Datasheet
LED Drivers for LCD Backlights
PFC Direct Current Resonance Type
White LED Driver for Large LCD
BD94122F
General Description
Key Specifications
BD94122F is a current resonance type LED Driver, which
can connect to PFC directly. LED current is controlled by
driving output frequency. Because this IC can use half
bridge structure, it can reduce the number of external
components.
BD94122F has some protection functions against fault
conditions such as Over Voltage Protection(OVP), LED
Short Protection(LSP) and LED Open Protection
Detection(LOP).
Power Supply Voltage Range:
Output Driving Frequency
(Minimum Frequency Setting):
Circuit Current:
Operating Temperature Range:
Package
VCC: 9.0V to 18.0V
60kHz(RRT=68kΩ)
5.0mA(Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
11.20mm x 7.80mm x 2.01mm
SOP18
Features
1 Channel Push Pull Control
Current Feedback by Driving Frequency Resolution
Timer Latch Circuit
Under Voltage Detection for IC’s Power Line (VCC
UVLO)
Output Over Voltage Protection
Driving Output Frequency (Minimum Frequency
Setting) Tolerance: ±5%
Error Signal Output from FAIL Pin
Control IC Power On and Off by STB Pin
Burst Control by External PWM
Analog Dimming by External DC
Pulse/DC Conversion Function for ADIM
Applications
TV, Computer Display, LCD Backlighting
Typical Application Circuit
PVIN
RN12
LED1P
CSTB
〇Product structure: Silicon monolithic integrated circuit
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RVOM11
RVOM21
RVOM22
CVOM1
RSTB2
RIS1
CADIM
RFAIL
LED2N
CFAIL
RSTB1
CLSPSET
RLSPSET1
CVCC
RLSPSET2
RVCC
RVOM12
CVOM2
RSSFB CSSFB
RRT
CSOFTON
DN2
DN1
CN12
LED2P
CIS
LED1N
RIS
〇This product has no designed protection against radioactive rays
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BD94122F
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Pin Function Descriptions ............................................................................................................................................................... 5
Detection Condition List of the Protection Functions ...................................................................................................................... 8
Operation List of the Protection Function ........................................................................................................................................ 8
Absolute Maximum Ratings ............................................................................................................................................................ 9
Thermal Resistance ........................................................................................................................................................................ 9
Recommended Operating Conditions ........................................................................................................................................... 10
External Components Recommended Ranges ............................................................................................................................. 10
Electrical Characteristics............................................................................................................................................................... 11
Typical Performance Curves ......................................................................................................................................................... 13
Timing Chart ................................................................................................................................................................................. 14
Application Example ..................................................................................................................................................................... 18
I/O Equivalence Circuits................................................................................................................................................................ 19
Operational Notes ......................................................................................................................................................................... 20
Ordering Information ..................................................................................................................................................................... 22
Marking Diagram .......................................................................................................................................................................... 22
Physical Dimension and Packing Information ............................................................................................................................... 23
Revision History ............................................................................................................................................................................ 24
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BD94122F
Pin Configuration
(TOP VIEW)
NC
SSFB
VOM2
VOM1
PDIM
PWM2DC
ADIM
IS
1
2
3
4
5
6
7
8
9
SOFTON
RT
10
FAIL
11
LSPSET
12
PGND
13
GND
14
N2
15
STB
16
N1
17
VCC
18
Pin Description
Pin No.
Pin Name
IN/OUT
1
VCC
IN
Power supply for IC (built in UVLO function).
2
STB
IN
Power ON/OFF control for IC (STB=L: Power OFF, STB=H: Power ON).
3
GND
IN
Ground for internal signal in IC.
4
LSPSET
IN
LED short protection voltage setting.
5
FAIL
OUT
6
PDIM
IN
7
PWM2DC
IN
8
ADIM
IN/OUT
9
IS
IN
10
VOM1
IN
11
VOM2
IN
12
SSFB
OUT
13
NC
-
14
RT
OUT
15
SOFTON
OUT
16
PGND
IN
17
N2
OUT
Gate drive output for low side external FET.
18
N1
OUT
Gate drive output for high side external FET.
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Function
Error signal output (Normal: L, Error: Open).
PWM signal input for burst dimming.
Pulse/DC converting.
Pulse signal is translated to flat by 100kΩ resistor in IC and the capacitor connected
to ADIM.
DC signal output of Pulse/DC converting and DC signal input for analog dimming.
