BD9560MUV

High performance Regulators for PCs Switching Regulator Controller for Graphic Chip Cores BD9560MUV No.10030ECT10 ●Description BD9560MUV is a switching regulator controller with high output current which can achieve low output voltage (0.412V ~ 1.2875V) from a wide input voltage range (4.5V ~ 25V). The setting of output voltage depends on DAC built in. High efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection, over current protection and power good function are all built in. This switching regulator is specially designed for GMCH. ●Features 1) Switching Regulator Controller 2) Light Load Mode and Continuous Mode Changeable 3) Thermal Shut Down circuit built-in (TSD) 4) Under Voltage Lockout circuit built-in (UVLO) 5) Over Current Protection circuit built-in (OCP) 6) Over Voltage Protection circuit built-in (OVP) 7) Short circuit protection with timer-latch built-in 8) Power good circuit built-in 9) Soft start function to minimize rush current during startup 10) Switching Frequency Variable (f=200 KHz ~ 600 KHz) 11) VQFN032V5050 package ●Applications Laptop PC, Desktop PC, Digital Components ●Maximum Absolute Ratings (Ta=25℃) Parameter Input voltage 1 Input voltage 2 Input voltage 3 BOOT voltage BOOT-SW voltage HG-SW voltage LG voltage VREF voltage VRON input voltage Logic input voltage Logic output voltage 1 Logic output voltage 2 Power dissipation1 Power dissipation2 Operating Temperature Range Storage Temperature Range Junction Temperature Symbol VCC PVCC VIN BOOT BOOT-SW HG-SW LG VREF VRON CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C PWRGD SUS_OUT Pd1 Pd2 Topr Tstg Tjmax Ratings 7 7 *1*2 35 *1*2 35 *1*2 7 *1*2 7 *1*2 PVCC VCC 7 *1 VCC 7 VCC 0.38*3 0.88*4 -10 ~ +100 -55 ~ +150 +150 *1*2 Unit V V V V V V V V V V V V W W ℃ ℃ ℃ *1 Not to exceed Pd.. *2 Maximum voltage that can be proof against instantaneous applied voltage such as serge, back electromotive voltage or continuous pulse applied voltage (Duty ratio : less than 10%) *3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board ) *4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/21 2010.04 - Rev.C BD9560MUV ●Operating Conditions (Ta=25℃) Parameter Input voltage 1 Input voltage 2 Input voltage 3 BOOT voltage SW voltage BOOT-SW voltage VRON input voltage Logic input voltage Logic output voltage 1 Logic output voltage 2 *This product should not be used in a radioactive environment. Technical Note Symbol VCC PVCC VIN BOOT SW BOOT-SW VRON CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C PWRGD SUS_OUT Ratings Min. 4.5 4.5 4.5 4.5 -2 4.5 -0.3 -0.3 -0.3 Max. 5.5 5.5 25 30 25 5.5 5.5 VCC+0.3 5.5 VCC Unit V V V V V V V V V V ●ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25℃, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V) Limits Parameter Symbol Unit MIN. TYP. MAX. [Total block] VCC bias current VIN bias current VCC shut down mode current VIN shut down mode current VRON low voltage VRON high voltage VRON bias current [Reference voltage block] Reference output voltage Maximum source current Line regulation Load regulation [Over voltage protection block] Threshold voltage Hysterisys voltage [Under voltage lock-out block] VCC input threshold voltage VCC hysterics voltage [VID block] VID input high voltage VID input low voltage VID bias current DAC delay charge current DAC output voltage [Error amplifier block] Output feedback voltage [Current limit protection block] Current limit threshold1 