BD9E151ANUX-TR

Datasheet 6 V to 28 V, 1.2 A 1ch Step-Down Switching Regulator Integrated Power MOSFET BD9E151ANUX General Description Key Specifications BD9E151ANUX is diode-rectification buck converter of high input voltage 28 V with integrated Power MOSFET. Because of diode-rectification, a pulse skips in light load automatically and it maintains high efficiency. In addition, it is available for battery powered application because supply current is small with 0 uA at shutdown. It can easily make a small power supply with the external parts of the wide range, because the use of ceramic capacitor is possible, and because it has high speed road response by current mode control and has the external setting phase compensation.     Input Voltage Range: 6 V to 28 V Reference Voltage Precision (Ta = 25 °C):1 V ± 1.0 % Max Output Current: 1.2 A (Max) Operating Temperature Range: -40 °C to +85 °C Package W (Typ) x D (Typ) x H (Max) 2.0 mm x 3.0 mm x 0.6 mm VSON008X2030 Features Wide Input Range (VIN = 6 V to 28 V) 30 V / 80 mΩ Integrated Power MOSFET 600 kHz (Typ) High Frequency Operation Built in Reference Voltage (1.0 V ± 1.0 %) Built in Over Current Protection (OCP), Under Voltage Lockout (UVLO), Over Voltage Protection (OVP), Thermal Shutdown (TSD)  Stand-by mode (IIN = 0 μA)  VSON008X2030 Small Package      Applications  Surveillance Camera Applications  Consumer 12 V, 24 V BUS-Line Systems  OA Applications Typical Application Circuit CBSTC:BST 0.1: 0.1μF μF 1 CVINC:VIN 10: 10μF/35V μF / 35 V VIN ON/OFF control BST LX L:L:15 μH 15μH 8 Cout :: OUT 47μF/16V 47 μF / 16 V D1 2 3 4 VIN GND EN VC SS FB 7 6 5 R1: kΩ R1: 12 12kΩ C1: 10000 pF C1: 10000pF R3: 2.7kΩ 2.7 kΩ R3: CSS : 0.047μF CSS : 0.047 μF 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 VOUT R2: kΩ R2: 33kΩ 〇This product has no designed protection against radioactive rays. 1/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Pin Configuration (TOP VIEW) BST 1 VIN 2 8 Lx LX 7 GND EXP-PAD EN 3 6 VC SS 4 5 FB Pin Descriptions Pin No. Pin Name 1 BST Bootstrap Capacitor Connecting Pin Function 2 VIN Input Supply Pin 3 EN EN Pin 4 SS Soft Start Setting Pin 5 FB Feedback Input Pin 6 VC Error AMP Output Pin 7 GND 8 LX - EXP-PAD Ground Switching Pin The EXP-PAD connect to GND Block Diagram ON/OFF EN VIN TSD UVLO Reference VREF REG Current Sense AMP shutdown FB 1.0 V SS + + BST Current Comparator Error AMP Σ + 80 mΩ R　　Q S　　 　 VOUT LX Soft Start GND Oscillator VC www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Description of Blocks 1. Reference This block generates reference voltage. It starts operation by EN pin High. It provides reference voltage to error amplifier reference voltage 1.0 V (Typ), reference of oscillator, and etc. 2. REG This is a gate drive and regulator for internal circuit power supply. 3. Oscillator This is an oscillation circuit with operation frequency fixed to 600 kHz (Typ). 4. Soft Start This is a circuit that gently raises the output voltage of the DC / DC converter to prevent in-rush current during start-up. Soft start time is determined by the capacitor connected to SS pin and SS pin charge current. 5. Error AMP This is an error amplifier circuit that detects the output signal, and outputs PWM control signal. Internal reference voltage is set to 1.0 V (Typ). 