BD9703CP-V5E2

Single-chip Type with Built-in FET Switching Regulator Series Simple Step-down Switching Regulators with Built-in Power MOSFET BD9701FP/CP-V5/T/T-V5, BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 No.09027EBT01 ●Description The BD9701/BD9703/BD9702 are single-channel step-down switching regulator capable of PWM operation. The Pch MOS FET is built in for high efficiency in small load area.Lower electricity consumption of operating current 4mA (Typ) and stand-by current 0uA(Typ) is realized by adopting Bi-CMOS process. ●Features 1) Maximum switching current: 1.5A(BD9701/BD9703), 3A(BD9702) 2) Built-in Pch FET ensures high efficiency 3) Output voltage adjustable via external resistors 4) High switching frequency: 100kHz (BD9701), 300kHz(BD9703), 110kHz(BD9702) 5) Overcurrent and thermal shutdown protection circuits built in 6) ON/OFF control via STBY pin 7) Small surface mount TO252-5 package (only BD9701FP, BD9703FP) ●Applications TVs, printers, DVD players, projectors, gaming devices, PCs, car audio/navigation systems, ETCs, communication equipment, AV products, office equipment, industrial devices, and more. ●Line Up BD9701FP/CP-V5/T/T-V5 BD9703FP/CP-V5/T/T-V5 BD9702CP-V5/T/T-V5 1.5A 3.0A Output Current Input Voltage Switching Frequency 100kHz (fixed) 8 or Vo+3 ～ 36V 300kHz (fixed) External Synchronization × Stand-by Function ○ -40 ～ +85℃ Operating Temperature Package 110kHz (fixed) TO252-5/TO220CP-V5/TO220FP-5/TO220FP-5 (V5) TO220CP-V5/TO220FP-5/TO220FP-5 (V5) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/16 2009.04- Rev.B Technical Note BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 ●Absolute Maximum Ratings (Ta＝25℃) Parameter Symbol Ratings Unit Supply Voltage (VCC-GND) VCC 36 V STBY-GND VSTBY 36 V OUT-GND VO 36 V INV-GND VINV 10 V BD9701/BD9703 1.5 Maximum Switching Current Iout A BD9702 3 0.8 (*1) TO252 Power Dissipation Pd W 2(*2) TO220 Operating Temperature Topr -40～+85 ℃ Storage Temperature Tstg -55～+150 ℃ *1 Without external heat sink, the power dissipation reduces by 6.4mW/℃ over 25℃. *2 Without external heat sink, the power dissipation reduces by 16.0mW/℃ over 25℃. Reduced by 160mW/℃, when mounted on Infinity size heatsink. ●Operating Conditions(Ta=-40～+85℃) Parameter Limit Symbol Input Voltage Output Voltage Unit MIN TYP MAX VCC 8.0 or Vo+3(*3) - 35.0 V Vo 1.0 - 32 V *3The minimum value of an input voltage is the higher either 8.0V or Vo+3 ●Electrical Characteristics ○BD9701FP/CP-V5/T/T-V5 (Unless otherwise noted, Ta=25℃,VCC=12V,Vo=5V,STBY=3V) Limit Parameter Symbol Unit Conditions MIN TYP MAX Ron - 1.0 1.5 Ω design guarantee η - 86 - % Io＝0.5A design guarantee fosc 80 100 120 kHz Load Regulation ΔVOLOAD - 10 40 mV VCC=20V,Io=0.5～1.5A Line Regulation ΔVOLINE - 40 100 mV VCC=10～30V,Io=1.0A Over Current Protection Limit Iocp 1.6 - - A INV Pin Threshold Voltage VINV 0.98 1.00 1.02 V INV Pin Threshold Voltage Thermal Variation ΔVINV - ±0.5 - % Tj=0～85℃ design guarantee IINV - 1 - μA VINV=1.0V ON VSTBYON 2.0 - 36 V OFF VSTBYOFF -0.3 - 0.3 V Istby 5 25 50 μA Circuit Current Icc - 4 12 mA Stand-by Current Ist - 0 5 μA Output ON Resistance Efficiency Switching Frequency INV Pin Input Current STBY Pin Threshold Voltage STBY Pin Input Current STBY=3V STBY＝0V This product is not designed to be resistant to radiation. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/16 2009.04- Rev.B Technical Note BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 ●Electrical Characteristics ○BD9703FP/CP-V5/T/T-V5 (Unless otherwise noted, Ta=25℃,VCC=12V,Vo=5V,STBY=3V) Limit Parameter Symbol Unit Conditions MIN TYP MAX Ron - 1.0 1.5 Ω design guarantee η - 86 - % Io＝0.5A design guarantee fosc 270 300 330 kHz Load Regulation ΔVOLOAD - 10 40 mV VCC=20V,Io=0.5～1.5A Line Regulation ΔVOLINE - 40 100 mV VCC=10～30V,Io=1.0A Over Current Protection Limit Iocp 1.6 - - A INV Pin Threshold Voltage VINV 0.98 1.00 1.02 V INV Pin Threshold Voltage Thermal Variation ΔVINV - ±0.5 - % Tj=0～85℃ design guarantee IINV - 1 - μA VINV=1.0V ON VSTBYON 2.0 - 36 V OFF VSTBYOFF -0.3 - 0.3 V Istby 5 25 50 μA Circuit Current Icc - 5 12 mA Stand-by Current Ist - 0 5 μA Output ON Resistance Efficiency Switching Frequency INV Pin Input Current STBY Pin Threshold Voltage STBY Pin Input Current STBY=3V STBY＝0V ●Electrical Characteristics ○BD9702FP/CP-V5/T/T-V5 (Unless otherwise noted, Ta=25℃,VCC=12V,Vo=5V,STBY=3V) Limit Parameter Symbol Unit Conditions MIN TYP MAX Ron - 0.5 1.5 Ω design guarantee η - 86 - % Io＝1A design guarantee fosc 88 110 132 kHz Load Regulation ΔVOLOAD - 10 40 mV VCC=20V,Io=1～3A Line Regulation ΔVOLINE - 40 100 mV VCC=10～30V,Io=1.0A Over Current Protection Limit Iocp 3.2 - - A INV Pin Threshold Voltage VINV 0.98 1.00 1.02 V INV Pin Threshold Voltage Thermal Variation ΔVINV - ±0.5 - % Tj=0～85℃ design guarantee IINV - 1 - μA VINV=1.0V ON VSTBYON 2.0 - 36 V OFF VSTBYOFF -0.3 - 0.3 V Istby 5 25 50 μA Circuit Current Icc - 4 12 mA Stand-by Current Ist - 0 5 μA Output ON Resistance Efficiency Switching Frequency INV Pin Input Current STBY Pin Threshold Voltage STBY Pin Input Current www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/16 STBY=3V STBY＝0V 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Characteristic Data ○BD9701FP/CP-V5/T/T-V5 5 80 70 60 50 110 OSC FREQUENCY : FOSC　[ｋHz] 90 OUTPUT VOLTAGE : VO [V] 6 EFFICIENCY η: [%] 100 4 3 2 1 0 40 10 100 0 1000 1 2 3 105 100 95 90 -10 4 OUTPUT CURRENT IOUT : [A] OUTPUT CURRENT : IOUT[A] Fig.2 OCP VCC=20V Fig.1 EFFICIENCY-LOAD CURRENT 30 50 70 90 Fig.3 fosc-Ta 5.100 5.1 10 AMBIE NT T E MPE RAT URE : T a [℃ ] 5 VCC=30V 5.05 5 4.95 VCC=20V VCC=10V CIRCUIT CURRENT ; [mA] OUTPUT VOLTAGE : VO [V] 5.050 5.000 4.950 4.9 3 2.5 2 1.5 1 0 4.900 0 200 400 600 800 1000 0 10 20 30 10 40 INPUT VOLTAGE : VCC [V] OUTPUT CURRENT : IOUT[A] OSC FREQUENCY : FOSC　[ｋHz] 3 2.5 2 1.5 1 0.5 0 0.5 1 1.5 105 100 95 2 SWITCHING CURRENT : ISW[A] Fig.7 VOUT～OUT VOLTAGE-DRAIN CURRENT www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 25 30 35 1.020 90 0 20 Fig.6 CIRCUIT CURRENT-INPUT VOLTAGE NO LOAD 110 3.5 15 INPUT VOLTAGE : VCC [V] Fig.5 OUTPUT