Error amplifier input for LED current feedback. IS Low detection and IS High
detection input.
Channel 1 over voltage protection and LED short protection.
Channel 2 over voltage protection and LED short protection.
Set phase compensation of feedback loop.
When VSSFB is 3.5V or more, LED OPEN protection and LED SHORT protection are
enable.
When VSSSB is 4.0V or more, SSFB MAX protection is enable.
No Connection(Open).
Minimum driving frequency and dead time setting.
Basic frequency and dead time are set by the resistor between RT and GND, and
driving frequency modulation range is set by RT resistor.
Soft on. When PDIM is set from high to low (or from low to high), a driving frequency
changes from normal to maximum (or maximum to normal), the frequency changing
speed can be adjusted by SOFTON capacitor setting.
Power ground for N1 and N2 drivers.
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BD94122F
VOM2
VCC
VOM1
Block Diagram
+
VCCUVLO
LSP1
+
LSP2
STB
+
OVP1
+
OVP2
+
System
ON/OFF
STB
LSPSET
+
-
GND
Protection
LOGIC
FAIL
Timer
VCC
LEDOCP
N1
PGND
SSFBMAX
+
-
IS
ADIM
VCC
N2
PGND
Error Amp
PWM2DC
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RT
SOFTON
SSFB
OSC
4/24
Control
LOGIC
PGND
PDIM
ADIM
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BD94122F
Pin Function Descriptions
If there is no description, the mentioned values are typical value.
PIN 1: VCC
This is power supply pin for the IC. Normal operation range is from 9V to 18V. Place ceramic capacitor 0.1µF or more as
bypass capacitor between VCC and GND. It is for noise elimination.
PIN 2: STB
This pin is for setting of ON/OFF. It is possible to use as reset when shutting down. Depending on input voltage to the STB
pin, the status of IC might be switched(ON/OFF). Avoid using between the two statuses (0.8V to 2.0V).
PIN 3: GND
This is signal system GND for IC inside. Make it independent from PGND as much as possible. (We recommend this
because it has less influence with switching noise which comes from short circuit of PGND and GND at connector close to
the GND pin.)
VIN
GND
IC
PGND
N1
Connecter
GND
Figure 1. Connection Method between GND and PGND
PIN 4: LSPSET
LED short protection voltage setting pin. 32CLK timer will be started if VOM1 or VOM2 pin’s voltage is under LSPSET pin’s
voltage after IS reaches to setting voltage or SSFB reaches to 3.5V at the first time while PDIM=H. If VOM1 voltage exceeds
LSPSET voltage within 32CLK or PDIM become Low, the timer will be re-set. After time out, system will stop N1, N2,
discharge SSFB, pull-up FAIL and latch off.
PIN 5: FAIL
This is error signal output pin of IC. At normal situation, it outputs GND level and it becomes open after timer latch in case
any abnormality is detected. The pull-up voltage during open must be set less than rated voltage 18V of the FAIL pin.
Connect about 0.1µF capacitor for noise reduction to the FAIL pin.
Condition
FAIL Output
Normal Operation
GND Level
Abnormal Operation
Open
FAIL
Figure 2. FAIL Block Diagram
PIN 6: PDIM
By inputting PWM pulse signal at the PDIM pin, it is possible to adjust burst dimming. (High level: 1.8V or more, Low level:
0.8V or less).
Condition
LED Condition
PDIM: 1.8V to 5.0V
Turn On
PDIM: -0.3V to +0.8V
Turn Off
Avoid using between the two statuses (0.8V < VPDIM < 1.8V).
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Pin Function Descriptions - continued
If there is no description, the mentioned values are typical value.
PIN 7: PWM2DC, PIN 8: ADIM
Pulse signal inputs to PWM2DC pin and IC can average it by IC internal 100kΩ and the capacitor connected to ADIM pin
(This means pulse to DC signal transfer circuit.). At this time, ADIM ripple is changed by ADIM’s capacitance, therefore
please set suitable capacitance according to set specification. While the PWM2DC pin is forced 8.5V or more, a buffer
output in the IC becomes high impedance and the ADIM pin is enable to input DC voltage directly. According to PWM2DC
input level, each pin’s function is changed as the followings. Pulse/DC translation circuit is shown in Pulse/DC Transfer
Block Diagram.
