BD9873CP-V5E2

Datasheet 8.0V to 35V, 3.0A/1.5A 1ch Buck Converter with Integrated FET BD9873CP-V5 BD9874CP-V5 Key Specifications General Description    The BD9873CP-V5 and BD9874CP-V5 is a single-channel step-down switching regulator integrated with a P-Channel MOSFET. Its circuitry eliminates the need for external compensation and consisting only of a diode, a coil and a ceramic capacitor, reducing the board size significantly.   Features      Built-in P-Channel FET Ensures High Efficiency Output Voltage Adjustable Via External Resistors Soft-Start Time : 4ms (fixed) Built-in Over-Current and Thermal Shutdown Protection Circuits ON/OFF Control Via STBY Pin   Input Voltage Range: 8.0V to 35V Output Voltage Range:1.0V to 0.8Vx(VCC-IOUTxRON)V Output Current: BD9873CP-V5: 1.5A(Max) BD9874CP-V5: 3.0A(Max) Switching Frequency: 110kHz(Typ) P-Channel FET ON-Resistance: BD9873CP-V5: 1.0Ω(Typ) BD9874CP-V5: 0.5Ω(Typ) Standby Current: 1μA(Typ) Operating Temperature Range: -40°C to +85°C Package W(Typ) x D(Typ) x H(Max) Applications TVs, Printers, DVD Players, Projectors, Gaming Devices, PCs, Car Audio/Navigation Systems, ETCs, Communication Equipment, AV Products, Office Equipment, Industrial Devices, and more. Typical Application Circuit TO220CP-V5 10.00mm x 20.12mm x 4.60mm L1 VIN VCC ＋ C2 VOUT OUT CIN D1 ＋ C1 C3 R1 STBY INV R2 GND Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Pin Configuration TOP VIEW 1 2 3 4 5 VCC GND STBY OUT INV Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name 1 VCC Input power supply pin Function 2 OUT Internal P-Channel FET drain pin 3 GND Ground 4 INV Output voltage feedback pin 5 STBY ON/OFF control pin Block Diagram VCC 1 VREF PWM COMP DRIVER OSC 5 STBY CTL LOGIC STBY 2 OCP TSD OUT Error AMP 4 INV SS 3 GND Figure 3. Block Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Rating VCC 36 Unit V STBY-GND VSTBY 36 V OUT-GND VOUT 36 V INV-GND VINV 5 V Supply Voltage (VCC-GND) Maximum Switching Current IOUT Power Dissipation Pd 1.5 (Note 1) BD9873 3.0 (Note 1) BD9874 A A 2.00 (Note 2) W Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C (Note 1) Do not exceed Pd, ASO. (Note 2) Derated at 0.16W/°C over Ta=25°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +85°C) Parameter Limit Symbol Unit Min Typ Max 35.0 0.8 x (VCC-IOUT x RON) Input Voltage VCC 8.0 - Output Voltage VOUT 1.0 - V V Electrical Characteristics (Unless otherwise noted, Ta=25°C, VCC=12V, VOUT=5V, VSTBY=3V) Limit Parameter Symbol Output ON-Resistance Switching Frequency Max 1.0 0.5 88 1.5 1.0 - Ω Ω BD9873 BD9874 η 80 ％ IOUT＝0.5A fOSC 99 110 121 kHz - 5 40 mV - 5 40 mV - 5 25 mV 1.6 - - A VCC=20V, IOUT =0.5A to 1.5A BD9873 VCC=20V, IOUT =1.0A to 3.0A BD9874 VCC=10V to 30V, IOUT=1.0A BD9873 3.2 - - A BD9874 0.985 1.00 1.015 V ΔVOUTLOAD Load Regulation ΔVOUTLOAD Line Regulation Conditions Typ RON Efficiency Unit Min Over-Current Protection Limit IOCP INV Pin Threshold Voltage VINV IINV - 1 2 μA ON VSTBYON 2.0 - VCC V OFF VSTBYOFF -0.3 - +0.3 V ISTBY 5 15 30 μA VSTBY=3V ICC - 5 12 mA VINV=2V Stand-by Current IST - 0 5 μA Soft-Start Time tSS - 4 20 ms VSTBY=0V VSTBY=0V to 3V INV Pin Input Current STBY Pin Threshold Voltage STBY Pin Input Current Circuit Current www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/19 VINV=1.0V TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves BD9873CP-V5 VCC=12V Output Voltage : VOUT [V] Efficiency : η [%] VCC=12V VCC=8V VCC=36V Load Current : IOUT [A] Load Current : IOUT [A] Figure 5 Output Voltage vs Load Current. (Over Current Protection) Figure 4. Efficiency vs Load Current Output Voltage : VOUT [V] Switching Frequency [kHz] VCC=12V Load Current : IOUT [A] Temperature : Ta [°C] Figure 7.Output Voltage vs Load Current Figure 6. Switching Frequency vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves – continued