BD94130MUF-ME2

Datasheet Automotive LED Driver Series 24-channel Constant Current Drivers and 8line Switch Controllers Embedded Backlight LED Driver BD94130MUF-M BD94130EFV-M General Description Key Specification BD94130MUF-M/BD94130EFV-M are embedded 24channel constant current drivers with 12bit PWM dimming and max 8-line switch controllers. This device can set LED constant current value by setting external ISET resistor. Communication with μ-controller via SPI is feasible. ◼ ◼ ◼ ◼ Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Power Supply Voltage Range: 3.0 V to 5.5 V LEDCHn Pin Voltage (n = 1 to 24): 20 V Maximum LED Output Current: 80 mA Operating Temperature Range: -40 °C to +125 °C Package AEC-Q100 Qualified(Note 1) Functional Safety Supportive Automotive Products Integrated 24-channel LED Constant Current Drivers Integrated 4/6/8-line Switch Controllers SPI Interface (Cascade Connection Feasible) 12bit PWM Dimming LED Constant Current Setting by ISET Resistor Phase Shift Function 6bit Dot Correct (50 % to 100 %) LED Open Detection and LED Short Detection Adjacent LEDCH Short Detection PGATE Short Protection VINSW Over Voltage Protection Slew Rate Control for PMOS Gate Driver Abnormality Output FAILB Pin W (Typ) x D (Typ) x H (Max) (BD94130MUF-M) VQFN56FCV080 (BD94130EFV-M) HTSSOP-B54 8.0 mm x 8.0 mm x 1.0 mm 18.5 mm x 9.5 mm x 1.0 mm VQFN56FCV080 (Note 1) Grade 1 HTSSOP-B54 Application ◼ ◼ Cluster, Center Infotainment Display Other Automotive Backlights Typical Application Circuit DC/DC VCC EN VINSW BD94130MUF BD94130EFV VREG15 ISET SW8 PGATE8 ・・・ LSPSET FB SW2 PGATE2 SUMFB SW1 PGATE1 VIO SCSB LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL SDI LEDCH24 SCLK SDO MCU LEDCH23 VSYNC ・・・ HSYNC VIO FAILB LEDCH1 TEST1 TEST2 GND 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 LGND 〇This product has no designed protection against radioactive rays. 1/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Pin Configuration FB EXP-PAD TEST1 HTSSOP-B54 (TOP VIEW) ISET PGATE1 PGATE3 PGATE2 VINSW PGATE4 PGATE5 PGATE7 PGATE6 TEST2 PGATE8 EXP-PAD LSPSET VQFN56FCV080 (TOP VIEW) 42 41 40 39 38 37 36 35 34 33 32 31 30 29 (N.C.) 43 LEDCH18 49 VINSW PGATE6 PGATE5 TEST2 PGATE8 PGATE7 LSPSET LEDCH15 LEDCH14 LEDCH13 LEDCH17 LEDCH16 LEDCH19 LGND LEDCH21 LEDCH20 LEDCH23 LEDCH22 GND SUMFB LEDCH18 41 40 39 38 37 36 35 34 33 32 31 30 29 28 22 LEDCH7 EXP-PAD LGND 50 21 LGND LEDCH19 51 20 LEDCH6 LEDCH20 52 LEDCH21 53 19 LEDCH5 18 LEDCH4 LEDCH22 54 17 LEDCH3 LEDCH23 55 16 LEDCH2 LEDCH24 56 EXP-PAD PGATE4 PGATE2 PGATE3 TEST1 PGATE1 FB 21 22 23 24 25 26 27 ISET LEDCH11 LEDCH10 LEDCH6 LEDCH12 LEDCH4 LEDCH8 LEDCH2 LEDCH9 11 12 13 14 15 16 17 18 19 20 LGND 10 LEDCH7 9 LEDCH5 8 LEDCH3 SDI 7 SCSB 6 LEDCH1 5 SCLK HSYNC 4 SDO VSYNC 3 VIO VCC 2 VSYNC (N.C.) 1 HSYNC VREG15 SCSB EN EXP-PAD 9 10 11 12 13 14 SDI 8 SDO 6 7 SCLK 5 VIO 4 FAILB 3 GND 15 LEDCH1 1 2 SUMFB EXP-PAD LEDCH24 54 53 52 51 50 49 48 47 46 45 44 43 42 23 LEDCH8 EN 24 LEDCH9 LEDCH17 48 VCC 25 LEDCH10 LEDCH16 47 (N.C.) 26 LEDCH11 LEDCH15 46 VREG15 27 LEDCH12 LEDCH14 45 FAILB 28 (N.C.) LEDCH13 44 Pin Description VQFN56FCV080 HTSSOP-B54 Pin Name 1 48 SUMFB 2 49 GND 3 50 EN 4 51 VREG15 6 53 VCC 7 54 FAILB 8 1 VSYNC VSYNC signal input pin 9 2 HSYNC HSYNC signal input pin 10 3 VIO Power supply pin for I/O 11 4 SDO SPI data output pin 12 5 SCLK SPI CLK input pin 13 6 SDI SPI data input pin 14 7 SCSB 15 8 LEDCH1 Output constant current channel 1 16 9 LEDCH2 Output constant current channel 2 17 10 LEDCH3 Output constant current channel 3 18 11 LEDCH4 Output constant current channel 4 19 12 LEDCH5 Output constant current channel 5 20 13 LEDCH6 Output constant current channel 6 21 14 LGND 22 15 LEDCH7 Output constant current channel 7 23 16 LEDCH8 Output constant current channel 8 24 17 LEDCH9 Output constant current channel 9 25 18 LEDCH10 Output constant current channel 10 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function Control DCDC feedback voltage Common GND Enable input pin Output of 1.5 V voltage regulator for digital block Power supply pin Abnormal operation detection output pin SPI device select setting pin Analog GND for constant current driver block 2/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Pin Description – continued VQFN56FCV080 HTSSOP-B54 Pin Name 26 19 LEDCH11 Output constant current channel 11 27 20 LEDCH12 Output constant current channel 12 29 21 FB 30 22 ISET 31 23 TEST1 32 24 PGATE1 Gate control 1 of external PMOS FET 33 25 PGATE2 Gate control 2 of external PMOS FET 34 26 PGATE3 Gate control 3 of external PMOS FET 35 27 PGATE4 Gate control 4 of external PMOS FET 36 28 VINSW Power supply for gate controller block 37 29 PGATE5 Gate control 5 of external PMOS FET 38 30 PGATE6 Gate control 6 of external PMOS FET 39 31 PGATE7 Gate control 7 of external PMOS FET 40 32 PGATE8 Gate control 8 of external PMOS FET 41 33 TEST2 Test pin 2. Use this pin as an open pin. 42 34 LSPSET 44 35 LEDCH13 Output constant current channel 13 45 36 LEDCH14 Output constant current channel 14 46 37 LEDCH15 Output constant current channel 15 47 38 LEDCH16 Output constant current channel 16 48 39 LEDCH17 Output constant current channel 17 49 40 LEDCH18 Output constant current channel 18 50 41 LGND 51 42 LEDCH19 Output constant current channel 19 52 43 LEDCH20 Output constant current channel 20 53 44 LEDCH21 Output constant current channel 21 54 45 LEDCH22 Output constant current channel 22 55 46 LEDCH23 Output constant current channel 23 56 47 LEDCH24 Output constant current channel 24 - - EXP-PAD The EXP-PAD is connected to GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function Control external DCDC feedback voltage LED constant current setting pin Test pin 1 LED short protection voltage setting for external adjustable Analog GND for constant current driver block 3/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Block Diagram VCC EN internal reference voltage VREG 1.5 V VCCUVLO TSD VCCUVLO VINSWOVP TSD Gate Controller VINSW EN VCCUVLO TSD VREG15UVL O EN VCCUVLO TSD PGATE8 VINSW - 4.5 V PGATE Short Detection VREG15UVLO VREG15UVLO ・・・ VREG15 VREF EN ・・・ EN VINSW PGATE2 VIOUVLO PGATE1 VIOUVLO VIO Current Driver SCSB PWM1・・・24 SDI Level Shifter Dot correct 1 ・・・192 SCLK SDO LEDCH24 curent driver control EN VCCUVLO TSD VREG15UVL O Digital LGND LED OPEN/SHORT Detection VSYNC LEDCH23 LEDCHn to LEDCHn Detection HSYNC EN VCCUVLO VREG15UVL O ・・・ + ERRREF FB ・・・ Driver controller ・・・ FAILB ・・・ LGND LEDCH1 LGND Soft Start FB control ISET OPEN/SHORT FB control ISET Driver ISET EN VCCUVLO TSD VREG15UVLO SUMFB GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 LSPSET 4/74 TEST1 TEST2 LGND TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Description of Blocks If there is no description, the mentioned values are typical value. The suffixes m of the symbol represent the number of gate control (m = 1 to 8), and the suffixes n represent the number of current driver (n = 1 to 24), respectively. For example, LEDCHn means LEDCH1, LEDCH2,,,LEDCH24. PGATEm means PGATE1, PGATE2,,,PGATE8. This expression is applicable to the whole of this datasheet. 1. Power Supply (VCC) The VCC pin has UVLO function (VCCUVLO), and it starts operation at VCC ≥ 2.65 V (Typ) and stops operation at VCC ≤ 2.55 V (Typ). About the condition to release/detect VCC UVLO, refer to Table 53. Connect a ceramic capacitor (CVCC) to the VCC pin for stable operation. CVCC range is 1 µF to 22 µF and recommended value is 2.2 µF. If the CVCC is not connected, unstable operation might occur e.g. oscillation. 2. Power Supply (VIO) It supplies power to FAILB, SCSB, SCLK, SDI, SDO, VSYNC, and HSYNC input / output from the VIO pin. Connect a ceramic capacitor (CVIO) to the VIO pin for stable operation. CVIO range is 1 µF to 4.7 µF and recommended value is 2.2 µF. If the CVIO is not connected, unstable operation might occur e.g. oscillation. 3. Power Supply (VINSW) It supplies power to the output of PGATE1 to PGATE8 from the VINSW pin. Connect a ceramic capacitor (CVINSW) to the VINSW pin to ensure stability of LED anode voltage. CVINSW range is 1 µF to 100 µF and recommended value is 10 µF. If the CVINSW value is not enough, the LED output might become unstable e.g. flicker. 4. Reference Voltage (VREG15) VREG15 block generates 1.5 V from VCC, and outputs 1.5 V to the VREG15 pin. It supplies this power (VVREG15) to the internal digital circuit. The VREG15 pin has UVLO function (VREG15UVLO), and it starts operation at VVREG15 ≥ 1.35 V (Typ) and stops operation at VVREG15 ≤ 1.30 V (Typ). It cannot be used to supply power to external components from this IC. About the condition to release/detect VREG15 UVLO, refer to Table 53. Connect a ceramic capacitor (CVREG15) to the VREG15 pin for phase margin. CVREG15 range is 1 µF to 4.7 µF and recommended value is 2.2 µF. If the CVREG15 is not connected, unstable operation might occur e.g. oscillation. 5. Gate Controller PGATEm pins connect to the gate of external PMOS transistors and this block controls power source timing to LED array. Each PGATEm pin turns on in order from PGATE1 to PGATE8 in one period of VSYNC. The number of PGATEm’s ON in one period of VSYNC can be set by PWMFREQ register, refer to PWMFREQ register. PGATEm output HIGH level is VVINSW (Typ) and its LOW level is VVINSW – 4.5 V (Typ). 6. Current Driver This device has integrated 24-channel constant current driver. Maximum LED current level ILEDMAX ( “Register Address” -> ….) Please access this IC using the settings as shown in Table 2 and Table 3. B S 0 0 1 0 1 1 Table 2. Access Table for Write (RW = 0) SPI Setting Access to Devices For All Device For Single DevAddr[5:0] NumOfData[8:0] Same Different Device Data Data 0x00 0x01 to 0x14 0x002 to 0x147 O 0x15 to 0x3F 0x00 Not sending 0x01 to 0x14 O this data 0x15 to 0x3F 0x00 O 0x01 to 0x3E 0x002 to 0x147 0x3F O 0x00 O Not sending 0x01 to 0x3E this data 0x3F O Acceptable (Note) X O X X O X O X O O X O (Note) X: This setting is not acceptable. Do not set this condition B S 0 0 1 1 0/1 Table 3. Access Table for Read (RW = 1) SPI Setting Access to Devices For All Device For Single DevAddr[5:0] NumOfData[8:0] Same Different Device Data Data 0x00 0x01 to 0x14 0x002 to 0x16B O 0x15 to 0x3F 0x00 Not sending 0x01 to 0x14 O this data 0x15 to 0x3F 0x00 0x002 to 0x16B 0x01 to 0x3E 0x3F - Acceptable (Note) X O X X O X X X X (Note) X: This setting is not acceptable. Do not set this condition. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (3) Register Address Bit15 Bit14 Bit13 Bit12 RW Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 0 Bit4 Bit3 Bit2 Bit1 Bit0 Bit1 Bit0 RegAddr[8:0] Bit Parameter Value RW Read / Write RegAddr[8:0] Register Address RW = 0: Write the registers RW = 1: Read the registers 0x000 to 0x16B (4) Data Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Data[15:0] Bit Data[15:0] Parameter Data Value 0x0000 to 0xFFFF (5) Single Device, 1 Address Write (Write to Device #1) B= 0: Target device receives the data S= 1: Single DevAddr[5:0] = 0x01: Target device address NumOfData[8:0] = -: 1 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK B S SDI 01 DevAddr[5:0] RW 0x00 SDO 0x01 0x0000 0 RegAddr[8:0] 0x00 01 0x002 0x00 0x01 Data1[15:0] 0 0x00 0x002 Ex) Detail of Timing Chart SCSB SCLK B S RegAddr[8:0] DevAddr[5:0] RW Data1[15:0] SDI 16bit shift every Device SDO Device #1 Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data1 Figure 11. SPI Protocol for 1 Address Write to Device #1 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (6) Single Device, 1 Address Write (Write to Device #3) B= 0: Target device receives the data S= 1: Single DevAddr[5:0] = 0x03: Target device address NumOfData[8:0] = -: 1 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. DevAddr[5:0] of each device is calculated by counting the number of byte of 0x00 data after the falling-edge of SCSB. DevAddr[5:0] = (Number of byte of 0x00 data) + 1 SCSB SCLK BS Device #1 SDI 01 DevAddr[5:0] RW 0x00 RegAddr[8:0] 0x03 0 0x00 0x002 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 01 0x00 Data1[15:0] 0x03 0 0x00 01 0x0000 0x002 0x00 0x0000 0x0000 Data1[15:0] 0x03 0 0x00 01 0x002 0x00 0x0000 Data1[15:0] 0x03 0 0x00 Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x002 Data1 Figure 12. SPI Protocol for 1 Address Write to Device #3 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (7) Single Device, N Address Write (Write to the consecutive register of Device #1) B= 0: Target device receives the data S= 0: Single DevAddr[5:0] = 0x01: Target device address NumOfData[8:0] = 0x003: 3 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], NumOfData[8:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 00 DevAddr[5:0] 0x00 NumOfData[8:0] RW 0x01 0x00 0x003 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 00 0x00 0x01 RegAddr[8:0] 0 0x00 0x002 0x00 00 0x003 0x00 0x01 0x0000 Data1[15:0] 0 0x00 0x002 0x00 0x003 00 0x00 Data3[15:0] Data1[15:0] Data2[15:0] 0 0x00 0x002 0x00 0x003 0x01 Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data3 Data2 Data1 Data2[15:0] Data1[15:0] 0 0x00 0x002 Figure 13. SPI Protocol for N Address Write to Device #1 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (8) All Devices, Different 1 Address Write (Write the same 2 bytes data to the same RegAddr[8:0] of all devices) B= 1: All devices receive data S= 1: Single DevAddr[5:0] = 0x3F: All devices receive different data NumOfData[8:0] = -: 1 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 11 DevAddr[5:0] RW RegAddr[8:0] 0x3F 0 0x00 0x00 0x002 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 11 0x00 Data1[15:0] 0x3F 0 0x00 11 Data2[15:0] 0x002 0x00 Data1[15:0] 0x3F 0 0x00 0x0000 11 0x002 0x00 Data3[15:0] Data3[15:0] 0x0000 Data1[15:0] Data2[15:0] Data3[15:0] Data1[15:0] Data2[15:0] 0x3F 0 0x00 0x002 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data2 0x0000 Data2[15:0] Device #1 Data1 0x0000 Data3 Figure 14. SPI Protocol for 1 Address Distinct Data Write to All Devices www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (9) All Devices, Same 1 Address Write (Write the same 2 bytes data to the same RegAddr[8:0] of all devices) B= 1: All devices receive data S= 1: Single DevAddr[5:0] = 0x00: All devices receive the same data RW = 0: Write NumOfData[8:0] = -: 1 address access RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 11 DevAddr[5:0] RW 0x00 RegAddr[8:0] 0x00 0 0x00 0x002 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 11 0x00 Data1[7:0] 0x00 0 0x00 11 0x0000 0x002 0x00 0x0000 0x0000 Data1[7:0] 0x00 0 0x00 11 0x002 0x00 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data1 Data1[7:0] 0x00 0 0x00 Device #1 Data1 0x0000 0x002 Data1 Figure 15. SPI Protocol for 1 Address Distinct Data Write to All Devices www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (10) All Devices, Different N Address Write (Write the different N x 2 bytes data to the same RegAddr[8:0] of all devices) B= 1: All devices receive data S= 0: Multi DevAddr[5:0] = 0x3F: All devices receive different data NumOfData[8:0] = 0x002: 2 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], NumOfData[8:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 10 DevAddr[5:0] 0x00 NumOfData[8:0] RW 0x3F 0x00 0x002 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 10 0x00 0x3F RegAddr[8:0] 0 0x00 0x002 0x00 10 Data1[15:0] 0x002 0x00 0x0000 0x3F 0 0x00 0x002 0x00 0x002 10 0x00 0x3F Data2[15:0] Data3[15:0] Data4[15:0] Data1[15:0] Data2[15:0] Data3[15:0] Data4[15:0] Data1[15:0] Data2[15:0] Data1[15:0] 0 0x00 0x002 0x00 0x002 0 0x00 0x002 Data5[15:0] 0x0000 0x0000 Data5[15:0] Data6[15:0] 0x0000 Data3[15:0] Data4[15:0] Data5[15:0] Data6[15:0] Data2[15:0] Data3[15:0] Data4[15:0] Data5[15:0] Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data2 Data1 Data4 Data3 Data6[15:0] Data6 Data5 Figure 16. SPI Protocol for N Address Distinct Data Write to All Devices www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (11) All Devices, Same N Address Write (Write the same N x 2 bytes data to the same RegAddr[8:0] of all devices) B= 1: All devices receive data S= 0: Multi DevAddr[5:0] = 0x00: All devices receive the same data NumOfData[8:0] = 0x003: 3 address access RW = 0: Write RegAddr[8:0] = 0x002: Address SDI: SDO: Transfer in the order of DevAddr[5:0], NumOfData[8:0], RegAddr[8:0], and Data[15:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 10 DevAddr[5:0] 0x00 NumOfData[8:0] RW 0x00 0x00 0x003 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 10 0x00 0x00 RegAddr[8:0] 0 0x00 0x00 10 0x002 0x003 0x00 0x0000 0x00 Data1[15:0] 0 0x00 0x002 0x00 0x003 10 0x00 0x00 Data2[15:0] Data3[15:0] Data1[15:0] Data2[15:0] Data3[15:0] 0x0000 Data1[15:0] Data2[15:0] Data3[15:0] Data1[15:0] Data2[15:0] 0 0x00 0x002 0x00 0x003 0 0x00 Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data3 Data2 Data1 Data3 Data2 Data1 0x002 0x0000 0x0000 Data3 Data2 Data1 Figure 17. SPI Protocol for N Address Same Data Write to All Devices www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (12) Single Device, 1 Address Read (Read the 2 bytes data from Device #2) B= 0: Target device receive the data S= 1: Single DevAddr[5:0] = 0x02: Target device address NumOfData[8:0] = -: 1 address access RW = 1: Read RegAddr[8:0] = 0x003: Address SDI: SDO: Transfer in the order of DevAddr[5:0] and RegAddr[8:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI 01 DevAddr[5:0] RW 0x00 RegAddr[8:0] 0x02 1 0x00 0x003 Device #1 SDO (Device #2 SDI) 0x0000 Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 01 0x00 0x0000 0x02 1 0x00 0x003 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 Read Data[15:0] 01 0x00 0x02 1 0x00 0x0000 01 0x00 0x003 Data1[15:0] 0x02 1 0x00 Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data1 0x0000 0x003 Data1[15:0] Figure 18. SPI Protocol for 1 Address Read from Device #2 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (13) Single Device, N Address Read (Read the N x 2 bytes data from Device #2) B= 0: Target device receives the data S= 0: Multi DevAddr[5:0] = 0x02: Target device address NumOfData[8:0] = 0x002: 2 address access RW = 1: Read RegAddr[8:0] = 0x003: Address SDI: SDO: Transfer in the order of DevAddr[5:0], NumOfData[8:0], and RegAddr[8:0]. Output the transferred data to the next device after SDI input by 2 bytes. SCSB SCLK BS Device #1 SDI Device #1 SDO (Device #2 SDI) 00 DevAddr[5:0] 0x00 0x0000 0x02 NumOfData[8:0] RW 0x00 00 0x002 0x00 0x02 RegAddr[8:0] 1 0x00 0x00 0x0000 0x003 0x002 1 0x00 0x0000 0x003 0x0000 0x0000 0x0000 0x0000 0x0000 0x0000 Data2[15:0] 0x0000 Data1[15:0] Data2[15:0] 0x0000 Read Data[15:0] Device #2 SDO (Device #3 SDI) 0x0000 0x0000 Device #3 SDO 0x0000 0x0000 00 0x00 0x0000 0x02 0x00 00 0x002 0x00 0x02 1 0x00 0x003 0x00 0x002 Data1[15:0] 1 0x00 Device #1 Device #2 Device #3 Register Register Register 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 0x007 0x006 0x005 0x004 0x003 0x002 0x001 0x000 Data2 Data1 0x003 Figure 19. SPI Protocol for N Address Read from Device #2 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. SPI Protocol – continued (14) Example (Write the data to Device #1 and Device #2) Example of byte transfer for 2 devices in Cascade Connection. Table 4. Byte transfer B, S, DevAddr[5:0] RW, NumOfData[8:0] RegAddr[8:0] Transfer setting Data Dummy byte DevAddr[5:0] 10 0x00 NumOfData[8:0] 0x3F 0 0x00 0x0C0 Data for the duty setting of Duty (2 bytes x 24 channels) x 8 matrix switch x 2 devices = 768 bytes for multi device transfer SUM 2 bytes 776 bytes RegAddr[8:0] 0 0x00 Number of transferred byte for each device 2 bytes 2 bytes 2 bytes 0x010 device #1 DTYCNT101 48 bytes : LEDCH1 to LEDCH24 data for PGATE1 of Device #1 device #1 device #1 device #1 DTYCNT102 48 bytes : LEDCH1 to LEDCH24 data for PGATE8 of Device #2 device #2 DTYCNT801 DTYCNT123 DTYCNT124 RegAddr of DTYCNT101 device #2 DTYCNT802 device #2 DTYCNT823 device #2 DTYCNT824 Dummy byte 0x0000 