BD9134MUV_12

Datasheet 4.5V to 5.5V, 3.0A 1ch Synchronous Buck Converter Integrated FET BD9134MUV ●General Description ROHM’s high efficiency step-down switching regulator BD9134MUV is a power supply designed to produce 3.3 volts from 5 volts power supply line. Offers high efficiency with our original pulse skip control technology and synchronous rectifier. Employs a current mode control system to provide faster transient response to sudden change in load. ●Features  Offers fast transient response with current mode PWM control system.  Offers highly efficiency for all load range with synchronous rectifier (Nch/Nch FET) TM and SLLM (Simple Light Load Mode)  Incorporates soft-start function.  Incorporates thermal protection and UVLO functions.  Incorporates short-current protection circuit with time delay function.  Incorporates shutdown function ●Key Specifications  Input voltage range:  Output voltage range:  Output current:  Switching frequency:  High side FET ON resistance:  Low side FET ON resistance:  Standby current:  Operating temperature range: ●Package VQFN020V4040: 4.5V to 5.5V 3.3V t±0.05V 3.0A(Max.) 1MHz(Typ.) 82mΩ(Typ.) 70mΩ(Typ.) 0μA (Typ.) -40℃ to +105℃ (Typ.) (Typ.) (Max.) 4.00mm x 4.00mm x 1.00mm ●Applications Power supply for LSI including DSP, Micro computer and ASIC VQFN020V4040 ●Typical Application Circuit Fig.1 Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Pin Configuration (Top View) N.C. GND ITH VOUT Datasheet 15 14 13 12 11 N.C. 16 EN 17 18 10 9 8 7 6 VCC BST PVCC PGND 19 20 1 2 3 4 5 SW Fig.2 Pin configuration ●Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 Pin name SW SW SW SW SW PVCC PVCC PVCC BST VCC SW pin SW pin SW pin SW pin SW pin Highside FET source pin Highside FET source pin Highside FET source pin Bootstrapped voltage input pin VCC power supply input pin Function Pin No. 11 12 13 14 15 16 17 18 19 20 Pin name GND VOUT ITH N.C. N.C. N.C. EN PGND PGND PGND Ground Output voltage detect pin GmAmp output pin/Connected phase compensation capacitor Non Connection Non Connection Non Connection Enable pin(High Active） Lowside FET source pin Lowside FET source pin Lowside FET source pin Function ●Block Diagram VCC EN VREF VCC BST Current Comp + RQ S Gm Amp + CLK SLOPE OSC VCC UVLO TSD SCP GND Current Sense/ Protect + Driver Logic SW PVCC Output PVCC 5V Input Soft Start PGND VOUT ITH RITH CITH Fig.3 Block Diagram www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Absolute Maximum Ratings(Ta=25℃) Parameter VCC Voltage PVCC Voltage BST Voltage BST_SW Voltage EN Voltage SW,ITH Voltage Power Dissipation 1 Power Dissipation 2 Power Dissipation 3 Power Dissipation 4 Operating temperature range Storage temperature range Maximum junction temperature *1 *2 *3 *4 *5 Datasheet Symbol VCC PVCC VBST VBST-SW VEN VSW, VITH Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limits -0.3 to +7 * 1 -0.3 to +7 * -0.3 to +13 -0.3 to +7 -0.3 to +7 -0.3 to +7 2 0.34 * 3 0.70 * 4 1.21 * 5 3.56 * -40 to +105 -55 to +150 +150 1 Unit V V V V V V W W W W ℃ ℃ ℃ Pd should not be exceeded. IC only 1-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 , in each layers 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers ●Recommended Operating Ratings (Ta=-40 to +105℃) Parameter Power Supply Voltage EN Voltage Output Current *6 Symbol VCC PVCC VEN ISW Min. 4.5 4.5 0 - Limits Typ. 5 5 - Max. 5.5 5.5 5.5 6 3.0* Unit V V V A Pd should not be exceeded. ●Electrical Characteristics ◎(Ta=25℃ VCC=PVCC=5V, EN=VCC, unless otherwise specified.) Parameter Symbol Limits Min. Standby current Active current EN Low voltage EN High voltage EN input current Oscillation frequency High side FET ON resistance Low side FET ON resistance OUTPUT Voltage ITH SInk current ITH Source Current UVLO threshold voltage UVLO release voltage Soft start time Timer latch time Output Short circuit Threshold Voltage ISTB ICC VENL VENH IEN FOSC RONH RONL VOUT ITHSI ITHSO VUVLO1 VUVLO2 TSS TLATCH VSCP 2.0 0.8 3.25 10 10 3.6 3.65 2.5 0.5 Typ. 0 250 GND Vcc 1 