BD9532EKN

TECHNICAL NOTE High-performance Regulator IC Series for PCs Switching Regulators for DDR-SDRAM Cores BD9532EKN ●Description BD9532EKN is a switching regulator controller with high output current which can achieve low output voltage (0.7V to 2.0V) from a wide input voltage range (4.5V to 25V). High efficiency for the switching regulator can be realized by utilizing an 3 TM external N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize ultra TM high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, and REF synchronous function are all built in. This switching regulator is specially designed for the DDR-SDRAM core. ●Features 3 TM 1) H Reg Switching Regulator Controller 2) Light Load Mode and Continuous Mode Changeable 3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Over Current Protection (OCP), Short Circuit Protection(SCP) built-in 4) Soft start function to minimize rush current during startup 5) Switching Frequency Variable (f=200KHz～600KHz) 6) HQFN20V Package ●Applications Laptop PC, Desktop PC, LCD-TV, Digital Components Sep. 2008 ●Maximum Absolute Ratings (Ta=25℃) Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage BOOT-SW Voltage HG-SW Voltage LG Voltage REF Voltage Output Voltage ILIM/SCP/SS/FS/SLLM Voltage VREG Voltage EN Input Voltage Power Dissipation 1 Power Dissipation 2 Power Dissipation 3 Power Dissipation 4 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VDD VIN BOOT BOOT-SW HG-SW LG REF VOUT/Is+/IsILIM/SCP/SS/FS/SLLM VREG EN Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limit 7 *1 *2 7 *1 *2 30 *1*2 35 *1*2 7 *1 *2 7 *1 *2 VDD VCC VCC VCC VCC 7 *1 0.5 *3 0.75 *4 1.75 *5 2.00 *6 -10～+100 -55～+150 +150 Unit V V V V V V V V V V V V W W W W ℃ ℃ ℃ *1 Not to exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 4mW for each increase in Ta of 1℃ over 25℃ (when not mounted on a heat radiation board ) *4 Reduced by 6mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.) *5 Reduced by 14mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.) *6 Reduced by 16mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.) ●Operating Conditions (Ta=25℃) Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage SW Voltage BOOT-SW Voltage SLLM Input Voltage EN Input Voltage Output setting voltage Is Input Voltage MIN ON Time Symbol VCC VDD VIN BOOT SW BOOT-SW SLLM EN REF Is+/IsTonmin MIN 4.5 4.5 4.5 4.5 -0.7 4.5 0 0 0.7 0.7 - MAX 5.5 5.5 25 30 25 5.5 5.5 5.5 2.0 2.7 200 Unit V V V V V V V V V V nsec ★ This product should not be used in a radioactive environment. 2/20 ●ELECTRICAL CHARACTERISTICS (unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,EN/SLLM=5V,VIN=12V,REF=1.8V,RFS=68kΩ) Standard Value Parameter Symbol Unit MIN TYP MAX [Whole Device] VCC Bias Current Icc 700 900 μA VIN Bias Current Iin 100 200 μA VCC Standby Current Iccstb 0 10 μA VIN Standby Current Iinstb 100 200 μA EN Low Voltage Enlow GND 0.8 V EN HighVoltage Enhigh 2.3 5.5 V EN Bias Current Ien 7 10 μA VREG Voltage [Under Voltage Locked Out ] VCC threshold voltage VCC hysteresis voltage VIN threshold voltage VIN hysteresis voltage VREG threshold voltage VREG hysteresis voltage [H3RegTM Controller] Frequency ON Time MAX ON Time MIN OFF Time [FET Driver] HG Higher side ON resistor HG Lower side ON resistor LG Higher side ON resistor LG Lower side ON resistor [Dead Time] HG rising LG rising [SCP] SCP Detect Voltage SCP threshold voltage Charge current Standby voltage [Soft