BD95850F-LBE2

Datasheet EARTH LEAKAGE CURRENT DETECTOR IC SERIES EARTH LEAKAGE CURRENT DETECTOR IC BD95850F-LB Description Key Specifications ■ ■ ■ ■ ■ This is the product guarantees long time support in Industrial market. The BD95850F-LB is the monolithic IC integrates earth leakage detection, signal amplification, and overvoltage detection . Especially, it’s suitable for high-sensitivity and high -speed operation use, and, since the operating temperature range is wide, it can be used for various applications. Operating Supply Voltage Range: 7V to 13V Operating Temperature Range: -30°C to +95°C Supply Current: 830μA(Typ) Trip Voltage(Leakage Detection DC Voltage): 7.5mV Output Current Ability : -100μA(Min) Features ■ Long Time Support Product for Industrial Applications ■ Small Temperature Fluctuation and High Input Sensitivity ■ Wide Operating Temperature Range ■ Detection Mode Selectable (1 count method /1.5 count method) Package SOP14 W(Typ) x D(Typ) x H(Max) 8.70mm x 6.20mm x 1.71mm Applications ■ Earth leakage circuit breaker ■ Earth leakage circuit relay ■ Industrial equipment Typical Application Circuit Example VCC SCR VCC CTTDC COFFC COS RVS CVS VZ 14 13 VS VCC 12 11 PSAV IBLI 10 9 TTDC Overvoltage Detection Power Supply 8 OFFC SCRT Reset SCR Driver Leakage Detection IREF Trip Coil 1 2 VREF 3 ILKI 4 TRC1 5 TRC2 6 CRC1 CRC2 PSEL 7 VCC ZCT:Zero-phase Current Transformer ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .14.001 ○This product has no designed protection against radioactive rays 1/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Pin Configurations Block Diagrams SOP14 (TOP VIEW) 14 13 12 11 10 14 9 8 13 VS VCC 12 11 PSAV IBLI 10 9 TTDC Overvoltage Detection Power Supply 8 OFFC SCRT Reset SCR Drive Leakage Detection IREF 1 2 3 4 5 6 1 7 2 VREF 3 ILKI 4 TRC1 5 TRC2 6 PSEL 7 Pin Descriptions Pin No. Symbol 1 GND 2 Function Pin No. Symbol Ground 8 SCRT Output for driving thyristor IREF Connect a resistor to set constant current of the internal circuits 9 OFFC Connect a capacitor to set reset time 3 VREF Reference voltage output 10 TTDC Connect a capacitor to set over-voltage detection time 4 ILKI Input of leakage detection signal 11 IBLI Input of over-voltage detection signal 5 TRC1 12 PSAV Enable pin for overvoltage detection function 6 TRC2 13 VCC Internal power supply 7 PSEL 14 VS Connect a capacitor for charge current of negative detection Connect a capacitor for charge current of positive detection Logic function switching pin for leakage detection Function Power supply Absolute Maximum Ratings (TA=25°C) Parameter Symbol Rating Unit IS 4 mA VS 18 V Input Voltage VΔIN -1.5 to +1.5 V across ILKI and VREF Input Current IΔIN -5 to +5 mA across ILKI and VREF Input Current of VREF IVREF 10 mA across VREF and GND Input Voltage VXXXX 8 V IREF/REF/IN/TRC1/TRC2/ PSEL/SCRT/OFFC/PSAV/ TTDC/VCC/IBLI Input Voltage of Overvoltage Detection VIBLI -0.3 to +5.0 V across IBLI and GND Input Current of Overvoltage Detection IIBLI 4 mA across IBLI and GND Supply Current Supply Voltage (Note 1) 0.56 (Note 2) Power Dissipation PD Operating Temperature Topr -30 to +95 °C Storage Temperature Tstg -55 to +150 °C Condition W (Note 1) Supply voltage is limited by internal clamping circuit . Please refer to maximum current voltage of the electrical characteristic item. (Note 2) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.5mW per 1°C above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 Symbol Rating Unit VSopr 7 to 13 V 2/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Electrical Characteristic (unless otherwise specified VS=9V,GND=0V, TA=25°C) Item Symbol Limits Min Typ Max Unit Condition