BD9045FV-E2

Large Current External FET Controller Type Switching Regulators Step-down,High-efficiency Switching Regulators (Controller type) BD9040FV,BD9045FV No.10028EBT03 ●Over View BD9040FV(output type of 1ch) and BD9045FV(output type of 2ch) are switching controllers that can be used within the wide range of the input.Highly effective can be achieved by the synchronous rectification method and it is possible to contribute to the eco-design of all electronic equipment (energy-saving). ●Feature(BD9040FV，BD 9045FV) 1) Wide input voltage range：4.5V～18V 2) Reference voltage 0.9V±1% 3) The overcurrent of timer latch type, excess voltage, short, and RTO/S protection are built-in 4) The switching frequency is changeable.(200kHz～750kHz) 5) A ceramic capacitor can be used for the output. ●Applications For thin television, DVD･HDD recorder , STB, amusement and others. ●Absolute maximum rating (Ta=25℃) Parameter Power-supply voltage Symbol Rating Unit Vcc 20 V EN input voltage VEN 20 V SW voltage VSW Vcc V Voltage between BOOT-SW VBOOT 6 V Permissible loss 1 Pd1 0.81** (BD9040FV) W Permissible loss 2 Pd2 0.94*** (BD9045FV) W Range of operating temperature Topr -40～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Tjmax 150 ℃ Junction temperature ** *** Ta=25℃ or more is reduced with 6.5mW/℃. Ta=25℃ or more is reduced with 7.5mW/℃. ●Operation condition (Ta=-40℃～+85℃) Parameter Power supply voltage*** Timing resistance Frequency of oscillator *** ○ Min 4.5 Limit Typ 12 Max 18 RT 39 － 130 kΩ Fosc 200 － 750 kHz Symbol Vcc Unit V Short EN,EN1,EN2 and VREG5 to VCC when the Vcc is less than 5.5V. The radiation design is not done. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Electric characteristics (Unless otherwise specified Ta=25℃ VCC=12V EN=5V) (BD9040FV) Parameter Symbol Limit Min Typ Max Unit VCC Current of bias ICC - 3 6 mA Standby current ISTB - 430 860 µA VREG5 5 5.5 6 V VREG5_L - 20 50 mV VREG3 2.85 3.0 3.15 V VREG3_L - 10 20 mV Condition VEN=0V ［VREG5］ Standard voltage output voltage Load stability level IVREG5=0 to 6mA ［VREG3 part] Standard voltage Load stability level IVREG3=0 to 1mA ［prevention part for mis-operation of low input］ VREG5 Threshold voltage VREG5_UVLO 3.4 3.8 4.2 V VREG5:Sweep down VREG3 Threshold voltage VREG3_UVLO 2.4 2.5 2.6 V VREG3:Sweep down FOSC 240 300 360 kHz Ivo+ - - 1 µA Isource -12 -6.5 -2 mA VFB=1.1V Sink current Isink 0.75 1.5 5 mA VFB=0.7V Return standard voltage VOB 0.891 0.900 0.909 V FB-COMP Short Output short detection voltage Vosh 0.37 0.45 0.53 V VFB:Sweep down ΔVosh 22 45 90 mV VFB:Sweep up Charge current ISS -14 -10 -6 µA Vss=1V Discharge current 1 IDIS 0.6 1.7 5 mA Vss=1V Discharge current 2 IDIS2 2.35 3.3 4.62 Maximum voltage Vss_MAX 1.75 1.95 2.15 V Standby current Vss_STB - - 0.3 V Iswin 9 10 11 µA Vovp 1.06 1.1 1.14 V ITM -14 -10 -6 µA Threshold voltage Vth_TM 0.9 1 1.1 V OFF Sink current IOFFS 0.6 1.7 5 mA REN 150 300 450 kΩ REN_SS 150 300 450 kΩ ［Oscillator］ Oscillation frequency RT=91 kΩ ［Error amplifier］ VO input bias current Source current Hysteresis voltage ［Soft start part］ Vss=1V, VEN_SS=0V ［overcurrent protection Division］ CL inflow current VCL=Vcc-0.2V ［Overvoltage protection Division］ Detection voltage ［Timer latch circuit Division］ Source current VTM=1V VTM=0.5V ［Each ch control part］ EN pull-up resistor EN_SS pull-up resistor www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Reference data (Unless otherwise specified Ta=25℃) 4.0 90 3.5 80 80 70 1.8V 60 2.6V 3.3V EFFICIENCY[%] 1.2V 50 40 30 3.3V 60 50 40 30 20 20 VIN =12V 10 10 Io=2A 0 1 2 OUTPUT CURRENT：Io[A] 6 3 9 12 15 INPUT VOLTAGE ： VIN [V] Fig.1 Efficiency 1 BD9045FV 0.5 0.4 0.3 BD9040FV 0.1 4 6 8 930 920 910 900 890 880 870 860 -40 10 12 14 16 18 20 -15 10 35 60 OUTPUT VOLTAGE ： Vo[V] 3 2 1 40 60 280 270 -40 80 10 35 60 85 Fig.6 Frequency temperature characteristic RCL=10kΩ 3.0 2.5 2.0 1.5 Latch OFF 1.0 BD9040FV RCL=10kΩ Use SP8K2 0.5 0 1 2 3 4 3.0 2.5 2.0 85℃ 1.5 25℃ 1.0 -40℃ 0.5 0.0 0 1 OUTPUT CURRENT ： Io[A] AMBIENT TEMPERATURE ： Ta[℃] Fig.7 Overcurrent protection temperature