6. OVP Output voltage is monitored with the FB pin, and output FET is turned off when it becomes 110 % or more of setting value. When the output voltage becomes 105 % or less, it makes possible to turn on FET again. 7. Current Comparator This is comparator that outputs PWM signal from current feed-back and error amp output for current mode. 8. OCP Current flowing FET is monitored, and output FET is turned off when it detects over current 2.2 A (Typ). When over current is detected for two consecutive cycles, the device is turned off with latch. Then the SS pin voltage and VC pin voltage is reset, and the device is automatically restarted when the SS pin voltage reaches 0.1 V. 9. Power MOSFET This is power MOSFET with maximum voltage 30 V and on-resistance 80 mΩ. It should be used within 1.6 A including ripple current of inductor because the current limiting of power MOSFET is 1.6 A. 10. UVLO This is a low voltage error prevention circuit. This prevents internal circuit error during increase and decrease of power supply voltage. VIN pin voltage is monitored, and it turns off output FET and resets Soft Start circuit when VIN voltage becomes UVLO detect threshold or less. UVLO detect threshold has hysteresis. 11. TSD This is over thermal protection circuit. When it detects the temperature exceeding maximum junction temperature (Tjmax = 150 °C), it turns off the output FET, and resets Soft Start circuit. When the temperature decreased, It has hysteresis and the device is automatically restarted. 12. EN When Voltage 2.4 V or more is supplied to this pin, it turns on. When open or voltage 0.8V or less is supplied, it turns off. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Absolute Maximum Ratings (Ta = 25 °C) Parameter Supply Voltage BST – GND Symbol Rating Unit VIN 30 V VBST 37 V BST – LX ∆VBST 7 V EN – GND VEN 30 V LX – GND VLX 30 V FB – GND VFB 7 V VC – GND VVC 7 V SS – GND VSS 7 V Power MOSFET Current IDH 1.6 A Tjmax 150 °C Tstg -55 to +125 °C Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 308.3 69.6 °C/W ΨJT 43 10 °C/W VSON008X2030 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. The arrangement should follow to land patterns. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Supply Voltage VIN 6 - V Output Voltage VOUT (Note 6) 28 VIN x 0.7 or VIN – 5 1.0 - V (Note 7) Output Current IOUT - - 1.2 A Operating Temperature Topr -40 +25 +85 °C (Note 6) Restricted by minimum on pulse typ. 100 nsec. (Note 7) Restricted by BSTUVLO or Max Duty Cycle (ref. p.14). Please set value of the low one for the maximum. Electrical Characteristics (Unless otherwise specified VIN = 12 V, VOUT = 5 V, EN = 5 V, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions Stand-by Current of VIN IST - 0 10 μA VEN = 0 V Operating Circuit Current of VIN IIN - 0.8 1.6 mA VFB = 1.5 V VIN rising Circuit Current Undervoltage Lockedout Reset Threshold Voltage Hysteresis Width VUV 5.0 5.4 5.8 V VUVHY - 200 400 mV Oscillator Oscillating Frequency fSW 540 600 660 kHz DMAX 85 91 - % VFBTH 0.990 1.000 1.010 V IFB -1.0 0 1.0 μA DC Gain AVEA - 600 6000 V/V Transconductance GEA - 250 500 μA/V GCS - 10 20 A/V RONH - 80 160 mΩ IOCP 1.6 2.2 - A ON VENON 2.4 - VIN V OFF VENOFF -0.3 - 0.8 V Ta = -40 °C to +85 °C VIN = 6 V to 28 V