PWM2DC Input Level
PWM2DC Function
ADIM Function
Pulse Signal Input
for Analog Dimming
Mask Pulse/DC
8.5V ≤ VPWM2DC ≤ 18.0V
Translation Function
Avoid using between the two statuses (6.5V < VPWM2DC < 8.5V).
-0.3V ≤ VPWM2DC ≤ +6.5V
DC Signal Output
for Analog Dimming
DC Signal Input
for Analog Dimming
Needed Signal
from External
DUTY Signal
for Analog Dimming
DC Signal
for Analog Dimming
The voltage that ADIM voltage multiplies by (1/2.75) becomes IS threshold voltage and it has linear characteristic. But,
ADIM voltage becomes 0.55V or less, IS threshold voltage is clamped at 0.55V/2.75=0.2V. And ADIM becomes 2.2V or
more, IS threshold voltage is clamped at 2.2V/2.75=0.8V. When IS threshold voltage is used for linear characteristic, set
0.6V≤VADIM≤2.1V.
IS
IS High Detect
PWM2DC
1.5V
Pulse
signal
0.8V
8.0V/7.0V
IS threshold
Gain=1/2.75
2.2V
ADIM
0.4V
RADIM
100k
Gain=VADIM/5.5
IS Low Detect
0.2V
0.1V
CADIM
ADIM
0.55V
2.2V
Figure 3. IS Threshold Voltage vs ADIM Voltage
Figure 4. Pulse/DC Transfer Block Diagram
PIN 9: IS
This is input pin of LED current feedback error amplifier. Set the IS pin to (ADIM/2.75V) in the normal operation. And the IS
pin has IS Low detect and IS High detect. IS Low detect works as LED open protection. IS Low detection voltage is changed
following with ADIM voltage (Refer to the Figure 3. IS Threshold Voltage vs ADIM Voltage). IS High detect works as LED
OCP. About each detection voltage and condition, refer to the Detection Condition List of the Protection Functions.
PIN 10: VOM1
The VOM1 pin is an input pin for channel 1 over voltage protection and LED short protection. If over voltage is detected,
N1 and N2 outputs are stopped and a timer will start counting at the same time. If VOM1 voltage is lower than over voltage
release threshold, N1 and N2 will restart to output. If over voltage is detected and released 3 times within 4096CLK, system
will stop N1 and N2, discharge SSFB, pull-up FAIL and latch off. If over-voltage is detected and released less than 3 times
within 4096CLK, system will not discharge SSFB, will not pull-up FAIL, and will not latch off. Timer counter will be reset at
4096CLK counting. When the LED short protection(LSP) function is activated, the LLC converter will stop operation and
latch off after 32CLK. The VOM1 pin is the high impedance type and involves no pull-down resistor, resulting in unstable
potential in the open circuited state. To avoid this problem, be sure to make input voltage setting with the use of a resistive
divider.
PIN 11: VOM2
The VOM2 pin is an input pin for channel 2 over voltage protection and LED short protection. The function is same to the
VOM1 pin.
PIN 12: SSFB
The SSFB pin is a phase compensation pin of the feedback loop. When the SSFB pin voltage is 3.5V or more, LED Open
Protection(LOP) can be detected. When the SSFB pin voltage is 3.5V or more or IS voltage reach to ADIM/2.75 at the first
time after system start up, LED Short Protection(LSP) can be detected. After the first time, even if the SSFB pin voltage is
lower than 3.5V or IS voltage do not reach to ADIM/2.75, LSP still can be detected. When the SSFB pin voltage is higher
than 3.5V, or IS voltage reach to setting voltage(ADIM/2.75), start up stage is completed. When start up state is under
operation (the SSFB pin voltage is less than 3.5V or IS voltage do not reach to setting voltage at first time), LSP timer
counter latch protection circuit will not operate. But OVP timer counter latch protection circuit can still operate.
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PIN 12: SSFB - continued
If there is no description, the mentioned values are typical value.
When the SSFB pin voltage is 4.0V or more, SSFB MAX Protection (SSFB MAX) can be detected. When SSFB MAX is
detected, a timer will start counting at the same time. When SSFB voltage is 3.5V or less, SSFB MAX is released. When
SSFB MAX is detected 3 times within 4096CLK, system will stop N1 and N2, discharge the SSFB pin, pull-up the FAIL pin
and latch off. When SSFB MAX is detected less than 3 times within 4096CLK, system will not discharge the SSFB pin, will
not pull up the FAIL pin, and will not latch off. Timer will be reset at 4096CLK counting.
