Datasheet
2.7V to 5.5V Input, 3A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9A301MUV-LB
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market. BD9A301MUV-LB is a synchronous
buck switching regulator with built-in low on-resistance
power MOSFETs. It is capable of providing current up to
3A.The SLLMTM control provides excellent efficiency
characteristics in light-load conditions which make the
product ideal for equipment and devices that demand
minimal standby power consumption. The oscillating
frequency is high at 1MHz using a small value of
inductance. It is a current mode control DC/DC converter
and features high-speed transient response. Phase
compensation can also be set easily.
Input Voltage Range:
2.7V to 5.5V
Output Voltage Range:
0.8V to VPVIN×0.7V
Average Output Current:
3A(Max)
Switching Frequency:
1MHz(Typ)
High-Side MOSFET On-Resistance: 60mΩ (Typ)
Low-Side MOSFET On-Resistance: 60mΩ (Typ)
Standby Current:
0μA (Typ)
Package
VQFN016V3030
W(Typ) x D(Typ) x H(Max)
3.00mm x 3.00mm x 1.00mm
Features
Long Time Support Product for Industrial Application
Synchronous Single DC/DC Converter.
SLLMTM (Simple Light Load Mode) Control.
Over Current Protection.
Short Circuit Protection.
Thermal Shutdown Protection.
Under Voltage Lockout Protection.
Adjustable Soft start Function.
Power Good Output.
VQFN016V3030 Package (Backside Heat
Dissipation)
VQFN016V3030
Applications
Industrial Equipment,
Step-Down Power Supply for DSPs,
FPGAs, Microprocessors, etc.
Storage Devices (HDDs/SSDs).
Printers, OA Equipment.
Distributed Power Supply, Secondary Power
Supply.
Typical Application Circuit
Figure 1. Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Datasheet
BD9A301MUV-LB
Pin Configuration
PVIN
1
PVIN
2
AVIN
EN
PGD
BOOT
(TOP VIEW)
16
15
14
13
12
SW
11
SW
E-Pad
FIN
PGND
4
9
SS
5
6
7
8
MODE
SW
ITH
10
FB
3
AGND
PGND
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1, 2
PVIN
3, 4
PGND
5
AGND
6
FB
7
ITH
8
MODE
9
SS
10, 11, 12
SW
13
BOOT
14
PGD
15
EN
16
AVIN
-
E-Pad
Function
Power supply terminals for the switching regulator.
These terminals supply power to the output stage of the switching regulator.
Connecting a 10µF ceramic capacitor is recommended.
Ground terminals for the output stage of the switching regulator.
Ground terminal for the control circuit.
An inverting input node for the gm error amplifier.
See page 23 for how to calculate the resistance of the output voltage setting.
An input terminal for the gm error amplifier output and the output switch current comparator.
Connect a frequency phase compensation component to this terminal.
See page 24 for how to calculate the resistance and capacitance for phase compensation.
Turning this terminal signal Low (0.2V or lower) forces the device to operate in the fixed
frequency PWM mode. Turning this terminal signal High (0.8V or higher) enables the SLLM
control and the mode is automatically switched between the SLLM control and fixed frequency
PWM mode.
Terminal for setting the soft start time. The rise time of the output voltage can be specified by
connecting a capacitor to this terminal. See page 23 for how to calculate the capacitance.
Switch nodes. These terminals are connected to the source of the high-side MOSFET and drain
of the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between these terminals and
BOOT terminals. In addition, connect an inductor of 1.5µH considering the direct current
superimposition characteristic.
Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminals.
The voltage of this capacitor is the gate drive voltage of the high-side MOSFET.
A “Power Good” terminal, an open drain output. Use of pull up resistor is needed. See page 18
for how to specify the resistance. When the FB terminal voltage reaches within ±7% of 0.8V
(Typ), the internal Nch MOSFET turns off and the output turns High.
Turning this terminal signal low (0.8V or lower) forces the device to enter the shutdown mode.
Turning this terminal signal high (2.0V or higher) enables the device. This terminal must be
terminated.
Supplies power to the control circuit of the switching regulator.
Connecting a 0.1µF ceramic capacitor is recommended.
A backside heat dissipation pad. Connecting to the internal PCB ground plane by using multiple
vias provides excellent heat dissipation characteristics.
