ROHM Switching Regulator Solutions
Evaluation Board:
7.5V to 18V, 6A Integrated MOSFET
1ch Synchronous Buck DC/DC Converter
No.000000000
BD95861MUVEVK-101 (5V | 6A Output)
● Introduction
This application note will provide the steps necessary to operate and evaluate ROHM’s synchronous buck DC/DC converter
using the BD95861MUV evaluation boards. Component selection, board layout recommendations, operation procedures
and application data is provided.
● Description
This evaluation board has been developed for ROHM’s synchronous buck DC/DC converter customers evaluating
BD95861MUV. While accepting a wide power supply of 7.5-18V, an output of 0.8V to 5.5V can be produced. The IC has
internal 50mohm high-side Nch MOSFET and 30mohm low-side Nch MOSFET and a synchronization frequency range of
500 kHz to 800 kHz. A fixed Soft Start circuit prevents in-rush current during startup along with UVLO (low voltage error
prevention circuit) and TSD (thermal shutdown detection) protection circuits. An EN pin allows for simple ON/OFF control of
the IC to reduce standby current consumption. Include open-drain PGOOD_LED feature for operation indication, OCP, SCP,
OVP.
● Applications
LCD TVs
Set Top Boxes (STB)
DVD/Blu-ray players/recorders
Broadband Network and Communication Interface
Amusement, other
o
● Evaluation Board Operating Limits and Absolute Maximum Ratings (TA=25 C)
Parameter
Symbol
Limit
Unit
MIN
TYP
MAX
VCC
7.5
-
18
V
VOUT
0.8
-
5.5
V
IOUT
-
-
6
A
Conditions
Supply Voltage
BD95861MUV
Output Voltage / Current
BD95861MUV
* Set by R2,R3 and R4
● Evaluation Board
Below is the evaluation board with the BD95861MUV.
Fig 1: BD95861MUV Evaluation Board
1
Application Note
● Evaluation Board Schematic
Below is the evaluation board schematic for BD95861MUV.
Fig 2: BD95861MUV Evaluation Board Schematic
● Evaluation Board I/O
Below is the reference application circuit that shows the inputs (VIN and EN) and the outputs (VOUT and PGOOD)
Fig 3: BD95861MUV Evaluation Board I/O
● Evaluation Board Operation Procedures
Below is the procedure to operate the evaluation board
1.
2.
3.
4.
Connect power supply’s GND terminal to GND test point TP3 on the evaluation board.
Connect power supply’s VCC terminal to VIN test point TP1 on the evaluation board. This will provide VIN to the IC U1.
Please note that the V CC should be in range of 7.5V to 18V.
Check if shunt jumper of J1 is at position ON (Pin2 connect to Pin1, EN pin of IC U1 is pulled high as default).
Now the output voltage VOUT (+5V) can be measured at the test point TP2 on the evaluation board with a load attached.
The load can be increased up to 6A MAX.
Page 2 of 11
Application Note
● Reference Application Data for BD95861MUVEVK-101
The following graphs show hot plugging test, circuit quiescent current, efficiency, load response, output voltage ripple
response of the BD95861MUV evaluation board.
Fig 4: Hot Plug-in Test with Zener Diode Fig 5: Circuit Current vs. Power supply
o
SMAJ15A, VIN=18V, VOUT=5V, IOUT=6A
Voltage Characteristics (Temp=25 C)
Fig 6: Electric Power Conversion Rate
VIN=12V, VOUT=5V
Fig 7: Load Response Characteristics
(VIN=12V, VOUT=5V, L=2.2uH, COUT=44uF, IOUT=0A6A)
Fig 8: Load Response Characteristics
(VIN=12V, VOUT=5V, L=2.2uH, COUT=44uF, IOUT=6A0A)
Fig 9: Output Voltage Ripple Response Characteristics
(VIN=12V, VOUT=5V, L=2.2uH, COUT=44uF, IOUT=0A)
Fig 10: Output Voltage Ripple Response Characteristics
(VIN=12V, VOUT=5V, L=2.2uH, COUT=44uF, IOUT=6A)
Page 3 of 11
Application Note
● Evaluation Board Layout Guidelines
Below are the guidelines that have been followed and recommended for BD95861MUV designs
Layout is a critical portion of good power supply design. There are several signals path that conduct fast changing currents
or voltage that can interact with stray inductance or parasitic capacitance to generate nose or degrade the power supplies
performance. To help eliminate these problems, the VCC pin should be bypassed to ground with a low ESR ceramic bypass
capacitor with B dielectric.