Figure 20. Transfer Byte Number for Multi Access www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Functions of Logic Block - continued 6. Register Map Address 0x000 0x001 0x002 0x003 0x005 0x006 0x007 0x008 0x009 0x00A 0x00B 0x00C 0x010 0x011 to 0x0CD 0x0CF 0x0D0 0x0D1 to 0x0E6 0x0E7 0x0E8 0x0E9 to 0x146 0x147 0x148 0x149 0x14A to 0x155 0x156 0x157 0x158 0x159 0x15A to 0x165 0x166 0x167 0x168 0x169 0x16A 0x16B Register Name SRSST TURNONWAIT SSMASK ERRMASK SYSCONFIG 1 SYSCONFIG 2 SYSCONFIG 3 SYSCONFIG 4 LEDENL LEDENM LEDENU GDLY DTYCNT101 DTYCNT102 to DTYCNT823 DTYCNT824 DLY01 DLY02 to DLY23 DLY24 IREV10102 IREV10304 to IREV82122 IREV82324 ERLSH1L ERLSH1H ERLSH2L to ERLSH7H ERLSH8L ERLSH8H ERLOP1L ERLOP1H ERLOP2L to ERLOP7H ERLOP8L ERLOP8H EROTHER ERLEDL ERLEDH ERPGSH Description Software reset and soft start time Wait time after turn on Soft start mask time Error output mask time System config 1 System config 2 System config 3 System config 4 Enable of LEDCH1 to LEDCH8 Enable of LEDCH9 to LEDCH16 Enable of LEDCH17 to LEDCH24 Global delay for all channel PWM duty setting of LEDCH1 for PGATE1 PWM duty setting of LEDCH2 for PGATE1 to PWM duty setting of LEDCH23 for PGATE8 PWM duty setting of LEDCH24 for PGATE8 Delay setting of LEDCH1 Delay setting of LEDCH2 to Delay setting of LEDCH23 Delay setting of LEDCH24 Current revision of LEDCH1 and LEDCH2 for PGATE1 Current revision of LEDCH3 and LEDCH4 for PGATE1 to Current revision of LEDCH21 and LEDCH22 for PGATE8 Current revision of LEDCH23 and LEDCH24 for PGATE8 Error status of LED1 to LED16 short detection for PGATE1 Error status of LED17 to LED24 short detection for PGATE1 Error status of LED1 to LED16 short detection for PGATE2 to Error status of LED17 to LED24 short detection for PGATE7 Error status of LED1 to LED16 short detection for PGATE8 Error status of LED17 to LED24 short detection for PGATE8 Error status of LED1 to LED16 open detection for PGATE1 Error status of LED17 to LED24 open detection for PGATE1 Error status of LED1 to LED16 open detection for PGATE2 to Error status of LED17 to LED24 open detection for PGATE7 Error status of LED1 to LED16 open detection for PGATE8 Error status of LED17 to LED24 open detection for PGATE8 Other error status Adjacent LEDCH1 to LEDCH16 short detection Adjacent LEDCH17 to LEDCH24 short detection PGATE VIN/GND short detection Section Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here Here As for the register update timing, there are 4 kinds of timing as following. Type 1. Updated to the newest data immediately when the data is written. Type 2. Updated to the newest data at the next VSYNC. (Rising edge trigger, after the data is written.) Type 3. Updated to the newest data at the next VSYNC and GDLY. Type 4. Updated to the newest data at the next PWM timing. (Rising edge trigger of VSYNC, then rising edge trigger of PWM after the data is written.) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Functions of Logic Block – continued 7. Description of Registers The writing register annotated “-” is not valid. Address 0x000: SRSST Bit No. Bit[15] Name Initial value 0 Bit No. Name Initial value Bit[7] 0 Bit[14] 0 Bit[13] 0 Bit[12] 0 Bit[6] Bit[5] SSTIM[2:0] 1 Bit[4] 0 Bit[11] 0 Bit[10] 0 Bit[9] 0 Bit[8] 0 Bit[3] Bit[2] Bit[1] Bit[0] SWRST 1 0 0 0 0 [Read / Write] Initial value: 0x0030 Update: Immediately The register data is updated immediately when the new data is written. SWRST is Write-only register. Bit[6:4] SSTIM SSTIM[2:0] is the register for setting the soft start time. It sets how the FBDAC[7:0] code changes with HSYNC. Table 5. Soft Start Time / 1 count SSTIM[2:0] Count Up Time 0 128 HSYNC 1 256 HSYNC 2 512 HSYNC 3 1024 HSYNC 4 2048 HSYNC 5 4096 HSYNC 6 6144 HSYNC 7 8192 HSYNC Bit[0] SWRST SWRST is available when HSYNC is available, because this function uses HSYNC clock. If SWRST = 1 is written, wait for more than 10 HSYNC pulses before accessing other registers. Table 6. Software Reset Software Reset Normal Reset (return to ‘0’ automatically) SWRST 0 1 Address 0x001: TURNONWAIT Bit No. Bit[15] Bit[14] Name 0 Initial value 0 Bit No. Name Initial value Bit[13] 0 Bit[12] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] TURNONWAIT[7:0] 0 0 1 0 0 [Read / Write] Initial value: 0x0004 Update: VSYNC Bit[7] Bit[6] Bit[5] 0 0 0 Bit[11] 0 Bit[10] 0 Bit[9] 0 Bit[8] 0 The register data is updated at the next VSYNC signal rising edge after the data is written. The mask time of PWM output is set by counting the number of VSYNC pulses. This register value is updated at the 3rd VSYNC pulse after reset is released (UVLO, SWRST). If this register needs to be updated, update this register before the 3rd VSYNC pulse. Write data higher than 0x04. 𝑡 𝑇𝑈𝑅𝑁𝑂𝑁𝑊𝐴𝐼𝑇 = 𝑇𝑈𝑅𝑁𝑂𝑁𝑊𝐴𝐼𝑇[7: 0]/𝑓𝑉𝑆𝑌𝑁𝐶 [𝑠] (Except for waiting time until 1st VSYNC pulse) Table 7. Maximum Turn on Wait Time fVSYNC[Hz] 60 120 Maximum TURNONWAIT Time [ms] 4,250 2,125 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/74 240 1,062.5 480 531.3 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x002: SSMASK Bit No. Bit[15] Bit[14] Name Initial value 0 0 Bit No. Name Initial value Bit[13] 0 Bit[12] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] SSMASK[7:0] 1 1 1 0 0 [Read / Write] Initial value: 0x003C Update: VSYNC Bit[7] Bit[6] Bit[5] 0 0 1 Bit[11] 0 Bit[10] 0 Bit[9] 0 Bit[8] 0 The register data is updated at the next VSYNC signal rising edge after the data is written. Set the value higher than 0x02. The mask time of ERROR detection is set by counting the number of VSYNC pulses after TURNONWAIT time. 𝑡𝑆𝑆𝑀𝐴𝑆𝐾 = 𝑆𝑆𝑀𝐴𝑆𝐾[7: 0]/𝑓𝑉𝑆𝑌𝑁𝐶 after TURNONWAIT time (Except for waiting time until 1st VSYNC pulse) [𝑠] Table 8. Maximum Soft Start Mask Time fVSYNC[Hz] 60 120 Maximum SSMASK Time [ms] 4,250 2,125 Address 0x003: ERRMASK Bit No. Bit[15] Bit[14] Name 0 Initial value 0 Bit No. Name Initial value Bit[12] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] ERRMASK[7:0] 0 1 0 0 1 [Read / Write] Initial value: 0x0029 Update: VSYNC Bit[6] Bit[5] 0 0 1 Bit[10] 0 480 531.3 Bit[13] 0 Bit[7] Bit[11] 0 240 1,062.5 Bit[9] 0 Bit[8] 0 The register data is updated at the next VSYNC signal rising edge after the data is written. Range: over 0x03 (Set for 0x00 to 0x02 also lead to 0x03, register value = writing value) ERROR mask time is set by counting the number of HSYNC pulses. 𝑡𝐸𝑅𝑅𝑀𝐴𝑆𝐾 = 𝐸𝑅𝑅𝑀𝐴𝑆𝐾[7: 0]/𝑓𝐻𝑆𝑌𝑁𝐶 [𝑠] If the capacitance of LEDCHn pin CLEDCH is connected, the transient response is affected. Please set the value considering the time margin of LED short detection. (Example) ERRMASK = 3: mask 3 or 4 clock (PWMn = HIGH and error signal) It reset ERRMASK counter when PWMn = LOW. Refer to HSYNC equation about the relationship between HSYNC frequency and VSYNC frequency. Table 9. Maximum Error Mask Time fHSYNC[Hz] 1,996,800 3,993,600 Maximum ERRMASK Time [μs] 127.7 63.8 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/74 7,987,200 31.9 15,974,400 15.9 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x005: SYSCONFIG1 Bit No. Bit[15] Bit[14] Name Initial value 0 0 Bit No. Name Initial value Bit[7] Bit[6] PGSRCNT[1:0] 0 0 Bit[13] 0 Bit[12] 0 Bit[11] 0 Bit[10] 0 Bit[9] Bit[8] MULSEL[1:0] 0 0 Bit[5] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] PRCEN PRCSEL 0 0 0 0 0 [Read / Write] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the new data is written. Bit[9:8] MULSEL[1:0] Line Switch Controller setting of external PMOS gate. Refer to PWM Delay and ON Duty setting procedure each dimming mode. As for the HSYNC frequency for MULSEL, Refer to the register PWMFREQ. This register prohibits changing the setting during dimming. Table 10. Line Switch Controller of External PMOS Gate MULSEL[1:0] Line Switch Controller 0x0 8-line switch controller 0x1 4-line switch controller 0x2 6-line switch controller 0x3 6-line switch controller Bit[7:6] PGSRCNT[1:0] Fall Slew Rate Control of external PMOS gate. Table 11. Fall Slew Rate of External PMOS Gate PGSRCNT[1:0] Slew Rate 0x0 100 Ω pull down 0x1 1.4 kΩ pull down 0x2 10 kΩ pull down 0x3 100 kΩ pull down Bit[1] PRCEN According to setting of PRCSEL, pull up charge ‘VINSW – 1.2 V’ to the LEDCHn pin. Table 12. Pull up charge Enable Setting PRCEN Pull up charge Enable Setting 0 Pull up charge disable 1 Pull up charge enable (Note) It is necessary to be careful about reverse pressure resistance. Bit[0] PRCSEL Pull up charge period setting of the LEDCHn pin. PRCSEL 0 1 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Table 13. Pull up charge Period Pull up charge Period Setting Pull up charge during PWM OFF Pull up charge during all PGATE OFF 33/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x006: SYSCONFIG2 Bit No. Bit[15] Bit[14] Bit[13] LSHEXE Name Initial value 0 0 0 Bit No. Name Initial value Bit[7] Bit[6] PWMFREQ[1:0] 0 0 Bit[5] 0 Bit[12] 0 Bit[11] FBREF[2:0] 0 Bit[10] 0 Bit[9] Bit[8] SMPTIM[1:0] 0 1 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] LSHEXT LOPEN LSHEN LEDSH[1:0] 0 0 0 0 0 [Read / Write] Initial value: 0x0100 Update: Immediately The register data is updated immediately when the new data is written. This register should be set before PWM dimming. Do not change this register value during dimming. Bit[13] LSHEXE Short check sequence of adjacent LEDCHn pin is executed after TURNONWAIT time if LSHEXE = 1 is written before TURNONWAIT time. LSHEXE 0 1 Table 14. Short Check of Adjacent LEDCHn Pin Short Check Execution No operation Execute short check sequence (return to ‘0’ automatically) Bit[12:10] FBREF Feedback reference voltage of FB control block. Table 15. Error Reference of FB Control Block Feedback Reference FBREF[2:0] Voltage 0x0 0.45 V 0x1 0.53 V 0x2 0.60 V 0x3 0.75 V other 0.90 V Bit[9:8] SMPTIM The LED channel voltage sampling timing, after PWMn goes from LOW to HIGH. It is necessary to set PWM duty register more than 8 at the dimming. Table 16. Sampling Time LED Channel Voltage SMPTIM[1:0] Sampling Time 0x0 8 HSYNC 0x1 16 HSYNC 0x2 32 HSYNC 0x3 64 HSYNC www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 34/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Address 0x006: SYSCONFIG2 – continued Bit[7:6] PWMFREQ (Please update this register until the 4th VSYNC pulse from RESET release.) The register PWMFREQ defines the number of times PWM turns on during a VSYNC pulse. So the proper HSYNC pulse number is almost proportional to the PWMFREQ. More specifically, considering the NOOVLAP1 and NOOVLAP2 timing, which is the deadtime of PMOSm (m = 1 to 8), the necessary HSYNC pulse number is expressed by the following equation. 