CL adjustment range CL bias current Ilim VCL ICL 22 0.2 30 0 38 1.5 1 mV V µA VFB VDAC-0.5% VDAC VDAC+0.5% V VVID_H VVID_L IVID IDAC+ VDAC 2.0 GND 90 1.2683 0 170 1.2811 VCC 0.8 1 250 1.2939 V V µA µA V VCC_UVLO dVCC_UVLO 4.0 50 4.1 100 4.2 200 V mV VOVPL VOVPH 1.400 50 1.500 150 1.600 250 V mV VREF IREF_source Reg.l Reg.L 2.475 0.5 2.500 0.1 5 2.525 0.3 20 V mA %/V mV ICC_VCC ICC_VIN IST_VCC IST_VIN VRON_L VRON_H IVRON GND 2.3 4 20 0 0 10 10 50 10 10 0.8 5.5 20 mA µA µA µA V V µA Conditions VCC=5V VIN=12V VRON=0V VRON=0V VRON=5V IREF=0 to 100µA VCC=4.5 to 5.5V IREF=0 to 0.5mA VCC: Sweep up VCC: Sweep down VVID=3.3V VID[0:4]=0V CL=0.48V CL=5V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/21 2010.04 - Rev.C BD9560MUV ●ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25℃, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V) Limits Unit Parameter Symbol MIN. TYP. MAX. [Load slope setup block] Offset voltage [Soft start block] Delay time SS Delay charge current [Short circuit Protection] Delay time SCP Delay charge current [SLLM block] Continuous mode threshold SLLM threshold [Operating frequency] Switching frequency [On time pulse width] On time pulse width TON adjustment voltage TON bias current [OFF time width] Min off time [Driver block] HG high side ON resistor HG low side ON resistor LG high side ON resistor LG high side ON resistor [Power good block] PWRGD Low threshold voltage PWRGD High threshold voltage PWRGD Output voltage PWRGD Output leakage current PWRGD_C Delay charge current PGDLow PGDHigh VPWRGD PGDLeak IPD VDAC-0.4 VDAC+0.1 1.5 VDAC-0.3 VDAC+0.2 2.0 VDAC-0.2 VDAC+0.3 0.4 10 2.5 V V V µA µA RonHGH RonHGL RonLGH RonLGL 1 1 1 0.5 2 2 2 1 Ω Ω Ω Ω MinOff 0.25 0.5 1.0 µs Fosc VTON ITON 250 0.2 350 0 450 2.0 1 ns V µA Fosc 300 kHz Vthcon VthSL2M GND VCC-0.5 0.5 VCC V V TSCP ISCP 1.5 60 2.0 2.5 µs µA TSS ISS 1.5 65 2.0 2.5 µs µA VLS TBD 0 TBD mV Technical Note Conditions Css=100pF Cscp=100pF TON=1V TON=1V TON=5V IPRGD=4mA PWRGD=3.6V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/21 2010.04 - Rev.C BD9560MUV ●DAC code table State VRON 1 1 1 1 1 Render Performance States 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Render Suspend States 1 1 1 1 1 1 1 1 1 1 0 VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 × VID3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 × VID2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 × VID1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 × VID0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 × VCCGFX 1.28750V 1.26175V 1.23600V 1.21025V 1.18450V 1.15875V 1.13300V 1.10725V 1.08150V 1.05575V 1.03000V 1.00425V 0.97850V 0.95275V 0.92700V 0.90125V 0.87550V 0.84975V 0.82400V 0.79825V 0.77250V 0.74675V 0.72100V 0.69525V 0.66950V 0.64375V 0.61800V 0.59225V 0.56650V 0.54075V 0.51500V 0.41200V 0.000V Technical Note VDAC 1.2811V 1.2554V 1.2298V 1.2042V 1.1786V 1.1530V 1.1273V 1.1017V 1.0761V 1.0505V 1.0249V 0.9992V 0.9736V 0.9480V 0.9224V 0.8967V 0.8711V 0.8455V 0.8199V 0.7943V 0.7686V 0.7430V 0.7174V 0.6918V 0.6662V 0.6405V 0.6149V 0.5893V 0.5637V 0.5380V 0.5124V 0.4099V × SUS OUT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/21 2010.04 - Rev.C BD9560MUV ●Reference Data 3 2.5 2 RON[Ω] RON[Ω] 1.5 1 0.5 0 -10 3 2.5 2 1.5 1 0.5 0 -10 RON[Ω] 3 2.5 2 1.5 1 0.5 0 -10 Technical Note 10 30 50 Ta( ℃) 70 90 10 30 50 Ta( ℃) 70 90 10 30 50 Ta( ℃) 70 90 Fig.1 HG high side ON resistance Fig.2 HG low side ON resistance