Supply current : during standby IS0 - 830 940 µA PSAV=VCC Supply current : during leakage detection IS1 - 840 950 µA PSAV=VCC Supply current : during overvoltage detection IS2 - 840 950 µA PSAV=VCC Supply current : during SCRT pin is "H" IS3 - - 870 µA PSAV=VCC Supply current : during standby IS0' - 750 860 µA PSAV=GND Supply current : during leakage detection IS1' - 760 870 µA PSAV=GND Supply current : during SCRT pin is "H" IS3' - - 870 µA PSAV=GND - - -0.07 - %/ °C Voltage at maximum current VSM 13.2 14.8 16.4 V Leakage detection DC input voltage VT - ±7.5 - mV ILKI pin input bias current IIH - 1 15 nA VREF pin output voltage VVREF - 2.4 - V ILKI-VREF input clamping voltage VINCL - ±0.8 - V IILKI=±3mA VVREFCL - 5.5 - V IRCL=5mA TRC1 pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA TRC1 pin threshold voltage VTH - 2.4 - V TW1 pulse width precision ETW1 -15 - +15 % - - -0.08 - %/ °C TA=-30°C to +85°C TRC2 pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA TRC2 pin threshold voltage VTH - 2.4 - V TW2 pulse width precision ETW2 -15 - +15 % - - -0.08 - %/ °C TA=-30°C to +85°C - - -4 - % TA=+25°C to +85°C - -2 - % TA=+25°C to -30°C VIBLI 2.3 2.4 2.5 V VIBLI supply voltage dependence - - 0.1 - %/V VIBLI ambient temperature dependence - - 0.06 - %/°C IIBLI - 50 300 nA VIN=VREF VIBLICL - 6.1 - V IIN=1mA TTDC pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-8µA TTDC pin threshold voltage VTH - 2.4 - V Delay time pulse width precision ETW4 -30 - +30 % C=1.0µF：TW4=300ms OFFC pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA OFFC pin threshold voltage VTH - 2.4 - V Reset timer pulse width precision ETW3 -30 - +30 % C=0.33µF：TW3=55ms SCRT pin "L" output voltage VOL3 - 0.02 0.2 V ICL=200µA IOHc - -300 -200 µA TA=-30°C,VO=0.8V IOHn - -260 -100 µA TA=+25°C,VO=0.8V IOHh - -210 -70 µA TA=+85°C,VO=0.8V VSOFF - 3.7 - V IS0 Ambient temperature dependence VREF-GND clamping voltage TW1 ambient temperature dependence TW2 ambient temperature dependence VT ambient temperature dependence Overvoltage detection voltage IBLI pin input bias current IBLI-GND clamping voltage SCRT pin "H" output current IOH hold supply voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 3/19 TA=-30°C to +85°C IS=3mA VILKI=VREF C=0.01µF：TW1=2.3ms C=0.0047µF：TW1=1.1ms TA=-30°C to +85°C TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Function Explanation 1.Switching of leakage detection mode The input logic to become output SCRT=HIGH Negative input → Positive input (1 count method mode) Negative input → Positive input → Negative input (1.5 count method mode) VCC PSEL pin voltage GND 2.ON/OFF switching of overvoltage detection function State of the overvoltage detection function PSAV pin voltage VCC ON GND OFF 3.Reset function Please connect a capacitor to OFFC pin (Pin.9) to set time in follows for making an IC initial state after a certain period of time. ・When a leakage detection input signal does not continue ・When an overvoltage detection signal does not continue ・After leakage detection or overvoltage detection, SCRT output voltage becomes high 4.Overvoltage detection wait time After first overvoltage detection, SCRT output voltage becomes “H” when overvoltage is detected after a certain period of time. Please set the wait time with a capacitor connecting to TTDC pin (Pin.10). 