TECHNICAL NOTE
Large Current External FET Controller Type Switching Regulators
Single-output High-frequency Step-down
Switching Regulator(Controller type)
High temperature
operating
Now available
ESD
Resistance
Now available
BD9850FVM
Dual-output Step-up, Negative, Step-down
Switching Regulator(Controller type)
BD9851EFV
Description
The BD9850FVM is a 1-channel DC/DC step-down switching regulator controller, while the BD9851EFV is a 2-channel DC/DC
step-down switching regulator controller. The BD9850FVM is adaptable for a maximum switching frequency of 2 MHz and the
BD9851EFV for that of 3 MHz. Both provide space saving in all applications.
Features
1) Adaptable for 2-MHz switching frequency (externally variable) (BD9850FVM)
Adaptable for 3-MHz switching frequency (externally variable) (BD9851EFV)
2) FET direct drive
3) High-accuracy reference voltage (Accuracy: ±1%)
4) Built-in Under Voltage Lock Out circuit (UVLO)
5) Built-in Thermal Shutdown circuit (TSD)
6) The BD9851EFV provides two channels:
Channel 1 available for selection of step-down/step-up switching
Channel 2 available for selection of step-down/inverting switching.
7) Compact MSOP8 package (BD9850FVM) / HTSSOP-B20 package (BD9851EFV)
Applications
TFT panel, TA / Router, digital consumer electronics, PC, and portable CD/DVD/DVC
Product lineup
Input range
Oscillation frequency range
External synchronization
Standby function
Operating temperature
Package
BD9850FVM
4V to 9V
100kHz to 2MHz
Not provided
Not provided
– 40˚C to 85˚C
MSOP8
BD9851EFV
4V to 18V
10kHz to 3MHz
Not provided
Provided
–40˚C to 85˚C
HTSSOP-B20
Sep. 2008
ROHM CO.,
LTD .
Absolute maximum ratings (Ta=25˚C)
BD9850FVM
Symbol
Rating
Unit
Power supply voltage
Vcc
10
V
Storage temperature
Tstg
–55 to +150
ºC
Operating temperature
Topr
–40 to +85
ºC
Item
Power dissipation
Maximum junction temperature
587 *
Pd
mW
+150
Tjmax
ºC
*Reduce by 4.7 mW/ ºC over 25ºC (When mounted on PCB of 70mm ×70mm ×1.6mm)
BD9851EFV
Symbol
Rating
Unit
Power supply voltage
(Between Vcc and GND)
Vcc
20
V
Between VREF and GND
VREF
7
V
Between OUT1 and PVcc1
Between OUT2 and PVcc2
Vouth
20
V
Between OUT1, OUT2 and PGND
Voutl
20
Item
Power dissipation
Operating temperature
Maximum junction temperature
Storage temperature
V
(*)
Pd
1000
mW
Topr
–40 to +85
ºC
Tjmax
+150
ºC
Tstg
–55 to +150
ºC
(*)Reduce by 8.0 mW/ ºC over 25ºC (When mounted on PCB of 70mm ×70mm ×1.6mm)
Recommended operating range
BD9850FVM
Item
Symbol
min.
Limits
Typ.
max.
Unit
Power supply voltage
Vcc
4
7
9
V
Oscillation frequency
fosc
100
–
2000
kHz
Operating temperature
Topr
–40
–
+ 85
ºC
min.
Limits
Typ.
max.
BD9851EFV
Item
Symbol
Unit
Power supply voltage
Vcc
4
12
18
V
Oscillation frequency
fosc
10
300
3000
kHz
Timing resistor
RRT
3.3
–
47
kΩ
Timing capacitor
CCT
33
–
10000
pF
2/16
BD9850FVM
Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=7V, fosc=600kHz)
Limits
Item
Symbol
min.
Typ.
max.
