Datasheet
8V to 35V, 1.5A 1ch
Buck Converter with Integrated FET
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
General Description
Key Specifications
The BD9701xx is a series of single-channel step-down
switching regulators capable of PWM operation. It has a
built-in P-Channel MOSFET making its efficiency high
at small loads. It has lower power consumption
because it is made under Bi-CMOS process. Its
operating current is only 4mA (Typ) and standby current
is 0µA (Typ).
Features
Input Voltage Range:
Output Voltage Range:
Output Current:
Switching Frequency:
FET ON-Resistance:
Standby Current:
Operating Temperature Range:
Packages
Built-In P-Channel MOSFET for High Efficiency
Adjustable Output Voltage Via External Resistors
Built-In Over-Current Protection and Thermal
Shutdown Circuits
ON/OFF Control Via STBY Pin
8V to 35V
1.0V to 32V
1.5A(Max)
100kHz(Typ)
1.0Ω(Typ)
0μA (Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
TO252-5
6.50mm x 9.50mm x 2.50mm
Applications
TVs, Printers, DVD Players, Projectors, Gaming
Devices, PCs, Car Audio/Navigation Systems, ETCs,
Communication Equipment, AV Products, Office
Equipment, Industrial Devices, and more.
TO220CP-V5
10.00mm x 20.12mm x 4.60mm
Typical Application Circuit
TO220FP-5
10.00mm x 30.50mm x 4.60mm
TO220FP-5(V5)
10.00mm x 31.50mm x 8.15mm
+
C1
1
VCC
OUT
L1
2
5.0V
D1
C4
+
C3
STBY
5
R1 : 4kΩ
INV
4
R2 : 1kΩ
3
GND
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Block Diagram
VCC
1
VREF
PWM COMP
DRIVER
OSC
STBY 5
STBY
CTL
LOGIC
OUT
2
OCP
TSD
INV
Error AMP
4
3
GND
Figure 2. Block Diagram
Pin Configuration
TO252-5
(TOP VIEW)
TO220CP-V5
(TOP VIEW)
GND
TO220FP-5
(TOP VIEW)
TO220FP-5(V5)
(TOP VIEW)
5
1
5
3
2
4
VCC
OUT
GND
INV
STBY
U
INV
3 4
STBY
2
GND
VCC
STBY
1
OUT
5
INV
3 4
GND
VCC
OUT
2
U
5
STBY
OUT
1
4
INV
2
GND
1
VCC
3
Pin Description
Pin No.
1
2
3,FIN(Note 1)
4
5
(Note 1)
Pin Name
VCC
OUT
GND
INV
STBY
Function
Input power supply pin
Internal Pch FET drain pin
Ground
Output voltage feedback pin
ON/OFF control pin
FIN is assigned in the case of TO252-5.
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BD9701T
BD9701T-V5
Absolute Maximum Ratings (Ta＝25°C)
Parameter
Symbol
Rating
Unit
VCC
36
V
STBY-GND
VSTBY
36
V
OUT-GND
VOUT
36
V
INV-GND
VINV
10
V
Maximum Switching Current
IOUT
1.5
A
Supply Voltage (VCC-GND)
TO252
0.8
Power Dissipation
Pd
(Note 2)
W
2 (Note 3)
TO220
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +150
°C
(Note 2)
(Note 3)
Without external heat sink, reduced by 6.4mW/°C over 25°C
Without external heat sink, reduced by 16.0mW/°C over 25°C
Reduced by 160mW/°C, when mounted on ideal size heatsink (Tc = Ta)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to +85°C)
Parameter
Symbol
Input Voltage
VCC
Output Voltage
VOUT
(Note 4)
Limit
Min
8.0
or
VOUT+3(Note 4)
1.0
Unit
Typ
Max
-
35.0
V
-
32
V
The minimum value of an input voltage is the higher either 8.0V or VOUT+3
Electrical Characteristics
(Unless otherwise noted, Ta=25°C,VCC=12V,VOUT=5V,VSTBY=3V)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
RON
-
1.0
1.5
Ω
Design guarantee
η
-
86
-
%
IOUT＝0.5A Design guarantee
fOSC
80
100
120
kHz
Load Regulation
ΔVOUTLOAD
-
10
40
mV
VCC=20V,IOUT=0.5A to 1.5A
Line Regulation
ΔVOUTLINE
-
40
100
mV
VCC=10V to 30V,IOUt=1.0A
Over Current Protection Limit
IOCP
1.6
-
-
A
INV Pin Threshold Voltage
VINV
0.98
1.00
1.02
V
INV Pin Threshold Voltage
Thermal Variation
ΔVINV
-
±0.5
-
%
Tj=0°C to 85°C
Design guarantee
IINV
-
1
-
μA
VINV=1.0V
ON
VSTBYON
2.0
-
36
V
OFF
VSTBYOFF
-0.3
-
+0.3
V
ISTBY
5
25
50
μA
Circuit Current
ICC
-
4
12
mA
Stand-by Current
IST
-
0
5
μA
Output ON-Resistance
Efficiency
Switching Frequency
INV Pin Input Current
STBY Pin
