BD9305AFVM-TR

Datasheet 4.2V to 18V Input 1ch Buck Controller BD9305AFVM General Description Key Specifications      BD9305AFVM is a 1-channel DC/DC converter controller. A Step-down DC/DC converter can be configured by BD9305AFVM. In addition, it has a built-in master-slave function which improves synchronization. Power Supply Voltage Range: 4.2V to 18V Error Amplifier Feed Back Voltage: 1.25±1.6% Oscillating Frequency Range: 100kHz to 800kHz Standby Current: 0µA(Typ) Operating Temperature Range: -40°C to +85°C Features     Package 1ch PWM Controlled DC/DC Converter Controller Built-in Soft Start Function Built-in Master / Slave Function Protection Circuits:  Under Voltage Lockout Protection Circuit  Thermal Shutdown Circuit  Short Protection Circuit of Timer Latch type W(Typ) x D(Typ) x H(Max) Applications ・TV, Power Supply for the TFT-LCD Panels used for LCD TVs, Back Lights ・DSC, DVC, Printer, DVD ,DVD Recorder, General Consumer Equipment, etc. MSOP8 2.90mm x 4.00mm x 0.90mm Typical Application Circuit 10000pF VCC 5.1kΩ FB GND COMP 8 VCC 6 7 10µF 5 Soft Start Err 1.25V 0.5Ω VREF Timer Latch (When Output Short, Protect Fall VCC) UVLO TSD Shut Down Shut Down 47µH OSC VOUT DRV PWM VCC 20uF 30ｋΩ 1kΩ 470pF ENABLE 1 3 2 RT 20kΩ 4 ENB CT 200pF 10ｋΩ GD 10kΩ VCC Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Pin Configuration TOP VIEW Pin Descriptions Pin No Pin Name Function 1 RT External timing resistor pin 2 CT External timing capacitor pin 3 ENB Control pin 4 GD Gate drive output pin 5 VCC 6 GND 7 COMP 8 FB Power supply pin Ground pin Error amp output pin Error amp inversion input pin Block Diagram FB VCC GND COMP 7 8 6 5 Soft Start Err 1.25V Vref Timer Latch UVLO TSD Shut Down Shut Down PWM DRV OSC VCC ENABLE 2 1 RT www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3 ENB CT 2/19 4 GD TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Block Operation 1. Error Amplifier (Err) It compares a reference voltage of 1.25V (TYP) and the output feedback voltage. This block produces the COMP terminal voltage that determines the duty cycle. 2. Oscillator (OSC) This block determines the switching frequency by RT and CT values. The triangular wave is determined by RT and CT. 3. PWM The duty cycle is determined by comparing the output of Error amplifier and the angular wave of Oscillator. 4. DRV This block drives the gate of the external power FET by the PWM switching Duty. 5. VREF This block outputs the internal reference voltage of 2.5V (TYP). This circuit’s reference voltage is controlled (ON / OFF) by the ENB terminal. 6. Protection Circuits (UVLO / TSD) UVLO (low-voltage Lock Out circuit) shuts down the circuits when the voltage is below 3.5V (MIN). TSD (temperature protection circuit) shuts down the IC when the temperature reaches 175°C (TYP). 7. Soft Start Circuit The Soft Start Circuit limits the current when the output voltage is slowly increasing during start-up. Through this, the overshoot of output voltage and current sinking can be prevented. 8. Timer Latch It is an output short protection circuit that detects if the output of error amplifier (COMP voltage) is more than 1.7V (TYP). If the COMP voltage becomes more than 1.7V, the counter begins to operate. The LATCH is locked when the counter counts to 2200 and the GD output shuts down. The frequency of counter is determined by RT and CT. Once the LATCH was locked, the GD output will not operate until it is restarted by ENB or VCC. If the output short is removed while the Timer latch is counting, the counter will be reset. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Absolute Maximum Ratings (Ta = 25°C) Parameter Power Supply Voltage Symbol (Note 2) Unit VCC 20 V Pd 0.58 (Note 1) W Topr -40 to +85 °C Tstg -55 to +150 °C Tjmax 150 °C Power Dissipation Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Limit (Note 1) When mounted on a glass epoxy 4-layer board (70 mm x 70 mm x 1.6 mm). Derate by 4.7 mW/°C for Ta over 25°C. (Note 2) Must not exceed Pd. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +85°C) Parameter Symbol Min 4.2 Limit Typ 12 Unit Max 18 Power Supply Voltage VCC V Control Voltage VENB － - VCC V Timing Capacitance Timing Resistance Oscillating Frequency CCT RRT fOSC 100 5 100 - 1000 50 800 pF kΩ kHz Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V, CCT=200pF, RRT=20kΩ) Parameter Symbol Limit Min Typ Max Unit Conditions 【Triangular Waveform Oscillator Block】 Oscillating Frequency fOSC 165 220 275 kHz Charge Threshold Voltage VOSC＋ 0.80 0.85 0.90 V Discharge Threshold Voltage VOSC－ 0.20 0.25 0.30 V VUT 3.5 - 4.2 V VFB 1.230 1.250 1.270 V VCC=5V 【Under-voltage Lockout Protection Circuit】 Threshold Voltage 【Error Amp Block】 Feed Back Voltage Input Bias Current IIB － 0.05 1 µA VFB=1.5V COMP Sink Current COMP Source Current IOI IOO 35 35 50 50 65 65 µA µA VFB=1.5V VFB=1.0V RON - 5 － Ω VCOMP=1.25V VCOMP=1.25V 【Gate Drive Block】 ON-Resistance Gate Drive Voltage L VGDL - 0 0.5 V No Load Gate Drive Voltage H VGDH VCC-0.5 VCC － V No Load MAX Duty MDT - - 100 % VCC=5V VON VOFF IENB 2 40 60 0.3 90 V V µA VENB=5V tS - 10 - ms VLC CNT DLY 1.5 - 1.7 2200 10 1.9 - V COUNT ms ISTBY ICC 1.0 0 1.5 10 2.5 µA mA 【Control Block】 ON Voltage OFF Voltage ENB Sink Current 【Soft Start Block】 Soft Start Time 【Timer Latch Protection Circuit】 Latch Detection COMP Voltage Latch Delay OSC Count Number Latch Delay Time 【Overall】 Standby Current Average Consumption Current www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/19 ENB=0FF No Switching TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Typical Performance Curves (Unless otherwise specified, VCC=12V, Ta=25°C) 4 Average Current : ICC [µA] AVERAGE CURRENT:ICC[uA] Standby Current : ISTBY [µA] STAND BY CURRENT:ICC[uA] 1 0.5 Ta=25°C Ta=85°C Ta=25℃ Ta=85℃ 0 Ta=-40°C Ta=40℃ -0.5 Ta=85℃ Ta=85°C 3 Ta=25℃ Ta=25°C 2 1 Ta=-40℃ Ta=-40°C 0 -1 0 1 2 3 4 5 0 5 10 15 20 25 InputVOLTAGE:VCC[V] Voltage : VCC [V] INPUT Input VOLTAGE:VCC[V] Voltage : VCC [V] INPUT Figure 3. Average Consumption Current vs Input Voltage Figure 2. Standby Current vs Input Voltage Frequency : fSW [kHz] GD SinkCURRENT:IGD[mA] Current : IGD [mA] GD SINK 1000 800 600 400 200 0 0 2 3 4 5 Figure 5. GD Sink Current vs GD Voltage Figure 4. Frequency vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1 Voltage : VGD [V] GDGD VOLTAGE:VGD[V] Ambient Temperature : Ta [°C] 5/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Typical Performance Curves – continued (Unless otherwise specified, VCC=12V, Ta=25°C) 100 COMP Sink Current : ICOMP [µA] COMP SINK CURRENT:ICOMP[μA] GD Source Current : IGD [mA] GD SOURCE CURRENT:IGD[mA] 0 -200 -400 -600 -800 60 40 20 0 -1000 0 1 2 3 4 GD : VGD [V] GDVoltage VOLTAGE:VGD[V] 0 5 0.5 1 1.5 2 2.5 COMPVOLTAGE:VCOMP[V] Voltage : VCOMP [V] COMP Figure 7. COMP Sink Current vs COMP Voltage Figure 6. GD Source Current vs GD Voltage 1.252 Reference Voltage : VFB [V] REFERENCE VOLTAGE:VFB[V] 0 COMP Source Current : ICOMP [µA] COMP SOURCE CURRENT:ICOMP[μA] 80 -20 1.250 -40 1.248 -60 1.246 -80 1.244 -100 0 0.5 1 1.5 2 COMP Voltage : V COMP [V] COMP VOLTAGE:VCOMP[V] -40 2.5 10 35 60 85 AmbientTEMPERATURE:Ta[ Temperature : Ta [°C] ℃] AMBIENT Figure 9. Reference Voltage vs Ambient Temperature Figure 8. COMP Source Current vs COMP Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -15 6/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Typical Performance Curves – continued 0.1 250 0.08 200 ENB Current : IENB [µA] ENB CURRENT:IENB[μA] FB CURRENT:IFB[μA] Current : IFB [µA] FB (Unless otherwise specified, VCC=12V, Ta=25°C) 0.06 0.04 0.02 0 Ta=85℃ Ta=85°C Ta=25°C Ta=25℃ 150 100 50 Ta=-40°C Ta=-40℃ 0 0.0 0.5 1.0 1.5 2.0 FB Voltage : V FB [V] FB VOLTAGE:VFB[V] 2.5 0.0 