Datasheet
4.75V to 18V, 2A/3A/4A 1ch
Buck Converter with Integrated FET
BD9325FJ
BD9326EFJ BD9327EFJ
General Description
Key Specifications
Input Voltage Range:
Output Current
BD9327EFJ :
BD9326EFJ:
BD9325FJ:
Switching Frequency:
High Side FET ON-Resistance
BD9327EFJ:
BD9326EFJ:
BD9325FJ:
Low Side FET ON-Resistance:
Standby Current:
Operating Temperature Range:
The BD9325FJ, BD9326EFJ and BD9327EFJ are
step-down regulators with built-in low resistance high
side N-Channel MOSFET. These ICs can supply
continuous output current of
2A / 3A / 4A
respectively over a wide input range, and provides
not only fast transient response, but also easy phase
compensation because of current mode control.
Features
Low ESR Output Ceramic Capacitors are Available
Low Standby Current during Shutdown Mode
Feedback Voltage
0.9V ± 1.5%(Ta=25°C)
0.9V ± 3.0%(Ta=-25°C to +85°C)
Protection Circuit:
Under Voltage Protection
Thermal Shutdown
Over-Current Protection
Packages
W(Typ)
4.75V to 18V
4.0A (Max)
3.0A (Max)
2.0A (Max)
380kHz (Typ)
0.11Ω(Typ)
0.12Ω(Typ)
0.16Ω(Typ)
10Ω(Typ)
80μA (Typ)
-40°C to +85°C
D(Typ)
H(Max)
Applications
Distributed Power System
Pre-Regulator for Linear Regulator
HTSOP-J8
4.90mm x 6.00mm x 1.00mm
SOP-J8
4.90mm x 6.00mm x 1.65mm
Typical Application Circuit
C_PC1
3300pF
R_DW
10k
R_PC
15k
R_UP
FB
COMP
EN
SS
C_SS
0.1μF
27k
Thermal Pad
GND
SW
VIN
BST
(For BD9326EFJ, BD9327EFJ)
L
VIN=12V
VOUT = 3.3V
C_VC1
10μF
C_BS
0.1μF
D
10μH
C_CO1
20μF
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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BD9325FJ
BD9326EFJ BD9327EFJ
Pin Configuration
Block Diagram
VIN
(TOP
VIEW)
1
BST
SS
8
2
VIN
EN
7
3
SW
COMP
6
4
GND
FB
5
Figure 2. Pin Configuration
Figure 3. Block Diagram
Pin Description
Pin No.
Pin Name
Function
1
BST
High-side gate drive boost input
2
VIN
Power supply input terminal
3
SW
Power switching output
4
GND
Ground terminal
5
FB
Feedback input
6
COMP
7
EN
Enable input
8
SS
Soft start control input
Compensation node
Lineup
High Side FET
ON-Resistance
(Typ)
Output Current
(Max)
0.16 Ω
2.0 A
SOP-J8
Reel of 2500
BD9325FJ-E2
0.12 Ω
3.0 A
HTSOP-J8
Reel of 2500
BD9326EFJ-E2
0.11 Ω
4.0 A
HTSOP-J8
Reel of 2500
BD9327EFJ-E2
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Part Number
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
BD9325FJ
BD9326EFJ BD9327EFJ
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage [VIN]
VIN
20
V
Switch Voltage [SW]
VSW
20
V
Power Dissipation for HTSOP-J8
Pd1
3.76
(Note 1)
(Note 2)
W
W
Power Dissipation for SOP-J8
Pd2
0.67
Operating Temperature Range
Topr
-40 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
VBST
VSW+7
V
EN Voltage
VEN
20
V
All Other Pins
VOTH
7
V
Maximum Junction Temperature
BST Voltage
(Note 1) Mounted on 4- layer 70mmx70mmx1.6mm board. Reduce by 30.08mW/°C for Ta above 25°C.