characteristic -15 3.5 0.0 20 290 AMBIENT TEMPERATURE ： Ta[℃] 3.5 4 0 300 85 4.0 BD9045FV RCL=12kΩ Use SP8K2 4 6 8 10 12 14 16 18 20 OUTPUT VOLTAGE ： Vo[V] 310 Fig.5 Reference voltage temperature characteristic 7 0 -20 2 320 AMBIENT TEMPERATURE ： Ta[℃] Fig.4 Standby current 5 0.5 330 940 INPUT VOLTAGE ： VIN [V] 6 1.0 Fig.3 Circuit current 850 0.0 2 1.5 0 OSILATING FREQUENCY ： FOSC[kHz] REFERENCE VOLTAGE ： VOB[V] STANDBY CURRENT ： ISTB[uA] 0.7 0 BD9040FV 2.0 18 950 0.8 0.2 2.5 Fig.2 Efficiency 2 0.9 0.6 BD9045FV 3.0 0.0 0 0 OUTPUT CURRENT ： Io[A] 5.0V 70 OUTPUT　VOLTAGE ： Vo[V] EFFICIENCY[%] 5.0V INPUT CURRENT ： IIN[mA] 100 90 100 Fig.8 Load regulation 2 3 4 5 INPUT VOLTAGE：VEN[V] Fig9. EN Threshold voltage OUTPUT　VOLTAGE ： Vo[V] 3.5 20mV/div 3.0 VOUT 2.5 2.0 20mV/div VOUT 85℃ 1.5 25℃ 1.0 -40℃ IOUT 0.5 1A/div 1A/div 0.0 0 1 2 3 4 IOUT 5 INPUT VOLTAGE：VEN_SS[V] Fig.10 EN_SS Threshold voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Fig.11 Load response 1 3/18 Fig.12 Load response 2 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Pin configuration (BD9040FV) EN_SS 1 20 CL RT 2 19 BOOT TM 3 18 OUTH SS 4 17 SW COMP 5 16 DGND FB 6 15 OUTL EN 7 14 VREG5 N.C. 8 13 N.C. VREG3 9 12 N.C. GND 10 11 VCC ●Pin function table (BD9040FV) Terminal number terminal name 1 EN_SS SS discharge Delay ON/OFF terminal 2 RT Oscillation frequency setting terminal 3 TM Output OCP and OVP timer latch setting terminal 4 SS 5 COMP Function Soft start time setting terminal Error amplifier output 6 FB Error amplifier input 7 EN Output ON/OFF terminal 8 N.C Unconnected terminal 9 VREG3 10 GND REG output for standard power supply GND 11 VCC Input power supply terminal 12 N.C Unconnected terminal 13 N.C Unconnected terminal 14 VREG5 15 OUTL 16 DGND 17 SW 18 OUTH Terminal of drive at high side in FET gate 19 BOOT OUTH driver power supply terminal 20 CL www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. REG output for FET drive drive terminal at low side of FET gate Source terminal at low side of FET High side FET source terminal Overcurrent detection setting terminal 4/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Block diagram (BD9040FV) VCC RT 5.5V Reg VREG5 3.0V Reg UVLO 3.8V TSD B.G O/S Check TSD OSC UVLO VREG3 2.5V TM OCP CL Set DRV Reset DRV BOOT OUTH SW VREG5 TSD UVLO Q Slope Set OUTL Reset PWM UVLO DGND FB SS OVP ErrAmp COMP 0.9V Q EN_SS COMP Set Sequence DET Reset 0.45V EN www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. GND 5/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Pin configuration (BD9045FV) GND 14 15 14 OUTL1 TM1 13 16 13 DGND1 SS1 12 17 12 SW1 COMP1 18 11 11 FB1 10 19 10 BOOT1 OUTH1 EN1 20 9 9 CL1 VCC 21 8 8 VREG5 EN2 22 7 7 N.C. VREG3 23 6 6 CL2 RT 24 5 5 BOOT2 FB2 25 4 4 OUTH2 COMP2 26 3 3 SW2 SS2 27 2 2 DGND2 TM2 28 1 1 OUTL2 ●Pin function table (BD9045FV) Terminal number terminal name Functions 1 OUTL2 Terminal 2 of drive at low side FET gate 2 DGND2 Low side FET source terminal2 3 SW2 4 OUTH2 Terminal 2of drive at high side of FET gate High side FET source terminal2 5 BOOT2 OUTH2 driver power supply terminal 6 CL2 Overcurrent detection setting terminal 7 N.C. Unconnected terminal 2 8 VREG5 9 CL1 Overcurrent detection setting terminal 10 BOOT1 OUTH1 driver power supply terminal Terminal 1of drive at high side of FET gate REG output for FET drive 1 11 OUTH1 12 SW1 13 DGND1 Low side FET source terminal 1 14 OUTL1 Terminal 1of drive at low side of FET gate 15 GND 16 TM1 Output 1 OCP and OVP timer latch setting terminal 17 SS1 Soft start time setting terminal 1 18 COMP1 19 FB1 Error amplifier input1 20 EN1 Outpt1ON/OFF terminal 21 VCC Input power supply terminal 22 EN2 Output2ON/OFFterminal 23 VREG3 24 RT Oscillation frequency setting terminal 25 FB2 Error amplifier input 2 26 COMP2 27 SS2 Soft start time setting terminal 2 28 TM2 Output 2 OCP and OVP timer latch setting terminal www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. High side FET source terminal 1 GND terminal Error amplifier output 1 REG output for standard power supply Error amplifier output 2 