Threshold Voltage
STBY Pin Input Current
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BD9701T-V5
Typical Performance Curves
Efficiency η: [%]
Output Voltage: VOUT [V]
(Unless otherwise specified: Ta=25deg, VCC=12V, VOUT=5V, VSTBY=3V)
Output Current: IOUT [A]
Output Current: IOUT [A]
Figure 3. Efficiency vs Output Current
Output Voltage: VOUT [V]
OSC Frequency: fOSC [kHz]
Figure 4. Output Voltage vs Output Current
(OCP VCC=20V)
Ambient Temperature: Ta [°C]
VCC
VCC
Output Current: IOUT [A]
Figure 5. OSC Frequency vs Ambient Temperature
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VCC
Figure 6. Output Voltage vs Output Current
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Typical Performance Curves - continued
Circuit Current: ICC [mA]
Output Voltage: VOUT [V]
(Unless otherwise specified: Ta=25deg, VCC=12V, VOUT=5V, VSTBY=3V)
Input Voltage: VCC [V]
Input Voltage: VCC [V]
Figure 8.Circuit Current vs Input Voltage
(No Load)
Output Voltage: VOUT [V]
OSC Frequency: fOSC [kHz]
Figure 7. Output Voltage vs Input Voltage
(VOUT=5V, ROUT=5Ω)
Switching Current: ISW [A]
Input Voltage: VCC [V]
Figure 9. Output Voltage vs Switching Current
Figure 10. OSC Frequency vs Input Voltage
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BD9701T-V5
Typical Performance Curves- continued
INV Threshold Voltage: VINV [V]
(Unless otherwise specified: Ta=25deg, VCC=12V, VOUT=5V, VSTBY=3V)
Ambient Temperature: Ta [°C]
Figure 11. INV Threshold Voltage vs Ambient Temperature
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Application Information
1. Block Function Explanation
(1) VREF
This block generates a temperature independent regulated voltage from the VCC input.
(2) OSC
This block generates a triangular waveform the frequency of which is set by internal resistors and capacitors. The output of
this block goes to the PWM comparator.
(3) Error AMP
This block samples the output voltage through a voltage divider network and compares it with an internal reference
voltage. The output of this block is the amplified difference between the sampled output voltage and the reference.
(4) PWM COMP
This block converts the Error AMP output to PWM pulses going to the Driver block.
(5) DRIVER
This push-pull FET driver which accepts PWM input pulses from PWM COMP block drives the internal Pch MOSFET.
(6) STBY
ON/OFF operation of the IC is controlled via the STBY pin. The output is ON when STBY is High.
(7) Thermal Shutdown (TSD)
This circuit protects the IC against thermal runaway and damage due to excessive heat. A thermal sensor detects the
junction temperature and switches the output OFF once the temperature exceeds a threshold value (175deg).
Hysteresis is built-in (15deg) in order to prevent malfunctions due to temperature fluctuations.
(8) Over Current Protection (OCP)
The OCP circuit detects the voltage difference between VCC and OUT by measuring the current through the internal
Pch MOSFET and switches the output OFF once the voltage reaches the threshold value. The OCP block is a
self-recovery type (not latch).
2. Timing Chart
VCC PIN
VOLTAGE WAVE
OSC
(Internal Oscillation Wave) Error AMP OUTPUT
OUTPIN
VOLTAGE WAVE
OUTPUT
VOLTAGE WAVE
Figure 12. Timing Chart
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3. Notes for PCB Layout
C5
C5
R11 ::4kΩ
4kO
R
R2: 1kO
:1kΩ
R2
C
C1
1
4
INV
STBY 5
1 VCC
OUT 2
C2
C2
L1
L1
GND
5.0V
C4
D1 C4
D1
3
C3
C3
Figure 13. Layout
(1) Place capacitors between VCC and Ground as close as possible to the IC to reduce ripple noise and maximize
efficiency.
(2) Place Schottky diode between OUT and Ground, and the Schottky diode as close as possible to the IC to reduce noise
and maximize efficiency.
