BD9555FVM-CGTR

Datasheet CR Timer IC 50V 1ch Timer IC for Automotive BD9555FVM-C General Description Key Specifications ROHM’s BD9555FVM-C is 50V-withstanding 1ch CR timer IC. Cycle and duty width can be set through external resistance and capacity. It is most suitable as timer and OSC for Automotive, so input voltage range and operating temperature range are wide. „ „ Input Voltage Range: Operating Temperature Range: 4.5V to 42V -40°C to +125°C Special Characteristics PWM Frequency Range: Duty Range: Features „ „ „ „ Package AEC-Q100 Qualified(Note1) Frequency and Duty Width Setting Through External Resistance and Capacity „ Wide Input Voltage Range „ Wide Operating Temperature Range „ Very Small MSOP8 Package (Note1:Grade1) 1Hz to 10000Hz 1% to 99% W(Typ) x D(Typ) x H(Max) 2.90mm x 4.00mm x 0.90mm MSOP8: Applications All set for Automotive using timer or OSC such as Automotive LED module, etc. Typical Application Circuit VIN CVIN REN VIN CRT DCENB BD9555FVM-C RCRT DISC GND CCRT DCIN OUT Q1 OUT GND Pin Configurations, Descriptions and Marking Diagram DISC CRT GND N.C. 8 7 6 5 D 9 Part Number Marking 5 5 1 2 3 4 VIN DCENB N.C. OUT Symbol 1 VIN 2 LOT Number 5 Pin No. 1PIN MARK MSOP8 (TOP VIEW) Function Power supply DCENB “L”:Output fixed “H” / “H”:PWM output 3 N.C. N.C. 4 OUT Output 5 N.C. N.C. 6 GND GND 7 CRT CR connection 8 DISC Discharge setting Ordering Information B Part Number D 9 Timer IC 5 5 5 F V M Package FVM : MSOP8 ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 - C T R Product Rank Packaging and forming specification C : for Automotive Embossed tape and reel TR : The pin number 1 is the upper right ○This product has no designed protection against radioactive rays 1/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Physical Dimension, Tape and Reel Information Package Name MSOP8 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 2/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Absolute Maximum Ratings Parameter Power Supply Voltage CRT, DISC, DCENB, OUT Terminal Voltage Output Current Power Dissipation Symbol VIN VCRT, VDISC, VDCENB, VOUT Io Pd Rating -0.3 to +50 GND-0.3 to VIN +0.3 70 0.38 (Note1) Unit V V mA W Topr Tstg Tjmax -40 to +125 -55 to +150 150 °C °C °C Operating Temperature Range Storage Temperature Range Junction Temperature (Note1) Pd deleted at 3.8mW/°C at temperatures above Ta=25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Range Parameter Power Supply Voltage Operating Temperature Range CR Timer Frequency Range PWM Minimum Pulse Width Symbol VIN Limit 4.5 ~ 42 Unit V Topr FPWM TMIN -40 ~ +125 1~10000 1 °C Hz µs Recommended Operating Conditions Parameter Symbol Input Capacitor CRT Terminal Capacitor CRT Terminal Resistor CIN CCRT RCRT Limit Min 0.1 19p 500 Typ - Max 18µ 5M Unit µF F Ω Conditions Ceramic capacitor recommended Ceramic capacitor recommended (Note2) The minimum value of capacitor must be met this specifications over full operating conditions. (ex. Temperature, DC bias, aging conditions) (Note3) Set CCRT, RCRT to become desired frequency and Duty width by using equations shown in P.8. Electrical Characteristics (Unless Otherwise Specified Ta=-40 to +125°C, VIN =13.0V) IIN Min - Limit Typ 1.00 Max 3.00 ICRT_SO 29.75 35.00 40.25 µA VCRT_CHA 0.99 1.10 1.21 V VCRT_DIS 2.7 3.0 3.3 V RCHA 51.6 54.3 