6/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Block diagram (BD9045FV) VCC 5V Reg VREG5 RT 3V Reg O/S Check UVLO B.G VREG3 OSC UVLO 3.8V TSD TSD TM1 TM2 OCP OCP CL1 CL2 BOOT1 BOOT2 DRV OUTH2 DRV SW2 DRV Set Set DRV Reset Reset OUTH1 SW1 TSD UVLO TSD UVLO VREG5 VREG5 Q OUTL2 Reset Set DGND2 FB2 SS2 PWM COMP Slope Slope PWM COMP Q Set － ＋ ＋ OUTL1 Reset OVP ErrAmp ErrAmp UVLO 0.9V 0.9V COMP DGND1 FB1 SS1 OVP COMP1 Set Q Q Reset Sequence DET Sequence DET 0.45V 0.45V EN2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Set Reset EN1 7/18 GND 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Block functional descriptions ・Error amplifier(ErrAmp) It is a circuit to compare the 0.9V reference voltage and the output voltage’s feedback voltage. Switching Duty is determined by the COMP voltage that is the result of the comparison. In addition, due to the SS terminal voltage on start-up, the Soft Start begins operating, and so the COMP voltage is limited by the SS voltage. ・Oscillator(OSC) It is a block, the oscillating frequency of which is decided by RT and can be set up to 200kHz～750kHz. ・SLOPE It is a block in which triangular wave is created from the clock generated by the OSC. And the generated triangular wave is transmitted to the PWM comparator. ・PWM Comparator(PWM COMP) The error amplifier’s output COMP voltage and the SLOPE block’s triangular wave are compared, and the switching Duty is determined. The switching duty is limited by the maximum Duty ratio internally decided and can not become 100%. ・Reference voltage(5V Reg, 3V Reg) It is a block to generate 5.5V and 3V internal reference voltage. ・Overcurrent protection circuit(OCP) At the time of OUTH=H, if SW voltage becomes not more than CL voltage, the overcurrent protection circuit operates. When the overcurrent protection operates, the Duty is limited, and so the output voltage is lowered. Moreover, when an overcurrent is detected by the overcurrent protection circuit, the charging of the external capacitor on TM terminal is started. When the voltage on TM terminal exceeds 1V, the output becomes OFF state and then is latched. Once EN is made to be L, the latch is released. ・Overvoltage protection circuit(OVP) When FB voltage becomes more than 1.1 V, the overvoltage protection operates. When the overvoltage protection operates, the charging of the external capacitor on TM terminal is started. When the voltage on TM terminal exceeds 1V, the output becomes OFF state and then is latched. Once EN is made to be L, the latch is released. ・Output short circuit protection circuit If FB voltage becomes not more than 0.4V, the output short circuit protection circuit operates. When the output short circuit protection operates, the charging of the external capacitor on TM terminal is started. When the voltage on TM terminal exceeds 1V, the output becomes OFF state and then is latched. Once EN is made to be L, the latch is released. ・O/S Check When RT terminals become open or short circuit states, RT OPEN and SHORT circuit protections operate respectively. When RT terminals’ open or short circuit state is detected, the charging of the external capacitor on TM terminal is started. When the voltage on TM terminal exceeds 1V, the output becomes OFF state and then is latched. Once EN is made to be L, the latch is released. ・Under Voltage Lockout (UVLO) / Thermal Shutdown(TSD) When VREG5 becomes no more than around 3.8V or VREG3 no more than around 2.5, the output of the under voltage lockout is turned off. Then, When VREG5 becomes more than around 4.2V or VREG3 more than around 2.6, the output of the under voltage lockout is reset. Moreover, when the temperature of chip becomes more than around 150℃, the output of the thermal shutdown (TSD) is turned off, and when it is returned to a certain temperature, the output is reset. When UVLO and TSD operate, the capacitors of TM and SS are discharged. ・Function of EN EN is pulled down in regard to GND and pulled up in regard to VCC, and normally EN=H. At the time of EN=L, the capacitors of OFF, TM and SS of output are discharged, and become the standby state. (As for BD9045, due to EN1 and EN2, the capacitors of OFF, TM and SS of each ch output are discharged. In addition it becomes the standby state when both EN1 and EN2 are made to be L). ・Function of EN_SS(BD9040 alone) EN_SS is pulled down in regard to GND and pulled up in regard to VCC, and normally EN_SS=H. At the time of EN_SS=L, the capacitors of OFF, TM and SS of output are discharged.At the time of EN_SS=L, the capacitor of SS is constant-current discharged, so it can be made delayed during output’s OFF. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Application circuit example BD9040FV VIN 12V 30uF CL EN_SS RT 82kΩ 0.1uF 4.7nF 0.1uF 3kΩ 47pF 0.1uF 0.1uF 10kΩ BOOT TM OUTH SS SW COMP DGND FB OUTL EN VREG5 N.C. N.C. VREG3 N.C. GND VCC 0.1uF 10uH 30uF Vo 3.3V 2.2nF 150Ω 27kΩ 10kΩ 1uF ※ There are many factors (The PCB board layout, output current, etc.) that can affect the DCDC characteristics, please Verify and confirm using practical applications. BD9045FV VIN 12V 30uF 0.1uF 0.1uF 10nF 3.3kΩ GND OUTL1 TM1 DGND1 SS1 SW1 COMP1 0.1uF 10kΩ OUTH1 22pF BOOT1 EN1 CL1 VCC VREG5 EN2 N.C. VREG3 CL2 RT BOOT2 FB2 OUTH2 2.2nF 120Ω 30uF 0.1uF FB1 Vo 1.8V 10uH 0.1uF 10kΩ 12kΩ 1uF 0.1uF 12kΩ 82kΩ 10nF 0.1uF 100pF COMP2 2kΩ 0.1uF Vo 1.2V 10uH SW2 SS2 DGND2 TM2 OUTL2 0.1uF 3.3nF 100Ω 15kΩ 30uF 39kΩ ※There are many factors (The PCB board layout, output current, etc.) that can affect the DCDC characteristics, please Verify and confirm using practical applications. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Application components selection (1) Setting of output L constant value The coil value significantly influences the output ripple current. Thus, as seen in equation (1), the bigger the coil, and the higher the switching frequency, the lower the drop in ripple current. ΔIL ΔIL = (VCC-VOUT)×VOUT IL VOUT [A]・・・ （1） L×VCC×f VCC The optimal output ripple current setting is 30% of maximum current. ΔIL = 0.3×IOUTmax.[A]・・・(2) L Co (VCC-VOUT)×VOUT L= [H]・・・ （3） ΔIL×VCC×f (ΔIL：output ripple current, f：switching frequency) Output ripple current ※ Outputting a current in excess of the coil current rating will cause magnetic saturation of the coil and decrease efficiency. Please establish sufficient margin to ensure that peak current does not exceed the coil current rating. ※ Use low resistance (DCR, ACR) coils to minimize coil loss and increase efficiency. (2) Setting of output constant Co Select the output capacitor with the highest value for ripple voltage (VPP) tolerance and maximum drop voltage (at rapid load change). The following equation is used to determine the output ripple voltage. Step down ΔVPP = ΔIL × RESR + ΔIL Co × Vo Vcc × 1 f [V]･･･(4) provided that f： switching frequency Be sure to keep the output Co setting within the allowable ripple voltage range. ※Please allow sufficient output voltage margin in establishing the capacitor rating. Note that low-ESR capacitors enable lower output ripple voltage. Also, to meet the requirement for setting the output startup time parameter within the soft start time range, please factor in the conditions described in the capacitance equation (5) for output capacitors, below. Tss：soft start time Tss × (ILimit – IOUT) IOUT：load current Co ≦ ・・・ （5） VOUT：output voltage VOUT ILimit：over current detection value reference Note: less than optimal capacitance values may cause problems at startup. (3) Input capacitor(Cin)selection VIN Cin VOUT L Co Input capacitor www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. The input capacitor serves to lower the output impedance of the power source connected to the input pin (VCC). Increased power supply output impedance can cause input voltage (VCC) instability, and may negatively impact oscillation and ripple rejection characteristics. Therefore, be certain to establish an input capacitor in close proximity to the VCC and GND pins. Select a low-ESR capacitor with the required ripple current capacity and the capability to withstand temperature changes without wide tolerance fluctuations. The ripple current IRMS is determined using equation (6). IRMS = IOUT × VOUT（VCC - VOUT） VCC [A]・・・(6) Also, be certain to ascertain the operating temperature, load range and MOSFET conditions for the application in which the capacitor will be used, since capacitor performance is heavily dependent on the application’s input power characteristics, substrate wiring and MOSFET gate drain capacity. 