(3) Connect resistors between INV and Ground, and the output capacitor filter at the same Ground potential in order to
stabilize the output voltage.
4. Application Component Selection and Settings
(1) Inductor L1
If the winding resistance of the choke coil is too high, the efficiency may deteriorate.
Even though the Over Current Protection operates when output current exceeds 1.6A minimum threshold, special
attention should be given to the external inductor which could heat up due to the excessive current during over-load or
short circuit.
Note that the current rating for the coil should be higher than IOUT (MAX)＋∆IL. IOUT (MAX) is the maximum load
current.
If current through the coil exceeds the maximum rating, magnetic saturation, which accounts for efficiency deterioration,
may occur. Therefore, choose an inductor with current rating higher than the expected peak current.
I L
(VCC VOUT ) VOUT
1
L1
VCC
fOSC
Where:
L1 is the inductor value
VCC is the maximum input voltage
VOUT is the output voltage
∆IL is the coil ripple current value
fOSC is the oscillation frequency
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(2) Schottky Barrier Diodes D1
A Schottky diode with extremely low forward voltage drop should be used. Selection should be based on the following
guidelines regarding maximum forward current, reverse voltage, and power dissipation:
(a) The maximum current rating is higher than the combined maximum load current and coil ripple current (∆IL).
(b) The reverse voltage rating is higher than the VIN value.
(c) Recommend using a diode with smaller the reverse current as possible.
In the high temperature case, the reverse current is increasing and it may cause overdrive.
(d) Power dissipation for the selected diode must be within the rated level.
The power dissipation of the diode is expressed by the following formula:
Pdi I OUT MAX VF (1 VOUT / VCC )
Where:
IOUT(MAX) is the maximum load current
VF is the forward voltage
VOUT is the output voltage
VCC is the input voltage
(3) Capacitor C1,C2,C3,C4,C5
Since large ripple currents flow through capacitors C1 and C3, high frequency and low impedance capacitors must be
used. Ceramic capacitor C2 should be present to prevent noise from causing abnormal operation. If the ripple voltage
of input and output is large, C4 can be selected among ceramic, tantalum and OS capacitors with low ESR to reduce
the ripple. However if only low ESR capacitors are used, oscillation or unstable operation may occur. C5 is the
capacitor for phase compensation and is normally not used. If you need to improve the stability of the feedback
network, connect C5 between INV and OUTPUT.
(4) Feed Back Resistance R1,R2
The offset of output voltage is determined by the Feedback resistors and INV pin input current.
VOUT ( R1 R2 )VINV / R2
Where:
VINV is INV Pin Threshold Voltage
If feedback resistance is high, the setting of output voltage will change.
Recommended: Resistance between INV pin and GND = less than 10kΩ.
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BD9701T
BD9701T-V5
5. Recommended Circuit
C2
C2
+
C1
C1
1
VCC
OUT
2
L1
L1
5.0V
D1
D1
C
C4
4
+
C33
C
STBY
5
INV
R1 ::4kΩ
R1
4kΩ
C5
C5
4
3
R2
1kΩ
R2 ::1kΩ
GND
Figure 14. Recommended Circuit Output Voltage 5V: Application Circuit Example
＜Recommended Components (Example)＞
Inductor
L1＝100μH
Schottky Diode
D1
Capacitor
C1＝100μF(50V)
C2＝OPEN
C3＝220μF(25V)
C4＝OPEN
C5＝OPEN
＜Recommended Components example 2＞
Inductor
L1＝100μH
Schottky Diode
D1
Capacitor
C1＝220μF(25V)
C2＝1.0μF(50V)
C3＝470μF(16V)
C4＝150μF(20V)
C3＝OPEN
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:CDRH127/LD (sumida)
:RB050LA-40 (ROHM)
:Al electric capacitor UHD1H101MPT (nichicon)
:Al electric capacitor UHD1E221MPT (nichicon)
:CDRH127/LD (sumida)
:RB050LA-40 (ROHM)
:Al electric capacitor UVR1H221MPA (nichicon)
:Ceramic cap UMK212F105ZG (TAIYO YUDEN)
:Al electric capacitor UVR1E471MPA (nichicon)
:OS capacitor 20SVP150M (SANYO)
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BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
6. Test Circuit
Vcc
VCC
OUT
2
1
GND
INV
4
3
SW2
+
STBY
5
SW4
SW5
A IIINV
INV
Icc A
ICC
ISTBY
ISTB
A
1kΩ
1kΩ
Vcc
V
CC
VINV
V
2kΩ
2kΩ
f
+
VSTB
VSTBY
SW6
V
VOUT
Vo
IOUT
Io
Figure 15. Input Output Measurement Circuit
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BD9701T
BD9701T-V5
Power Dissipation
TO252-5
(4) 4.80W
Power Dissipation: Pd [W]
POWER DISSIPATION : Pd [W]
5
4
(1) No heat sink
(2) 2layer PCB