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BD9A301MUV-LB
Block Diagram
Current
Comparator
gm Amplifier
Figure 3. Block Diagram
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BD9A301MUV-LB
Description of Blocks
1. VREF
The VREF block generates the internal reference voltage.
2. UVLO
The UVLO block is for under voltage lockout protection. It will shut down the IC when the VIN falls to 2.45V (Typ) or lower.
The threshold voltage has a hysteresis of 100mV (Typ).
3. SCP
After the soft start is completed and when the feedback voltage of the output voltage has fallen below 0.4V (Typ) for
1msec (Typ), the SCP stops the operation for 16msec (Typ) and subsequently initiates restart.
4. OVP
Over voltage protection function (OVP) compares FB terminal voltage with the internal standard voltage VREF. When the
FB terminal voltage exceeds 0.88V (Typ) it turns MOSFET of output part MOSFET off. After output voltage drop it returns
with hysteresis.
5. TSD
The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal
temperature of IC rises to 175C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The circuit
has a hysteresis of 25°C (Typ).
6. SOFT START
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current. A built-in soft start function is provided and a soft start is
initiated in 1msec (Typ) when the SS terminal is open.
7. gm Amplifier
The gm Amplifier block compares the reference voltage with the feedback voltage of the output voltage. The error and
the ITH terminal voltage determine the switching duty. A soft start is applied at startup. The ITH terminal voltage is limited
by the internal slope voltage.
8. Current Comparator
The Current Comparator block compares the output ITH terminal voltage of the error amplifier and the slope block signal
to determine the switching duty. In the event of over current, the current that flows through the high-side MOSFET is
limited at each cycle of the switching frequency.
9. OSC
This block generates the oscillating frequency.
10. DRIVER LOGIC
This block is a DC/DC driver. A signal from current comparator is applied to drive the MOSFETs.
11. PGOOD
When the FB terminal voltage reaches 0.8V (Typ) within ±7%, the Nch MOSFET of the built-in open drain output turns off
and the output turns high.
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Datasheet
BD9A301MUV-LB
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Supply Voltage
EN Voltage
Symbol
Rating
Unit
VPVIN, VAVIN
-0.3 to +7
V
VEN
-0.3 to +7
V
MODE Voltage
VMODE
-0.3 to +7
V
PGD Voltage
VPGD
-0.3 to +7
V
Voltage from GND to BOOT
VBOOT
-0.3 to +14
V
Voltage from SW to BOOT
⊿VBOOT
-0.3 to +7
V
FB Voltage
VFB
-0.3 to +7
V
ITH Voltage
VITH
-0.3 to +7
V
VSW
-0.3 to VPVIN + 0.3
V
SW Voltage
Allowable Power Dissipation
(Note 1)
Maximum Junction Temperature
Storage Temperature Range
Pd
2.66
W
Tjmax
150
°C
Tstg
-55 to 150
°C
(Note 1) When mounted on a 70mm x 70mm x 1.6mm 4-layer glass epoxy board (copper foil area: 70 mm x 70 mm)
Derate by 21.3mW when operating above 25C.
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Caution2: Long-term reliability may be influenced when operated at or near the absolute maximum rating.
Recommended Operating Conditions
Parameter
Supply Voltage
Output Current(Note 2)
Output Voltage Range
Operating Junction Temperature Range
Symbol
Min
Typ
Max
Unit
VPVIN, VAVIN
IOUT
2.7
-
5.5
V
-
-
3
A
VRANGE
0.8
-
VPVIN × 0.7
V
Tj
-40
-
+125
°C
(Note 2) Pd,ASO should not be exceeded.
