Datasheet
Switching Regulator ICs
with Built-in FET (5V)
BD9639MWV
Key Specifications
General Description
Input Supply Voltage Range:
2.5V to 5.5V
Oscillating Frequency 1:
1.5 MHz(Typ)
ON-Resistance:
Refer to Electrical Characteristics
Shutdown Current Consumption:
0µA(Typ)
Operating Temperature Range:
-20°C to +85°C
BD9639MWV is a 6-channel system switching
regulator IC with built-in FET and error amplifier phase
compensation for DSC/DVC applications. The built-in
regulators consisting of 2ch Buck-Boost, 2ch Buck and
2ch Boost circuits operate at high efficiency.
Features
6CH DC/DC converter
・CH1 Boost
FET embedded Start-up ch,Motor
・CH2 Buck
FET embedded Core
・CH3 Buck-Boost FET embedded CMOS
・CH4 Buck-Boost FET embedded Digital
・CH5 Buck
FET embedded CMOS, Memory
・CH6 Boost
FET embedded LED
Low voltage operation 2.5[V]
CH1 supply voltage output for internal circuit
CH1 PWM / PFM selectable
CH3-CH4 Boost-Buck auto switching
CH6 integrated Boost output shutdown
(Load switch embedded)
Soft-start correspondence to each channel
Built-in ground short protection function
(CH2 to CH6)
Built-in error amp phase compensation (CH1 to
CH6)
Operating frequency 1.5[MHz] (CH1 to CH6)
Package
W(Typ) x D(Typ) x H(Max)
UQFN056V7070
7.00mm x 7.00mm x 1.00mm
Applications
DSC/DVC
○Product structure：Silicon monolithic integrated circuit
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BD9639MWV
Pin Configuration
33
32
FB6
FB6
34
SW6
SW6
35
PGND6
PGND6
36
VBAT6
VBAT6
37
LSO6
LSO6
38
XSHDN6
XSHDN6
39
RT
RT
PGND2
PGND2
40
VCC
VCC
PGND2
PGND2
41
AGND2
AGND2
SW2
SW2
42
SW2
SW2
VBAT2
VBAT2
TOP VIEW
31
30
29
VBAT2
VBAT2
43
28
FB61
FB61
FB2
FB2
44
27
Reserve
Reserve
21
PGND4
PGND4
USW3
USW3
51
20
PGND4
PGND4
VOUT3
OUT3
52
19
USW4
USW4
FB3
FB3
53
18
USW4
USW4
FB1
FB1
54
17
VOUT4
OUT4
VOUT1
OUT1
55
16
VOUT4
OUT4
VOUT1
OUT1
56
15
FB4
FB4
2
3
4
5
6
7
Pin Descriptions
Terminal
No.
Name
1
SW1
2
3
4
5
6
SW1
PGND1
PGND1
TEST1
VBAT
7
XSHDN1
CH1 shutdown terminal
8
9
10
11
12
AGND1
XSHDN24
FB5
PGND5
SW5
13
VBAT5
14
8
9
10
11
12
13
14
XSHDN5
XSHDN5
1
SW5
SW5
50
VBAT5
VBAT5
DSW4
DSW4
PGND3
PGND3
PGND5
PGND5
22
FB5
FB5
49
AGND1
AGND1
DSW4
DSW4
DPG3
DPG3
XSHDN24
XSHDN24
VBAT4
VBAT4
23
XSHDN1
XSHDN1
24
48
VBAT
VBAT
47
DSW3
DSW3
TEST1
TEST1
VBAT4
VBAT4
PGND1
PGND1
DPG4
DPG4
25
PGND1
PGND1
26
46
SW1
SW1
45
SW1
SW1
TEST2
TEST2
XSHDN3
XSHDN
3
VBAT3
VBAT3
Terminal
No.
