Datasheet
7.0 V to 26.0 V Input, 1 A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9E104FJ
General Description
Key Specifications
BD9E104FJ is a synchronous buck DC/DC converter with
built-in low on-resistance power MOSFETs. High efficiency
at light load with a SLLMTM (Simple Light Load Mode). It is
most suitable for use in the equipment to reduce the
standby power is required. It is a current mode control
DC/DC converter and features high-speed transient
response. Phase compensation can also be set easily.
Features
Input Voltage Range:
7.0 V to 26.0 V
Output Voltage Range:
1.0 V to VIN x 0.5 V
Output Current:
1.0 A (Max)
Switching Frequency:
570 kHz (Typ)
High Side MOSFET ON-Resistance:250 mΩ (Typ)
Low Side MOSFET ON-Resistance: 200 mΩ (Typ)
Shutdown Current:
0 μA (Typ)
Package
SLLMTM Control (Simple Light Load Mode)
Single Synchronous Buck DC/DC converter
Over Current Protection
Short Circuit Protection
Thermal Shutdown Protection
Under Voltage Lockout Protection
Internal Soft Start
Reduce External Diode
SOP-J8 Package
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
SOP-J8
Applications
Consumer Applications such as Home Appliance
Secondary Power Supply and Adapter Equipment
Telecommunication Devices
SOP-J8
Typical Application Circuit
VIN
12V
Enable
2
VIN
BOOT
1
SW
8
BD9E104FJ
3
VOUT
EN
COMP
AGND
PGND
FB
6
4
7
5
Figure 1. Application Circuit
SLLMTM is a trademark of ROHM Co., Ltd.
〇Product structure : Silicon monolithic integrated circuit
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BD9E104FJ
Pin Configuration
(TOP VIEW)
BOOT
1
8
SW
VIN
2
7
PGND
EN
3
6
COMP
AGND
4
5
FB
8
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1
BOOT
2
VIN
Power supply pin for the switching regulator and control circuit.
Connecting a 10 µF ceramic capacitor is recommended.
3
EN
Turning this pin signal low-level (0.8 V or lower), the device is forced to be in the shutdown
mode. Turning this pin signal high-level (2.5 V or higher) enables the device. This pin must
be terminated.
4
AGND
5
FB
6
COMP
Input pin for the gm error amplifier output and the output for the PWM comparator.
Connect phase compensation components to this pin.
See page 22 for how to calculate the resistance and capacitance for phase compensation.
7
PGND
Ground pin for the output stage of the switching regulator.
8
SW
Description
Connect a bootstrap capacitor of 0.1 µF between this pin and the SW pin.
The voltage of this capacitor is the gate drive voltage of the High Side MOSFET.
Ground pin for the control circuit.
Inverting input node for the gm error amplifier.
See page 21 for how to calculate the resistance of the output voltage setting.
Switch pin. This pin is connected to the source of the High Side MOSFET and drain of the
Low Side MOSFET. Connect a bootstrap capacitor of 0.1 µF between this pin and the
BOOT pin. In addition, connect an inductor considering the direct current superimposition
characteristic.
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BD9E104FJ
Block Diagram
3V
EN
3
5V
VREG3
VREG
BOOTREG
1
BOOT
2
VIN
8
SW
7
PGND
SCP
UVLO
OSC
OVP
TSD
OCP
SLLMTM
DRIVER
LOGIC
ERR
FB
5
SLOPE
PWM
COMP
6
SOFT
START
4
AGND
Figure 3. Block Diagram
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Description of Blocks
VREG3
Block creating internal reference voltage 3 V (Typ).
VREG
Block creating internal reference voltage 5 V (Typ).
BOOTREG
Block creating gate drive voltage.
TSD
The TSD block is for thermal protection. It shuts down the device when the internal temperature of IC rises to 175 °C
(Typ) or higher. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25 °C (Typ).
UVLO
This is under voltage lockout block. It shuts down the device when the VIN pin voltage falls to 6.4V (Typ) or less. The
UVLO threshold voltage has a hysteresis of 200mV (Typ).
ERR
The ERR amplifier compares the reference voltage with the feedback voltage of the output voltage. The ERR amplifier
output voltage (the COMP pin voltage) determine the switching duty. Also, the COMP pin voltage is limited by internal
slope voltage due to soft start function during start-up.