VOLTAGE-INPUT VOLTAGE (Vo=5V,Ro=5ohm) Fig.4 OUTPUT VOLTAGE-LOAD CURRENT OUTPUT VOLTAGE : VDS[V] 4 3.5 0.5 0 10 20 30 INPUT VOLTAGE : VCC [V] Fig.8 fosc-INPUT VOLTAGE 4/16 40 INV THRESHOLD VOLTAGE : VINV[V] OUTPUT VOLTAGE : VO [V] 4.5 1.010 1.000 0.990 0.980 -10 10 30 50 70 AMBIENT TEMPERATURE : Ta [℃] Fig.9 INV THRESHOLD VOLTAGE-Ta 2009.04- Rev.B 90 BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Characteristic Data ○BD9702FP/CP-V5/T/T-V5 6 100 EFFICIENCY η: [%] 80 70 60 50 [kHz] OSC FREQUENCY : FOSC OUTPUT VOLTAGE : VO [V] 120 90 5 4 3 2 1 0 40 10 100 1000 OUTPUT CURRENT : IOUT[A] 0 10000 1 5.10 4 5 VCC=20V 5.00 4.95 VCC=10V 4.90 500 1000 1500 2000 2500 5.00 4.95 10 20 30 40 Fig.13 OUTPUT VOLTAGE-LOAD CURRENT Fig.14 OUTPUT VOLTAGE-INPUT VOLTAGE (Vo=5V,Ro=5ohm) INV THRESHOLD VOLTAGE : VINV[V] OSC FREQUENCY : FOSC　[ｋHz] 110 105 0.5 1 1.5 2 2.5 3 SWITCHING CURRENT : ISW[A] Fig.16 VOUT～OUT VOLTAGE-DRAIN CURRENT www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2 1 15 20 25 30 35 Fig.15 CIRCUIT CURRENTINPUT VOLTAGE NO LOAD 1.01 1.00 0.99 0.98 100 0 3 1.02 115 0.0 90 INPUT VOLTAGE : VCC [V] 120 0.5 70 4 10 OUTPUT CURRENT : IOUT[A] 1.0 50 0 0 INPUT VOLTAGE : VCC [V] 1.5 30 5 5.05 3000 2.0 10 Fig.12 fosc-Ta 4.90 0 - 10 AMBIENT TEMPERATURE : Ta [℃] CIRCUIT CURRENT ; [mA] VCC=30V 5.05 105 100 6 5.10 OUTPUT VOLTAGE : VO [V] OUTPUT VOLTAGE : VO [V] 3 110 Fig.11 OCP VCC=20V Fig.10 EFFICIENCY-LOAD CURRENT OUTPUT VOLTAGE : VDS[V] 2 OUTPUT CURRENT : IOUT[A] 115 0 10 20 30 40 -10 10 30 50 70 INPUT VOLTAGE : VCC [V] AMBIENT TEMPERATURE : Ta [℃] Fig.17 fosc-INPUT VOLTAGE Fig.18 INV THRESHOLD VOLTAGE-Ta 5/16 2009.04- Rev.B 90 BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Characteristic Data ○BD9703FP/CP-V5/T/T-V5 100 6 80 70 60 50 OSC FREQUENCY : FOSC　[ｋHz] OUTPUT VOLTAGE : VO [V] EFFICIENCY η: [%] 90 330 5 4 3 2 1 0 40 10 100 0 1000 OUTPUT CURRENT : IOUT[A] 3 285 270 4 -10 Fig.21 fosc-Ta 5 OUTPUT VOLTAGE : VO [V] VCC=30V 5 VCC=20V 4.95 VCC=10V CIRCUIT CURRENT ; [mA] 5.10 5.05 5.05 5.00 4.95 200 400 600 800 0 1000 1.5 10 20 30 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 SWITCHING CURRENT : ISW[A] www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 20 25 30 35 Fig.24 CIRCUIT CURRENT-INPUT VOLTAGE NO LOAD 1.02 315 300 285 270 0 10 20 30 INPUT VOLTAGE : VCC [V] Fig.25 VOUT～OUT VOLTAGE-DRAIN CURRENT 15 INPUT VOLTAGE : VCC [V] INV THRESHOLD VOLTAGE : VINV[V] OSC FREQUENCY : FOSC　[ｋHz] 0 1 10 40 330 0 2 Fig.23 OUTPUT VOLTAGE-INPUT VOLTAGE (Vo=5V,Ro=5ohm) Fig.22 OUTPUT VOLTAGE-LOAD CURRENT 0.5 3 INPUT VOLTAGE : VCC [V] OUTPUT CURRENT : IOUT[A] 1 4 0 4.90 4.9 0 10 30 50 70 90 AMBIENT TEMPERATURE : Ta [℃] Fig.20 OCP VCC=20V 5.1 OUTPUT VOLTAGE : VO [V] 2 300 OUTPUT CURRENT : IOUT[A] Fig.19 EFFICIENCY-LOAD CURRENT OUTPUT VOLTAGE : VDS[V] 1 315 Fig.26 fOSC-INPUT VOLTAGE 6/16 40 1.01 1.00 0.99 0.98 -10 10 30 50 70 90 AMBIENT TEMPERATURE : Ta [℃] Fig.27 INV THRESHOLD VOLTAGE-Ta 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 ●Block Diagram BD9701FP/CP-V5/T/T-V5, BD9703FP/CP-V5/T-V5, BD9702CP-V5/T/T-V5 