1 82 70 3.3 18 18 3.8 3.9 5 1 1.65 Max. 10 500 0.8 10 1.2 115 98 3.35 4.0 4.2 10 2 2.4 Unit μA μA V V μA MHz mΩ mΩ V μA μA V V ms ms V Conditions EN=GND Standby mode Active mode VEN=5V PVCC=5V PVCC=5V VOUT=4.1V VOUT=2.5V VCC=5V→0V VCC=0V→5V VOUT =3.3V→0V www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Typical Performance Curves Datasheet Fig.4 Vcc - VOUT Fig.5 VEN - VOUT Fig.6 IOUT - VOUT Fig.7 Ta - VOUT www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet Fig.8 Efficiency Fig.9 Ta - Fosc Fig.10 Ta – RONN, RONP Fig.11 Ta - VEN www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet Fig.12 Ta - Icc Fig.13 Vcc - Fosc Fig.14 Soft start waveform Fig.15 SW waveform Io=10mA www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet Fig.16 SW waveform Io=3A Fig. 17 Transient Response Io=1→3A(10μs) Fig.18 Transient Response Io=3→1A(10μs) www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Application Information Datasheet ●Operation BD9134MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for TM heavier load, while it utilizes SLLM (Simple Light Load Mode) operation for lighter load to improve efficiency. ○Synchronous rectifier It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC, and its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power dissipation of the set is reduced. ○Current mode PWM control Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback. ・PWM (Pulse Width Modulation) control The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a highside MOS FET (while a lowside MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp) receives two signals, a current feedback control signal (SENSE: Voltage converted from I L) and a voltage feedback control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the highside MOS FET (while a lowside MOS FET is turned ON) for the rest of the fixed period. The PWM control repeat this operation. ・SLLM (Simple Light Load Mode) control When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allow s linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Curr ent Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces the switching dissipation and improves the efficiency. TM VOUT Level Shift Gm Amp. ITH FB Current Comp RESET RQ SET S Driver Logic SW Load IL VOUT OSC Fig.19 Diagram of current mode PWM control PVCC SENSE FB SET GND GND GND IL(AVE) SET PVCC SENSE FB GND GND Current Comp Current Comp RESET SW IL RESET SW GND IL 0A VOUT VOUT(AVE) VOUT VOUT(AVE) Fig.20 PWM switching timing chart Fig.21 SLLM TM Not switching switching timing chart www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet ●Description of Operations ・Soft-start function EN terminal shifted to “High” activates a soft -starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ・Shutdown function With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0μA (Typ.). ・UVLO function Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. of 50mV (Typ.) is provided to prevent output chattering. Hysteresis 50mV And the hysteresis width VCC EN VOUT Tss Soft start Standby mode Operating mode Standby mode Tss Tss Operating mode Standby mode Operating mode Standby mode UVLO UVLO EN UVLO Fig.22 Soft start, Shutdown, UVLO timing chart ・Short-current protection circuit with time delay function Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for the fixed time (TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re -unlocking UVLO. EN 1msec VOUT Output Current in non-control 1/2VOUT Until output voltage goes up the half of Vo or over, timer latch is not operated. (No timer latch, only limit to the output current) Output voltage OFF Latch Limit IL Output Current in control by limit value (With fall of the output voltage, limit value goes down) Standby mode Operated mode Standby mode Operated mode EN Timer Latch EN Fig.23 Short-current protection circuit with time delay timing chart www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Information on Advantages Advantage 1：Offers fast transient response with