BD93F10MWV-E2

Datasheet USB Type-C Power Delivery High Voltage Protection of CC Pins USB Type-C Power Delivery Controller BD93F10MWV General Description Key Specifications     BD93F10MWV is a full function USB Type-C Power Delivery (PD) Controller that supports USB PD using base-band communication. It is compatible with USB Type-C Specification and Power Delivery specification. BD93F10MWV includes support for the PD policy engine and communicates with an Embedded Controller or the SoC via host interface. Features         ® VBUS Voltage Range: VSVR Voltage Range: Operating Temperature Range: Protection Voltage of CC Pins: 3.67 V to 22 V 3.1 V to 5.5 V -30 °C to +85 °C 28 V FW Revision  Rev.7525(1D65h) Applications ®         32 Bit ARM Cortex -M0 Processor Embedded USB Type-C Specification Ver.1.3 Compatible USB PD Specification Ver.3.0 Compatible Integrated VBUS N-ch MOSFET Switch Gate Driver Integrated VBUS Discharge Switch Protection Voltage of CC Pins is 28 V Supports Dead Battery operation I2C Interface for Host Communication Printers Projectors Mobile Batteries POS Drone Smart Speaker LAN Device Set Top Box Package W (Typ) x D (Typ) x H (Max) 5.0 mm x 5.0 mm x 1.0 mm UQFN040V5050 Typical Application Circuits Q10 Q11 Power Source Q20 VBUS Q21 Power Sink 9 (open) CC1 1.0 μF (open) 8 CC1 BD93F10MWV CC2 (Package: UQFN040V5050) 5.0 mm x 5.0 mm x 1.0 mm XCLPOFF2 ADCVREF U1 5 ADCVREF 1.0 μF 39 CSVR VSVR 1.0 μF 31 VS 34 35 S2_SRC S2_DRV S1_DRV 33 32 37 1.0 μF VDDIO XCLPOFF1 11 CS2S 10 μF VCONNIN 7 10 CC2 CVAD USB Type-C PD Receptacle CVB VB DSCHG 36 120 Ω S1_SRC RDSCHG CVIO CS1S 1.0 μF 3.3V / 5.0V VCCIN 20 SDA0 18 SCL0 19 GPIO0 21 GPIO1 22 GPIO2 23 RSDA RSCL 3.3 kΩ 3.3 kΩ (open) (open) HOST I/F GPIO5 26 GPIO9 30 GPIO4 25 GPIO8 29 GPIO3 24 RVD1 GPIO6 27 RVD2 GPIO7 28 RPD XRST 40 ADCVREF RVU1 RVU2 RPU 22 kΩ RIDD 100 kΩ CRST RAT1 100 kΩ CVCC CV38 4.7 μF 0.1 μF GND CSN CSP LDO15 CV15 12 13 4 LDO38 VCCIN 1 2 ATST2 (open) 3 GND ATST1 6 16 USB PHY GND t° D+/DRX1+/RX1RX2+/RX2TX1+/TX1TX2+/TX2- IDSEL GND RTHD 38 15 ADCIN 17 14 10 pF RTHU CS 0.1 μF 1.0 μF RS 10 mΩ GND GND ® ® “ARM Cortex “is a registered trademark of Arm Limited. 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 FW Revision ................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuits ............................................................................................................................................................. 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 4 Block Diagram ................................................................................................................................................................................ 5 Description of Block ........................................................................................................................................................................ 6 Absolute Maximum Ratings ............................................................................................................................................................ 7 Thermal Resistance ........................................................................................................................................................................ 7 Recommended Operating Conditions ............................................................................................................................................. 8 Internal Memory Cell Characteristic ................................................................................................................................................ 8 Electrical Characteristic .................................................................................................................................................................. 8 Timing Chart ................................................................................................................................................................................. 10 I/O Equivalence Circuits................................................................................................................................................................ 12 Operational Notes ......................................................................................................................................................................... 