Datasheet
2.5V to 5.5V, 0.3A 1ch
Synchronous Buck Converter with
Integrated FET
BD9122GUL
General Description
Key Specifications
The BD9122GUL is ROHM’s high efficiency step-down
switching regulator designed to produce a voltage as
low as 1V from a supply voltage of 3.3V or 5V. It offers
high efficiency by using pulse skip control technology
and synchronous switches, and provides faster
transient response to sudden load changes by
implementing current mode control.
Features
■
■
■
■
■
Input Voltage Range:
Output Voltage Range:
Output Current:
Switching Frequency:
Pch FET ON Resistance:
Nch FET ON Resistance:
Standby Current:
Operating Temperature Range:
Package
Fast Transient Response because of Current Mode
Control System.
High Efficiency for All Load Ranges because of
Synchronous Rectifier (Nch and Pch FET) and
SLLMTM(Simple Light Load Mode).
Soft-Start Function.
Thermal Shutdown and UVLO Functions
Short-Circuit Protection with Time Delay Function
Shutdown Function.
2.5V to 5.5V
1.0V to 2.0V
0.3A (Max)
1MHz(Typ)
0.3Ω(Typ)
0.2Ω(Typ)
0μA (Typ)
-25°C to +85°C
W(Typ) x D(Typ) x H(Max)
2.50mm x 1.10mm x 0.55mm
VCSP50L2:
Applications
Power Supply for LSI including DSP, Microcomputer
and ASIC
Typical Application Circuit
VCC
CIN
L
EN
VCC,PVCC
SW
VOUT
ADJ
ITH
R2
CO
GND,PGND
RITH
R1
CITH
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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BD9122GUL
Pin Configuration
TOP VIEW
A1 PGND
SW B1
PVCC B2
A2 GND
VCC B3
A3 EN
ADJ B4
A4 ITH
Figure 2. Pin Configuration
Pin Description
Pin No.
Pin Name
A1
PGND
A2
GND
Pin Function
Power switch ground pin
Ground pin
A3
EN
Enable pin（Active High）
A4
ITH
Gm Amp output pin/connected phase compensation capacitor
B1
SW
Power switch node
B2
PVCC
B3
VCC
VCC power supply input pin
B4
ADJ
Output voltage detect pin
Power switch supply pin
Block Diagram
VCC
EN
VCC
VREF
3.3V
Input
PVCC
Current
Sense/
Protect
Current
Comp
+
10µF
R Q
+
S
Gm Amp
SLOPE
CLK
Driver
Logic
4.7µH
OSC
+
Output
SW
VCC
4.7μF
UVLO
Soft
Start
TSD
PGND
SCP
GND
ADJ
ITH
RITH
R1
CITH
R2
Figure 3. Block Diagram
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Absolute Maximum Ratings (Ta=25°C)
Parameter
VCC Voltage
PVCC Voltage
EN Voltage
SW,ITH Voltage
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Symbol
VCC
PVCC
VEN
VSW,VITH
Pd
Topr
Tstg
Tjmax
Limit
-0.3 to +7 (Note 1)
-0.3 to +7 (Note 1)
-0.3 to +7
-0.3 to +7
0.66 (Note 2)
-25 to +85
-55 to +150
+150
Unit
V
V
V
V
W
°C
°C
°C
Pd should not be exceeded.
Reduce by 5.28mW/°C for temperatures above Ta=25°C. (Mounted on 50mmx58mmx1.6mm Glass Epoxy PCB).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
(Note 1)
(Note 2)
Recommended Operating Conditions (Ta=25°C)
Parameter
VCC Voltage
PVCC Voltage
EN Voltage
SW Average Output
Output Voltage Setting Range
(Note 3)
(Note 4)
Symbol
Limit
Typ
3.3
3.3
-
Min
2.5 (Note 4)
2.5 (Note 4)
0
1.0
VCC (Note 3)
PVCC(Note 3)
VEN
Isw (Note 3)
VOUT
Unit
Max
5.5
5.5
VCC
0.3
2.0
V
V
V
A
V
Pd should not be exceeded.
In case set output voltage is 1.8V or more, VCCMin = 2.7V.
Electrical Characteristics (Ta=25°C, VCC=PVCC=3.3V, VEN=VCC, R1=20kΩ, R2=10kΩ, unless otherwise specified.)