Technical Note VCC 1 TO252-5 Package Dimensions (mm) VREF PWM COMP DRIVER OSC STBY 5 STBY CTL LOGIC OUT 2 OCP TSD INV 4 Error AMP TO220CP-V5 Package Dimensions (mm) 3 GND Fig.28 Block Diagram ●Pin Description Pin No. Pin Name Function 1 VCC Input Power Supply Pin 2 OUT Internal Pch FET Drain Pin 3,FIN(*2) GND Ground 4 INV Output Voltage Feedback Pin 5 STBY ON/OFF Control Pin (*2)FIN is assigned in the case of TO252-5. TO220FP-5 Package Dimensions (mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. TO220FP-5(V5) Package Dimensions (mm) 7/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Block Function Explanations ・VREF Generates the regulated voltage from VCC input, compensated for temperature. ・OSC Generates the triangular wave oscillation frequency using an internal resistors and capacitor. Used for PWM comparator input. ・Error AMP This block, via the INV pin, detects the resistor-divided output voltage, compares this with the reference voltage, then amplifies and outputs the difference. ・PWM COMP Outputs PWM signals to the Driver block, which converts the error amp output voltage to PWM form. ・DRIVER This push-pull FET driver powers the internal Pch MOSFET, which accepts direct PWM input. ・STBY Controls ON/OFF operation via the STBY pin. The output is ON when STBY is High. ・Thermal Shutdown (TSD) This circuit protects the IC against thermal runaway and damage due to excessive heat. A thermal sensor detects the junction temperature and switches the output OFF once the temperature exceeds a threshold value (175deg). Hysteresis is built in (15deg) in order to prevent malfunctions due to temperature fluctuations. ・Over Current Protection (OCP) The OCP circuit detects the voltage difference between VCC and OUT by measuring the current through the internal Pch MOSFET and switches the output OFF once the voltage reaches the threshold value. The OCP block is a self-recovery type (not latch). ●Timing Chart OSC (Internal Oscillation Wave) Error AMP OUTPUT VCC PIN VOLTAGE WAVE OUTPIN VOLTAGE WAVE OUTPUT VOLTAGE WAVE Fig.29 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Timing Chart 8/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Notes for PCB layout C5 R1 : 4kO R2 : 1kO C1 4 INV STBY 5 1 VCC OUT 2 L1 GND C2 3 5.0V D1 C4 C3 Fig.30 Layout • Place capacitors between VCC and Ground, and the Schottky diode as close as possible to the IC to reduce noise and maximize efficiency. • Connect resistors between INV and Ground, and the output capacitor filter at the same Ground potential in order to stabilize the output voltage. ●Application component selection and settings Inductor L1 If the winding resistance of the choke coil is too high, the efficiency may deteriorate. As the overcurrent protection operates over minimum 1.6A (BD9701FP/CP-V5/T/T-V5, BD9703FP/CP-V5/T-V5) or 3.2A minimum (BD9701CP-V5/T/T-V5), attention must be paid to the heating of the inductor due to overload of short-circulated load. Note that the current rating for the coil should be higher than IOUT(MAX)＋⊿IL. Iout (MAX): maximum load current If you flow more than maximum current rating, coil will become overload, and cause magnetic saturation, and those account for efficiency deterioration. Select from enough current rating of coil which doesn’t over peak current. VOUT (VCC-VOUT) ⊿IL. = × × 1 fosc L1 VCC L1:inductor value, VCC:maximum input voltage, VOUT:output voltage, ⊿IL:coil ripple current value, fosc:oscillation frequency Shottky Barrier Diodes D1 A Schottky diode with extremely low forward voltage should be used. Selection should be based on the following guidelines regarding maximum forward current, reverse voltage, and power dissipation: ・The maximum current rating is higher than the combined maximum load current and coil ripple current (⊿IL). ・The reverse voltage rating is higher than the VIN value. ・Power dissipation for the selected diode must be within the rated level. The power dissipation of the diode is expressed by the following formula: Pdi=Iout(MAX)×Vf×(1-VOUT/VCC) Iout (MAX): maximum load current, Vf: forward voltage, VOUT: output voltage, VCC: input voltage Capacitor C1,C2,C3,C4,C5 As large ripple currents flow across C1 and C3 capacitors, high frequency and low impedance capacitor for a switching regulator must be used. The ceramic capacitor C2 must be connected. If not, noise may cause an abnormal operation. If the ripple voltage of input and output is large, C4 selected among ceramic , tantalum and OS capacitor with low ESR may decrease the ripple, however if the only low ESR capacitor is used, an oscillation or unstable operation may be caused. C5 is the capacitor for phase compensation and normally not used. If you need to improve the stability of feedback network, connect C5 between INV and OUTPUT. Feed back resistance R1,R2 The offset of output voltage is determined by both Feed back resistance and INV pin input current. VOUT=(R1+R2) VINV/R2 (VINV pin Threshold Votage) If Feed back resistance is high, the setting of output voltage will be move. Recommended : Resistance between INV pin and GND = less than 10kΩ. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Recommended Circuit C2 + C1 1 VCC OUT L1 2 5.0V D1 C4 + C3 STBY 5 R1 : 4kΩ C5 INV 4 R2 : 1kΩ 3 GND Fig.31 Recommended Circuit Output Voltage 5V : Application cicuit example (BD9701FP/CP-V5/T/T-V5) ＜Recommended Components (Example)＞ Inductor L1＝100μH Schottky Diode D1 Capacitor C1＝100μF(50V) C2＝OPEN C3＝220μF(25V) C4＝OPEN C5＝OPEN ＜Recommended Components example 2＞ Inductor L1＝100μH Schotky Diode D1 Capacitor C1＝220μF(25V) C2＝1.0μF(50V) C3＝470μF(16V) C4＝150μF(20V) C3＝OPEN www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. :CDRH127/LD (sumida) :RB050LA-40 (ROHM) :Al electric capacitor UHD1H101MPT (nichicon) :Al electric capacitor UHD1E221MPT (nichicon) :CDRH127/LD (sumida) :RB050LA-40 (ROHM) :Al electric capacitor UVR1H221MPA (nichicon) :ceramic cap UMK212F105ZG (TAIYO YUDEN) :Al electric capacitor UVR1E471MPA (nichicon) :OS capacitor 20SVP150M (SANYO) 10/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note (BD9703FP/CP-V5/T/T-V5) ＜Recommended Components＞ Inductor L1＝47μH Schotky Diode D1 Capacitor C1＝100μF(50V) C2＝2.2μF(50V) C3＝470μF(25V) C4＝OPEN C3＝OPEN :CDRH127/LD (sumida) :RB050LA-40 (ROHM) :Al electric capacitor UHD1H101MPT (nichicon) :ceramic cap CM43X7R225K50A (KYOCERA) :Al electric capacitor UHD1E471MPT (nichicon) (BD9702CP-V5/T/T-V5) ＜Recommended Components＞ Inductor L1＝47μH Schotky Diode D1 Capacitor C1＝1000μF(50V) C2＝OPEN C3＝1000μF(25V) C4＝OPEN C3＝OPEN :CDRH127/LD (sumida) :RB050LA-40 (ROHM) :Al electric capacitor UHD1H102MPT (nichicon) :Al electric capacitor UHD1E102MPT (nichicon) ●Test Circuit Vcc 1 OUT 2 GND INV 4 3 SW2 + STBY 5 SW4 Icc A A I INV 1kΩ Vcc 2kΩ A V INV + f SW5 ISTB VSTB SW6 V Vo Io Fig.32 Input Output Measurement Circuit www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●I/O Equivalent Circuit Pin 1 (VCC), Pin 3 (GND) Pin 2 (OUT) Pin 4 (INV) Pin 5 (STBY) VC VCC VCC STB VCC OUT INV 300Ω 140KΩ 60KΩ GND 70KΩ Fig.33Input Output Equivalent Circuit ●Notes for use 1. Absolute Maximum Ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2. GND voltage Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry a voltage lower than or equal to the GND pin, including during actual transient phenomena. 3. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the presence of a foreign object may result in damage to the IC. 5. Operation in strong electromagnetic field Operation in a strong electromagnetic field may cause malfunction. 6. Thermal shutdown circuit (TSD circuit) This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of the thermal shutdown circuit is assumed. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 12/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note 8. IC pin input This IC is a monolithic IC which (as below) has P+ substrate and betweenthe various pin. A P-N junction is formed from this P layer of each pin. For example the relation between each potential is as follows. (When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.) Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical damage. Accordingly, you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND(P substrate)voltage to an input pin. (PinB) Ｃ ～ ～ (PinA) Transistor (NPN) B ～ ～ Resistance E GND N P＋ P N P＋ P＋ P N Ｎ N N N P substrate P substrate Parasitic diode P＋ GND ＧＮＤ Parasitic diode (PinB) (PinA) ～ ～ ～ ～ C Parasitic diode B E GND GND Other adjacent components Parasitic diode Fig.34 Simplified structure of a Bipolar IC 9. Common impedance Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 10. Pin short and mistake fitting Do not short-circuit between OUT pin and VCC pin, OUT pin and GND pin, or VCC pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about theorientation and the position of the IC. Bypass diode Back current prevention diode VCC Output Pin Fig.35 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 13/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note 11. Application circuit Although we can recommend the application circuits contained herein with a relatively high degree of confidence, we ask that you verify all characteristics and specifications of the circuit as well as performance under actual conditions. Please note that we cannot be held responsible for problems that may arise due to patent infringements or noncompliance with any and all applicable laws and regulations. 