14 1. Reverse Connection of Power Supply ............................................................................................................................ 14 2. Power Supply Lines ........................................................................................................................................................ 14 3. Ground Voltage............................................................................................................................................................... 14 4. Ground Wiring Pattern .................................................................................................................................................... 14 5. Recommended Operating Conditions............................................................................................................................. 14 6. Inrush Current................................................................................................................................................................. 14 7. Testing on Application Boards ........................................................................................................................................ 14 8. Inter-pin Short and Mounting Errors ............................................................................................................................... 14 9. Unused Input Pins .......................................................................................................................................................... 14 10. Regarding the Input Pin of the IC ................................................................................................................................... 15 11. Ceramic Capacitor .......................................................................................................................................................... 15 12. Thermal Shutdown Circuit (TSD) .................................................................................................................................... 15 13. Over Current Protection Circuit (OCP) ........................................................................................................................... 15 Ordering Information ..................................................................................................................................................................... 16 Marking Diagram .......................................................................................................................................................................... 16 Physical Dimension and Packing Information ............................................................................................................................... 17 Revision History ............................................................................................................................................................................ 18 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Pin Configuration GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 (TOP VIEW) 30 29 28 27 26 25 24 23 22 21 VS 31 20 VDDIO S1_DRV 32 19 SCL0 S1_SRC 33 18 SDA0 S2_DRV 34 17 GND S2_SRC 35 16 ATST1 DISCHG 36 15 IDSEL VB 37 14 ADCIN GND 38 13 CSP VSVR 39 12 CSN 11 XCLPOFF2 EXP-PAD Pin 1 mark GND LDO15 ADCVREF www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6 7 8 9 3/18 10 CC2 5 VCONNIN 4 CC1 3 XCLPOFF1 2 ATST2 1 VCCIN 40 LDO38 XRST TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Pin Description Pin No. Pin Name 1 LDO38 Internal LDO 3.8 V 2 VCCIN Internal power supply (for internal use only) 3 GND 4 LDO15 5 ADCVREF 6 ATST2 7 XCLPOFF1 8 CC1 Function Ground Internal LDO 1.5 V Reference voltage for ADC Analog test pin. Short to GND. Disable clamper of CC1 L: Dead-battery not support, Open: Dead-battery support Configuration channel 1 for Type-C 9 VCONNIN 10 CC2 Input power for VCONN 11 XCLPOFF2 12 CSN Current sensing negative input 13 CSP Current sensing positive input 14 ADCIN Input voltage to ADC 15 IDSEL I2C Device ID Select 16 ATST1 Analog test pin. Short to GND. Configuration channel 2 for Type-C Disable clamper of CC2 L: Dead-battery not support, Open: Dead-battery support 