10/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV (4) Feedback resistor design Please refer to the following equation in determining the proper feedback resistance. The recommended setting is in a range between 1kΩ and 330kΩ. Resistance less than 1kΩ risks decreased power efficiency, while setting the resistance value higher than 330kΩ will result in an internal error amp input bias current of 0.4uA increasing the offset voltage. Vo Internal reference 0.9V R1 FB R2 R1 +R2 Vo = × 0.9 [V] ・・・(7) R2 f [kHz] (5) Setting switching frequency The triangular wave switching frequency can be set by connecting a resistor to the RT pin. The RT sets the frequency by adjusting the charge/discharge current in relation to the internal capacitor. Refer to the figure below in determining proper RT resistance. Settings outside this range may render the switching function inoperable, and proper operation of the controller overall cannot be guaranteed when unsupported resistance values are used. 750 700 650 600 550 500 450 400 350 300 250 200 0 20 40 60 80 100 120 140 160 R T [ kΩ] (6) Setting the soft start delay The soft start function is necessary to prevent an inrush of coil current and output voltage overshoot at startup. The figure below shows the relation between soft start delay time and capacitance, which can be calculated using equation (8) at right. TSL = 0.8 × Vo Css TSH = 0.7 × Css [sec]・・・ （8） Iss（10µA typ） Vcc If the capacitance value is reduced (to no more than 0.01 uF or so), the overshoot in output may be caused. Please use high accuracy components (such as X5R) when implementing sequential startups involving other power sources. Be sure to test the actual devices and applications to be used, since the soft start time varies, depending on input voltage, output voltage, load, coil, output capacitance and phase compensation constant etc. Iss（10µA typ） [sec] × (7) Setting the EN_SS (output delay function)(in the case of BD9040FV) If EN_SS is made to be L, the output voltage’s OFF time can be made delayed. The calculating formula for delay time is shown in the following equation. TDIS= Vss_MAX(1.95VTyp)-(0.8+0.7× Vo Vcc ) × Css Idis(3.3uA,Typ) [sec]・・・(9) VCC EN_SS VO Tdis TSL TSH www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV (8) Overcurrent protection Current limit value (ILimit) is determined by the resistance RCL established between VCC and CL. (refer to the following diagram)The current limit is self-feedback type, when overcurrent is detected, the output Duty is reduced, and the current is limited. When load returns to normal state, the output voltage returns to its former state. overcurrent protection 6 6 5 5 4 4 Io [A] Io [A] overcurrent protection 3 In case of SP8K2 2 3 2 In case of SP8K2 1 1 0 0 12 13 14 15 16 R CL [kΩ] 17 12 18 BD9040FV measurement value of our company’s substrate 13 BD9045FV 14 15 16 R CL [kΩ] 17 18 measurement value of our company’s substrate ※There are many factors (the layout and service condition) that can affect the characteristics, please verify and confirm using practical applications.Overcurrent protection detection value is dependent on the ON resistance of external FET and so varies with temperature. (Refer to Fig.7 on page 3) Please determine it in such a way that a good margin is left while setting it. Moreover, in case of different layout of substrate or large gate capacitance of external FET, sufficient voltage between gate and source of external FET can not be provided, the ON resistance becomes high, and so the overcurrent protection value may be greatly changed. Please use a FET, the gate capacitance of which is no more than1500pF, as external