PIN 13: NC
NC is no connection pin. Set this pin as open.
PIN 14: RT
Set up the minimum driving frequency. By changing the resistance value between the RT pin and GND, it is possible to set
up minimum driving frequency as following formula;
𝑓𝑀𝐼𝑁 =
4080
𝑅𝑅𝑇
𝑓𝑀𝐼𝑁 = 𝑅
4374
𝑅𝑇 +1.75
[kHz]
(𝑓𝑀𝐼𝑁
≤ 168𝑘𝐻𝑧)
[kHz]
(𝑓𝑀𝐼𝑁
> 168𝑘𝐻𝑧)
Once minimum driving frequency is decided, maximum driving frequency is also decided. As following formula;
𝑓𝑀𝐴𝑋 = 4.491 × 𝑓𝑀𝐼𝑁 [kHz]
6×𝑓
𝑀𝐼𝑁
𝑓𝑀𝐴𝑋 = 1+0.002+𝑓
[kHz]
𝑀𝐼𝑁
(𝑓𝑀𝐼𝑁
≤ 168𝑘𝐻𝑧)
(𝑓𝑀𝐼𝑁
> 168𝑘𝐻𝑧)
There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly verify it
with actual application. If minimum driving frequency is decided, Dead Time is also decided as the following formula;
𝑡𝑂𝐹𝐹 = 8.2353 × 𝑅𝑅𝑇 =
𝑡𝑂𝐹𝐹 = 200
33600
𝑓𝑀𝐼𝑁
[ns]
(𝑓𝑀𝐼𝑁
≤ 168𝑘𝐻𝑧)
[ns]
(𝑓𝑀𝐼𝑁
> 168𝑘𝐻𝑧)
10,000
Oscillation frequency recommended range
Output Frequency : f MIN,f MAX [kHz]
fMAX
fMIN
100
N1 to N2 , N2 to N1 Dead Time : tOFF [ns]
1,000
RT resistance recommended range
1,000
100
10
10
100
1,000
10
100
1,000
RT Connection Resistance : RRT [kΩ]
RT Connection Resistance : RRT [kΩ]
Figure 5. Output Frequency vs RT Connection Resistance
Figure 6. N1 to N2, N2 to N1 Dead Time vs
RT Connection Resistance
PIN 15: SOFTON
This is soft ON/OFF time set up pin when PWM logic is changed. A capacitor (0.01µF to 0.1µF) is connected to SOFTON
pin to decide soft ON/OFF time.
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BD94122F
PIN 15: SOFTON - continued
If there is no description, the mentioned values are typical value.
𝑡𝑆𝑂𝐹𝑇𝑂𝑁 = 0.633 × 𝐶𝑆𝑂𝐹𝑇𝑂𝑁 × 𝐼
𝑉𝑆𝑆𝐹𝐵
𝑆𝑂𝐹𝑇𝑂𝑁
= 0.633 ×
𝐶𝑆𝑂𝐹𝑇𝑂𝑁 ×𝑉𝑆𝑆𝐹𝐵
[s]
1.0×10−4
VSSFB is SSFB pin’s voltage. It is decided by system feedback loop.
PIN 16: PGND
This is Power GND pin for output pin N1 and N2 at driver part. Make it independent from the GND pin (Pin 3) on PCB. This
pin is not connected to GND pin in IC inside.
PIN 17: N2
This is gate drive output pin for Low Side external FET. Normally connect it to the FET gate through about 10Ω resistor.
Internal has 100Ω pull down resistor for noise reduction when STB=L.
PIN 18: N1
This is gate drive output pin for High Side external FET. Normally connect it to the FET gate through about 10Ω resistor.
Internal has 100Ω pull down resistor for noise reduction when STB=L.
Detection Condition List of the Protection Functions
If there is no description, the mentioned values are typical value.
