BD91364BMUU-ZE2

Datasheet 2.9V to 5.5V Input, 5A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD91364BMUU General Description Key Specifications ROHM’s high efficiency switching regulator, BD91364BMUU, is a step-down converter designed to produce a low voltage output of 0.8V to 3.3V from a 2.9V to 5.5V power supply line. It offers high efficiency in all load ranges by automatic PFM/PWM adjustment. It employs an On-time control system to provide faster transient response to sudden change in load.         Input Voltage Range: 2.9V to 5.5V Output Voltage Range: 0.8V to PVCC×0.8V Output Current: 5.0A(Max) Switching Frequency: 1.7MHz(Typ) High Side FET ON Resistance: 27mΩ(Typ) Low Side FET ON Resistance: 27mΩ(Typ) Standby Current: 0μA (Typ) Operating Temperature Range: -40°C to +105°C Features       Fast transient response with On-time control system. High efficiency for all load range with synchronous rectifier (Nch/Nch FET) and adaptive PFM/PWM system. Adjustable Soft-start function. Thermal and UVLO protection. Short-circuit current protection with timer latch. Shutdown function. W(Typ) x D(Typ) x H(Max) 4.00mm x 4.00mm x 0.50mm Package VQFN20U4040M Applications Power supply for LSI including SoC, DSP, Micro computer and ASIC  Laptop PC / Tablet PC / Server  LCD TV, Storage Devices (HDD / SSD)  Printer  Entertainment device  Secondary power supply VQFN20U4040M Typical Application Circuit VIN CIN 22µF PVCC PGD AVCC BST PGD CBST EN BD91364BMUU SS L SW VOUT 0.47µH FB CO 22µF CSS GND RS Figure 1. Typical Application Circuit 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU AVCC BST PVCC PVCC PVCC Pin Configuration(TOP VIEW) 10 9 8 7 6 EN 11 5 SW PGD 12 4 SW RES 13 3 SW SS 14 2 SW FB 15 1 SW PGND PGND PGND AGND RS 16 17 18 19 20 Figure 2. Pin Configuration Pin Description Pin No. Pin Name Function Pin No. Pin Name Function 1 SW Switch pin 11 EN 2 SW Switch pin 12 PGD Power good open drain pin 3 SW Switch pin 13 RES Reserve pin, Connect to ground 4 14 SS Enable pin (High active) SW Switch pin 5 SW Switch pin 15 FB Output voltage detect pin 6 PVCC High Side FET source pin 16 RS Remote sense ground pin 7 PVCC High Side FET source pin 17 AGND Ground 8 PVCC High Side FET source pin 18 PGND Low Side FET source pin 9 BST Bootstrapped voltage input pin 19 PGND Low Side FET source pin 10 AVCC Power supply input pin 20 PGND Low Side FET source pin Soft start capacitor connection pin Block Diagram Figure 3. Block Diagram www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Absolute Maximum Ratings (Ta= 25°C) Parameter AVCC/ PVCC Voltage Symbol Rating AVCC/PVCC Unit -0.3 to +7 (Note 1) V -0.3 to +7 (Note 1) V EN Voltage VEN BST Voltage VBST -0.3 to +13 V VBST-SW -0.3 to +7 V VSW VSS/ VFB VPGD/ VRS Pd1 -0.3 to +7 V -0.3 to +7 V 0.8 (Note 2) W W W BST_SW Voltage SW Voltage SS/FB/PGD/RS Voltage Power Dissipation 1 Power Dissipation 2 Pd2 1.7 (Note 3) Power Dissipation 3 Pd3 2.7 (Note 4) Operating temperature range Topr -40 to +105 Tstg -55 to +150 °C Tjmax +150 °C Storage temperature range Maximum junction temperature °C (Note 1) Pd,and Tj=150°C should not be exceeded. (Note 2) 1-layer. mounted on a 74.2mm x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 0mm2 (Note 3) 2-layer. mounted on a 74.2mm x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers. (Note 4) 4-layer. mounted on a 74.2mm x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers. Recommended Operating Conditions (Ta= -40°C to +105°C) Parameter Power Supply Voltage EN Voltage Output Voltage Range SW Average Output Current Symbol Min Typ Max Unit AVCC 2.9 5.0 5.5 V PVCC 2.9 5.0 5.5 V VEN 0 VCC 5.5 V VOUT 0.8 - PVCC×0.8 V ISW - - (Note 5) 5 A (Note 5) Pd should not be exceeded. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Electrical Characteristics (Unless otherwise specified Ta= 25°C AVCC=PVCC=5V, EN=VCC, R1=200kΩ, R2=51kΩ) Parameter Symbol Min Typ Max Unit Conditions AVCC and PVCC Voltage Range VIN 2.9 - 5.5 V Standby Supply Current ISTB - - 3 µA EN=GND Operating Supply Current ICC 100 150 200 µA Non-switching UVLO Threshold Voltage VUVLO1 2.650 2.750 2.850 V VCC rising UVLO Release Voltage VUVLO2 2.450 2.550 2.650 V VCC falling EN Low-level Input Voltage VENL GND - 0.8 V Standby mode EN High-level Input Voltage VENH 1.8 - VCC V Active mode IEN - 3 6 µA VEN=5V PG Threshold Voltage VPGTH -20% -15% -10% V VFB-15% (Typ) PG Hysteresis Voltage VPGHYS -25% -20% -15% V VFB-20% (Typ) PG Detect Delay Time PDELAY 6 15 25 µs RPG 50 100 200 Ω VFB ∆IL, excess current will be charged and output voltage will keep on rising (Fig.37 dotted line waveform). When the output voltage is set to a low value, ∆IL will be small and output voltage will increase significantly. BD91364BMUU operates over shoot reduction when the Low side power MOS is kept ON after twice the PWM pulse width. Vf voltage is generated to the SW terminal by turning off the HG-LG and applying IL through the body diode of the Lowside MOS. This makes ∆IL =(-Vf-VOUT)/L and reduces the rise in output voltage by controlling excess current not to be charged to output capacitor. ‐ VOUT L PVCC ‐ Vf ‐ VOUT L HG -Vf VOUT IL IOUT LG Figure 37. Over short reduction timing chart www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU 7. Remote Sense Voltage drop is caused by an interconnection resistance, Rx, present between the power supply IC output, VOUT, and the load, such as a System on a Chip (SoC). In addition, GNDS terminal can get to a higher potential by an interconnection resistance Ry between board GND and GNDS terminal of SoC. This voltage variation increases in proportion to the load current and may cause SoC malfunction. BD91364BMUU remote circuit, as shown in Fig.38, compensates voltage variation caused by Ry. The voltage in between VS and GND is kept constant by sensing the voltage at GNDS terminal and adding it to the IC’s reference voltage. As for interconnection resistance Rx, voltage variation can be prevented by monitoring the output voltage feedback line from the nearest SoC input terminal, VS. PVCC IO VOUT SoC, etc. Wiring resistance : Rx [mΩ] VS V SW GNDS Feedback resistor FB terminal Feedback resistor Vrefo Wiring resistance : Ry [mΩ] RS Board ground Vref Figure 38. Remote sense www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Switching Regulator Efficiency η POUT POUT VOUT  IOUT  100 %   100 %   100 % VIN  IIN PIN POUT  PDα Efficiency may be improved by reducing the switching regulator power dissipation factors PDα as follows: Dissipation factors 1. ON resistance dissipation of inductor and FET : PD I2R [W] 2. Gate charge/discharge dissipation : PD Gate [W] 3. Switching dissipation : PD SW [W] 4. ESR dissipation of capacitor : PD ESR [W] 5. Operating current dissipation of IC : PD IC [W]     (1) PD I R IOUT  RCOIL  RON [W] (RCOIL [Ω] : DC resistance of inductor, RON [Ω] :ON resistance of FET, IOUT [A] : Outputcurrent) 2 (2) PD Gate voltage of FET) 2  Cgs  f V [W] (Cgs [F] : Gate capacitance of FET, f [Hz] : Switching frequency, V [V] : Gate driving 2 VIN Crss  IOUT  f 2 (3) PD SW  IDRIVE [W] (Crss [F] : Reverse transfer capacitance of FET, IDRIVE [A] : Peak current of gate) (4) (5) PD ESR  Irms ESR [W] (Irms [Arms] : Ripple current of capacitor, ESR [Ω] : Equivalent series resistance) PD IC  VIN  ICC [W] (ICC [A] : Circuit current) 2 Consideration on Permissible Dissipation and Heat Generation Since this IC functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered because the conduction losses are the most significant among other dissipation mentioned above, such as gate charge/discharge dissipation and switching dissipation. 