BD9327EFJ

Single-chip Type with Built-in FET Switching Regulators Simple Step-down Switching Regulators with Built-in Power MOSFET BD9325FJ,BD9326EFJ,BD9327EFJ No.10027ECT06 ●Description The BD9325FJ, BD9326EFJ and BD9327EFJ are step-down regulators that integrate a low resistance high side N-channel MOSFET. It achieves 2A / 3A / 4A continuous output current over a wide input supply range. Current mode operation provides fast transient response and easy phase compensation. ●Features 1) Wide operating INPUT Range 4.75V～18.0V 2) Selectable 2A / 3A / 4A Output Current 3) Selectable 0.16Ω / 0.12Ω / 0.11ΩInternal MOSFET Switch 4) Low ESR Output Ceramic Capacitors are Available 5) Low Stanby Current during Shutdown Mode 6) 380kHz Operating Frequency 7) Feedback voltage 0.9V ±1.5% Accuracy at room temp. (±3.0% for -40℃ to 85℃ temperature range) 8) Protection circuit: UnderVoltage lockout protection circuit Thermal shutdown circuit OverCurrent protection circuit 9) SOP-J8 Package for 2A model, HTSOP-J8 Package for 3A, 4A models (with Exposed thermal PAD) ●Applications Distributed Power System Pre-Regulator for Linear Regulator ●Line up matrix LINE-UP FET ON-RESISTANCE OUTPUT CURRENT Package BD9325FJ 0.16 Ω 2.0 A SOP-J8 BD9326EFJ 0.12 Ω 3.0A HTSOP-J8 BD9327EFJ 0.11 Ω 4.0 A HTSOP-J8 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Absolute maximum ratings (Ta = 25°C) Parameter Supply Voltage Switch Voltage Power Dissipation for HTSOP-J8 Power Dissipation for SOP-J8 Operating Temperature Range Storage Temperature Range Junction Temperature BST Voltage EN Voltage All other pins Technical Note Symbol VIN VSW Pd1 Pd2 Topr Tstg Tjmax VBST VEN VOTH Ratings 20 20 3760 675 *1 *2 Unit V V mW mW ℃ ℃ ℃ V V V -40～+85 -55～+150 150 VSW+7 20 7 *1 Derating in done 30.08 mW/℃ for operating above Ta≧25℃(Mount on 4-layer 70.0mm×70.0mm×1.6mm board) *2 Derating in done 5.4 mW/℃ for operating above Ta≧25℃(Mount on 1-layer 70.0mm×70.0mm×1.6mm board) ●Operation Range (Ta= -40～85℃) Parameter Supply Voltage SW Voltage Output current for BD9325FJ Output current for BD9326EFJ Output current for BD9327EFJ ** Pd, ASO should not be exceeded Symbol VIN VSW ISW2 ISW3 ISW4 Ratings Min 4.75 -0.5 Typ 12 Max 18 18 2** 3** 4** Unit V V A A A ●Electrical characteristics (Unless otherwise specified VIN=12V Ta=25℃) Limits Parameter Symbol Min Typ Error amplifier block FB input bias current Feedback voltage1 Feedback voltage2 SW block – SW Hi-side FET On-resistance for BD9325FJ Hi-side FET On-resistance for BD9326EFJ Hi-side FET On-resistance for BD9327EFJ Lo-side FET On-resistance Leak current N-channel Switch Current Limit for BD9325FJ Switch Current Limit for BD9326EFJ Switch Current Limit for BD9327EFJ Maximum duty cycle General Enable Sink current Enable Threshold voltage Under Voltage Lockout threshold Under Voltage Lockout Hysteresis Soft Start Current Soft Start Time Operating Frequency Circuit Current Quiescent Current *** See the series line-up table below. Max 2 0.914 0.927 10 275 1.4 4.75 62 460 4.3 170 Unit Conditions IFB VFB1 VFB2 RON2 RON3 RON4 RONL ILEAKN ILIMIT2 ILIMIT3 ILIMIT4 MDUTY IEN VEN VUVLO VHYS ISS TSS FOSC ICC IQUI 0.886 0.873 2.5 3.5 4.5 86 1.1 4.05 23 300 - 0.1 0.900 0.900 0.16 0.12 0.11 10 0 90 181 1.18 4.40 0.1 41 1.6 380 2.1 80 µA V V Ω Ω Ω Ω µA A A A % µA V V V uA ms kHz mA µA VFB= 1.5V, VEN= 12V VEN= 0V VSS= 0 V CSS= 0.1 µF VIN rising Voltage follower Ta=-40℃～85℃ ISW= -0.8A *** ISW= -0.8A *** ISW= -0.8A *** ISW= 0.1A VIN= 18V, VSW = 0V *** *** *** VFB= 0V VEN= 12V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Block diagram VIN EN VREF EN;PULL UP to VIN OCP UVLO IBIAS FB + ERR － Technical Note 5V OSC VREG BST 12V VIN TSD S DRV LVS SW SLOPE + PWM － OUTPUT COMP SS Soft Start LOGIC R LVS GND Fig.1 Block Diagram ●Typical application circuit C_PC1 3300pF C_SS 0.1μF COMP SS EN R_PC 15k FB R_DW 10k R_UP 27k Thermal Pad (For BD9326EFJ, BD9327EFJ) BST GND VIN SW L VIN 12V C_VC1 10μF 10μH D C_BS 0.1μF VOUT 3.3V C_CO1 20μF Fig.2 Application Circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Block operation ・VREG A block to generate constant-voltage for DC/DC boosting. ・VREF A block that generates internal reference voltage of 2.9 V (Typ.). Technical Note ・TSD/UVLO TSD (Thermal shutdown)/UVLO (Under Voltage Lockout) protection block. The TSD circuit shuts down IC at 175℃ (Typ.) The UVLO circuit shuts down the IC when the VCC is Low Voltage. ・Error amp block (ERR) This is the circuit to compare the reference voltage and the feedback voltage of output voltage. The COMP pin voltage resulting from this comparison determines the switching duty. At the time of startup, since the soft start is operated by the SS pin voltage, the COMP pin voltage is limited to the SS pin voltage. ・Oscillator block (OSC) This block generates the oscillating frequency. ・SLOPE block This block generates the triangular waveform from the clock created by OSC. Generated triangular waveform is sent to the PWM comparator. ・PWM block The COMP pin voltage output by the error amp is compared to the SLOPE block's triangular waveform to determine the switching duty. Since the switching duty is limited by the maximum duty ratio which is determined internally, it does not become 100%. ・DRV block A DC/DC driver block. A signal from the PWM is input to drive the power FETs. ・Soft start circuit Since the output voltage rises gradually while restricting the current at the time of startup, it is possible to prevent the output voltage overshoot or the rush current. ●Pin assignment and pin function Pin No. 1 2 3 4 5 6 7 8 Pin name BST VIN SW GND FB COMP EN SS Function High-Side Gate Drive Boost Input Power Input Power Switching Output Ground Feed Back Input Compensation Node Enable Input Soft Start Control Input www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Typical performance characteristics (Unless otherwise specified, VIN= 12V Ta = 25℃) 2.5 2.4 2.3 2.2 2.1 160 140 120 100 0.1 0.08 0.06 0.04 Technical Note Icc [mA] 2 1.9 1.8 1.7 1.6 1.5 Icc [uA] 80 60 40 20 0 IFB [uA] 4 6 8 10 12 14 16 18 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.1 0 0.5 1 1.5 2 4 6 8 10 12 14 16 18 VIN : [V] VIN : [V] VFB [V] Fig.3 Circuit Current (No switching) Fig.4 Quiescent Current (IC not active) Fig.5 Input Bias Current 0.25 370 360 0.923 0.2 Operating Frequency [kHz] 60 80 0.913 BD9325FJ Ron [ Ω] 0.15 Feedback voltage [V] 350 340 330 320 310 0.903 0.893 0.1 BD9326EFJ 0.883 0.05 0.873 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 Ta [℃] 40 300 -40 -20 0 20 40 60 80 TEMPERATURE : [C] TEMPERATURE : [C] Fig.6 Feedback voltage Fig.7 Hi-Side On-resistance Fig.8 Operating Frequency 95 90 85 EFFICIENCY [%] 80 75 70 65 60 55 50 0 0.2 0.4 0.6 0.8 1 Iout [A] 1.2 100 BD9326EFJ BD9325FJ VOUT SOFTSTART TIME [ms] 10 VSS 1 VSW IOUT 1.4 1.6 1.8 2 0.1 0.01 0.001 0.01 0.1 1 CSS [uF] Fig.9 STEP Down Efficiency (VIN= 12V VOUT= 3.3V L=10µH) Fig.10 OverCurrent Protection (VOUT is shorted to GND) Fig.11 Soft Start Time www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ Technical Note VOUT: 100 mV / D VOUT-MAX: +100mV VOUT VOUT-MIN: -100m V IOUT: 1.0 A / Div IOUT IOUT VOUT VOUT: 10.0 mV / Div Δ: 10.4 mV IOUT: 1.0 A / Div Fig.12 Transient Response (VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF Iout= 0.2-1.0A ) Fig.13 Output Ripple Voltage (VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF I out= 1.0A ) VOUT-MAX: +460mV VOUT VOUT-MIN: -240mV VOUT VOUT: 10.0 mV / Div Δ:11.8 mV IOUT: 1.0 A / Div IOUT IOUT IOUT: 1.0 A / Div Fig.14 Transient Response (VIN= 12V V = 3.3V L= 10µH Cout =22µF Iout= 0.2-3.0A) OUT Fig.15 Output Ripple Voltage (VIN= 12V VOUT= 3.3V L= 10µH Cout =22µF Iout= 3.0A) EN EN: 10V / Div VOUT: 1.0V / Div VOUT IOUT: 1.0 A / Div IOUT Fig.16 Start Up waveform (VIN= 12V VOUT= 3.3V L= 22µH CSS= 0.1µF Iout= 0A) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Selecting application components Technical Note (1) Output LC constant (Buck Converter) The inductance L to use for output is decided by the rated current ILR and input current maximum value IOMAX of the inductance. VCC IL IOMAX +  IL should not reach the rated value level ILR IOMAX mean current IL L Co Vo t Fig.17 Fig.18 Adjust so that IOMAX + ∆IL does not reach the rated current value ILR. At this time, ∆IL can be obtained by the following equation. ∆I L = 1 L  (VCC - Vo)  Vo VCC  1 f [A] Set with sufficient margin because the inductance L value may have the dispersion of ± 30%. For the capacitor C to use for the output, select the capacitor which has the larger value in the ripple voltage VPP permissible value and the drop voltage permissible value at the time of sudden load change. Output ripple voltage is decided by the following equation. ∆VPP = ∆IL  RESR + ∆I L 2Co  Vo VCC  1 f [V] Perform setting so that the voltage is within the permissible ripple voltage range. For the drop voltage VDR during sudden load change, please perform the rough calculation by the following equation. VDR = ∆I L Co  10 µs [V] However, 10μs is the rough calculation value of the DC/DC response speed. Make Co settings so that these two values will be within the limit values. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ (2) Loop Compensation Choosing compensation capacitor C1 and resistor R3 Technical Note The example of DC/DC converter application bode plot is shown below. The compensation resistor R3 will set the cross over frequency FC that decides the stability and response speed of DC/DC converter. So compensation resistor R3 has to be adjusted to adequate value for good stability and response speed. The cross over frequency FC can be adjusted by changing the compensation resistor R3 connected to COMP terminal. The higher cross over frequency achieves good response speed, but less stability. And the lower cross over frequency shows good stability, but worse response speed. Usually, the 1/10 of DC/DC converter operating frequency is used for cross over frequency FC. So please decide the compensation resistor and capacitor using the following formula on setting FC to 1/10 of operating frequency at first. After that, please measure and adjust the cross over frequency on your set (on the actual application) to meet the enough response speed and phase-margin. ( i ) Choosing phase compensation resistor R3 Please decide the compensation resistor R3 on following formula. Compensation Resistor R3= 5800×COUT×FC×VOUT [Ω] Where COUT : Output capacitor connected to DC/DC output VOUT : Output voltage FC : Desired cross over frequency (38kHz) ( ii ) Choosing phase compensation capacitor C1 The stability of DC/DC converter needs to cancel the phase delay that is from output LC filter by inserting the phase advance. The phase advance can be added by the zero on compensation resistor and capacitor. The LC resonant frequency FLC and the zero on compensation resistor and capacitor are expressed below. LC resonant frequency FLC= 1 2π√LCOUT 1 2πC1R3 [Hz] Zero by C1 and R3 FZ= [Hz] Please choose C1 to make FZ to 1 / 3 of FLC . Compensation Capacitor C1= 3 2πFLCR3 [F] ( iii ) The condition of the loop compensation stability The stability of DC/DC converter is important. To secure the operating stability, please check the loop compensation has the enough phase-margin. For the condition of loop compensation stability, the phase-delay must be less than 150 degree where Gain is 0 dB. Namely over 30 degree phase-margin is needed. Lastly after the calculation above, please measure and adjust the phase-margin to secure over 30 degree. V OUT Gain [dB] A (a) R1 FB R2 － ＋ COMP PHASE GBW(b) 0 FC －90° PHASE MARGIN －180 －180° F F R3 C1 0 －90 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ (3) Design of Feedback Resistance constant Set the feedback resistance as shown below. Reference voltage VOUT R1 FB R2 ＋ Technical Note VOUT = R1 + R2 R2  Reference Voltage [V] － ERR ●Soft Start Function The buck converter has an adjustable Soft Start function to prevent high inrush current during start up. The soft-start time is set by the external capacitor connected to SS pin. The soft start time is given by; Tss [ms] = 16.2・C [µF] Css Please confirm the overshoot of the output voltage and inrush current when deciding the SS capacitor value. COMP ERRAMP 2.9V(typ) 70k(typ) SS + - ●EN Function VIN EN 66kΩ(typ.) The EN terminal controls IC’s shut down. Leaving EN terminal open makes IC shutdown. To start the IC, EN terminal should be connected to VIN or the other power source output. When the EN voltage exceed 1.2V (typ.), the IC start operating. 60kΩ(typ.) Fig.19 The equivalent internal circuit. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ Technical Note ●Layout Pattern Consideration Two high pulsing current flowing loops exist in the buck regulator system. The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through GND. The second loop, when FET is OFF, starts from the shotkey diode, to the inductor, to the output capacitor, and then returns to the shotkey diode through GND. To reduce the noise and improve the efficiency, please minimize these two loop area. Especially input capacitor, output capacitor and shotkey diode should be connected to GND plain. PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing PCB Layout patterns. VIN CIN FET Di L COUT