OSC
Block generating oscillation frequency.
SLOPE
Creates delta wave from clock, generated by OSC, and sends voltage composed by current sense signal of High Side
MOSFET and delta wave to PWM comparator.
PWM
Settles the switching duty by comparing the output COMP pin voltage of ERR amplifier and signal of SLOPE block.
DRIVER LOGIC
This is DC/DC driver block. Input signal from PWM and drives MOSFET.
SOFT START
By controlling current, output voltage starts calmly preventing over shoot of output voltage and inrush current.
OCP
Current flowing in High Side MOSFET is controlled one cycle each of switching frequency when over current occurs.
SCP
When the FB pin voltage has fallen below 0.56 V (Typ) and remained there for 0.9ms (Typ), SCP stops the operation for
14.4 ms (Typ) and subsequently initiates a restart.
OVP
When the FB pin voltage exceeds 1.04 V (Typ), it turns MOSFET of output part MOSFET OFF. After output voltage
dropped, it returns to normal operation with hysteresis.
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BD9E104FJ
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Input Voltage
VIN
-0.3 to +30.0
V
EN Pin Voltage
VEN
-0.3 to +30.0
V
VBOOT
-0.3 to +35.0
V
ΔVBOOT
-0.3 to +7.0
V
VFB
-0.3 to +7.0
V
VCOMP
-0.3 to +7.0
V
VSW
-0.5 to +30.0
V
Tjmax
150
°C
Tstg
-55 to +150
°C
Voltage from GND to BOOT
Voltage from SW to BOOT
FB Pin Voltage
COMP Pin Voltage
SW Pin Voltage
Maximum Junction Temperature
Storage Temperature Range
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
SOP-J8
Junction to Ambient
θJA
149.3
76.9
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
18
11
°C/W
(Note 1) Based on JESD51-2A(Still-Air)..
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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Recommended Operating Ratings
Parameter
Input Voltage
Symbol
VIN
Rating
Unit
Min
Typ
Max
7.0
-
26.0
V
°C
Operating Temperature
Topr
-40
-
+85(Note 1)
Output Current
IOUT
-
-
1.0
A
VRANGE
1.0(Note 2)
-
VIN×0.5
V
Output Voltage Range
(Note 1) Tj must be lower than 150°C under actual operating environment.
(Note 2) Please use it in output voltage setting of which output pulse width does not become 250 ns (Typ) or less.
See the page 21 for how to calculate the resistance of the output voltage setting.
Electrical Characteristics (Unless otherwise specified Ta=25°C, VIN=12V, VEN=3V)
Limits
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Operating Supply Current
IOPR
-
250
500
µA
VFB=0.9 V
Shutdown Current
ISD
-
0
10
µA
VEN=0 V
FB Pin Voltage
VFB
0.784
0.800
0.816
V
FB Input Current
IFB
-1
0
+1
µA
Switching Frequency
fOSC
484
570
656
kHz
High Side MOSFET ON-Resistance
RONH
-
250
-
mΩ
ISW=100 mA
Low Side MOSFET ON-Resistance
RONL
-
200
-
mΩ
ISW=100 mA
Over Current limit(Note 3)
ILIMIT
2.1
2.4
2.7
A
Without switching
UVLO Threshold Voltage
VUVLO
6.1
6.4
6.7
V
VIN falling
UVLO Hysteresis Voltage
VUVLOHYS
100
200
300
mV
EN ON Threshold Voltage
VENH
2.5
-
VIN
V
EN OFF Threshold Voltage
VENL
0
-
0.8
V
EN Input Current
IEN
2
4
8
µA
Soft Start Time
tSS
1.2
2.5
5.0
ms
VFB=0.8 V
VEN=3 V
(Note 3) No tested on outgoing inspection.