FET. (the recommended: SP8K2， SP8K1)However, There are many factors (the layout and service condition) that can affect the characteristics, please verify and confirm using practical applications. Compare the VCL that is set by RCL and the ΔVsw that is generated by ON resistance of loxFET. VCC RCL CL VCL 10uA OUTH Io Overcurrent protection ΔVsw SW OUTL (9) Setting of OFF latch timer time ・OFF latch timer is charged if one of the following conditions is met. ・Current limit is operating. ・Overvoltage protection(FB≧1.1V)is operating. ・Output short circuit protection(FB≦0.45V)is operating. ・Resistor connected on RT terminal becomes open. ・RT terminal is shorted with GND. ・Resistor connected on CL terminal becomes open. If the charging is started and continued until the fully-charged, the output is OFF latched. The time from start-up of charging till output OFF is determined by the following formula. CTM TTM = [sec] ・・・(10) ITM(10uA typ) This OFF latch is released once EN is made to be「L」or if VCC is once lowered and then rises again. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV (10) Method for determining phase compensation Conditions for application stability Feedback stability conditions are as follows: ・When gain is 1 (0dB) and phase shift is 150° or less (i.e., phase margin is at least 30°): a dual-output high-frequency step-down switching regulator is required Additionally, in DC/DC applications, sampling is based on the switching frequency; therefore, overall GBW may be set at no more than 1/10 the switching frequency. In summary, target characteristics for application stability are: ・Phase shift of 150° or less (i.e., phase margin of 30° or more) with gain of 1 (0dB) ・GBW (i.e., gain 0dB frequency) no more than 1/10 the switching frequency. Stability conditions mandate a relatively higher switching frequency, in order to limit GBW enough to increase response. The key to achieving successful stabilization using phase compensation is to cancel the secondary phase margin/delay (-180°) generated by LC resonance, by employing a dual phase lead. In short, adding two phase leads stabilizes the application.GBW (the frequency at gain 1) is determined by the phase compensation capacitor connected to the error amp. Thus, a larger capacitor will serve to lower GBW if desired. ① General use integrator (low-pass filter) Feedback COMP A R ② Integrator open loop characteristics Gain [dB] -20dB/decade GBW(b) 90 0 Phase 0 [deg] -90 -90 FB (a) A 180 Point(a) fa = 1 1.25[Hz]・・・ （11） 2πRCA 0 C -180 -180 -90° Point(b) fa = GBW -180° Phase margin 1 2πRC [Hz] ・・・ （12） The error amp is provided with phase compensation similar to that depicted in figures ① and ② above and thus serves as the system’s low-pass filter.In DC/DC converter applications, R is established parallel to the feedback resistance. When electrolytic or other high-ESR output capacitors are used Phase compensation is relatively simple for applications employing high-ESR output capacitors (on the order of several Ω). In DC/DC converter applications, where LC resonance circuits are always incorporated, the phase margin at these locations is -180°. However, wherever ESR is present, a 90° phase lead is generated, limiting the net phase margin to -90° in the presence of ESR. Since the desired phase margin is in a range less than 150°, this is a highly advantageous approach in terms of the phase margin. However, it also has the drawback of increasing output voltage ripple components. ③ LC resonance circuit ④ ESR connected Vcc 1 [Hz]: 2π√LC fr = 1 fr = 2π√LC Vo [Hz]・・・ （13） fESR = resonance point ・・ （14） 1 [Hz]: Zero （15） 2πRESRC Resonance point phase margin -180º L C -90°:Pole Since ESR changes the phase characteristics, only one phase lead need be provided for high-ESR applications. Please choose one of the following methods to add the phase lead. ⑤ Add C to feedback resistance ⑥ Add R3 to aggregator Vo Vo C2 C1 R3 FB FB A COMP 1 2πC1R1 [Hz]・・・(16) R2 Phase lead fz = C2 R1 R1 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R2 Phase lead fz = 13/18 