Unit
Conditions
[Oscillator block]
Oscillation frequency
fosc
510
600
690
kHz
Frequency regulation
FDV
–5
0
5
%
Vcc = 4V to 9V
Vpptr
–
0.5
–
V
*
CTL/SS pin sink current
ISS
–1.90
–1.00
1.00
μA
CTL / SS pin clamp voltage
VSS
2.2
2.4
2.6
V
VCTLTH
1.2
1.3
1.4
V
D0
1.5
1.6
1.7
V
fosc = 600kHz
D100
2.0
2.1
2.2
V
fosc = 600kHz
Threshold voltage
VIN
0.98
1.00
1.02
V
AV = 0dB
Frequency bandwidth
BW
1.5
3.0
–
MHz
Voltage gain
Av
–
70
–
dB
Input bias current
IIB
–150
–70
–
hA
Maximum output voltage
VCH
2.3
2.4
2.6
V
Minimum output voltage
VCL
–
0.03
0.20
V
Output source current
IOl
–3.1
–1.6
–1.0
mA
VFB = 1.0V
Output sink current
IOO
12
50
125
mA
VFB = 1.0V
VREF output voltage
VREF
2.475
2.500
2.525
V
FREF load regulation
ΔVREFl0
–
–
10
mV
IVREF
–45
–16
–1
mA
Standby current
ICCS
420
610
960
μA
Average supply current
ICCA
3.4
5.0
7.8
mA
ON resistance
RON
0.9
2.5
8.0
Ω
Output transient time
Tr/ Tf
–
20
–
nsec
VUT
3.7
3.8
3.9
V
VUThy
0.05
0.10
0.15
V
Oscillator amplitude voltage
RRT = 24kΩ
[Soft start / SW block]
CTL threshold voltage
VCTL/SS = 1.5V
[PWM comparator block]
0% threshold voltage
100% threshold voltage
[Error Amp block]
*
*
[VREF block]
VREF current capacitance
IVREF = 0mA
IVREF = 0mA to –1mA
[Total device]
At no load
[Output block]
Cout = 1000pF
*
[Under voltage lockout block]
Threshold voltage
Hysteresis width
*Design guarantee
*Not designed to be radiation-resistant.
3/16
Vcc sweep down
BD9851EFV
Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=12V, fosc=300kHz, STB=3V)
Limits
Item
Symbol
Unit
min.
Typ.
max.
[Total device]
Conditions
Iccst
–
–
5
μA
STB=0V
Icc
1.5
2.5
4.1
mA
FB1, FB2=0V
Output voltage
VREF
2.475
2.500
2.525
V
Io=–0.1mA
Input stability
DVli
–
–
10
mV
Vcc=4Vto18V, Io=–0.1mA
Load stability
DVlo
–
–
10
mV
Io=–0.1mA to –1mA
Ios
– 45
–12
–3
mA
fosc
270
300
330
kHz
Dfosc
–2
0
2
%
Vcc=4Vto18V
Threshold voltage
Vthea
0.98
1.00
1.02
V
Ch1
Input offset voltage
Vofst
–10
0
10
mV
Ch2
Common-mode input voltage range
Vcm
0.3
–
2.0
V
Ch2
Input bias current
Ibias
–150
–70
–
nA
Voltage gain
Av
60
75
90
dB
Frequency bandwidth
Bw
3
6
13
MHz
Maximum output voltage
Vfbh
VREF –0.1
–
VREF
V
Minimum output voltage
Vfbl
–
–
0.1
V
Output sink current
Isink
1.6
6
16
mA
FB pin
Isource
–260
–160
–90
μA
FB pin
Vth0
1.21
1.31
1.41
V
FB voltage
Vth100
1.74
1.84
1.94
V
FB voltage
Idtc
–1
–
1
μA
RONN
1.5
3
3
Ω
When OUT = Lo
RONP
1
2
2
Ω
When OUT=Hi
Vselh
Vcc – 0.2
–
–
V
In step-down switching
Vsell
0
–
–
V
In step-down switching
Threshold voltage
Vstb
0.6
1.5
1.5
V
Sink current
Istb
6
15
15
μA
Standby mode circuit current
Operation mode circuit current
[Reference voltage block]
Short circuit mode output current
[Oscillator block]
Oscillation frequency
Oscillation frequency regulation
RRT=24kΩ, CCT=220pF
[Error Amp block]
Output source current
DC
*Design guarantee
MHz *Design guarantee
[PWM comparator block]
0% threshold voltage
100% threshold voltage