17 GND Ground 18 SDA0 SMBus slave data 19 SCL0 SMBus slave clock 20 VDDIO GPIO H level voltage input 21 GPIO0 GPIO 22 GPIO1 GPIO 23 GPIO2 GPIO 24 GPIO3 GPIO 25 GPIO4 GPIO 26 GPIO5 GPIO 27 GPIO6 GPIO 28 GPIO7 GPIO 29 GPIO8 GPIO 30 GPIO9 GPIO 31 VS Source voltage monitor input 32 S1_DRV Power path FET gate control 33 S1_SRC Power path FET BG/SRC voltage 34 S2_DRV Power path FET gate control 35 S2_SRC Power path FET BG/SRC voltage 36 DISCHG Discharge NMOS drain (Max 28 V) 37 VB Power supply from VBUS 38 GND Ground 39 VSVR Power supply from 3.3 V / 5 V system voltage rail 40 XRST - EXP-PAD System reset signal input EXP-PAD connects with substrate of IC. On the board, this PAD shall be shorted to Ground or be open condition. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV VS GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 Block Diagram GPIOs VDDIO S1_DRV SCL0 S1_SRC OSC S2_DRV S2_SRC SDA0 GND Device Policy Manager Protocol Layer Policy Engine POWCNT ATST1 DSCHG ADC VB IDSEL ADCIN GND CSP VSVR CSN VREF BB_PHY CC_PHY www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/18 CC2 VCONNIN CC1 XCLPOFF1 ATST2 ADCVREF LDO15 GND VCCIN XCLPOFF2 LDO38 XRST TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Description of Block (VREF) VREF block is internal power source circuit of this LSI with the UVLO (Under Voltage Lock Out) function. The main power input is VSVR. And for supporting dead battery operation, VB can become power source of this LSI when VSVR does not exist. VREF block monitors VSVR and VB, and chooses an appropriate power supply by detecting normal condition or dead battery condition. From the voltage it chose, it generates VCCIN and LDO15 for internal circuits. (OSC) OSC block is reference clock circuit of this LSI. This LSI does not need another external clock source. (I/F Bus) I/F Bus block have I2C Slave for Host Control. The I2C Slave is intended to communicate with HOST MCU such as the EC. (Device Policy Manager) Device Policy Manager manages USB Type-C Power Delivery operation. It is constructed in internal MCU and program memory. It is accessible using Host IF Bus from external host MCU. And the writing access to program memory is possible from Host IF Bus. (Policy Engine / Protocol Layer) Policy Engine and Protocol Layer carry out USB Power Delivery operation. These blocks are constructed in internal MCU and the program memory in the same way as Device Policy Manager. (CC_PHY) CC_PHY block is a physical layer of USB Type-C. It supports the following function  Pull-down Resistor for Up Facing Port (UFP)  the CC1 pin and the CC2 pin clamper for dead battery  VBUS Detecting (BB_PHY) BB_PHY block is a physical layer of USB Power Delivery. By control from Protocol Layer, it performs coding, decoding and judgment of CRC and communicates Base Band PD signal. (POWCONT) POWCONT block is power path control circuit of VBUS. It has two gate drivers for Nch MOSFET switch, high withstand discharge switch for VBUS and over voltage protection (OVP). (ADC) ADC block is a general-purpose ADC. It is used for the monitoring of various operating states. Monitoring object is external input voltage for thermistor circuit, VBUS voltage, system Voltage, die temperature and source current www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Absolute Maximum Ratings (Ta = 25 °C) Parameter Supply Voltage [VSVR] Symbol Rating Unit VSVR -0.3 to +6.0 V VBUS Voltage [VB] VB -0.3 to +28 V I/O Voltage [VDDIO] VDDIO -0.3 to VSVR (or VB) V Maximum Junction Temperature Tjmax +150 °C Storage Temperature Range Tstg -55 to +150 °C S1_SRC, S2_SRC Voltage VSRC -0.3 to +22 V S1_DRV, S2_DRV Voltage VDRV -0.3 to (VSRC+6.0) V DSCHG, CC1, CC2, VS Voltage VHV -0.3 to +28 V LDO15, ADCVREF, ADCIN Voltage Differential Voltage Between CSN and CSP All Other Pins VLV -0.3 to +2.1 V VCS -0.2 to +0.2 V VOTH -0.3 to +6.0 V Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s (Note 3) 2s2p (Note 4) Unit UQFN040V5050 Junction to Ambient Junction to Top Characterization Parameter (Note 2) θJA 113.6 24.5 °C/W ΨJT 8 3 °C/W (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers (Note 5) Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Temperature Topr -30 +25 +85 °C Supply Voltage VSVR 3.1 3.3 5.5 V VBUS Voltage VB 3.67 - 22 V VDDIO Voltage VDDIO 1.7 3.3 5.5 V Internal Memory