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Datasheet
BD9A301MUV-LB
Electrical Characteristics (Unless otherwise specified Ta = 25°C, VAVIN = VPVIN, = 5V, VEN = 5V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Standby Supply Current
ISTB
-
0
10
µA
Operating Supply Current
ICC
-
350
500
µA
UVLO Detection Voltage
VUVLO1
2.35
2.45
2.55
V
EN= GND
IOUT= 0mA
Non-switching
VIN falling
UVLO Release Voltage
VUVLO2
2.425
2.55
2.7
V
VIN rising
EN Threshold Voltage High
VENH
2.0
-
-
V
EN Threshold Voltage Low
VENL
-
-
0.8
V
IEN
-
5
10
µA
VMODEH
0.2
0.4
0.8
V
IMODE
-
10
20
µA
FB Terminal Voltage
VFB
0.792
0.8
0.808
V
FB Input Current
IFB
-
0
1
µA
AVIN PIN
ENABLE
EN Input Current
EN= 5V
MODE
MODE Threshold Voltage
MODE Input Current
MODE= 5V
Reference Voltage, Error Amplifier
FB= 0.8V
ITH Sink Current
ITHSI
10
20
40
µA
FB= 0.9V
ITH Source Current
ITHSO
10
20
40
µA
FB= 0.7V
Soft Start Time
TSS
0.5
1.0
2.0
ms
With internal constant
Soft Start Current
ISS
0.9
1.8
3.6
µA
FOSC
800
1000
1200
kHz
Falling (Fault) Voltage
VPGDFF
87
90
93
%
OUTPUT voltage falling
Rising (Good) Voltage
VPGDRG
90
93
96
%
OUTPUT voltage rising
Rising (Fault) Voltage
VPGDRF
107
110
113
%
OUTPUT voltage rising
Falling (Good) Voltage
VPGDFG
104
107
110
%
OUTPUT voltage falling
PGD Output Leakage Current
ILKPGD
-
0
5
µA
PGD= 5V
Power Good ON Resistance
RPGD
-
100
200
Ω
Power Good Low Level Voltage
PGDVL
-
0.1
0.2
V
SWITCHING FREQUENCY
Switching Frequency
POWER GOOD
IPGD= 1mA
SWITCH MOSFET
High Side FET ON Resistance
RONH
-
60
120
mΩ
Low Side FET ON Resistance
RONL
-
60
120
mΩ
High Side Output Leakage Current
RILH
-
0
10
µA
Non-switching
Low Side Output Leakage Current
RILL
-
0
10
µA
Non-switching
VSCP
0.28
0.4
0.52
V
SCP
Short Circuit Protection Detection
Voltage
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BD9A301MUV-LB
Typical Performance Curves
5.0
800
4.5
700
4.0
3.5
VIN = 5.5V
3.0
500
Istb[µA]
Icc[µA]
600
400
2.5
2.0
1.5
300
VIN = 2.7V
200
0.5
100
0.0
-40
-20
0
20
40
60
80
-40
100 120
-20
0
20
40
60
80
100 120
Temperature[°C]
Temperature[°C]
Figure 5. Stand-by Current vs Temperature
Figure 4. Operating Current vs Temperature
1.20
0.808
1.15
0.806
VIN = 2.7V
1.10
0.804
1.05
0.802
VFB[V]
FOSC [MHz]
VIN = 5.5V
VIN = 2.7V
1.0
1.00
0.95
VIN = 2.7V
0.800
0.798
0.90
0.796
VIN = 5.0V
0.85
0.794
0.80
0.792
-40
-20
0
20
40
60
80
100 120
-40
-20
0
20
40
60
80
100 120
Temperature[℃]
Temperature[℃]
Figure 6. Switching Frequency vs Temperature
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VIN = 5.0V
Figure 7. FB Voltage vs Temperature
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BD9A301MUV-LB
Typical Performance Curves - continued
40
40
35
35
VIN = 5.0V
30
VIN = 5.0V
Isource[µA]
Isink[µA]
30
25
25
20
20
VIN = 2.7V
VIN = 2.7V
15
15
10
10
-40
-20
0
20
40
60
80
-40
100 120
-20
0
40
60
80
100 120
Temperature[℃]
Temperature[℃]
Figure 8. ITH Sink Current vs Temperature
Figure 9. ITH Source Current vs Temperature
20
0.8
VIN = 5.0V
18
0.7
16
MODE = 5.0V
14
Imode[µA]
0.6
Vmode[µA]
20
0.5
0.4
12
10
8
6
4
0.3
MODE = 2.7V
2
0.2
0
-40
-20
0
20
40
60
80
100 120
Temperature[℃]
-20
0
20
40
60
80
100 120
Temperature[℃]
Figure 10. Mode Threshold vs Temperature