Name
O
29
FB6
O
G
G
O･G
V
30
31
32
33
34
PGND6
SW6
LSO6
VBAT6
XSHDN6
G
35
RT
Analog GND terminal
CH2・4 shutdown terminal
CH5 feed buck terminal
CH5 DRIVER GND terminal
CH5 switching terminal
CH5 DRIVER power supply
terminal
G
O･G
G
G
O
36
37
38
39
40
AGND2
VCC
PGND2
PGND2
SW2
V
41
SW2
XSHDN5
CH5 shutdown terminal
O･G
42
VBAT2
15
FB4
CH4 feed buck terminal
G
43
VBAT2
16
17
OUT4
OUT4
O
O
44
45
FB2
TEST2
18
USW4
O
46
XSHDN3
19
USW4
O
47
VBAT3
20
21
PGND4
PGND4
G
G
48
49
DSW3
DPG3
CH3 DRIVER power supply
V
terminal
CH3 Buck side switching terminal O
CH3 gate connecting terminal
O
22
DSW4
O
50
PGND3
CH3 DRIVER GND terminal
G
23
DSW4
O
51
USW3
CH3 Boost side switching
terminal
O
24
VBAT4
V
52
OUT3
CH3 output terminal
O
25
VBAT4
V
53
FB3
CH3 feed buck terminal
G
26
27
DPG4
Reserve
O
O･G
54
55
FB1
OUT1
CH1 feed buck terminal
CH1 output terminal
G
O
28
FB61
CH4 output terminal
CH4 output terminal
CH4 Boost side switching
terminal
CH4 Boost side switching
terminal
CH4 DRIVER GND terminal
CH4 DRIVER GND terminal
CH4 Buck side switching
terminal
CH4 Buck side switching
terminal
CH4 DRIVER power supply
terminal
CH4 DRIVER power supply
terminal
CH4 gate connecting terminal
Reserve terminal
CH6 feed buck terminal
(Constant current side)
G
56
OUT1
CH1 output terminal
O
Equivalent Circuit
CH1 switching terminal
CH1 switching terminal
CH1 DRIVER GND terminal
CH1 DRIVER GND terminal
Test terminal
Battery input terminal
Equivalent Circuit
CH6 feed buck terminal
G
(Constant voltage side)
CH6 DRIVER GND terminal
G
CH6 switching terminal
O
CH6 Load switch output terminal O
CH6 Load switch input terminal
V
CH6 shutdown terminal
O･G
Triangle wave setting resistor
terminal
Analog GND terminal
G
Analog power supply terminal
V
CH2 DRIVER GND terminal
G
CH2 DRIVER GND terminal
G
CH2 switching terminal
O
CH2 switching terminal
O
CH2 DRIVER power supply
terminal
CH2 DRIVER power supply
terminal
CH2 feed buck terminal
Test terminal
G
O･G
CH3 shutdown terminal
O･G
V
V
The letter on the right side of each pin explanation indicates the reaction if the terminal are not used.
O・・・OPEN
G・・・GND
O･G・・・OPEN or GND
V・・・Power supply (VBAT)
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BD9639MWV
Block Diagram
VBAT
OUT1
[CH1]
Boost
OUT1
OUT1
PFM
F 1
B
PRE
DRIVER
PWM
SW1
PGND1
MA .
X
DUTY
OUT2
[CH2]
Buck
VBAT 2
F 2
B
PRE
DRIVER
SW2
OUT2
PGND2
OUT3
OUT3
USW3
OUT3
[CH3]
Buck -Boost
VBAT 3
F 3
B
Buck -Boost
PWMCOMP
PRE
DRIVER
MA .
X
DUTY
DSW 3
PGND 3
DPG 3
OUT4
OUT4
USW4
OUT4
F 4
B
[CH4]
VBAT 4
Buck -Boost
Buck -Boost
PWMCOMP
PRE
DRIVER
MA .
X
DUTY
DSW 4
PGND 4
DPG 4
OUT5
VBAT 5
F 5
B
[CH5]
Buck
PRE
DRIVER
SW5
OUT5
PGND5
OUT6
F 6
B
VBAT 6
[CH6]
Boost
PRE
DRIVER
LS 6
O
SW 6
MA .