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Typical Performance Curves
500
1.0
400
0.8
VIN=26 V
Shutdown Current : ISD[µA]
Operating Supply Current : IOPR[µA]
450
VIN=24 V
350
300
250
200
VIN=7 V
150
VIN=12 V
0.6
0.4
VIN=7 V
0.2
VIN=12 V
VIN=24 V
VIN=26 V
100
0.0
50
-40
-20
0
20
40
60
-40
80
-20
Temperature[℃]
0
20
40
60
80
Temperature[℃]
Figure 5. Shutdown Current vs Temperature
Figure 4. Operating Supply Current vs Temperature
0.816
10.0
=24V
VVFBIN=0.8
V
VIN=12 V
9.0
8.0
FB Input Current : IFB[µA]
FB Pin Voltage : VFB[V]
0.808
0.800
0.792
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0.784
-40
-20
0
20
40
60
80
Temperature[℃]
-20
0
20
40
60
80
Temperature[℃]
Figure 7. FB Input Current vs Temperature
Figure 6. FB Pin Voltage vs Temperature
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Typical Performance Curves - continued
656
98
Maximum Duty Ratio : DMAX[%]
Switching Frequency : fosc[kHz]
97
613
570
VIN=7 V
527
VIN=12 V
VIN=24 V
VIN=26 V
96
VIN=26 V
95
VIN=24 V
VIN=12 V
94
93
92
91
90
VIN=7 V
89
484
88
-40
-20
0
20
40
60
80
-40
-20
0
Temperature[℃]
40
60
80
Temperature[℃]
Figure 8. Switching Frequency vs Temperature
Figure 9. Maximum Duty Ratio vs Temperature
450
400
Low Side MOSFET ON-Resistance : RONL [mΩ]
High Side MOSFET ON-Resistance : R ONH[mΩ]
20
400
350
300
250
VIN=26 V
200
VIN=24 V
VIN=12 V
150
VIN=7 V
100
50
350
300
250
200
VIN=26 V
150
VIN=12 V
100
VIN=24 V
VIN=7 V
50
0
-40
-20
0
20
40
60
80
-40
Temperature[℃]
0
20
40
60
80
Temperature[℃]
Figure 11. Low Side MOSFET ON-Resistance
vs Temperature
Figure 10. High Side MOSFET ON-Resistance
vs Temperature
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Typical Performance Curves - continued
6.9
2.7
VIN=12 V
VOUT=5 V
6.8
UVLO Threshold Voltage : VUVLO[V]
Over Current Limit : ILIMIT [A]
2.6
2.5
2.4
2.3
2.2
2.1
VIN Sweep up
6.7
6.6
6.5
6.4
6.3
VIN Sweep down
6.2
6.1
-40
-20
0
20
40
60
-40
80
-20
0
20
40
60
80
Temperature[℃]
Temperature[℃]
Figure 13. UVLO Threshold Voltage vs Temperature
Figure 12. Over Current Limit vs Temperature
2.0
300
EN ON/OFF Threshold Voltage : VEN[V]
UVLO Hysteresis Voltage : VUVLOHYS[mV]
EN Sweep up
275
250
225
200
175
150
125
1.8
1.6
EN Sweep down
1.4
1.2
1.0
0.8
100
-40
-20
0
20
40
60
80
-20
0
20
40
60
80
Temperature[℃]
Temperature[℃]
Figure 14. UVLO Hysteresis Voltage vs Temperature
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Figure 15. EN ON/OFF Threshold Voltage vs Temperature
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Typical Performance Curves - continued
5.0
8.0
Soft Start Time : tss[ms]
EN Input Current : IEN[µA]
7.0
6.0
5.0
4.0
4.0
VIN=7 V
VIN=12 V
VIN=24 V
VIN=26 V
3.0
2.0
3.0
2.0
1.0
-40
-20
0
20
40
60
80
Temperature[℃]
-20
0
20
40
60
80
Temperature[℃]
Figure 17. Soft Start Time vs Temperature
Figure 16. EN Input Current vs Temperature
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Typical Performance Curves (Application)
100
100
90
90
80
80
VIN=12 V
60
VIN=18 V
50
40
VIN=24 V
30
VEN=3.0 V
VOUT=5.0 V
20
VIN=7 V
70
Efficiency : η[%]
Efficiency : η[%]
70
60
VIN=12 V
50
VIN=18 V
40
30
VEN=3.0 V
VOUT=3.3 V
20
10
10
0
0
1
10
100
1000
1
10
Output Current : IOUT[mA]
Figure 19. Efficiency vs Output Current
(VOUT=3.3 V)
2.0