start] Charge current Standby voltage [Over Current Protection Block] Current limit threshold1 Current limit threshold2 Reverse-current limit threshold1 Reverse-current limit threshold2 ILIM bias current [VOUT setting ] VOUT offset voltage VOUT bias current REF bias current Is+ Input current Is- Input current [SLLM ] Continuous mode threshold SLLM threshold * Design Guarantee Condition EN=0V EN=0V Vreg Vcc_UVLO dVcc_UVLO Vin_UVLO dVin_UVLO Vreg_UVLO dVreg_UVLO Fosc Ton Tonmax Toffmin HGhon HGlon LGhon LGlon Hgdead LGdead Vscp Vscpth Iscp Vscp_stb Iss Vss_stb Ilim1 Ilim2 ReIlim1 ReIlim2 IILIM Voutoff Ivout Iref IIs+ IIsVthcon VthSLLM 2.475 4.1 100 4.1 100 2.0 100 400 REF ×0.65 1.2 1.5 1.5 43 160 REF-7m -100 -100 -1 -1 VCC-0.5 GND 2.500 4.3 160 4.3 160 2.2 160 300 500 3 450 3.0 2.0 2.0 0.5 50 50 REF ×0.7 1.25 2 2 50 200 -50 -200 15 REF 0 0 0 0 - 2.525 4.5 220 4.5 220 2.4 220 600 550 6.0 4.0 4.0 1.0 REF ×0.75 1.3 2.5 50 2.5 50 57 240 REF+7m 100 100 1 1 VCC 0.5 V V mV V mV V mV kHz nsec μsec nsec Ω Ω Ω Ω nsec nsec V V μA mV μA mV mV mV mV mV nA V nA nA μA μA V V Ireg=100μA Ta=-10℃ to 100℃* VCC:Sweep up VCC:Sweep down VIN:Sweep up VIN:Sweep down VREG:Sweep up VREG:Sweep down ILIM=0.5V Ta=-10℃ to 100℃* ILIM=2.0V Ta=-10℃ to 100℃* Is+=1.8V Is-=1.8V 3/20 ●Reference Data 600 590 580 2.500 2.498 2.496 2.494 2.492 2.490 4.30 4.25 4.20 Sweep up VREG[V] VCC[V] Icc(uA) 4.15 4.10 4.05 4.00 570 560 550 -10 Sweep down 10 30 50 Ta( ℃) 70 90 -10 10 30 50 Ta( ℃) 70 90 -10 10 30 50 Ta( ℃) 70 90 Fig.1 Ta vs Icc Fig.2 Ta vs VREG Fig.3 Ta vs UVLO (VCC) 4.30 4.25 4.20 2.20 1.7 1.6 Sweep up VREG[V] 2.15 2.10 2.05 2.00 1.95 1.90 Sweep up EN[V] Sweep up VIN[V] 1.5 1.4 4.15 4.10 4.05 4.00 -10 10 30 50 Ta( ℃) 70 90 Sweep down Sweep down 1.3 1.2 -10 Sweep down -10 10 30 50 Ta(℃) 70 90 10 30 50 Ta( ℃) 70 90 Fig.4 Ta vs UVLO (VIN) Fig.5 Ta vs UVLO (VREG) Fig.6 Ta vs EN Threshold 2.8 2.4 2.0 TON [nsec] 1000 900 800 700 600 500 400 300 200 100 0 600 500 400 300 200 100 0 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.2 0.8 0.4 0.0 0 1.5 3 4.5 Vcc(V) 6 Right: -10℃ Middle: 25℃ Left: 100℃ Top: -10℃ Middle: 25℃ Bottom: 100℃ TON [nsec] VREG(V) Top: -10℃ Middle: 25℃ Bottom: 100℃ 0.6 0.8 1 1.2 1.4 1.6 1.8 2 REF [V] REF [V] Fig.7 VCC vs VREG (Start up) Fig.8 REF vs ON TIME (VIN=7V) Fig.9 REF vs ON TIME (VIN=12V) 400 350 300 TON [nsec] 1200 1000 3 2 200 150 100 50 0 0.6 0.8 1 1.2 Top: -10℃ Middle: 25℃ Bottom: 100℃ TON [nsec] 250 600 400 200 0 Top: -10℃ Middle: 25℃ Bottom: 100℃ VOUT-REF [mV] 25 800 1 0 -1 -2 -3 1.4 1.6 1.8 2 5 10 15 VIN [V] 20 -10 10 30 50 70 90 REF [V] Fig.10 REF-ON TIME (VIN=25V) Ta [℃] Fig.11 VIN-ON TIME (REF=1.8V) Fig.12 Ta vs VOUT offset 4/20 ●Reference Data 54 350 330 frequency[kHz] 310 290 270 400 360 frequency[kHz] 52 ⊿Is [mV] Io=2A 320 280 240 200 50 Io=0A 48 ILIM=0.5V 46 -10 10 30 50 Te [℃] 70 90 250 -10 10 30 50 Ta(℃) 70 90 0 5 10 15 VIN(V) 20 25 Fig.13 Ta vs current limit threshould 100 Fig.14 Ta vs Frequency Fig.15 VIN vs Frequency 100 100 SLLM 80 80 SLLM 80 SLLM 60 η[%] η[%] 40 40 Continuous mode η[%] Continuous mode 60 60 40 Continuous mode 20 20 20 0 1 10 100 Io(mA) 1000 10000 0 1 10 100 Io(mA) 1000 10000 0 1 10 100 Io(mA) 1000 10000 Fig.16 Io vs Efficiency (VIN=7V) Fig.17 Io vs Efficiency (VIN=12V) Fig.18 Io vs Efficiency (VIN=20V) VOUT VOUT HG/LG VOUT HG/LG HG/LG IOUT IOUT IOUT Fig.19 Load Transient Response (VIN=7V) Fig.20 Load Transient Response (VIN=12V) Fig.21 Load Transient Response (VIN=19V) VOUT VOUT HG/LG VOUT HG/LG HG/LG IOUT IOUT IOUT Fig.22 Load Transient Response (VIN=7V) Fig.23 Load Transient Response (VIN=12V) Fig.24 Load Transient Response (VIN=19V) 5/20 ●Reference Data VOUT IL VOUT IL VOUT IL HG/LG HG/LG HG/LG Fig.25 SLLM (IOUT=0A) Fig.26 SLLM (IOUT=0.4A) Fig.27 SLLM (IOUT=1A) IL IL IL HG/LG/SW HG/LG/SW HG/LG/SW Fig.28 Continuous MODE (Io=0A) Fig.29 Continuous MODE (Io=4A) Fig.30 Continuous MODE (Io=5A) VIN VIN EN HG/LG HG/LG SS VOUT VOUT VOUT Fig.31 VIN change (5→19V) 1.82 400 350 Fig.32 VIN change (19→5V) 700 Fig.33 FS VIN wake up Continuous mode Frequency [kHz] 600 1.81 VOUT [V] Frequency [kHz] Continuous mode 300 250 200 150 100 50 500 From upper side VIN=5V 7V 12V 16V 19V 1.8 400 1.79 SLLM SLLM 300 200 1.78 1 10 100 Iout [mA] 1000 10000 0 1 10 100 Iout [mA] 1000 10000 100 30 40 50 60 70 80 90 100 110 120 130 RFS [kΩ] Fig.34 IOUT-VOUT Fig.35 IOUT-Frequency Fig.36 FS resistance- Frequency 6/20 ●Block Diagram 2 VCC 5 VIN 19 VREG 16 SS EN 4 Reference Block VREG VIN VDD UVLO SS 2.5VReg 2.5V Soft Start Block BOOT 15 14 VIN REF×0.7 SCP SCP 7 REF 20 SS×0.7 VOUT SCP H Reg 3 TM HG R S Q SLLM Driver Circuit 13 VOUT Controller Block SS 18 SLLM Current Limit ILIM + SW VDD 12 11 VOUT + + TSD UVLO ILIM SCP TSD LG 10 Thermal Protection PGND 1 GND FS 17 6 SLLM ILIM 3 Is+ 9 8 Is- ●PHYSICAL DIMENSIONS ●Pin Number・Pin Name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 - Pin Name GND VCC ILIM EN VIN SLLM SCP ISIS+ PGND LG VDD SW HG BOOT SS FS VOUT VREG REF FIN BD9532 1PIN MARK Lot No. (UNIT：mm) HQFN20V ※ Mounting is not recommended to the dotted line part. Please short FIN to the 1PIN 7/20 ●Pin Descriptions ・GND(1pin) This is the ground pin for IC internal circuits. It is equivalent to FIN voltage. ・VCC(2pin) This is the power supply pin for IC internal circuits, except the FET driver. The maximum circuit current is 900uA. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 0.1uF bypass capacitor be put in this pin. ・ILIM(3pin) BD9532EKN detects the voltage between Is+ pin and Is- pin and limits the output current (OCP). Voltage equivalent to 1/10 of the ILIM voltage is the voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. ・EN(4pin) When EN pin voltage is at least 2.3V, the status of this switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V and circuit current becomes 10uA. ・VIN(5pin) The duty cycle is determined by input voltage and output voltage. In other words, the output voltage is affected by input voltage. Therefore, when VIN voltage fluctuates, the output voltage becomes also unstable. Since the VIN line is also the input voltage of the switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application. ・SLLM(6pin) This is the switch shift pin for Simple Light Load Mode. The efficiency in SLLM is improved when SLLM pin voltage goes lower than 0.5V. ・SCP(7pin) This is the pin to adjust the timer latch time for short circuit protection. The timer circuit is active when the pin voltage becomes 70% of REF, and the output switches OFF and latched after the specified time. When the UVLO circuit is active or EN is low, this latch function is cancelled. ・Is-(8pin) ,Is+(9pin) These pins are connected to both sides of the current sense resistor to detect output current. The voltage drop between Is+ and Is- is compared with the voltage equivalent to 1/10 of ILIM voltage. When this voltage drop reaches the specified voltage level, the output