A COMP 1 [Hz]・・・(17) 2πC2R3 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV Set the phase lead frequency close to the LC resonance frequency in order to cancel the LC resonance. ・When using ceramic, OS-CON, or other low-ESR capacitors for the output capacitor: Where low-ESR (on the order of tens of mΩ) output capacitors are employed, a two phase-lead insertion scheme is required, but this is different from the approach described in figure ③～⑥, since in this case the LC resonance gives rise to a 180° phase margin/delay. Here, a phase compensation method such as that shown in figure ⑦ below can be implemented. ⑦Phase compensation provided by secondary (dual) phase lead Vo R3 C1 R1 Phase lead fz1 = 1 2πR1C1 [Hz]・・・(18) Phase lead fz2 = 1 2πR3C2 [Hz] ・・・(19) C2 FB A COMP R2 LC resonance frequency fr = 1 2π√LC [Hz] ・・・(20) Once the phase-lead frequency is determined, it should be set close to the LC resonance frequency. This technique simplifies the phase topology of the DCDC Converter. Therefore,it might need a certain amount of trial-and-error process. There are many factors(The PCB board layout, Output Current, etc.)that can affect the DCDC characteristics. Please verify and confirm using practical applications. (9)MOS FET selection VCC VDS IL VGSM1 VGSM2 Vo FET uses Nch MOS ・VDS＞Vcc ・VGSM1＞BOOT-SW interval voltage ・VGSM2＞VREG5 ・allowable current＞output current + ripple current ※Should be at least the over current protection value ※Select a low ON-resistance MOSFET for highest efficiency ※Attention If the input capacitance of FET is extremely large or it is used with Duty no more than 10%, it is possible that output FETs on both upper side and under side are simultaneously turned on and so the efficiency deteriorates. The input capacitance of output FET is recommended to be no more than 1000pF. But these characteristics vary with substrates’ layouts or varieties of parts etc, so please confirm them thoroughly with actual devices when it is put into mass production. VDS (10)Schottky barrier diode selection ・Reverse voltage VR＞Vcc ・Allowable current ＞ output current + ripple current ※Should be at least the over current protection value ※Select a low forward voltage, fast recovery diode for highest efficiency VCC Vo VR www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Timing chart EN=L EN=L EN=L UVLO VCC SS EN1 Vreg3 Vreg5 3.8V TM 1V 4.2V 1V 1.1V FB OVP 検出 OVP detection www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/18 0.45V SCP detection SCP 検出 on latch condition ラッチ状態で output OFF 出力 OFF on latch condition ラッチ状態で 出力 OFF output OFF 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ● Input & output equivalent circuits 2(24)PIN [RT] [EN] ７PIN (20,22)PIN [EN1, EN2] VREG3 VCC VCC VCC VCC 300kΩ VREG3 20kΩ EN EN RT 150Ω 20PIN (9,6)PIN 367kΩ 20kΩ 315kΩ 20kΩ 200kΩ 184kΩ 15PIN [OUTL] (14, 1)PIN [OUTL1, OUTL2] [CL] [CL1, CL2] 20kΩ 377kΩ 5PIN [COMP] (18,26)PIN [COMP1, COMP2] VCC VREG5 2kΩ VCC VREG3 VREG5 CL 3kΩ 20kΩ VREG3 COMP OUTL 5kΩ 6PIN [FB] (19, 25)IN [FB1, FB2] 1PIN 3PIN [TM] (6，28)PIN [TM1, TM2] [EN_SS] VREG3 VCC VCC VCC VREG3 VREG3 VREG3 300kΩ 1kΩ EN_SS 2kΩ 200kΩ FB 20kΩ TM 1kΩ 55Ω 100kΩ 4PIN (7, 27)PIN [SS] [SS1, SS2] VCC 9PIN (23)PIN VCC VREG3 9,17,18PIN (10, 5)PIN (12, 3)PIN (11, 4)PIN [VREG3] [VREG3] VCC [BOOT, SW, OUTH] [BOOT1, BOOT2] [SW1, SW2] [OUTH1, OUTH2] BOOT VCC OUTH 2kΩ SS 150kΩ 50Ω VREG3 100kΩ 100kΩ ※ The inside of ( SW 300kΩ ) is of BD9045FV www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Notes for use 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2. GND potential Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry a voltage lower than or equal to the GND pin, including during actual transient phenomena. if there is a terminal, electric potential of which is lower than that of GND, please take such measures as provide a bypass route etc. 3. Permissible dissipation Pd If by any chance you use it in such a way that the permissible dissipation is exceeded, occurs the deterioration of original performances of IC such as reduction of current capacity caused by an increase in temperature of chip, which will lead to a decline in reliability, therefore please use it in such a way that its dissipation is within the permissible one and allows for a sufficient margin. 