DTC bias current
[FET driver block]
ON resistance
SEL1 input voltage range
[Control block]
STB = 3V
[Short circuit protection circuit (SCP) block]
Timer start voltage
Vtime
2.2
2.3
2.3
V
FB voltage
Threshold voltage
Vthscp
1.4
1.5
1.5
V
SCP voltage
Standby mode voltage
Vstscp
–
10
10
mV
SCP voltage
Source current
Vsoscp
–3.2
–2.0
–2.0
μA
SCP=0.75V
Vuvlo
3.58
3.7
3.7
V
DVuvlo
0.05
0.11
0.11
V
[Under voltage lockout block (UVLO)]
Threshold voltage
Hysteresis width
*Design guarantee
4/16
Vcc sweep down
Characteristic data
1.02
100
1.015
90
87
1.01
70
ON DUTY : DON(%)
ERROR-AMP. THRESHOLD VOLTAGE : VINV(V)
(BD9850FVM)
1.005
1
0.995
0.99
60
50
40
30
20
0.985
10
0.98
–40
–20
0
20
40
60
0
1.5
80
1.6
1.7
1.8
1.9
2
2.1
FB VOLTAGE : VFB(V)
Fig.1 Error Amp threshold voltage vs. Ambient temperature
Fig.2 FB voltage vs. ON Duty
1000
1000
900
900
800
Vcc=10V
700
600
Vcc=7V
500
400
Vcc=4V
300
200
100
2.2
Vcc=10V
800
OUT SINK CURRENT : IOUT [mA]
OUT SOURCE CURRENT : IOUT [mA]
AMBIENT TEMPERATURE : Ta(˚C)
700
Vcc=7V
600
500
400
Vcc=4V
300
200
100
0
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
0
0.25
(VCC-OUT)VOLTAGE : VO(V)
0.5
0.75
1
1.25
1.5
1.75
2
OUT VOLTAGE : VO(V)
Fig.3 (Vcc-OUT) Voltage vs. Output source current
Fig.4 Output voltage vs. Output sink current
650
2.53
640
OSCILLATING FREQUENCY : FOSC [kHz]
VREF VOLTAGE:VREF [V]
2.52
2.51
2.5
2.49
2.48
2.47
–40
–20
0
20
40
60
80
630
620
610
RT=24kΩ
600
590
580
570
560
550
–40
–20
0
20
40
60
80
AMBIENT TEMPERATURE : Ta [˚C]
AMBIENT TEMPERATURE : Ta [˚C]
Fig.5 VREF vs. Ambient temperature
Fig.6 Oscillation frequency vs. Ambient temperature
5/16
(BD9851EFV)
100
90
1.015
80
1.01
ON DUTY : DON (%)
ERROR-AMP. THRESHOLD VOLTAGE : VEATH (V)
1.02
1.005
1
0.995
0.99
70
60
50
40
30
fosc=1MHz
fosc=300kHz
20
0.985
10
0
0.98
–40
–20
0
20
40
60
80
1.2
1.3
1.4
1.5
1.6
1.7
1.8
AMBIENT TEMPERATURE : Ta(˚C)
DTC VOLTAGE : VDTC (V)
Fig.7 Error Amp threshold voltage vs. Ambient temperature
Fig.8 FB voltage vs. ON Duty
1000
19
1000
Vcc=20V
900
800
OUT SINK CURRENT : IOUT (mA)
OUT SOURCE CURRENT : IOUT (mA)
900
Vcc=12V
700
600
500
400
Vcc=4V
300
200
100
0
0
0.5
1
1.5
2
2.5
3
3.5
800
600
Vcc=12V
500
400
Vcc=4V
300
200
100
0
4
Vcc=20V
700
0
(Vcc-OUT) VOLTAGE : VO(V)
315
OSCILLATING FREQUENCY : FOSC (kHz)
320
2.54
REFERENCE VOLTAGE : VREF (V)
2.53
2.52
2.51
2.5
2.49
2.48
2.47
2.46
0
20
40
1.5
2
2.5
3
3.5
4
Fig.10 Output voltage vs. Output sink current
2.55
–20
0
OUT VOLTAGE : VO (V)
Fig.9 (Vcc-OUT) Voltage vs. Output source current
2.45
–40
0.5
60
80
RRT=24kΩ
CCT=220pF
310
305
300
295
290
285
280
–40
–20
0
20
40
60
80
AMBIENT TEMPERATURE : Ta(˚C)
AMBIENT TEMPERATURE : Ta(˚C)
Fig.11 VREF vs. Ambient temperature
Fig.12 Oscillation frequency vs. Ambient temperature
6/16
Block diagram / Pin assignment
(BD9850FVM)
Vcc
Vcc
VREF
RT
1
8
4
Vcc
VREF
U.V.L.O
TRI
Vcc
5
INV
Error Amp
2
Clamper
1.0V
VREF
OUT
Vo
PWM COMP
6
FB
T.S.D
7
3
INV
FB
Pin No.