4.5 P IOUT RON [W] 2 4.0 ① Power dissipation: Pd [W] ② 3.0 2.0 1.0 ③ ①2.7W 2 RON  D  RONH  ( 1  D )RONL [Ω] 4 layers (Copper foil area: 5505mm ) copper foil in each layers θj-a=46.3.0°C/W 2 2 layers (Copper foil area: 5505m ) copper foil in each layers. θj-a=73.5°C/W 2 1 layers (Copper foil area: 0m ) θj-a=156.3°C/W D : ON duty (=VOUT/VCC) RONH : ON resistance of Highside MOSFET [Ω] RONL : ON resistance of Lowside MOSFET [Ω] IOUT : Output current [A] ②1.7W Ex) When in VCC=5V, VOUT=1V, RONH=27mΩ, RONL=27mΩ, IOUT=5A ③0.8W By RON  0.2  0.027  1  0.2  0.027 0 0 25 50 75 100 105 125 D VOUT/VCC  1/5  0.2 150  0.0054  0.0216 Ambient temperature: Ta [°C]  0.027 [Ω] Figure 39. Thermal derating curve (VQFN20U4040M) P 5 0.027  0.675 [W] 2 Thermal design must be carried out with sufficient margin allowed with consideration on the dissipation above. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU External Component Selection 1. Inductor (L) The inductance has great influence on the output ripple current. As seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. IL ∆IL ΔIL  PVCC VCC VOUT VOUT L VCC  f [A]・・・(1) f : Switching frequency [Hz] ΔIL : Output ripple current [A] IL VOUT L CO 2 Efficiency is affected as the dissipation factor, PD(I R) [W], PD(Gate) [W], PD(SW) [W], changes with respect to the coil value and PFM frequency dependence on ripple current. BD91364BMUU is designed to have least dissipation in PFM and PWM, both about L = 0.33µH to 0.47µH. Figure 40. Output ripple current ※Current flow that exceeds the coil rating brings the coil into magnetic saturation, which may lead to lower efficiency. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. In addition, select a coil with a low resistance component (DCR, ACR) to lessen coil dissipation and improve efficiency. 2. Output Capacitor (CO) Output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required for smooth ripple voltage. PVCC Output ripple voltage is determined by the equation (2): ΔVOUT  ΔIL  ESR VOUT L [V]・・・(2) ΔIL: output ripple current [A] ESR: Equivalent series resistance of CO [Ω] ESR CO Figure 41. Output capacitor ※ There must be an adequate margin between the maximum rating and output voltage of the capacitor. against output voltage. A 22μF to 100μF ceramic capacitor is recommended. A capacitor with low ESR is recommended order to reduce output ripple. If you connect many parallel ceramic capacitor(Low ESR) to Vout. ESR value is very small. Please careful interfere with noise signal. Maximum value of CO must be considered as a large current is needed to charge CO to VOUT set point during boot-up. This current may trigger over current protection (OCP) and cause a normal boot-up failure. TSS  CO VOUT IOCP [sec]・・・(3) TSS : Soft start time [sec] (refer to Page10) IOCP : Over current detection [A] (min) about 6.5A www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU 3. Input Capacitor (CIN) Input capacitor must be a low ESR capacitor with a capacitance sufficient to cope with high ripple current to prevent high transient voltage. The ripple current IRMS is given by the equation (4): Cin is recommended to 22µF. PVCC CIN Irms  IOUT  VOUT VCC ‐VOUT  [Arms]・・・(4) VCC VOUT L CO Irms [Arms](max) When VCC  2 VOUT , Irms  IOUT 2 [Arms] Ex) BD91364BMUU When VCC=5.5V, VOUT=2.75V, IOUT max=5A Figure 42. Input capacitor Irms  5  2.75 5 ‐ 2.75   2.75 5.5 [Arms] 4. Feedback Capacitor FIX ONTIME control needs enough ripple voltage for stable feedback voltage comparator operation. This IC is designed to respond to low ESR output capacitor, such as ceramic capacitor, by injecting a ripple to the feedback voltage. In order to inject appropriate ripple, a feedback capacitor of 100pF to 200pF is recommended. 