2.0
1.5
1.5
Output Voltage Change : VCHANGE [%]
Output Voltgae Change : VCHANGE[%]
1000
Output Current : IOUT [mA]
Figure 18. Efficiency vs Output Current
(VOUT=5.0 V)
1.0
0.5
0.0
-0.5
-1.0
VIN=12.0 V
VOUT=5.0 V
-1.5
100
1.0
0.5
0.0
-0.5
-1.0
VOUT=5.0 V
IOUT=1.0 A
-1.5
-2.0
-2.0
0
500
1000
9
11
13
15
17
19
21
23
25
VIN Input Voltage : VIN[V]
Output Current : IOUT [mA]
Figure 21. VOUT Line Regulation
Figure 20. VOUT Load Regulation
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Typical Performance Curves (Application) - continued
VIN=10 V/div
VIN=10V /div
VEN=10 V/div
VEN=10 V/div
VOUT=2 V/div
Time=2 ms/div
Time=2 ms/div
VSW=10 V/div
VOUT=2 V/div
VSW=10 V/div
Figure 22. Start-up Waveform (VIN=VEN)
IOUT=1.0 A
Figure 23. Shutdown Waveform (VIN=VEN)
IOUT=1.0 A
VIN=10 V/div
VIN=10 V/div
VEN=10 V/div
VEN=10 V/div
VOUT=2 V/div
Time=2 ms/div
Time=2 ms/div
VOUT=2 V/div
Time=2ms/div
VSW=10 V/div
VSW=10 V/div
Figure 24. Start-up Waveform (VEN=0 V to 5 V)
IOUT=1.0 A
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Figure 25. Shutdown Waveform (VEN=5 V to 0 V)
IOUT=1.0 A
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Typical Performance Curves (Application) - continued
VOUT=50 mV/div
VOUT=50 mV/div
Time=5 µs/div
Time=2 ms/div
VSW=5 V/div
VSW=5 V/div
Figure 27. VOUT Ripple
(VIN=12 V, VOUT=5 V, IOUT=10 mA, COUT=10 µFx3)
Figure 26. VOUT Ripple
(VIN=12 V, VOUT= 5 V, IOUT=0 A, COUT=10 µFx3)
VOUT=50 mV/div
VOUT=50 mV/div
Time=5 µs/div
Time=2 µs/div
VSW=5 V/div
VSW=5V/div
Figure 28. VOUT Ripple
(VIN=12 V, VOUT=5 V, IOUT=20 mA, COUT=10 µFx3)
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Figure 29. VOUT Ripple
(VIN=12 V, VOUT=5 V, IOUT=1 A, COUT=10 µFx3)
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Typical Performance Curves (Application) - continued
VIN=50 mV/div
VIN=50 mV/div
Time=2 ms/div
Time=2 µs/div
VSW=5 V/div
VSW=5 V/div
Figure 30. VIN Ripple
(VIN=12 V, VOUT=5 V, IOUT=0 A)
Figure 31. VIN Ripple
(VIN=12 V, VOUT=5 V, IOUT=1 A)
IL=1 A/div
IL=1 A/div
Time=2 µs/div
Time=5 µs/div
VSW=5 V/div
VSW=5 V/div
Figure 32. Switching Waveform
(VIN=12 V, VOUT=5 V, IOUT=10 mA)
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Figure 33. Switching Waveform
(VIN=12 V, VOUT=5 V, IOUT=1 A)
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Typical Performance Curves (Application) - continued
Figure 34. Loop Response
(VIN=12 V, VOUT=5 V, IOUT=1 A, COUT=Ceramic10 μFx3)
VOUT=100 mV/div
Figure 35. Loop Response
(VIN=12 V, VOUT=3.3 V, IOUT=1 A, COUT=Ceramic10 μFx3)
VOUT=100 mV/div
Time=2 ms/div
Time=2 ms/div
IOUT=500 mA/div
IOUT=500 mA/div
Figure 36. Load Transient Response IOUT =0.2 A – 1 A
(VIN=12 V, VOUT=5 V, COUT=Ceramic10 μFx3)
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Figure 37. Load Transient Response IOUT =0.2 A – 1 A
(VIN=12 V, VOUT=3.3 V, COUT=Ceramic10 μFx3)
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Function Description
1.
DC/DC converter operation
BD9E104FJ is a synchronous rectifying step-down switching regulator that achieves faster transient response by
employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode
for heavier load, while it utilizes SLLMTM (Simple Light Load Mode) control for lighter load to improve efficiency.