(Note 2) Mounted on 1- layer 70mmx70mmx1.6mm board. Reduce by 5.4mW/°C for Ta above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Supply Voltage
VIN
Min
4.75
SW Voltage
VSW
-0.5
Rating
Typ
12
Max
18
-
+18
V
A
Unit
V
Output Current for BD9325FJ
ISW2
-
-
2(Note 3)
Output Current for BD9326EFJ
ISW3
-
-
3(Note 3)
A
-
4(Note 3)
A
Output Current for BD9327EFJ
ISW4
-
(Note 3) Pd, ASO should not be exceeded
Electrical Characteristics (Unless otherwise specified VIN=12V Ta=25°C)
Parameter
Error Amplifier Block
FB Input Bias Current
Feedback Voltage1
Feedback Voltage2
SW Block – SW
Hi-Side FET ON-Resistance for
BD9325FJ
Hi-Side FET ON-Resistance for
BD9326EFJ
Hi-Side FET ON-Resistance for
BD9327EFJ
Low-Side FET ON-Resistance
Leak Current N-Channel
Switch Current Limit for BD9325FJ
Switch Current Limit for BD9326EFJ
Switch Current Limit for BD9327EFJ
Maximum Duty Cycle
General
Enable Sink Current
Enable Threshold Voltage
Under Voltage Lockout Threshold
Under Voltage Lockout Hysteresis
Soft Start Current
Soft Start Time
Operating Frequency
Circuit Current
Standby Current
Min
Limit
Typ
Max
IFB
VFB1
VFB2
0.886
0.873
0.1
0.900
0.900
2
0.914
0.927
µA
V
V
Voltage Follower
Ta=-40°C to +85°C
RON2
-
0.16
-
Ω
ISW= -0.8A (Note 4)
RON3
-
0.12
-
Ω
ISW= -0.8A (Note 4)
RON4
-
0.11
-
Ω
ISW= -0.8A (Note 4)
RONL
ILEAKN
ILIMIT2
ILIMIT3
ILIMIT4
MDUTY
2.5
3.5
4.5
-
10
0
90
10
-
Ω
µA
A
A
A
%
ISW= 0.1A
VIN= 18V, VSW= 0V
IEN
VEN
VUVLO
VHYS
ISS
tSS
fOSC
ICC
IQUI
86
1.1
4.05
23
300
-
181
1.18
4.40
0.1
41
1.6
380
2.1
80
275
1.4
4.75
62
460
4.3
170
µA
V
V
V
µA
ms
kHz
mA
µA
VEN= 12V
Symbol
Unit
Conditions
(Note 4)
(Note 4)
(Note 4)
VFB= 0V
VIN Rising
VSS= 0 V
CSS= 0.1 µF
VFB= 1.5V, VEN= 12V
VEN= 0V
(Note 4) See the lineup table .
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BD9325FJ
BD9326EFJ BD9327EFJ
Typical Performance Curves
Icc :[μA]
Icc :[mA]
(Unless otherwise specified, VIN= 12V Ta = 25°C)
VIN :[V]
Figure 4. Circuit Current vs Input Voltage
(No Switching)
Figure 5. Standby Current vs Input Voltage
(IC Not Active)
IFB :[μA]
Feedback Voltage :[V]
VIN :[V]
VFB :[V]
Temperature :[ °C ]
Figure 6. Input Bias Current vs
Feedback Voltage
Figure 7. Feedback Voltage vs
Temperature
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BD9325FJ
BD9326EFJ BD9327EFJ
Typical Performance Curves - continued
390
RON :[Ω]
Operating Frequency [kHz]
380
370
360
350
340
330
320
-40
-20
0
20
40
60
Temperature :[ °C
]
TEMPERATURE
: [C]
Figure 8. Hi-Side ON-Resistance
vs Temperature
Figure 9. Operating Frequency vs
Temperature
80
Efficiency : [%]
Soft Start Time :[ms]
Ta: [°C]
CSS: [μF]
IOUT: [A]
Figure 11. Soft Start Time vs
Soft Start Capacitor
Figure 10. Efficiency vs Output Current
(VIN= 12V VOUT= 3.3V L=10µH)
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Typical Waveforms
Figure 12. Over-Current Protection
(VOUT is shorted to GND)
Figure 13. Transient Response
(VIN= 12V VOUT= 3.3V L= 10µH COUT =22µF IOUT= 0.2-1.0A )
Figure 15. Transient Response
(VIN= 12V VOUT= 3.3V L= 10µH COUT =22µF IOUT= 0.2-3.0A)
Figure 14. Output Ripple Voltage
(VIN= 12V VOUT= 3.3V L= 10µH COUT =22µF IOUT= 1.0A )
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BD9326EFJ BD9327EFJ
Typical Waveforms - continued
Figure 17. Start Up Waveform
(VIN= 12V VOUT= 3.3V L= 22µH CSS= 0.1µF IOUT= 0A)
Figure 16. Output Ripple Voltage
(VIN= 12V VOUT= 3.3V L= 10µH COUT =22µF IOUT= 3.0A)
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BD9326EFJ BD9327EFJ
Application Information
1.