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Figure 11. Mode Input Current vs Temperature
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BD9A301MUV-LB
Typical Performance Curves - continued
2.0
3.0
Css = OPEN
2.5
VIN = 2.7V
1.5
VIN = 5.5V
2.0
ISS[µA]
TSS[msec]
VIN = 2.7V
1.0
1.5
VIN = 5.0V
0.5
1.0
0.0
0.5
-40
-20
0
20
40
60
80
100 120
-40
-20
0
Temperature[℃]
60
80
100 120
Figure 13. Soft Start Terminal Current vs Temperature
120
120
110
110
100
100
90
90
R ONL[mΩ]
R ONH [mΩ]
40
Temperature[℃]
Figure 12. Soft Start Time vs Temperature
VIN = 2.7V
80
20
70
60
VIN = 2.7V
80
70
60
VIN = 5.0V
VIN = 3.3V
50
VIN = 5.0V
50
40
VIN = 3.3V
40
30
30
-40
-20
0
20
40
60
80
100 120
Temperature[℃]
-20
0
20
40
60
80
100 120
Temperature[℃]
Figure 14. High side FET ON-Resistance vs Temperature
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-40
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Figure 15. Low side FET ON-Resistance vs Temperature
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Datasheet
BD9A301MUV-LB
Typical Performance Curves - continued
-6
14
VIN = 5.0V
-7
-8
12
Good
-9
Fault
11
VPGD[%]
VPGD[%]
VIN = 5.0V
13
-10
-11
10
9
Fault
-12
8
-13
7
-14
6
-40
-20
0
20
40
60
80
100
Good
-40
120
-20
0
Temperature[℃]
40
60
80
100 120
Temperature[℃]
Figure 17. PGD Voltage vs Temperature
Figure 16. PGD Voltage vs Temperature
3.0
100
2.9
90
2.8
80
2.7
VUVLO[V]
VIN = 2.7V
70
RPGD[Ω]
20
60
VIN = 5.0V
50
Release
2.6
2.5
2.4
2.3
40
Detect
2.2
30
2.1
20
2.0
-40
-20
0
20
40
60
80
100 120
Temperature[℃]
-20
0
20
40
60
80
100 120
Temperature[℃]
Figure 19. UVLO Threshold vs Temperature
Figure 18. PGD ON-Resistance vs Temperature
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BD9A301MUV-LB
Typical Performance Curves - continued
2.0
7.0
6.5
1.8
6.0
UP
1.6
5.5
IEN[µA]
VEN[V]
EN = 5.0V
1.4
5.0
4.5
1.2
4.0
DOWN
1.0
3.5
0.8
3.0
-40
-20
0
20
40
60
80
100 120
Temperature[℃]
-20
0
20
40
60
80
100 120
Temperature[℃]
Figure 20. EN Threshold vs Temperature
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Figure 21. EN Input Current vs Temperature
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BD9A301MUV-LB
Typical Performance Curves (Application)
100
100
MODE = H
90
90
80
80
70
70
60
60
Efficiency[%]
50
MODE = L
40
50
MODE = L
40
30
30
20
20
VIN =5.0V
VOUT =1.8V
10
VIN =5.0V
VOUT =1.8V
10
0
0
0.001
0.01
0.1
1
10
0.001
0.01
Output_Current [A]
1
10
Output_Current [A]
Figure 23. Efficiency vs Load Current
(VIN=3.3V, VOUT=1.8V, L=1.5μH)
Figure 22. Efficiency vs Load Current
(VIN=5V, VOUT=1.8V, L=1.5μH)
100
80
90
180
VIN=5V
VOUT=1.8V
60
80
135
phase
40
70
60
VOUT =1.8V
50
90
VOUT =3.3V
VOUT =1.2V
Gain[dB]
Efficiency[%]
0.1
20
45
0
0
gain
40
-20
30
-40
-90
-60
-135
-80
-180
20
10
VCC = 5.0V
0
0
0.5
1
1.5
2
2.5
1K
3
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10K
100K
1M
Frequency[Hz]
Output_Current [A]
Figure 24. Efficiency vs Load Current
(VIN = 5.0V, MODE = 5.0V, L=1.5μH)
-45
Phase[deg]
Efficiency[%]
MODE = H
Figure 25. Closed Loop Response
(VIN=5V, VOUT=1.8V, IOUT=1A, L=1.5μH, COUT=Ceramic 44μF)
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BD9A301MUV-LB
Typical Performance Curves (Application) - continued
VIN=5V/div
VIN=5V/div
EN=5V/div
EN=5V/div
Time=1ms/div
Time=1ms/div
VOUT=1V/div
VOUT=1V/div
