2.7V to 5.5V Input ,3A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9B331GWZ
General Description
Key Specifications
ROHM’s
high
efficiency
switching
regulator,
BD9B331GWZ, is a step-down converter designed to
produce a low voltage output of 0.6V~3.3V from a
2.7V~5.5V power supply line. It offers high efficiency in
all load ranges by automatic PFM/PWM adjustment. It
employs an On time control system to provide faster
transient response to sudden change in load.
Input Voltage Range:
2.7V to 5.5V
Output Voltage Range:
0.6V to PVCC×0.8V
Output Current:
3.0A (Max)
Switching Frequency:
1.3MHz(Typ)
High Side FET ON Resistance:
23mΩ(Typ)
Low Side FET ON Resistance:
23mΩ(Typ)
Standby Current:
0µA (Typ)
Operating Temperature Range:
-40°C to +85°C
Features
Fast transient response with On time control system.
High efficiency for all load range with synchronous
rectifier (Nch/Nch FET) and adaptive PFM/PWM
system.
Adjustable Soft-start function.
Thermal and UVLO protection.
Short-circuit current protection with pulse count
Shutdown function.
Package(s)
W(Typ) x D(Typ) x H(Max)
1.98mm x 1.80mm x 0.33mm
UCSP30L1:
Applications
Power supply for LSI including SoC, DSP,
Micro computer and ASIC
Laptop PC / Tablet PC / Server
LCD TV, Storage Devices (HDD / SSD)
Printer
Amusement
Secondary power supply
.
UCSP30L1
Typical Application Circuit(s)
VIN
CIN
PVCC
PGD
AVCC
BST
PGD
CBST
EN
L
BD9B331GWZ
EN
SS
VOUT
SW
FB
COUT
CSS
RES
AGND
PGND
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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BD9B331GWZ
Pin Configuration (BOTTOM VIEW)
D
C
B
A
1
2
3
4
Figure 2. Pin Configuration
Pin Description(s)
Pin No
Symbol
A1
FB
A2
AGND
A3
A4
B1
Function
Pin No
Symbol
Output feedback pin
C1
EN
Function
Enable pin（High active）
Ground pin
C2
SS
Soft start capacitor connection pin
PGND
Power ground pin
C3
SW
Switch pin
PGND
Power ground pin
C4
SW
Switch pin
PGD
Power good open drain pin
D1
AVCC
B2
RES
Reserved pin
(Connect to Ground)
D2
BST
B3
SW
Switch pin
D3
PVCC
Power supply input pin
B4
SW
Switch pin
D4
PVCC
Power supply input pin
Power supply input pin
Bootstrap pin
Block Diagram(s)
PVcc
AVcc
22uF
1000pF
ILIM
EN
UVLO
BST
FB
On Time
Modulation
Error Amp
On Time
SS
REF
0.1uF
Control
Logic
+
DRV
+
Over shoot
reduction
1uH
VOUT
SW
22uF
Amp
PGND
TSD
0.8×REF
0.85×REF
RES
PGD
AGND
100pF
Figure 3. Block Diagram
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BD9B331GWZ
Absolute Maximum Ratings (Ta = 25°C)
Parameter
AVCC / PVCC Voltage
Symbol
Rating
Unit
AVCC / PVCC
-0.3 to +7 (Note 1)
V
(Note 1)
V
EN Voltage
VEN
BST Voltage
VBST
-0.3 to +13
V
VBST-SW
-0.3 to +7
V
Vsw
-0.3 to PVcc+0.3
V
VSS/ VFB VPGD
-0.3 to +7
V
BST_SW Voltage
SW Voltage
SS/FB/PGD/ Voltage
-0.3 to +7
(Note 2)
W
Topr
-40 to +85
°C
Tstg
-55 to +150
°C
Tjmax
+150
°C
Power Dissipation
Pd
Operating temperature range
Storage temperature range
Maximum junction temperature
0.81
(Note 1) Pd,and Tj=150°C should not be exceeded.
(Note 2) Derate by 6.5mW/°C when operating above Ta=25°C.
When mounted on a board 63mm×55mm×1.6mm glass-epoxy board, 9 layer.(Refer to page.16 )
Recommended Operating Ratings (Ta=-40 to 85℃)
Parameter
Symbol
Min.