2.5 5.0 7.5 10.0 12.5 Voltage : VENB [V] ENBENB VOLTAGE:VENB[V] Figure 11. ENB Input Current vs ENB Voltage Figure 10. FB Input Bias Current vs FB Voltage 100 125 90 Efficiency : EF [%] EFFICIENCY:EF[%] DUTY : DT [%] DUTYCycle CYCLE:DT[%] 100 75 50 25 80 70 60 50 VCC=12V VOUT=5V IOUT=SWEEP fSW=220kHz Ta=25°C 40 30 20 10 0 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 COMPVOLTAGE:VCOMP[V] Voltage : VCOMP [V] COMP 1.0 1.5 2.0 Output CURRENT[A] Current [A] OUTPUT Figure 12. DUTY Cycle vs COMP Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.5 Figure 13. Efficiency vs Output Current 7/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Typical Waveforms ΔV=166mV IOUT=1A VCC=12V VOUT=5V Figure 14. Load Response www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Application Information 1.Selecting Application Components (1) Setting the Output L Constant (Step Down DC/DC) The inductance L used for output was decided by the rated current ILR and input current maximum value IOMAX of the inductance. IOMAX + ∆IL should not 2 reach the rated value level IL VCC ILR IL IOMAX mean current L VOUT CO t Figure 15. Coil Current Waveform (Step Down DC/DC) Figure 16. Output Application Circuit (Step Down DC/DC) Adjust so that IOMAX + ΔIL / 2 does not reach the rated current value ILR. At this time, ∆IL can be obtained by the following equation. V 1 1 [A] × (VCC − VOUT ) × OUT × L VCC f Set a sufficient margin because the inductance L value may have ± 30% dispersion. If the coil current exceeds the rating current ILR of the coil, it can cause damage to the IC internal elements. ∆I L = (2) Setting the Output L Constant (Step Up DC/DC) The inductance L to use for output is decided by the rated current ILR and input current maximum value IINMAX of the inductance. ∆ILL should should not not IIINMAX +ΔI INMAX + 2 2 reach the rated value level IL IL VCC L IL VOUT INMAXmean mean IIINMAX current current CO t Figure 17. Coil Current Waveform (Step Up DC/DC) Figure 18. Output Application Circuit (Step Up DC/DC) Adjust so that IINMAX + ΔIL / 2 does not reach the rated current value ILR. At this time, ∆IL can be obtained by the following equation. ∆IL = V − VCC 1 1 VCC × OUT × [A ] L VOUT f where: f is the switching frequency Set a sufficient margin because the inductance L value may have ± 30% dispersion. If the coil current exceeds the rating current ILR of the coil, it can cause damage to the IC internal elements. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM (3) Setting the Output Capacitor For the output capacitor C, select a capacitor which has a larger value at the ripple voltage VPP allowance value and the drop voltage allowance value when there’s a sudden load change. Output ripple voltage is determined by the following equation. V ∆I 1 (Step Down DC/DC) [V ] ∆Vpp = ∆I L × RESR + L × OUT × 2CO ∆Vpp = I LMAX × RESR + VCC f V ∆I  1  × CC ×  I LMAX − L  2  fCO VOUT  [V ] (Step Up DC/DC) Apply the setting so that the voltage is within the allowable ripple voltage range. For the drop voltage during the sudden load change (VDR), perform a rough calculation by the following equation. ∆I ∆VDR = L × 10 µ sec [V ] CO However, 10 µs is the rough calculation value of the DC/DC response speed. Set the capacitance while considering a sufficient margin so that these two values are within the standard value range. (4) Setting of Feedback Resistance Constant Refer to the following formula for setting of feedback resistance. VOUT = R1 + R 2 × 1.25 [V ] R2 It is recommend to use 10kΩ to 330kΩ setting range. If a resistance below 10kΩ was set, voltage efficiency will be dropped. If a resistance of more than 330kΩ was set, the offset voltage becomes large because of the internal error amplifier’s input bias current of 0.05µA(Typ). Reference Voltage 1.25V VOUT R1 FB － 8 ERR ＋ R2 Figure 19. Feedback Resistance