SW=5V/div
SW=5V/div
Figure 27. Power Down (VIN = EN)
Figure 26. Power Up (VIN = EN)
VIN=5V/div
VIN=5V/div
EN=5V/div
EN=5V/div
Time=1ms/div
Time=1ms/div
VOUT=1V/div
VOUT=1V/div
SW=5V/div
SW=5V/div
Figure 28. Power Up (EN = 0V→5V)
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Figure 29. Power Down (EN = 5V→0V)
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BD9A301MUV-LB
Typical Performance Curves (Application) - continued
VOUT= 20mV/div
SW= 2V/div
VOUT= 20mV/div
SW= 2V/div
Time= 0.5ms/div
Figure 31. Output Ripple
(VIN = 5V, VOUT = 1.8V, IOUT = 3A)
Figure 30. Output Ripple
(VIN = 5V, VOUT = 1.8V, IOUT = 0A)
VIN=50mV/div
VIN=50mV/div
SW=2V/div
Time=20ms/div
SW=2V/div
Figure 32. Input Ripple
(VIN = 5V, VOUT = 1.8V, IOUT = 0A)
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Time= 1µs/div
Time=1µs/div
Figure 33. Input Ripple
(VIN = 5V, VOUT = 1.8V, IOUT = 3A)
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BD9A301MUV-LB
Typical Performance Curves (Application) - continued
IL= 1A/div
IL= 1A/div
Time= 1µs/div
SW= 2V/div
Time= 1µs/div
SW= 2V/div
Figure 35. Switching Waveform
(VIN = 5.0V, VOUT = 1.8V, IOUT = 1A, L=1.5µH)
Figure 34. Switching Waveform
(VIN = 3.3V, VOUT = 1.8V, IOUT = 1A, L=1.5µH)
IL= 500mA/div
Time= 10µs/div
SW= 2V/div
SLLM
TM
Control
TM
Figure 36. Switching Waveform with SLLM
(VIN = 3.3V, VOUT = 1.8V, IOUT = 30mA, L=1.5µH)
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BD9A301MUV-LB
0.4
0.4
0.3
0.3
Output Voltage Deviation [%]
Output Voltage Deviation[%]
Typical Performance Curves (Application) - continued
0.2
0.1
0.0
-0.1
-0.2
0.2
0.1
0
-0.1
-0.2
VOUT=1.8V
-0.3
VIN=5.0V
VOUT=1.8V
-0.3
-0.4
2.5
3.0
3.5
4.0
4.5
5.0
-0.4
5.5
0
VIN Input Voltage[V]
1
2
3
Output Current [A]
Figure 38. Load Regulation vs Load Current
Figure 37. Line Regulation vs Input Voltage
VOUT= 50mV/div
VOUT= 50mV/div
Time= 1ms/div
Time= 1ms/div
IOUT= 1A/div
IOUT= 1A/div
Figure 39. Load Transient Response
IOUT= 0.75A to 2.25A load step
(VIN= 5V, VOUT= 1.8V, COUT= Ceramic 44μF)
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Figure 40. Load Transient Response
IOUT=0A to 3A load step
(VIN= 5V, VOUT= 1.8V, COUT= Ceramic 44μF)
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1.
Function Explanations
(1)
DC/DC converter operation
BD9A301MUV-LB is a synchronous rectifying step-down switching regulator that achieves faster transient response
by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation)
mode for heavier load, while it utilizes SLLM (Simple Light Load Mode) control for lighter load to improve efficiency.
Efficiency η[%]
① SLLMTM control
② PWM control
Output current IOUT [A]
Figure 41. Efficiency (SLLMTM control and PWM control)
①SLLM
TM
②PWM control
control
VOUT =50mV/div
VOUT =50mV/div
Time=5µs/div
Time=5µs/div
SW=2V/div
SW=2V/div
Figure 42. SW Waveform (SLLMTM control)
(VIN = 5.0V, VOUT = 1.8V, IOUT = 50mA)
Figure 43. SW Waveform (PWM control)
(VIN = 5.0V, VOUT = 1.8V, IOUT = 1A)
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(2)
Enable Control
The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 1.5V (Typ), the
internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown
interval (Low level interval of EN) must be set to 100µs or longer.