Parameter
Standby Current
Symbol
Limit
Unit
Min
Typ
Max
ISTB
-
0
10
μA
Conditions
EN=GND
ICC
-
250
400
μA
EN Low Voltage
VENL
-
GND
0.8
V
Standby mode
EN High Voltage
VENH
2.0
VCC
-
V
Active mode
EN Input Current
IEN
-
1
10
μA
VEN=3.3V
Oscillation Frequency
fOSC
0.8
1
1.2
MHz
Pch FET ON Resistance
RONP
-
0.3
0.6
Ω
PVCC=3.3V
Nch FET ON Resistance
RONN
-
0.2
0.5
Ω
PVCC=3.3V
ADJ Voltage
VADJ
0.780
0.800
0.820
V
Output Voltage
VOUT
-
1.200
-
V
ITH SInk Current
ITHSI
10
20
-
μA
VADJ=1.0V
Bias Current
ITHSO
10
20
-
μA
VADJ=0.6V
UVLO Threshold Voltage
VUVLO1
2.2
2.3
2.4
V
VCC=3V to 0V
UVLO Release Voltage
VUVLO2
2.22
2.35
2.5
V
VCC=0V to 3V
tSS
0.5
1
2
ms
Timer Latch Time
tLATCH
1
2
4
ms
Output Short Circuit Threshold Voltage
VSCP
-
VOUTx0.5
-
V
ITH Source Current
Soft Start Time
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VOUT=2V to 0V
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Typical Performance Curves
[VOUT=1.5V]
Ta=25°C
IO=0A
Output Voltage: VOUT[V]
Output Voltage:VOUT[V]
[VOUT=1.5V]
VCC=3.3V
Ta=25°C
IO=0A
Input Voltage: VCC[V]
EN Voltage: VEN[V]
Figure 4. Output Voltage vs Input Voltage
Figure 5. Output Voltage vs EN Voltage
[VOUT=1.5V]
[VOUT=1.5V]
Output Voltage:VOUT[V]
Output Voltage: VOUT[V]
VCC=3.3V
IO=0A
VCC=3.3V
Ta=25°C
Output Current: IOUT[A]
Temperature: Ta[°C]
Figure 7. Output Voltage vs Temperature
Figure 6. Output Voltage vs Output Current
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Typical Performance Curves - continued
Efficiency: η [%]
Frequency: fOSC [MHz]
[VOUT=1.5V]
VCC=3.3V
VCC=3.3V
Ta=25°C
Output Current: IOUT[mA]
Temperature: Ta[°C]
Figure 9. Frequency vs Temperature
Figure 8. Efficiency vs Output Current
VCC=3.3V
PMOS
NMOS
EN Voltage: VEN[V]
ON Resistance: RON[Ω]
VCC=3.3V
Temperature: Ta[°C]
Temperature: Ta[°C]
Figure 10. On Resistance vs Temperature
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Figure 11. EN Voltage vs Temperature
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Typical Performance Curves - continued
VCC=3.3V
Frequency: fOSC;MHz]
Circuit Current: ICC[µA]
Ta=25°C
Input Voltage: VCC[V]
Temperature: Ta[°C]
Figure 13. Frequency vs Input Voltage
Figure 12. Circuit Current vs Temperature
Typical Waveforms
[VOUT=1.5V]
VCC=PVCC
=EN
[SLLMTM control
VOUT=1.5V
SW
VOUT
VOUT
VCC=3.3V
Ta=25°C
IO=0A
VCC=3.3V
Ta=25°C
Figure 15. SW waveform
(Io=10mA)
Figure 14. Soft Start Waveform
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Typical Waveforms - continued
SW
VOUT
IOUT
VOUT
VCC=3.3V
Ta=25°C
VCC=3.3V
Ta=25°C
Figure 17. Transient Response
(Io=50mA to 125mA , 10μs)
Figure 16. SW waveform
(Io=200mA)
[VOUT=1.8V]
VOUT
IOUT
VCC=3.3V
Ta=25°C
Figure 18. Transient Response
(Io=125mA to 50mA , 10μs)
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BD9122GUL
Application Information
1. Operation
BD9122GUL is a synchronous step-down switching regulator that achieves faster transient response by employing current
mode PWM control system. Its switching operation utilizes PWM (Pulse Width Modulation) mode for heavier load, while
SLLMTM (Simple Light Load Mode) operation for lighter load to improve efficiency.
(1) Synchronous Rectifier
Integrated synchronous rectification using two MOSFETS reduces power dissipation and increases efficiency when
compared to converters using external diodes. Internal shoot-through current limiting circuit further reduces power
dissipation.
(2) Current Mode PWM Control
The PWM control signal of this IC depends on two feedback loops, the voltage feedback and the inductor current
feedback.