Pin name
1
Vcc
Power supply
2
OUT
FET driver drive output
3
GND
Ground
4
VREF
Reference voltage (2.5V±1%) output
5
INV
Error Amp inverting input
6
FB
Error Amp output
7
CTL /SS
8
RT
VREF
CTL/ SS
GND
Fig.13 BD9850FVM Block diagram
GND
OUT
Vcc
RT
CTL/SS
Function
Control/Soft start common
Oscillation frequency setting resistor connection
(BD9851EFV)
Vcc
Vcc
18
VREF
Pin No.
Pin name
1
SEL1
2
RT
Oscillation frequency setting resistor connection
3
CT
Oscillation frequency setting capacitor connection
4
NON2
Error Amp non-inverting input (CH2)
5
INV2
Error Amp inverting input (CH2)
6
FB2
Error Amp output (CH2)
Vcc
FB1
Vo1
15
Vcc
PVcc1
12
INV1
CH1 drive FET setting (Vcc short: P-ch drive, GND short: N-ch drive)
SEL1
1
16
Function
19 STB
Both channels
ON/OFF
VREF
(2.5V)
17
–
–
–
+
+
OUT1
11
1V
VREF
Vo1
DTC1
13
7
DTC2
Maximum duty/soft start setting (CH2)
8
PVCC2
FET driver block power supply input (CH2)
9
OUT2
FET driver block output (CH2)
10
PGND
FET driver block ground
11
OUT1
FET driver block output (CH1)
12
PVCC1
FET driver block power supply input (CH1)
13
DTC1
Maximum duty/soft start setting (CH1)
14
SCP
Short circuit protection timer setting capacitor connection
15
FB1
Error Amp output (CH1)
16
INV1
Error Amp inverting input (CH1)
17
VREF
Reference voltage (2.5V±1%) output
18
VCC
Power supply input
19
STB
ON/OFF control
20
GND
Ground
–
FIN on
reverse
+
+
–
FB2
6
PGND
10
2.3V
Vo2
Vcc
PVcc2
8
VREF
INV1
NON2
5
4
–
+
VREF
DTC2
RT
OUT2
–
–
+
9
Vo2
7
2
OSC
CT
3
SCP 14
GND
20
Tmer
Latch
GND
STB
Vcc
VREF
INV1
FB1
SCP
DTC1
PVcc1
OUT1
SEL1
RT
CT
NON2
INV2
FB2
DTC2
PVcc2
OUT2
PGND
Fig.14 BD9851EFV Block diagram
7/16
Make FIN on the reverse open or ground to GND (pin 20)
(However, open FIN on the reverse will degrade radiation performance.)
Description of operations
1) Reference voltage block
The reference voltage block generates a constant voltage with temperature compensated through inputting the power supplied from
the Vcc pin. The output voltage is 2.5 V, with a ±1% accuracy. To cancel noises, insert a capacitor with a low ESR (several tens of mΩ)
between the VREF and GND pins. It is recommended to use a ceramic capacitor of 1μF for this purpose.