Rating
Typ.
Max.
Unit
Power Supply Voltage
AVCC
PVCC
2.7
2.7
5.0
5.0
5.5
5.5
V
V
EN Voltage
Output voltage Range
SW average output current
VEN
VOUT
ISW
0
0.6
-
AVCC
-
5.5
PVCC×0.8
3(Note 3)
V
V
A
(Note 3) Pd, ASO should not be exceeded
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BD9B331GWZ
Electrical Characteristics (Unless otherwise specified AVCC=PVCC=5V, EN=AVCC Ta=25°C)
Parameter
Symbol
Limits
Unit
Min.
Typ.
Max.
-
5.5
V
Conditions
Supply
AVcc and PVcc voltage range
VIN
2.7
Standby current
ISTB
-
-
3
µA
Active current
ICC
-
150
200
µA
UVLO detection voltage
VUVLOTH
2.38
2.50
2.62
V
UVLO hysteresis
VUVLOHYS
40
50
60
mV
EN low voltage
VENL
GND
-
0.5
V
EN high voltage
VENH
1.5
-
AVcc
V
Active mode
EN input current
IEN
-
3
6
µA
VEN=5V
PG threshold voltage
VPGTH
-20%
-15%
-10%
V
VFB-15% (Typ)
PG hysteresis voltage
VPGHYS
-25%
-20%
-15%
V
VFB-20% (Typ)
PG detect delay time
PDELAY
6
15
25
µs
RPG
50
100
200
Ω
VFB △IL,
excess current will be charged and output voltage will keep on rising (Fig.35 dotted line waveform). When the output voltage
is set to a low value, △IL will be small and output voltage will increase significantly. BD9B331GWZ operates over shoot
reduction when the Low side power MOS is kept ON after twice the PWM pulse width. Vf voltage is generated to the SW
terminal by turning off the HG-LG and applying IL through the body diode of the Low side MOS. This makes △IL =(-VfVOUT)/L and reduces the rise in output voltage by controlling excess current not to be charged to output capacitor.
VIN
HG
-Vf
VOUT
IL
IOUT
LG
Figure 35. Over short reduction timing chart
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BD9B331GWZ
Switching Regulator Efficiency
η
VOUT I OUT
P
POUT
100 [%] OUT 100 [%]
100 [%]
VIN I IN
PIN
POUT PDα
Efficiency may be improved by reducing the switching regulator power dissipation factors PDα as follows:
Dissipation factors:
2
1) ON resistance dissipation of inductor and FET：PD (I R)
2) Gate charge/discharge dissipation：PD (Gate)
3) Switching dissipation：PD (SW)
4) ESR dissipation of capacitor：PD (ESR)
5) Operating current dissipation of IC：PD (IC)
1)
2
PD ( I 2 R ) I OUT ( R COIL R ON )
where :
R COIL is DC resistance of inductor
R ON is ON resistance of FET
I OUT is Output current
PD ( Gate ) Cqs f V 2
2)
where :
Cqs is Gate capacitance of FET
f is Switchingfrequency
V is Gate drivingvoltageof FET
2
3）
PD ( SW )
VIN CRSS I OUT f
I DRIVE
where :
C RSS is Reversetransfer capacitance of FET
I DRIVE is Peak current of gate
4)
PD ( ESR ) I RMS 2 ESR
where :
I RMS is Ripplecurrentof capacitor
ESR is Equivalentseriesresistance
5)
PD ( IC ) VIN I CC
where :
I CC is Circuitcurrent
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BD9B331GWZ
Power Dissipation (Pd)
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as
reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage.