Cell Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V) Parameter Memory Data rewrite cycles Memory Data retention life (Note 6) (Note 7) Symbol Min Typ Max Unit Conditions Mrw 100 - - cycles Ta = -30 °C to 85 °C Mrl 20 - - years Ta = -30 °C to 85 °C (Note 6) BD93F10MWV cannot rewrite FW. ROHM cannot guarantee if FW is rewriting. (Note 7) Not 100% Tested Electrical Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Shutdown Current ISD - 30 70 μA Stop Current ISP - 150 - μA Standby Current IST - 2 - mA VCCIN - 3.3 - V V38 - 3.8 - V Conditions Current Consumption XRST=” L” VSVR Current USB-C Un-Attached VSVR Current The option function stops. USB-C Attached, PD Standby VSVR Current VREF VCCIN Voltage LDO38 Output Voltage LDO15 Output Voltage V15D - 1.5 - V VSVR UVLO release VDBSVR - - 3.10 V VB UVLO release VBUSDET - - 3.67 V VDDIO UVLO release VDBDDIO - 1.0 1.7 V Standby Standby VB = 5 V Standby Digital DC Characteristics (GPIOx: x = 2 to 9) Input “H” Voltage 1 VIH1 0.8 x VDDIO - 0 VDDIO+ 0.3 0.2 x VDDIO +5 Input “L” Voltage 1 VIL1 -0.3 - Input Leak Current 1 IIL1 Output “H” Voltage 1 VOH1 Output “L” Voltage 1 VOL1 -5 0.85 x VDDIO - μA - - V IL = +1 mA - 0.3 V IL = -1 mA IL = -3 mA V V Digital DC Characteristics (SDA0,SCL1) Output “L” Voltage 2 VOL3 - - 0.4 V SCL Frequency fSCL 0 - 400 kHz RRD 4.6 5.1 5.6 kΩ CC_PHY Pull-Down Resistor www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Electrical Characteristic - continued Parameter Symbol Min Typ Max Unit Conditions ADVREF Voltage VADC 1.45 1.5 1.55 V VB/VS Voltage Measurement Range External Input Voltage Measurement Range POWCNT Output Voltage between S1_DRV and S1_SRC or S2_DRV and S2_SRC Discharge Switch on Resistance VRV 0 - 28 V VRIN 0 - 1.5 V VOSW 4.4 5.5 6.6 V Sx_SRC = 5.0 V (x = 1 or 2) RDSC - 2.0 - Ω DSCHG = 0.2 V ACOVP -5 - +5 % OVP Detecting Voltage = 6.0 V Voltage Measurement OVP Detecting Voltage Accuracy www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Timing Chart (Normal Wakeup) 3.3V VSVR 0V 5V VB 0V t1 VDDIO 0V VCONNIN 0V LDO38 (Internal) 0V 1.5V LDO15 (Internal) 0V CC1 or CC2 (Pull Down) LSI Operation Hi-Z Shutdown Pull Down Enable HW Standby Initialization t2 Active(Type-C) According to USB Type-C Specification Timing Characteristic (Ta = 25 °C) Symbol Min Typ Max Unit VDDIO Input Timing from VSVR Input Parameter t1 0 - - ms LSI Wakeup Time t2 - - 100 ms www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/18 Conditions Not emergency operating. I2C (slave) is disable. TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Timing Chart - Continued (Normal Shutdown) t3 3.3V VSVR 0.5V 0V 5V VB 3.3V t4 VDDIO 0.5V 0V VCONNIN 0V LDO38 (Internal) 0V 1.5V LDO15 (Internal) CC1 or CC2 (Pull Down) 0V Pull Down Enable Hi-Z Timing Characteristic (Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions VSVR Falling Time t3 400 ms As for the timing of t4, it is arbitrary. But LSI may not maintain action of USB Type-C PD when it is lost during LSI action. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV I/O Equivalence Circuits PIN No. Pin Name Equivalent Circuit Diagram VB Pin 1 LDO38 GND GND GND VCCIN 4 5 Pin LDO15 ADCVREF GND GND GND GND GND GND GND Pin 7 11 XLCPOFF1 XCLPOFF2 GND Pin 8 10 CC1 CC2 GND VCCIN 12 13 Pin CSN CSP GND Pin ADCVREF 14 ADCIN GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV I/O Equivalence Circuits - Continued Pin No. Pin Name Equivalent Circuit Diagram VCCIN Pin 15 IDSEL GND 18 19 21 22 23 24 25 26 27 28 29 30 GND VDDIO SDA0 SCL0 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 Pin GND GND Pin 32 34 S1_DRV S2_DRV Sx_SRC Sx_DRV Pin 33 35 S1_SRC S2_SRC GND Pin 31 36 VS DSCHG GND VCCIN Pin 40 XRST GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 1. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Ordering Information B D 9 3 F 1 Part Number 0 M W V Package MWV: UQFN040V5050 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram UQFN040V5050 (TOP VIEW) Part Number Marking D93F10 LOT Number Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 UQFN040V5050 17/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 BD93F10MWV Revision History Date Revision 02, Apr.2020 001 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes New Release 18/18 TSZ02201-0Q3Q0H507800-1-2 02.Apr.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001