voltage goes OFF. ・PGND(10pin) This is the power ground pin connected to the source of the low side FET. ・LG(11pin) This is the voltage supply to drive the Gate of the low side FET. This voltage swings between VDD and PGND. High-speed Gate driving for the low side FET is achieved due to the low on-resistance (2 ohm when LG is high, 0.5 ohm when LG is low) of the driver. ・VDD(12pin) This is the power supply pin to drive the LOW side FET. It is recommended that a 1uF bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. ・SW(13pin) This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between VIN and GND. ・HG(14pin) This is the voltage supply to drive the Gate of the high side FET. This voltage swings between BOOT and SW. High-speed Gate driving for the high side FET is achieved due to the low on-resistance (3 ohm when HG is high, 2 ohm when HG is low) of the driver. ・BOOT(15pin) This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from SW). BOOT voltage swings between VIN+Vcc and Vcc during active operation. ・SS(16pin) This is the adjustment pin to set the soft start time. SS voltage is low during standby status. When EN is ON, the soft start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage, the output voltage is equivalent to SS voltage. ・FS(17pin) This is the pin to adjust the switching frequency based on the resistor value. The frequency range is f=200KHz - 600KHz. ・VOUT(18pin) This is the output voltage sense pin. It is also possible to adjust the output voltage using external resistor divider based on the equation, REF≒VOUT. ・VREG(19pin) This is the reference voltage output pin. The voltage is 2.5V, with 100uA current ability. It is recommended that a 1uF capacitor (X5R or X7R) be established between VREG and GND. When REF is not adjusted from the external voltage supply, the REF voltage can be adjusted using the external resistor divider of VREF. ・REF(20pin) This is the output voltage adjustment pin. It is very convenient for synchronizing external voltage supply. The IC controls the output voltage (REF≒VOUT). 8/20 ●Explanation of Operation 3 TM The BD9532EKN is a synchronous buck regulator controller incorporating ROHM’s proprietary H Reg CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency. 3 TM H Reg control (Normal operation) VOUT REF When VOUT falls to a threshold voltage (REF), the drop is 3 TM detected, activating the H Reg CONTROLLA system. TON= REF 1 × VIN f [sec]・・・(1) HG HG output is determined with the formula above. LG outputs until the status of VOUT is lower than REF after the status of HG is off. LG (VOUT drops due to a rapid load change) VOUT REF When VOUT drops due to a rapid load change, and the voltage remains below REF after the programmed TON time interval has elapsed, the system quickly restores VOUT by extending the TON time, improving the transient response. Io HG TON+α LG (SLLM ) VOUT REF In SLLM (SLLM=0V), SLLM function is operated when LG pin is OFF and the coil current is lower than 0A (the current goes from VOUT to SW). And it stops to output next HG. When VOUT goes lower than REF voltage again, the status of HG is ON. HG LG 0A 9/20 ●Timing Chart • Soft Start Function EN TSS SS Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. Soft start time VOUT Tss= REF×Css 2μA(typ) [sec] ・・・(2) Incoming current IIN IIN= Co×VOUT Tss [A] ・・・(3) (Css: Soft start capacitor; Co: Output capacitor) ・Timer Latch Type Short Circuit Protection