○Measurement conditions
Evaluation board
Layout of Board for
Measurement
Top Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (9 layers)
Board Size
63 mm x 55 mm x 1.6 mm
Top layer
Wiring
Rate
Metal (GND) wiring rate: Approx. 81.6%
Bottom layer
Metal (GND) wiring rate: Approx. 82.3%
Outer layer L1,L9 : 27μm
Inner layer L8 : 27μm,L2~L7 : 18μm
Diameter 0.1mm x 256 holes
Diameter 0.6mm x 266 holes
0.81W
Copper Foil Thickness
Through Hole
Power Dissipation
Thermal
Resistance
θJA =153.8°C/W
0.8
P I OUT 2 R ON
R ON D R ONH 1 D R ONL
0.6
D is ON duty
( V OUT /V IN )
0.81W
Power dissipation: Pd [W]
Bottom Layer (Bottom View)
Where :
R ONH is ON resistance of High side MOS FET
R ONL is ON resistance of Low side MOS FET
0.4
I OUT is Output current
Ex) V IN 5V, V OUT 1V, R ONH 23m Ω , R ONL 23m Ω , IOUT 3A
0.2
0
0
25
50
75 85 100
125
150
Ambient temperature :Ta [°C]
Figure 36. Power dissipation (BD9B331GWZ)
D=
V OUT 1
0 .2
V IN
5
0.2 0 .023 ( 1 0.2 ) 0.023
R ON =
0.023 [Ω ]
P 3 2 0.023 0.207 [W]
Thermal design must be carried out with sufficient margin allowed with consideration on the dissipation above.
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Datasheet
BD9B331GWZ
External Component Selection
1. Inductor (L)
The inductance has great influence on the output ripple current.
As seen in the equation (1), the ripple current decreases as the
inductor and/or switching frequency increases.
IL
∆IL
VIN
V IN -V OUT
L V IN
IL
IL
V OUT
A
f
(1)
Where :
f is Switching frequency
I L is Output ripple current
VOUT
L
COUT
Efficiency is affected as the dissipation factor, PD(I2R), PD(Gate),
PD(SW), changes with respect to the coil value and PFM frequency
dependence on ripple current.
BD9B331GWZ is designed to have least dissipation in PFM and PWM,
both about L = 0.47µH to 1µH.
Figure 37. Output ripple current
※Current flow that exceeds the coil rating brings the coil into magnetic saturation, which may lead to lower efficiency.
Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. In
addition, select a coil with a low resistance component (DCR, ACR) to lessen coil dissipation and improve efficiency.
2. Output Capacitor (COUT)
VIN
Output capacitor should be selected with the consideration on the stability region
and the equivalent series resistance required for smooth ripple voltage.
VOUT
L
ESR
COUT
Figure 38. Output capacitor
Output ripple voltage is determined by the equation (2)：
ΔV OUT
ΔI L
ESR V
(2)
Where :
ESR is Equivalent series resistance of COUT
ΔI L is output ripple current
※The capacitor rating must allow a sufficient margin with respect to the
output voltage. A 22μF to 100μF ceramic capacitor is recommended. A
capacitor with low ESR is recommended order to reduce output ripple.
Maximum value of COUT must be considered as a large current is needed to
charge COUT to VOUT set point during boot-up. This current may trigger over
current protection (OCP) and cause a normal boot-up failure.
COUT ＞
TSS I OCP
[F]
VOUT
(3)
Where :
TSS
is Soft start time (refer to Page12)
I OCP is Over current detection( min) about 6.5A
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BD9B331GWZ
3. Input Capacitor (CIN)
VIN
Input capacitor must be a low ESR capacitor with a capacitance
sufficient to cope with high ripple current to prevent high transient voltage. The
ripple current IRMS is given by the equation (4):
CIN
ｄ
VOUT
L
I RMS I OUT
COUT
VOUT VIN VOUT
[A]
VIN
(4)
IRMS(max)
VIN
Figure 39. Input capacitor
=
2 VOUT , I RMS=
I OUT
2
Ex) BD9B331GWZ when VIN=5.5V, VOUT=2.75V, IOUTmax=3A
I RMS 3
2.75 5.5 2.75
1.5 [ARMS]
5 .5
4. Feedback Capacitor
Generally, in fixed ON time control (hysteresis control), sufficient ripple voltage in FB voltage is needed to operate
comparator stably. This IC is designed to respond to low ESR output capacitor, such as ceramic capacitor, by injecting a
ripple to the feedback voltage. In order to inject appropriate ripple, a feedback capacitor of 100pF to 200pF is recommended.
5. Output Voltage Determination
L
The output voltage VOUT is determined by the equation (5):
V OUT
R2
1 V FB
R
1
SW
(5)
FB
Where :
V FB is FB terminal voltage(0. 6V Typ.)
With R1 and R2 adjusted, the output voltage may be determined as required.
VOUT
COUT
R2
R1
Figure 40. Output voltage setting resistor
Output voltage setting range is 0.6V to PVcc×0.8 V
Use about 100kΩ resistor for R1 and R2 to consider loss at the PFM.