X
DUTY
OUT6
PGND 6
F 61
B
Reserve
SA
1.5W[MHz ]
RT
VBAT
XSHDN 1
STAR -UP
TCIRCUIT
XSHDN 24
TSD
OUT1
XSHDN 3
XSHDN 5
XSHDN 6
VCC
CONTROL
VREF
To each block
AGN
D
AGN
D
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BD9639MWV
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
-0.3 to +7
V
VVBAT
VVBAT2
Supply Voltage Permissible Voltage
VVBAT3
VVBAT4
VVBAT5
VVBAT6
SW6 Permissible Voltage
VSW6
24.0
V
OUT1 Permissible Current Output
IOUT1
1.0
A
SW1 Permissible Current Output
ISW1
1.0
A
SW2 Permissible Current Output
ISW2
2.0
A
OUT3 Permissible Current Output
IOUT3
1.0
A
DSW3 Permissible Current Output
IDSW3
1.0
A
USW3 Permissible Current Output
IUSW3
1.0
A
OUT4 Permissible Current Output
IOUT4
1.0
A
DSW4 Permissible Current Output
IDSW4
1.0
A
USW4 Permissible Current Output
IUSW4
1.0
A
SW5 Permissible Current Output
ISW5
1.0
A
SW6 Permissible Current Output
ISW6
0.2
A
Power Dissipation
Pd
4.83
(Note 1)
W
Operating Temperature Range
Topr
-20 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Junction Temperature
(Note 1) Implemented on Glass epoxy board (ROHM standard board : 74.2 x 74.2 x 1.6[mm3] 4 layers(Copper foil : 5502 m2)
Power dissipation depends on the mounted wiring pattern.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
VBAT Supply Voltage
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TSZ22111・15・001
Symbol
Limit
Min
Typ
Max
Unit
VVBAT
2.5
3.7
5.5
V
VVBAT2
2.5
3.7
5.5
V
VVBAT3
2.5
3.7
5.5
V
VVBAT4
2.5
3.7
5.5
V
VVBAT5
2.5
3.7
5.5
V
VVBAT6
2.5
3.7
5.5
V
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BD9639MWV
Electrical Characteristics
(Unless otherwise specified, VVBAT=VVBAT2,3,4,5,6=3.7[V], VCC input terminal =3.7[V], Ta=25[°C])
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
・XSHDN1=H, XSHDN24=L
・Without load on each channel
Current Consumption (PFM)
ICC1
72
150
μA
・VFB1=0.5[V]
・sum of VBAT terminal,
and OUT1 terminal
・XSHDN1=H, XSHDN24=H,
TEST1=H
Current Consumption (PWM)
ICC2
1.57
2.35
3.53
mA ・VFB1=0.5[V]
・Sum of VBAT terminal,
and OUT1 terminal
・All setting terminal=L
Shutdown Current Consumption
ICC3
0
10
μA
・Sum of VBAT terminal,
and OUT1 terminal
VVBAT
H Input Voltage 1
VIH1
V
-0.3
XSHDN1
GND
L Input Voltage 1
VIL1
V
+0.3
H Input Voltage 2
VIH3
2.5
V
XSHDN24, XSHDN3,
GND
XSHDN5, XSHDN6
L Input Voltage 2
VIL3
V
+0.3
Input voltage =3.7[V]
H Input Current 1
IIH1
4.63
9.25
18.5
μA
XSHDN24, XSHDN3,
XSHDN5, XSHDN6
Oscillating Frequency 1
fOSC1
1.2
1.5
1.8
MHz RRT=10[kΩ]
Reduced-voltage Detection Voltage
VUVLO1
1.75
1.95
2.15
V
Reduced-voltage Return Voltage
VUVLO2
1.95
2.15
2.35
V
tSS1
310
620
930
μs
VEREF1
0.388
0.400
0.412
V
Soft-start period 100% 730[µs](Typ)
XSHDN24=L
XSHDN24=H
PMOS ON-Resistance
RONP1
-
0.24
0.38
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN1
-
0.14
0.23
Ω
Power supply 3.7[V]
DMAX1
76.5
85.0
93.5
%
XSHDN24=H
VEREF2
0.390
0.400
0.410
V
tSS2
0.43
0.85
1.27
ms
Soft-start period 100% 1.0[ms](Typ)
PMOS ON-Resistance
RONP2
-
0.13
0.21