Two high pulsing current flowing loops exist in the buck regulator system:
1.
The first loop, when FET is ON, starts from the input capacitors, to the V IN terminal, to the SW terminal, to the
inductor, to the output capacitors, and then returns to the input capacitor through GND.
2.
The second loop, when FET is OFF, starts from the low FET, to the inductor, to the output capacitor, and then
returns to the low FET through GND.
To reduce the noise and improve the efficiency, please minimize the areas of the two loops. The input and output capacitors
should be connected to the GND (PGND) planes.
The PCB layout design will affect the thermal performance, noise and efficiency of the system . So please take extra care
when designing PCB Layout patterns.
Fig 11: Current loop Buck regulator system
Fig 12: BD95861MUVEVK-101 PCB layout
Page 4 of 11
Application Note
o
Fig 13: BD95861MUVEVK-101 Thermal Characteristics at Temp=25 C, no air flow, V IN=7.5V, VOUT=5V, IOUT=6A and
D2&D3 not installed
o
Thermal note: If the board is operated above room temperature (T>25 C) OR with 2 DNP diodes D2&D3 installed, an active
cooling source (fan) or heat sink (soldered to bottom of PCB) need to be added.
Additional layout notes:
The thermal Pad on the back side of IC has the great thermal conduction to the chip. So using the GND plane as
broad and wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the
different layer is also effective.
The input capacitors should be connected to PGND as close as possible to the VIN terminal.
The inductor and the output capacitors should be placed close to SW pin as much as possible.
For applications operating at or near maximum voltage conditions (18V max), additional precautions regarding heat
dissipation need to be considered during board layout. The provided evaluation board is a 4-layer board meant for
evaluation purposes only. At maximum conditions, the IC’s internal thermal shutdown detection circuit will be potentially
initiated and the output disabled until the junction temperature falls. For final designs operating near these conditions,
we recommend using one of the below PCB options for better heat dissipation of the IC.
1) Use of a 4-layer PCB with internal GND planes connected to the IC GND pins
2) Use of a 2-layer PCB with a heat sink attached to the IC package
3) Use of a 2-layer PCB with a copper plane (>1oz) attached to the IC
Page 5 of 11
Application Note
● Calculation of Application Circuit Components
1. Output LC Filter Selection (Buck Converter)
1-1. Inductor (L) Selection
The Output LC filter is required to supply constant current to the output load. A larger value inductance at this filter results in less
inductor ripple current (ΔIL) and less output ripple voltage. However, the larger value inductors tend to have a slower load
transient-response, a larger physical size, a lower saturation current and higher series resistance. A smaller value inductance
has almost opposite characteristics above.
The value of ΔIL is shown as formula below.
The inductor saturation current must be larger than the sum of the maximum output current (I OUTMAX) and 1/2 of the inductor ripple
current (ΔIL / 2). A larger current than the inductor’s saturation current will cause magnetic saturation in the inductor, and
decrease efficiency. When selecting an inductor, be sure to allow enough margins to assure that peak current does not exceed
the inductor’s saturation current value.
※ To minimize loss of inductor and improve efficiency, choose an inductor with a low resistance (DCR, ACR).
Fig 14: Inductor Ripple Current
1-2. Output Capacitor (COUT) Selection
Output Capacitor (COUT) has a considerable influence on output voltage regulation due to a rapid load change and smoothing
output ripple voltage. Determine the capacitor by considering the value of capacity, the equivalent series resistance, and
equivalent series inductance. Also, make sure the capacitor’s voltage rating is high enough for the set output voltage (inclu ding
ripple).
Output ripple voltage is determined as in formula below.
(ΔIL Output ripple current, ESR: Equivalent series resistance, ESL: Equivalent series inductance)
Page 6 of 11
Application Note
Also, give consideration to the conditions in the formula below for output capacitance, bearing in mind that output rise time must
be established within the fixed soft start time. As output capacitance, bypass capacitor will be also connected to output load side
(CEXT, Fig 15). Please set the over current detection value with regards to these capacitance.
(IOCP: OCP Current Limit, IOUT: Output Current)
Note: an improper output capacitor may cause startup malfunctions.
Fig 15: Output Capacitor
2. Input Capacitor (C IN) Selection
In order to prevent transient spikes in voltage, the input capacitor should have a low enough ESR resistance to fully support a
large ripple current. The formula for ripple current I RMS is given in equation as below.
