 1 mA)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Figure 50. EN Shutdown Waveform
(3.3 V output, IOUT = 1 mA)
27/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Measurement Circuit for Typical Performance Curves
VIN
0.1 μF
VOUT
EN
GND
VIN
0.1 μF
Measurement Setup for
Figure 1 to 5, 16, 29 to 33
VIN
EN
0.1 μF
IOUT
VOUT
0.1 μF
GND
IOUT
Measurement Setup for
Figure 6, 9 to 12, 14, 34, 37 to 39
VIN
VOUT
VOUT
Vripple
0.1 μF
EN
GND
0.1 μF
Measurement Setup for
Figure 7, 35
VIN
0.1 μF
EN
EN
0.1 μF
IOUT
0.1 μF
VIN
EN
0.1 μF
0.1 μF
VOUT
VIN
M
0.1 μF
EN
M
0.1 μF
GND
Measurement Setup for
Figure 17 to 18
Measurement Setup for
Figure 13, 40
VIN
VOUT
VOUT
M
GND
0.1 μF
M
0.1 μF
EN
M
GND
IOUT
Measurement Setup for
Figure 27 to 28, 49 to 50
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
M
IOUT
Measurement Setup for
Figure 8, 36
VOUT
GND
GND
0.1 μF
IOUT
Measurement Setup for
Figure 19 to 26, 41 to 48
28/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Measurement Circuit for Typical Performance Curves - continued
VIN
VOUT
67 kΩ
0.1 μF
EN
GND
ADJ
10 kΩ
0.1 μF
Measurement Setup for
Figure 15
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
29/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Application and Implementation
Notice: The following information is given as a reference or hint for the application and the implementation. Therefore, it does
not guarantee its operation on the specific function, accuracy or external components in the application. In the
application, it shall be designed with sufficient margin by enough understanding about characteristics of the external
components, e.g. capacitor, and also by appropriate verification in the actual operating conditions.
Selection of External Components
Input Pin Capacitor
In order to fully demonstrate the performance of this IC, it is recommended that the input capacitor be placed as close as
possible to the input pin and the GND pin without being affected by mounting impedance, etc., and that it be laid out on the
same mounting surface. In this case, a capacitor with a capacitance value of 0.047 μF (Min) or higher is recommended.
Depending on the layout of the peripheral components, including this IC, from the input power supply, if the distance from
the battery is too far or the impedance of the input side is too high, for example, the current supply due to the load response
of the IC cannot be withstood, and the output voltage may become unstable due to fluctuations in the input voltage. In such
a case, it is necessary to use a large capacitor to prevent the line voltage from dropping. Select the capacitance of the input
terminal capacitor according to the line impedance between the power smoothing circuit and the input terminal, and the
load response required by the application.
In addition, the consideration should be taken as the output pin capacitor, to prevent an influence to the regulator’s
characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned
above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,
e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors should
be placed close to the input pin and mounted on the same board side of the regulator not to be influenced by implement
impedance.
Output Pin Capacitor
The output capacitor is mandatory for the regulator in order to realize stable operation. The output capacitor with
capacitance value of 0.05 μF (Min) or higher and ESR up to 500 mΩ (Max) must be required between the output pin and
the GND pin. For applications where the output voltage is 1.5 V or less, it is recommended to use an output capacitor with
capacitance value of 0.22 μF or higher because the output capacitor holds less charge, increasing the amount of voltage
fluctuation during transient response.
A proper selection of appropriate both the capacitance value and ESR for the output capacitor can improve the transient
behavior of the regulator and can also keep the stability with better regulation loop. The correlation of the output capacitance
value and ESR is shown in the graph on the next page as the output capacitor’s capacitance value and the stability region
for ESR. As described in this graph, this regulator is designed to be stable with ceramic capacitors as of MLCC, with the
capacitance value from 0.05 μF to 470 μF and with ESR value within almost 0 Ω to 500 mΩ. The frequency range of ESR
can be generally considered as within about 10 kHz to 100 kHz.
Note that the provided the stable area of the capacitance value and ESR in the graph is obtained under a specific set of
conditions which is based on the measurement result in single IC on our board with a resistive load. In the actual
environment, the stability is affected by wire impedance on the board, input power supply impedance and also loads
impedance. Therefore, please note that a careful evaluation of the actual application, the actual usage environment and
the actual conditions should be done to confirm the actual stability of the system.
