BD9479FV-GE2

Datasheet LED Drivers for LCD Backlights White LED Driver for large LCD Panels (DCDC Converter type) BD9479FV ●General Description BD9479FV is a high efficiency driver for white LEDs and designed for large LCDs. This IC is built-in a boost DCDC converters that employ an array of LEDs as the light source. BD9479FV has some protect function against fault conditions, such as the over-voltage protection (OVP), the over current limit protection of DCDC (OCP), the short circuit protection (SCP), the open detection of LED string. Therefore BD9479FV is available for the fail-safe design over a wide range output voltage. ●Features  8ch LED constant current driver (external PNP Tr Type)  Maximum LED setting current 500mA (VREF pin setting)  Build-in DC/DC converter  Analog Dimming (Linear) function  Individual channel PWM Dimming function  LED protection function (Open Short protection) [PWM-independent Type]  Output short protection (OVP)  Built-in Timer latch function (CP)  Built-in under voltage Lockout function (UVLO)・over voltage protection (OVP)  Built-in FAIL indication function  Built-in OVP voltage Feedback function  Built-in PWM-independent soft start circuit  SSOP-B40 Package ●Key Specification  Operating power supply voltage range: 9.0V to 35.0V  Oscillator frequency: 150kHz (RT=100kΩ)  Operating Current: 8.7mA (typ.)  Operating temperature range: -40℃ to +85℃ ●Applications TV, Computer Display, Notebook, LCD Backlighting ●Package SSOP-B40: W(Typ.) D(Typ.) H(Max.) 13.6mm x 7.80mm x 1.80mm Pin Pitch: 0.65mm ●Typical Application Circuit STB PWMx 1 40 39 REG50 VCC N FAIL 2 38 PGND 37 CS 34 UVLO 3 33 AGND 4 OVP FB 36 CP VREF 35 5 LSP SS 6 STB RT 7 CLx 8 BSx PWMx Figure 1. SSOP-B40 FAIL VREF Figure 2. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Power supply voltage VCC 36 V BS1-8 40 V OVP, STB, PWM1-8,VREF,UVLO REG50, N, CS, CP, LSP, CL1-8, FB, SS, RT Pd 20 V 7 V 1.125(Note1) W Ta(opr) -40 to +85 ℃ Tstg -55 to +150 ℃ Tjmax 150 ℃ BS1-8 terminal voltage OVP, STB, PWM1-8,VREF,UVLO terminal voltage REG50, N, CS, CP, LSP, CL1-8, FB, SS, RT terminal voltage Power dissipation (SSOP-B40)*1 Operating temperature range Storage temperature range Junction temperature (Note1) SSOP-B40 package at Ta25C or higher, de-rating power rating by 9.0mW/C(70.0mm x 70.0mm x1.6mm with 1-layer board) ●Operating Ratings (Ta = 25℃) Parameter Symbol Limits Unit VCC supply voltage VCC 9.0 to 35.0 V Analog Dimming setting (VREF Pin) range VREF 0.6 to 3.0 V LSP setting voltage range VLSP 0.3 to 3.0 V FCT 100 to 800 kHz F_PWM 0.05 to 20 kHz Symbol Limits Unit CVCC 1 to 100 uF RRT 18.75 to 150 kΩ DC/DC oscillation frequency PWM pin input frequency range Above operating condition are the constants of IC itself. Please pay attention at the actual set. ●Recommended external component range Parameter VCC pin connecting capacity DC/DC frequency setting resistant REG50 pin connecting capacity CREG50 1.0 to 10 uF Soft start setting capacity CSS 0.001 to 1.0 uF Timer Latch setting capacity CCP 0.001 to 1.0 uF Above operating condition are the constants of IC itself. Please pay attention at the actual set. ●Pin Configuration ●Marking diagram and physical dimension Marking BD9479FV 1PIN MARK LOT No Figure 4. Physical Dimension SSOP-B40 Figure 3. Pin Configuration www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV o ●Electrical Characteristics (Unless otherwise noted, Ta = 25 C, VCC=24V) Parameter Symbol Limit Min. Typ. Max. Unit Condition [Whole Device] Operation current ICC － 8.7 14.0 mA STB=3V, PWM1-8=0V Standby current IST － 12 24 uA STB=0V Operation Voltage （VCC） VUVLO_VCC 6.5 7.5 8.5 V VCC=SWEEP UP Hysteresis Voltage （VCC） VUHYS_VCC 150 300 600 mV Operation Voltage （UVLO） VUVLO 2.91 3.00 3.09 V Hysteresis Voltage（UVLO） VUHYS 170 210 250 mV VEAMP 0.55 0.60 0.65 V 142.5 150.0 157.5 kHz RT=100kΩ N pin MAX DUTY output FCT NMAX_DUT Y 90 95 99 % RT=100kΩ N pin source ON resistor RNSO 0.5 1 2 Ω N pin sink ON resistor RNSI 0.5 1 2 Ω RT pin Voltage VRT 1.00 1.50 2.00 V ISSSO -2.4 -2.0 -1.6 uA VSS_ED 3.6 4.0 4.4 V FB pin source current IFBSO -110 -100 -90 uA FB pin sink current IFBSI 85 100 115 uA Over current detect Vlotage VCS 0.35 0.40 0.45 V CP pin source current ICPSO -2.4 -2.0 -1.6 uA CP pin detect Voltage VCP 2.375 2.500 2.625 V OVP High detect voltage VOVPH 2.137 2.250 2.363 V OVP Feedback Voltage VOVPFB 2.375 2.500 2.625 V OVP Low detect Voltage VOVPL 0.14 0.20 0.30 V VRCL 295.5 300.0 304.5 mV VRCLMAX -3% 1.0 +3% V VREF max=3.0V VRCLMIN -3% 200.0 +3% mV VREF min=0.6V RBS 55 80 120 Ω PWMx=High, VCL=Low IVREF -1.0 0.0 1.0 uA VREF=1V [UVLO Block] VCC=SWEEP DOWN UVLO=SWEEP UP UVLO=SWEEP DOWN [DC/DC Block] Error amp Base Voltage Oscillation frequency SS pin source current Soft start ended Voltage BSx pin, VREF=0.9V RT=100kΩ [DC/DC Protection Block] [LED PNP Driver Block] CL pin current setting Voltage CL pin current setting Voltage (Analog MAX) CL pin current setting Voltage (Analog MIN) PNP Driver output sink resistor VREF pin input current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/26 VREF=0.9V TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV o ●Electrical Characteristics (Unless otherwise noted, Ta = 25 C, VCC=24V) Parameter Symbol Limit Unit Condition Min. Typ. Max. VOPEN 0.05 0.10 0.15 V VLSP 8.5 9.0 9.5 V CL pin Detect Voltage VCLLVP 0.05 0.10 0.15 V LSP pin pull high resistor RULSP 1260 2100 3180 kΩ LSP=0V LSP pin pull down resistor RDLSP 540 900 1620 kΩ LSP=3V REG50 4.95 5.00 5.05 V |IREG50| 5 - - mA Io=-5mA ※DCDC block consumption is neglected. STB pin HIGH Voltage STBH 2.0 - VCC V STB=SWEEP UP STB pin LOW Voltage STBL -0.3 - 0.8 V STB=SWEEP DOWN STB pin Pull Down resistor RSTB 0.5 1.0 2.0 MΩ PWMx pin High detect voltage PWM_H 2.0 - 18 V PWM=SWEEP UP PWMx pin Low detect voltage PWM_L -0.3 - 0.8 V PWM=SWEEP DOWN PWMx pin Pull Down resistor RPWM 0.5 1.0 2.0 MΩ RFAIL 30 50 85 Ω 0.0 1.0 uA [LED protection Block] LED OPEN Detect Voltage LED SHORT Detect Voltage BSx=SWEEP DOWN BSx=SWEEP UP, LSP=OPEN [REG50 Block] REG50 output Voltage REG50 maximum output current [STB Block] STB=3.0V [PWM input Block] PWM=3.0V [FAIL Block(OPEN DRAIN)] FAIL pin Ron FAIL pin Leakage current ILFAIL -1.0 (This product is not designed to be radiation-proof.) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/26 FAIL=36V TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Pin Descriptions Pin No Pin Name In/Out Function Rating [V] 1 REG50 Out 5V regulator output for N output pin -0.3 ~ 7 2 N Out DC/DC switching output pin -0.3 ~ 7 3 PGND - Power GND - 4 CS In DCDC external NMOS current monitor pin -0.3 ~ 7 5 OVP In Overvoltage protection detection pin -0.3 ~ 20 6 CP Out Timer Latch setting pin -0.3 ~ 7 7 LSP In LED short voltage setting pin -0.3 ~ 7 8 STB In Enable pin -0.3 ~ 20 9 BS1 In PNP Tr Base connecting pin１ -0.3 ~ 40 10 BS2 In PNP Tr Base connecting pin２ -0.3 ~ 40 11 BS3 In PNP Tr Base connecting pin３ -0.3 ~ 40 12 BS4 In PNP Tr Base connecting pin４ -0.3 ~ 40 13 BS5 In PNP Tr Base connecting pin５ -0.3 ~ 40 14 BS6 In PNP Tr Base connecting pin６ -0.3 ~ 40 15 BS7 In PNP Tr Base connecting pin７ -0.3 ~ 40 16 BS8 In PNP Tr Base connecting pin８ -0.3 ~ 40 17 PWM1 In Dimming signal input pin１ -0.3 ~ 20 18 PWM2 