Where VIN =2×VOUT, IRMS= IOUT/2
A low ESR capacitor is recommended to reduce ESR loss and improve efficiency
Fig 16: Input Capacitor
Page 7 of 11
Application Note
3. Output Voltage Setting
The IC controls output voltage as REF = VFB.
However, the actual output voltage will also reflect the average ripple voltage value.
The output voltage is set with a resistor divider from the output node to the FB pin. The formula for output voltage is given in
below:
4. Relationship between Output Voltage and ON TIME
Fig 17: Output Voltage Setting
BD95861MUV is a synchronous buck converter controlling constant ON TIME. The ON TIME (T ON) depends on the output
voltage settings, as described by the formula.
The frequency of the application condition is determined by the below formula using the above Ton.
However with actual applications, there exists a rising and falling time of the SW due to the gate capacitance of the integrated
MOSFET and the switching speed, which may vary the above parameters. Therefore please also verify those parameters
experimentally.
Page 8 of 11
Application Note
5. Relationship between Output Current and Frequency
BD95861MUV is a constant on time type of switching regulator. When the output current increases, the switching loss of the
inductor, MOSFET, and output capacitor also increases. Hence the switching frequency speeds up.
The loss of the inductor, MOSFET, and output capacitor is determined as below.
(DCR: Inductor Equivalent series resistance, RONH: On resistance of High-side MOSFET, RONL: On resistance of Low-side
MOSFET, ESR: C OUT Equivalent series resistance)
Taking the above losses into the frequency equation, then T (=1/Freq) becomes
However since the parasitic resistance of the PCB layout pattern exists in actual applications and affects the parameter, ple ase
also verify experimentally.
Page 9 of 11
Application Note
● Evaluation Board BOM
Below is a table with the build of materials. Part numbers and supplier references are provided.
Item
Qty
Ref
1
1
CR1
2
2
C1,C2
3
1
4
Description
Manufacturer
Part Number
LED 570NM GREEN WTR CLR 0603 SMD
Rohm
SML-310MTT86
CAP CER 10UF 25V 20% X5R 1206
Murata
GRM31CR61E106MA12L
C3
CAP CER 0.1UF 50V 10% X7R 0603
Murata
GRM188R71H104KA93D
2
C4,C5
CAP CER 22UF 16V 10% X5R 1206
Murata
GRM31CR61C226KE15K
5
1
C6
CAP CER 4.7UF 25V 10% X5R 0603
Murata
GRM188R61E475KE11D
6
1
C7
CAP CER 0.47UF 25V 10% X7R 0603
Murata
GRM188R71E474KA12D
7
1
D1
DIODE TVS 15V 400W UNI 5% SMA
SMAJ15A
8
1
J1
CONN HEADER VERT .100 3POS 15AU
9
1
L1
INDUCTOR 2.2UH 8.2A 20% SMD
10
1
Q1
TRANSISTOR NPN 40V 0.6A SOT-23
Littelfuse Inc
TE Connectivity
Div
TDK
Corporation
Rohm
11
1
R1
RES 20 OHM 1/10W 5% 0603 SMD
Rohm
MCR03ERTJ200
12
1
R2
RES 24K OHM 1/10W 1% 0603 SMD
Rohm
MCR03ERTF2402
13
1
R3
RES 680 OHM 1/10W 1% 0603 SMD
Rohm
MCR03ERTF6800
14
1
R4
RES 4.7K OHM 1/10W 1% 0603 SMD
Rohm
MCR03ERTF4701
15
1
R5
RES 100K OHM 1/10W 5% 0603 SMD
Rohm
MCR03ERTJ104
16
1
R6
RES 1K OHM 1/10W 5% 0603 SMD
Rohm
MCR03ERTJ102
17
1
R7
RES 140 OHM 1/10W 1% 0603 SMD
MCR03ERTF1400
18
3
TP1,TP2,TP5
TEST POINT PC MULTI PURPOSE RED
19
2
TP3,TP4
TEST POINT PC MULTI PURPOSE BLK
Rohm
Keystone
Electronics
Keystone
Electronics
20
1
U1
7.5V to 18V, 6A Integrated MOSFET 1ch
Synchronous Buck DC/DC Converter
ROHM
BD95861MUV
21
1
ZX1
1806 footprint solder-short during
assembly
22
1
TE Connectivity
881545-1
Shunt jumper for header J1 (item #11),
CONN SHUNT 2POS GOLD W/HANDLE
87224-3
SPM6530T-2R2M
SST2222AT116
5010
5011
Page 10 of 11
Application Note
Notes
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If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained
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should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall
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Page 11 of 11