Detect Condition
Protect
Detection
Detection
Pin
Function
pin
SSFB
Condition
VIS ≤ 0.1V
and
VADIM < 0.55V
LED OPEN
VIS ≤ VADIM/5.5
(IS Low
IS
and
VSSFB ≥ 3.5V
Detect)
0.55V ≤ VADIM ≤ 2.2V
VIS ≤ 0.4V
and
VADIM > 2.2V
(PDIM=H
and
VSSFB ≥ 3.5V)
VOM1
LED SHORT
VVOMx ≤ VLSPSET
or
VOM2
(PDIM=H
And
LEDOK=H)
LED OCP
(IS High
IS
VIS ≥ 1.5V
Detect)
Timer
Operation
Protection
Type
16CLK
Latch Off
VVOMx > VLSPSET
32CLK
Latch Off
VIS ≤ 1.3V
16CLK
Latch Off
Release Condition
VIS > 0.1V
and
VADIM < 0.55V
VIS > VADIM/5.5
and
0.55V ≤ VADIM ≤ 2.2V
VIS > 0.4V
and
VADIM > 2.2V
OVP
VOM1
VOM2
VVOMx ≥ 3.0V
-
VVOMx ≤ 2.9V
3 times
within
4096CLK
Latch Off
VCC UVLO
VCC
VCC ≤ 7.5V
-
VCC ≥ 8.0V
-
Restart by
Release
SSFB MAX
SSFB
-
VSSFB ≥ 4.0V
VSSFB ≤ 3.5V
3 times
within
4096CLK
Latch Off
In order to reset the latch off condition, to set the STB pin to low or detection of VCCUVLO is required. The count number in the list is calculated with output
driving frequency.
Operation List of the Protection Function
Protect Function
Operation of the Protect Function
N1, N2 Output
SSFB Pin
FAIL Output
LED OPEN
Stop after latch
Low after latch
High after latch
LED SHORT
Stop after latch
Low after latch
High after latch
LED OCP
Stop after latch
Low after latch
High after latch
OVP
Stop immediately
Low after latch
High after latch
VCC UVLO
Stop immediately
Low immediately
High immediately
SSFB MAX
Stop after latch
Low after latch
High after latch
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BD94122F
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
STB, PWM2DC, N2, N1, LSPSET, FAIL,
PDIM, ADIM, VOM1, VOM2 Pin Voltage
RT, SSFB, IS, SOFTON Pin Voltage
VCC
VSTB, VPWM2DC, VN2, VN1, VLSPSET,
VFAIL, VPDIM, VADIM, VVOM1, VVOM2
VRT, VSSFB, VIS, VSOFTON
-0.3 to +18
V
-0.3 to +18
V
-0.3 to +5.5
V
Tjmax
150
°C
Tstg
-55 to +150
°C
Maximum Junction Temperature
Storage Temperature Range
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
179.3
119.9
°C/W
ΨJT
20
17
°C/W
SOP18
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
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BD94122F
Recommended Operating Conditions
Parameter
Operating Temperature
Power Supply Voltage
Symbol
Min
Typ
Max
Unit
Topr
-40
-
+85
°C
VCC
9.0
-
18.0
V
PDIM Input Frequency Range
fPWMIN
60
-
500
Hz
Oscillation Frequency Range
fOUT
30
-
300
kHz
fPWM2DC
0.09
-
30.00
kHz
VADIM
0
-
5
V
VADIMLIN
0.6
-
2.1
V
Symbol
Min
Typ
Max
Unit
RRT
20
-
200
kΩ
CSOFTON
0.01(Note 5)
-
0.10
µF
CADIM
0.22(Note 5)
-
10.00
µF
CSSFB
0.01(Note 5)
-
1.00
µF
PWM2DC Input Frequency Range
ADIM Input Voltage Range
ADIM Range with Linearity IS
External Components Recommended Ranges
Parameter
RT Connection Resistance
SOFTON Connection Capacitance
ADIM Connection Capacitance
SSFB Connection Capacitance
(Note 5) Please set connection capacitance above minimum value of External Components Recommended Ranges according to temperature characteristic and
DC bias characteristic.