2) Triangular wave oscillator block
By connecting the resistor and capacitor of frequency settings to the RT and CT pins (only to RT pin on the BD9850FVM), a triangular
wave will be generated and then input to the PWM comparators of Channels 1 and 2.
3) Error Amp block
The Error Amp block detects the output voltage of the INV pin, amplifies an error with the set output voltage, and then outputs the
error from the FB pin. The comparison voltage is 1 V, with a ±2% accuracy. (The Channel 2 of the BD9851EFV uses the NON pin input
voltage as a reference.)
Inserting a resistor and capacitor between the INV and FB pins will conduct phase compensation.
4) PWM comparator block
The PWM comparator block converts the output voltage (FB voltage) into a PWM waveform and outputs it to the FET driver.
(Only available on the BD9851EFV)
Inputting a voltage, divided by resistance of the VREF pin in the DTC pin, will allow maximum ON duty setting.
Inserting a capacitor between the CTL/SS and GND pins will allow the soft start function to control the rising output voltage.
Inserting a capacitor between the DTC and GND pins will allow the soft start function to control the rising output voltage.
Furthermore, the overshoot of output voltage at startup can be derated. Adding a Schottky diode between the FB and DTC
pins will make it possible to suppress the overshoot rate (only available with step-down application).
5) FET driver block
This block is a push-pull type driver enabling direct drive of external MOS FET.
For the Channel 1, SEL1 pin setting will determine the application function.
Set the SEL1 pin to step-down (P-ch drive) mode for short-circuiting Vcc or to step-up (N-ch drive) mode for short-circuiting GND.
Furthermore, be sure to short-circuit the SEL1 pin to Vcc or GND pin.
6) Standby function
(BD9850FVM)
The CTL/SS pin allows for output ON/OFF control. Set the CTL/SS pin voltage to “H” to activate the output ON control.
(BD9851EFV)
The STB pin allows for output ON/OFF control. Set the STB pin voltage to “H” to activate the output ON control.
The standby mode circuit current should be set to less than 5 μA.
7) Short circuit protection circuit (SCP) (Only available on BD9851EFV)
The SCP is a timer-latch type short circuit protection circuit.
If the output voltage of either channel drops below the set voltage, the Error Amp will be activated to increase the FB voltage and
initiate charging the capacitor connected to the SCP pin with a 2 μA current. When the SCP pin voltage exceeds 1.5 V, the latch circuit
will be activated to fix the output of both channels at OFF and, at the same time, the DTC pin at “L” level.
In order to rest the latch circuit, set the STB pin to “L” level once, and then to “H” level. Or, turn ON the power supply again.
Furthermore, if the short circuit protection circuit is not used, short-circuit the SCP pin to the GND pin.
8) Under Voltage Lock Out (UVLO) circuit
The UVLO is a protection circuit to prevent the IC from malfunctioning when the power supply turns ON or if an instantaneous power
interruption occurs.
When the Vcc voltage falls below 3.8 V (or 3.7 V on the BD9851EFV), the output of both channels will be fixed at “OFF” and, at the same
time, the DTC pin at “L” level. Hysteresis width of 0.1 V (or 0.11 V on the BD9851EFV) is provided for the detection voltage and release
voltage of the UVLO in order to prevent malfunctions of the IC which may result from variations in the input voltage due to threshold
online.
Furthermore, if the latch circuit is activated through the short circuit protection circuit, the circuit will be reset by this UVLO.
9) Thermal shutdown circuit (TSD)
The TSD is a protection circuit to prevent the destruction of the IC due to abnormal heat generation.
If the TSD detects an abnormal heat generation (175˚C) on the chip, the output of both channels will be fixed at “OFF” and, at the same
time, the DTC pin at “L” level. Hysteresis width (15˚C) is provided for the superheat detection and release temperatures in order to prevent
malfunctions of the IC which may result from variations in the input voltage due to threshold online.
Furthermore, if the latch circuit is activated through the short circuit protection circuit, the circuit will be reset by this TSD.