Block Operation
(1) VREG
This block generates the constant-voltage needed for DC/DC boosting.
(2) VREF
This block generates the 2.9 V internal reference voltage of the Error Amp.
(3) TSD/UVLO
TSD (Thermal shutdown)/UVLO (Under Voltage Lockout) are protection circuit blocks. This circuit protects the device
from damages due to excessive heat and power dissipation. When the TSD circuit is triggered by temperature
exceeding the 175°C Maximum Junction Temperature, it shuts down the device. Once temperature falls below the
threshold set by a hysteresis, the device resumes operation.
UVLO circuit prevents error in the device operation due to either excessive or insufficient power supply voltage. It
monitors the voltage level at VIN pin and also the output of REG block. Once VIN voltage falls below 4.4V, the UVLO
circuit disables the device and resets the Soft-Start circuit. Typical UVLO Hysteresis is 100 mV.
(4) Error Amp Block (ERR)
This circuit compares the reference voltage and the feedback of output voltage. The COMP pin voltage, which is the
output of ERR block, determines the switching duty. During startup, the COMP pin voltage is limited by SS pin voltage
since the soft start is operated by the SS pin voltage.
(5) Oscillator Block (OSC)
This block generates the internal oscillating frequency of the IC.
(6) SLOPE Block
This circuit is used to generate triangular waveform from the clock created by OSC block. This triangular waveform is
sent to the PWM comparator.
(7) PWM Block
The COMP pin voltage, which is the output of ERR block, is compared to the SLOPE block's triangular waveform to
determine the switching duty. Since the switching duty is limited by the maximum duty ratio which is determined
internally, it does not become 100%.
(8) DRV Block
This circuit is a DC/DC driver block. A signal from the PWM serves as the input to drive the power FETs.
(9) OCP Block
OCP (Over-Current Protection) is a protection circuit block. The OCP block activates when the current flows through
the FET is detected, and OCP starts when it reached 2.5 / 3.5 / 4.5A (min). After OCP, switching will turn OFF and SS
capacitor will discharge. OCP is a self-recovery type (not latch).
(10) Soft Start Circuit
The soft-start feature reduces overshoot in the output by making the regulator reach steady-state gradually. The
soft-start capacitor, CSS, which is connected to SS (pin 8) and GND (pin4), sets the soft-start time, tSS.
(Refer to Figure 23 to know how to set CSS.)
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BD9325FJ
2.
BD9326EFJ BD9327EFJ
Selecting Application Components
(1) Output LC Constant (Buck Converter)
The inductance L to be used for the output is decided by the current rating ILR and maximum input current value IOMAX
of the inductor.
IOMAX + ∆IL/2
should not reach
the rated value level
IL
VCC
IL
Vo
ILR
L
IOMAX mean current
Co
t
Figure 18
Figure 19
Adjust IOMAX+∆IL/2 so that it won’t reach the current rating value ILR. At this time, ∆IL can be obtained by the following
equation.
∆I L =
V
1
1
× (VCC − VO ) × O ×
L
VCC
f
[A]
Set with sufficient margin because the inductance L value may have a tolerance of ± 30%.
For output capacitor C, select a capacitor which has the larger value in the ripple voltage VPP permissible value and
the drop voltage permissible value at the time of sudden load change.
Output ripple voltage is decided by the following equation.