Fig.3 LG high side ON resistance 1 0.9 0.8 0.7 RON[Ω] 0.6 0.5 0.4 0.3 0.2 0.1 0 -10 10 30 50 Ta( ℃) 70 90 VCC_CORE[V] 1.35 V IN=5V V IN=12V V IN=21V setup voltage+2% setup voltage-2% 1000 DAC=0.412V 800 DAC=0.84975V DAC=1.2875V 1.3 V nom+5% V nom-5% on time[ns] 0 2 4 Io[A] 6 8 10 600 1.25 400 1.2 200 1 .15 0 0 1 2 3 4 5 Fig.4 LG low side ON resistance TON[V] Fig.5 Load slope Fig.6 Ton_On time 1ch Vout (20mV/div) 4ch IL (5A/div) 3ch LG (5V/div) 2ch HG (5V/div) 1ch Vout (20mV/div) 4ch IL (5A/div) 3ch LG (5V/div) 2ch HG (10V/div) 1ch Vout (20mV/div) 4ch IL (5A/div) 3ch LG (5V/div) 2ch HG (10V/div) Fig.7 (VIN=5V) Switching wave form (Iout=0A) Fig.8(VIN=12V) Switching wave form (Iout=0A) Fig.9 (VIN=21V) Switching wave form (Iout=0A) 4ch IL (5A/div) 1ch Vout (20mV/div) 3ch LG (5V/div) 2ch HG (5V/div) 4ch IL (5A/div) 1ch Vout (20mV/div) 3ch LG (5V/div) 2ch HG (10V/div) 4ch IL (5A/div) 1ch Vout (20mV/div) 3ch LG (5V/div) 2ch HG (10V/div) Fig.10 (VIN=5V) Switching wave form (Iout=10A) Fig.11(VIN=12V) Switching wave form (Iout=10A) Fig.12 (VIN=21V) Switching wave form (Iout=10A) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/21 2010.04 - Rev.C BD9560MUV ●Reference Data Technical Note 4ch Iout (5A/div) 3ch Vout (50mV/div) 2ch LG (5V/div) 1ch HG (5V/div) 4ch Iout (5A/div) 3ch Vout (50mV/div) 2ch LG (5V/div) 1ch HG (5V/div) 4ch Iout (5A/div) 3ch Vout (50mV/div) 2ch LG (5V/div) 1ch HG (10V/div) Fig.13 Transient Response (VIN=5V) VOUT=1.2875V, IOUT=0A→10A Fig.14 Transient Response (VIN=12V) VOUT=1.2875V, IOUT=0A→10A Fig.15 Transient Response (VIN=21V) VOUT=1.2875V, IOUT=0A→10A 3ch Vout (50mV/div) 3ch Vout (50mV/div) 3ch Vout (50mV/div) 4ch Iout (5A/div) 2ch LG (5V/div) 1ch HG (5V/div) 4ch Iout (5A/div) 2ch LG (5V/div) 1ch HG (5V/div) 4ch Iout (5A/div) 2ch LG (5V/div) 1ch HG (10V/div) Fig.16 Transient Response (VIN=5V) VOUT=1.2875V, IOUT=10A→0A Fig.17 Transient Response (VIN=12V) VOUT=1.2875V, IOUT=10A→0A Fig.18 Transient Response (VIN=21V) VOUT=1.2875V, IOUT=10A→0A VR_ON 2V/div VR_ON VR_ON 2V/div VOUT 2V/div 200mV/div VOUT VOUT IL 200mV/div 200mV/div 5A/div Fig.19 Wakeup wave form VOUT=1.2875V,VIN=12V, IOUT=0A Fig.20 Wakeup wave form VOUT=1.2875V,VIN=12V, RVOUT=120mΩ Fig.21 Wakeup wave form VOUT=0.84975V,VIN=12V, IOUT=0A VR_ON 2V/div VCC_CORE 200mV/div VOUT VR_ON VR_ON 2V/div 2V/div VOUT 100mV/div VOUT 100mV/div IL IL 5A/div Fig.22 Wakeup wave from VOUT=0.84975V,VIN=12V, RVOUT=80mΩ Fig.23 Wakeup wave form VOUT=0.412V,VIN=12V, IOUT=0A 5A/div Fig.24 Wakeup wave form VOUT=0.412V,VIN=12V, RVOUT=40mΩ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/21 2010.04 - Rev.C BD9560MUV ●Block Diagram, Application circuit VRON VCC 25 13 Technical Note V_3 VIN 32 GND 12 PWRGD_C 1 2 PWRGD VIN VREF 14 Refernce Block VREF Under Voltage Lock out ISM UVLO VDAC ISM OVP Over Voltage Protect VDAC UVLO OVP TSD ILIM SCP TSD Controller R S Q Driver Logic Delay BOOT 31 30 29 VID(4) VID(3) VID(2) VID(1) VID(0) VSS_SNS VID4 VID3 VID2 VID1 VID0 SGND 9 8 7 6 5 11 HG SW PVCC LG 1.5V 5bit DAC Delay VDAC VOUT 28 27 PGND 26 SS VDAC 21 19 20 SUS_OUT 23 DAC_C 10 Thermal Protection UVLO VR_ON SS FB LSM LSP ISM ISP VDAC ISM Short Circuit Delay ILIM SCP UVLO 18 17 3 22 24 16 4 SS Soft Start Block SCP TON SLLM CL SS ●Pin Configuration VQFN032V5050 (Unit : mm) ●Pin Function Table Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin name PWRGD_C PWRGD SCP SS VID0 VID1 VID2 VID3 VID4 DAC_C SGND GND VCC VREF NC CL Pin No. 