REF×0.7 VOUT TSCP SCP Short protection kicks in when output falls to or below REF X 0.7. When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. Output voltage can be restored either by reconnecting the EN pin or disabling UVLO. Short circuit protection time is programmed using formula (4) below. EN/UVLO Short protection time setting Tscp= 1.25(V)×CSCP 2μA(typ) [sec] ・・・(4) ・Over current protection circuit tON HG tON TMAX LG ILIMIT IL During the normal operation, when VOUT becomes less than REF Voltage, HG becomes High during the time TON. However, when inductor current exceeds ILIMIT threshold, HG becomes OFF. After MAX ON TIME, HG becomes ON again if the output voltage is lower than the specific voltage level and IL is lower than ILIMIT level. 10/20 ●External Component Selection 1. Inductor (L) selection The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. (VIN-VOUT)×VOUT ΔIL= [A]・・・(5) ΔIL×VIN×f The proper output ripple current setting is about 30% of maximum output current. ΔIL=0.3×IOUTmax. [A]・・・(6) L= (VIN-VOUT)×VOUT ΔIL×VIN×f [H]・・・(7) ΔIL VIN IL VOUT L Co (ΔIL: output ripple current; f: switch frequency) Output ripple current ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2.Output Capacitor (CO) Selection VIN When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (8) below. ΔVOUT=ΔIL×ESR+ESL×ΔIL/TON [V]・・・(8) (ΔIL: Output ripple current; ESR: CO equivalent series resistance, ESR:equivalent series inductance) ※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. VOUT L ESR ESL Co Output capacitor Please give due consideration to the conditions in formula (9) below for output capacity, bearing in mind that output rise time must be established within the soft start time frame. Co≦ Tss×(Limit-IOUT) VOUT ・・・(9) Tss: Soft start time Limit: Over current detection Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection VIN Cin The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (10) below. VOUT L IRMS=IOUT× √ out(VIN-VOUT) V VIN IOUT 2 [A]・・・(10) Co Where VIN=2×VOUT, IRMS= Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. 11/20 4. MOSFET Selection Loss on the main MOSFET VIN main switch Pmain=PRON+PGATE+PTRAN VOUT VIN ×RON×IOUT2+Ciss×f×VDD+ 2 VIN ×Crss×IOUT×f VOUT L Co = IDRIVE ・・・(11) (Ron: On-resistance of FET; Ciss: FET gate capacity; f: Switching frequency Crss: FET inverse transfer function; IDRIVE: Gate peak current) Loss on the synchronous MOSFET Psyn=PRON+PGATE = VIN-VOUT VIN ×RON×IOUT2+Ciss×f×VDD ・・・(12) synchronous switch 5. Setting Detection Resistance VIN The over current protection function detects the output ripple current peak value. This parameter (setting value) is determined as in formula (13) below. L R VOUT IL Co ILMIT= VILIM×0.1 R [A]・・・(13) (VILIM: ILIM voltage; R: Detection resistance) Current limit VIN IL L RL VOUT Co When the over current protection is detected by DCR of coil L, this parameter (setting value) is determined as in formula (14) below. (Application circuit:P20) r×C L ILMIT=VILIM×0.1× (RL= L r×C ) [A]・・・(14) r C (VILIM:ILIM voltage RL: the DCR value of coil) Current limit IL ILIMIT detect point As soon as the voltage drop between Is+ and Is- generated by the inductor current becomes specific threshold, the gate voltage of the high side MOSFET becomes low. Since the peak voltage of the inductor ripple current is detected, this operation can sense high current ripple operation caused by inductance saturated rated current