8/16
Timing chart
• In startup/normal operation
(BD9850FVM)
Soft start set voltage
FB pin voltage
Oscillator output
Control threshold
OUT pin waveform
Vcc waveform
Output voltage
waveform
Fig.15 BD9850FVM Timing chart
(BD9851EFV)
Vcc pin voltage
waveform
3.8V
Output short circuit
SCP pin voltage
waveform
FB
CT
DTC
2.3V
OUT pin voltage
waveform
Output voltage
waveform
Fig.16 BD9851EFV Timing chart
9/16
1.5V
Description of external components
• Setting of output voltage (BD9850FVM)
Setting of output voltage for the step-down application can be calculated by the formula below :
Setting procedure
Application
Vo = Vthea × (R1 + R2) / R2 [V]
(Vthea: Error Amp threshold voltage Typ. 1.0 [V])
Vo
R1
INV (5)
R2
Setting of output voltage (BD9851EFV)
Setting procedure
Application
• Step-down (CH1), Step-up (CH1)
Vo1 = Vthea × (R1 + R2) / R2 [V]
(Vthea: Error Amp threshold voltage Typ. 1.0 [V])
Vo1
R1
INV1 (16)
R2
• Step-down (CH2)
Vo2 = VNON2 × (R1 + R2) / R2 [V]
VNON2 = 2.5 × R4 / (R3 + R4) [V]
However, set the NON2 pin voltage to 0.3 to 2.0 V.
VREF (17)
R3
Vo2
NON2 (4)
R1
R4
INV2 (5)
R2
• Inverting (CH2)
Vo2 = 2.5 – {(2.5 - VINV2) X (R1 + R2) / R1} [V]
VINV2 = 2.5 × R4 / (R3 + R4) [V]
However, set the INV2 pin voltage to 0.3 to 2.0 V
VREF (17)
R3
INV2 (5)
R1
R4
NON2 (4)
R2
Vo2
Setting of oscillation frequency (BD9850FVM)
Connecting a resistor to the RT pin (pin 2) allows for the setting of oscillation frequency.
10000
Oscillating frequency [kHz]
RT (2)
RRT
1000
Fig.17 Setting procedure for BD9850FVM
oscillation frequency
100
1
10
100
1000
Timing resistance(RT) [kΩ]
Fig.18 RT vs. Oscillation frequency
10/16
• Setting of oscillation frequency (BD9851EFV)
Connecting a resistor to the RT pin (pin 2) and a capacitor to the CT pin allows
for the setting of oscillation frequency.
RT (2)
RRT
CT (3)
CCT
Fig. 19 Setting procedure for BD9851EFV oscillation frequency
1000
1000
Oscillating Frequency (kHz)
Oscillating Frequency (kHz)
CCT=33pF
CCT=220pF
1000
CCT=1200pF
100
10
1
10
1000
RRT=4.7kΩ
100
RRT=24kΩ
10
10
100
10
Timing Resistance (kΩ)
Fig. 20 RT vs. Oscillation frequency
Fig. 20 CT vs. Oscillation frequency
• Setting of timer of short circuit protection circuit (BD9851EFV)
Setting procedure
Application
TSCP = 7.45 × 105 × CSCP
TSCP : Time from output short circuit to latch stop [sec]
OSCP : Capacitance of capacitor between the SCP and
GND pins [F]
SCP (14)
CSCP
• Setting of maximum duty (BD9851EFV)
Setting procedure
Application
DUTY(max.) = 100 × (VDTC – Vth0) / (Vth100 – Vth0)
VDTC = 2.5 × R2 / (R1 + R2)
DUTY(max.)
VDTC
Vth0
Vth100
:
:
:
:
VREF (17)
R1
Maximum duty [%]
DTC pin voltage [V]
0% duty threshold voltage [V]
100% duty threshold voltage [V]
DTC (13)(7)
R2
• Pin treatment of unused channels (BD9851EFV)
(18)
Vcc
SEL1
(1)
(17)
VREF
NON2
(4)
INV
(16)
(5)
(18)
Vcc
FB
(15)
(6)
DTC
(13)
(7)
100
Timing Capacitance(pF)
PVcc
(12)
(8)
OUT
(11)
(9)
Upper : Pin No. to be treated when the CH1 is not used
Lower : Pin No. to be treated when the CH2 is not used
Fig. 22 Pin treatment procedure for unused channel on BD9851EFV
In order to use one channel, treat the pins of unused channel as shown above.