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BD94122F
Electrical Characteristics(Unless otherwise specified VCC=12V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit Current
ICC1
-
5.0
10.0
mA
fOUT=60kHz, VPDIM=3V
Circuit Current at Stand by
ICC2
-
1.5
20.0
µA
VSTB=0V
Whole Device
STB Control
STB High Voltage
VSTH
2.0
-
VCC
V
System ON
STB Low Voltage
VSTL
-0.3
-
+0.8
V
System OFF
VVCCUVP
7.5
8.0
8.5
V
VCC Sweep Up
ΔVVCCUVP
0.37
0.50
0.63
V
VRT
2.5
3.1
3.7
V
PDIM High Voltage
VPWMINH
1.8
-
5.0
V
PDIM Low Voltage
VPWMINL
-0.3
-
+0.8
V
VSTEND
3.20
3.50
3.80
V
IS Threshold Voltage 1
VIS1
0.746
0.764
0.782
V
VADIM=2.1V, VPWM2DC=12V
IS Threshold Voltage 2
VIS2
0.382
0.400
0.418
V
VADIM=1.1V, VPWM2DC=12V
IS Threshold Voltage 3
VIS3
0.203
0.227
0.251
V
SSFB Source Current
ISSFBSO
-120
-100
-80
µA
SSFB Sink Current
ISSFBSI
80
100
120
µA
SOFTON Charge Current
ISFTONC
-120
-100
-80
µA
VADIM=0.625V, VPWM2DC=12V
VSSFB=2.0V, VADIM=5.0V,
VIS=0.0V
VSSFB=2.0V, VADIM=0.0V,
VIS=1.2V
VSSFB=3.0V, VSOFTON=2.0V
SOFTON Discharge Current
ISFTOND
80
100
120
µA
IS Low Detection Voltage
VISLOW
0.040
0.100
0.160
V
IS High Detection Voltage
VISHIGH
1.35
1.50
1.65
V
VSSFB=1.0V, VSOFTON=2.0V
IS Sweep Down
VADIM=0.5V
IS Sweep Up
VOVP
2.85
3.00
3.15
V
VOM1,VOM2 Sweep Up
VOVP_HYS
50
100
200
mV
VSSFBMAX
3.8
4.00
4.2
V
VSSFBMAXHYS
250
500
1000
mV
VCC UVLO
VCC Operation Start Voltage
VCC UVLO Hysteresis
OSC
RT Pin Voltage
PDIM
Start
Start Ended Voltage
Feedback
OVP
OVP Detection Voltage
OVP Detection Hysteresis
VOM1,VOM2 Sweep Down
SSFB MAX
SSFB MAX Detection Voltage
SSFB MAX Detection Hysteresis
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BD94122F
Electrical Characteristics(Unless otherwise specified VCC=12V Ta=25°C) - continued
Parameter
Symbol
Min
Typ
Max
Unit
N1 Output Sink Resistance
RN1SI
1.5
N1 Output Source Resistance
RN1SO
4.5
N1 Pull-Down Resistance
RN1PD
N2 Output Sink Resistance
N2 Output Source Resistance
N2 Pull-Down Resistance
Conditions
3.0
6.0
Ω
9.0
18.0
Ω
50
100
200
Ω
RN2SI
1.5
3.0
6.0
Ω
RN2SO
4.5
9.0
18.0
Ω
RN2PD
50
100
200
Ω
STB=L
tOFF
280
560
1120
ns
VSSFB=4.0V, RRT=68kΩ
tOFFMIN
100
200
400
ns
fOUTMIN
57.0
60.0
63.0
kHz
NOVP
-
4096
-
CLK
IADIM1
-5
0
+5
µA
VADIM=2.2V, VPWM2DC=12V
OUTPUT
N1 to N2, N2 to N1 Dead Time
N1to N2, N2 to N1 Minimum Dead
Time
Driving Output Frequency
(Minimum Frequency Setting)
Timer
OVP Timer Number
STB=L
VSSFB=4.0V, RRT=68kΩ
ADIM
ADIM Inflow Current 1
IADIM2
19
28
37
µA
VADIM=5V, VPWM2DC=12V
PWM2DC Inflow Current
IPWM2DC
4
6
8
µA
VPWM2DC=3V
PWM2DC High Voltage
VPWM2DCH
1.8
-
5.0
V
PWM2DC Low Voltage
PWM2DC Selected Voltage to High
Impedance
FAIL
VPWM2DCL
-0.3
-
+0.8
V
VPWM2DCZ
7.5
8.0
8.5
V
RFAIL
-
100
200
Ω
ADIM Inflow Current 2
FAIL ON Resistance
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BD94122F
Typical Performance Curves
10
70
Ta=25°C
8
Circuit Current: ICC [mA]
Driving Output Frequency: fOUTMIN [kHz]
9
7
6
5
4
3
2
1
0
8
10
12
14
16
68
64
62
60
58
56
54
52
50
-40
18
-20
0
20
40
60
80
100
Temperature: Ta[°C]
Supply Voltage: VCC [V]
Figure 7. Circuit Current vs Supply Voltage
Figure 8. Driving Output Frequency vs Temperature
1000
1.0
VCC=12V
RRT=68kΩ
VSSFB=4.0V
900
800
0.9
VCC=12V
Ta=25°C
0.8
700
IS Voltage: VIS [V]
N1 to N2,N2 to N1 Dead Time: tOFF [ns]
VCC=12V
RRT=68kΩ
VSSFB=4.0V
66
600
500
400
300
0.7
0.6
0.5
0.4
0.3
200
0.2
100
0.1
0
0.0
-60
-30
0
30
60
90
120
150
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Temperature: Ta [°C]
ADIM Voltage: VADIM [V]
Figure 9. N1 to N2,N2 to N1 Dead Time vs Temperature
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Figure 10. IS voltage vs ADIM Voltage
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BD94122F
Timing Chart
If there is no description, the mentioned values are typical value.