(Copper laminate area 15 mm x15mm)
(3) 2layer PCB
(Copper laminate area 70 mm x 70mm)
(4) 4layer PCB
(Copper laminate area 70 mm x 70mm)
(3) 3.50W
3
(2) 1.85W
2
(1) 0.80W
1
0
0
25
50
75 85 100
125
AMBIENT
: Ta[°C]
AmbientTEMPERATURE
Temperature: Ta [°C]
150
Figure 16. Power Dissipation
TO220
Power Dissipation: Pd [W]
POWER DISSIPATION : Pd [W]
15
(3) 11.0W
(1) No heat sink
(2) Aluminum heat sink
50 x 50 x 2 (mm3)
(3) Aluminum heat sink
100 x 100 x 2 (mm3)
10
(2) 6.5W
5
(1) 2.0W
0
0
25
50
75
100
125
AmbientTEMPERATURE
Temperature: Ta [°C]
AMBIENT
: Ta[°C]
150
Figure 17. Power Dissipation
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BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
I/O Equivalent Circuit
Pin 1 (VCC), Pin 3 (GND)
Pin 2 (OUT)
Pin 4 (INV)
Pin 5 (STBY)
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
STBY
OUT
INV
300Ω
140KΩ
60KΩ
GND
70KΩ
Figure 18. Input Output Equivalent Circuit
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BD9701T
BD9701T-V5
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board
size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one
power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground
wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions
during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result
in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
N
Parasitic
Elements
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 19. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Pin short and mistake fitting
Do not short-circuit between OUT pin and VCC pin, OUT pin and GND pin,
or VCC pin and GND pin. When soldering the IC on circuit board,
please be unusually cautious about the orientation and the position of the IC.
Bypass diode
Back current prevention diode
VCC
Output Pin
Figure 20
15. Application circuit
Although we can recommend the application circuits contained herein with a relatively high degree of confidence, we
ask that you verify all characteristics and specifications of the circuit as well as performance under actual conditions.
Please note that we cannot be held responsible for problems that may arise due to patent infringements or
noncompliance with any and all applicable laws and regulations.
16. Operation
The IC will turn ON when the voltage at the STBY pin is greater than 2.0V and will switch OFF if under 0.3V.
Therefore, do not input voltages between 0.3V and 2.0V. Malfunctions and/or physical damage may occur.
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15/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Ordering Information
B
D
9
7
0
Part Number
9701=35V/1.5A
1
x
x
-
Package
FP : TO252-5
CP-V5 : TO220CP-V5
T/T-V5 : TO220FP-5(V5)
x
x
x
x
Packaging and forming specification
E2: Embossed tape and reel
None: Tray, Tube
V5 : Forming done
Lineup
Output
Current
Switching
Frequency
TO252-5
TO220CP-V5
TO220FP-5
TO220FP-5 (V5)
100kHz
(fixed)
1.5A
Package
Reel of 2000
Reel of 500
Tube of 500
Tube of 500
Orderable Part
Number
BD9701FP-E2
BD9701CP-V5E2
BD9701T
BD9701T-V5
Part Number Marking
BD9701
BD9701CP
BD9701T
BD9701T
Marking Diagrams
TO220CP-V5
(TOP VIEW)
TO252-5
(TOP VIEW)
Part Number Marking
Part Number Marking
BD9701
LOT Number
BD9701CP
LOT Number
TO220FP-5
(TOP VIEW)
TO220FP-5 (V5)
(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
BD9701T
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
BD9701T
16/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Physical Dimensions, Tape and Reel information
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TO252-5
17/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Physical Dimensions, Tape and Reel information - continued
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TO220CP-V5
18/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Physical Dimensions, Tape and Reel information - continued
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TO220FP-5
19/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Physical Dimensions, Tape and Reel information - continued
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TO220FP-5 V5
20/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
BD9701FP BD9701CP-V5
BD9701T
BD9701T-V5
Revision History
Date
Revision
04.Nov.2014
001
Changes
New Release
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
21/21
TSZ02201-0Q3Q0AJ00390-1-2
04.Nov.2014 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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