BD9D300MUV-E2

Datasheet 4.0 V to 17 V Input, 3 A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9D300MUV General Description Key Specifications Features Package BD9D300MUV is a synchronous buck switching regulator with built-in low on-resistance power MOSFETs. This integrated circuit (IC) is capable of providing current up to 3 A. It operates high oscillating frequency with low inductance. It has original on-time control system which can operate low power consumption in light load condition. This IC is ideal for reducing standby power consumption of equipment. ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Single Synchronous Buck DC/DC Converter On-time Control Light Load Mode Control Over Current Protection (OCP) Short Circuit Protection (SCP) Thermal Shutdown Protection (TSD) Under Voltage Lockout Protection (UVLO) Adjustable Soft Start Power Good Output Over Voltage Protection (OVP) VQFN016V3030 Package Backside Heat Dissipation Input Voltage Range: Output Voltage Range: Output Current: Switching Frequency: High-Side FET ON Resistance: Low-Side FET ON Resistance: Shutdown Current: Operating Quiescent Current: 4 V to 17 V 0.9 V to 5.25 V 3 A (Max) 1.25 MHz (Typ) 110 mΩ (Typ) 50 mΩ (Typ) 3 μA (Typ) 20 µA (Typ) W (Typ) x D (Typ) x H (Max) 3.00 mm x 3.00 mm x 1.00 mm VQFN016V3030 Applications ◼ Step-down Power Supply for SoC, FPGA, Microprocessor ◼ Laptop PC / Tablet PC / Server ◼ LCD TV ◼ Storage Device (HDD / SSD) ◼ 2-series Cell Li-Ion Batteries Equipment ◼ Printer, OA Equipment ◼ Distributed Power Supply, Secondary Power Supply VQFN016V3030 Typical Application Circuit VIN BD9D300MUV PVIN PGD AVIN CIN VEN R3 EN RESERVE MODE SS L1 SW VOUTS VOUT R1 COUT FB PGND AGND 〇Product structure : Silicon integrated circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 VPGD R2 〇This product has no designed protection against radioactive rays. 1/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Pin Configuration SW 1 SW 2 PGND PGND VOUTS EN (TOP VIEW) 16 15 14 13 12 PVIN 11 PVIN EXP-PAD Pin Descriptions PGD 4 9 SS 5 6 7 8 MODE AVIN RESERVE 10 AGND 3 FB SW Pin No. Pin Name Function 1, 2, 3 SW Switch pin. These pins are connected to the drain of the High-Side and Low-Side FET. In addition, connect an inductor considering the direct current superimposition characteristic. 4 PGD Power Good pin. This pin is an open drain output that requires a pull-up resistor (to the VOUTS pin). See page 15 for setting the resistance. If not used, this pin can be left floating or connected to Ground. 5 FB Output voltage feedback pin. See page 32 for how to calculate the resistances of the output voltage setting. 6 AGND 7 Ground pin for the control circuit. RESERVE Reserve pin. Connect to Ground. 8 MODE Pin for setting switching control mode. Connecting this pin to the VOUTS pin forces the device to operate in the Pulse Width Modulation (PWM) mode control. Connecting to Ground, the mode is automatically switched between the Light Load mode control and PWM mode control. Fix this pin to the VOUTS pin or Ground. Do not change the mode control during operation. 9 SS Pin for setting the soft start time of output voltage. The soft start time is 1 ms (Typ) when the SS pin is open. A ceramic capacitor connected to the SS pin makes the soft start time 1 ms or more. See page 32 for how to calculate the capacitance. 10 AVIN Pin for supplying power to the control circuit. Connecting 0.1 µF (Typ) ceramic capacitor is recommended. This pin is connected to PVIN. 11, 12 PVIN Power supply pins for the output MOSFETs. Connecting 10 µF (Typ) ceramic capacitor is recommended. 13 EN Enable pin. The device starts up when VEN is set to 0.9 V (Min) or more. The device enters the shutdown mode with setting VEN to 0.3 V (Max) or less. This pin must be properly terminated. 14 VOUTS Pin for discharging output and detecting output voltage. Connect to output voltage node. 15, 16 PGND Ground pins for the output stage of the switching regulator. - EXP-PAD A backside heat dissipation pad. Connecting to the internal PCB Ground plane by using via provides excellent heat dissipation characteristics. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Block Diagram AVIN 10 11 REG EN 13 UVLO PVIN 12 HOCP ＋ EN SCP OVP VOUTS － 14 High-Side FET Main Comparator SS 9 VREF Control Logic + DRV ＋ Soft Start On Time ＋ ＋ － 1 2 3 － FB Low-Side FET Error Amplifier LOCP 5 ＋ TSD PGOOD PGND － ZXCMP 15 ＋ 16 － PGD www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SW 4 3/39 7 RESERVE 8 6 AGND MODE TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Description of Blocks 1. REG This block generates the internal power supply. 2. EN This is the enable block. When EN voltage (VEN) is set to 0.9 V (Min) or more, the internal circuit is activated and the device starts operation. Shutdown is forced if VEN is set to 0.3 V (Max) or less. 3. UVLO This block is for under voltage lockout protection. The device shuts down when input voltage falls to 3.6 V (Typ) or less. The threshold voltage has a hysteresis of 200 mV (Typ). 