In Dimming signal input pin２ -0.3 ~ 20 19 PWM3 In Dimming signal input pin３ -0.3 ~ 20 20 PWM4 In Dimming signal input pin４ -0.3 ~ 20 21 PWM5 In Dimming signal input pin５ -0.3 ~ 20 22 PWM6 In Dimming signal input pin６ -0.3 ~ 20 23 PWM7 In Dimming signal input pin７ -0.3 ~ 20 24 PWM8 In Dimming signal input pin８ -0.3 ~ 20 25 CL8 Out PNP Tr collector ・current detection pin８ -0.3 ~ 7 26 CL7 Out PNP Tr collector ・current detection pin７ -0.3 ~ 7 27 CL6 Out PNP Tr collector ・current detection pin６ -0.3 ~ 7 28 CL5 Out PNP Tr collector ・current detection pin５ -0.3 ~ 7 29 CL4 Out PNP Tr collector ・current detection pin４ -0.3 ~ 7 30 CL3 Out PNP Tr collector ・current detection pin３ -0.3 ~ 7 31 CL2 Out PNP Tr collector ・current detection pin２ -0.3 ~ 7 32 CL1 Out PNP Tr collector ・current detection pin１ -0.3 ~ 7 33 VREF In 34 FB In/Out LED voltage setting pin -0.3 ~ 20 DCDC phase-compensation pin -0.3 ~ 7 35 SS Out Soft Start pin -0.3 ~ 7 36 RT Out DCDC frequency setting resistor connection pin -0.3 ~ 7 37 UVLO In Under voltage Lockout protection pin -0.3 ~ 20 38 AGND - Analog GND 39 FAIL Out VCC - 40 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 - Error detection output pin -0.3 ~ 36 Power supply pin -0.3 ~ 36 5/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Pin ESD Type REG50 / N / PGND / CS OVP REG50 N 100k PGND CS CP LSP STB BS(1-8) / CL(1-8) PWM(1-8) VREF FB SS RT Figure 5-1. Pin ESD Type www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV UVLO FAIL Figure 5-2. Pin ESD Type ・・・ ●Block Diagram Figure 6. Block Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Typical Performance Curve Figure 8. REG50[V] vs. VCC[V] Figure 7. Operating Current (ICC) [mA] vs. VCC[V] 7 15 13 6 REG50 [V] ICC [mA] 11 9 7 5 4 3 5 3 2 9 13 17 21 25 29 33 9 13 17 VCC [V] 21 25 29 33 VCC [V] Figure 9. CL1 Voltage (VRCL1) [V] vs. VREF [V] Figure 10. N Frequency [MHz] vs. R_RT [MΩ] 2 10 1.6 N Freq [MHz] VRCL1 [V] 1 1.2 0.8 0.4 0.01 0.015 0 0.6 1.1 1.6 2.1 0.1 2.6 0.035 0.055 VREF [V] 0.075 0.095 0.115 0.135 RRT [MΩ] Figure 11. CL1 Voltage (VRCL1) [V] vs. Temp [℃] Figure 12. FB Current (IFB) [uA] vs. VBS1 [V] 400 160 380 120 360 80 340 40 300 IFB [uA] VRCL1 [V] 320 280 260 0 -40 -80 240 -120 220 -160 200 -40 -20 0 20 40 60 0 80 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.2 0.4 0.6 0.8 1 1.2 1.4 VBS1 [V] TEMP [°C] 8/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Pin Function ○Pin 1: REG50 The REG pin is used in the DC/DC converter driver block to output 5V power. The maximum operating current is 5mA. Using the REG pin at a current higher than 5mA can affect the N pin output pulse, causing the IC to malfunction and leading to heat generation of the IC itself. To avoid this problem, it is recommended to make load setting to the minimum level. ○Pin 2:N The N pin is used to output power to the external NMOS gate driver for the DC/DC converter in the amplitude range of approx. 0 to 5V. Frequency setting can be made with a resistor connected to the RT pin. For details of frequency setting, refer to the description of the ＜RT pin＞. ○Pin 3: PGND The PGND pin is a power ground pin for the driver block of the N output pin. ○Pin 4: CS CS pin is current detect for DC/DC current mode inductor current control pin. Current flowing through the inductor is converted into voltage by the current sensing resistor RCS connected to the CS pin and this voltage is compared with voltage set with the error amplifier to control the DC/DC output voltage. The CS pin also incorporates the overcurrent protection (OCP) function. If the CS pin voltage reaches 0.4V (Typ.) or more, switching operation will be forcedly stopped. In order to prevent the malfunction while OCP occurred in BD9479FV,it equipped with mask function.It mask OCP signal within 200ns interval after N driver is outputted.  