and lead to high reliable systems. t 0 12/20 6.Setting frequency 3000 2500 2000 TON [nsec] 1500 1000 500 VIN=5V 7V 12V 16V 19V The On Time(TON) at steady state is determined by resistance value connected to FS pin. But actually SW rising time and falling time come up due to influence of the external MOSFET gate capacity or switching speed and TON is increased. The frequency is determined by the following formula after TON, input current and the REF voltage are fixed. REF=1.8V 0 0 50 100 RFS [kΩ] 150 200 F= REF VIN×TON ・・・(15) 1200 1000 800 600 400 200 0 0 50 100 Resistance [kΩ] 150 200 7. Setting standard voltage (REF) VIN It is available to synchronize setting the reference voltage (REF) with outside supply voltage [V] by using outside power supply voltage. Frequency [kHz] VIN=5V 7V 12V 16V 19V Consequently, total frequency becomes lower than the formula above. TON is also influenced by Dead Time around the output current 0A area in continuous mode. This frequency becomes lower than setting frequency. It is recommended to check the steady frequency in large current area (at the point where the coil current doesn’t back up). REF H Reg 3 TM R S Q CONTROLLA Outside voltage VOUT VREG R1 REF VIN It is available to set the reference voltage (REF) by the resistance division value from VREG in case it is not set REF from an external power supply. R S Q REF= R2 R1+R2 ×VREG [V]・・・(16) H3RegTM CONTROLLA R2 VOUT 13/20 8. Setting output voltage This IC is operated that output voltage is REF≒VOUT. And it is operated that output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V. VIN VIN REF H3RegTM CONTROLLA R S Q SLLM Driver SLLM Circuit Output voltage VOUT In case the output voltage range is 0.7V to 2.0V. It is operated that the resistance division value of the output voltage is feed back to VOUT pin in case the output voltage is more than 2.0V. R1+R2 R2 output voltage≒ ×REF [V]・・・(17) VIN VIN REF H3RegTM CONTROLLA R S Q SLLM Driver SLLM Circuit R1 Output voltage VOUT R2 In case the output voltage is more than 2.0V. 14/20 ●I/O Equivalent Circuit 3pin (ILIM) VCC 4pin (EN) 5pin (VIN) 6pin (SLLM) VCC 7pin (SCP) VCC 8pin (Is-) VCC 9pin (Is+) VCC 11pin (LG) VCC VDD 13pin (SW) BOOT HG 14pin(HG) BOOT BOOT 15pin (BOOT) 16pin (SS) VCC HG SW 17pin (FS) VCC 18pin (VOUT) VCC 19pin (VREG) VCC 20pin (REF) VCC 15/20 ●Evaluation Board Circuit (Frequency=300kHz application circuit in Continuous mode/SLLM) 4.5V～25V VIN VCC 5V R2 R16 BD9532EKN 5 4 VIN EN BOOT 6 SLLM HG SW 14 13 R8 R10 VDD 12 D1 VCC EN R18 SLLM R19 VREG 2.5V R14 R12 PGND C15 C8 PGND Q1 PGND PGND L1 R7 1.8V/10A VOUT 19 VREG ILIM 0.5V REF 1.8V R1 20 17 7 Ｒ9 R21 R22 R23 REF FS C13 C14 R15 R13 R24 PGND 10 R4 9 C16 D2 C3 R3 SCP SS VCC GND Is+ PGND PGND PGND PGND R25 R17 R20 16 2 C11 C12 C2 C1 Is- 8 18 R5 VOUT 1 GND Part No U1 Q1 Q2 D1 D2 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 R1 R2 R3 Value Company ROHM ROHM ROHM ROHM ROHM KYOCERA MURATA MURATA Part name BD9532EKN RSS100N03 RSS100N03 RB521S-30 RB051L-40 CM105B105K06A GRM39X7R103K50 GRM39C0G101J50 Part No R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R26 L1 Value Company Part name 0Ω 5mΩ 0Ω 0Ω 0Ω 0Ω 200kΩ 51kΩ 68kΩ 180kΩ 1kΩ 0Ω 10kΩ 10kΩ 0Ω ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM MCR03 PMR100 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 1uF 10nF 100pF 10uF 0.1uF 10uF 10uF 1000pF 1500pF 1uF 100pF 10uF 470uF 68KΩ 0Ω 0Ω KYOCERA KYOCERA KYOCERA KYOCERA