OVP and LED SHORT Protection(LSP)
2.0V
STB
1.8V
PDIM
SSFB
3.5V
LEDOK
(Internal Node)
VADIM/2.75
IS
OVP
VOM1,VOM2
LSP
3.0V
2.9V
VLSPSET
12
1 2 3
N1,N2
4096CLK
Timer
4096CLK
32CLK
32CLK
FAIL
1
2
not Latch Off
Latch Off
Latch Release
3
4
not Latch Off
Latch Off
Figure 11. Timing Chart 1
LEDOK signal is internal signal that latches to high while IS voltage becomes ADIM/2.75.
No.
Error Detect Content
Error Detect Condition
1
OVP detection (not Latch Off)
Detect VVOMx ≥ 3.0V less than 3times in 4096CLK
2
OVP detection (Latch Off)
Detect VVOMx ≥ 3.0V 3times in 4096CLK
3
LSP detection (not Latch Off)
Return to VVOMx ≥ VLSPSET in less than 32CLK
4
LSP detection (Latch Off)
Detect VVOMx ≤ VLSPSET in 32CLK
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BD94122F
Timing Chart - continued
If there is no description, the mentioned values are typical value.
LED OPEN Protection(LOP) and LED OCP
2.0V
STB
PDIM
1.8V
LOP
LED OCP
1.5V
1.33V
ADIM/2.75
IS
ADIM/5.5
LEDOK
(Internal Node)
SSFB
3.5V
N1,N2
16CLK
Timer
16CLK
16CLK
16CLK
FAIL
5
7
6
Latch Off Latch Release
not Latch Off
8
not Latch Off Latch Off
Figure 12. Timing Chart 2
Detection voltage of LED open protection in this timing chart is the condition of 0.55V≤VADIM≤2.2V. Detection voltage of
LED open protection is changed by ADIM voltage setting (Refer to the Detection Condition List of the Protection
Functions.).
LEDOK signal is internal signal that latches to high while IS voltage becomes ADIM/2.75.
No.
Error Detect Content
Error Detect Condition
5
LOP detection (not Latch Off)
Return to VIS > VADIM/5.5 in less than 16CLK
6
LOP detection (Latch Off)
Detect VIS ≤ VADIM/5.5 and VSSFB ≥ 3.5V in 16CLK
7
LED OCP detection (not Latch Off)
Return to VIS ≤ 1.3V in less than 16CLK
8
LED OCP detection (latch Off)
Detect VIS ≥ 1.5V in 16CLK
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BD94122F
Timing Chart - continued
If there is no description, the mentioned values are typical value.
SSFB MAX Protection
2.0V
STB
1.8V
PDIM
VADIM/2.75
IS
SSFB
4.0V
3.5V
3.33V
12
1 2 3
N1,N2
4096CLK
Timer
4096CLK
FAIL
9
10
not Latch Off
Latch Off
Figure 13. Timing Chart 3
No.
Error Detect Content
Error Detect Condition
9
SSFB MAX detection (not Latch Off)
Detect VSSFB ≥ 4.0V less than 3times in 4096CLK
10
SSFB MAX detection (Latch Off)
Detect VSSFB ≥ 4.0V 3times in 4096CLK
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BD94122F
Timing Chart - continued
If there is no description, the mentioned values are typical value.
Output Timing Chart
BD94122F outputs the signal that operates the Push Pull or Half Bridge which is made up of Nch FET.
The output timing of drive signal is shown in the following chart.