VEN
EN terminal
VENH
VENL
0
t
VOUT
Output setting voltage
0
t
Soft start 1 msec
(Typ)
Figure 44. Start Up and Down with Enable
(3)
Power Good
When the output voltage reaches outside ±10% of the voltage setting, the open drain N-ch MOSFET internally
connected to the PGD terminal turns on and the PGD terminal is pulled down with an impedance of 100Ω (Typ). A
hysteresis of 3% applies to resetting. Connecting a pull up resistor (10kΩ to 100kΩ) is recommended.
+10%
+7%
VOUT
-7%
-10%
PGD
Figure 45. PGD Timing Chart
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2.
Protection
The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them
for continuous protective operation.
(1)
Short Circuit Protection (SCP)
The short circuit protection block compares the FB terminal voltage with the internal reference voltage VREF. When
the FB terminal voltage has fallen below 0.4V (Typ) and remained there for 1msec (Typ), SCP stops the operation for
16msec (Typ) and subsequently initiates a restart.
EN Terminal
2.0V or higher
FB Terminal
＜0.4V(Typ)
＞0.4V(Typ)
0.8V or lower
-
Short Circuit
Protection
Enabled
Disabled
Short Circuit
Protection Operation
ON
OFF
OFF
Figure 46. Short Circuit Protection (SCP) timing chart
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(2)
Under Voltage Lockout Protection (UVLO)
The Under Voltage Lockout Protection circuit monitors the AVIN terminal voltage.
The operation enters standby when the AVIN terminal voltage is 2.45V (Typ) or lower.
The operation starts when the AVIN terminal voltage is 2.55V (Typ) or higher.
Figure 47. UVLO Timing Chart
(3)
Thermal Shutdown
When the chip temperature exceeds Tj = 175C, the DC/DC converter output is stopped. The thermal shutdown
circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the temperature
exceeding Tjmax = 150C. It is not meant to protect or guarantee the soundness of the application. Do not use the
function of this circuit for application protection design.
(4)
Over Current Protection
The Over Current Protection function operates by using the current mode control to limit the current that flows
through the high-side MOSFET at each cycle of the switching frequency. The designed over current limit value is 6.0A
(Typ).
(5)
Over Voltage Protection (OVP)
Over voltage protection function (OVP) compares FB terminal voltage with internal standard voltage VREF and when
FB terminal voltage exceeds 0.88V (Typ) it turns MOSFET of output part MOSFET off. After output voltage drop it
returns with hysteresis.
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Application Example
Figure 48. Application Circuit
Table 1. Recommended Component Values
Output Voltage
Reference
Designator
1.1V
1.2V
1.5V
1.8V
3.3V
R3
8.2kΩ
8.2kΩ
9.1kΩ
9.1kΩ
18kΩ
-
R5
100kΩ
100kΩ
100kΩ
100kΩ
100kΩ
-
R7
10kΩ
10kΩ
16kΩ
30kΩ
75kΩ
-
R8
27kΩ
20kΩ
18kΩ
24kΩ
24kΩ
-
C2
10μF
10μF
10μF
10μF
10μF
10V, X5R, 3216
C4
0.1μF
0.1μF
0.1μF
0.1μF
0.1μF
25V, X5R, 1608
C6
2700pF
2700pF
2700pF
2700pF
2700pF
-
C7
0.01μF
0.01μF
0.01μF
0.01μF
0.01μF
-
C8
0.1μF
0.1μF
0.1μF
0.1μF
0.1μF
-
C9
22μF
22μF
22μF
22μF
22μF
10V, X5R, 3225
C10
22μF
22μF
22μF
22μF
22μF
10V, X5R, 3225
L1
1.5μH
1.5μH
1.5μH
1.5μH
1.5μH
TOKO, FDSD0630
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Description
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BD9A301MUV-LB
Selection of Components Externally Connected
1.