Setting (5) Setting of Oscillating Frequency The angular wave oscillation frequency can be set by connecting a resistor and a capacitor to RT (Pin 1) and CT (Pin 2) respectively. The charge and discharge currents at the capacitor of CT will be determined by the RT resistor. Refer to the configuration below for setting the RT’s resistor and the CT’s capacitor. RRT: 5kΩ to 50kΩ, CCT: 100pF to 1000pF. The frequency range of 100kHz to 800kHz are recommended. Remember that the switching will stop if your setting is off this range. Frequency [kHz] 10000 1000 Ta=25°C VCC=12V CCT=100pF CCT=200pF CCT=470pF CCT=1000pF 100 10 1 10 100 RT [kΩ] Figure 20. Frequency Setting www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM (6) Selection of Input Capacitor For DC/DC converter, the capacitor at the input side is also necessary because maximum current will be flowing between input and output. Therefore, it is recommended that an input capacitor with over 10μF and low ESR below 100mΩ. If a selected capacitor is outside this range, excessive large ripple voltage will overlap with the input voltage which may cause IC malfunction. However, this condition varies with negative overcurrent, input voltage, output voltage, inductor’s value, and switching frequency so make sure to have a margin check with actual devices. (7) Selection of Output Rectifier Diode Schottky barrier diode is recommended as the diode for rectification at the output stage of DC/DC converter. Refer below for choosing the maximum inductor current, the maximum output voltage, and the power supply voltage. Maximum inductor current Power supply voltage I OMAX + ∆I L 2 VCC < < Diode’s rated current Diode’s rated voltage Maximum inductor current Maximum output voltage ∆I L 2 I INMAX + VOMAX < Diode’s rated current < Diode’s rated voltage Furthermore, each parameter has a deviation of 30% to 40%, so design in such a way that you have provided enough margin for the deviation in your design. (8) Setting of Power FET If step-down DC/DC was configured by BD9305AFVM, Pch FET is necessary. Consider the following conditions when you choose: Maximum inductor current Power supply voltage Power supply voltage Gate capacitance (Note 1) I OMAX + ∆I L 2 VCC VCC CGATE < FET’s rated current < > < FET’s rated voltage FET’s gate ON voltage 2000pF < FET’s rated current < > FET’s rated voltage FET’s gate ON voltage < 2000pF Maximum inductor current Maximum output voltage Power supply voltage Gate capacitance (Note 1) I INMAX + ∆I L 2 VOMAX VCC CGATE Furthermore, each parameter has a deviation of 30% to 40%, so design in such a way that you have provided enough margin for the deviation in your design. (Note 1) If the Gate capacity becomes large, the switching speed will be slower, which may cause heat generation and breakdown, so check thoroughly the actual devices. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM (9) Phase Compensation Phase Setting Method The following conditions are required to ensure the stability of the negative feedback circuit. Phase lag should be 150° or lower when gain is 1 (0 dB) (phase margin of 30° or higher). Because DC/DC converter applications are sampled using the switching frequency, the overall GBW should be set to 1/10 the switching frequency or lower. The target application characteristics can be summarized as follows: (a) Phase lag should be 150° or lower when gain is 1 (0 dB) (phase margin of 30° or higher). (b) The GBW at that time (i.e., the frequency of a 0-dB gain) is 1/10 of the switching frequency or below. In other words, because the response is limited by the GBW, it is necessary to use higher switching frequencies to raise response. One way to maintain stability through phase compensation involves cancellation of the secondary phase lag (-180°) caused by LC resonance with a secondary phase advance (by