∆VPP = ∆I L × RESR +
V
∆I L
1
× O ×
2CO VCC
f
[V ]
Perform setting so that the voltage is within the permissible ripple voltage range.
For the drop voltage VDR during sudden load change, please perform the rough calculation by the following equation.
VDR =
∆I L
× 10 µs
CO
[V ]
However, 10μs is the rough calculation value of the DC/DC response speed.
Make Co settings so that these two values will be within the limit values.
(2) Loop Compensation
Choosing compensation Capacitor C1 and Resistor R3
The example of DC/DC converter application bode plot is shown in Figure 21. The compensation resistor R3 will set
the cross over frequency FC that decides the stability and response speed of DC/DC converter. So compensation
resistor R3 has to be adjusted to adequate value for good stability and response speed.
The cross over frequency FC can be adjusted by changing the compensation resistor R3 connected to COMP terminal.
Higher cross over frequency achieves good response speed, but less stability, and the lower cross over frequency
shows good stability, but worse response speed.
Usually, the 1/10 of DC/DC converter operating frequency is used for cross over frequency FC. So please decide the
compensation resistor and capacitor using the following formula on setting FC to 1/10 of operating frequency at first.
After that, please measure and adjust the cross over frequency on your set (on the actual application) to meet the
desired speed and phase-margin.
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BD9325FJ
BD9326EFJ BD9327EFJ
(a) Choosing Phase Compensation Resistor R3
Please decide the compensation resistor R3 by following the formula below.
Compensation Resister
R3 = 5800 × COUT × fc × VOUT
[Ω]
Where
COUT is the Output capacitor connected to DC/DC output
VOUT is the Output voltage
fC is the Desired cross over frequency (38kHz)
The larger value of R3, value of fc increases (response better and stability worse).
The smaller value of R3, value of fc decreases (response worse and stability better).
(b) Choosing Phase Compensation Capacitor C1
The phase delay which is from output LC filter, needs to be cancelled to stabilize the DC/DC converter, this is
done by inserting the phase lead.
The phase lead can be added by the zero introduced by the compensation resistor and capacitor.
The LC resonant frequency FLC and the zero on compensation resistor and capacitor are expressed below.
f LC =
LC Resonant Frequency
fZ =
Zero C1 and R3
[H Z ]
1
2π LCOUT
[H Z ]
1
2πC1R3
Please choose C1 to make fZ to 1 / 3 of fLC .
C1 =
Compensation Capacitor
[F ]
3
2πf LC R3
(c) The Condition of the Loop Compensation Stability
The stability of the DC/DC converter is important. To ensure the operating stability, please check the loop
compensation if it has enough phase-margin. For the condition of loop compensation stability, the phase-lag must
be less than 150 degrees when gain is 0 dB. Namely over 30 degrees phase-margin is needed.
Lastly, after the calculation above, find measures to adjust the phase-margin to more than 30 degrees.
VOUT
(a)
A
Gain [dB]
R1
FB
COMP
－
GBW(b)
0
＋
R2
R3
PHASE
C1
F
FC
0
－90°
－90
Phase MARGIN
Margin
PHASE
－180°
－180
F
Figure 20
Figure 21
(3) Design of Feedback Resistance Constant
Set the feedback resistance as shown below.
Reference Voltage
VOUT =
VOUT
R1 + R 2
× Reference Voltage
R2
[V]
＋
R1
ERR
FB
－
R2
Figure 22
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BD9326EFJ BD9327EFJ
(4) Soft Start Function
COMP
ERRAMP
The buck converter has an adjustable Soft Start function to
prevent high inrush current during start up.
2.9V(typ)
+
-
The soft-start time is set by the external capacitor connected
to SS pin.
The soft start time is given by;
70k(typ)
SS
[S ]
tss = 16200 × C SS
CSS
Please confirm the overshoot of the output voltage and inrush
current when deciding the SS capacitor value.
Figure 23
(5) EN Function
The EN terminal control the IC’s shut down.
Leaving EN terminal open will shutdown the IC.
To start the IC, EN terminal should be connected to VIN or the
other power source output.
When the EN voltage exceed 1.2V (typ), the IC start
operating.
