BD92111F-GE2

Datasheet PFC Direct current resonance type White LED Driver for Large LCD BD92111F General Description Key Specifications BD92111F is a current resonance type LED Driver with frequency-controlled LED current. It can connect to PFC directly and can use half-bridge structure reducing the number of external components. It incorporates some protection functions against fault conditions such as Over-Voltage Protection and LED Open Detection (IS Low Detection).     Package Features           Operating Power Supply Voltage Range: 8.0V to 18.0V Minimum Oscillator Frequency: 65.8kHz (RRT=22kΩ,RADJ=36kΩ,VFB=3.2V) Operating Current: 2.3mA (Typ) Operating Temperature Range: -40°C to +85°C W(Typ) x D(Typ) x H(Max) 11.20mm x 7.80mm x 2.01mm Pin pitch 1.27mm SOP18 20V High Rating Process 1 Channel Push-pull Control Current and Voltage Feedback by Driving Frequency Adjustable Soft Start Adjustable Timer Latch Under-Voltage Detection for IC’s Power Line Output Over-Voltage Protection Output Error Signal from FAIL Terminal Shift to Save Mode by STB Terminal Burst Control by External PWM Signal Applications  TV, Computer Display, LCD Backlighting. Figure. 1 SOP18 Typical Application Circuit < Primary Side > VCC VCC GND PDIM GND PDIM STB ON/OFF PWM PWMIN ERR FAIL PVIN GND T1 CSS CSDON RADJ RRT CFBVS RFBVS CFBIS RFBIS CCP RS < Secondary Side > Figure. 2 Typical Application Circuit(s) 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Contents General Description ....................................................................................................................................................1 Features .......................................................................................................................................................................1 Applications ................................................................................................................................................................1 Key Specifications ......................................................................................................................................................1 Package .......................................................................................................................................................................1 Typical Application Circuit .........................................................................................................................................1 Absolute Maximum Ratings.......................................................................................................................................3 Recommended Operating Conditions ......................................................................................................................3 External Components Recommended Range ..........................................................................................................3 Pin Configuration ........................................................................................................................................................3 Physical Dimension and Marking Diagram ..............................................................................................................3 Electrical Characteristics ...........................................................................................................................................4 Pin Description............................................................................................................................................................6 I/O Equivalent Circuits................................................................................................................................................7 Block Diagram .............................................................................................................................................................8 Typical Performance Curves .....................................................................................................................................9 Pin Function Description .........................................................................................................................................10 Detection Condition List of the Protection Functions ..........................................................................................15 Behavior List of the Protect Function ....................................................................................................................15 Application Example ................................................................................................................................................16 Timing Chart ..............................................................................................................................................................17 Operational Notes .....................................................................................................................................................20 Ordering Information ................................................................................................................................................22 Marking Diagrams .....................................................................................................................................................22 Physical Dimension, Tape and Reel Information ...................................................................................................23 Revision History .......................................................................................................................................................24 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit VCC 20 V VSTB,VN2,VN1 20 V VRT,VFB,VIS,VVS,VPWMCMP, VCP,VPWMIN,VADIM,VSS, VFAIL,VCOMP,VSDON,VCOMPSD 5.5 V Supply Voltage STB, N2, N1 Terminal Voltage RT,FB,IS,VS,PWMCMP,CP, PWMIN,SS,FAIL,COMP,SDON, COMPSD Terminal Voltage Power Dissipation (Note 1) W -40 to +85 °C Tjmax 150 °C Tstg -55 to +150 °C Pd Operating Temperature Range 0.69 Topr Junction Temperature Storage Temperature Range (Note 1) Derating in done 5.5 mW/°C for operating above Ta≥25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Power Supply Voltage PWMIN Input Frequency Range Oscillation Frequency Symbol Range Unit VCC 8.0 to 18.0 V fPWMIN 60 to 500 Hz fOUT 30 to 200 kHz Symbol Range Unit RRT 24 to 160 kΩ RADJ 51 ～ OPEN kΩ External Components Recommended Range (Ta= -40°C to +85°C) Parameter RT Connection Resistance Set up Resistance for operation frequency range CP Connection Capacitance CCP SS Connection Capacitance CSS SDON Connection Capacitance CSDON 0.01 to 2.2 (Note 2) µF 0.01 to 0.1 (Note 2) µF 0.01 to 2.2 (Note 2) µF (Note 2) Please set connection capacitance above Min value of Recommended Range according to temperature characteristic and DC bias characteristic. Pin Configuration Physical Dimension and Marking Diagram PWM_IN_10 SDON_11 SS_12 FAIL_13 COMPSD_14 COMP_15 PGND_16 N2_17 N1_18 Product Name (Max 11.55 (include.BURR)) BD92111F 9_CP 8_PWMCMP 7_VS 6_IS 5_FB 4_RT 3_GND 2_STB 1_VCC BD92111F (TOP VIEW) Lot No. Figure. 3 Pin Configuration (UNIT : mm) PKG : SOP18 Drawing No. : EX115-5001 SOP18(Unit:mm) Figure. 4 Physical Dimension and Marking Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V) Parameter Symbol Limit Min Typ Max Unit Conditions 【Whole Device】 Circuit Current ICC1 － 2.3 5.0 mA Circuit Current at Stand-by ICC2 － 0 20 µA fOUT=60kHz, VPWMCOMP=0V VSTB=0V STB Pin High Voltage VSTH 2.0 － VCC V System ON STB Pin Low Voltage VSTL -0.3 － +0.8 V System OFF 【VCC UVLO Block】 VCC Operation Voltage VVCCUVP 6.17 6.50 6.83 V VCC UVLO Hysteresis ⊿VVCCUVP 0.37 0.50 0.63 V VRT 1.05 1.50 1.95 V PWMIN Pin High Voltage VPWMINH 2.0 - 5.0 V PWMIN Pin Low Voltage VPWMINL -0.3 - +0.8 V 【STB Block】 【OSC Block】 RT Terminal voltage 【PWMIN Block】 【Soft Start Block】 ISS 1.5 2.0 2.5 µA VSSEND 2.8 3.0 3.2 V IS Threshold Voltage VIS 1.225 1.250 1.275 V