5.Time delay function As shown below, by applying overvoltage detection function, the leakage detection function can be provided with a time delay function. However, the overvoltage detection function can not be used. In Figure 1; It is set by a diode between Pin.6 and Pin.10, GND connection of Pin.11. In Figure 2; It is set by PNP transistor between Pin.6 and Pin.10, GND connection of Pin.11. In the case of Figure 2, the delay time becomes approximately 60% of Figure 1. VCC VCC VCC VCC 14 13 VS VCC 12 11 PSAV IBLI 10 Overvoltage Detection Power Supply 9 TTDC 14 8 OFFC 13 VS SCRT VCC 12 IBLI 10 9 TTDC Overvoltage Detection Power Supply Reset 11 PSAV SCR Driver Leakage Detection Leakage Detection Trip Coil 1 2 VREF 3 ILKI 4 TRC1 5 SCRT Reset SCR Driver IREF 8 OFFC TRC2 6 IREF PSEL 7 Trip Coil 1 2 VREF 3 ILKI 4 TRC1 5 TRC2 6 PSEL 7 VCC VCC Figure 1. Setting of time delay function 1 Figure 2. Setting of time delay function 2 6.IREF terminal A resistance connecting to this terminal becomes the standard constant current source of this IC. Cause this resistance determines the characteristic of each circuit, it is recommended that a high precision resistance (+-1%) be used. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 4/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Timing Chart 1. Earth leakage detection 1-1. 1 count method 1-2. 1.5 count method www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 5/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Timing Chart - continued 2.Overvoltage detection 2.4V IBLI 2.4V OFFC 2.4V TTDC TW4 SCRT TW3 3.A time delay function for leakage detection After the first leakage detection, SCRT pin becomes “H” after a certain period of time. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 6/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Test Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 RBIAS RBIAS (RBIAS=120kΩ) 7/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Typical Performance Curves (reference data) 16 0.6 Vs Terminal Voltage [V] Power Dissipation [W] 0.5 0.4 0.3 0.2 -40 °C 25 °C 12 105°C 8 4 0.1 0.0 0 25 50 75 0 95 100 125 0 150 1 Ambient Temperature [℃] 4 Figure 2. Supply Voltage - Supply Current 1000 1000 PSAV=GND Supply Current [µA] 750 Supply Current [µA] 3 Supply Current [mA] Figure 1. Derating Curve 500 -40 °C 25 °C 250 2 PSAV=VCC 750 500 -40 °C 25 °C 125 °C 250 125 °C 0 0 3 6 9 12 Supply Voltage [V] 0 3 6 9 12 Supply Voltage [V] Figure 3. Supply Current - Supply Voltage During Standby www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 0 Figure 4. Supply Current - Supply Voltage During Standby 8/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Typical Performance Curves (reference data) - continued 3.0 Vref Terminal Voltage [V] Vcc Terminal Voltage [V] 8 125 °C 6 25 °C -40 °C 4 2 2.5 2.0 1.5 1.0 -40 °C 25 °C 0.5 125 °C 0.0 0 0 3 6 9 0 12 3 9 12 Supply Voltage [V] Supply Voltage [V] Figure 5. VCC pin Voltage - Supply Voltage Figure 6. VREF pin Voltage - Supply Voltage 8.0 Vref Terminal Voltage [V] 1.4 Iref Terminal Voltage [V] 6 1.3 105 °C 1.2 25 °C -40 °C 1.1 1.0 0 1 2 3 4 Supply Current [mA] 6.0 -40 °C 25 °C 4.0 2.0 0.0 0.0 2.5 5.0 7.5 10.0 Input Current [mA] Figure 7. IREF pin Voltage - Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 125 °C Figure 8. VREF pin Clamping Voltage - Input Current 9/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Typical Performance Curves (reference data) - continued 2.8 Ibli Threshold Voltage [V] 10.0 Trip Voltage [mV] 9.0 8.0 VT+ 7.0 VT- 6.0 2.6 2.4 2.2 2.0 -40 0 40 80 -40 120 Ambient Temperature [℃] Figure 9. Trip Voltage – Ambient Temperature 40 80 120 Figure 10. Overvoltage Detection Threshhold Voltage - Ambient Temperature 2.8 400 Ibli Threshold Voltage [V] -40℃ Os Source Current [µA] 0 Ambient Temperature [℃] 300 25℃ 200 125℃ 100 0 2.6 2.4 2.2 2.0 6 8 10 12 14 Supply Voltage [V] 8 10 12 14 Supply Voltage [V] Figure 11. SCRT pin Source Current - Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 6 Figure 