Efficiency: η[%]
1: SLLMTM control
2: PWM control
Output Current: IOUT [A]
Figure 38. Efficiency (SLLMTM control and PWM control)
2: PWM control
1: SLLMTM control
VOUT=50 mV/div
VOUT=50 mV/div
Time=5 µs/div
Time=2 µs/div
VSW=5 V/div
VSW=5 V/div
Figure 39. SW Waveform (1: SLLMTM control)
(VIN=12 V, VOUT=5.0 V, IOUT=10 mA)
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Figure 40. SW Waveform (2: PWM control)
(VIN= 12 V, VOUT=5.0 V, IOUT=1 A)
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Function Description-continued
2.
Enable Control
The IC shutdown can be controlled by the voltage applied to the EN pin. When the EN pin voltage reaches 2.5 V (Min),
the internal circuit is activated and the IC starts up. To enable shutdown control with the EN pin, set the shutdown interval
(Low level interval of EN) must be set to 100 µs or longer.
VEN
EN pin
VENH
VENL
t
0
VOUT
Output setting voltage
VOUT×0.85
t
0
tSS
Figure 41. Timing Chart with Enable Control
3.
Protective Functions
The protective circuits are intended for prevention of damage caused by unexpected accidents.
Do not use them for continuous protective operation.
(1)
Short Circuit Protection (SCP)
The short circuit protection block compares the FB pin voltage with the internal reference voltage VREF. When the
FB pin voltage has fallen below 0.56 V (Typ) and remained there for 0.9 ms (Typ), SCP stops the operation for 14.4
ms (Typ) and subsequently initiates a restart.
Table 1. Short Circuit Protection Function
EN pin
FB pin
Short Circuit Protection
2.5 V or higher
0.30 V (Typ)< FB≤0.56 V (Typ)
Switching Frequency
0.30 V (Typ)≥FB
142.5 kHz (Typ)
Enabled
285 kHz (Typ)
FB>0.56 V (Typ)
0.8 V or lower
570 kHz (Typ)
-
Disabled
OFF
Soft Start
2.5ms (Typ)
VOUT
VOUT×0.85
SCP detection time
0.9ms (Typ)
SCP detection time
0.9ms (Typ)
0.8V
FB terminal
SCP threshold voltage：
0.56Ｖ(Typ)
SCP detection released
High Side
MOSFET Gate
LOW
Low Side
MOSFET Gate
LOW
OCP
Threshold
Coil current
IC internal
SCP signal
14.4ms (Typ)
SCP reset
Figure 42. Short Circuit Protection Function (SCP) Timing Chart
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Function Description - continued
(2)
Under Voltage Lockout Protection (UVLO)
The under voltage lockout protection circuit monitors the VIN pin voltage.
The operation enters standby when the VIN pin voltage is 6.4 V (Typ) or lower.
The operation starts when the VIN pin voltage is 6.6 V (Typ) or higher.
VIN
UVLO
ON
UVLO
OFF
hys
0V
VOUT
VOUT×0.85
Soft Start
FB
High Side
MOSFET Gate
Low Side
MOSFET Gate
Normal operation
UVLO
Normal operation
Figure 43. UVLO Timing Chart
(3)
Thermal Shutdown Function (TSD)
This is the thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within
the IC’s power dissipation rating. However, if the rating is exceeded for a continued period and the junction
temperature (Tj) rises to 175 °C (Typ) or more, the TSD circuit will operate and turn OFF the output MOSFET. When
the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD
circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances,
should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage.
(4)
Over Current Protection Function (OCP)
The Over Current Protection Function observes the current flowing in High side MOSFET by switching cycle and
when it detects over flow current, it limits ON duty and protects by dropping output voltage.
(5)
Over Voltage Protection Function (OVP)
Over Voltage Protection Function (OVP) compares the FB pin voltage with internal reference voltage VREF and
when the FB pin voltage exceeds 1.04 V (Typ), the OVP function turns off the output MOSFET. When the output
voltage drops, the device returns to normal operation with hysteresis.