VOUT Fig.20 Current loop in Buck regulator system ・The thermal Pad on the back side of IC has the great thermal conduction to the chip. So using the GND plain as broad and wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the different layer is also effective. ・The input capacitors should be connected as close as possible to the VIN terminal. ・Keep sensitive signal traces such as trace connected FB and COMP away from SW pin. ・The inductor, the shot key diode and the output capacitors should be placed close to SW pin as much as possible. CIN VIN SW BST VIN SS EN Di COUT L SW GND FET COMP FB VOUT Fig.21 The example of PCB layout pattern www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ Technical Note ●Operation Notes 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake fitting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. 5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. 7) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns of any external components. 8) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when the resistors and transistors are connected to the pins as shown in Fig.22 , a parasitic diode or a transistor operates by inverting the pin voltage and GND voltage. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage to input and output pins. Resistor (Pin A) (Pin B) C Transistor (NPN) B (Pin B) B C E GND Parasitic elements N (Pin A) Parasitic elements GND ～ ～ ～ ～ GND P+ N N P N Parasitic elements GND Parasitic elements N P N P+ P+ N P substrate GND P P+ ～ ～ E Fig.22 Example of a Simple Monolithic IC Architecture 9) Overcurrent protection circuits An overcurrent protection circuit designed according to the output current is incorporated for the prevention of IC damage that may result in the event of load shorting. This protection circuit is effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative characteristics to temperatures. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/14 2010.08 - Rev.C ～ ～ BD9325FJ, BD9326EFJ, BD9327EFJ Technical Note 10) Thermal shutdown circuit (TSD) This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output power elements. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit. 11) Testing on application boards At the time of inspection of the installation boards, when the capacitor is connected to the pin with low impedance, be sure to discharge electricity per process because it may load stresses to the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. ●I/O Equivalent Circuit Diagram 1.BST 3.SW 5.FB VIN VIN VIN REG SW 6.COMP 7.EN 8.SS VIN EF VIN VIN VIN www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Power Dissipation Technical Note POWER DISSIPATION: PD [mW] 4000 3000 (4)3760mW HTSOP-J8 Package On 70  70  1.6 mm glass epoxy PCB (1) 1-layer board (Backside copper foil area 0 mm  0 mm) (2) 2-layer board (Backside copper foil area 15 mm  15 mm) (3) 2-layer board (Backside copper foil area 70 mm  70 mm) (4) 4-layer board (Backside copper foil area 70 mm  70 mm) (3)2110mW 2000 (2)1100mW 1000 0 0 (1)820mW 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [°C] POWER DISSIPATION: PD [mW] 4000 3000 2000 1000 SOP-J8 Package On 70  70  1.6 mm glass epoxy PCB (1) 1-layer board (Backside copper foil area 0 mm  0 mm) 0 0 (1)675mW 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [°C] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/14 2010.08 - Rev.C BD9325FJ, BD9326EFJ, BD9327EFJ ●Ordering part number Technical Note B D 9 Part No. 9325 9326 9327 3 2 5 F J - E 2 Part No. Package FJ : SOP-J8 EFJ : HTSOP-J8 Packaging and forming specification E2: Embossed tape and reel SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 8 7 6 5 Tape Quantity 0.45MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.0±0.3 3.9±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 0.545 S 0.2±0.1 1.375±0.1 0.175 1.27 0.42±0.1 0.1 S 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. HTSOP-J8 4.9±0.1 (MAX 5.25 include BURR) (3.2) 4° 8765 Tape 0.65±0.15 1.05±0.2 Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold +6° −4° Quantity Direction of feed 6.0±0.2 3.9±0.1 (2.4) ( reel on the left hand and you pull out the tape on the right hand ) 1 234 1PIN MARK 0.545 1.0MAX +0.05 0.17 -0.03 S 1.27 0.85±0.05 0.08±0.08 +0.05 0.42 -0.04 0.08 S 0.08 M 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/14 2010.08 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A