Generally, in the transient event which is caused by the input voltage fluctuation or the load fluctuation beyond the gain
bandwidth of the regulation loop, the transient response ability of the regulator depends on the capacitance value of the
output capacitor. Basically the capacitance value of 0.05 μF (Min) or higher for the output capacitor is recommended as
shown in the table on Output Capacitance COUT, ESR Available Area. Using bigger capacitance value can be expected to
improve better the transient response ability in a high frequency. Various types of capacitors can be used for the output
capacitor with high capacity which includes electrolytic capacitor, electro-conductive polymer capacitor and tantalum
capacitor. Noted that, depending on the type of capacitors, its characteristics such as ESR (≤ 500 mΩ) absolute value
range, a temperature dependency of capacitance value and increased ESR at cold temperature needs to be taken into
consideration. When using capacitor with large ESR (≤500mΩ) , note that ceramic capacitor with 0.05 uF or higher must
be connected in parallel to keep stability. In this case, the total capacitance should be less than 470 µF.
In addition, the same consideration should be taken as the input pin capacitor, to prevent an influence to the regulator’s
characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned
above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,
e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors should
be placed close to the output pin and mounted on the same board side of the regulator not to be influenced by implement
impedance.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
30/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Application and Implementation - continued
10
Unstable Area
ESR [Ω]
1
Stable Area
0.1
0.01
0.01
0.1
1
10
100
1000
Output Capacitance COUT [μF]
Figure 51. Output Capacitance COUT, ESR Available Area
(-40 °C ≤ Tj ≤ +150 °C, 4.5 V ≤ VIN ≤ 42 V, VEN = 5 V, IOUT = 0 mA to 150 mA)
Typical Application
Parameter
Symbol
Reference Value for Application
Output Current Range
IOUT
IOUT ≤ 150 mA
Output Capacitor
COUT
0.1 μF
Input Voltage
VIN
13.5 V
Input Capacitor (Note 1)
CIN
0.1 μF
(Note 1) If the inductance of power supply line is high, please adjust input capacitor value.
To avoid any malfunctions by input voltage drop of power supply line, please consider to adjust the impedance of power supply line
to small as much as possible.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
31/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Application and Implementation - continued
Surge Voltage Protection for Linear Regulators
The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute
maximum ratings.
Positive Surge to the Input
If there is any potential risk that positive surges higher than absolute maximum ratings, it is applied to the input, a
Zener Diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure 52.
VIN
VIN
D1
VOUT
VOUT
GND
CIN
COUT
Figure 52. Surges Higher than absolute maximum ratings is Applied to the Input
Negative Surge to the Input
If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the
input, a Schottky Diode should be inserted between the VIN and the GND to protect the device as shown in Figure
53.
VIN
VIN
D1
VOUT
VOUT
GND
CIN
COUT
Figure 53. Surges Lower than -0.3 V is Applied to the Input
Reverse Voltage Protection for Linear Regulators
A linear regulator which is one of the integrated circuit (IC) operates normally in the condition that the input voltage is
higher than the output voltage. However, it is possible to happen the abnormal situation in specific conditions which is
the output voltage becomes higher than the input voltage. A reverse polarity connection between the input and the output
might be occurred or a certain inductor component can also cause a polarity reverse conditions. If the countermeasure
is not implemented, it may cause damage to the IC. The following shows some helpful tips to protect ICs from the reverse
voltage occasion.
Protection against Reverse Input/Output Voltage
In the case that MOSFET is used for the pass transistor, a parasitic body diode between the drain-source generally
exists. If the output voltage becomes higher than the input voltage and if its voltage difference exceeds V F of the body
diode, a reverse current flows from the output to the input through the body diode as shown in Figure 54. The current
flows in the parasitic body diode is not limited in the protection circuit because it is the parasitic element, therefore
too much reverse current may cause damage to degrade or destroy the semiconductor elements of the regulator.
IR
VOUT
VIN
Error
AMP.