VS Threshold Voltage VVS 1.212 1.250 1.288 V IS Source Current 1 IIS1 － － 0.9 µA VPWMIN=2.5V IS Source Current 2 IIS2 40 50 60 µA VPWMIN=0V, VIS=1.0V VS Source Voltage IVS － － 0.9 µA VISCOMP 0.606 0.625 0.644 V Setting Current for Soft Start Timer Soft Start Ended Voltage 【Feed Back Block】 IS COMP Detection Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Electrical Characteristics – continued (Unless otherwise specified Ta=25°C, VCC= 12V) Parameter Symbol Limit Min Typ Min Unit Conditions 【Output Block】 N1 Output Sink Resistance RN1SI 1.5 3.0 6.0 Ω N1Output Source Resistance RN1SO 4.5 9.0 18.0 Ω N2 Output Sink Resistance RN2SI 1.5 3.0 6.0 Ω N2 Output Source Resistance RN2SO 4.5 9.0 18.0 Ω MAX DUTY 43.0 45.0 47.0 % tOFF 100 200 400 ns fOUTMIN 59.3 65.8 72.3 kHz Setting Voltage for CP Time VCP 1.90 2.00 2.10 V Setting Current for CP Time 【COMP Block】 Over voltage Detection level of COMP ICP 0.85 1.00 1.15 µA VCOMP 3.88 4.00 4.12 V Hysteresis width (COMP) ⊿VCOMP 0.15 0.20 0.25 V COMPSD Detection Voltage 【FAIL Block】 VCOMPSD 3.88 4.00 4.12 V RFAIL - 100 200 Ω MAX DUTY N1-N2,N2-N1Dead Time Output Frequency (minimum frequency setting) 【Timer Block】 FAIL Pin ON-Resistance www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/24 fOUT=60kHz RRT=22kΩ,RADJ=36kΩ, VFB=3.2V TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Pin Description Pin No. Pin Name IN/OUT Function Rating [V] 1 VCC IN -0.3 to +20 2 STB IN 3 GND IN 4 RT OUT 5 FB OUT 6 IS IN Power Supply Pin for IC (Built-In UVLO Function) Power ON/OFF Control Pin for IC Power OFF when STB=L and Power ON when STB=H. Ground Pin for Internal Signal in IC Drive Frequency Setting Pin Basic Frequency is set by the resistor between RT and GND and Drive Frequency Modulation Range is set by the resistor between RT and FB. Error Amplifier Output pin for LED Current feedback and LED Voltage feedback Error Amplifier Input pin for LED Current feedback 7 VS IN 8 PWMCMP IN 9 CP OUT 10 PWMIN IN 11 SDON OUT 12 SS OUT 13 FAIL OUT 14 COMPSD IN 15 COMP IN Error Amplifier Input pin for LED Open Voltage feedback PWM Comparator Input Pin which controls PWM operation during brightness adjustment. N1 and N2 output stop when PWMCMP=L, and they output Max Duty when PWMCMP=H Timer Latch Setting Pin In abnormal case, 1µA (Typ) will be charged to the capacitor connected to CP, and IC becomes latch status after output operation stops at CP>2V(Typ) PWM Signal Input Pin for burst brightness adjustment Enable COMPSD inputs over voltage detection When start up, 1µA(Typ) will be charged to connected capacitor. When SDON>2.0V(Typ), it will be possible to detect over voltage. Soft Start timer and COMPSD timer Setting Pin During start-up, 2µA (Typ) will be charged to connected capacitor. At SS>2.0V(typ), COMPSD can start to detect. At SS>2.5V (typ), CP can accept charge operation. Error Indication Signal Output Pin Normal : L, Error : Open Quickly Over Voltage Detection Pin When detecting abnormality, output operation stops and IC becomes latch status after 2 clocks. Detection pin for over voltage 16 PGND IN Power Ground for external MOSFET drive 17 N2 OUT Output pin for external FET drive circuit (Channel N2) -0.3 to +20 18 N1 OUT Output pin for external FET drive circuit (Channel N1) -0.3 to +20 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/24 -0.3 to +20 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 - TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F I/O Equivalent Circuits STB RT VCC FB REF REF REF VCC 160KΩ STB 10KΩ 300KΩ 20Ω FB RT 130KΩ 50KΩ GND GND GND GND GND GND GND IS VS GND PWMCMP REF REF REF GND GND REF REF REF REF REF VCC 100KΩ 1KΩ PWMCMP 20Ω VS 100kΩ IS 10KΩ 10KΩ GND GND GND GND GND GND GND GND GND GND CP PWMIN GND VCC REF VCC VCC SDON 350Ω 350Ω CP 100KΩ PWMIN GND GND GND GND GND SS GND SDON REF REF GND GND GND FAIL GND GND COMPSD REF REF REF VCC 50Ω 350Ω FAIL SS GND GND GND GND GND COMP VCC VCC VCC N2 N1 90KΩ GND GND GND PGND PGND GND N1 VCC 100KΩ GND GND N2 REF COMP 100KΩ COMPSD PGND 90KΩ PGND PGND PGND Figure. 