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin name ISP ISM LSM LSP FB TON SUS_OUT SLLM VRON PGND LG PVCC SW HG BOOT VIN www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/21 2010.04 - Rev.C BD9560MUV Technical Note ●Pin Descriptions ・VCC This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 1uF bypass capacitor be put in this pin. ・VRON When VRON pin voltage at least 2.3V, the status of this switching regulator become active. Conversely, the status switches off when VRON pin voltage goes lower than 0.8V and circuit current becomes 10µA or less. ・VREF This is the reference voltage output pin. The voltage is 2.5V, with 100µA current ability. It is recommended that a 0.1uF capacitor be established between VREF and GND. ・CL BD9560MUV detects the voltage between ISP pin and ISM pin and limits the output current (OCP) voltage equivalent to 1/16 of the CL voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. ・SS This is the adjustment pin to set the soft start time. SS voltage is low during shutdown status. When VRON is the status of high, the soft start time can be determined by the SS charge current and capacitor between SS and GND. Until SS reaches DAC output voltage, the output voltage VOUT is equivalent to SS voltage. ・SCP This is the pin to adjust the timer latch time for short circuit protection. The timer circuit is active when the output voltage VOUT becomes 70% of DAC output voltage, and the output switches OFF (HG=L, LG=L) and is latched after the specified time. When the UVLO circuit is active or VRON is low, this latch function is cancelled. ・VIN Since the VIN line is also the input voltage of switching regulator, stability depends in the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application. ・TON This is the adjustment pin to set the ON time. On time is determined by the applied voltage to TON pin. ・ISP, ISM These pins are connected to both sides of the current sense resistor detect output current. The voltage drop between ISP and ISM is compared with the voltage equivalent to 1/16 of CL voltage. When this voltage drop hits the specified voltage level, the output voltage is OFF. And these are the pins returned output voltage for Power Good block, SCP block and OVP block. ・BOOT This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from SW). BOOT voltage swings between (VIN+VCC) and VCC during active operation. ・HG This is the voltage supply to drive the Gate of the high side. This voltage swings between BOOT and SW. High-speed Gate driving for the high side FET is achieved due to the low on-resistance (1.5 ohm when HG is high, 1.0 ohm when HG is low) driver. ・SW This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between VIN and GND. ・PVCC This is the power supply to drive the low side FET Gate. It is recommended that a 10uF bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. ・LG This is the voltage supply to drive the Gate of the low side FET. This voltage swings between PVCC and PGND. High–speed Gate driving for the low side FET is achieved due to the low on-resistance (1.5 ohm when LG is high, 0.5 ohm when LG is low) driver. ・PGND This is the power ground pin connected to the source of the low side FET. ・PWRGD This is the Power Good output pin with open drain. When VOUT range is (VDAC-300mV) to (VDAC+200mV), the status is high, and when it is in out of range, the status is low. ・PWRGD_C This is the pin to adjust the delay time of Power Good. When the