𝑓𝐻𝑆𝑌𝑁𝐶 = 𝑓𝑉𝑆𝑌𝑁𝐶 × (4096 + 𝑎 + 𝑏) × 𝑐 × 2(𝑃𝑊𝑀𝐹𝑅𝐸𝑄[1:0]) NOOVLAP1 register 0: a = 32, 1: a = 64, 2: a = 128, 3: a = 256 NOOVLAP2 register 0: b = 32, 1: b = 64, 2: b = 128, 3: b = 256 MULSEL register 0: c = 8, 1: c = 4, 2: c = 6, 3: c = 6 The ratio fHSYNC/fVSYNC is noted in the Table 17. Here is the example of the register MULSEL = 0 (the case c = 8 is substituted in the above formula) Table 17. The example of the ratio fHSYNC/fVSYNC (the register MULSEL = 0) PWMFREQ[1:0] 0 1 2 3 NOOVLAP1 0 1 2 3 0 1 2 3 0 1 2 3 0 1 2 3 NOOVLAP2 0 33,280 33,536 34,048 35,072 66,560 67,072 68,096 70,144 133,120 134,144 136,192 140,288 266,240 268,288 272,384 280,576 1 33,536 33,792 34,304 35,328 67,072 67,584 68,608 70,656 134,144 135,168 137,216 141,312 268,288 270,336 274,432 282,624 2 34,048 34,304 34,816 35,840 68,096 68,608 69,632 71,680 136,192 137,216 139,264 143,360 272,384 274,432 278,528 286,720 3 35,072 35,328 35,840 36,864 70,144 70,656 71,680 73,728 140,288 141,312 143,360 147,456 280,576 282,624 286,720 294,912 The example of HSYNC pulse number is shown as VSYNC is 60 Hz, 120 Hz, 240 Hz and 480 Hz. The maximum HSYNC frequency is 20 MHz. (Refer to frequency range of electric characteristics) Table 18. HSYNC Frequency and PWM Frequency (NOOVLAP1 = NOOVLAP2 = 0, MULSEL = 0) (Example) VSYNC Frequency [Hz] PWMFREQ [1:0] 60 120 240 480 60 120 240 480 0 1,996,800 3,993,600 7,987,200 15,974,400 120 240 480 960 1 3,993,600 7,987,200 15,974,400 240 480 960 1,920 2 7,987,200 15,974,400 480 960 1,920 3,840 3 15,974,400 (Note) Upper: PWM frequency Lower: HSYNC frequency “-“ is not acceptable to set this value in PWMFREQ register www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Address 0x006: SYSCONFIG2 – continued Bit[4] LSHEXT External pin or internal register setting for LED short protection voltage. Table 19. Setting for LED Short Protection Voltage LSHEXT Setting for LED Short Protection 0 Internal register LEDSH[1:0] setting 1 External LSPSET pin setting As LSHEXT = 0, please connect the LSPSET pin to GND. As LSHEXT = 1, please set the LED short protection voltage VLSPSETDET by the following equation. 𝑉𝐿𝑆𝑃𝑆𝐸𝑇𝐷𝐸𝑇 = 10 × 𝑉𝐿𝑆𝑃𝑆𝐸𝑇 Where VLSPSET is the LSPSET pin voltage (0.5 V to 1.8 V) Bit[3] LOPEN This register enables/disables LED Open Error detection. Table 20. Enable Setting for LED Open Error Detection of LEDCHn LOPEN Enable Setting 0 LED Open Error detection is not available 1 LED Open Error detection is available Bit[2] LSHEN This register enables/disables LED Short Error detection. Table 21. Enable Setting for LED Short Error Detection of LEDCHn LSHEN Enable Setting 0 LED Short Error detection is not available 1 LED Short Error detection is available Bit[1:0] LEDSH[1:0] This register controls the detection voltage for LED Short Error. Table 22. LED Short Error Detection Voltage Setting LEDSH[1:0] Detection Voltage[V] 0 3.0 V 1 6.0 V 2 9.0 V 3 12.0 V www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 36/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x007: SYSCONFIG3 Bit No. Bit[15] Bit[14] Name Initial value Bit No. Name Initial value 0 0 Bit[7] Bit[6] NOOVLAP1[1:0] 0 0 Bit[13] Bit[12] Bit[11] - - - 0 0 0 Bit[10] VINSW OVPEN 0 Bit[9] Bit[8] VINSWOVPREF[1:0] 0 0 Bit[5] Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] NOOVLAP2[1:0] AUTOCLR AUTOOFF ERRCLR ERRLAT 0 0 0 0 0 0 [Read / Write] Initial value: 0x0000 Update: Immediately or VSYNC The data in registers (VINSWOVPEN, VINSWOVPREF, AUTOCLR, AUTOOFF and ERRCLR) are updated immediately when the new data is written. The data in registers (NOOVLAP1, NOOVLAP2, ERRLAT) are updated at the next VSYNC signal rising edge after the data is written. The data in registers (NOOVLAP1, NOOVLAP2) should be set before PWM dimming. AUTOCLR and ERRCLR are Write-only registers. Bit[10] VINSWOVPEN This register enables/disables Over Voltage Detection of the VINSW pin. Table 23. Enable Setting for Over Voltage Detection of the VINSW pin VINSWOVPEN Enable Setting 0 VINSW Over Voltage detection is not available 1 VINSW Over Voltage detection is available Bit[9:8] VINSWOVPREF[1:0] Detection voltage for over voltage of the VINSW pin. Table 24. Detection Voltage Setting of the VINSW pin VINSWOVPREF[1:0] Detection Voltage[V] 0 8.0 V 1 12.0 V 2 16.0 V 3 18.0 V Bit[7:6] NOOVLAP1 (Update this register until 4th VSYNC pulse from RESET release.) None overlap time setting 1. Refer to None overlap function. As for the HSYNC frequency for NOOVLAP1, please refer to the register PWMFREQ. Table 25. None Overlap Time Setting1 NOOVLAP1[1:0] None Overlap Time Setting 1 0 32 HSYNC 1 64 HSYNC 2 128 HSYNC 3 256 HSYNC Bit[5:4] NOOVLAP2 (Update this register until 4th VSYNC pulse from RESET release.) None overlap time setting 2. Refer to None overlap function. As for the HSYNC frequency for NOOVLAP2, please refer to the register PWMFREQ. Table 26. None Overlap Time Setting2 NOOVLAP2[1:0] None Overlap Time Setting 2 0 32 HSYNC 1 64 HSYNC 2 128 HSYNC 3 256 HSYNC www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 37/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Address 0x007: SYSCONFIG3 – continued Bit[3] AUTOCLR AUTOCLR is available in AUTOOFF = 1 setting. AUTOCLR 0 1 Table 27. AUTOOFF Condition AUTOOFF Condition No Operation AUTOOFF condition in LEDCHn output is released (return to ‘0’ automatically) Bit[2] AUTOOFF Control ON/OFF condition in LEDCHn output. AUTOOFF condition is latched until released by UVLO or AUTOCLR. Table 28. ON/OFF Condition of LEDCHn Output ON/OFF Condition LEDCHn does not turn OFF automatically after error is detected LEDCHn turn OFF automatically after error is detected AUTOOFF 0 1 Bit[1] ERRCLR ERRCLR is available in ERRLAT = 1 setting. ERRCLR 0 1 Table 29. Clear Error Register Clear Error Register No Operation Clear error register and return Hi-z in FAILB output when ERRLAT = 1 (returns to ‘0’ automatically) Bit[0] ERRLAT Control error register and FAILB output when error is detected. ERRLAT 0 1 Table 30. Error Detection Function Error Detection Function Error register and FAILB output return to initial condition when error is released Error register and FAILB output is retained until ERRCLR = 1 is written www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 38/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x008: SYSCONFIG4 Bit No. Bit[15] Bit[14] Name Initial value 0 0 Bit No. Name Initial value Bit[7] 0 Bit[6] 0 Bit[13] 0 Bit[5] DACUP[2:0] 0 Bit[12] 0 Bit[11] 0 Bit[10] 0 Bit[9] 0 Bit[8] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] DACDN[1:0] MSMODE 1 0 0 0 0 [Read / Write] Initial value: 0x0010 Update: Immediately The register data is updated immediately when the new data is written. Bit[6:4] DACUP[2:0] DACUP[2:0] is register for setting the FB DAC's count up step after soft start. Table 31. FB DAC Code Count Up Step FB DAC Code Count DACUP[2:0] Up Step 1 0 1 2 3 2 4 3 5 4 6 5 7 6 7 8 Bit[3:2] DACDN[1:0] DACDN[1:0] is register for setting the FB DAC's count down step after soft start. Table 32. FB DAC Code Count Down Step FB DAC Code Count DACDN[1:0] Down Step -1 0 -2 1 -3 2 -4 3 Bit[0] MSMODE MSMODE is register for setting of FB DAC’s controller mode or target mode. Table 33. FB DAC Mode Setting FB DAC Mode Setting MSMODE Controller mode 0 Target mode 1 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 39/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x009: LEDENL Bit No. Bit[15] Bit[14] Name Initial value 0 0 Bit No. Name Initial value Bit[11] 0 Bit[10] 0 Bit[9] 0 Bit[8] 0 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] LEDEN[7:0] 1 1 1 1 1 [Read / Write] Initial value: 0x00FF Update: Immediately Bit[6] Bit[5] 1 1 1 Bit[14] 0 Bit[13] 0 Bit[12] 0 Bit[7] Bit[6] Bit[5] 1 1 1 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] LEDEN[15:8] 1 1 1 1 1 [Read / Write] Initial value: 0x00FF Update: Immediately Bit[14] 0 Bit[13] 0 Bit[12] 0 Bit[7] Bit[6] Bit[5] 1 1 1 Bit[4] Bit[3] Bit[2] Bit[1] Bit[0] LEDEN[23:16] 1 1 1 1 1 [Read / Write] Initial value: 0x00FF Update: Immediately Address 0x00B: LEDENU Bit No. Bit[15] Name Initial value 0 Bit No. Name Initial value Bit[12] 0 Bit[7] Address 0x00A: LEDENM Bit No. Bit[15] Name Initial value 0 Bit No. Name Initial value Bit[13] 0 Bit[11] 0 Bit[11] 0 Bit[10] 0 Bit[10] 0 Bit[9] 0 Bit[9] 0 Bit[8] 0 Bit[8] 0 The register data is updated immediately when the new data is written. These registers (0x009, 0x00A, 0x00B) enable or disable each LED channel. If ‘0’ is set in LEDEN[n-1] (n = 1 to 24), the channel n is not available. LEDCHn current is turned off, and the status of LED Open/Short Detection and FAILB output are not affected by LEDCHn since disabled channels do not detect LED Open/Short Error. Table 34. LEDCHn Enable Setting LEDCHn current control, LEDEN[n-1] LED Open/Short Detection, FAILB output for LEDCHn 0 Disable 1 Enable www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 40/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x00C: GDLY Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit No. Name Initial value Bit[13] - Bit[12] - Bit[11] 0 0 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[4] Bit[3] GDLY[7:0] 0 Bit[10] Bit[9] GDLY[11:8] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 0 [Read / Write] Initial value: 0x0000 Update: VSYNC GDLY is the delay time counted from VSYNC rising edge to PGATE1 fall-edge. The register data is updated at the next VSYNC signal rising edge after the data is written. MULSEL register 0: c = 8, 1: c = 4, 2: c = 6, 3: c = 6 Table 35. Global Delay Setting GDLY[11:0] GDLY Total Clock Number (clock width @HSYNC) 0x000 0x001 0x002 0x003 to 0xFFC 0xFFD 0xFFE 0xFFF NGDLYa = 5 clock to 6 clock from rise-edge of VSYNC NGDLYa + 1 x c x 2(PWMFREQ[1:0]) NGDLYa + 2 x c x 2(PWMFREQ[1:0]) NGDLYa + 3 x c x 2(PWMFREQ[1:0]) to NGDLYa + 4092 x c x 2(PWMFREQ[1:0]) NGDLYa + 4093 x c x 2(PWMFREQ[1:0]) NGDLYa + 4094 x c x 2(PWMFREQ[1:0]) NGDLYa + 4095 x c x 2(PWMFREQ[1:0]) (Note) This count starts from VSYNC rising edge. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 41/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x010: DTYCNT101 Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit No. Name Initial value Bit[13] - Bit[12] - Bit[11] 0 0 0 Bit[7] Bit[6] Bit[5] 0 0 0 0 Bit[4] Bit[3] DTY101[7:0] 0 Bit[10] Bit[9] DTY101[11:8] Bit[8] 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 0 [Read / Write] Initial value: 0x0000 Update: PWM The register data is updated at the next PWM signal rising edge after the data is written. Table 36. PWM Duty Setting DTYmn[11:0] LED Pulse Width 0x000 0 HSYNC clock width 0x001 1 HSYNC clock width 0x002 2 HSYNC clock width 0x003 3 HSYNC clock width 0x004 4 HSYNC clock width to to 0xFFC 4,092 HSYNC clock width 0xFFD 4,093 HSYNC clock width 0xFFE 4,094 HSYNC clock width 0xFFF 4,095 HSYNC clock width Address 0x011 to 0x0CF: DTYCNT102 to DTYCNT824 These registers are used to set the PWM pulse width. The setting procedure is the same as that for LEDCH1 with Address set to 0x010. Address Description 0x010 to 0x027 PWM duty register for PGATE1 0x028 to 0x03F PWM duty register for PGATE2 0x040 to 0x057 PWM duty register for PGATE3 0x058 to 0x06F PWM duty register for PGATE4 0x070 to 0x087 PWM duty register for PGATE5 0x088 to 0x09F PWM duty register for PGATE6 0x0A0 to 0x0B7 PWM duty register for PGATE7 0x0B8 to 0x0CF PWM duty register for PGATE8 Address 0x0D0: DLY01 Bit No. Bit[15] Name 0 Initial value Bit No. Name Initial value Bit[14] - Bit[13] - Bit[12] - Bit[11] 0 0 0 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[4] Bit[3] DLY01[7:0] 0 Bit[10] Bit[9] DLY01[11:8] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 0 [Read / Write] Initial value: 0x0000 Update: VSYNC+GDLY The register data is updated at the next VSYNC+GDLY timing after the data is written. DLY01 is the delay time which starts to count after NOOVLAP2. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 42/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Address 0x0D0: DLY01 (PWM Delay setting register) – continued Table 37. Delay Setting of PWM Output DLY01[11:0] DLY01 Total Clock Number (clock width @HSYNC) 0x000 0x001 0x002 0x003 to 0xFFC 0xFFD 0xFFE 0xFFF 0 1 2 3 to 4092 4093 4094 4095 (Note) This count starts from NOOVLAP2 finish point. Address 0x0D1 to 0x0E7: DLY02 to DLY24 These registers are used to set the delay width of PWM for LEDCH2 to LEDCH24. The setting procedure is the same as that for LEDCH1 with address set to 0x0D0. Address 0x0E8: IREV10102 Bit No Bit[15] Bit[14] Name 0 0 Initial value Bit No Name Initial value Bit[13] Bit[12] 1 1 Bit[11] Bit[10] IREV102[5:0] 1 Bit[7] - Bit[6] - Bit[5] Bit[4] 0 0 1 1 1 Bit[3] Bit[2] IREV101[5:0] 1 1 Bit[9] Bit[8] 1 1 Bit[1] Bit[0] 1 1 [Read / Write] Initial value: 0x3F3F Update: immediately IREV101 is used with current revision of LEDCH1 of PGATE1 from 50 % to 100 %. IREV102 is used with current revision of LEDCH2 of PGATE1 from 50 % to 100 %. IREV register prohibit changing the setting during dimming. These LED current registers should be updated before LED turns on. The dynamic update during the dimming may affect to the DCDC feedback. Table 38. Current Revision Setting of LEDCHn IREV101[5:0] Current Revision Setting 0x3F 0x3E 0x3D 0x3C to 0x03 0x02 0x01 0x00 ILEDDC x 100 % ILEDDC x 99.2 % ILEDDC x 98.4 % ILEDDC x 97.6 % to ILEDDC x 52.8 % ILEDDC x 52.0 % ILEDDC x 51.2 % ILEDDC x 50.4 % 𝐼𝐿𝐸𝐷𝐴𝐿𝐿 = 𝐼𝐿𝐸𝐷𝐷𝐶 × (𝐼𝑅𝐸𝑉𝑚𝑛 [5: 0] + 64) 127 [𝑚𝐴] Address 0x0E9 to 0x147: IREVmn This register is used to make setting of current revision for LEDCH3 to LEDCH24 of PGATE1 and LEDCH1 to LEDCH24 of PGATE2 to PGATE8. The setting procedure is the same as that for LEDCH1 of PGATE1 with address set to 0x0E8. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 43/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x148: ERLSH1L Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit No. Name Initial value Bit[13] 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[12] Bit[11] ERLSH1 [15:8] 0 Bit[10] Bit[9] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 0 Bit[4] Bit[3] ERLSH1 [7:0] 0 0 [Read] Initial value: 0x0000 Update: Immediately Address 0x149: ERLSH1H Bit No. Bit[15] Name 0 Initial value Bit No. Name Initial value Bit[14] - Bit[13] - Bit[12] - Bit[11] - Bit[10] - Bit[9] - Bit[8] - 0 0 0 0 0 0 0 Bit[7] Bit[6] Bit[5] Bit[2] Bit[1] Bit[0] 0 0 0 0 0 0 Bit[4] Bit[3] ERLSH1 [23:16] 0 0 [Read] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the data is written. These registers (0x148, 0x149) correspond to the status of LED Short Detection of PGATE1 of LED1 to LED24. Table 39. Status of LED Short Detection ERLSH1[n-1] Status 0 Normal 1 Detected LED Short Error(Note 1) (Note 1) ERRLAT = 0: ERLSHm[n-1] (m = 1 to 8, n = 1 to 24) turns 0, if LED Short Error is released or LEDEN[n-1] = 0 is set or LSHEN = 0 is set. ERRLAT = 1: ERLSHm[n-1] turns 0, if ERRCLR = 1 is set. Address 0x14A to 0x157: ERLSHm[n-1] These registers (0x14A to 0x157) correspond to the status of LED Short Detection of PGATE2 to PGATE8 of LED1 to LED24. The setting procedure is the same as that for LED1 to LED24 of PGATE1 with address set to 0x148 and 0x149. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 44/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x158: ERLOP1L Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit No. Name Initial value Bit[13] 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[12] Bit[11] ERLOP1[15:8] 0 Bit[10] Bit[9] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 0 Bit[4] Bit[3] ERLOP1[7:0] 0 0 [Read] Initial value: 0x0000 Update: Immediately Address 0x159: ERLOP1H Bit No. Bit[15] Name 0 Initial value Bit No. Name Initial value Bit[14] - Bit[13] - Bit[12] - Bit[11] - Bit[10] - Bit[9] - Bit[8] - 0 0 0 0 0 0 0 Bit[7] Bit[6] Bit[5] Bit[2] Bit[1] Bit[0] 0 0 0 0 0 0 Bit[4] Bit[3] ERLOP1[23:16] 0 0 [Read] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the data is written. These registers (0x158, 0x159) correspond to the status of LED Open Detection of PGATE1 of LED1 to LED24. Table 40. Status of LED Open Detection ERLOP1 [n-1] Status 0 Normal 1 Detected LED Open Error(Note 2) (Note 2) ERRLAT = 0: ERLOPm[n-1] (m = 1 to 8, n = 1 to 24) turns 0,if LED Open Error is released or LEDEN[n-1] = 0 is set or LOPEN = 0 is set. ERRLAT = 1: ERLOPm[n-1] turns 0, if ERRCLR = 1 is set. Address 0x15A to 0x167: ERLOPm[n-1] These registers (0x15A to 0x167) correspond to the status of LED Short Detection of PGATE2 to PGATE8 of LED1 to LED24. The setting procedure is the same as that for LED1 to LED24 of PGATE1 with Address set to 0x158 and 0x159. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 45/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x168: EROTHER Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit[13] - Bit[12] - Bit[11] - Bit[10] - Bit[9] - Bit[8] - 0 0 0 0 0 0 Bit[3] ERISET OPEN Bit[2] ERISET OCP Bit[1] Bit[0] ERVINSW OVP 0 0 0 Bit No. Bit[7] Bit[6] Bit[5] Bit[4] Name - - EXENG EXEOK Initial value 0 0 0 0 - 0 [Read] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the new data is written. Bit[5]: EXENG EXENG register correspond to the status that short check sequence of adjacent LEDCHn is not executed. EXENG 0 1 Table 41. Status of Short Check Sequence NG Status Normal Short check sequence of adjacent LEDCHn is not executed Bit[4]: EXEOK EXEOK register correspond to the status that short check sequence of adjacent LEDCHn is executed. EXEOK 0 1 Table 42. Status of Short Check Sequence OK Status Normal Short check sequence of adjacent LEDCHn is executed Bit[3]: ERISETOPEN ERISETOPEN register correspond to the status of ISET Open Detection. Table 43. Status of ISET Open Detection ERISETOPEN Status 0 Normal 1 Detected ISET Open Error(Note 3) Bit[2]: ERISETOCP ERISETOCP register correspond to the status of ISET Over Current Detection. Table 44. Status of ISET Over Current Detection ERISETOCP Status 0 Normal 1 Detected ISET Over Current Error(Note 3) Bit[0]: ERVINSWOVP ERVINSWOVP register correspond to the status of VINSW Over Voltage Detection. Table 45. Status of VINSW Over Voltage Detection ERVINSWOVP Status 0 Normal 1 Detected VINSW Over Voltage Error(Note 3) (Note 3) ERRLAT = 0: ERISETOPEN, ERISETOCP and ERVINSWOVP turns 0, if error condition is released. ERRLAT = 1: ERISETOPEN, ERISETOCP and ERVINSWOVP turns 0, if ERRCLR = 1 is set. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 46/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 7. Description of Registers – continued Address 0x169: ERLEDL Bit No. Bit[15] Bit[14] Name 0 0 Initial value Bit No. Name Initial value Bit[13] 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[12] Bit[11] ERLED[15:8] 0 0 Bit[4] Bit[3] ERLED[7:0] 0 0 Bit[10] Bit[9] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 [Read] Initial value: 0x0000 Update: Immediately Address 0x16A: ERLEDH Bit No. Bit[15] Name 0 Initial value Bit No. Name Initial value Bit[14] - Bit[13] - Bit[12] - Bit[11] - Bit[10] - Bit[9] - Bit[8] - 0 0 0 0 0 0 0 Bit[7] Bit[6] Bit[5] Bit[2] Bit[1] Bit[0] 0 0 0 0 0 0 Bit[4] Bit[3] ERLED[23:16] 0 0 [Read] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the data is written. These registers (0x169, 0x16A) correspond to the status of Short Detection of adjacent LEDCHn. Table 46. Status of Short Detection of Adjacent LEDCHn ERLED[n-1] Status (n = 1 to 24)) 0 Normal 1 Detected Short Detection Error of Adjacent LEDCHn(Note 4) Address 0x16B: ERPGSH Bit No. Bit[15] Name 0 Initial value Bit No. Name Initial value Bit[14] Bit[13] 0 0 Bit[7] Bit[6] Bit[5] 0 0 0 Bit[12] Bit[11] ERPGVINSH[7:0] 0 0 Bit[4] Bit[3] ERPGGSH[7:0] 0 0 Bit[10] Bit[9] Bit[8] 0 0 0 Bit[2] Bit[1] Bit[0] 0 0 0 [Read] Initial value: 0x0000 Update: Immediately The register data is updated immediately when the data is written. Bit[15:8]: ERPGVINSH[7:0] This register correspond to the status of Short Detection between the PGATEm pin and the VINSW pin. Table 47. Status of Short Detection between the PGATEm pin and the VINSW pin ERPGVINSH[m-1] Status (m = 1 to 8) 0 Normal 1 Detected Short Error to the VINSW pin(Note 4) Bit[7:0]: ERPGGSH[7:0] This register correspond to the status of Short Detection between the PGATEm pin and the GND. Table 48. Status of Short Detection between the PGATEm pin and GND ERPGGSH[m-1] Status (m = 1 to 8) 0 Normal 1 Detected Short Error to GND(Note 4) (Note 4) ERLED[n-1], ERPGVINSH[m-1] and ERPGGSH[m-1] turn 0, if ERRCLR = 1 is set. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 47/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Application Circuit Diagram 1. The Example of Basic Application DC/DC VCC EN VINSW BD94130MUF BD94130EFV VREG15 ISET SW8 PGATE8 ・・・ LSPSET FB SW2 PGATE2 SUMFB SW1 PGATE1 VIO SCSB LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL SDI LEDCH24 SCLK SDO MCU LEDCH23 VSYNC ・・・ HSYNC V IO FAILB LEDCH1 TEST1 TEST2 GND LGND 2. The Plural BD94130 Usage (the common SPI and the common DCDC) DC/DC VINSW VCC EN BD94130MUF BD94130EFV EN VREG15 ISET SW8 PGATE8 ・・・ LSPSET FB SW2 PGATE2 SUMFB SCSB SCSB SDI LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL SDI LEDCH24 SCLK SCLK SDO SDO MCU LEDCH23 VSYNC VSYNC ・・・ HSYNC HSYNC VIO FAILB SW1 PGATE1 VIO FAILB LEDCH1 TEST1 TEST2 GND LGND VCC EN VINSW BD94130MUF BD94130EFV VREG15 ISET SW8 PGATE8 ・・・ LSPSET FB SW2 PGATE2 SUMFB SW1 PGATE1 VIO SCSB LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL LEDCELL SDI LEDCH24 SCLK SDO LEDCH23 VSYNC ・・・ HSYNC FAILB LEDCH1 TEST1 TEST2 GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 48/74 LGND TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Timing Chart 1. Boot Sequence (1) SPI Command Mode VCC VCCUVL O VCCUVLO [9] [1] VINSW [2] [8] VIOUVLO VIO VIOUVLO EN [3] [7] VREG15UVLO VREG15 VREG15UVLO RESET= VCCUVLO or VIOUVLO or EN or VREG15UVLO or Register RESET (internal) VSYNC HSYNC [4] [5] [6] SPI PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 LEDCHn current status OFF TURNONWAIT dimming OFF output disable output disable Enlarged view Initial setting Duty setting SPI Register SRSST TURNONWAIT SSMASK ERRMASK SYSCONFIG1 SYSCONFIG2 SYSCONFIG3 SYSCONFIG4 Enlarged view LEDENL LEDENM LEDENU GDLY DTYCNTmn DLYn IREVmn Enlarged view OFF setting SPI SPI Register DTYCNTmn Register LEDENL LEDENM LEDENU Figure 21. The Boot Sequence for SPI Command Mode Turn ON Sequence [1] Power on VCC and VCCUVLO is released. And power on VINSW. [2] Power on VIO and VIOUVLO is released. [3] After the EN pin is H, VREG15 turn on. The signal RESET is expressed by the following equation. After RESET is released, the registers can be accessed. RESET = VCCULVO or VIOUVLO or EN or VREG15UVLO or Register [4] Set the initial registers until 4th VSYNC period from RESET release. 4th VSYNC period is adjustable by the register TURNONWAIT[7:0]. During the state TURNONWAIT, the IC keeps LEDs off. [5] The duty register DTYCNTmn are updated in every VSYNC period for dimming. Turn OFF Sequence [6] Set the register LEDENL, LEDENM and LEDENU registers to 0. [7] VREG15 turn off after the EN pin is L. The registers cannot be accessed during RESET = L. [8] Power off VIO and VIOUVLO is detected. [9] Power off VINSW and VCC. The first turn on and the last turn off are VCC. And the order of the VIO, EN can be exchanged. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 49/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 1. Boot Sequence – continued (2) PWM Direct Control Mode (without SPI command) VCCUVLO VCC VCCUVL O [9] [1] VINSW [2] [8] VIOUVLO VIO VIOUVLO EN [3] [7] VREG15UVLO VREG15 VREG15UVLO RESET= VCCUVLO or VIOUVLO or EN or VREG15UVLO or Register RESET (internal) TEST1 [4] [5] [6] VSYNC HSYNC Low SCSB High SCLK Low SDI Low LEDCHn current TURNONMASK counter 0x00 1 2 3 4 0xFF PGATE1 PGATE2 ・ ・ ・ PGATE8 status TURNONWAIT OFF dimming OFF output disable Figure 22. The boot Sequence for PWM Direct Control Mode Turn ON Sequence [1] Power on VCC and VCCUVLO is released. And power on VINSW. [2] Power on VIO and VIOUVLO is released. [3] After the EN pin is H, VREG15 turn on. The signal RESET is expressed by the following equation. After RESET is released, the VSYNC signal becomes valid. And the TEST1 pin must be H. RESET = VCCULVO or VIOUVLO or EN or VREG15UVLO or Register [4] Until 4th VSYNC period from RESET release, the IC keeps LEDs off, as TURNONWAIT. [5] Input PWM pulse to VSYNC for dimming. VSYNC signal can control LED current directly. PGATEm are all on. Turn OFF Sequence [6] Stop PWM dimming pulse input to VSYNC. [7] VREG15 turn off after the EN pin is L. [8] Power off VIO and VIOUVLO is detected. [9] Power off VINSW and VCC. The first turn on and the last turn off are VCC. And the order of the VIO, EN can be exchanged. About PWM Direct Control Mode If 8 HSYNC clocks counts, PWM Direct Control Mode is shifted to SPI Command Mode. Even if error is detected, LED keeps ON, and FAILB signal is still HIGH. RESET (internal) HSYNC BITCNT[3:0] 0 (internal signal) operating mode 1 2 3 4 5 6 7 PWM Direct Control 8 0 SPI Command Mode PWM Direct Control Figure 23. SPI Command Mode / PWM Direct Control Mode www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 50/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Timing Chart – continued 2. Matrix Operation and PWM Dimming Setting (1) Matrix Operation Setting (the line number of gate controller) The register MULSEL[1:0] controls the number of active PGATE as shown in Figure 24. The unused PGATE5 to PGATE8 asserts always OFF. The selectable gate number is 4, 6, and 8. The necessary HSYNC clock number is depend on the register MULSEL[1:0]. 8 Line Gate controller (MULSEL[1:0] = 0x0) 4 Line Gate Controller (MULSEL[1:0] = 0x1) VSYNC VSYNC GDLY GDLY PGATE1 PGATE1 PGATE2 PGATE2 PGATE3 PGATE3 PGATE4 PGATE4 PGATE5 PGATE5 PGATE6 PGATE6 PGATE7 PGATE7 PGATE8 PGATE8 No delay No delay LEDCH1 current LEDCH1 current DLY02 DLY02 LEDCH2 current LEDCH2 current DLY24 DLY24 LEDCH24 current LEDCH24 current Figure 24. Dimming Mode (2) Matrix Operation Setting (PWM frequency) The register PWMFREQ[1:0] controls the repeated number of active PGATE for VSYNC period. The figure 25 show the example of the one repeat and two repeats. The selectable repeated number is 1, 2, 4, and 8. The necessary HSYNC clock number is depend on the register PWMFREQ[1:0]. PWMFREQ = 0 LEDCHn output frequency = VSYNC×１ PWMFREQ = 1 VSYNC VSYNC HSYNC HSYNC PGATE1 PGATE1 PGATE2 PGATE2 PGATE7 PGATE7 PGATE8 PGATE8 LEDCH1 current LEDCH1 current LEDCHn output frequency = VSYNC×2 Figure 25. PWMFREQ vs LEDCHn output www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 51/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 2. Matrix Operation and PWM Dimming Setting – continued (3) PWM Delay Setting There are 2 kinds of delay setting. The register GDLY set the interval from VSYNC to PGATE1, and the GDLY delay affects all PGATEm accordingly. The register DLYn (n = 1 to 24) set the interval from PGATE = ON to the current rising of LEDCHn. (That interval is expressed NOOVLAP2 + DLYn in detail.) By shifting the starting timing of each LED current, the transient response of the total current is averaged. NOOVLAP1 the interval PGATE1 = off is omitted NOOVLAP2 VSYNC PGATE1 GDLY PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 DLY01 DLY01 LEDCH1 current LEDCH1 PWM = 100 % interval ・ ・ ・ LEDCH24 current DLY24 ・ ・ ・ DLY24 LEDCH24 PWM = 100 % interval Figure 26. PWM delay setting Figure 26 shows the delay setting over 1 PGATE in 8 Line Gate Controller. The setting in the figure is 75 % Duty and 50 % Delay for LEDCH1. If the LED current is finished within the single period of PGATE = ON, the delay setting of DTYmn is expressed as following. 0 ≤ 𝐷𝐿𝑌𝑛 < 4095 𝐷𝑇𝑌𝑚𝑛 + 𝐷𝐿𝑌𝑛 ≤ 4095 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 52/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 2. Matrix Operation and PWM Dimming Setting – continued (4) PWM Duty Setting VCC VIO present VSYNC period next VSYNC period VSYNC HSYNC SCSB [1] SPI status dimming DTYmn (register) [2] DTYmn (buffer1) [3] DTYmn (buffer2) [4] DTYmn (control data) GLDY PGATE1 DLY1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 DTYmn is reflected. LEDCHn current Enlarged view duty setting SPI DTYmn Register Figure 27. Dimming Sequence for Normal Operation [1] The register DTYmn access is finished within the present VSYNC period to reflect in the next VSYNC period. If that access is not finished by the VSYNC, the register is not reflected correctly. [2] Buffer1 data is updated at VSYNC timing. [3] Buffer2 data is updated at VSYNC+GDLY timing. [4] Control data (DTYmn) is updated after the delay setting DLYn in the next VSYNC period, DTYmn is reflected to the LEDCHn current. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 53/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Timing Chart – continued 3. None Overlap Function None overlap time between PMOSm can be adjustable by the register NOOVLAP1, NOOVLAP2. NOOVLAP1 is the interval from PMOSm = OFF to PMOS(m+1) = ON. This is set longer than the PMOS off delay not to cause PMOS = ON simultaneously. NOOVLAP2 is the interval from PMOS = ON to the beginning of LEDCHn current. This is set longer than the PMOS on delay. These register adjustable such as 32 clock, 64 clock, 128 clock, 256 clock by HSYNC. The necessary clock of HSYNC is changed accordingly. Please refer the section of Description of PWMFREQ[1:0] (Address 0x006). (Example) NOOVLAP1 = 0, NOOVLAP2 = 0 (DTY101, DTY201 = 0xFFF, DLY1 = 0) none overlap time (total 64 clock) 1 st nd rd 63th64th 65th 2 3 HSYNC PMOS OFF delay PGATE1 NOOVLAP1 NOOVLAP2 PGCNT[9:0] (Note 1) 0 0 0 1 30 31 32 33 NOOVLAP1 setting 62 62 63 64 65 NOOVLAP2 setting PMOS ON delay PGATE2 LEDCH1 current (Note 1) Internal signal for counting PGATE ON timing and LEDCH1 current ON timing. Figure 28. PGATE1, PGATE2 None Overlap Timing www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 54/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Timing Chart – continued 4. PWM Behavior at Close VSYNC Intervals In this section, PWM dimming behavior is shown if HSYNC is not equal to ideal frequency. The ideal frequency of HSYNC is 33280 times of VSYNC below example. (1) HSYNC Frequency less than Ideal Frequency Example: Delay = 0, Duty = 75 %, PWMFREQ = 0, NOOVLAP1 = NOOVLAP2 = 0, MULSEL = 0 HSYNC = 33280 × VSYNC HSYNC < 33280 × VSYNC VSYNC HSYNC [1] [2] PGATE8 width is proper PGATE8 and PWMn width is short MAIN COUNTER PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE7 PGATE8 PWMn Figure 29. HSYNC Frequency Less than Ideal Frequency The main counter is reset at the rising edge of VSYNC. The main counter starts counting up by HSYNC and proceed the line control from PGATE1 to PGATE8. [1] As HSYNC is equal to the ideal frequency, the main counter reaches the full value 33280. The ON interval of PGATE8 and PWMn are proper. [2] As HSYNC is smaller than the ideal frequency, the main counter does not reach the full value. The ON interval of PGATE8 and PWMn are short. (2) HSYNC Frequency more than Ideal Frequency Example: Delay = 0, Duty = 50 %, PWMFREQ = 0, NOOVLAP1 = NOOVLAP2 = 0, MULSEL = 0 HSYNC = 33280 × VSYNC HSYNC > 33280 × VSYNC VSYNC HSYNC [1] MAIN COUNTER PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 blank interval PWMn Figure 30. HSYNC Frequency More than Ideal Frequency [1] As HSYNC is more than the ideal frequency, the main counter continues the full value 33280 without reset. In this blank interval after PGATE8 = OFF, all LEDs turn off. The ON interval of PGATE8 and PWMn are almost proper, but all LEDs brightness is LOW. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 55/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Timing Chart – continued 5. ERROR Detection and Release The following are the internal signals on the timing chart: PWM_OH[1] LOPDET_IL[n-1] LSHDET_IL[n-1] VINSWOVP_IL ISETOCP_IL ISETOPEN_IL PGGSH_IL[m-1] SSEND R_LOPDET, R_LSHDET, R_VSYNC ERR_MASKCNTmn R_SSCNT (m = 1 to 8, n = 1 to 24) PWM signal for channel 2 control LED Open Error signal (HIGH: normal, LOW: error) LED Short Error signal (HIGH: normal, LOW: error) VINSW pin Over Voltage Error signal (HIGH: normal, LOW: error) ISET pin Over Current Error signal (HIGH: normal, LOW: error) ISET pin OPEN Error signal (HIGH: normal, LOW: error) PGATEm Comparator signal Soft start mask signal (HIGH: normal, LOW: mask) retiming signal error mask counter for PGATEm counter for soft start (1) LED Open Detection LED Open Error is detected after ERRMASK, and LED Open Error is released as shown in Figure 31. Here ERRMASK[7:0] = 0x03 If PWM_OH[n-1] is shorter than ERR_MSKCNTmn[7:0], the LED OPEN is not detected. VSYNC VSYNC HSYNC HSYNC "Low" PGATE1 "Low" PGATE1 "Low" PGATE2 "High" ・ ・ ・ "High" PGATE2 ・ ・ ・ PGATE8 "High" ・ ・ ・ "High" ・ ・ ・ PGATE8 PWM_OH[1] PWM_OH[1] LOPDET_IL[1] mask 2clock delay (synchronize) R_LOPDET[1] LOPDET_IL[1] "High" R_LOPDET[1] "High" SSEND "High" SSEND "High" ERRMASK register 0x03 ERRMASK register 0x03 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT202[7:0] ・ ・ ・ ERR_MSKCNT802[7:0] 0x00 ・ ・ ・ 0x00 ERR_MSKCNT202[7:0] ・ ・ ・ ERR_MSKCNT802[7:0] 0x00 ・ ・ ・ 0x00 ERLOP1[23:0] 0x000000 ERLOP1[23:0] 0x000002 ERLOP2[23:0] 0x000000 ・ ・ ・ 0x000000 ERLOP2[23:0] ・ ・ ・ ERLOP8[23:0] 0x000000 ・ ・ ・ ERLOP8[23:0] 0x01 0x02 0x03 0x00 0x000002 FAILB mask 0x01 0x02 0x03 0x00 0x000000 ・ ・ ・ 0x000000 FAILB Figure 31. LED Open Detection and Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 56/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M (1) LED Open Detection - continued [Case: LED Open Error signal is LOW width］ While PWM_OH[1] = HIGH and LOPDET_IL[1] = LOW with SSEND = HIGH (Soft Start end), if ERR_MSKCNT does not counts up until the ERRMASK, FAILB remains HIGH. In the same condition, if ERR_MSKCNT counts up until the ERRMASK, FAILB asserts LOW. VSYNC VSYNC 1st 2nd 3rd 1st HSYNC 2nd 3rd 4th 1st 2nd 3rd 4th HSYNC PGATE1 "Low" PGATE1 "Low" PGATE2 ・ ・ ・ PGATE8 "High" ・ ・ ・ "High" PGATE2 ・ ・ ・ PGATE8 "High" ・ ・ ・ "High" PWM_OH[1] "High" PWM_OH[1] "High" LOPDET_IL[1] LOPDET_IL[1] mask (3 to 4 clock) R_LOPDET[1] mask R_LOPDET[1] 2clock delay (synchronize) SSEND "High" SSEND "High" ERRMASK register 0x03 ERRMASK register 0x03 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT202[7:0] ・ ・ ・ ERR_MSKCNT802[7:0] 0x00 ・ ・ ・ 0x00 ERR_MSKCNT202[7:0] ・ ・ ・ ERR_MSKCNT802[7:0] 0x00 ・ ・ ・ 0x00 ERLOP1[23:0] 0x000000 ERLOP1[23:0] 0x000000 ERLOP2[23:0] ・ ・ ・ ERLOP8[23:0] 0x000000 ・ ・ ・ 0x000000 ERLOP2[23:0] ・ ・ ・ ERLOP8[23:0] 0x000000 ・ ・ ・ 0x000000 FAILB "High" 0x01 0x02 0x03 0x00 0x01 0x02 0x03 0x00 0x01 0x02 0x03 0x000002 0x00 0x000000 FAILB Figure 32. LED Open Detection (the error signal is LOW width) (2) LED Short Detection (Example) ERRMASK[7:0] = 0x03 LED Short Error is detected after ERRMASK, and LED Short Error is released as shown in Figure 33. If the capacitance of LEDCHn pin CLEDCH is connected, the transient response is affected. Please set the ERRMASK value considering the time margin of LED short detection. VSYNC "High" VSYNC HSYNC "Low" HSYNC PGATE1 "Low" PGATE1 "Low" PGATE2 "High" PGATE2 "High" ・ ・ ・ PGATE8 ・ ・ ・ ・ ・ ・ "High" PGATE8 PWM_OH[1] ・ ・ ・ "High" PWM_OH[1] LSHDET_IL[1] 2clock delay (synchronize) R_LSHDET[1] LSHDET_IL[1] "High" R_LSHDET[1] "High" mask SSEND "High" SSEND "High" ERRMASK register 0x03 ERRMASK register 0x03 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT102[7:0] 0x00 ERR_MSKCNT202[7:0] 0x00 ERR_MSKCNT202[7:0] 0x00 ・ ・ ・ ERR_MSKCNT802[7:0] ERLSH1[23:0] 0x000000 ERLSH2[23:0] 0x000000 ・ ・ ・ 0x00 ・ ・ ・ 0x00 ERLSH8[23:0] 0x01 0x02 0x03 ・ ・ ・ 0x000002 ERR_MSKCNT802[7:0] ERLSH1[23:0] 0x000002 ERLSH2[23:0] 0x000000 FAILB ・ ・ ・ ERLSH8[23:0] 0x01 0x02 0x03 0x00 ・ ・ ・ 0x00 ・ ・ ・ 0x000000 mask 0x000000 ・ ・ ・ 0x000000 FAILB Figure 33. LED Short Detection and Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 57/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release - continued (3) VINSW Over Voltage Detection (Example) VINSWOVPEN = 1, ERRLAT = 0 VINSW Over Voltage is detected after SSEND, and VINSW Over Voltage Error is released as shown in Figure 34. LEDCHn output is not turned off by VINSW Over Voltage Error. VSYNC HSYNC PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 PWM_OH[1] SSEND "High" VINSWOVP_IL ERVINSWOVP FAILB Figure 34. VINSW Over Voltage Detection (4) ISET Over Current Detection (Example) ERRLAT = 0 ISET Over Current is detected after SSEND, and ISET Over Current Error is released as shown in Figure 35. LEDCHn output is turned off by ISET Over Current Error. VSYNC HSYNC PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 PWM_OH[1] SSEND "High" ISETOCP_IL ERISETOCP FAILB Figure 35. ISET Over Current Detection (5) ISET Open Detection (Example) ERRLAT = 0 ISET Open is detected after SSEND, and ISET Open Error is released as shown in Figure 36. LEDCHn output is not turned off by ISET Open Error. VSYNC HSYNC PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 PWM_OH[1] SSEND "High" ISETOPEN_IL ERISETOPEN FAILB Figure 36. ISET Open Detection www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 58/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release – continued (6) Short PGATEm to VINSW Detection (Example) MULSEL = 0 Short PGATEm to VINSW is detected the timing that PGATEm goes from LOW to HIGH during dimming mode. Detected PGATEm becomes Hi-z output. Short Error can release by ERRCLR. VSYNC HSYNC PGATE1 PGATE2 short PGATE3 to VINSW Hi-z PGATE3 PGATE4 PGATE5 PGATE6 PGATE7 PGATE8 PWM_OH[1] PGGSH_IL[7:0] 0xFE 0xFD 0xFF ERPGVINSH[7:0] 0xFB 0xFF 0xFF 0xF7 0xEF 0xFF 0x00 0xDF 0xFF 0xBF 0xFF 0x7F 0xFF 0xFE 0xFF 0xFF 0x04 FAILB Figure 37. Short PGATEm to VINSW Detection www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 59/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release – continued (7) Short PGATEm to GND Detection (Example) MULSEL = 0 Short PGATEm to GND is detected the timing that PGATEm goes from HIGH to LOW during dimming mode. Detected PGATEm becomes Hi-z output. Short Error can release by ERRCLR. VSYNC HSYNC PGATE1 PGATE2 PGATE3 Hi-z PGATE4 short PGATE4 to GND PGATE5 PGATE6 PGATE7 PGATE8 PWM_OH[1] PGGSH_IL[7:0] 0xFE 0xFD 0xFF ERPGVINSH[7:0] 0xFB 0xF3 0xFF 0xF7 0xF7 0xE7 0xF7 0x00 0xD7 0xF7 0xB7 0xF7 0x77 0xF7 0xF5 0xF7 0xF7 0x08 FAILB Figure 38. Short PGATEm to GND Detection www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 60/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release – continued (8) Short Check Detection of Adjacent LEDCHn The short check sequence of adjacent the LEDCHn pin is executed at the end of TURNONWAIT interval, if the register LSHEXE = 1 is written by the end of TURNONWAIT interval, where EXEOK status is HIGH. If LSHEXE = 1 is written after TURNONWAIT interval, the short check sequence is not executed and the register EXENG = 1. The short check result can be read from the register ERLED[23:0]. Example both ERLED[5] and ERLED[6] is HIGH, the LEDCH6 pin and the LEDCH7 pin can be judged as short pin. internal reset VSYNC HSYNC PGATE1 PGATE2 ・ ・ ・ PGATE8 ・ ・ ・ PWM_OH[1] LSHEXE = 1 is written by the end of TURNONWAIT LSHEXE EXEOK TURNONWAIT short check ERLED[23:0] Status 0x000000 OFF output disable 0x000060 TURNONWAIT dimming FAILB Figure 39. Short Check Detection of Adjacent LEDCHn (9) Soft-start Masking Function LED Open Error cannot be detected