5 I/O equivalent circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Block Diagram VCC VCC STB PWMIN RT PWM BLOCK OSC BLOCK UVLO BLOCK STB BLOCK SYSTEM　 ON/OFF CT VCC FB IS VS N1 Feedback BLOCK LOGIC BLOCK DRV BLOCK PWM SS CT N2 BLOCK PWMCOMP PGND GND PROTECT BLOCK COMP COMPSD CP FAIL SDON Figure. 6 Block Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Typical Performance Curves 5 70 VCC=12V RRT=100kΩ RADJ=none 68 4 fOUT[kHz] Output Frequency: f:OUT [kHz] Frequency Output : ICC[mA] Current Operating [mA] : ICC1 Current Operating Ta=25°C 3 2 1 66 64 62 60 58 56 54 52 50 0 8 10 12 14 Supply Voltage Supply Voltage: V: CC Vcc[V] [V] 16 -40 18 0 20 40 60 80 Temperature : Ta [°C] Temperature : Temp. [℃] 100 Figure 8. Output Frequency vs Temperature Figure 7. Operating Current vs Power Supply Voltage 3.0 50 VCC=12V VCC=12V RRT=100kΩ VPWMCMP=OPEN 2.5 CP charge current : ICP [µA] 48 [%] DUTY MAX : [%] Max Duty -20 46 44 42 2.0 1.5 1.0 0.5 0.0 40 -40 -20 0 20 40 60 Temperature : Ta [°C] Temperature : Temp [deg] 80 100 Figure 9. MAX DUTY vs Temperature www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 -20 0 20 40 60 Temprature : Ta [°C] 80 100 Figure. 10 CP time setting current vs Temperature 9/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Pin Function Description PIN.1 VCC This is power supply pin for the IC. Normal operation range (Typ) is from 9V to 18V. Please place ceramic capacitor bigger than 0.1µF as bypass capacitor between VCC and GND. It is for noise elimination. PIN.2 STB This PIN is for setting of ON/OFF. It is possible to use as reset when shutting down. Please set the STB terminal voltage below VCC voltage. In addition, please set below 4V if the voltage is applied earlier than VCC. Depending on input voltage to STB pin, the status of IC might be switched (ON/OFF). Please avoid using between the two status (0.8V to 2.0V) PIN.3 GND This is signal system GND for IC inside. Please make it independent from PGND as much as possible (We recommend this because it has less influence with switching noise which comes from short circuit of PGND and GND at connector close to GND pin. Vin GND_PIN IC PGND N1 N2 GND Figure. 11 PIN.4 RT Set up the charge/discharge current by frequency of IC inside. By changing the resistance value of resistor between RT pin and GND, it is possible to set up basic drive frequency as following formula; Basic frequency means output N1, N2 frequency which is determined only with resistor between RT pin and GND. f OUT  1.217  (3.32  10  5  RRT[k]) [kHz]  4  4 (2.4948  10 )  (2.5371  10  RRT [k]) Drive output frequency [kHz] 1,000 BD92111F Error Amp OSC 100 RT 10 RRT FB IS VS CFBIS RFBIS CFBVS RFBVS 1 10 100 1000 RRT [kΩ] Figure. 13 RRT Resistor connection method Figure. 12 RT Resistance vs Output Frequency There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly verify it with actual application. In addition, frequency may change upon resistor RADJ which is placed between RT and FB pins www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F PIN.5 FB This is output pin for LED current feedback (IS pin) error amplifier and open LED voltage feedback (VS pin) error amplifier. The capacitance between FB and IS (1500pF to 0.01µF) also determines start up time of LED current necessary during phase compensation and brightness adjustment. Capacitance between FB and VS (1500pF to 0.01µF) is for phase compensation of error amplifier. BD92111F Error Amp OSC RT RRT FB RADJ IS Figure. 14 RRT and RADJ Resistor connection method VS CFBIS RFBIS CFBVS RFBVS As shown by left graph, by changing resistor RADJ between FB and RT, it is possible to determine the modulation width of frequency. Modulation width of frequency determined by the resistor between FB and RT resistor (Theoretical formula : Example) When RADJ=100kΩ , Δ fOUT=84.46kHz Figure. xx . Figure. 15 Modulation width of Output Frequency vs RADJ Resistance Output Frequency vs FB Voltage Output frequency Fout [kHz] Modulation width of frequency determined by the resistor between FB and RT resistor (Theoretical formula : Example) When RADJ=100kΩ , Δ fOUT=84.46kHz FB voltage Vin [V] Figure. 