11/16
5
1000
Application circuit / Directions for pattern layout
(BD9850FVM)
RT
Vo
Vcc
R1
Vcc
OUT
* R1
Vcc
C1
*
C2
1µF
*
C1
GND
RT
Vcc
GND
FB
VREF
INV
VREF
ON/OFF
Fig.23 BD9850FVM Reference application
Vo2
CT/SS
GND
FB
VREF
INV
C1: In order to reduce ripple noises, set the shortest
distance between the VCC pin and the capacitor pin,
and the GND pin and the capacitor pin. Furthermore,
the OUT line may pass under the C1.
C2: In order to reduce ripple noises, set the shortest
pattern between the VREF pin and the capacitor pin,
and the GND pin and the capacitor pin.
OFF
[ HL::ON
]
Step-down
OUT
C1
CTL/SS
OUT
RT
R1: In order to stabilize the switching frequency, set the
smallest pattern area so that PCB parasitic
capacitance for the RT pin will be minimized.
1 SEL1
GND 20
1 SEL1
GND 20
2 RT
STB 19
STB
2 RT
STB 19
STB
3 CT
VCC 18
Vcc
3 CT
Vcc 18
Vcc
4 NON2
VREF 17
GND
4 NON2
VREF 17
5 INV2
INV1 16
5 INV2
INV1 16
6 FB2
FB1 15
6 FB2
FB1 15
7 DTC2
SCP 14
7 DTC2
SCP 14
8 PVCC2
DTC1 13
8 PVcc2
DTC1 13
9 OUT2
PVcc1 12
9 OUT2
PVcc1 12
10 PGND
OUT1 11
10 PGND
OUT1 11
Vo2
Vo1
Inverting
GND
VO1
Step-down
Step-up
Fig.24 Step-down/Step-up application
Fig.25 Step-up/Inverting application
Equivalent circuit
(BD9850FVM)
4PIN(VREF)
2PIN(OUT)
5PIN(INV)
Vcc
Vcc
Vcc
1.67k
50k
250k
VREF
OUT
INV
200k
193k
GND
6PIN(FB)
GND
8PIN( R T )
7PIN(CTL/SS)
Vcc
GND
Vcc
VREF
20k
5k
FB
100k
500k
CTL/SS
20p
RT
1k
200k
GND
GND
GND
Fig.26 Equivalent circuit (BD9850FVM)
12/16
BD9851EFV
2PIN (RT)
1PIN (SEL1)
Vcc
7,13PIN (DTC2,DTC1)
Vcc
Vcc
VREF
VREF
Vcc
SEL1
DTC
RT
9PIN (OUT2)
3PIN (CT)
Vcc
Vcc
4PIN (NON2)
PVcc2
VREF VCC
OUT2
Vcc
VREF
VREF
VREF
VREF
VREF
VREF
CT
Vcc
Vcc
NON2
PGND
11PIN (OUT1 )
14PIN (SCP)
Vcc
Vcc
5,16PIN (INV2,INV1)
VREF
PVcc1
Vcc
VREF
SCP
OUT1
6,15PIN (FB2,FB1)
VREF
Vcc
VREF
Vcc
19PIN (STB)
Vcc
Vcc
Vcc
INV
17PIN (VREF)
VREF
VREF
Vcc
Vcc
Vcc
STB
FB
VREF
Fig.27 Equivalent circuit (BD9851EFV)
Cautions on use
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices,
thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the
absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) GND potential
Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential
voltage including an electric transients.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive
and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuitís power
lines.
5) Operation in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Thermal shutdown circuit (TSD circuit)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off
to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating
this circuit or use the IC in an environment where the operation of this circuit is assumed.
7) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the
inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC.
13/16
8) IC pin input
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. Pin junctions are formed at the
intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each
potential is as follows:
When GND > Pin A and GND > Pin B, the Pin junction operates as a parasitic diode.