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN2
-
0.08
0.14
Ω
Power supply 3.7[V]
【CH1】
Soft-start Period 85%
Error Amp Reference Voltage
Maximum Duty
【CH2】
Error Amp Reference Voltage
Soft-start Period 85%
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BD9639MWV
Electrical Characteristics –continued
(Unless otherwise specified, VVBAT=VVBAT2,3,4,5,6=3.7[V], VCC input terminal =3.7[V], Ta=25[°C])
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
【CH3】
Error Amp Reference Voltage
VEREF3
0.390
0.400
0.410
V
tSS3
0.85
1.70
2.55
ms
Soft-start period 100% 2.0[ms](Typ)
RONPD3
-
0.24
0.39
Ω
Power supply 3.7[V]
RONND3
-
0.25
0.40
Ω
Power supply 3.7[V]
RONPU3
-
0.26
0.42
Ω
Power supply 3.7[V]
NMOS ON-Resistance UP Side
RONNU3
-
0.16
0.27
Ω
Power supply 3.7[V]
Maximum Duty
DMAX3
65
80
95
%
VEREF4
0.390
0.400
0.410
V
tSS4
1.28
2.55
3.83
ms
Soft-start period 100% 3.0[ms](Typ)
RONPD4
-
0.16
0.26
Ω
Power supply 3.7[V]
RONND4
-
0.21
0.33
Ω
Power supply 3.7[V]
RONPU4
-
0.24
0.38
Ω
Power supply 3.7[V]
NMOS ON-Resistance UP Side
RONNU4
-
0.16
0.26
Ω
Power supply 3.7[V]
Maximum Duty
DMAX4
65
80
95
%
VEREF5
0.390
0.400
0.410
V
Soft-start Period 85%
tSS5
0.85
1.70
2.55
ms
Soft-start period 100% 2.0[ms](Typ)
PMOS ON-Resistance
RONP5
-
0.26
0.42
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN5
-
0.17
0.28
Ω
Power supply 3.7[V]
Error Amp Reference Voltage 1
VEREF6
0.380
0.400
0.420
V
Constant voltage control side
Error Amp Reference Voltage 2
VEREF6.1
0.380
0.400
0.420
V
Constant current control side
Soft-start Period 85%
PMOS ON-Resistance DOWN
Side
NMOS ON-Resistance DOWN
Side
PMOS ON-Resistance UP Side
【CH4】
Error Amp Reference Voltage
Soft-start Period 85%
PMOS ON-Resistance DOWN
Side
NMOS ON-Resistance DOWN
Side
PMOS ON-Resistance UP Side
【CH5】
Error Amp Reference Voltage
【CH6】
Soft-start Period 85%
tSS6
2.55
5.10
7.65
ms
Soft-start period 100% 6.0[ms](Typ)
Load Switching ON-Resistance
RONP6
-
0.23
0.37
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN6
-
0.47
0.73
Ω
Power supply 3.7[V]
DMAX6
83
90
97
%
Maximum Duty
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BD9639MWV
Application Information
1.
Function Description
(1) Features Summary
CH
Function
Output voltage
Power output
Setting res.
CH1
USE
Boost converter
3.70[V] to 5.50[V]
Embedded
External
Start-up CH, Motor
CH2
Buck converter
1.05[V] to 1.80[V]
Embedded
External
Core
CH3
H-BRIDGE converter
1.80[V] to 3.30[V]
Embedded
External
CMOS
CH4
H-BRIDGE converter
3.25[V]
Embedded
Embedded
Digital
CH5
Buck converter
1.50[V] to 1.80[V]
Embedded
External
CMOS, Memory
CH6
Boost converter
2 LED to 6 LED
Embedded
External
LED
(2) CONTROL
(a) Stand-by function related terminals
Following table shows start-up condition of each block.
XSHDN1 XSHDN24 XSHDN3 XSHDN5 XSHDN6 CH1 PFM CH1 PWM
L
L
H
H
-
-
-
L
L
L
H
L
ON
L
H
L
OFF
L
OFF
OFF
ON
Internal
supply
CH2
CH4
OFF
OFF
ON
ON
CH3
OFF
OFF
CH6
OFF
ON
OFF
H
CH5
ON
OFF
ON
(Note) - symbol mean without conditions.