inserting 2 phase advances). The GBW (i.e., the frequency with the gain set to 1) is determined by the phase compensation capacitor connected to the error amp. Increase the capacitance if a GBW reduction is required. (a) Standard integrator (low-pass filter) (b) Open loop characteristics of integrator (a) A ＋ COMP GBW(b) A Feedback R -20 dB/decade Gain [dB] 0 － F FB 0 C -90° Phase -90 [°] Phase margin -180° -180 Figure 21 Point (a) fa = 1 2πRCA F Figure 22 [Hz ] Point (b) fb = GBW = 1 2πRC [Hz ] The error amp performs the phase compensation at points (a) and (b) and it acts as a low-pass filter. For DC/DC converter applications, R refers to feedback resistors connected in parallel. From the LC resonance of output, the number of phase advances to be inserted is two. 1 [Hz ] LC resonant frequency fp = Phase advance fz1 = 1 2πC1 R1 [Hz ] Phase advance fz 2 = 1 2πC2 R3 [Hz ] 2π LC VOUT R1 R4 C1 COMP － ＋ R2 A R3 C2 Figure 23 Set a phase advance frequency close to the LC resonant frequency for the purpose of canceling the LC resonance. (Note) If high-frequency noise is generated in the output, FB is affected through capacitor C1. Therefore, insert the resistor R4=1kΩ or so, which is in series with capacitor C1. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM 2.Example of Application (Note) We strongly recommend the following application circuit examples but check thoroughly the characteristics before putting using them. When you made changes at the external circuit, design a sufficient margin after considering the deviation, etc. of the external components and ROHM IC in terms of not only the static characteristic but also the transient characteristic. Moreover, understand that our company can not confirm fully with regard to the patent right. The master slave function is built-in. Synchronous switching is possible by the multi-connection of BD9305AFVM/ BD9306AFVM ICs. The following drawing shows an example of circuit connection in which BD9305AFVM is connected on the master side and BD9306AFVM is connected on the slave side. GND VCC GD CTL0 ENB BD9306AFVM (Slave Side) CT GD ENB CT RT RRT COMP FB GND VCC CTL2 BD9305AFVM (Master Side) RT CTL1 COMP FB VCC VOUT2 CCT VOUT1 Figure 24. Master Slave Application Circuit In the circuit above, BD9306AFVM is synchronized with the switching frequency which is determined by RT and CT of BD9305AFVM (master). In addition, the ON/OFF of output can be controlled by connecting the switch to the COMP terminal. (Refer to the following table) Control signal correspondence table Output state VOUT1 Control signal CTL0 CTL1 CTL2 OFF Low (Note) (Note) OFF ON High High Low ON OFF High Low High ON ON High Low Low OFF VOUT2 (Note) The same in either case of High / Low. Similarly in the case of connecting three or more than three, synchronization is still possible by connecting the CT terminal of Master and the CT terminal of Slave. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM I/O Equivalent Circuits 1.RT 4.GD VCC VCC VREF VCC 2.CT 7.COMP VCC VCC VREF VREF 3.ENB 8.FB VCC VREF www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Transistor (NPN) Resistor Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND GND Parasitic Elements Parasitic Elements GND N Region close-by Figure 25. Example of monolithic IC structure 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Ordering Information B D 9 3 0 5 A F V Package FVM : MSOP8 Part Number M - TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram MSOP8 (TOP VIEW) Part Number Marking 9 5 3 0 A LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 MSOP8 18/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 BD9305AFVM Revision History Date Revision 09.Sep.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/19 TSZ02201-0323AAJ00560-1-2 09.Sep.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001