current mode control system. Conventional product (Load response IO=1A→3A) Datasheet BD9134MUV (Load response IO=1A→3A) VOUT 572mV VOUT 328mV IOUT IOUT Voltage drop due to sudden change in load was reduced by about 50%. Fig.24 Comparison of transient response Advantage 2： Offers high efficiency for all load range. ・For lighter load: TM Utilizes the current mode control mode called SLLM for lighter load, which reduces various dissipation such as switching dissipation (PSW), gate charge/discharge dissipation, ESR dissipation of output capacitor (P ESR) and on-resistance dissipation (PRON) that may otherwise cause degradation in efficiency for lighter load. Achieves efficiency improvement for lighter load. ・For heavier load: Utilizes the synchronous rectifying mode and the low on -resistance MOS FETs incorporated as power transistor. ON resistance of Highside MOS FET : 82mΩ(Typ.) ON resistance of Lowside MOS FET : 70mΩ(Typ.) 100 Efficiency η[%] SLLMTM ② 50 ① PWM Achieves efficiency improvement for heavier load. Offers high efficiency for all load range with the improvements mentioned above. ①inprovement by SLLMTM system ②improvement by synchronous rectifier 0 0.001 0.01 0.1 Output current Io[A] 1 Fig.25 Efficiency www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Advantage 3：・Supplied in smaller package due to small-sized power MOS FET incorporated. Datasheet ・Output capacitor Co required for current mode control: 22μF ceramic capacitor ・Inductance L required for the operating frequency of 1 MHz: 2.2μH inductor ・Incorporates FET + Boot strap diode Reduces a mounting area required. VCC EN VREF VCC BST Current Comp RQ S CLK PVCC 20mm 3.3V Input + SLOPE Cf R2 CBST Rf 15mm R1 RITH CITH CIN L Gm Amp Current Sense/ Protect + Driver Logic SW PVCC Output + OSC VCC PGND GND Soft Start UVLO TSD SCP VOUT ITH RITH CITH Co Fig.26 Example application ●Switching Regulator Efficiency Efficiency ŋ may be expressed by the equation shown below: η= VOUT×IOUT Vin×Iin ×100[%]= POUT Pin ×100[%]= POUT POUT+PDα ×100[%] Efficiency may be improved by reducing the switching regulator power dissipation factors P Dα as follows: Dissipation factors: 2 1) ON resistance dissipation of inductor and FET：PD(I R) 2) Gate charge/discharge dissipation：PD(Gate) 3) Switching dissipation：PD(SW) 4) ESR dissipation of capacitor：PD(ESR) 5) Operating current dissipation of IC：PD(IC) 1)PD(I R)=IOUT ×(RCOIL+RON) (RCOIL[Ω]：DC resistance of inductor, RON[Ω]：ON resistance of FET, IOUT[A]：Output current.) 2 2)PD(Gate)=Cgs×f×V (Cgs[F]：Gate capacitance of FET、f[H]：Switching frequency、V[V]：Gate driving voltage of FET) 2 Vin ×CRSS×IOUT×f 3)PD(SW)= (CRSS [F]：Reverse transfer capacitance of FET、IDRIVE[A]：Peak current of gate.) IDRIVE 4)PD(ESR)=IRMS ×ESR (IRMS[A]：Ripple current of capacitor、ESR[Ω]：Equivalent series resistance.) 5)PD(IC)=Vin×ICC (ICC[A]：Circuit current.) 2 2 2 www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet ●Consideration on Permissible Dissipation and Heat Generation As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered. Because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. 4.0 ①3.56W Power dissipation:Pd [W] 3.0 2.0 ②1.21W 1.0 ③0.70W ④0.34W 0 0 25 50 75 100105 125 150 Ambient temperature:Ta [℃] ① 4 layers (Copper foil area : 5505mm ) copper foil in each layers. θj-a=35.1℃/W 2 ② 4 layers (Copper foil area : 10.29m ) copper foil in each layers. θj-a=103.3℃/W 2 ③ 4 layers (Copper foil area : 10.29m ) θj-a=178.6℃/W ④IC only. θj-a=367.6℃/W 2 Fig.27 Thermal derating curve (VQFN020V4040) P=IOUT ×RON RON=D×RONP+(1-D)RONN D：ON duty (=VOUT/VCC) RONH：ON resistance of Highside MOS FET RONL：ON resistance of Lowside MOS FET IOUT：Output current If VCC=5V, VOUT=3.3V, RONH=82mΩ, RONL=70mΩ IOUT=3A, for example, D=VOUT/VCC=3.3/5.0=0.66 RON=0.66×0.082+(1-0.66)×0.07 =0.05412+0.0238 =0.07792[Ω] 2 P=3 ×0.07792＝0.70128[W] As RONH is greater than RONL in this IC, the dissipation increases as the ON duty becomes greater. Wi th the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. 