BD9873CP-V5 VSTB=3V Circuit Current : ICC [mA] Output Voltage : VOUT [V] VOUT=5V Supply Voltage : VCC [V] Supply Voltage : VCC [V] Figure 9. Circuit Current vs Supply Voltage (IOUT=No Load) Figure 8. Output Voltage vs Supply Voltage VCC=12V ∆ VOUT [v] Switching Frequency : fOSC [kHz] VOUT=5V Output Current : IOUT [A] Supply Voltage : VCC [V] Figure 10. Delta Output Voltage vs Output Current ΔVOUT - IOUT www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 11. Switching Frequency vs Supply Voltage 5/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves – continued BD9873CP-V5 OFFSET [V] Circuit Current : ICC (STB) [µA] VCC=12V Temperature: Ta [°C] Temperature : Ta [°C] Figure 13. Circuit Current vs Temperature ICC (STB) - Ta Figure 12. INV Pin Threshold Voltage vs Temperature Typical Waveforms BD9873CP-V5 5V / div VOUT VOUT 2V / div Figure 14. Load Response www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 15. Start-up Waveform 6/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves BD9874CP-V5 VCC=12V VCC=8V Output Voltage : VOUT [V] Efficiency [%] VCC=12V VCC=36V Load Current : IOUT [A] Load Current : IOUT [A] Figure 16. Efficiency vs Load Current Figure 17. Output Voltage vs Load Current (Over Current Protection) Output Voltage: VOUT [V] Switching Frequency [kHz] VCC=12V Load Current : IOUT [A] Temperature : Ta [°C] Figure 19. Output Voltage vs Load Current Figure 18. Switching Frequency vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves – continued BD9874CP-V5 VSTB=3V Circuit Current : ICC [mA] Output Voltage : VOUT [V] VOUT=5V Supply Voltage : VCC [V] Supply Voltage : VCC [V] Figure 20. Output Voltage vs Supply Voltage Figure 21. Circuit Current vs Supply Voltage (IOUT=No Load) VOUT=5V ∆ VOUT [V] Switching Frequency : fOSC [kHz] VCC=12V Output Current : IOUT [A] Supply Voltage : VCC [V] Figure 23. Switching Frequency vs Supply Voltage Figure 22. Delta Output Voltage vs Output Current ΔVOUT - IOUT www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Typical Performance Curves – continued BD9874CP-V5 OFFSET [V] Circuit Current: ICC (STB) [µA] VCC=12V Temperature: Ta [°C] Temperature : Ta [°C] Figure 25. Circuit Current vs Temperature (ICC (STB) – Ta ) Figure 24. INV Pin Threshold Voltage vs Temperature Typical Waveforms BD9874CP-V5 VOUT VOUT Figure 26. Load Response Figure 27. Start-up Waveform www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Application Information 1. Block Function Explanation (1) VREF Generates a temperature-independent regulated voltage from the VCC input. (2) OSC Generates a triangular wave with an oscillation frequency of 110 kHz or as set by the internal resistors and capacitors. The output of this block goes to the PWM comparator. (3) Error AMP Detects the output voltage through a voltage divider network and compares it with an internal reference voltage. The output of this block is the amplified difference between the detected output voltage and the reference. (4) PWM COMP Converts the Error AMP output to PWM pulses going to the Driver block. (5) DRIVER This push-pull FET driver accepts PWM input pulses from PWM COMP block and drives the internal P-channel MOSFET. (6) STBY Controls ON/OFF operation using STBY pin. The output is ON when STBY is High. (7) Thermal Shutdown (TSD) This circuit protects the IC against thermal runaway and damage due to excessive heat. A thermal sensor detects the junction temperature and switches the output OFF once the temperature exceeds a threshold value (175deg). Hysteresis is built in (15deg) in order to prevent malfunctions due to temperature fluctuations. (8) Over-Current Protection (OCP) The OCP circuit detects the voltage difference between VCC and OUT by measuring the current through the internal P-Channel MOSFET and switches the output OFF once the voltage