12. Operation The IC will turn ON when the voltage at the STBY pin is greater than 2.0V and will switch OFF if under 0.3V. Therefore, do not input voltages between 0.3V and 2.0V. Malfunctions and/or physical damage may occur. ●Power Dissipation TO252-S (4) 4.80W POWER DISSIPATION : Pd [W] 5 4 (1) No heat sink (2) 2layer PCB (Copper laminate area 15 mm×15mm) (3) 2layer PCB (Copper laminate area 70 mm×70mm) (4) 4layer PCB (Copper laminate area 70 mm×70mm) (3) 3.50W 3 (2) 1.85W 2 (1) 0.80W 1 0 0 25 50 75 85 100 125 AMBIENT TEMPERATURE : Ta[°C] 150 Fig.36 TO220 POWER DISSIPATION : Pd [W] 15 (1) No heat sink (2) Aluminum heat sink 3 50×50×2 (mm ) (3) Aluminum heat sink 100×100×2 (mm3) (3) 11.0W 10 (2) 6.5W 5 (1) 2.0W 0 0 25 50 75 100 125 AMBIENT TEMPERATURE : Ta[°C] 150 Fig.37 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 14/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note ●Ordering part number B D 9 Part No. 7 0 1 F Part No. 9701=36V/1.5A 9702=36V/1.5A 9703=36V/3.0A P - Package FP : TO252-5 CP-V5 : TO220CP-V5 T/T-V5 : TO220FP-5(V5) E 2 Packaging and forming specification E2: Embossed tape and reel None:Tray,Tube ●Package specifications TO252-5 2.3±0.2 6.5±0.2 C0.5 1.5±0.2 +0.2 5.1 -0.1 0.5±0.1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.5 4 5 0.8 1 2 3 2.5 9.5±0.5 5.5±0.2 FIN E2 0.5±0.1 0.5 1.27 1.0±0.2 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. +0.3 4.5 −0.1 +0.2 2.8 −0.1 φ3.2±0.1 Container Tube Quantity 500pcs Direction of feed Direction of products is fixed in a container tube 8.0±0.2 0.7 +0.4 17.0 −0.2 +0.3 10.0−0.1 +0.3 7.0 −0.1 13.5Min. 12.0±0.2 1.8±0.2 TO220FP-5 1.2 0.8 1.778 0.5±0.1 2.85 1 2 3 4 5 ∗ Order quantity needs to be multiple of the minimum quantity. (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 15/16 2009.04- Rev.B BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5 Technical Note 23.4 (2.0) φ3.2±0.1 +0.2 2.8 −0.1 17.5 +0.3 4.5 −0.1 0.3 7.0 + − 0.1 Container Tube Quantity 500pcs Direction of feed Direction of products is fixed in a container tube 25.8 + 0.3 10.0 − 0.1 8.0±0.2 0.7 +0.4 17.0 −0.2 12.0±0.2 31.5Max. 1.8±0.2 TO220FP-5(V5) 1.2 0.8 0.5±0.1 1.778 (2.85) 4.25 8.15 1 2 3 4 5 ∗ Order quantity needs to be multiple of the minimum quantity. (Unit : mm) TO220CP-V5 1.444 4.5±0.1 (1.0) 0.82±0.1 0.92 1.778 Tape Embossed carrier tape Quantity 500pcs E2 Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 16.92 13.60 +0.2 2.8 -0.1 8.0 ± 0.2 1.0 ± 0.2 4.92 ± 0.2 12.0 ± 0.2 +0.4 15.2 -0.2 +0.3 φ3.2±0.1 10.0 -0.1 0.42±0.1 1.58 (2.85) 4.12 (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 16/16 1pin Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.04- Rev.B Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001