(b) Other setting terminals
(c) XSHDN24 to XSHDN6 terminal equivalent circuit
VBAT
VBAT
30[kΩ ]
400[kΩ ]
AGND
XSHDN1 terminal does not have a pull down.
it is necessary to process the VBAT input and the GND input.
(3) Start-up Circuit
CH1 begins operating using PFM when XSHDN1 goes “HIGH”.
Afterwards, when XSHDN24 goes “HIGH” an internal power supply turns ON and CH1 starts operating using PWM.
From the time XSHDN24 goes “HIGH”, CH2 to CH6 enters standby mode for about 5 ms after which CH2 and CH4
begin a soft start. Similarly, when XSHDN24 to XSHDN6 goes High synchronously, CH2 to CH6 starts soft-start
after the normal wait time.
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(4) CH1
(a) Function
Selectable PWM/PFM boost DC/DC converter.
Output voltage is ranges from 3.7[V] to 5.5[V].
Low voltage operation starts up from 2.5[V] and also provides supply voltage to VREF circuit.
OUT1
VOUT1
OUT1
VOUT1
OUT1
VOUT1
VBAT
R11
D11
PFM
C13 FB1
R12
PRE
DRIVER
PWM
C11
SW1
L11
C12
PGND1
VBAT
0.4[V]
MAX.
MAX
DUTY
PWM/PFM
VBAT
C14
R13
Start up circuit
(b) Recommended External Components (At the time of setting when VOUT1=5.0V)
Parts Name
Value
Maker
Part Number
R11
620[kΩ] +24[kΩ]
-
-
R12
56[kΩ]
-
-
R13
10[Ω]
-
-
C11
22[µF]
C12
C13
Taiyo Yuden
JMK212BJ226MG
10[µF]
Taiyo Yuden
JMK212BJ106KG
100[pF]
Taiyo Yuden
UMK1005CH101JV
C14
1[µF]
Taiyo Yuden
JMK105BJ105KV
L11
2.2[µH]
Taiyo Yuden
NR4018T2R2N
ROHM
RB060M-30
D11
(x2)
-
(c) Start-up Sequence
2.5[ V] to 5.5[V]
VBAT
0[ V]
H input voltage
XSHDN1
0[ V]
3 .7 [V] to 5. 5[ V]
OUT1
Electricity is discharged
according to the load .
≈ VBAT[ V]
0[V]
Soft start period
(d) PWM/PFM
H input voltage
XSHDN24
0[V]
3.7[ V] to 5 .5[V]
OUT1
PFM operation
PWM operation
（Load 5mA or less)
PFM operation
（Load 5mA or less)
Select PWM/PFM (operation of XSHDN=HIGH and XSHDN24) with light load (10mA or less).
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BD9639MWV
(5) Internal Supply Voltage
(a) Function
Regulator input voltage is supplied by OUT1.
Output voltage is 2.5[V] is not available outside the chip and is used only to power up internal circuit.
This internal supply is used during PWM mode when both XSHDN1 and XSHDN24 are “HIGH”.
VCC
OUT1
Internal
power
supply
Reference
Voltage
(b) Start-up Sequence
3 .7[V] to 5. 5[ V]
VCC
H input voltage
0 [V]
XSHDN 24
2 .5 [V]
Internal power supply
0[ V]
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BD9639MWV
(6) CH2
(a) Function
Synchronous rectification buck DC/DC converter with built in power MOS output stage.
Output voltage ranges from 1.05[V] to 1.80[V].
OUT2
VOUT2
VBAT
VBAT2
R21
C23
C22
FB2
R22
SW2
PRE
DRIVER
OUT2
VOUT2
L21
0.4[V]
C21
PGND2
SAW
(b) Recommended External Components
Parts
Value
Maker
Part number
name
OUT2
Set external
1.1[V]
1.2[V]
R21
Refer to right table
-
-
R21
100[kΩ]
100[kΩ]
R22
Refer to right table
-
-
R22
56[kΩ] + 1.1[kΩ]
20[kΩ] + 30[kΩ]
C21
22[µF]
Taiyo Yuden
JMK212BJ226MG
C22
10[µF]
Taiyo Yuden
JMK212BJ106KG
C23
33[pF]
Taiyo Yuden
UMK105CH330JV
L21
2.0[µH]
TOKO
A915AY-2R0M
(c) Start-up Sequence
2. 5[ V] to 5. 5[V]
VBAT2
VBAT4
H input voltage
XSHDN1
H input voltage
XSHDN 24
0 [V]
Discharge
1 .05 [V] to1.80[ V]
OUT2
0[V]
5.00[ms]
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Soft start period
1. 00[ms]
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BD9639MWV
(7) CH3
(a) Function
Synchronous rectification cross converter with built-in power MOS output stage.