reaches the threshold value. The OCP block is a self-recovery type (not latch). (9) Soft-Start (SS) This block conducts soft start operations. When STBY is High and the IC starts up the internal capacitor begins charging. The soft start time is set to 5ms. 2. Notes for PCB Layout C3：0.47µF R2:1kΩ R1:4kΩ 4 STBY 5 INV L1：100µH C1：100µF 1 VCC C2：4.7µF OUT 2 GND 3 5.0V D1 C4：680µF Figure 28. Layout (1) Place capacitors between VCC and Ground, and the Schottky diode as close as possible to the IC to reduce noise and maximize efficiency. (2) Connect resistors between INV and Ground, and the output capacitor filter at the same ground potential in order to stabilize the output voltage. (If the patterning is longer or thin, it’s possible to cause ringing or waveform crack.) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 3. Application Component Selection and Settings (1) Inductor L1 Large inductor series impedance will result in deterioration of efficiency. OCP operation greater than 1.6A(BD9873) or 3.2A(BD9874) may cause inductor overheating, possibly leading to overload or output short. Note that the current rating for the coil should be higher than I OUT ( MAX )  I L . where: IOUT (MAX) is the maximum load current. If you allow current flow more than maximum current rating, the coil will overload, causing magnetic saturation, and those account for efficiency deterioration. Select a coil with enough current rating which doesn’t exceed peak current. I L  VCC  VOUT   VOUT L1 VCC  1 f OSC where: L1 is the inductor value. VCC is the maximum input voltage. VOUT is the output voltage. ∆IL is the coil ripple current value. fosc is the oscillation frequency. (2) Schottky Barrier Diode D1 Select a Schottky diode having an inter-terminal capacity as small as possible (reverse recovery time as short as possible) and a forward voltage VF as low as possible. (Noise can be reduced and efficiency improved by reduction of switching noise and switching loss, as well as reduction of voltage drop loss of forward voltage.) Diode should be selected on the basis of maximum current rating in forward direction, voltage rating in reverse direction, and power dissipation of diode. (a) The maximum current rating is higher than the combined maximum load current and coil ripple current (∆IL). (b) The reverse voltage rating is higher than the IN value. (c) Recommend using a diode with smaller the reverse current as possible In the high temperature case, the reverse current is increasing and it may cause overdrive (d) Power dissipation for the selected diode must be within the rated level. The power dissipation of the diode is expressed by the following formula: Pdi  I OUT ( MAX ) VF  (1  VOUT / VCC ) where: IOUT (MAX) is the maximum load current. VF is the forward voltage. VOUT is the output voltage. VCC is the input voltage. (3) Output Capacitor C4 A suitable output capacitor should satisfy the following formula for ESR: ESR  VL / I L where: ∆VL is the permissible ripple voltage. ∆IL is the coil ripple current. Another factor that must be considered is the permissible ripple current. Select a capacitor with sufficient margin, governed by the following formula: I RMS  I L / 2 3 where: IRMS is the effective value of ripple current to the output capacitor ∆IL is the coil ripple current The output capacitor is a major factor for system stability. When an inappropriate capacitor is selected, expected characteristics may not be guaranteed depending on ambient temperature, output voltage setting condition, etc. Fully confirm ESR, temperature characteristics, DC, and bias characteristics before evaluation. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 (4) Intput Capacitor C1,C2 The input capacitor is the source of current flow to the coil via the built-in P-Channel FET when the FET is ON. When selecting the input capacitor, sufficient margin must be provided to accommodate capacitor voltage and permissible ripple current. The expression below defines the effective value of the ripple current to the input capacitor. It should be used in determining the suitability of the capacitor in providing sufficient margin for the permissible ripple current. I RMS  I OUT  1  VOUT / VCC VOUT / VCC where: IRMS is the effective value of the ripple current to the input capacitor. IOUT is the output load current. VOUT is the output voltage. VCC is the input voltage. (5) Capacitor,C3 This capacitor is utilized to stabilize the frequency characteristics. When C3 is removed, overshoot or undershoot may occur during start-up or in rapid change of load. Be sure to insert 0.47 μF. (6) Resistor R1, R2 These resistors determine the output voltage: VOUT  1.0V  (1  R1 / R2 ) Select resistors less than 10kΩ. BD9873CP-V5 Inductor L1=100μH : RCR1616 (SUMIDA) Schottky Diode D1= RB050LA-40 (ROHM) Capacitor C1=100μF : Al electrolytic capacitor C2=4.7μF : Laminated ceramic capacitor C3=0.47μF : Laminated ceramic capacitor C4=680μF : Al electrolytic capacitor BD9874CP-V5 Inductor Schottky Diode Capacitor L1=100μH : RCR1616 (SUMIDA) D1=RB050LA-40(ROHM) C1 =100μF : Al electrolytic capacitor C2 = 4.7μF :Laminated ceramic capacitor C3 = 0.47μF :Laminated ceramic capacitor C4 = 680μF : Al electrolytic capacitor www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 4. Tj (Tip Junction Temperature) Calculating Method It is impossible to measure the tip junction temperature Tj outside the IC, but it can be calculated by the formula shown below. Calculation method of tip junction temperature Tj Tj  W j  c  Tc where: W is the Power consumed by IC (calculated by the formula below) θj - c is the Thermal resistance from the tip to the back of the package 12.5 °C/W for TO220 package Tc is the IC surface temperature (to be measured by thermocouple, etc.) Calculation method of electric power W consumed by IC W  VIN  I IN  VOUT  I OUT Where: VIN is the Input voltage IIN is the Input voltage VOUT is the Output voltage IOUT is the Load Current VF is the forward voltage of Schottky diode www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001  VF  I OUT  1 VOUT / VIN 13/19  TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Power Dissipation Power Dissipation : Pd [W] POWER DISSIPATION : Pd [W] 15 (1) No heat sink (2) Aluminum heat sink 50 x 50 x 2 (mm3) (3) Aluminum heat sink 100 x 100 x 2 (mm3) (3) 11.0W 10 (2) 6.5W 5 (1) 2.0W 0 0 25 50 75 100 125 AmbientTEMPERATURE Temperature : Ta :[°C] AMBIENT Ta[C] 150 Figure 29. Power Dissipation I/O Equivalent Circuit 1Pin,FIN (VCC, GND) 2pin (OUT) 4pin (INV) 5pin (STBY) V CC VCC VCC VCC VCC VCC STBY VCC VCC INV OUT GND Figure 30. Input Output Equivalent Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 31. Example of monolithic IC structure 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Ordering Information B D 9 8 7 x Part Number 9873 9874 C P - V 5 - Package CP-V5: TO220CP-V5 E2 Packaging and forming specification E2: Embossed tape and reel Lineup Maximum Output Current (Max) 1.5 A Part Number Marking 3.0 A Package Orderable Part Number BD9873CP TO220CP-V5 Reel of 500 BD9873CP-V5E2 BD9874CP TO220CP-V5 Reel of 500 BD9874CP-V5E2 Marking Diagram TO220CP-V5 (TOP VIEW) Part Number Marking LOT Number www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Physical Dimension, Tape and Reel information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 TO220CP-V5 18/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 BD9873CP-V5 BD9874CP-V5 Revision History Date Revision 05.Nov.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/19 TSZ02201-0Q3Q0AJ00440-1-2 05.Nov.2014 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001