VREF
Figure 54. Reverse Current Path in a MOS Linear Regulator
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
32/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Protection against Reverse Input/Output Voltage – continued
An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current
flow inside the IC as shown in Figure 55. Especially in applications where the output voltage setting is high and a
large output capacitor is connected, be sure to consider countermeasures for large reverse current values. Note that
the bypass diode must be turned on prior to the internal body diode of the IC. This external bypass diode should be
chosen as being lower forward voltage VF than the internal body diode. It should to be selected a diode which has a
rated reverse voltage greater than the IC’s input maximum voltage and also which has a rated forward current greater
D1
than the anticipated reverse current in the actual application.
VIN
VIN
VOUT
VOUT
GND
CIN
COUT
Figure 55. Bypass Diode for Reverse Current Diversion
A Schottky barrier diode which has a characteristic of low forward voltage (V F) can meet to the requirement for the
external diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (IR)
caused by the reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to
choose it because if IR is large, it may cause increase of the current consumption, or raise of the output voltage in the
light-load current condition. IR characteristic of Schottky diode has positive temperature characteristic, which the
details shall be checked with the datasheet of the products, and the careful confirmation of behavior in the actual
application is mandatory.
Even in the condition when the input/output voltage is inverted, if the VIN pin is open as shown in Figure 56, or if the
VIN pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic
element. It's because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the
protection external diode is not necessary.
ON→OFF
IBIAS
VIN
VIN
CIN
VOUT
VOUT
GND
COUT
Figure 56. Open VIN
Protection against Input Reverse Voltage
When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if
there is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a
large current passes via the internal electrostatic breakdown prevention diode between the input pin and the GND
pin inside the IC as shown in Figure 57.
The simplest solution to avoid this problem is to connect a Schottky barrier diode or a rectifier diode in series to the
power supply line as shown in Figure 58. However, it increases a power loss calculated as VF x ICC, and it also causes
the voltage drop by a forward voltage VF at the supply voltage while normal operation.
Generally, since the Schottky barrier diode has lower VF, so it contributes to rather smaller power loss than rectifier
diodes. If IC has load currents, the required input current to the IC is also bigger. In this case, this external diode
generates heat more, therefore select a diode with enough margin in power dissipation. On the other hand, a reverse
current passes this diode in the reverse connection condition, however, it is negligible because its small amount.
VIN
VIN
VOUT
VOUT
-
VIN
CIN
+
GND
GND
COUT
VIN
CIN
VOUT
GND
VOUT
COUT
GND
Figure 57. Current Path in Reverse Input Connection
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
D1
33/46
Figure 58. Protection against Reverse Polarity 1
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Protection against Input Reverse Voltage - continued
Figure 59 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic
element) is located in the drain-source junction area of the MOSFET. The drop voltage in a forward connection is
calculated from the on state resistance of the MOSFET and the output current IO. It is smaller than the drop voltage
by the diode as shown in Figure 59 and results in less of a power loss. No current flows in a reverse connection where
the MOSFET remains off in Figure 59.
If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in
consideration, reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 60.
Q1
VIN
Q1
VIN
VIN
CIN
VOUT
GND
VOUT
R2
COUT
Figure 59. Protection against Reverse Polarity 2
R1
VIN
CIN
VOUT
GND
VOUT
COUT
Figure 60. Protection against Reverse Polarity 3
Protection against Reverse Output Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the
moment that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground
pins. A large current may flow in such condition finally resulting on destruction of the IC. To prevent this situation,
connect a Schottky barrier diode in parallel to the integrated diodes as shown in Figure 61.
Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the
negative voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the
waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for
a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar way.
VIN
CIN
VIN
VOUT
VOUT
GND
COUT
GND
D1
XLL
GND
Figure 61. Current Path in Inductive Load (Output: Off)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
34/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Power Dissipation
■SSOP5
1.0
Power Dissipation Pd [W]
(1): 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 μm. copper.
(2) 0.85 W
0.9
0.8
0.7
0.6
(2): 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 μm. copper.
2 inner layers copper foil area of PCB:
74.2 mm x 74.2 mm, 35 μm. copper.
Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm, 70 μm. copper.
(1) 0.46 W
0.5
0.4
0.3
0.2
0.1
0.0
0
25
50
75
100 125
Ambient Temperature Ta [°C]
150
Condition (1) : θJA = 271.3 °C/W, ΨJT (top center) = 46 °C/W
Condition (2) : θJA = 146.7 °C/W, ΨJT (top center) = 37 °C/W
Figure 62. Power Dissipation Graph (SSOP5)
■HTSOP-J8
4.0
3.5
Power Dissipation Pd [W]
(1): 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 μm. copper.