Output voltage ranges from 1.80[V] to 2.80[V].
OUT3
OUT3
OUT3
C31
USW3
PGND3
R31
C33
VBAT
FB3
VBAT3
L31
R32
C32
Buck-Boost
PWMCOMP
PRE
DRIVER
DSW3
P31
0.4[V]
SAW
(b) Recommended External Components
Parts
Value
Maker
Part Number
Name
Refer to right
R31
table
Refer to right
R32
table
C31
22[µF]
Taiyo Yuden
JMK212BJ226MG
C32
10[µF]
Taiyo Yuden
JMK212BJ106KG
C33
100[pF]
Taiyo Yuden
UMK105CH101JV
L31
4.7[µH]
Taiyo Yuden
NR3015T4R7M
P31
-
ROHM
RW1A020ZP
DPG3
MAX.
DUTY
OUT3
1.80[V]
2.80[V]
R31
100[kΩ]
100[kΩ]
R32
27[kΩ] + 1.6[kΩ]
12[kΩ] + 4.7[kΩ]
Set external
(c) Start-up Sequence
2. 5[V] to 5. 5 [V]
VBAT3
H input voltage
XSHDN 1
XSHDN24
H input voltage
XSHDN 3
0[V]
Discharge
1.80[V] to 2 .80[ V]
OUT3
0[V]
Soft start period
2 .00[ ms]
(Note) When VOUT=1.8[V], if OUT3・USW3 are not used (These terminals are only for Buck condition),
Discharge function is not activated.
(d) DPG3
The DPG3 output terminal is a gating signal to an external PMOS inserted between VBAT3 and DSW3.
If the VVBAT voltage becomes lower than 2.85[V], DPG3 becomes Low and an external PMOS turns ON.
The over-current can still electrify even if the voltage descend.
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(8) CH4
(a) Function
Synchronous rectification cross converter with built-in power MOS output stage.
The output voltage is fixed at 3.25V.
OUT4
OUT4
C41
USW4
PGND4
OUT4
VBAT
FB4
VBAT4
L41
C42
Buck-Boost
PWMCOMP
DSW4
PRE
DRIVER
0.4[V]
DPG4
MAX.
DUTY
SAW
P41
(b) Recommended External Components
Parts name
Value
Maker
Part number
C41
22[µF]
Taiyo Yuden
JMK212BJ226MG
C42
10[µF]
Taiyo Yuden
JMK212BJ106KG
L41
3.3[µH]
Taiyo Yuden
NR4018T3R3M
P41
-
ROHM
RW1A20ZP
(c) Start-up Sequence
2.5[ V] to 5. 5[ V]
VBAT2
VBAT4
H input voltage
XSHDN1
H input voltage
XSHDN 24
0 [V]
Discharge
1.05 [ V] to1 . 80[ V]
70 [%]
OUT2
0[V]
Discharge
3. 25[V]
OUT4
0[V]
5. 00[ ms]
UP side
PMOS
Control signal
Soft start period
3. 00 [ms]
UP side PMOS ON or Switching
(d) DPG4
The DPG4 output terminal is a gating signal to an external PMOS inserted between VBAT4 and DSW4.
If the VVBAT voltage becomes lower than 2.85[V], DPG4 becomes Low and an external PMOS turns ON.
The over-current can still electrify even if the voltage descend.
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BD9639MWV
(9) CH5
(a) Function
Synchronous rectification Buck DC/DC converter with integrated output stage power MOS.
Output voltage ranges from 1.50[V] to 1.80[V].