16 Output Frequency vs FB Voltage The basic drive frequency is determined by resistor RRT which is connected from RT pin to GND. The basic frequency is the one at VFB=1.5V, and operation frequency range will be fixed with frequency modulation width that is determined by RADJ under this condition. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F PIN.6 IS This is input pin of LED current feedback (IS pin) error amplifier. Please set up as normal voltage 1.25V. When IS pin voltage becomes less than 0.625V(Typ), the output will be stopped and latched. 50uA FB R2 R1 IS _ 100kΩ + Error Amp 1.25 V Figure. 17 IS Block Diagram 50µA (Typ) current flows from IS pin to external resistor during OFF period of burst brightness adjustment. Considering Min value of IS source current during burst brightness adjustment, please set that total resistance from IS Pin to GND is more than 32kΩ. When R2 is 100kΩ in above diagram, please set R1 + R2 > 32KΩ. PIN.7 VS This is input pin of Open LED voltage feedback (VS pin) error amplifier. It has to be 1.25V during LED is open. When LED is ON, it will be 0.5V to 1.0V. When VS pin becomes over 1.25V, protection circuit will start operation, and if it becomes more than CP timer set up time (Timer Latch), it will shut down. Connector 8 7 6 5 FB R1 VS R2 R3 Error Amp _ + 1. 25 V Figure. 18 VS Block Diagram Please set C1, C2, R1, R2, and R3 value to input 1.25V to VS pin during LED bar’s connector disconnects. PIN.8 PWMCMP PWMCOMP pin voltage is fixed by DUTY of drive output N1, N2 in comparison with a saw wave of IC inside. This pin has 100µA sink/source current capability and when external capacitor is connected between PWMCMP and GND, IC will operate PWM at brightness start up stage. When N1 and N2 only drive at MaxDuty, please set PWMCMP=open. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F PIN.9 CP This pin sets up the time from the point of abnormal detection till shut down (Timer Latch). Having 1µA constant current charges at external capacitor connected to CP pin, it will shut down when it becomes over 2.0V. During soft start, there is no charge to CP external capacitor even fulfilling CP pin charge condition (timer latch). External capacitor is set around 0.01µF to 2.2µF). TCP  CCP  VCP CCP  2.0   2.0  10 6  CCP I CP 1.0  10  6 [sec] Timer Latch Time TCP 1uA 100 Timer Latch Time : TCP[sec] 10 Timer latch Shut-down CCP 2.0V Timer Start 1 0.1 0.01 0.001 0.001 0.01 Figure. 19 CP Block Diagram 0.1 1 10 CP Capacitance CCP[µF] Figure. 20 Timer Latch Time vs CP Capacitance PIN.10 PWMIN By inputting PWM pulse signal at PWMIN pin, it is possible to adjust burst brightness. (High level: over 2.0V, Low level: below 0.8V). condition LED condition PWMIN : 2.0V to 5.0V Turn On PWMIN : -0.3V to 0.8V Turn Off PIN.11 SDON This is for the set up of time till COMPSD starts operation when start up. After STB starts to become ON, there will be 1µA constant current charging at external capacitor that is connected to SDON pin. Then if it becomes over 2.0V, it is possible to detect COMPSD. When it is below 2.0V, immediately latch protection current will no operate. External capacitor is around 0.01µF to 2.2µF. 1uA COMPSD Enable to detect C sdon 2.0V Power On Figure. 21 IS SDON block diagram TSDON CSDON  www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VSDON CSDON  2.0   2.0 10 6  CSDON I SDON 1.0 10 6 13/24 [sec] TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F PIN.12 SS This is soft start time and SDON time set up pin. Constant current 2.0µA(Typ) is charged to external capacitor (0.01µF to 0.1µF). When soft start is under operation (SS pin voltage is less than 3.0V), timer latch protection circuit by CP charge will not operate. 2uA Finish Soft Start ss Css 3.0V Where: CSS is the capacitance of SS pin POWER ON Figure. 