4. VREF This block generates the internal reference voltage. 5. TSD This block is for thermal protection. The device is shut down when the junction temperature (Tj) reaches to 175 °C (Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ) when the Tj goes down. 6. Soft Start This block slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. The internal soft start time is 1 ms (Typ) when the SS pin is open. A capacitor connected to the SS pin makes the rising time 1 ms or more. 7. PGOOD This block is for power good function. When the FB voltage (VFB) is more than or equal to 95 % (Typ) of 0.8 V, the builtin open drain Nch MOSFET connected to the PGD pin is off, and the PGD pin becomes High impedance. When VFB is less than or equal to 90 % (Typ) of 0.8 V, it turns on the built-in open drain Nch MOSFET and the PGD pin is pulled down with 100 Ω (Typ). 8. Control Logic + DRV This block controls switching operation and various protection functions. 9. OVP This block is for output over voltage protection. When VFB is more than or equal to 120 % (Typ) of 0.8 V, the output MOSFETs are off. After VFB is less than or equal to 115 % (Typ) of 0.8 V, the output MOSFETs are returned to normal operation condition. In addition, when VOUTS voltage (VVOUTS) reaches 5.95 V (Typ) or more, the output MOSFETs are off. After VVOUTS falls 5.65 V (Typ) or less, the output MOSFETs are returned to normal operation condition. If the condition of the over voltage protection is continued for 20 µs (Typ), the output MOSFETs are latched to off. 10. HOCP This block is for over current protection of the High-Side FET. When the current that flows through the High-Side FET reaches the value of over current limit, it turns off the High-Side FET and turns on the Low-Side FET. 11. LOCP This block is for over current protection of the Low-Side FET. While the current that flows through the Low-Side FET over the value of over current limit, the condition that being turned on the Low-Side FET is continued. 12. SCP This block is for short circuit protection. After soft start is completed and in condition where VFB is less than or equal to 90 % (Typ) of 0.8 V, this block counts the number of times of which current flowing in the High-Side FET or the Low-Side FET reaches over current limit. When 256 times is counted, the device is shut down for 15 ms (Typ) and re-operates. Counting is reset when VFB is more than or equal to 95 % (Typ) of 0.8V, or IC re-operates by EN, UVLO and SCP function. 13. Error Amplifier The Error Amplifier adjusts Main Comparator input voltage to make the internal reference voltage equal to VFB. 14. Main Comparator The Main Comparator compares the Error Amplifier output voltage and VFB. When VFB becomes lower than the Error Amplifier output voltage, the output turns High and reports to the On Time block that the output voltage has dropped below the control voltage. 15. On Time This block generates On Time. The designed On Time is generated after the Main Comparator output turns High. The On Time is adjusted to control the frequency to be fixed even with I/O voltage is changed. 16. ZXCMP The ZXCMP is a comparator that monitors the inductor current. When inductor current falls below 0 A (Typ) while the Low-Side FET is on, it turns the FET off. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Absolute Maximum Ratings (Ta = 25 °C) Parameter Input Voltage Symbol Rating Unit VPVIN, VAVIN -0.3 to +20 V VEN -0.3 to VPVIN + 0.3 V VMODE -0.3 to +7 V VRESERVE -0.3 to +7 V SS Voltage VSS -0.3 to +20 V PGD Voltage VPGD -0.3 to +7 V EN Voltage MODE Voltage RESERVE Voltage VFB -0.3 to +7 V VVOUTS -0.3 to +7 V VSW -0.3 to VPVIN + 0.3 V FB Voltage VOUTS Voltage SW Voltage IOUT 3.5 A Tjmax 150 °C Tstg -55 to +150 °C Output Current Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) θJA 189.0 57.5 °C/W ΨJT 23 10 °C/W VQFN016V3030 Junction to Ambient Junction to Top Characterization Parameter (Note 2) (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via (Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Recommended Operating Conditions Parameter Input Voltage Symbol Min Typ Max Unit VPVIN, VAVIN 4.0 - 17 V Operating Temperature Ta -40 - Output Current IOUT 0 - 3 A Output Voltage Setting VOUT (Note 2) - 5.25 V 0.9 +85 (Note 1) °C (Note 1) Tj must be lower than 150C under actual operating environment. Life time is derated at junction temperature greater than 125 °C. (Note 2) Use under the condition of the output voltage (VOUT) ≥ input voltage (VIN) × 0.125. Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VPVIN = VAVIN = 12 V, VEN = 5 V, VMODE = GND) Parameter Symbol Min Typ Max Unit Conditions Shutdown Current ISDN - 3 10 µA Operating Quiescent Current ICC - 20 40 µA VUVLO 3.4 3.6 3.8 V VUVLOHYS - 200 - mV EN Input High Level Voltage VENH 0.9 - VAVIN V EN Input Low Level Voltage VENL GND - 0.3 V IEN - - 10 µA VFBTH 0.792 0.800 0.808 V FB Input Current IFB - 1 100 nA Soft Start Charge Current ISS 2.3 2.5 2.7 µA Internal Soft Start Time tSS 0.4 1 1.8 ms MODE Input High Level Voltage VMODEH 0.9 - VVOUTS V MODE Input Low Level Voltage VMODEL GND - 0.3 V tONT - 333 - ns VPGDR 92 95 98 % VPGDF 87 90 93 % ILKPGD - 0 800 nA PGD MOSFET ON Resistance RPGD - 100 200 Ω PGD Low Level Voltage VPGDL - 0.2 0.4 V High-Side FET ON Resistance RONH - 110 220 mΩ Low-Side FET ON Resistance RONL - 50 100 mΩ High-Side Output Leakage Current ILKH - 0 10 µA No switching Low-Side Output Leakage Current ILKL - 0 10 µA No switching Output OVP Detection Voltage VOVPH 115 120 125 % Output OVP Release Voltage VOVPL 110 115 120 % Low-Side FET Over Current Detection Current (Note 3) ILOCP 3.1 3.8 - A Power Supply (AVIN) UVLO Detection Threshold Voltage UVLO Hysteresis Voltage VEN = 0 V IOUT = 0 mA No switching VIN falling Enable EN Input Current Reference Voltage, Error Amplifier, Soft Start FB threshold Voltage VFB = 0.8 V Control On Time Power Good Power Good Rising Threshold Voltage Power Good Falling Threshold Voltage PGD Output Leakage Current VOUT = 5.0 V VFB rising, VPGDR = VFB / VFBTH x 100 VFB falling, VPGDF = VFB / VFBTH x 100 VPGD = 5 V IPGD = 2 mA SW (MOSFET) Protection VFB rising, VOVPH = VFB / VFBTH x 100 VFB falling, VOVPL = VFB / VFBTH x 100 (Note 3) No tested on outgoing inspection. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves 10 VIN = 12 V Shutdown Supply Current : ISDN [μA] Operating Quiescent Current : ICC [μA] 30 25 20 15 10 5 0 -40 -20 0 20 40 Temperature : Ta [°C] 60 Figure 1. Operating Quiescent Current vs Temperature 7 6 5 4 3 2 1 -40 100 100 90 90 80 80 70 70 60 50 40 0 20 40 Temperature : Ta [°C] 60 80 60 50 40 30 30 VIN = 7.4 V 20 20 VIN = 12 V 10 0 0.001 -20 Figure 2. Shutdown Supply Current vs Temperature Efficiency [%] Efficiency [%] 8 0 80 VIN = 12 V 9 10 VIN = 15 V 0.01 0.1 1 Output Current : IOUT [A] 10 Figure 3. Efficiency vs Output Current (VOUT = 5 V, L = 2.2 μH, MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 0.001 VIN = 7.4 V VIN = 12 V VIN = 15 V 0.01 0.1 1 Output Current : IOUT [A] 10 Figure 4. Efficiency vs Output Current (VOUT = 5 V, L = 2.2 μH, MODE = High) 7/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 100 100 90 90 80 80 70 70 Efficiency [%] Efficiency [%] Typical Performance Curves – continued 60 50 40 60 50 40 30 30 20 20 VIN = 7.4 V 10 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 10 0.01 0.1 1 Output Current : IOUT [A] 10 Figure 6. Efficiency vs Output Current (VOUT = 3.3 V, L = 2.2 μH, MODE = High) 4 0.815 VIN = 12 V 0.81 UVLO Threshold Voltage : VUVLO [V] FB Threshold Voltage : VFBTH [V] VIN = 12 V 0 0.001 Figure 5. Efficiency vs Output Current (VOUT = 3.3 V, L = 2.2 μH, MODE = Low) 0.805 0.8 0.795 0.79 0.785 VIN = 7.4 V 10 VIN = 12 V -40 -20 0 20 40 60 Temperature : Ta [°C] Release 3.8 3.7 3.6 Detection 3.5 3.4 3.3 3.2 80 Figure 7. FB Threshold Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3.9 -40 -20 0 20 40 Temperature : Ta [°C] 60 80 Figure 8. UVLO Threshold Voltage vs Temperature 8/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves – continued 1 0.9 VIN = 12 V 9 0.8 8 EN Input Current : IEN [μA] EN Threshold Voltage : VEN [V] 10 VIN = 12 V 0.7 VENH (High Level) 0.6 0.5 VENL (Low Level) 0.4 0.3 7 6 5 4 3 0.2 2 0.1 1 0 0 -40 -20 0 20 40 Temperature : Ta [°C] 60 80 VEN = 0.5 V VEN = 5.0 V -40 Figure 9. EN Threshold Voltage vs Temperature 1 VMODEH (High Level) 0.6 0.5 VMODEL (Low Level) 0.4 0.3 0.2 0.7 0.6 0.5 0.4 0.3 0.2 0 -40 -20 0 20 40 Temperature : Ta [°C] 60 80 Figure 11. MODE Threshold Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 80 0.8 0.1 0.1 0 60 VIN = 12 V 0.9 MODE Input Current : IMODE [μA] MODE Threshold Voltage : VMODE [V] 1 0.8 0.7 0 20 40 Temperature : Ta [°C] Figure 10. EN Input Current vs Temperature VIN = 12 V 0.9 -20 VMODE = 5 V -40 -20 0 20 40 Temperature : Ta [°C] 60 80 Figure 12. MODE Input Current vs Temperature 9/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves – continued 80 VIN = 12 V Low-Side FET ON Resistance : R ONL [mΩ] High-Side FET ON Resistance : RONH [mΩ] 140 120 100 80 60 40 20 0 -40 -20 0 20 40 Temperature : Ta [°C] 60 Figure 13. High-Side FET ON Resistance vs Temperature 98 VPGDR (Rising) 96 94 92 VPGDF (Falling) 88 86 84 -40 -20 40 30 20 10 -40 200 VIN = 12 V 90 50 0 20 40 Temperature : Ta [°C] 60 Figure 15. Power Good Threshold Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/39 0 20 40 Temperature : Ta [°C] 60 80 VIN = 12 V 180 IPGD = 2 mA 160 140 120 100 80 60 40 20 0 80 -20 Figure 14. Low-Side FET ON Resistance vs Temperature PGD MOSFET ON Resistance : RPGD [Ω] Power Good Threshold Voltage : VPGD [%] 100 60 0 80 VIN = 