Pin 5: OVP The OVP pin is an input pin for overvoltage protection and short circuit protection of DC/DC output voltage.When voltage of it over 2.25V or higher,CP pin start to charge.When it over 2.5V(typ),it will control FB pin.When OVP pin voltage is near 2.5V,DCDC output feedback will controlled by OVP pin voltage. When OVP pin voltage 4V BSx > 0.1V Latch CLx CLx < 0.1V H SS > 4V CLx > 0.1V Latch BSx BSx > 9V H SS > 4V BSx < 9V Latch UVLO UVLO < 2.79V - - UVLO > 3V Auto-restart REG50 REG50 < 4.2V - - REG50 > 4.5V Auto-restart VCC VCC < 7.2V - - VCC > 7.5V Auto-Restart OVP OVP OVP > 2.25V - SS > 4V OVP < 2.25V Latch OVP Feedback OVP OVP > 2.5V H - OVP < 2.5V Pulse-by-pulse SCP OVP OVP < 0.2V - - OVP > 0.2V OCP CS CS > 0.4V - - CS < 0.4V LED OPEN LED SHORT UVLO Latch (Pulse-by-pulse and gate is OFF) N output stops (200ns Mask from Gate ON) To release the latch function, STB should be set to “L” once, and then to “H”. (CP does not charged under Soft start duration.) *When abnormality is detected under PWM=H, CP will continue to charge even if PWM=L. To release the latch function, STB should be set from “L” to “H”.(CP does not charged under Soft start duration.) Protect Function Operation after protect function detects error DC/DC LED Driver Soft Start FAIL Pin STB Instantaneously stops Instantaneously stops Instantaneously discharged OPEN LED Open Stops operating after CP charged Stops operating charged after CP Discharge after CP discharged GND after CP charged LED short Stops operating after CP charged Stops operating charged after CP Discharge after CP discharged GND after CP charged UVLO Instantaneously stops Instantaneously discharged GND OVP Stops operating after CP charged Stops operating charged after CP Discharge after CP discharged GND after CP charged SCP N output stops Stops operating charged after CP Discharge after CP discharged GND after CP charged OCP N pin limits duty cycle Normal operation OPEN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Instantaneously stops Normal operation 24/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Operational Notes 1) We pay utmost attention to the quality control of this product. However, if it exceeds the absolute maximum ratings including applied voltage and operating temperature range, it may lead to its deterioration or breakdown. Further, this makes it impossible to assume a breakdown state such as short or open circuit mode. If any special mode to exceed the absolute maximum ratings is assumed, consider adding physical safety measures such as fuses. 2) Making a reverse connection of the power supply connector can cause the IC to break down. To protect the IC form breakdown due to reverse connection, take preventive measures such as inserting a diode between the external power supply and the power supply pin of the IC. 3) Since current regenerated by back electromotive force flows back, take preventive measures such as inserting a capacitor between the power supply and the ground as a path of the regenerative current and fully ensure that capacitance presents no problems with characteristics such as lack of capacitance of electrolytic capacitors causes at low temperatures, and then determine the power supply line. Provide thermal design having an adequate margin in consideration of power dissipation (Pd) in the practical operating conditions. 