status of the output voltage is Power Good, the delay time is determined by the capacitor connected between the fixed current for internal IC and PWRGD_C-GND. ・SLLM This is the adjustment pin to set the control mode. When SLLM pin voltage goes lower than 0.5V, the status is continuous mode. Conversely the status is SLLM (Simple Light Load Mode) when SLLM pin voltage is at least (VCC-0.5). ・VID[0:4] This is the logic input pin for 5bit DAC. ・LSP, LSM This is the input pin for the amplifier to set the load slope. ・SUS_OUT The output is SUS_OUT=”H” in performance states, is SUS_OUT=”L” in sleep states. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/21 2010.04 - Rev.C BD9560MUV ● Timing Chart ・Soft Start Function Technical Note VRON TSS SS Soft start is exercised with the VRON pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (1) and (2) below. Soft start time Tss= VDAC×Css [sec] ・・・(1) 2μA(typ) Incoming current VOUT IIN IIN= Co×VOUT Tss [A] ・・・(2) (Css: Soft start capacitor; Co: Output capacitor) ・Timer Latch Type Short Circuit Protection VDAC×0.7 VOUT TSCP Short protection kicks in when output falls to or below (VDAC X0.7). When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. Output voltage can be restored either by reconnecting the VRON pin or disabling UVLO. Short Circuit Protection timing is calculated with formulas (3) below. Short Circuit Protection time Tscp= 1.2(V)×CSCP [sec] ・・・(3) 2μA(typ) SCP VRON/UVLO ・Output Over Voltage Circuit Protection VOUT 1.5V Over voltage protection kicks and low side FET is the status of full ON in when output is up to 1.5V or more （ LG=High 、 HG=Low） . It is operated ordinary with falling of output. HG LG Switching ・Power good function VOUT VOUT-300mV TPWRGD Power good function kicks in when output is from (VOUT-300mV) to (VOUT+200mV). After setting, power good pin is the status of high. (Pull up the resistance outside) Delay timing of power good is calculated with formulas (4) below. Power good delay time TPWRGD = 1.2(V)×CPWRGD_C 2μA(typ) [sec] ・・・(4) PWRGD_C PWRGD (CPWRGD : PWRGD_C pin capacitor) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/21 2010.04 - Rev.C BD9560MUV ●External Component Selection 1. Inductor (L) selection Technical Note ΔIL The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. [A]・・・(5) L×VIN×f The proper output ripple current setting is about 30% of maximum output current. ΔIL= (VIN-VOUT)×VOUT VIN IL VOUT L Co ΔIL=0.3×IOUTmax. [A]・・・(6) L= (VIN-VOUT)×VOUT L×VIN×f [H]・・・(7) (ΔIL: output ripple current; f: switch frequency) Output ripple current ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (CO) Selection VIN When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (8) below. VOUT ESR Co L ΔVOUT=ΔIL×ESR [V]・・・(8) (ΔIL: Output ripple current; ESR: CO equivalent series resistance) ※In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Output Capacitor Please give due consideration to the conditions in formula (9) below for output capacity, bearing in mind that output rise time must be established within the soft start time frame. Co≦ Tss×(Limit-IOUT) VOUT ・・・(9) Tss: Soft start time Limit: Over current detection 2A(Typ) Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection VIN Cin The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (10) below. VOUT L IRMS=IOUT× √ CC(VCC-VOUT) V VCC IOUT 2 [A]・・・(10) Co Where VCC=2×VOUT, IRMS= Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/21 2010.04 - Rev.C