57.0 kΩ RCHA = (VCRT_DIS - VCRT_CHA) / ICRT_SO RD - 50.0 100 Ω VCRT=3.4V VIH_DCENB 4.4 - VIN +0.2 V - 3.6 V 12.3 1.28 3.8 V V Parameter Circuit Current CRT Terminal Charge Current CRT Terminal Charge ON Voltage CRT Terminal Discharge ON Voltage CRT Terminal Charge Resistance DISC Terminal Discharge Resistance DCENB Terminal “H” Input Voltage DCENB Terminal “L” Input Voltage “H” Output Voltage “L” Output Voltage Symbol VIL_DCENB www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VOH VOL GND -0.2 11.0 - 3/12 Unit Conditions mA VCRT=0.9V IOH=-10mA IOL=50mA TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Typical Performance Curves (Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, ) 40 2 CRT Charge Current ICRT_SO [µA] Circuit Current IIN [mA] 3 Ta=125°C Ta=25°C 1 Ta=-40°C 0 30 0 10 20 30 40 Input Voltage VIN [V] 50 -50 -25 0 25 50 75 100 125 150 Temperature Ta [°C] Figure 2. CRT Charge Current vs Temperature Figure 1. Circuit Current vs Input Voltage 3.5 CRT Discharge ON Voltage VCRT_DIS [V] 1.5 CRT Charge ON Voltage VCRT_CHA [V] 35 1.0 3.0 2.5 0.5 -50 -25 0 -50 25 50 75 100 125 150 Temperature Ta [°C] Figure 3. CRT Charge ON Voltage vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -25 0 25 50 75 100 125 150 Temperature Ta [°C] Figure 4. CRT Discharge ON Voltage vs Temperature 4/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Typical Performance Curves – continued (Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, ) 80 DISC Discharge Resistance R D [Ω] CRT Charge Resistance R CHA [kΩ] 70 60 50 40 60 50 40 30 20 -50 -25 0 25 50 75 100 125 150 Temperature Ta [°C] -50 -25 0 25 50 75 100 125 150 Temperature Ta [°C] Figure 6. DISC Discharge Resistance vs Temperature Figure 5. CRT Charge Resistance vs Temperature 5 5 DCENB "L" Input Voltage VIL_DCENB [V] DCENB "H" Input Voltage VIH_DCENB [V] 70 4 3 2 4 3 2 -50 -25 0 25 50 75 100 125 150 Temperature Ta [°C] -50 Figure 7. DCENB “H” Input Voltage vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -25 0 25 50 75 100 125 150 Temperature Ta [°C] Figure 8. DCENB “L” Input Voltage vs Temperatute 5/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Typical Performance Curves – continued (Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, ) 13 4 Ta=25°C "L" Output Voltage VOL [V] "H" Output Voltage VOH [V] Ta=-40°C 12 Ta=125°C 11 Ta=125°C Ta=25°C 2 1 Ta=-40°C 0 10 0 10 20 "H" Output Current IOH [mA] 0 30 10 20 30 40 50 60 70 80 90 100 "L" Output Current IOL [mA] Figure 9. “H” Output Voltage vs “H” Output Current Figure 10. “L” Output Voltage vs “L” Output Current 600 6 PWM ON Duty [%] PWM Frequency FPWM [Hz] 3 500 400 5 4 -50 -25 0 25 50 75 100 125 150 Temperature Ta [°C] -50 Figure 11. PWM Frequency vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -25 0 25 50 Temperature Ta [°C] 75 100 Figure 12. PWM On Duty vs Temperature 6/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Block Diagram VIN VREF EN OSC CRT OUT DISC GND DCENB Figure 13. BD9555FVM-C Block Diagram Functional Description Timer operation ON switches to OFF depending on DCENB terminal voltage. When DCENB terminal voltage under VIL_DCENB(3.6V(Max)), timer operation turns to OFF and output is “H”. When DCENB terminal voltage over VIH_DCENB(4.4V(Min)), CR timer function in IC is activated and triangular waveform is generated