Output LC Filter Constant
The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the
TM
load. BD9A301MUV-LB is returned to the IC and IL ripple current flowing through the inductor for SLLM control. This
feedback current, Inductance value is the behavior of the best when the 1.5µH. Therefore, the inductor to use is
recommended 1.5µH.
IL
Inductor saturation current > IOUTMAX +⊿IL /2
IOUTMAX
⊿IL
Average inductor current
t
Figure 49. Waveform of current through inductor
Figure 50. Output LC filter circuit
Computation with VIN = 5V, VOUT = 1.8V, L=1.5µH, and the switching frequency FOSC = 1MHz, the method is as below.
Inductor ripple current ∆IL
ΔI L VOUT
V IN -VOUT
1
FOSC
V IN
768 mA
L
The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor
ripple current ∆IL.
The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the
required ripple voltage characteristics.
The output ripple voltage can be represented by the following equation.
ΔV RPL
ΔI L
R ESR
1
8
C OUT
FOSC
[V ]
RESR is the Equivalent Series Resistance (ESR) of the output capacitor.
With COUT = 44µF, RESR = 10mΩ the output ripple voltage is calculated as
ΔV RPL
0.768
10m
8
1
44μ 1MHz
9.8 mV
*Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT.
Use maximum additional capacitor CLOAD(max.) condition which satisfies the following method.
Maximum starting inductor ripple current ILSTART
Over Current limit 3.8 A min
Maximum starting inductor ripple current ILSTART can be expressed in the following method.
ILSTART
Maximum starting output current I OMAX
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Charge current to output capacitor I CAP
ΔI L
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Charge current to output capacitor ICAP can be expressed in the following method.
I CAP
C OUT
C LOAD
TSS
VOUT
[A ]
Computation with VIN= 5V, VOUT= 3.3V, L= 1.5µH, switching frequency FOSC= 800kHz(Min), Output capacitor COUT=
44µF, Soft Start time TSS= 0.5ms(Min), load current during soft start IOSS= 2A the method is as below.
3.8 ‐ I OSS ‐ ΔI L /2
VOUT
C LOAD max
TSS
‐ C OUT 157.9 μF
If the value of CLOAD is large, and cannot meet the above equation,
1.5 ‐ I OSS ‐ ΔI L /2
VOUT I SS
C LOAD max
V FB
C SS ‐ C OUT
Adjust the value of the capacitor CSS to meet the above formula.
(Refer to the following items (3) Soft Start Setting equation of time TSS and soft-start value of the capacitor to be
connected to the CSS.)
Computation with VIN = 5V, VOUT = 3.3V, L = 1.5µH, load current during soft start IOSS = 2A, switching frequency FOSC=
800kHz (Min), Output capacitor COUT = 44µF, VFB = 0.792V(Max), ISS = 3.6µA(Max), A capacitor connected to the CSS if
you want to connect the CLOAD = 220uF is the following equation.
V OUT I SS
3.8 ‐ I OSS ‐ ΔI L /2
C SS
2.
V FB
C LOAD
C OUT
2.97 [nF ]
Output Voltage Setting
The output voltage value can be set by the feedback resistance ratio.
VOUT
R1
gm Amp
FB
－
R2
VOUT
＋
R1 R2
R2
0.8 [V ]
0.8V
Figure 51. Feedback Resistor Circuit
3.
Soft Start Setting
Turning the EN terminal signal high activates the soft start function. This causes the output voltage to rise gradually while
the current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush current.
The rise time depends on the value of the capacitor connected to the SS terminal.
TSS
C SS V FB /I SS
TSS : Soft Start Time
C SS : Capacitor connected to Soft Start Time Termina l
V FB : FB Terminal Voltage (0.8V (Typ))
I SS : Soft Start Terminal Source Current (1.8μA(Typ))
with C SS
TSS
0.01μF,
0.010 [μF] 0.8 [ V ]) /1.8 [μA ]
4.44 [msec ]
Turning the EN terminal signal high with the SS terminal open (no capacitor connected) or with the terminal signal high
causes the output voltage to rise in 1msec (Typ).
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4.
Phase Compensation Component
A current mode control buck DC/DC converter is a one-pole, one-zero system. One poles are formed by an error amplifier
and load and the one zero point is added by phase compensation. The phase compensation resistor RITH determines the
crossover frequency FCRS where the total loop gain of the DC/DC converter is 0dB. A high value crossover frequency FCRS
provides a good load transient response characteristic but inferior stability. Conversely, a low value crossover frequency
FCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired.