MURATA MURATA KYOCERA MURATA KYOCERA SANYO ROHM ROHM ROHM CM21B106M06A CM105B104K25A CT32X5R106K25A CT32X5R106K25A GRM39X7R102K50 GRM39X7R152K50 CM105B105K06A GRM39C0G101J50 CM21B106M06A 2R5TPE470ML MCR03 MCR03 MCR03 0Ω 0Ω 0Ω 1.8uH ROHM ROHM ROHM SUMIDA MCR03 MCR03 MCR03 CDEP104-1R8ML 16/20 R26 C4 C5 ILIM R6 C17 3 LG 11 Q2 C10 C9 15 R11 C6 ●Evaluation Board Circuit (Frequency=300kHz application circuit for detecting DCR current in Continuous mode/SLLM) 4.5V～25V VIN VCC 5V R2 Ｒ16 BD9532EKN 5 VIN EN BOOT 6 SLLM HG SW 3 ILIM 14 13 R8 R10 VDD 12 D1 VCC EN R18 SLLM R19 VREG PGND C15 4 C8 PGND Q1 PGND PGND VOUT L1 19 R14 R12 VREG ILIM D2 REF 20 R1 C13 C14 R15 R13 C3 C7 R21 R22 R23 R24 REF FS PGND 10 R4 9 C16 17 7 R3 SCP SS VCC GND Is+ PGND PGND PGND PGND R25 R17 R20 Ｒ9 16 2 C12 C11 C2 C1 Is- 8 18 R5 VOUT 1 GND ●Evaluation Board Parts List Part No U1 Q1 Q2 D1 D2 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 R1 R2 R3 Value Company ROHM ROHM ROHM ROHM ROHM KYOCERA MURATA MURATA Part name BD9532EKN RSS100N03 RSS100N03 RB521S-30 RB051L-40 CM105B105K06A GRM39X7R103K50 GRM39C0G101J50 Part No R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R26 L1 Value 0Ω 1kΩ 0Ω 0Ω 0Ω 0Ω 51kΩ 200kΩ 68kΩ 180kΩ 1kΩ 0Ω 10kΩ 10kΩ 0Ω 0Ω 0Ω Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM Part name MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 1uF 10nF 100pF 10uF 0.1uF 0.1uF 10uF 10uF 1000pF 1500pF 1uF 100pF 10uF 330uF 68KΩ 0Ω 0Ω KYOCERA KYOCERA KYOCERA KYOCERA KYOCERA MURATA MURATA KYOCERA MURATA KYOCERA SANYO ROHM ROHM ROHM CM21B106M06A CM105B104K25A CM105B104K25A CT32X5R106K25A CT32X5R106K25A GRM39X7R102K50 GRM39X7R152K50 CM105B105K06A GRM39C0G101J50 CM21B106M06A 6TPB330M MCR03 MCR03 MCR03 0Ω 3.3uH ROHM NEC/TOKIN MCR03 MPLC0730L3R3 17/20 R26 C4 C5 R6 C17 LG 11 Q2 C10 C9 15 R11 C6 ●Operation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [°C] (typ.) Hysteresis temperature [°C] (typ.) BD9532EKN 175 15 10. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 18/20 Resistor Pin A Pin A P + Transistor (NPN) Pin B C B E B P P + Pin B N P P + N N N P substrate Parasitic element GND Parasitic element P+ N N C E P substrate Parasitic element GND GND GND Parasitic element Other adjacent elements Fig. 31 Example of IC structure 12. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. ● Power Dissipation [mW] 2500 Power Dissipation [Pd] (4) 2000 (3) 1500 1000 500 0 0 25 50 75 100 125 Ambient temperature [Ta] 150 [℃] (2) (1) (1) (2) (3) IC unit time θj-a=250℃/W Substrate (Substrate surface copper foil area: none) θj-a=166.7℃/W Substrate (Substrate surface copper foil area: 60mm × 60mm…1 layer) θj-a=71.4℃/W Substrate (Substrate surface copper foil area: 60mm × 60mm…2 layers) θj-a=62.5℃/W (4) 19/20 ● Type Designations (Selections) for Ordering B ・BD9532 D 9 5 3 2 E K N ― T R Product name Package type ・EKN : HQFN20V Taping type name E2= Embossed carrier tape HQFN20V 4.2±0.1 4.0±0.1 (1.1) 15 11 (2.1) 0.5 2) Tape Quantity Direction of feed (2.1) Embossed carrier tape(with dry pack) 2500pcs E2 (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) 4.2±0.1 4.0±0.1 20 1 5 6 (0 3− (0 .3 5) 16 10 0.22±0.05 .2 0.05 +0.03 0.02 −0.02 0.95MAX +0.1 0.6 −0.3 (0 .5 0.22±0.05 ) 1234 1234 1234 1234 1234 1234 0.05 (Unit:mm) Reel 1pin Direction of feed ※When you order , please order in times the amount of package quantity. Catalog No.08T443A '08.9 ROHM © Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev3.0