at CRT terminal. Output is “L” while CRT voltage is ramping up, and output is “H” while CRT voltage is ramping down. Ramp up / down time of CRT voltage can be set by values of external components (CCRT, RCRT) VIN +B VREF ICRT=35uA (Typ) CRT CCRT EN OUT OSC RCRT RD=50Ω(Typ) DISC GND CRT Voltage Ramp-up DCENB CRT Voltage Ramp-down V CRT_DIS 3.0V CRT Terminal Waveform ΔV CRT V CRT_CHA (1) T1= 1.1V ΔV CRT x C CRT T1 T2 (2) T2= -C CRT x (R CRT + R D ) x ln( ICRT_SO V CRT_CHA V CRT_DIS ) V OH OUT Terminal Waveform V OL www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C (1)CRT Ramp up Time T1 CRT ramp up time can be obtained from the following equations: T1 = ΔVCRT x CCRT ICRT_SO [s] where: ICRT_SO is the CRT Terminal Charge Current 35µA (Typ) (2)CRT Ramp down Time T2 CRT ramp down time is defined by discharge period due to external capacity CCRT and resistance (RCRT+RD). (CRT Terminal Charge Current is OFF at CRT ramp down.) Make sure that T2 is set at not smaller than Min. pulse width 1µs. T2 =-CCRT x (RCRT + RD) x ln( VCRT_CHA ) [s] VCRT_DIS where: RD is the CRT Terminal Discharge Resistance VCRT_CHA is the CRT Terminal Charge ON Voltage VCRT_DIS is the CRT Terminal Discharge ON Voltage 50Ω(Typ) 1.1V(Typ) 3.0V(Typ) (3)Frequency FPWM PWM Frequency is defined by T1 and T2. FPWM = 1 T1 + T2 10000 [Hz] DON = 1000 Frequency ［Hz］ (4)ON Duty (DON) Like the above, PWM ON duty is defined by T1 and T2. T2 100 T1 + T2 (Ex) In case of FPWM=500Hz and 6% Duty(Typ) From FPWM=500Hz; T1 + T2 = 1 / FPWM = 1 / 500Hz = 2000µs 10 From ON Duty = 6%; CRT ramp up time T1 is T1 = (T1 + T2) x 0.94 = 1880µs 1 0.0001 0.001 1 10 100 10 100 RCRT=10MΩ 100 External resistance RCRT is; RCRT = -T2 / (CCRT x ln(VCRT_CHA / VCRT_DIS)) – RD = -120µs / (0.035µF x ln(1.1 / 3.0)) - 50Ω ≒ 3.4kΩ 0.1 CCRT - Capacitance ［uF] External capacity CCRT is; CCRT = T1 x (ICRT_SO /ΔVCRT) = 1880µs x 35µA / 1.9V ≒ 0.035µF CRT ramp down time T2 is; T2 = (T1 + T2) x 0.06 = 120µs 0.01 RCRT=1MΩ 90 80 70 RCRT=100kΩ 60 Duty ［%］ And the characteristics example of frequency and duty is shown by the right figure. This is the reference value of external components, please decide its value by the above equations. 50 40 30 20 RCRT=10kΩ 10 RCRT=1kΩ 0 0.0001 0.001 0.01 0.1 1 CCRT - Capacitance ［uF] Figure 14. Frequency and Duty Characteristics Example www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Timing Chart VIN VIN VREF ICRT=35uA CRT (Typ) CCRT EN OUT OSC RCRT RD=50Ω(Typ) DISC DRL/Po Signal GND DCENB ON Vcc OFF H DRL/Po Signal VDCENB L H L VCRT OUT ① ② ③ Figure 15. Recommended Application Circuit and Timing Chart ① If VIN is switched ON and DCENB voltage is ”H” (VDCENB≧4.4V), VCRT will start oscillation, and according to its waveform rectangular wave is output by OUT. ② If DCENB voltage is ”L”(VDCENB≦3.6V), OUT will be fixed at ”H”(ON Duty=100%) ③ And DCENB voltage is ”H”, oscillation will start again. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 16. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Datasheet BD9555FVM-C Revision History Date Revision 27.Oct.2014 29.Mar.2016 001 002 Changes New Release Correction of erroneous description www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/12 TSZ02201-0R7R0GZ95550-1-2 29.Mar.2016 Rev.002 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001