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Application Example
C3
L
COUT
1
BOOT
2
VIN
SW
8
PGND
7
VOUT
VIN
BD9E104FJ
C1
3
EN
4
AGND
R1
C4
COMP
6
FB
5
CFB
R4
R2
C2
R3
Figure 44. Application Circuit
Table 2. Recommendation Circuit Constants
VIN
VOUT
C1(Note 1)
C2(Note 2)
C3(Note 3)
L
R1
R2
R3
R4
CFB
C4
COUT(Note 4)
5V
10 μF
0.1 μF
0.1 μF
6.8 μH
0Ω
430 kΩ
82 kΩ
82 kΩ
12 pF
390 pF
12 V
3.3 V
10 μF
0.1 μF
0.1 μF
6.8 μH
0Ω
470 kΩ
150 kΩ
56 kΩ
12 pF
470 pF
24 V
12 V
10 μF
0.1 μF
0.1 μF
22 μH
20 kΩ
120 kΩ
10 kΩ
240 kΩ
33 pF
2200 pF
Ceramic
10 μF×3
Ceramic
10 μF×3
Ceramic
10 μF×3
(Note 1) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value no less
than 4.7 μF.
(Note 2) In order to reduce the influence of high frequency noise, arrange the 0.1 μF ceramic capacitor as close as possible to the VIN pin.
(Note 3) Connect a 0.1 μF bootstrap capacitor between the SW pin and the BOOT pin.
(Note 4) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of output capacitor, crossover frequency may
fluctuate. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. Also, please use ceramic type capacitors for
output capacitor.
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Selection of Components Externally Connected
About the application except the recommendation, please contact us.
1.
Output LC Filter
The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the
load. In BD9E104FJ, IL ripple current flowing through the inductor is returned to the IC for SLLMTM control. Use an
inductor having the recommended value because the feedback ripple current to the IC is designed to operate optimally
when the inductance is the recommended value.
VIN
IL
Inductor saturation current > IOUTMAX + ΔIL /2
IOUT
ΔIL
L
VOUT
Driver
Average inductor current
COUT
t
Figure 45. Waveform of Current through Inductor
Figure 46. Output LC Filter Circuit
Computation with VIN=12 V, VOUT=5 V, L=6.8 µH, and switching frequency fOSC=570 kHz, the method is as below.
Inductor ripple current
ΔIL = VOUT × (VIN - VOUT) ×
1
= 752 [mA]
VIN × fOSC × L
Also for saturation current of inductor, select the one with larger current than the total of maximum output current and 1/2
of inductor ripple current ∆IL
Output capacitor COUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple
voltage characteristics are satisfied.
Output ripple voltage can be expressed in the following method.
ΔVRPL ΔIL × (RESR
1
8 × COUT × FOSC
)
[V]
RESR is the serial equivalent series resistance here.
With COUT=30 µF, RESR=10 mΩ the output ripple voltage is calculated as below.
ΔVRPL = 0.75 × (10 m +
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1
) = 13 [mV]
8 × 30 × 570 k
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Selection of Components Externally Connected - continued
*Be careful of total capacitance value, when additional capacitor CLOAD is connected to output capacitor COUT.
Use maximum additional capacitor CLOAD (Max) condition which satisfies the following method.
Maximum starting inductor ripple current IL_START
<
Over current limit 2.1 A (Min)
Maximum starting inductor ripple current IL_START can be expressed in the following method.
IL_START =
Maximum starting output current (IOUTMAX) +
Charge current to output capacitor(ICAP) +
∆IL
2
Charge current to output capacitor ICAP can be expressed in the following method.
ICAP =
(COUT + CLOAD) × VOUT
tSS
[A]
Computation with VIN=12 V, VOUT=5 V, L=6.8 µH, IOUTMAX=1 A (Max), switching frequency fOSC=484 kHz (Min), Output
capacitor COUT=30 µF, Soft Start Time tSS=1.2 ms (Min), the method is as below.
CLOAD (Max) ≤
(2.1 - IOUTMAX VOUT
ΔIL
) × tSS
2
- COUT 127
[µF]
Confirm maximum starting inductor ripple current less than 2.1 A on actual equipment.
2.
Output Voltage Set Point
The output voltage value can be set by the feedback resistance ratio.
VOUT
V OUT =
[V]
*Minimum pulse is 250 ns for BD9E104FJ.
Use input/output condition which satisfies the following
method.
R1
VOUT
250ns
1.75
VIN
R2
FB
R3
R1 + R 2 + R3
× 0.8
R3
[µs]
ERR
0.8V
Figure 47. Feedback Resistor Circuit
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Selection of Components Externally Connected - continued
3.