5. Output Voltage Determination L The output voltage VOUT is determined by the equation (5): VOUT  R2/R1  1  VFB [V] Output SW CO ・・・(5) ADJ VFB :FB terminal voltage(0.8V Typ) R2 R1 With R1 and R2 adjusted, the output voltage may be determined as required. Output voltage setting range is 0.8V to PVCC×0.8V Use about 100kΩ resistor for R1 and R2 to consider loss at the PFM. Figure 43. Output voltage setting resistor ＜Caution when reducing input voltage＞ Output voltage decreases below set value when input voltage is not sufficient. The decrease in output voltage is not only dependent on IC characteristics. It is also affected by the output load current and by the inductor’s DCR. Load Fig.39 shows output voltage condition when output voltage is Set to 3.3V and input voltage is lowered in varying load current condition (L=FDSD0420-H-R47 : DCR=15mΩ Typ). 0A 1A 3A 5A Basically PVCC×0.8≥VOUT is set as specification range, but in case this condition is not satisfied, the output voltage goes lower than the set value like in Figure 44. UVLO detection VOUT=3.3V L=FDSD0420-H-R47 DCR=15mΩ Figure 44. Output and input voltage difference limits www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Application Information Figure 45. Recommended part circuit 1. 2. 3. 4. 5. pin 11, EN Provide control signal externally when controlling the output via enable terminal. pin 13, RES Connect to ground. pin 16, RS Connect RS to ground sense point when using remote sense function. Connect to AGND(Ground) if not in use. Rpg Pull-up resistor for Power GOOD function. Keep pin 12(PGD) open or connect it to ground when Power GOOD function is not in use. CSS Capacitors for soft start time setting. A default 1msec soft start time is set if pin 14(SS) is left open. Recommendation parts list Part No Value Manufacturer Part number U1 - ROHM BD91364BMUU LSW 0.47µH TOKO FDSD0420-H-R47M CO 22µF MURATA GRM32ER61E226 Cin(Note6) 22µF MURATA GRM21BR60J226 Cbst 0.1µF MURATA GRM15 Series 1005 CSS 1000pF MURATA GRM15 Series 1005 Cfbu 200pF MURATA GRM15 Series 1005 Cf 1000pF MURATA GRM15 Series 1005 Rfbd 200kΩ ROHM MCR01 Series 1005 Rfbu 51kΩ ROHM MCR01 Series 1005 Rf 100Ω ROHM MCR01 Series 1005 100kΩ ROHM MCR01 Series 1005 Rpg (Note6) For capacitance of input capacitor take temperature characteristics,DC bias characteristics,etc. into consideration to set minimum value to no less than 10uF. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU PVCC PVCC PVCC PGND PGND BST AGND PGND AVCC RS Notes for PCB Layout B A Figure 46. PCB layout Ground sense interconnection should be carefully placed as input capacitors generate a large transient current. Connect analog ground pin, AGND, to ground plane at point Ⓐ as shown in Fig.46 to prevent high current from passing through the analog ground trace. Vout ground, which carries a transient current, should be connected to ground plane at point Ⓑ. And Feed back capacitor and resistor are arranged trace nearly FB input pin. And please be careful Feed back LINE arranged trace for interfereing with noise signal. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU I/O equivalence circuit  SW pin  EN pin PVCC 0.5MΩ PVCC PVCC EN 0.9MΩ SW 0.3MΩ 1kΩ  FB pin  SS pin AVCC 10kΩ FB 10kΩ SS  BST pin  PGD pin PVCC PGD PVCC 100Ω BST SW  RS pin 40kΩ RS 800kΩ Figure 47. I/O equivalence circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. OR 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 48. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Ordering Information B D 9 1 3 6 4 B Part Number M U U - Package MUU:VQFN20U4040M ZE2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams VQFN20U4040M (TOP VIEW) Part Number Marking 9 1 3 6 4 LOT Number B 1PIN MARK www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Physical Dimension, Tape and Reel Information Package Name VQFN20U4040M Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin Reel www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 26/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet BD91364BMUU Revision History Date Revision 27.Jul.2015 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/27 TSZ02201-0J2J0AJ00930-1-2 27.Jul.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001