IEN 6.0 7.0 15.0 μA VEN = 5 V ISS 1 2 4 μA Max Duty Cycle Error AMP FB Threshold Voltage FB Input Current VFB = 0 V IVC = ±10 μA, VVC = 1.0 V Current Sense Amplifier Transconductance Output High-Side Power MOSFET ON Resistance High-Side Over Current Detect Current CTL EN Threshold Voltage EN Input Current SOFT START Charge Current www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Performance Curves (Unless otherwise specified VIN = 12 V, VOUT = 5 V, EN = 5 V, Ta = 25 °C) 2.0 Input Circuit Current : IIN[mA] Input Circuit Current : IIN[mA] 2.0 1.6 1.2 0.8 0.4 0.0 1.2 0.8 0.4 0.0 6 8 10 12 14 16 18 20 22 24 26 28 Input Voltage : VIN[V] -40 Figure 1. Input Circuit Current vs Input Voltage -15 10 35 60 Ambient Temperature : Ta[ºC] 85 Figure 2. Input Circuit Current vs Ambient Temperature 640 6.0 Oscilating Frequency : fSW [kHz] UVLO Threshold : VUV,VUV-VUVHY[V] 1.6 VUV 5.6 5.2 VUV - VUVHY 4.8 4.4 4.0 -40 -15 10 35 60 Ambient Temperature : Ta[ºC] 620 610 600 590 580 570 560 550 540 85 -40 Figure 3. UVLO Threshold vs Ambient Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 630 -15 10 35 60 Ambient Temperature : Ta[ºC] 85 Figure 4. Oscillating Frequency vs Ambient Temperature 6/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Performance Curves – Continued (Unless otherwise specified VIN = 12 V, VOUT = 5 V, EN = 5 V, Ta = 25 °C) 100 FB Threshold Voltage : VTHFB[V] 1.020 Max Duty : DMAX[%] 96 92 88 84 1.010 1.005 1.000 0.995 0.990 0.985 0.980 80 -40 -15 10 35 60 Ambient Temperature : Ta[ºC] 6 8 10 12 14 16 18 20 22 24 26 28 Input Voltage : VIN[V] 85 Figure 6. FB Threshold Voltage vs Input Voltage Figure 5. Max Duty vs Ambient Temperature 1.020 60 1.015 40 VC Current : IVC[μA] FB Threshold Voltage : VTHFB[V] 1.015 1.010 1.005 1.000 0.995 0.990 20 0 -20 -40 0.985 0.980 -60 -40 -15 10 35 60 85 Ambient Temperature : Ta[ºC] 0 Figure 7. FB Threshold Voltage vs Ambient Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.4 0.8 1.2 1.6 FB Voltage : VFB[V] 2 Figure 8. VC current vs FB Voltage 7/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Performance Curves – Continued (Unless otherwise specified VIN = 12 V, VOUT = 5 V, EN = 5 V, Ta = 25 °C) 160 High-side FET Ron : RONH[Ω] SS Charge Current : ISS[μA] 4.0 3.2 2.4 1.6 0.8 0.0 120 100 80 60 40 20 0 -40 -15 10 35 60 Ambient Temperature : Ta[ºC] 85 -40 Figure 9. SS Charge Current vs Ambient Temperature -15 10 35 60 Ambient Temperature : Ta[ºC] 85 Figure 10. High-Side FET Ron vs Ambient Temperature 4.0 2.0 EN Threshold Voltage : VENON[V] OCP Detect Current : IOCP[A] 140 3.2 2.4 1.6 0.8 1.8 1.6 1.4 1.2 1.0 0.0 -40 -15 10 35 60 Ambient Temperature : Ta[ºC] -40 85 85 Figure 12. EN Threshold Voltage vs Ambient Temperature Figure 11. OCP Detect Current vs Ambient Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -15 10 35 60 Ambient Temperature : Ta[ºC] 8/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Application VIN = 12 V, VOUT = 5 V, IOUT = 1 A CBST 0.1: 0.1μF μF C:BST 1 CVINC:VIN 10: 10μF/35V μF / 35 V VIN LX L:L:15 μH 15μH 8 4 VIN GND EN VC SS FB VOUT OUT Cout :: 47μF/16V 47 μF / 16 V D1 2 3 ON/OFF control BST 7 6 R1: kΩ R1: 12 12kΩ C1: 10000 pF C1: 10000pF 5 R3: 2.7kΩ 2.7 kΩ R3: CSS : 0.047μF CSS : 0.047 μF R2: kΩ R2: 33kΩ Figure 13. Typical Application Schematic (VOUT = 5 V) When use in VIN < 7 V is assumed, it is recommended to add to pull-down resistance of about 1 kΩ to VOUT as shown above. 