Phase Compensation
A current mode control buck DC/DC converter is a two-pole, one-zero system. Two-pole formed by an error amplifier and
load and one zero point added by phase compensation. The phase compensation resistor R 4 determines the crossover
frequency fCRS where the total loop gain of the DC/DC converter is 0 dB. High value for this crossover frequency fCRS
provides a good load transient response characteristic but inferior stability. Conversely, specifying a low value for the
crossover frequency fCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired.
(1)
Selection of Phase Compensation Resistor R4
The phase compensation resistance R4 can be determined by using the following equation.
R4
2 VOUT fCRS COUT
VFB GMP GMA
[Ω]
Where:
VOUT is the output voltage (5 V (Typ))
fCRS is the crossover frequency [Hz]
COUT is the output capacitance [F]
VFB is the feedback reference voltage (0.8 V (Typ))
GMP is the current sense gain (7 A/V (Typ))
GMA is the error amplifier transconductance (82 µA/V (Typ))
(2)
Selection of phase compensation capacitance C4
For stable operation of the DC/DC converter, inserting a zero point at 1/6 of the zero crossover frequency cancels
the phase delay due to the pole formed by the load often provides favorable characteristics.
The phase compensation capacitance C4 can be determined by using the following equation.
C4
Where:
(3)
1
2 R4 fZ
[F]
fZ is Zero point inserted
Loop stability
In order to ensure stability of DC/DC converter, confirm there is enough phase margin on actual equipment. Under
the worst condition, it is recommended to ensure phase margin is 45° or more. The feed forward capacitor CFB is
used for the purpose of forming a zero point together with the resistor R1 and R2 to increase the phase margin
within the limited frequency range.
VOUT
R1
A
CFB
(a)
Gain [dB]
GBW(b)
【dB】
R2
0
Phase[deg]
FB
－90
ERR
0.8V
－90°
PHASE MARGIN
C4 Phase
R3
f
fCRS
0
－180°
－180
【°】
f
R4
Figure 48. Phase Compensation Circuit
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BD9E104FJ
PCB Layout Design
PCB layout design for DC/DC converter power supply IC is as important as the circuit design. Appropriate layout can avoid
various problems caused by power supply circuit. Figure 50-a to 50-c show the current path in a buck DC/DC converter
circuit. The Loop1 in Figure 50-a is a current path when High Side switch is ON and Low Side switch is OFF, the Loop2 in
Figure 50-b is when High Side switch is OFF and Low Side switch is ON. The thick line in Figure 50-c shows the difference
between Loop1 and Loop2. The current in thick line changes sharply each time the switching element High Side and Low
Side switch change from OFF to ON, and vice versa. These sharp changes induce several harmonics in the waveform.
Therefore, the loop area of thick line that is consisted by input capacitor and IC should be as small as possible to minimize
noise. For more detail, refer to application note of switching regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
VOUT
L
CIN
High Side switch
COUT
Low Side switch
GND
GND
Figure 50-a. Current path when High Side switch = ON, Low Side switch = OFF
VIN
VOUT
L
CIN
High Side switch
COUT
Loop2
Low Side switch
GND
GND
Figure 50-b. Current Path when High Side switch = OFF, Low Side switch = ON
VIN
VOUT
L
CIN High Side FET
COUT
Low Side FET
GND
GND
Figure 50-c. Difference of Current and Critical Area in Layout
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PCB Layout Design - continued
Accordingly, design the PCB layout with particular attention paid to the following points.
Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation
from the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil as thick
and short as possible.
Provide lines connected to the FB pin and the COMP pin as far from the SW node.
Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the
input.
Top Layer
Bottom Layer
Figure 51. Example of Sample Board Layout Pattern
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I/O Equivalence Circuit
1. BOOT 8. SW
3. EN
BOOTREG
EN
BOOT
VIN
AGND
PGND
SW
VREG
AGND
AGND
AGND
AGND
PGND
5. FB
6. COMP
VREG
VREG
FB
COMP
AGND
AGND
AGND
AGND
Figure 52. I/O Equivalence Circuit
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 53. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD9E104FJ
Ordering Information
B
D
9
E
1
Part Number
0
4
F
J
Package
FJ:SOP-J8
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8(TOP VIEW)
Part Number Marking
9 E 1 0 4
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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SOP-J8
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BD9E104FJ
Revision History
Date
Revision
11.Dec.2017
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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