12 V 70 -40 -20 0 20 40 Temperature : Ta [°C] 60 80 Figure 16. PGD MOSFET ON Resistance vs Temperature TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves – continued 2 1.6 1.4 1.2 1 0.8 0.6 0.4 -40 -20 0 20 40 Temperature : Ta [°C] 60 2 3 2.5 2 1.5 1 2 Switching Frequency : fOSC [MHz] MODE = High 1.4 1.2 1 0.8 MODE = Low 0.4 -20 0 20 40 Temperature : Ta [°C] 60 80 VIN = 12 V 1.8 1.6 0.6 -40 Figure 18. Soft Start Charge Current vs Temperature VIN = 12 V 1.8 Switching Frequency : fOSC [MHz] 3.5 0 80 Figure 17. Internal Soft Start Time vs Temperature 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0.2 0 4 0.5 0.2 0 VIN = 12 V 4.5 Soft Start Charge Current : ISS [μA] 1.8 Internal Soft Start Time : tSS [ms] 5 VIN = 12 V 0 0 0.5 1 1.5 2 Output Current : IOUT [A] 2.5 3 Figure 19. Switching Frequency vs Output Current (VIN = 12 V, VOUT = 5 V) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 6 7 8 9 10 11 12 13 14 15 16 17 Input Voltage : VIN [V] Figure 20. Switching Frequency vs Input Voltage (VOUT = 5.0 V, IOUT = 1 A, MODE = High) 11/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves – continued Time: 500 µs/div Time: 500 µs/div VEN: 5 V/div VEN: 5 V/div VOUT: 2 V/div VOUT: 2 V/div VSW: 10 V/div VSW: 10 V/div VPGD: 5 V/div VPGD: 5 V/div Figure 21. EN Start-up Waveform (VIN = 12 V, VOUT = 5 V, RLOAD = 5 Ω, MODE = Low) Figure 22. EN Shutdown Waveform (VIN = 12 V, VOUT = 5 V, RLOAD = 5 Ω, MODE = Low) Time: 500 µs/div Time: 500 µs/div VIN: 10 V/div VIN: 10 V/div VOUT: 2 V/div VOUT: 2 V/div VSW: 10 V/div VSW: 10 V/div VPGD: 5 V/div VPGD: 5 V/div Figure 23. VIN Start-up Waveform (VOUT = 5 V, RLOAD = 5 Ω, MODE = Low, VPVIN = VAVIN = VEN) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 24. VIN Shutdown Waveform (VOUT = 5 V, RLOAD = 5 Ω, MODE = Low, VPVIN = VAVIN = VEN) 12/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Typical Performance Curves – continued Time: 1 µs/div Time: 1 µs/div VOUT: 100 mV/div VOUT: 100 mV/div VSW: 5 V/div VSW: 5 V/div Figure 25. Switching Waveform (VIN = 12 V, VOUT = 5 V, IOUT = 0.1 A, L = 2.2 μH, COUT = 47 μF, MODE = Low) 2 2 VIN = 12 V 1.5 1 0.5 0 -0.5 -1 -1.5 -2 VIN = 12 V 1.5 Output Voltage Deviation [%] Output Voltage Deviation [%] Figure 26. Switching Waveform (VIN = 12 V, VOUT = 5 V, IOUT = 3.0 A, L = 2.2 μH, COUT = 47 μF, MODE = Low) 1 0.5 MODE = Low 0 MODE = High -0.5 -1 -1.5 6 7 8 9 10 11 12 13 14 15 16 17 Input Voltage : VIN [V] Figure 27. Line Regulation (VOUT = 5 V, L = 2.2 μH, IOUT = 3.0 A) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -2 0 0.5 1 1.5 2 Output Current : IOUT [A] 2.5 3 Figure 28. Load Regulation (VIN = 12 V, VOUT = 5 V, L = 2.2 μH) 13/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Function Explanations 1. Basic Operation (1) DC/DC Converter Operation BD9D300MUV is a synchronous rectifying step-down switching regulator that has original on-time control method. When the MODE pin is connected to Ground, it utilizes switching operation in Pulse Width Modulation (PWM) mode control for heavier load, and it operates in Light Load mode control at lighter load to improve efficiency. When the MODE pin is connected to the VOUTS pin, the device operates in PWM mode control regardless of the load. Efficiency [%] MODE = Low Light Load mode control PWM mode control PWM mode control MODE = High Output Current [A] Figure 29. Efficiency Image between Light Load Mode Control and PWM Mode Control (2) Enable Control The start-up and shutdown can be controlled by the EN voltage (VEN). When VEN becomes 0.9 V (Min) or more, the internal circuit is activated and the device starts up. When VEN becomes 0.3 V (Max) or less, the device is shut down. The start-up with VEN must be at the same time of the input voltage (VIN=VEN) or after supplying VIN. VIN 0V VEN VENH VENL 0V VOUT 0V Start-up Shutdown Figure 30. Start-up and Shutdown with Enable Control Timing Chart www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 1. Basic Operation – continued (3) Soft Start When VEN goes high, soft start function operates and output voltage gradually rises. This soft start function can prevent overshoot of the output voltage and excessive inrush current. The soft start time (tSS) is 1 ms (Typ) when the SS pin is left floating. A capacitor connected to the SS pin makes tSS more than 1 ms. See page 32 for how to set the soft start time. When Short Circuit Protection (SCP) is released, tSS is 1 ms (Typ) regardless of a capacitor connected to the SS pin. VIN 0V VEN 0V VOUT 0V VFBTH x 95 % 0.8 V (Typ) VFB 0V VPGD 0V tSS Figure 31. Soft Start Timing Chart (4) Power Good When the FB voltage (VFB) is more than or equal to 95 % (Typ) of 0.8 V, the built-in open drain Nch MOSFET connected to the PGD pin is off, and the PGD pin becomes Hi-Z (High impedance). When VFB is less than or equal to 90 % (Typ) of 0.8V, it turns on the built-in open drain Nch MOSFET