4. Input power supply Please wire and arrange in such a way that, in the wiring pattern and pattern layout, the wiring to the input pin VIN is sufficiently short and furthermore electrical interference is not caused. The electrical characteristics included in this specification may vary with such conditions as temperature, power supply voltage and external circuits etc., so please confirm them thoroughly including transient characteristic. 6. Thermal shutdown circuit Thermal shutdown circuit is built-in in order to prevent the thermal destruction of IC. Please use it within its permissible dissipation range, but if by any chance the state of exceeding the permissible dissipation continues, the temperature of chip rises, as a result the thermal shutdown circuit operates and so the output is turned off. If after that the temperature Tj of chip falls, the circuit resets automatically. Furthermore, the thermal shutdown circuit leads to the state of exceeding the absolute maximum rating, so please absolutely avoid such set design as uses the thermal shutdown circuit. 7. nter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the presence of a foreign object may result in damage to the IC. 8. Applications with modes that reverse VCC and pin potentials may cause damage to internal IC circuits. For example, such damage might occur when VCC is shorted with the GND pin while an external capacitor is charged. Please use 1μF and 0.1μF respectively as the capacitor of VREG5’s output terminal and the capacitor of VREG3’s output terminal. Moreover, it is recommended to insert a diode for preventing back current flow in series with VCC or bypass diodes between VCC and each pin. 9.Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 10. Please insert the protective diode when it is conceivable that the back electromotive force is produced at the time of start-up or output OFF because a load that has a large inductance component is connected on output terminal. 11. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. 12. GND wiring pattern If there are both small-signal GND and large-current GND, then large-current GND pattern and small-signal GND pattern are separated, and in order that the pattern wiring and the voltage change caused by large current do not change the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set. Please be careful of not changing the GND wiring pattern of external parts. 13. SW terminal In case of connecting of application, SW terminal may become a negative electric potential due to the back electromotive force of coil. Please take such measures as provide a bypas route between SW terminal and GND at the time of setting of application. 14. Output At the time of EN=L，UVLO, and timer latch, the current flows out from SW terminal. If the service condition is such that the output load becomes no more than 1mA, then please insert a 1kΩ resistor between output and GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/18 2010.03 - Rev.B Technical Note BD9040FV, BD9045FV ●Ordering part number B D 9 Part No. 0 4 0 F Part No. 9040 9045 V - Package FV : SSOP-B20 SSOP-B28 E 2 Packaging and forming specification E2: Embossed tape and reel (SSOP-B20, SSOP-B28) SSOP-B20 6.5 ± 0.2 11 0.3Min. 4.4 ± 0.2 6.4 ± 0.3 20 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 10 1.15 ± 0.1 0.1± 0.1 0.15 ± 0.1 0.1 0.65 0.22 ± 0.1 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. SSOP-B28 10 ± 0.2 (MAX 10.35 include BURR) 15 0.3Min. 1 Embossed carrier tape Quantity 2000pcs E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 14 0.15 ± 0.1 0.1 1.15 ± 0.1 Tape Direction of feed 5.6 ± 0.2 7.6 ± 0.3 28 0.1 0.65 0.22 ± 0.1 1pin (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel 18/18 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.03 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A