6. Bootstrap capacitor
Bootstrap capacitor CBOOT shall be 0.1μF. Connect a bootstrap capacitor between SW pin and BOOT pin.
For capacitance of Bootstrap capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to
set minimum value to no less than 0.047μF.
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Datasheet
BD9B331GWZ
Recommended Part Circuit
C7
V IN
R3
C1
C2
PVCC
R4
AVCC
EN
BST
PGD
VOUT
0. 9V
C6
Power Good
U1
SW
L1
SS
C8
R1
C5
FB
RES
AGND
C3
C4
R2
PGND
Figure 41. Recommended part circuit
●EN
Provide control signal externally when controlling the output via enable terminal.
●RES
Connect to ground.
●R4
Pull-up resistor for Power Good function.
Keep PGD open or connect it to ground when Power Good function is not in use.
●Recommendation parts list
Part No
Value
Manufacturer
U1
-
ROHM
Part number
BD9B331GWZ
Size(mm)
1.98*1.80*0.33
L1
1.0µH
TOKO
DFE252010F-1R0M
2520
C1
22µF(Note 4)
MURATA
GRM219 Series 10V
2012
C2
-
-
-
-
C3
22µF
MURATA
GRM188 Series 4V
1608
C4
-
-
-
-
C5
100pF
MURATA
GRM033 Series
0603
C6
0.1uF
MURATA
GRM033 Series
0603
C7
1000pF
ROHM
MCR006 Series
0603
C8
-
-
-
-
R1
100kΩ
ROHM
MCR006 Series
0603
R2
200kΩ
ROHM
MCR006 Series
0603
R3
100Ω
ROHM
MCR006 Series
0603
R4
100kΩ
ROHM
MCR006 Series
0603
(Note 4) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less
than 8μF.
※Evaluation using the actual machine must be done for above constant is only a value on our evaluation board.
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BD9B331GWZ
PCB Layout Design
In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current
flows when the High-Side FET is turned ON. The flow starts from the input capacitor CIN, runs through the FET, inductor L
and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current flows
when the Low-Side FET is turned on. The flow starts from the Low-Side FET, runs through the inductor L and output
capacitor COUT and back to GND of the Low-Side FET via GND of COUT. Route these two loops as thick and as short as
possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors
directly to the GND plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat
generation, noise and efficiency characteristics.
Figure 42. Current Loop of Buck Converter
Accordingly, design the PCB layout considering the following points.
Connect an input capacitor as close as possible to the IC PVCC terminal on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from
the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as
thick and as short as possible.
Provide lines connected to FB far from the SW nodes.
Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.
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BD9B331GWZ
An example of PCB layout
BD9B331GWZ
Parts placement
TOP layer
Bottom layer
Middle layer
Figure 43. An example of PCB layout
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BD9B331GWZ
I/O equivalent circuit(s)
・EN pin
PVCC
・SW pin
0.5MΩ
PVCC
PVCC
EN
0.9MΩ
SW
0.3MΩ
・SS pin
・FB pin
SS
FB
・BST pin
AVCC
・PGD pin
PVCC
PVCC
PGD
BST
SW
Figure 44. I/O equivalence circuit
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BD9B331GWZ
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 45. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered
down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state
even if the TJ falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
17. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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BD9B331GWZ
Ordering Information
B
D
9
B
3
3
1
Part Number
G
W
Z
Package
GWZ:UCSP30L1
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
UCSP30L1 (TOP VIEW)
1PIN MARK
Part Number Marking
B 3 3 1
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
LOT Number
25/27
TSZ02201-0J3J0AJ00810-1-2
27.MAY.2015 Rev.002
Datasheet
BD9B331GWZ
Physical Dimension, Tape and Reel Information
Package Name
UCSP30L1
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
)
∗ Order quantity needs to be multiple of the minimum quantity.
26/27
TSZ02201-0J3J0AJ00810-1-2
27.MAY.2015 Rev.002
Datasheet
BD9B331GWZ
Revision History
Date
Revision
28.Jun.2015
27.May.2015
001
002
Changes
New Release
Error correction
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
27/27
TSZ02201-0J3J0AJ00810-1-2
27.MAY.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