turns on and the PGD pin is pulled down with 100 Ω (Typ). It is recommended to connect a pull-up resistor of 10 kΩ to 100 kΩ to the VOUTS pin. Table 1. PGD Output State Condition PGD Output Before Supply Input Voltage VIN < 1.6 V (Typ) Hi-Z Shutdown VEN ≤ 0.3 V (Max) Low (Pull-down) Enable VEN ≥ 0.9 V (Min) 95 % (Typ) ≤ VFB / VFBTH Hi-Z VFB / VFBTH ≤ 90 % (Typ) Low (Pull-down) UVLO 1.6 V (Typ) < VIN ≤ 3.6 V (Typ) Low (Pull-down) TSD Tj ≥ 175 °C (Typ) Low (Pull-down) OVP 120 % (Typ) ≤ VFB / VFBTH, 5.95 V (Typ) ≤ VVOUTS Low (Pull-down) SCP Complete Soft Start VFB / VFBTH ≤ 90 % (Typ) OCP 256 counts Low (Pull-down) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV (4) Power Good – continued VIN 0V VEN 0V 5.95 V (Typ) 5.65 V (Typ) VOUT 0V VFB TH x 120 % (Typ) VFB TH x 115 % (Typ) VFB TH x 95 % (Typ) VFB TH x 90 % (Typ) VFB 0V tSS VPGD < 20 μs (Typ) < 20 μs (Typ) 0V Figure 32. Power Good Timing Chart (Connecting a pull-up resistor to the PGD pin) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Function Explanations – continued 2. Protection The protection circuits are intended for prevention of damage caused by unexpected accidents. Do not use the continuous protection. (1) Over Current Protection (OCP) / Short Circuit Protection (SCP) Over Current Protection (OCP) restricts the flowing current through the Low-Side FET or High-Side FET for every switching period. If the inductor current exceeds the Low-Side OCP ILOCP = 3.8 A (Typ) while the Low-Side FET is on, the Low-Side FET remains on even with FB voltage (VFB) falls to VFBTH = 0.8 V (Typ) or less. If the inductor current becomes lower than ILOCP, the High-Side FET is able to be turned on. When the inductor current is the High-Side OCP IHOCP = 4.8 A (Typ) or more while the High-Side FET is on, it is turned off. Output voltage may decrease by changing frequency and duty due to OCP operation. Short Circuit Protection (SCP) function is a Hiccup mode. When OCP operates 256 cycles while VFB is less than or equal to 90 % (Typ) of 0.8V (VPGD = Low), the device stops the switching operation for 15 ms (Typ). After 15 ms (Typ), the device restarts. SCP does not operate during the soft start even if the device is in the SCP condition. Do not exceed the maximum junction temperature (Tjmax = 150 °C) during OCP and SCP operation. Table 2. The Operating Condition of OCP and SCP VFB Start-up OCP VEN ≤ VFBTH x 90 % (Typ) ≥ 0.9 V (Typ) > VFBTH x 95 % (Typ) ≤ VFBTH x 90 % (Typ) ≤ 0.3 V (Typ) During Soft Start Complete Soft Start - Shutdown SCP Enable Disable Enable Disable Enable Enable Disable Disable VOUT VFB VFB TH x 90 % (Typ) VFB TH x 95 % (Typ) VPGD VSW High-Side FET Inte rnal Gate Signal Low-Side FET Inte rnal Gate Signal IHOCP Inductor Current ILOCP High-Side OCP Internal Signal Low-Side OCP Internal Signal SCP Internal Signal OCP 256 counts Less than OCP 256 counts 15 ms (Typ) Figure 33. OCP and SCP Timing Chart www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 2. Protection – continued (2) Under Voltage Lockout Protection (UVLO) When input voltage (VIN) falls to 3.6 V (Typ) or less, the device is shut down. When VIN becomes 3.8 V (Typ) or more, the device starts up. The hysteresis is 200 mV (Typ). VIN (=VEN) VOUT Hysteresis VUVLOHYS = 200 mV (Typ) 3.8 V (Typ) UVLO Detect VUVLO = 3.6 V (Typ) 0V VOUT 0V tSS Figure 34. UVLO Timing Chart (3) Thermal Shutdown Protection (TSD) Thermal shutdown circuit prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating (Tjmax = 150 °C). However, if it continues exceeding the rating and the junction temperature Tj rises to 175 °C (Typ), the TSD circuit is activated and it turns the output MOSFETs off. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. The TSD threshold has a hysteresis of 25 °C (Typ). Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings. Therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. (4) Over Voltage Protection (OVP) When VFB is more than or equal to 120 % (Typ) of 0.8 V, the output MOSFETs are off. After V FB is less than or equal to 115 % (Typ) of 0.8 V, the output MOSFETs are returned to normal operation condition. In addition, when VOUTS voltage (VVOUTS) reaches 5.95 V (Typ) or more, the output MOSFETs are off. After V VOUTS falls 5.65 V (Typ) or less, the output MOSFETs are returned to normal operation condition. If the condition of the over voltage protection is continued for 20 µs (Typ), the output MOSFETs are latched to off, and it re-operates by Enable control or UVLO function. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples 1. VIN = 12 V / VOUT = 5.0 V Table 3. Specification of Application (VIN = 12 V / VOUT = 5.0 V) Symbol Specification Value Parameter Input Voltage Output Voltage Switching Frequency Maximum Output Current Operating Temperature VIN 12 V VOUT 5.0 V fOSC 1.25 MHz (Typ) IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 35. Application Circuit Part No. L1 C1 C4 C7 R0 Table 4. Recommended Component Values Value Part Name (Note 1) (VIN = 12 V / VOUT = 5.0 V) Size (mm) Manufacturer 2.2 μH FDSD0518-H-2R2M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - (Note 2) 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 270 kΩ (1 %, 1/16 W) MCR01MZPF2703 1005 ROHM R2 51 kΩ (1 %, 1/16 W) MCR01MZPF5102 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 1. VIN = 12 V / VOUT = 5.0 V – continued 100 80 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 10 Figure 36. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 37. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 38. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 20/39 Figure 39. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples – continued 2. VIN = 7.4 V / VOUT = 5.0 V Table 5. Specification of Application (VIN = 7.4 V / VOUT = 5.0 V) Symbol Specification Value Parameter Input Voltage Output Voltage Switching Frequency Maximum Output Current Operating Temperature VIN 7.4 V VOUT 5.0 V fOSC 1.25 MHz (Typ) IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 40. Application Circuit Part No. L1 C1 C4 C7 R0 Table 6. Recommended Component Values Value Part Name (Note 1) (VIN = 7.4 V / VOUT = 5.0 V) Size (mm) Manufacturer 2.2 μH FDSD0518-H-2R2M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - (Note 2) 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 270 kΩ (1 %, 1/16 W) MCR01MZPF2703 1005 ROHM R2 51 kΩ (1 %, 1/16 W) MCR01MZPF5102 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 2. VIN = 7.4 V / VOUT = 5.0 V – continued 100 80 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 10 Figure 41. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 42. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 43. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 22/39 Figure 44. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples – continued 3. VIN = 12 V / VOUT = 3.3 V Table 7. Specification of Application (VIN = 12 V / VOUT = 3.3 V) Symbol Specification Value Parameter Input Voltage Output Voltage Switching Frequency Maximum Output Current Operating Temperature VIN 12 V VOUT 3.3 V fOSC 1.25 MHz (Typ) IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 45. Application Circuit Part No. L1 C1 C4 C7 R0 Table 8. Recommended Component Values Value Part Name (Note 1) (VIN = 12 V / VOUT = 3.3 V) Size (mm) Manufacturer 2.2 μH FDSD0518-H-2R2M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - (Note 2) 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 160 kΩ (1 %, 1/16 W) MCR01MZPF1603 1005 ROHM R2 51 kΩ (1 %, 1/16 W) MCR01MZPF5102 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 3. VIN = 12 V / VOUT = 3.3 V – continued 80 100 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 10 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 Figure 46. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 47. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 48. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 24/39 Figure 49. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples – continued 4. VIN = 7.4 V / VOUT = 3.3 V Table 9. Specification of Application (VIN = 7.4 V / VOUT = 3.3 V) Symbol Specification Value Parameter Input Voltage VIN 7.4 V Output Voltage VOUT 3.3 V Switching Frequency fOSC 1.25 MHz (Typ) Maximum Output Current Operating Temperature IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 50. Application Circuit Part No. L1 C1 C4 C7 R0 Table 10. Recommended Component Values Value Part Name (Note 1) (VIN = 7.4 V / VOUT = 3.3 V) Size (mm) Manufacturer 2.2 μH FDSD0518-H-2R2M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 2) (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 160 kΩ (1 %, 1/16 W) MCR01MZPF1603 1005 ROHM R2 51 kΩ (1 %, 1/16 W) MCR01MZPF5102 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 4. VIN = 7.4 V / VOUT = 3.3 V – continued 100 80 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 10 Figure 51. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 52. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 53. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 26/39 Figure 54. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples – continued 5. VIN = 7.4 V / VOUT = 1.8 V Table 11. Specification of Application (VIN = 7.4 V / VOUT = 1.8 V) Symbol Specification Value Parameter Input Voltage VIN 7.4 V Output Voltage VOUT 1.8 V Switching Frequency fOSC 1.25 MHz (Typ) Maximum Output Current Operating Temperature IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 55. Application Circuit Part No. L1 C1 C4 C7 R0 Table 12. Recommended Component Values Value Part Name (Note 1) (VIN = 7.4 V / VOUT = 1.8 V) Size (mm) Manufacturer 1.5 μH FDSD0518-H-1R5M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 2) (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 150 kΩ (1 %, 1/16 W) MCR01MZPF1503 1005 ROHM R2 120 kΩ (1 %, 1/16 W) MCR01MZPF1203 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 5. VIN = 7.4 V / VOUT = 1.8 V – continued 100 80 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 10 Figure 56. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 57. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 58. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 28/39 Figure 59. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Application Examples – continued 6. VIN = 7.4 V / VOUT = 1.2 V Table 13. Specification of Application (VIN = 7.4 V / VOUT = 1.2 V) Symbol Specification Value Parameter Input Voltage VIN 7.4 V Output Voltage VOUT 1.2 V Switching Frequency fOSC 1.25 MHz (Typ) Maximum Output Current Operating Temperature IOUTMAX 3A Ta 25 °C BD9D300MUV VIN PGD PVIN PGD AVIN C3 C2 C1 R3 L1 C7 EN EN R0 C4 VOUTS PGND R1 SS RESERVE C9 VOUT SW MODE C5 C6 C8 FB AGND R2 Figure 60. Application Circuit Part No. L1 C1 C4 C7 R0 Table 14. Recommended Component Values Value Part Name (Note 1) (VIN = 7.4 V / VOUT = 1.2 V) Size (mm) Manufacturer 1.0 μH FDSD0518-H-1R0M 5249 Murata 10 μF (35 V / X5R) GRM21BR6YA106ME43 2012 Murata C2 - - - - C3 - - - - 47 μF (16 V / X5R) GRM31CR61C476ME44 3216 Murata C5 - - - - C6 - - - - (Note 2) (Note 3) 0.1 μF (35 V / X5R) GRM033R6YA104ME14 0603 Murata C8 - - - - C9 - - - - R1 150 kΩ (1 %, 1/16 W) MCR01MZPF1503 1005 ROHM R2 300 kΩ (1 %, 1/16 W) MCR01MZPF3003 1005 ROHM R3 100 kΩ (1 %, 1/16 W) MCR01MZPF1003 1005 ROHM Short - - - (Note 4) (Note 5) (Note 1) You agree that this is presented only as guidance for products use. Confirm on the actual equipment considering variations of the characteristics of the product and external components. (Note 2) For the capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set to a minimum value of no less than 2 μF. (Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of the output capacitor, loop response characteristics may change. Confirm on the actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. (Note 4) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor as close as possible to the PVIN pin and the PGND pin if needed. (Note 5) R0 is an option used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV 6. VIN = 7.4 V / VOUT = 1.2 V – continued 100 80 240 Gain 70 60 Gain [dB] Efficiency [%] Phase 60 80 50 40 30 20 MODE = High 0 0.001 0.01 0.1 1 Output Current : IOUT [A] 40 120 20 60 0 0 -20 MODE = Low 10 10 Figure 61. Efficiency vs Output Current -40 -60 1 10 100 Frequency [kHz] -120 1000 Figure 62. Frequency Characteristics IOUT = 2.0 A Time: 1 µs/div Time: 1 ms/div VOUT: 100 mV/div VOUT: 100 mV/div IOUT: 1 A/div VSW: 5 V/div Figure 63. Load Transient Response IOUT = 0.1 A – 2.0 A (MODE = Low) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Phase [°] 90 30/39 Figure 64. VOUT Ripple IOUT = 3.0 A (MODE = High) TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Selection of Components Externally Connected Contact us if not use the recommended component values in Application Examples. 1. Output LC Filter In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output voltage. VIN IL Inductor saturation current > IOUTMAX + ΔIL/2 L1 ΔIL VOUT Driver Maximum output current IOUTMAX COUT t Figure 65. Waveform of current through inductor Figure 66. Output LC filter circuit For example, given that VIN = 12 V, VOUT = 5.0 V, L1 = 2.2 μH, and the switching frequency fOSC = 1.25 MHz, the inductor ripple current ΔIL can be calculated as below. ∆𝐼𝐿 = 𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 1 𝑉𝐼𝑁 × 𝑓𝑂𝑆𝐶 × 𝐿1 = 1061 mA The inductance value of L1 is recommended in the range between 1.0 μH and 3.3 μH. However, ΔIL should be set 400 mA or more when using Light Load mode control by the MODE pin connecting to Ground. The rated current of the inductor (Inductor saturation current) must be larger than the sum of the maximum output current IOUTMAX and 1/2 of the inductor ripple current ΔIL. The output capacitor COUT affects the output ripple voltage characteristics. The capacitance value of COUT is recommended in the range between 22 μF and 47 μF for stability of the control loop. COUT must satisfy the required ripple voltage characteristics. The output ripple voltage ΔVRPL can be estimated by the following equation. ∆𝑉𝑅𝑃𝐿 = ∆𝐼𝐿 × (𝑅𝐸𝑆𝑅 + 1 8 × 𝐶𝑂𝑈𝑇 × 𝑓𝑂𝑆𝐶 ) [V] Where: 𝑅𝐸𝑆𝑅 is the Equivalent Series Resistance of the output capacitor. For example, given that COUT = 47 μF, and RESR = 3 mΩ, ΔVRPL can be calculated as below. ∆𝑉𝑅𝑃𝐿 = 1061 𝑚𝐴 × (3 𝑚𝛺 + 1 8 × 47 𝜇𝐹 × 1.25 𝑀𝐻𝑧 ) = 5.4 [mV] The total capacitance COUTMAX connected to VOUT needs to satisfy the value obtained by the following equation. 𝐶𝑂𝑈𝑇𝑀𝐴𝑋 < 𝑡𝑆𝑆𝑀𝐼𝑁 𝑉𝑂𝑈𝑇 × (3.1 + ∆𝐼𝐿 − 𝐼𝑂𝑈𝑇𝑆𝑆 ) [F] 2 where: 𝑡𝑆𝑆𝑀𝐼𝑁 is the minimum soft start time. 