(2) 3.45 W
3.0
2.5
(2): 4-layer PCB
(Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm)
Board material: FR-4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Top copper foil: ROHM recommended footprint
+ wiring to measure, 70 μm. copper.
2 inner layers copper foil area of PCB:
74.2 mm x 74.2 mm, 35 μm. copper.
Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm, 70 μm. copper.
2.0
1.5
(1) 0.79 W
1.0
0.5
0.0
0
25
50
75
100 125
Ambient Temperature Ta [°C]
150
Condition (1) : θJA = 157.2 °C/W, ΨJT (top center) = 32 °C/W
Condition (2) : θJA = 36.2 °C/W, ΨJT (top center) = 11 °C/W
Figure 63. Power Dissipation Graph (HTSOP-J8)
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
35/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement. The power consumption
of the IC is decided by the dropout voltage condition, the load current and the current consumption. Refer to power dissipation
curves illustrated in Figure 62 and 63 when using the IC in an environment of Ta ≥ 25 °C. Even if the ambient temperature Ta
is at 25°C, chip junction temperature (Tj) can be very high depending on the input voltage and the load current. Consider the
design to be Tj ≤ Tjmax = 150 °C in whole operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Therefore, need to be careful because it might be
different from the actual use condition. Verify the application and allow sufficient margins in the thermal design by the following
method to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta.
𝑇𝑗 = 𝑇𝑎 + 𝑃𝐶 × 𝜃𝐽𝐴 [°C]
Where:
Tj
Ta
PC
θJA
is the Junction Temperature
is the Ambient Temperature
is the Power Consumption
is the Thermal Resistance (Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature TT.
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇 [°C]
Where:
Tj
TT
PC
ΨJT
is the Junction Temperature
is the Top Center of Case’s (mold) Temperature
is the Power consumption
is the Thermal Resistance (Junction to Top Center of Case)
3. The following method is used to calculate the power consumption Pc (W).
𝑃𝑐 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶 [W]
Where:
PC
VIN
VOUT
IOUT
ICC
is the Power Consumption
is the Input Voltage
is the Output Voltage
is the Load Current
is the Current Consumption
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
36/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Calculation Example (SSOP5)
If VIN = 13.5 V, VOUT = 5.0 V, IOUT = 40 mA, ICC = 28 μA, the power consumption Pc can be calculated as follows:
𝑃𝐶 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶
= (13.5 𝑉 – 5.0 𝑉) × 40 𝑚𝐴 + 13.5 𝑉 × 28 𝜇𝐴
= 0.34 𝑊
At the maximum ambient temperature Tamax = 85 °C,
the thermal impedance (Junction to Ambient) θJA = 146.7 °C/W (4-layer PCB)
𝑇𝑗 = 𝑇𝑎𝑚𝑎𝑥 + 𝑃𝐶 × 𝜃𝐽𝐴
= 85 °𝐶 + 0.34 𝑊 × 146.7 °𝐶/𝑊
= 134.9 °𝐶
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 46 °C/W (1-layer PCB)
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇
= 100 °𝐶 + 0.34 𝑊 × 46 °𝐶/𝑊
= 115.6 °𝐶
If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the
board, increasing the layer and thermal via between thermal land pad for optimum thermal performance.