OUT5
VOUT5
VBAT
VBAT5
R51
C53
C52
FB5
R52
SW5
PRE
DRIVER
OUT5
VOUT5
L51
0.4[V]
C51
PGND5
SAW
(b) Recommended External Components
Parts
Value
Maker
Part number
name
Refer to right
R51
table
Refer to right
R52
table
C51
10[µF]
Taiyo Yuden
JMK212BJ106KG
C52
1[µF]
Taiyo Yuden
JMK105BJ105KV
C53
100[pF]
Taiyo Yuden
UMK105CH101JV
L51
6.8[µH]
Taiyo Yuden
NR3015T6R8M
OUT5
1.5[V]
1.8[V]
R51
100[kΩ]
100[kΩ]
R52
33[kΩ] + 3.3[kΩ]
27[kΩ] + 1.6[kΩ]
Set external
(c) Start-up Sequence
2.5[ V] to 5. 5 [V]
VBAT5
H input voltage
XSHDN 1
XSHDN24
H input voltage
XSHDN 5
0[V]
Discharge
1.50 [V] to 1 .80[ V]
OUT5
0[V]
Soft start period
2 . 00[ ms]
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BD9639MWV
(10) CH6
(a) Function
Boost DC/DC converter with built-in load switch.
This channel enables constant voltage operation and constant voltage operation for protection.
The constant voltage is available with output of 2 to 6 LEDs (typ).
The load switch turns OFF when XSHDN6 goes LOW (CH6 shutdown) and the timer latch.
VBAT
FB6
OUT6
VOUT6
VBAT6
C62
LSO6
L61
PRE
DRIVER
0.4[V]
SW6
MAX.
MAX
DUTY
Di61
OUT6
VOUT6
C61
SAW
PGND6
0.4[V]
FB61
R61
Reserv
e
(b) Recommended External Components
Parts
Value
Maker
name
Part number
R61
20[Ω]
-
-
C61
4.7[µF]
Taiyo Yuden
EMK212BJ475KG
C62
1[µF]
Taiyo Yuden
JMK105BJ105KV
L61
10[µH]
Taiyo Yuden
NR3015T100M
Di61
-
ROHM
RB551V-30
(c) Start-up Sequence
2 .5 [ V] to 5. 5[ V]
VBAT 6
H input voltage
XSHDN 1
XSHDN24
H input voltage
XSHDN 6
0 [ V]
2 to 6 lights output voltage
OUT6
Electricity is discharged
according to the load .
≈ VBAT [V]
0[ V]
ON_delay
SOFT
Soft start period
6. 0[ ms]
(d) Set Voltage when Fixed Voltage is Driven
When a fixed voltage is driven by internal resistance, it is set to 16V.
It is possible to return in a set voltage by adding external resistance between OUT6 and FB6.
When a fixed voltage is driven, it becomes 20.1V if 82kΩ is added.
When a fixed voltage is driven, it becomes 22.0V if 120kΩ is added.
However, note the resisting pressure of the capacitance of C61 when stepping up the voltage
applying external resistance.
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BD9639MWV
(11) Ground Short Protection Function
(a) CH2 to CH6 are monitoring error amp input voltage fed backed from output and enable timer circuit with falling
below the detection voltage of short protection circuit. Timer latch circuit will latch power MOS to OFF status of
CH2 to CH6 if such condition remained for 1.0[ms].
(b) All channel except CH1 will be latched with any other channels to be over-current and/or shorted.
(c) Latch will be released either setting XSHDN1=GND, XSHDN24=GND or restarting the device.
(d) Short detection comparator will be disabled by soft start.
(e) The timer latch circuit doesn't operate when an internal power supply is OFF.
OUT2
FB2
0.2[ V]
Latch with follow conditions CH 2 toCH6.
0.2[ V]
CH 2：SW2=Hiz
CH 3：DSW3=Hiz
USW 3=Hiz
CH 4：DSW4=Hiz
USW 4=Hiz
CH 5：SW5=Hiz
CH 6：Load Switch OFF
NMOS =OFF
OUT3
.
FB3
FB4
OUT4
0.2[ V]
Timer latch circuit
OUT5
FB5
OUT6
0.2[V]
FB6
0.4[ V]
(12) Thermal shutdown function
Thermal shutdown function is built in to prevent IC from heat distraction.