2 www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Selection of Components Externally Connected 1. Selection of inductor (L) IL ΔIL Datasheet VCC The inductance significantly depends on output ripple current. As seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. (VCC-VOUT)×VOUT ΔIL= [A]・・・(1) L×VCC×f Appropriate ripple current at output should be 20% more or less of the maximum output current. ΔIL=0.2×IOUTmax. [A]・・・(2) (VCC-VOUT)×VOUT L= ΔIL×VCC×f [H]・・・(3) IL VOUT L Co Fig.28 Output ripple current (ΔIL: Output ripple current, and f: Switching frequency) *Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. The inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. If VCC=5.0V, VOUT=3.3V, f=1MHz, ΔIL=0.2×3A=0.6A, for example,(BD9134MUV) (5-3.3)×3.3 L= 0.6×5×1M =1.87μ → 2.2[μH] *Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for better efficiency. 2. Selection of output capacitor (CO) VCC Output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. Output ripple voltage is determined by the equation (4)： ΔVOUT=ΔIL×ESR [V]・・・(4) (ΔIL: Output ripple current, ESR: Equivalent series resistance of output capacitor) ※Rating of the capacitor should be determined allowing sufficient margin against VOUT L ESR Co Fig.29 Output capacitor 3. Selection of input capacitor (Cin) VCC output voltage. A 22μF to 100μF ceramic capacitor is recommended. Less ESR allows reduction in output ripple voltage. Cin Input capacitor to select must be a low ESR capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. The ripple current IRMS is given by the equation (5): VOUT L IRMS=IOUT× √ OUT(VCC-VOUT) V VCC IOUT [A]・・・(5) Co < Worst case > IRMS(max.) 2 If VCC=5V, VOUT=3.3V, and IOUTmax.=3A, (BD9134MUV) IRMS=3× When Vcc=2×VOUT, IRMS= Fig.30 Input capacitor √ .3(5-3.3) 3 =1.42[ARMS] 3 5 . 3 A low ESR 22μF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV 4. Determination of RITH, CITH that works as a phase compensator Datasheet As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and it’s ESR. So, the phases are easily compensated by adding a zero to the power amplifier output with C and R as described below to cancel a pole at the power amplifier. fp(Min.) A Gain [dB] fp(Max.) 0 fz(ESR) IOUTMin. 0 IOUTMax. 1 2π×RO×CO 1 fz(ESR)= 2π×ESR×CO fp= Pole at power amplifier When the output current decreases, the load resistance Ro increases and the pole frequency lowers. fp(Min.)= 1 [Hz]←with lighter load 2π×ROMax.×CO 1 2π×ROMin.×CO [Hz] ←with heavier load Phase [deg] -90 Fig.31 Open loop gain characteristics fp(Max.)= A Gain [dB] 0 0 Phase [deg] -90 fz(Amp.) Zero at power amplifier Increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (This is because when the capacitance is doubled, the capacitor ESR reduces to half.) fz(Amp.)= Fig.32 Error amp phase compensation characteristics 1 2π×RITH×CITH Rf VCC Cin EN VOUT ADJ Cf PVCC VCC CBST L ITH RITH CITH GND,PGND SW ESR CO RO VOUT Fig.33 Typical application Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load resistance with CR zero correction by the error amplifier. fz(Amp.)= fp(Min.) 1 2π×RITH×CITH = 1 2π×ROMax.×CO www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Cautions on PC Board Layout Datasheet Fig.34 Layout diagram ① ② Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the pin PGND. Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring. ※ VQFN020V4040 (BD9134MUV) has thermal PAD on the reverse of the package. The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area of PCB. ●Recommended Components Lists on Above Application Symbol L CIN CO CITH RITH Cf Rf Coil Ceramic capacitor Ceramic capacitor Ceramic capacitor Resistance Ceramic capacitor Resistance Part Value 2.0µH 2.2µH 22µF 22µF 1500pF 5.1kΩ 1000 pF 10Ω Manufacturer Sumida Sumida Murata Murata Murata Rohm Murata Rohm Series CDR6D28MNP-2R0NC CDR6D26NP-2R2NC GRM32EB11A226KE20 GRM31CB30J226KE18 GRM18 Serise MCR03 Serise GRM18 Serise MCR03 Serise *The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteri stics should be considered in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode or snubber established between the SW and PGND pins. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●I/O Equivalence Circuit ・EN pin ・SW pin PVCC PVCC PVCC Datasheet EN SW ・VOUT pin VOUT ・ITH pin VCC ITH ・BST pin PVCC PVCC BST SW Fig.35 I/O equivalence circuit www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV Datasheet ●Operational Notes 1. Absolute Maximum Ratings While utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken, short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. Electrical potential at GND GND must be designed to have the lowest electrical potential In any operating conditions . 3. Short-circuiting between terminals, and mismounting When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and power supply or GND may also cause breakdown. 4. Thermal shutdown protection circuit Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. Inspection with the IC set to a pc board If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the inspection process, be sure to turn OFF the power supply before it is connected and removed. 6. Input to IC terminals + This is a monolithic IC with P isolation between P-substrate and each element as illustrated below. This P -layer and the N-layer of each element form a P-N junction, and various parasitic element are formed. If a resistor is joined to a transistor terminal as shown in Fig 36. ○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and ○if GND>Terminal B (at NPN transistor side), a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode. The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. It is therefore req uested to take care not to use the device in such manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. Fig.36 Simplified structure of monorisic IC 7. Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large -current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of th e small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 8. Selection of inductor It is recommended to use an inductor with a series resistance element (DCR) 0.1 Ω or less. Especially, note that use of a high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched OFF. When using an inductor over 0.1Ω, be careful to ensure adequate margins for variation between external devices and this IC, including transient as well as static characteristics. Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is within operation range. Status of this document The Japanese version of this document is formal s pecification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Ordering Information Datasheet B D 9 1 3 4 M U V - E2 Packaging and forming specification E2: Embossed tape and reel Package MUV: VQFN020V4040 ●Physical Dimension Tape and Reel Information ●Marking Diagram VQFN020V4040 (TOP VIEW) Part Number Marking D9134 LOT Number 1PIN MARK www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 BD9134MUV ●Revision History Date 17.Jan.2012 Revision 001 New Release Changes Datasheet www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/19 TSZ02201-0J3J0AJ00150-1-2 02.MAR.2012 Rev.001 Datasheet Datasheet Notice ●Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation The products are not radiation resistant. Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. Confirm that operation temperature is within the specified range described in product specification. Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. 3) 4) 5) 6) 7) 8) ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Datasheet ●Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. Use products within the specified time after opening a dry bag. 3) 4) ●Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. ●Precaution for disposition When disposing products please dispose them properly with a industry waste company. ●Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. ●Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001