Calculation Example (HTSOP-J8)
If VIN = 13.5 V, VOUT = 5.0 V, IOUT = 40 mA, ICC = 28 μA, the power consumption Pc can be calculated as follows:
𝑃𝐶 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶
= (13.5 𝑉 – 5.0 𝑉) × 40 𝑚𝐴 + 13.5 𝑉 × 28 𝜇𝐴
= 0.34 𝑊
At the maximum ambient temperature Tamax = 85 °C,
the thermal impedance (Junction to Ambient) θJA = 36.2 °C/W (4-layer PCB)
𝑇𝑗 = 𝑇𝑎𝑚𝑎𝑥 + 𝑃𝐶 × 𝜃𝐽𝐴
= 85 °𝐶 + 0.34 𝑊 × 36.2 °𝐶/𝑊
= 97.3 °𝐶
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 32 °C/W (1-layer PCB)
𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇
= 100 °𝐶 + 0.34 𝑊 × 32 °𝐶/𝑊
= 110.9 °𝐶
If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the
board, increasing the layer and thermal via between thermal land pad for optimum thermal performance.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
37/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
I/O Equivalence Circuit
VIN Pin
VOUT Pin (Note 1)
VIN
VIN
VOUT
1 kΩ
Internal
Circuit
6.25 kΩ
VOUT Pin (Note 2)
ADJ Pin (Note 2)
VIN
VOUT
1 kΩ
ADJ
20 kΩ
6.25 kΩ
(Note 1) Applicable for product with BD9xxN1G-C, BD9xxN1WG-C, BD9xxN1EFJ-C, BD9xxN1WEFJ-C.
(Note 2) Applicable for product with BD900N1G-C, BD900N1WG-C, BD900N1EFJ-C, BD900N1WEFJ-C.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
38/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
I/O Equivalence Circuit - continued
EN Pin (Note 3)
EN
100 kΩ
Internal
Circuit
(Note 3) Applicable for product with BD9xxN1WG-C, BD9xxN1WEFJ-C (xx = 33, 50, 00).
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
39/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input
and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat
does not exceed the Pd rating. If Junction temperature is over Tjmax (=150 °C), IC characteristics may be worse due
to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment
recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
40/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
N Region
close-by
GND
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Protection Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
41/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Ordering Information
B
D
9
x
x
Output
Voltage
33: 3.3 V
50: 5.0 V
00:
Adjustable
N
Output
Current
Capability
1: 150 mA
1
W
x
Enable
Function
None:
Without
Enable
Function
W:
Enable
Function
x
x
-
C x x
Package
G : SSOP5
EFJ: HTSOP-J8
Product Rank
C: for Automotive
Packaging and Forming
Specification
TR: Embossed Tape and Reel
E2: Embossed Tape and Reel
Lineup
Output Current
Capability
Output Voltage
Enable Function
not available
3.3 V
available
not available
150 mA
5.0 V
available
not available
Adjustable
available
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
42/46
Package
SSOP5
HTSOP-J8
SSOP5
HTSOP-J8
SSOP5
HTSOP-J8
SSOP5
HTSOP-J8
SSOP5
HTSOP-J8
SSOP5
HTSOP-J8
Ordering
BD933N1G-CTR
BD933N1EFJ-CE2
BD933N1WG-CTR
BD933N1WEFJ-CE2
BD950N1G-CTR
BD950N1EFJ-CE2
BD950N1WG-CTR
BD950N1WEFJ-CE2
BD900N1G-CTR
BD900N1EFJ-CE2
BD900N1WG-CTR
BD900N1WEFJ-CE2
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Marking Diagrams
SSOP5(TOP VIEW)
Part Number Marking
LOT Number
Part Number
BD950N1G-C
BD933N1G-C
BD900N1G-C
BD950N1WG-C
BD933N1WG-C
BD900N1WG-C
Part Number Marking
dd
de
df
dk
dm
dn
Output Voltage [V]
5.0
3.3
Adjustable
5.0
3.3
Adjustable
Enable Input(Note 1)
not available
not available
not available
available
available
available
HTSOP-J8(TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
Part Number
BD950N1EFJ-C
BD933N1EFJ-C
BD900N1EFJ-C
BD950N1WEFJ-C
BD933N1WEFJ-C
BD900N1WEFJ-C
(Note 1) available: With Enable Input
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Part Number Marking
950N1
933N1
900N1
950N1W
933N1W
900N1W
Output Voltage [V]
5.0
3.3
Adjustable
5.0
3.3
Adjustable
Enable Input(Note 1)
not available
not available
not available
available
available
available
not available: Without Enable Input
43/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Physical Dimension and Packing Information
Package Name
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP5
44/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Physical Dimension and Packing Information – continued
Package Name
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
HTSOP-J8
45/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
BD9xxN1-C Series
Revision History
Date
Revision
12.May.2022
001
www.rohm.com
© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Changes
New Release
46/46
TSZ02201-0BDB0A400100-1-2
12.May.2022 Rev.001
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