PDIM
SSFB
SOFTON
VSOFTON=0.5×VSSFB
VSOFTON=0.458×VSSFB
SSFBCOMP (Internal Node)
CT
(Internal Node)
VCC
N1
VCC
N2
12 3 4
5
678
Figure 14. Timing Chart 4
CT is internal signal of an oscillator based on N1 and N2 driving frequency.
SSFBCOMP is internal signal that is enable to output N1 and N2 when VSOFTON becomes 0.5 x VSSFB.
1.
2.
3.
4.
5.
6.
7.
8.
When PDIM is changed from Low to High, SOFTON voltage is increased.
When VSOFTON is 0.5 x VSSFB, SSFBCOMP is changed from Low to High and N1 and N2 outputs are enable.
N1 outputs pulse first.
And then N2 outputs pulse. When SOFTON voltage shifts from 0.5 x VSSFB to SSFB voltage, N1 and N2 driving
frequency shifts from maximum to normal.
When PDIM is changed from High to Low, SOFTON voltage is decreased. When SOFTON voltage shifts from SSFB
voltage to 0.458 x VSSFB, N1 and N2 driving frequency shifts from normal to maximum.
When VSOFTON is 0.458 x VSSFB, SSFBCOMP is changed from High to Low.
After N1 outputs a pulse decided by the level of the SOFTON pin, N1 stops output.
After N2 outputs a pulse decided by the level of the SOFTON pin, N2 stops output.
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BD94122F
Application Example
1Ω
LED1N
LED2N
RIS
RVOM21
RVOM12 7.5kΩ
CVOM2 1000pF
540kΩ
RVOM11
CVOM11000pF
CIS
1kΩ
1000pF
RIS1
LED2P
540kΩ
RVOM22 7.5kΩ
LED1P
Introduce an application example with BD94122F.
1µF
CADIM
33nF
1kΩ
RSSFB CSSFB
CFAIL
4700pF
68kΩ
RFAIL
RRT
47kΩ
CLSPSET
10kΩ RLSPSET1
RLSPSET2 33kΩ
22nF
CSOFTON
1000pF
PVIN
DN2
RSTB2
RSTB1
CVCC
RVCC
CSTB
CN12
10
DN1
RN12
1µF
(Note 5) LED dimming setting is decided by ADIM voltage setting and PWM Duty setting, but actual
lowest dimming value is depended on application’s responsibility, so check set’s behavior and
then decide each setting.
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BD94122F
I/O Equivalence Circuits
Pin1: VCC / Pin3: GND
Pin2: STB
Pin4: LSPSET
REF
REF
300kΩ
150kΩ
STB
VCC
300kΩ
Internal
Block
100kΩ
LSPSET
GND
GND
GND
GND
225kΩ
GND
GND
Pin5: FAIL
GND
GND
Pin6: PDIM
GND
Pin7: PWM2DC
VCC
REF
REF
50Ω
FAIL
100kΩ
PDIM
400kΩ
100kΩ
PWM2DC
100kΩ
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin8: ADIM
Pin9: IS
Pin10: VOM1
2.2V
REF
REF
REF
REF
REF
REF
REF
100kΩ
10kΩ
100kΩ
GND
100kΩ
ADIM
VOM1
IS
GND
10kΩ
GND
GND
10kΩ
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin11: VOM2
Pin12: SSFB
REF
Pin13: NC
REF
500Ω
100kΩ
VOM2
20kΩ
―
10Ω
SSFB
2kΩ
GND
GND
GND
GND
GND
GND
Pin14: RT
Pin15: SOFTON
Pin16: PGND / Pin17: N2 / Pin18: N1
REF
REF
REF
VCC
20kΩ
20kΩ
RT
300Ω
10Ω
SOFTON
4kΩ
2kΩ
200Ω
100Ω
PGND
4pF
GND
GND
GND
GND
N1 / N2
GND
GND
GND
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BD94122F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage
below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD94122F
Operational Notes - continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 15. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD94122F
Ordering Information
B
D
9
4
1
Part Number
2
2
F
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Package
F: SOP18
Marking Diagram
SOP18 (TOP VIEW)
Part Number Marking
BD94122F
LOT Number
Pin 1 Mark
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BD94122F
Physical Dimension and Packing Information
Package Name
SOP18
(Max 11.55 (include. BURR))
(UNIT: mm)
PKG: SOP18
Drawing No.: EX115-5001
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BD94122F
Revision History
Date
Revision
23.Mar.2018
001
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