When Pin B > GND > Pin A, the PñN junction operates as a parasitic transistor.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits,
operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the
GND (P substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
B
(Pin B)
(Pin A)
C
E
GND
N
P+
P+
P
P+
N
P+
P
N
N
N
N
N
Player
Player
Parasitic element
GND
GND
Parasitic element
(Pin B)
(Pin A)
C
B
Parasitic element
E
GND
GND
Other proximity element
Parasitic element
Fig. 28 Typical simple construction of monolithic IC
9) Common impedance
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage
line may damage the device.
on the power ground
10) On the application shown below, Vcc is short-circuited to the Ground with external diode charged, internal circuits may be damaged.
recommended to insert a backflow prevention diode in series with the Vcc or a bypass diode between each pin and Vcc.
Bypass diode
Backflow prevention diode
Vcc
Output pin
Fig. 29
14/16
11) Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit
characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static
and transient characteristics for external components as well as this Rohm IC. Allow for sufficient margins when determining circuit constants.
Oscillation frequency setting resistor
12) For the oscillation frequency setting resistor to be inserted between the RT pin and the GND pin, mount this resistor close to the RT pin and
provide the shortest pattern routing.
Thermal derating characteristics
MSOP 8
PD(W)
0.8
HTSSOP-B20
4
POWER DISSIPATION : Pd [W]
(2) 0.59 W
0.6
POWER DISSIPATION : Pd [W]
PD(W)
5
(1) 0.30 W
0.4
Wiring width 0.4mm
Pd = 0.50 W
qjc = 200˚C/W
0.2
0
(4) 3.20W
3
(3) 2.30W
2
(2) 1.45W
(1) 1.00W
1
0
0
25
50
75
100
125
150
0
AMBIENT TEMPERATURE : Ta [˚C]
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta [˚C]
(1) : Single piece of IC
(2) : With ROHM standard PCB mounted
(Glass epoxy PCB of 70mmX70mm X1.6mm)
(1) : Single piece of IC
PCB size: 70mmX70mmX1.6 mm2 (PCB incorporates thermal via)
Copper foil area on the reverse side of PCB: 10.5X10.5mm2
(2) : 2-layer PCB (Copper foil area on the reverse side of PCB: 15mmX15mm
(3) : 2-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm
(4) : 4-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm
Fig.30
Fig.31
Selection of order type
B
D
9
ROHM
model name
8
5
Product No.
9850=10V
9851=20V
0
F
V
M
T
Package type
FVM=MSOP8
EFV=HTSSOP-B20
R
Taping type
TR=Reel-type embossed carrier tape (MSOP8)
E2=Reel-type embossed carrier tape (HTSSOP-B20)
MSOP8
Package style
Quantity
Embossed carrier tape
3000 pieces /reel
Packaging
direction
TR
(When holding a reel in left hand and pulling out the tape with
right hand, No. 1 pin appears in the upper right of the reel.)
5
1
4
0.29 ± 0.15
0.6 ± 0.2
8
2.8 ± 0.1
4.0 ± 0.2
2.9 ± 0.1
0.145
0.9max.
0.75 ± 0.05
0.08 ± 0.05
0.475
+0.05
–0.04
0.22
0.65
+0.05
–0.03
0.08
M
0.08 S
No. 1 pin
Pulling-out side
Reel
(unit : mm)
HTSSOP-B20
Package style
Quantity
Embossed carrier tape (Moisture-proof specificatin)
2500 pieces /reel
Packaging
direction
E2
(When holding a reel in left hand and pulling out the tape with
right hand, No. 1 pin appears in the upper left of the reel.)
6.5 ± 0.1
11
6.4 ± 0.2
4.4 ± 0.1
0.5 ± 0.15
1.0 ± 0.2
20
1
10
0.17
+0.05
+0.03
S
0.08 S
0.65
0.2
+0.05
+0.04
12.34
15/16
12.34
Reel
12.34
No. 1 pin
(unit : mm)
12.34
12.34
12.34
12.34
12.34
1.0max.
0.85 ± 0.05
0.08 ± 0.05
0.325
Pulling-out side
Catalog No.08T679A '08.9 ROHM ©
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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