VIN
EN
66kΩ(typ)
60kΩ(typ)
Figure 24. The Equivalent Internal Circuit
3. Selecting Application Components
Two high pulsing current flowing loops exist in the buck regulator system.
The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to
the output capacitors, and then returns to the input capacitor through GND.
The second loop, when FET is OFF, starts from the Schottky diode, to the inductor, to the output capacitor, and then
returns to the Schottky diode through GND.
To reduce the noise and improve the efficiency, please minimize these two loop area.
Especially input capacitor, output capacitor and Schottky diode should be connected to GND plane.
PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing
PCB Layout patterns.
L
VIN
CIN
VOUT
COUT
FET
Di
Figure 25. Current Loop in Buck Regulator System
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(1) The Thermal Pad on the back side of IC serves as heat sink for thermal conduction to the chip. Making the GND
plane as broad and wide as possible can help in thermal dissipation. Adding a lot of thermal via is also effective for
helping the spread of heat to the different layer.
(2) The input capacitors should be connected as close as possible to the VIN terminal.
(3) When there is unused area on PCB, please arrange the copper foil plane of DC nodes, such as GND, VIN and VOUT
for helping heat dissipation of IC or circumference parts.
(4) Make the trace of the switching line as short and thick as possible to coil to avoid the noise influence of AC signals to
combine with the other line.
(5) Keep sensitive signal traces such as trace connected FB and COMP away from SW pin.
(6) The inductor, the Schottky diode and the output capacitors should be placed close as possible to SW pin.
BST
SS
VIN
EN
CIN
VIN
SW
Di
COUT
SW
FET
COMP
GND
FB
L
VOUT
Figure 26. The Example of PCB Layout Pattern
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I/O Equivalence Circuit
1.BST
3.SW
VIN
5.FB
VIN
VIN
REG
SW
6.COMP
7.EN
VIN
VIN
8.SS
VIN
VIN
Power Dissipation: Pd [mW]
Power Dissipation
4000
(4)3760mW
HTSOP-J8 Package
On 70 x 70 x 1.6 mm glass epoxy PCB
(3)2110mW
(1) 1-layer board (Backside copper foil area 0 mm x 0 mm)
(2) 2-layer board (Backside copper foil area 15 mm x 15 mm)
(3) 2-layer board (Backside copper foil area 70 mm x 70 mm)
(4) 4-layer board (Backside copper foil area 70 mm x 70 mm)
3000
2000
(2)1100mW
1000
(1)820mW
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Power Dissipation: Pd [mW]
Figure 27
SOP-J8 Package
On 70 x 70 x 1.6 mm glass epoxy PCB
4000
(1) 1-layer board (Backside copper foil area 0 mm x 0 mm)
3000
2000
1000
(1)675mW
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 28
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD9325FJ
BD9326EFJ BD9327EFJ
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Transistor (NPN)
Resistor
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
N Region
close-by
Figure 29. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
15/19
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
BD9325FJ
BD9326EFJ BD9327EFJ
Ordering Information
B
D
9
3
2
x
x
x
x
-
Package
FJ : SOP-J8
EFJ : HTSOP-J8
Part Number
9325
9326
9327
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP-J8(TOP VIEW)
Part Number Marking
HTSOP-J8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Package
Orderable Part Number
D9325
SOP-J8
BD9325FJ-E2
D9326
HTSOP-J8
BD9326EFJ-E2
D9327
HTSOP-J8
BD9327EFJ-E2
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
16/19
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
BD9325FJ
BD9326EFJ BD9327EFJ
Physical Dimensions, Tape and Reel information
Package Name
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
SOP-J8
17/19
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
BD9325FJ
BD9326EFJ BD9327EFJ
Physical Dimensions, Tape and Reel information - continued
Package Name
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
HTSOP-J8
18/19
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
BD9325FJ
BD9326EFJ BD9327EFJ
Revision History
Date
Revision
11.Apr.2012
05.Sep.2014
001
002
Changes
New Release
Applied the ROHM Standard Style and improved understandability.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
19/19
TSZ02201-0323AAJ00030-1-2
05.Sep.2014 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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