during Soft Start (SSEND = LOW). Soft start counter counts up every VSYNC period until the SSMASK setting (SSEND = HIGH) as shown Figure 40 below. LED Open Error can be detected when SSEND = HIGH. It is also the same when LED Short Error is detected. Time of mask = (TURNONWAIT register + SSMASK register) x VSYNC (Example) SSMASK = 0x3C internal reset VSYNC HSYNC PGATE1 PGATE2 ・ ・ ・ PGATE8 ・ ・ ・ output mask LEDCH1 LOPDET_IL[0] TURNONWAIT 0x00 0x01 0x02 0x03 0x04 0xFF SSMASK[7:0] 0x3C R_SSCNT[7:0] 0x00 0xFF 0x00 0x01 0x02 0x3A 0x3B 0x3C 0xFF SSEND mask released "soft start mask" FAILB Figure 40. Setting for Soft Start Mask www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 61/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release – continued (10) Error Sequence for the Register AUTOOFF AUTOOFF set the abnormal LED = OFF automatically. (Case) the register ERRLAT = 0 and AUTOOFF = 1 VSYNC PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 [2] [5] LEDCH1(PGATE1) = OFF automatically LEDCH1 current AUTOOFF is cleared LEDCH24 current [4] [6] SPI Error LEDCH1(PGATE1) [1] External condition normal AUTOOFF(register) "High" ERRLAT(register) "Low" AUTOCLR(register) "Low" ERRCLR(register) "Low" ERLSH1(register) [3] normal 0x000000 0x000001 LEDEN[23:0](register) 0x000000 0xFFFFFF [7] FAILB Enlarged view Enlarged view SPI register SPI Read: ERLSHmn ERLOPmn register Write: AUTOCLR Figure 41. Error Sequence for the register AUTOOFF = 1 [1] If LED Short Error is detected, FAILB asserts LOW. [2] LEDCH1 output is turned off automatically. (Only target timing (PGATE1)) [3] The external condition turns to normal. The LEDCH1 = OFF continues, and FAILB keeps LOW. [4] By reading the register ERLSHmn, ERLOPmn, the abnormal LED component can be distinguished. [5] Once LEDCH1(PGATE1) is off automatically, IC does not judge the LED Short Error status. The LED keeps off. [6] The register AUTOCLR = 1 is written, The automatical off status is cleared. [7] IC judges LED Short Error. As the external condition is normal, LED turns on and ERLSH1 = 0x000000 and FAILB = HIGH. (Case) the register ERRLAT = 0 and AUTOOFF = 0 [2] When the abnormal is detected, LED does not turn off automatically. [3] If the abnormal state is released, LED turn on again. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 62/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M 5. ERROR Detection and Release – continued (11) Error Sequence for the Register ERRLAT ERRLAT keeps the abnormal state as latch state, even if that is released. (Case) the register ERRLAT = 1 and AUTOOFF = 0 VSYNC PGATE1 PGATE2 ・ ・ ・ ・ ・ ・ PGATE8 LEDCH1 current [2] [5] LEDCH24 current [4] [6] SPI [1] External condition [3] normal normal Error LEDCH1(PGATE1) AUTOOFF(register) "Low" ERRLAT(register) "High" AUTOCLR(register) "Low" ERRCLR(register) "Low" ERLSH1(register) 0x000000 LEDEN[23:0] (register) 0x000001 0x000000 0xFFFFFF FAILB Enlarged view SPI register Enlarged view SPI Read: ERLOPmn ERLSHmn register Write: AUTOCLR Figure 42. Error Sequence for the register ERRLAT = 1 [1] If LED Short Error is detected, FAILB asserts LOW. [2] LEDCH1 output is still turned on, because AUTOOFF is 0. [3] The external condition turns to normal. The register ERLSH1 keeps 0x000001 and FAILB asserts LOW. [4] By reading the register ERLSHmn, ERLOPmn, the abnormal LED component can be distinguished. [5] LEDCH1 output is still turned on, because AUTOOFF is 0. [6] The register ERRCLR = 1 is written, The register ERLSH1 is cleared to 0x000000 and FAILB asserts HIGH. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 63/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Condition for Protections Table 49. Protection Table 1 LED OPEN ERRLAT = 0 ERRLAT = 1 Pin Protection Error Setting Error Flag Error Channel LEDCHn in every PGATEm Detection Condition Release Condition Error Enable SSMASK ERRMASK ERRLAT AUTOOFF Error Register FAILB(Note 1) Clear Condition AUTOOFF =0 AUTOOFF =1 LED SHORT ERRLAT = 0 ERRLAT = 1 LEDEN[n-1] = 1 and DTYmn > 0 and LOPEN = 1 and LEDCHn ON and VLEDCHn ≤ 0.15 V LEDEN[n-1] = 0 or LOPEN = 0 or LEDCHn ON and VLEDCHn > 0.15 V LOPEN O O O O LEDEN[n-1] = 1 and DTYmn > 0 and LSHEN = 1 and LEDCHn ON and VLEDCHn ≥ VSHDET LEDEN[n-1] = 0 or LSHEN = 0 or LEDCHn ON and VLEDCHn < VSHDET LSHEN O O O O ERLOP[n-1] ERLSH[n-1] LOW LOW Protection released ERRCLR = 1 Protection released ERRCLR = 1 OFF by LEDEN[n-1] = 0(Note 2) OFF by LEDEN[n-1] = 0(Note 2) OFF automatically OFF automatically ‘O’: It has the function. (Note 1) When the IC detects VCCUVLO or VREG15UVLO or TSD or EN, it cannot detect other protection. (Note 2) Write LEDEN[n-1] = 0 when the error channel is turned off. (Note) m = 1 to 8, n = 1 to 24 Table 50. Protection Table 2 ISET OCP ERRLAT = 0 ERRLAT = 1 Pin Protection Error Setting Error Flag Error Channel Detection Condition Release Condition Error Enable SSMASK ERRMASK ERRLAT AUTOOFF Error Register FAILB(Note 1) Clear Condition AUTOOFF =0 AUTOOFF =1 ISET OPEN ERRLAT = 0 ERRLAT = 1 ISET RISETSP ≤ max 16 kΩ RISETOPEN ≥ min 340 kΩ RISETSP > max 16 kΩ RISETOPEN < min 340 kΩ O O - O O - ERISETOCP ERISETOPEN LOW LOW Protection released ERRCLR = 1 Protection released ERRCLR = 1 - - - ‘-’: It does not have the function. (Note 1) When the IC detects VCCUVLO or VREG15UVLO or TSD or EN, it cannot detect other protection. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 64/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Condition for Protections – continued Table 51. Protection Table 3 PGATEm to VINSW SHORT Pin Protection Error Setting Error Flag Error Channel PGATEm to GND SHORT PGATEm Detection Condition Release Condition Error Enable SSMASK ERRMASK ERRLAT AUTOOFF Error Register FAILB(Note 1) Clear Condition AUTOOFF =0 AUTOOFF =1 PGATEm Rise edge and VPGATEm > VINSW-1.5 V PGATEm Fall edge and VPGATEm ≤ VINSW-2.5 V ERRCLR = 1 ERRCLR = 1 - - ERPGVINSH[m-1] ERPGGSH[m-1] LOW LOW ERRCLR = 1 ERRCLR = 1 - - - ‘-’: It does not have the function. (Note 1) When the IC detects VCCUVLO or VREG15UVLO or TSD or EN, it cannot detect other protection. (Note) m = 1 to 8 Table 52. Protection Table 4 VINSW OVP ERRLAT = 0 ERRLAT = 1 Protection Error Setting Error Flag Error Channel Pin VINSW Detection Condition VVINSW Release Condition Error Enable SSMASK ERRMASK ERRLAT AUTOOFF Error Register FAILB(Note 1) Clear Condition AUTOOFF =0 AUTOOFF =1 Short of Adjacent LEDCHn LEDCHn > VVINSWOVPREF LSHEXE = 1 before TURNONWAIT time and LEDCHn OFF and VLEDCHn < VSHDET during short check sequence VVINSW ≤ VVINSWOVPREF × 0.9 VINSWOVPEN O O - ERRCLR = 1 - ERVINSWOVP ERLED[n-1] LOW LOW Protection released ERRCLR = 1 ERRCLR = 1 - - - ‘-’: It does not have the function. (Note 1) When the IC detects VCCUVLO or VREG15UVLO or TSD or EN, it cannot detect other protection. (Note) n = 1 to 24 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 65/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Condition for Protections – continued Table 53. Protection Table 5 Protection Error Setting Error Flag Error Channel VCCUVLO VREG15UVLO VIOUVLO Pin VCC VREG15 VIO Detection Condition Release Condition Error Enable SSMASK ERRMASK ERRLAT AUTOOFF Error Register FAILB(Note 1) Clear Condition AUTOOFF =0 AUTOOFF =1 VCC ≤ 2.55 V VCC ≥ 2.65 V - VVREG15 ≤ 1.3 V VVREG15 ≥ 1.35 V - VVIO ≤ 1.41 V VVIO ≥ 1.46 V - - - - - - ‘-’: It does not have the function. (Note 1) When the IC detects VCCUVLO or VREG15UVLO or TSD or EN, it cannot detect other protection. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 66/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M I/O Equivalence Circuit VCC FB EN VCC FB VCC EN GND 10k 100k 5k GND GND GND GND / LGND VREG15 ISET VCC VCC VCC GND 70k LGND VREG15 1k 1k 330k GND GND GND ISET 10k GND HSYNC / VSYNC / SCSB / SDI / SCLK VIO SDO VIO VIO VIO HSYNC VSYNC SCSB SDI SCLK SDO 1k GND GND GND GND FAILB LEDCH1 to LEDCH24 PGATE1 to PGATE8 / VINSW VINSW FAILB LEDCH1 to LEDCH24 10k GND 1M PGATE1 to PGATE8 LGND GND GND GND LGND GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 67/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M I/O Equivalence Circuit – continued SUMFB TEST1 TEST2 VIO VCC VIO 10k TEST1 1k SUMFB 1k 10k TEST2 GND GND GND GND GND LSPSET 20k LSPSET GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 68/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 69/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 43. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 14. Functional Safety “ISO 26262 Process Compliant to Support ASIL-*” A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in the datasheet. “Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)” A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet. “Functional Safety Supportive Automotive Products” A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety. Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 70/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Ordering Information B D 9 4 1 3 0 x x x - Package MUF: VQFN56FCV080 EFV: HTSSOP-B54 ME2 Product Rank M: for Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram HTSSOP-B54 (TOP VIEW) VQFN56FCV080 (TOP VIEW) Part Number Marking Part Number Marking D 9 4 1 3 0 D 9 4 1 3 0 LOT Number Pin 1 Mark Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 LOT Number 71/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN56FCV080 72/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Physical Dimension and Packing Information - continued Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSSOP-B54 73/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 BD94130MUF-M BD94130EFV-M Revision History Data Revision 17.Aug.2022 001 New release 002 (1) Page 39 Modified description of MSMODE register. (2) Page 49, 50 Added VINSW pin to the timing chart. 02.Dec.2022 Changes www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 74/74 TSZ02201-0V1V0B200030-1-2 02.Dec.2022 Rev.002 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001