22 SS Block Diagram TSSEND CSS  VSSEND CSS  3.0   1.5  10 6  CSS 6 I SS 2.0  10 [sec] PIN.13 FAIL This is fail signal output pin of IC. At normal situation, it outputs GND Level and it becomes Open after timer latch in case any abnormality is detected. The pull up voltage during Open must be set less than rated voltage 5.5V of FAIL pin. Please connect about 0.1uF capacitor for noise reduction to FAIL pin. Condition FAILOutput Normal operation GND Level Abnormal operation Open FAIL Figure. 23 FAIL Block Diagram PIN.14 COMPSD This is input pin for shut down detection comparator. When SDON pin voltage is over 2.0V(Typ) and COMPSD is 4.0V(Typ), it will latch after the next clock. PIN.15 COMP This is input pin for over voltage protection comparator. The detection voltage of comparator is 4.0V(Typ) and will start charging to CP pin after over voltage detection. After CP is charged, it will shut down by timer latch. PIN.16 PGND This is Power GND pin for output pin N1, N2 at driver part. Please make it independent from GND (Pin 3) pin on inverter PCB. This pin is not connected to GND pin in IC inside. PIN.17 N2 This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about 10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ. PIN.18 N1 This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about 10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Detection Condition List of the Protection Functions (Typ Condition) Detect Condition Protect Function Detection Pin Detection Condition SS,SDON Release Condition Timer Operation Protection Type LED OPEN IS IS < 0.625V SDON>2.0V IS > 0.625V 2CLK Latch off OVP COMP VS COMP VS > 1.25V COMP > 4.0V SS>3.0V SS>3.0V VS < 1.25V COMP < 3.8V CP CP VCC VCC < 6.0V - VCC > 6.5V - COMPSD COMPSD > 4.0V SDON>2.0V COMPSD < 3.8V 2CLK Latch off Latch off Restart by release Latch off VCC UVLO COMPSD To reset the latch type protection, please set STB logic to ‘L’ once. Otherwise the detection of VCCUVLO is required. The count number in the list is calculated with double of output frequency. Behavior List of the Protect Function Protect Function Operation of the Protect Function N1,N2 Output SS pin FAIL pin LED OPEN Stop after latch Low after latch High after latch OVP Stop after latch Low after latch High after latch COMP Stop after latch Low after latch High after latch VCC UVLO Stop immediately Low Immediately High Immediately COMPSD Stop after latch Low after latch High after latch www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Application Example RFBIS Figure. 24 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 RRT CFBIS RFBVS RADJ CFBVS CSS CSDON CCP RS Introduce an application example with BD92111F Application Example 16/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Timing Chart When it Detects Quick Detection Type Error 2.0V STB (A) 3.0V SS 2.0V SDON 2.0V FB 1 1.25V IS 0.7V 0.625V 0.625V 1.25V 1.25V VS COMP 4.0V 4.0V 2 COMSD 4.0V 2.0V CP FAIL Figure. 25 Timing Chart 1 [The explanation of quick abnormal detection] Due to the timing of ① to② in the above chart, the IC detects malfunction and starts the output-mute latch without CP Charge . For ① to②, the malfunction is detected according to the conditions in the table shown below. No. ① Content of Abnormal Detection Abnormal LED current detection Condition of Abnormal Detection IS Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure xx. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Ordering Information B D 9 2 1 Part Number 1 1 F - Package F:SOP18 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams SOP18(TOP VIEW) Part Number Marking B D 9 2 111 F LOT Number 1PIN MARK www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Physical Dimension, Tape and Reel Information Package Name SOP18 (Max 11.55 (include.BURR)) (UNIT : mm) PKG : SOP18 Drawing No. : EX115-5001 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 BD92111F Revision History Revision No. 001 Date 31.Jan.2016 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Page All Changes New Release 24/24 TSZ02201-0F5F0C100090-1-2 31.Jan.2016 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001