BD9560MUV 4. MOSFET Selection Loss on the main MOSFET VIN main switch Technical Note Pmain=PRON+PGATE+PTRAN VOUT VIN 2 VIN ×Crss×IOUT×f = VOUT L Co ×RON×IOUT2+Ciss×f×VDD+ IDRIVE ・・・(11) (Ron: On-resistance of FET; Ciss: FET gate capacity; f: Switching frequency Crss: FET inverse transfer function; IDRIVE: Gate bottom current) Loss on the synchronous MOSFET Psyn=PRON+PGATE = VIN-VOUT VIN ×RON×IOUT2+Ciss×f×VDD ・・・(12) synchronous switch 5. Setting Detection Resistance VIN The over current protection function detects the output ripple current bottom value. This parameter (setting value) is determined as in formula (13) below. R VOUT L IL ILMIT= Co VCL×1/16 R [A]・・・(13) (VILIM: ILIM voltage; R: Detection resistance) Current limit VIN IL L RL VOUT Co When it detect the over current protection from DCR of “the coil L”, this parameter (setting value) is determined as in formula (14) below. r C ILMIT=VCL×1/16× (RL= L r×C ) r×C L [A]・・・(14) Current limit (VCL:CL voltage RL:DCR value of the coil) 6. Setting Load Line Slope VIN HG IL RSENSE LG VOUT FB = R2 R1 ×RSENSE×IL+ RSENSE×IL+VOUT R2 R1 ) × RSENSE×IL+VOUT R2 R1 = (1+ So that, SS VDAC Amplifier for setting Load slope LSP LSM FB R2 R1 R1 SLOPELL = (1+ ) × RSENSE (SLOPELL : Load Line Slope) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/21 2010.04 - Rev.C BD9560MUV ●I/O Equivalent Circuit 1pin(PWRGD_C) Technical Note 2pin(PWRGD) PWRGD 3pin(SCP) SCP PWRGD_C GND 4pin(SS) SS 5pin(VID0) ~ 9pin(VID4) VID[0:4] 10pin(DAC_C) DAC_C 14pin(VREF) 16pin(CL),17pin(ISP) 18pin(ISM) ISM VREF CL ISP 19pin(LSM),20pin(LSP),22pin(TON) 21pin(FB) VCC 23pin(SUS_OUT) VCC LSM LSP TON SUS_OUT FB 24pin(SLLM) VCC 25pin(VRON) VR_ON 27pin(LG) VDD SLLM LG 29pin(SW) BOOT HG 30pin(HG) BOOT BOOT 31pin(BOOT) BOOT 32pin(VIN) VIN SW HG HG SW www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Circuit(Application for POS CAP) Technical Note 3.3V R0 VCC VIN VIN_IC SW1 VIN VCC_CORE 32 R2 R1 R3 C1 VIN P_MON 15 R41 P_MON C24 Vcc C18 C19 C20 C21 C22 C23 R26 SW2 SW3 SW4 SW5 SW6 R4 R5 R6 R7 R8 25 5 6 VRON VID0 VID1 VID2 VID3 BTS 31 R38 C14 C15 PVCC 28 R40 C17 VIN R39 PVCC VIN_FET VIN_FET D2 C16 Tr2a L1 R33 Tr1a Tr1b D1 R29 R30 R31 C13 PULSE_I N R32 R42 R36 VCC_CORE R43 VCC CORE 9 VID4 HG SW 30 R37 VCC 3.3V 29 R35 R34 PGND R9 R10 C2 R11 2 PWRGD LG PGND 27 26 17 VREF Tr3A Tr3B R12 16 C3 R13 14 VIN_IC R15 22 R16 CL R28 CL VREF R14 ISP C12 VREF ISM FB 18 21 19 20 C25 R27 VIN_IC R24 R22 R21 R23 R25 C4 VREF C_TON TON LSM LSP 1 PWRGD_C 3 SCP 4 SS 10 Vcc C5 C6 C7 C8 Vcc DAC SGND 11 C11 R20 VCC R18 R17 SW7 R19 13 VCC SLLM GND GND C9 12 24 23 C10 GND SUS_OUT R44 R45 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Parts List Part No R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R27 R28 R29 R30 R31 R32 R33 R34 R35 R36 R37 R38 R39 R40 Value 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 20kΩ 300kΩ 47kΩ 0Ω 560kΩ 62kΩ 0Ω 10Ω 1kΩ 1kΩ 1MΩ 3kΩ 1MΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 2ｍΩ 0Ω 0Ω 0Ω 10Ω Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM Part name MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series PMR100 MCR03 Series MCR03 Series MCR03 Series MCR03 Series TR1A TR2A TR3A TR3B FET FET NEC NEC L1 D1 D2 0.7uH Diode TDK ROHM Part No R41 R42 R43 R44 R45 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C-Ton Value 0Ω 0.01uF 0.1uF 0.01uF 0.01uF 0.01uF 2200pF 1uF 0.22uF 10uF 10uF 330uF Company ROHM MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA KYOCERA MURATA Panasonic - Technical Note Part name MCR03 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series CM32X7R106M25A GMR21 Series CM21B106M06A EEFSX0D331XE VLM10055T-R70M120 RB521S-30 uPA2702 uPA2702 - 10uF×8 KYOCERA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Circuit(Application for ceramic capacitor) 3.3V R0 VCC VIN VCC_CORE 32 SW1 R3 C1 Technical Note VIN VIN_IC R2 R1 VIN P_MON 15 R41 P_MON C24 Vcc C18 C19 C20 C21 C22 C23 R26 SW2 SW3 SW4 SW5 SW6 R4 R5 R6 R7 R8 25 5 6 7 VRON VID0 VID1 VID2 BTS 31 R38 C14 C15 PVCC 28 R40 C17 VIN R39 PVCC VIN_FET VIN_FET D2 8 9 VID3 VID4 HG SW 30 C16 Tr2a L1 R33 Tr1a Tr1b D1 R29 R30 R31 C13 PULSE_IN R32 Tr3A R42 Tr3B R36 VCC_CORE R43 VCC CORE R37 VCC 3.3V 29 R35 R34 PGND R9 R10 C2 R11 2 PWRGD LG PGND 27 26 17 VREF R12 16 C3 R13 14 VIN_IC R15 22 R16 CL ISP R28 CL VREF R14 C12 VREF ISM FB 18 21 19 20 C25 R27 VIN_IC R24 R22 R21 R23 R25 C4 VREF C_TON TON LSM LSP 1 PWRGD_C 3 SCP 4 SS 10 Vcc C5 C6 C7 C8 Vcc R19 DAC 13 SGND 11 C11 R20 VCC R18 R17 SW7 GND GND C9 12 VCC SLLM 24 23 C10 GND SUS_OUT R44 R45 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Parts List Part No Value R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R27 R28 R29 R30 R31 R32 R33 R34 R35 R36 R37 R38 R39 R40 0Ω 1kΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 20kΩ 300kΩ 47kΩ 0Ω 560kΩ 62kΩ 0Ω 10Ω 1kΩ 1kΩ 1MΩ 3kΩ 1MΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 2ｍΩ 0Ω 0Ω 0Ω 10Ω Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM Part name MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series PMR100 MCR03 Series MCR03 Series MCR03 Series MCR03 Series TR1A TR2A TR3A TR3B FET FET NEC NEC L1 D1 D2 0.7uH Diode Panasonic ROHM Part No Value R41 R42 R43 R44 R45 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C-Ton 0Ω 0.01uF 0.1uF 0.01uF 0.01uF 0.01uF 2200pF 1uF 0.47uF 10uF 10uF Company ROHM MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA KYOCERA MURATA - Technical Note Part name MCR03 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR21 Series CM32X7R106M25A GMR21 Series CM32B476M06A CM32B476M06A ETQP2H0R7BFA RB521S-30 uPA2702 uPA2702 - 47uF×4 KYOCERA 47uF×4 KYOCERA - www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Circuit(Application for VIN UVLO OFF) Technical Note 3.3V R0 VCC VCC_CORE 32 SW1 R3 C1 VIN 15 R41 P_MON C24 Vcc R26 SW2 SW3 SW4 SW5 SW6 R4 R5 R6 R7 R8 25 5 6 7 VID2 8 VID3 9 VID4 HG SW PWRGD LG C2 VREF R12 R11 PGND 16 C3 R14 VIN C4 VREF C_TON R15 R16 1 PWRGD_C 3 SCP 4 10 SS DAC 13 VCC SLLM 12 GND R44 R45 SUS_OUT 24 23 R17 C10 22 R13 14 IS 18 CL ISP 30 29 BTS C14 R37 R35 R34 PGND R33 Tr1b D1 R28 C12 R27 V IN_IC R24 R22 C25 R21 R23 R20 VCC C11 R18 SW7 R25 VREF R29 R30 17 R31 C15 C16 Tr2a L1 C13 PULSE_IN R32 Tr3A R42 Tr3B R36 VCC_CORE Tr1a R43 VCC CORE VRON VID0 VID1 31 R38 PVCC 28 R40 C17 VIN R39 PVCC VIN_FET VIN_FET C18 C19 C20 C21 C22 C23 R2 VCC P_MON D2 VCC 3.3V R9 R10 2 27 26 CL VREF M 21 FB LSM LSP 19 20 TON SGND 11 Vcc C5 C6 C7 C8 Vcc R19 GND GND C9 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/21 2010.04 - Rev.C BD9560MUV ●Evaluation Board Parts List Part No Value R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R27 R28 R29 R30 R31 R32 R33 R34 R35 R36 R37 R38 R39 R40 0Ω 1kΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 20kΩ 300kΩ 47kΩ 0Ω 560kΩ 62kΩ 0Ω 10Ω 1kΩ 1kΩ 1MΩ 3kΩ 1MΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 2ｍΩ 0Ω 0Ω 0Ω 10Ω Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM Part name MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series TR1A TR2A TR3A TR3B FET FET NEC NEC L1 D1 D2 0.7uH Diode TDK ROHM Part No Value R41 R42 R43 R44 R45 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C-Ton 0Ω 0.01uF 0.1uF 0.01uF 0.01uF 0.01uF 2200pF 1uF 0.22uF 10uF 10uF 330uF Company ROHM MURATA MURATA MURATA MURATA MURATA MURATA MURATA MURATA KYOCERA MURATA Panasonic - Technical Note Part name MCR03 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series GMR18 Series CM32X7R106M25A GMR21 Series CM21B106M06A EEFSX0D331XE VLM10055T-R70M120 RB521S-30 uPA2702 uPA2702 - 10uF×8 KYOCERA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/21 2010.04 - Rev.C BD9560MUV Technical Note ● Operation Notes and Precautions 1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction depending on the relation between each potential, as follows: ・When GND＞ element A＞ element B, the P-N junction is a diode. ・When element B＞GND element A, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Resistance ( Pin A) ( Pin B) C Transistor (NPN) B E ( Pin A) Parasitic transistor N P+ N N P GND P P+ N GND ( Pin B) C E P P+ N Parasitic pin N P+ N P substrate Parasitic pin GND B GND Other pins in close proxiity GND Parasitic transistor 2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between the various pins and the VCC is recommended. Bypass diode Countercurrent prevention diode VCC Pin 3. Absolute maximum rating Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating limits is to be implemented. 4.GND potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode. 5. Thermal design In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. 6. Short-circuits between pins and incorrect mounting position When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and may damage the IC. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 19/21 2010.04 - Rev.C BD9560MUV Technical Note 7. Operation in strong electromagnetic fields Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields. 8. Thermal shutdown circuit This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature reaches 175℃ (standard value), and has a hysteresis range of 15℃ (standard). When the IC chip temperature rises to the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or subsequent operation once the TSD is activated. 9. Capacitor between output and GND When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a capacitor larger than 1000uF between the output and GND. 10. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 11. GND wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. ● Power Dissipation [mW] 1000 880mW 800 70mm×70mm×1.6mm θja=142.0℃/W Glass-epoxy PCB Power Dissipation [Pd] 600 With no heat sink θj-a=328.9℃/W 380mW 400 200 0 25 50 75 100 125 150 [℃] Ambient Temperature [Ta] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 20/21 2010.04 - Rev.C BD9560MUV ●Ordering part number Technical Note B D 9 Part No. 5 6 0 M U V - E 2 Part No. Package MUV : VQFN032V5050 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 5.0 ± 0.1 5.0 ± 0.1 Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 1PIN MARK 1.0MAX S +0.03 0.02 -0.02 (0.22) ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S C0.2 0.4 ± 0.1 32 3.4 ± 0.1 1 8 9 25 24 17 16 0.75 0.5 3.4 ± 0.1 +0.05 0.25 -0.04 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 21/21 2010.04 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A