(1)
Selection of Phase Compensation Resistor RITH
The Phase Compensation Resistance RITH can be determined by using the following equation.
2π
R ITH
VOUT FCRS C OUT
[Ω]
V FB G MP G MA
]
VOUT : Output Voltage[V
F CRS: Crossover Frequency [Hz]
C OUT : Output Capacitance[F]
V FB : Feedback Reference Voltage (0.8V (Typ))
G MP : Current Sense Gain (13A/V (Typ))
G MA : Error Amplifier Trans conductanc e (260μA /V (Typ))
(2)
Selection of Phase Compensation Capacitance CITH
For stable operation of the DC/DC converter, zero for compensation cancels the phase delay due to the pole formed
by the load.
The phase compensation capacitance CITH can be determined by using the following equation.
C OUT
R ITH
C ITH
(3)
VOUT
[F]
I OUT
Loop stability
To ensure the stability of the DC/DC converter, make sure that a sufficient phase margin is provided. A phase margin
of at least 45º in the worst conditions is recommended.
VOUT
A
(a)
Gain [dB]
RUP
FB
RDW
－
GBW(b)
ITH
0
＋
RITH
0.8V
CITH
－90
f
FCRS
0
Phase[deg]
－90°
PHASE MARGIN
－180°
－180
f
Figure 52. Phase Compensation Circuit
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Figure 53. Bode Plot
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PCB Layout Design
In the buck DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current flows
when the high-side FET is turned on. The flow starts from the input capacitor CIN, runs through the FET, inductor L and
output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current flows
when the low-side FET is turned on. The flow starts from the low-side FET, runs through the inductor L and output capacitor
COUT and back to GND of the low-side FET via GND of COUT. Route these two loops as thick and as short as possible to
allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors directly to
the GND plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat generation, noise
and efficiency characteristics.
VIN
MOS FET
CIN
VOUT
L
COUT
Figure 54. Current Loop of Buck DC/DC Converter
Accordingly, design the PCB layout considering the following points.
Connect an input capacitor as close as possible to the IC PVIN terminal on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from
the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as
thick and as short as possible.
Provide lines connected to FB and ITH far from the SW nodes.
Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.
EN
VIN
CIN
L
VOUT
GND
GND
COUT
Top Layer
Bottom Layer
Figure 55. Example of evaluation board layout
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Power Dissipation
When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power
dissipation is within the allowable dissipation curve.
This package incorporates an exposed thermal pad. Solder directly to the PCB ground plane. After soldering, the PCB can
be used as a heatsink.
The exposed thermal pad dimensions for this package are shown in page 31.
4.0
Allowable power
dissipation: Pd [W]
3.0
2.0
1.0
(1)4-layer board (surface heat dissipation copper foil 5505mm2)
(copper foil laminated on each layer)
JA=47.0°C/W
(2) 4-layer board (surface heat dissipation copper foil 6.28mm2)
(copper foil laminated on each layer)
JA=70.62°C/W
(3) 1-layer board (surface heat dissipation copper foil 6.28mm2)
JA=201.6°C/W
(4) IC only
JA=462.9°C/W
①2.66W
②1.77W
③0.62W
④0.27W
0
0
25
50
75 85 100
125
150
Ambient temperature: Ta [°C]]
Figure 56. Thermal Derating Characteristics
(VQFN016V3030)
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I/O equivalence circuits
6. FB
7. ITH
8. MODE
9. SS
MODE
10Ω
10kΩ
AGND
500kΩ
AGND
10.11.12. SW13. BOOT
14. PGD
PGD
60Ω
AGND
AGND
15. EN
EN
430kΩ
10kΩ
AGND
570kΩ
AGND
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm 4-layer glass epoxy board. In case of exceeding this absolute
maximum rating increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 56. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B
D
9
A
3
0
Part Number
1
M
U
V
Package
VQFN016V3030
-
LBE2
Product class
LB: for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN016V3030 (TOP VIEW)
Part Number Marking
D9A
LOT Number
3 0 1
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
VQFN016V3030
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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Revision History
Date
Revision
20.Aug.2014
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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