12. Overvoltage Detection Threshhold Voltage - Supply Voltage 10/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Typical Performance Curves (reference data) - continued 12 12 Ttdc Output Current [µA] Offc Output Current [µA] 14 125 °C 10 25°C -40°C 8 10 125°C 8 25°C -40°C 6 4 6 6 8 10 12 14 6 8 10 12 14 Supply Voltage [V] Supply Voltage [V] Figure 13. OFFC pin Source Current - Supply Voltage Figure 14. TTDC pin Source Current - Supply Voltage Trc Output Current [µA] 14 12 125°C 10 25 °C -40 °C 8 6 6 8 10 12 14 Supply Voltage [V] Figure 15. TRC1/2 pin Source Current - Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 11/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C (normal temperature).IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 16(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, junction temperature TJmax, and power dissipation PD can be calculated by the equation below °C /W ・・・・・ (Ⅰ) θJA = (TJmax - TA) / PD Derating curve in Figure 16(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 17(a) show a derating curve for an example of BD95850F-LB . PowerLSI dissipation of 力 LSI[W] LSIの の消費電力 消費電 PPd D(max) (max) θJA =(TJmax-TA)/P °C /W θ JA2 < JA1 θja2 < θθja1 P2 Ambient temperature TA[°C] 周囲温度 Ta [℃] θ’ θ'JA2 ja2 P1 θ’θ'JA1 ja1 θθJA2 ja2 T’Jmax TTjJmax Tj ' (max) (max) θθJA1 ja1 Chip surfaceチップ temperature TJ[℃] [°C] 表面温度 Tj 0 消費電力 P [W] (a) Thermal Resistance 25 50 75 100 125 TA [℃ [T °C ] ] 周囲温度 周temperature 囲 温 度 Ta Ambient A] [°C 150 (b) Derating Curve Figure 16. Thermal Resistance and Derating Curve 0.7 POWER DISSIPATION [W] 0.6 0.5 0.4 0.3 0.2 0.1 0.0 95 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [℃] (a) BD95850F-LB Derating Curve Slope Unit 4.5 mW/°C BD95850F-LB When using the unit above TA=25°C, subtract the value above per degree℃ Power dissipation is a value when glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted. Figure 17. Derating Curve www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 12/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB I/O Equivalence Circuit VCC VCC Pin.1 [GND] Pin.5 [TRC1] VCC VCC VCC VCC Pin.2 [IREF] Pin.6 [TRC2] VCC VCC VCC VCC 500Ω 322kΩ Pin.3 [REF] Pin.7 [PSEL] Pin.4 150Ω 350Ω VCC VCC VCC Pin.3 VCC VCC Pin.4 [IN] Pin.8 [SCRT] 150Ω 350Ω 50kΩ www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 13/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB I/O Equivalence Circuit - continued VCC VCC VCC Pin.9 [OFFC] Pin.12 [PSAV] VCC VCC Pin.14 Pin.10 [TTDC] Pin.13 [VCC] Internal Circuit VCC BG Pin.11 [IBLI] www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 Pin.14 [VS] 14/19 CL TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 15/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Operational Notes – continued 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 18. Example of monolithic IC structure www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 16/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Ordering Information B D 9 5 8 5 Part Number 0 F Package F: SOP14 - LBE2 Product class LB for Industrial applications Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP14 (TOP VIEW) BD95850F LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 17/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Physical Dimension, Tape and Reel Information Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 18/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet BD95850F-LB Revision History Date Revision 13.Jun.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 .15.001 19/19 TSZ02201- 0RCR1GZ00130-1-2 13.Jun.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ROHM Semiconductor: BD95850F-LBE2