𝑉𝑂𝑈𝑇 is the output voltage. ∆IL is the inductor current. IOUTSS is the maximum output current during soft start. For example, given that VIN = 12 V, VOUT = 5.0 V, L1 = 2.2 µH, fOSC = 1.25 MHz (Typ), tSSMIN = 0.4 ms (CSS = OPEN), and IOUTSS = 3 A, COUTMAX can be calculated as below. 𝐶𝑂𝑈𝑇𝑀𝐴𝑋 < 0.4 𝑚𝑠 5.0 𝑉 × (3.1 + 1061 𝑚𝐴 2 − 3.0 𝐴) = 50.4 [μF] If the total capacitance connected to VOUT is larger than COUTMAX, over current protection may be activated by the inrush current at start-up and prevented to turn on the output. In addition, COUT affects the load transient response and stability of the control loop. Confirm it on the actual application. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Selection of Components Externally Connected – continued 2. Output Voltage Setting The output voltage value can be set by the feedback resistance ratio. For stable operation, use feedback resistance R1 of value from 100 kΩ to 300 kΩ. VOUT 𝑉𝑂𝑈𝑇 = R1 Error Amplifier 𝑅2 = FB R2 𝑅1 + 𝑅2 𝑅2 × 𝑉𝐹𝐵 [V] 𝑉𝐹𝐵 𝑉𝑂𝑈𝑇 − 𝑉𝐹𝐵 × 𝑅1 [Ω] 0.8 V (Typ) Figure 67. Feedback Resistor Circuit 3. Soft Start Capacitor (Soft Start Time Setting) The soft start time tSS depends on the value of the capacitor connected to the SS pin. tSS is 1 ms (Typ) when the SS pin is left floating. The capacitor connected to the SS pin makes tSS more than 1 ms. The tSS and CSS can be calculated using below equation. The CSS should be set in the range between 3300 pF and 0.1 μF. 𝑡𝑆𝑆 = (𝐶𝑆𝑆 × 𝑉𝑆𝑆 ) 𝐼𝑆𝑆 Where: 𝑡𝑆𝑆 is the soft start time. 𝐶𝑆𝑆 is the capacitor connected to the SS pin. 𝑉𝑆𝑆 is the SS voltage finished soft start function. 𝐼𝑆𝑆 is the soft start current. 2.5 μA (Typ) 1.2 V (Typ) x 0.95 (Typ) With CSS = 0.01 µF, tSS can be calculated as below. 𝑡𝑆𝑆 = (0.01 μF × 1.2 V ×0.95) 2.5 μA www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 = 4.56 ms 32/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV PCB Layout Design PCB layout design for DC/DC converter power supply IC is as important as the circuit design. Appropriate layout can avoid various problems caused by power supply circuit. Figure 68-a to Figure 68-c show the current path in a buck converter circuit. The Loop1 in Figure 68-a is a current path when H-side switch is ON and L-side switch is OFF and the Loop2 in Figure 68-b is when H-side switch is OFF and L-side switch is ON. The thick line in Figure 68-c shows the difference between Loop1 and Loop2. The current in thick line changes sharply each time the switching element H-side and L-side switch change from OFF to ON, and vice versa. These sharp changes induce several harmonics in the waveform. Therefore, the loop area of thick line that is consisted by input capacitor and IC should be as small as possible to minimize noise. For more detail, refer to application note of switching regulator series “PCB Layout Techniques of Buck Converter”. VIN Loop1 H-side switch VOUT L CIN COUT L-side switch GND GND Figure 68-a. Current Path when H-side Switch = ON, L-side Switch = OFF VIN CIN VOUT L H-side switch COUT Loop2 L-side switch GND GND Figure 68-b. Current Path when H-side Switch = OFF, L-side Switch = ON VIN VOUT L CIN COUT H-side FET L-side FET GND GND Figure 68-c. Difference of Current and Critical Area in Layout www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 33/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV I/O Equivalence Circuits 1.2.3. SW 4. PGD PVIN SW PGD 500 kΩ 300 kΩ 50 Ω Internal Circuit 167 kΩ 5. FB 8. MODE Internal REG Internal REG FB 10 kΩ MODE 9. SS 13. EN Internal REG EN SS 25 kΩ 20 kΩ 20 kΩ 10 kΩ 380 kΩ 14. VOUTS 35 kΩ VOUTS 10 kΩ www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 500 kΩ 34/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Operation Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND Figure 69. Example of Monolithic IC Structure N Region close-by GND 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 36/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Ordering Information B D 9 D 3 0 0 M U V Package VQFN016V3030 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN016V3030 (TOP VIEW) Part Number Marking D9D LOT Number 3 0 0 Pin 1 Mark www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 37/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Physical Dimension and Packing Information Package Name www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN016V3030 38/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 BD9D300MUV Revision History Date Revision Changes 18.Mar.2019 001 16.Sep.2021 002 New Release P4 Consist Soft Start block explanation with Japanese version. P6 Correct of Output Voltage Setting symbol error in Recommended Operating Condition P6 Correct of Output OVP Release Voltage symbol error in Electrical Characteristics P7 Correct of Figure 3 MODE setting error in Typical Performance Curves www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 39/39 TSZ02201-0F3F0AJ00260-1-2 16.Sep.2021 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001