4) The potential of the GND pin should be maintained at the minimum level in any operating state. 5) Provide thermal design having an adequate margin in consideration of power dissipation (Pd) in the practical operating conditions. 6) To mount the IC on a printed circuit board, pay utmost attention to the direction and displacement of the IC. Furthermore, the IC may get damaged if it is mounted in an erroneous manner or if a short circuit is established due to foreign matters entered between output pins or between output pin and power supply GND pin. 7) Note that using this IC in strong magnetic field may cause it to malfunction. 8) This IC has a built-in thermal-protection circuit (TSD circuit), which is designed to be activated if the IC junction temperature reached 150C to 200C and deactivated with hysteresis of 10C or more. The thermal-protection circuit (TSD circuit) is a circuit absolutely intended to protect the IC from thermal runaway, not intended to protect or guarantee the IC. Consequently, do not use the IC based on the activation of this TSD circuit for subsequent continuous use and operation of the IC. 9) When testing the IC on a set board with a capacitor connected to the pin, the IC can be subjected to stress. In this case, be sure to discharge the capacitor for each process. In addition, to connect the IC to a jig up to the testing process, be sure to turn OFF the power supply prior to connection, and disconnect the jig only after turning OFF the power supply. 10) This monolithic IC contains P  Isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersections of these P layers and the N layers of other elements, thus making up different types of parasitic elements. For example, if a resistor and a transistor is connected with pins respectively as shown in Fig. When GND(Pin A) for the resistor, or when GND(Pin B) for the transistor (NPN), P-N junctions operate as a parasitic diode. When GND(Pin B) for the transistor (NPN), the parasitic NPN transistor operates by the N layer of other element adjacent to the parasitic diode aforementioned. Due to the structure of the IC, parasitic elements are inevitably formed depending on the relationships of potential. The operation of parasitic diodes can result in interferences in circuit operation, leading to malfunctions and eventually breakdown of the IC. Consequently, pay utmost attention not to use the IC for any applications by which the parasitic elements are operated, such as applying a voltage lower than that of GND (P substrate) to the input pin. Transistor (NPN) Resistor B (Pin A) P N N N P P P E C (Pin B) N GND P P N N N P substrate P substrate GND Parasitic element GND Parasitic element (Pin B) B (Pin A) C E Parasitic element GND ＧＮＤ Adjacent other elements Parasitic Figure 13. Example of Simple Structure of Monolithic IC Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/26 TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet BD9479FV ●Ordering Information B D 9 4 7 9 Part Number F V - Package FV:SSOP XX Packaging and forming specification XX: Please confirm the formal name to our sales. ●Physical Dimension Tape and Reel Information SSOP-B40 13.6 ± 0.2 (MAX 13.95 include BURR) 0.5 ± 0.2 1 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 20 0.15 ± 0.1 0.1 1.8 ± 0.1 Embossed carrier tape Quantity 21 5.4 ± 0.2 7.8 ± 0.3 40 Tape 0.1 S 0.65 0.22 ± 0.1 0.08 M 1pin (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Reel 26/26 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0F1F0C100020-1-2 25.Sep.2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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