(a)
PWM (Pulse Width Modulation) control
The clock signal coming from OSC has a frequency of 1Mhz. When OSC sets the RS latch, the P-channel
MOSFET is turned ON and the N-channel MOSFET is turned OFF, causing an inductor current IL to increase.
The opposite happens when the current comparator (Current Comp) resets the RS latch i.e. the P-channel
MOSFET is turned OFF and the N-channel MOSFET is turned ON. Current Comp’s output is a comparison of two
signals, the current feedback control signal “SENSE” which is a voltage proportional to the current IL and the
voltage feedback control signal, FB.
(b)
SLLMTM (Simple Light Load Mode) Control
When the control mode is shifted by PWM from heavier load to lighter load or vice versa, the switching pulse is
designed to turn OFF with the device held operating in normal PWM control loop. This allows linear operation
without voltage drop or deterioration in transient response during the sudden load changes.
Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from
Current Comp, it is designed such that the RESET signal is kept constant when shifted to the light mode where
the switching is tuned OFF and the switching pulses disappear. Activating the switching discontinuously reduces
the switching dissipation and improves the efficiency.
SENSE
Current
Comp
RESET
VOUT
Level
Shift
R Q
FB
SET
Gm Amp
RITH
S
IL
Driver
Logic
VOUT
SW
Load
OSC
Figure 19. Diagram of Current Mode PWM Control
PVCC
Current
Comp
SENSE
PVCC
SENSE
Current
Comp
FB
FB
SET
GND
SET
GND
RESET
GND
RESET
GND
SW
GND
SW
IL
GND
IL(AVE)
IL
0A
VOUT
VOUT
VOUT(AVE)
VOUT(AVE)
Not switching
Figure 21. SLLMTM Switching Timing Chart
Figure 20. PWM Switching Timing Chart
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2. Description of Operations
(1) Soft-Start Function
During start-up, the soft-start circuit gradually establishes the output voltage to limit the input current. This prevents the
overshoot in the output voltage and inrush current.
(2) Shutdown Function
When EN terminal is “Low”, the device operates in Standby Mode, and all the functional blocks including reference
voltage circuit, internal oscillator and drivers are turned OFF. Circuit current during standby is 0μA (Typ).
(3) UVLO Function
It detects whether the input voltage is sufficient enough to secure that the expected output voltage of this IC. A
hysteresis width of 50 mV (Typ) is provided to prevent the output from chattering.
Hysteresis 50mV
VCC
EN
VOUT
tss
tss
tss
Soft start
Standby Mode
Operating mode
Standby
Mode
Standby
Mode
Operating Mode
UVLO
UVLO
Operating Mode
EN
Standby Mode
UVLO
Figure 22. Soft Start, Shutdown, UVLO Timing Chart
(4) Short-Current Protection Circuit with Time Delay Function
To protect the IC from breakdown, the short-circuit protection circuit turns the output off when the internal current limiter
is activated continuously for a fixed time (tLATCH) or more. The output that is held OFF may be turned ON again by
restarting EN or by resetting UVLO.
EN
Output OFF
Latch
Output Short circuit
Threshold Voltage
VOUT
IL Limit
IL
t1 IRMSMax
When VCC is twice the VOUT, IRMS
IOUT
2
If VCC=3.3V, VOUT=1.5V, and IOUTMax =0.3A
Figure 30. Input Capacitor
I RMS 0.3
1.5(3.3 1.5)
[ ARMS ]
0.15
3.3
A low ESR 10μF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better
efficiency.
(4) Calculating RITH, CITH for Phase Compensation
Since the Current Mode Control is designed to limit an inductor
frequency area due to a CR filter consisting of an output capacitor
appears in the high frequency area due to the output capacitor
compensated by adding a zero to the power amplifier output with C
power amplifier.
fp
fp(Min)
A
Gain
[dB]
fZ(ESR)
IOUTMin
Phase
[deg]
1
2 RO CO
f Z ESR
fp(Max)
0
IOUTMax
current, a pole (phase lag) appears in the low
and a load resistance, while a zero (phase lead)
and its ESR. Therefore, the phases are easily
and R as described below to cancel a pole at the
1
2 ESR CO
Pole at Power Amplifier
When the output current decreases, the load resistance Ro
increases and the pole frequency decreases.