Thermal circuit will be disabled by PFM.
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TSZ02201-0313AA400630-1-2
09.Feb.2016 Rev.001
BD9639MWV
Power Dissipation
Power
Dissipation
Pd [W]
Power
dissipation :Pd[W]
5.0
4.83[W]
2.51[W]
2.5
0
25
85
150
Ambient
Temperature
: Ta [°C]
Ambient
temperature Ta[℃]
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BD9639MWV
I/O Equivalent Circuits
Terminal
No.
7
9
14
15
34
37
46
Terminal
Name
Equivalent Circuit
Terminal
No.
Terminal
Name
1
2
16
17
18
19
51
52
55
56
SW1
SW1
OUT4
OUT4
USW4
USW4
USW3
OUT3
OUT1
OUT1
Terminal
No.
Terminal
Name
12
22
23
26
32
40
41
48
49
SW5
DSW4
DSW4
DPG4
LSO6
SW2
SW2
DSW3
DPG3
Terminal
No.
Terminal
Name
6
13
24
25
33
42
43
47
VBAT
VBAT5
VBAT4
VBAT4
VBAT6
VBAT2
VBAT2
VBAT3
Terminal
No.
Terminal
Name
27
Reserve
XSHDN1
XSHDN24
XSHDN5
FB4
XSHDN6
VCC
XSHDN3
AGND
Terminal
No.
Terminal
Name
5
10
28
35
44
45
53
54
TEST1
FB5
FB61
RT
FB2
TEST2
FB3
FB1
Terminal
No.
Terminal
Name
Equivalent Circuit
VBAT
AGND
Equivalent Circuit
Equivalent Circuit
PGND
Equivalent Circuit
VBAT
PGND
Equivalent Circuit
VBAT
29
31
High resisting
pressure
FB6
SW6
AGND
Terminal
No.
Terminal
Name
3
4
8
11
20
21
30
36
38
39
50
PGND1
PGND1
AGND1
PGND5
PGND4
PGND4
PGND6
AGND2
PGND2
PGND2
PGND3
Equivalent Circuit
VBAT2
VBAT3
VBAT4
VBAT5
VBAT6
PGND
AGND
Equivalent Circuit
AGND
AGND
PGND
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BD9639MWV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating. (Refer page 16)
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD9639MWV
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 1. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Board Patterning
・VBAT,VBAT2,VBAT3,VBAT4,VBAT5, VBAT6 must be connected to the power supply on the board.
・VCC must be connected to OUT1 output on the board.
・ALL PGND and AGND must be connected to GND on the board.
・ALL power supply line and GND terminals must be wired with wide/short pattern in order to achieve the lowest
impedance possible.
15. Peripheral Circuitry
・Use low ESR ceramic capacitor for bypass capacitor and place them as close as possible between power supply and
GND terminals.
・Place external components such as L and C by IC using wide and short PCB trace patterns.
・Draw output voltage from each end of capacitor.
・Causing short circuit at CH1 output will overload the external diode and may breakdown the component.
・Prepare physical countermeasures by adding poli-switches and fuses to avoid excess current flow.
16. Start-up
・Keep light load condition when starting up the device.
・Switch to PWM mode (XSHDN24=L to H) after CH1 has started up in PFM mode (XSHDN1=L to H),
and the OUT1 output voltage is stable.
CH3・CH5・CH6 should starts after or simultaneously with PWM mode.
17. Usage of this Product
This IC is designed to be used in DSC/DVD application. When using in other applications, please be sure to consult with
our sales representative in advance.
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BD9639MWV
Ordering Information
B
D
9
6
3
9
M
W
V
-
Package
Package Name
MWV : UQFN056V7070
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UQFN056V7070 (TOP VIEW)
Part Number Marking
BD9639MW
LOT Number
1PIN MARK
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09.Feb.2016 Rev.001
BD9639MWV
Physical Dimension, Tape and Reel Information
Package Name
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UQFN056V7070
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09.Feb.2016 Rev.001
BD9639MWV
Revision History
Date
Revision
09.Feb.2016
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