0
-90
fpMin
Figure 31. Open Loop Gain Characteristics
1
2 RO Max CO
fpMax
1
2 RO Min CO
Hz with lighter load
Hz with heavier load
A
fZ(Amp)
Zero at Power Amplifier
Gain
[dB]
Increasing capacitance of the output capacitor lowers the pole
frequency while the zero frequency does not change. (This is
because when the capacitance is doubled, the capacitor ESR
is reduced to half.)
1
f Z Amp
2 RITH CITH
0
0
Phase
[deg]
-90
Figure 32. Error Amp Phase Compensation Characteristics
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BD9122GUL
CIN
VCC
VCC, PVCC
EN
L
SW
VOUT
ADJ
R2
CO
ITH
GND,PGND
RITH
R1
CITH
Figure 33. Typical Application
Stable feedback loop may be achieved by canceling the pole fp (Min) produced by the output capacitor and the load
resistance with CR zero correction by the error amplifier.
f Z Amp fpMin
1
2 R ITH C ITH
1
2 RO Max C O
(5) Determination of Output Voltage
The output voltage VOUT is determined by the equation (7):
VOUT ( R2 / R1 1) V ADJ
L
Output
SW
Co
・・・(7)
Where:
VADJ is the Voltage at ADJ terminal (0.8V Typ)
ADJ
R2
R1
The desired output voltage may be determined by adjusting R1 and R2.
Figure 34. Determination of Output Voltage
Output voltage range: 1.0V to 2.0V
Use 1 kΩ to 100 kΩ resistor for R1. When using a resistor with resistance higher than 100 kΩ, check the assembled set
carefully for ripple voltage etc.
7. Cautions on PC Board Layout
②
CO
①
VOUT
CIN
L
SW
PVCC
VCC
PGND
GND
③
CITH
GND
RITH
R2
VCC
EN
ADJ
ITH
EN
R1
Figure 35. Layout Diagram
①
For the sections drawn with heavy line, use thick conductor pattern as short as possible.
②
Lay out the input ceramic capacitor CIN near PVCC and PGND pins, and the output capacitor Co near PGND pin.
③
Lay out CITH and RITH between the pins ITH and GND as near as possible with the least necessary wiring.
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BD9122GUL
8. Recommended Parts List for the Above Application
Symbol
L
CIN
CO
Part
Coil
Ceramic Capacitor
Ceramic Capacitor
CITH
Ceramic Capacitor
RITH
Resistance
Value
2.2uH
10uF
10uF
VOUT=1.0V
VOUT=1.2V
VOUT=1.5V
VOUT=1.8V
VOUT=2.0V
VOUT=1.0V
VOUT=1.2V
VOUT=1.5V
VOUT=1.8V
VOUT=2.0V
Manufacturer
FDK
Murata
Murata
Series
MIPF2016D2R2
GRM188B30J106ME47B
GRM188B30J106ME47B
Murata
GRM15 Series
2200pF
1000pF
6.8kΩ
MCR006 6801
ROHM
4.7kΩ
MCR006 4701
Note: The parts list presented above is an example of recommended parts. Although the parts are standard, actual circuit characteristics should be checked
on your application carefully before using. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when
employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these
margins. When switching noise is significant and may affectt the system, a low pass filter should be inserted between the VCC and PVCC pins, and a
Schottky Barrier diode established between the SW and PGND pins.
I/O Equivalent Circuit
・EN pin
PVCC
・SW pin
PVCC
PVCC
EN
SW
・ITH pin
・ADJ pin
VCC
ADJ
ITH
Figure 36. I/O Equivalent Circuit
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 37. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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BD9122GUL
Ordering Information
B
D
9
1
2
Part Number
2
G
U
L
Package
GUL: VCSP50L2
E2
Packaging and forming specification
E2: Embossed tape and reel
(VCSP50L2)
Marking Diagram
VCSP50L2
(TOP VIEW)
9122
LOT No.
1PIN MARK
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19/21
TSZ02201-0J3J0AJ00110-1-2
02.Oct.2014 Rev.002
BD9122GUL
Physical Dimension Tape and Reel Information
Package Name
VCSP50L2 (BD9122GUL)
[Unit: mm]
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand.)
1234
1234
1234
1234
1234
1234
Direction of feed
Reel
1Pin
When you order , please order in times the amount of package quantity.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
20/21
TSZ02201-0J3J0AJ00110-1-2
02.Oct.2014 Rev.002
BD9122GUL
Revision History
Date
Revision
02.Mar.2012
02.Oct.2014
001
002
Changes
New Release
Applied the ROHM Standard Style and improved understandability.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
21/21
TSZ02201-0J3J0AJ00110-1-2
02.Oct.2014 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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