100 100 90 90 80 80 70 VIN=8 V 60 50 Efficiency[%] Efficiency[%] 70 VIN=12 V 40 VIN=25 V IOUT=100 mA 50 40 30 30 20 20 10 10 0 IOUT=1 A 60 IOUT=10 mA 0 1 10 100 1000 Output Current IOUT[mA] 10000 0 Figure 14. Efficiency vs Output Current 5 10 15 20 Input Voltage VIN[V] 25 30 Figure 15. Efficiency vs Input Voltage Iout [1 A/div] EN [10 V/div] Overshoot = 268 mV LX [10 V/div] Vout [0.1 V/div] VOUT [2 V/div] Undershoot = 305 mV IOUT [0.2 A/div] 10 ms/div Figure 16. Start-up Waveform www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1 ms/div Figure 17. Load Transient Characteristic 9/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Application – Continued Phase Gain Figure 18. Frequency Characteristic (IOUT = 1 A) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Typical Application – Continued Application Parts List 1 (VIN = 12 V, VOUT = 5 V, IOUT = 1 A) Symbol [Capacitor] CVIN CSS C1 CBST COUT [Resistor] R3 R4 R5 [Diode] D [Inductor] L Value Parts name Company 10 μF / 35 V 0.047 μF / 25 V 10000 pF / 25 V 0.1 μF / 10 V 47 μF / 16 V GRM21BR6YA106KE43 GRM155R71E473JA88 GRM033B31E103KA12 GRM033B31A104ME84 GRM32EC81C476KE15 MURATA MURATA MURATA MURATA MURATA 2.7 kΩ 12 kΩ 3 kΩ MCR03 series MCR03 series MCR03 series ROHM ROHM ROHM - RSX201VAM-30 ROHM 15 μH NRS6045T150 TAIYO YUDEN Application Parts List 2 (When load current is light and total area is important) (VIN = 12 V, VOUT = 5 V, IOU T = 300 mA) Symbol [Capacitor] CVIN CSS C1 CBST COUT [Resistor] R3 R4 R5 [Diode] D [Inductor] L Value Parts name Company 10 μF / 25 V 0.047 uF / 25 V 22000 pF / 25 V 0.1 μF / 10 V 22 μF / 10 V GRM188R61E106MA73 GRM155R71E473JA88 GRM155R71H223JA61 GRM033B31A104ME84 GRM31CR71A226ME15 MURATA MURATA MURATA MURATA MURATA 2.2 kΩ 12 kΩ 3 kΩ MCR006 series MCR006 series MCR006 series ROHM ROHM ROHM - RSX201VAM-30 ROHM 15 μH DEM3518C series MURATA www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Selection of External Application Components (1) Inductor Shield type that meets the current rating (current value from the IPEAK below), with low DCR (direct current resistance element) is recommended. The value of inductor has an effect in the inductor ripple current which causes the output ripple. In the same formula below, this ripple current can be made small with a large value L of inductor or as high as the switching frequency. 𝐼𝑃𝐸𝐴𝐾 = 𝐼𝑂𝑈𝑇 + ∆𝐼𝐿 = 𝑉𝐼𝑁−𝑉𝑂𝑈𝑇 𝐿 ∆𝐼𝐿 (1) 2 × ΔIL 𝑉𝑂𝑈𝑇 𝑉𝐼𝑁 ×𝑓 1 Figure 19. Inductor Current (2) 𝑆𝑊 (∆IL: Output ripple current, VIN: Input voltage, fSW: Switching frequency) For design value of inductor ripple , please carry out design tentatively with about 20 % to 50 % of maximum output current. (2) Output Capacitor It is recommended a ceramic capacitor of low ESR for reducing output ripple. Also, for capacitor rating, please use a capacitor that maximum rating has sufficient margin to the output voltage with taking into consideration the DC bias characteristics. Output ripple voltage is determined by following formula. 𝑉𝑃𝑃 = ∆𝐼𝐿 × 2𝜋×𝑓 1 𝑆𝑊 ×𝐶𝑂𝑈𝑇 + ∆𝐼𝐿 × 𝑅𝐸𝑆𝑅 (3) Please set the value within allowable ripple voltage. It is recommended a ceramic capacitor 10 μF or more. VOUT (3) Output Voltage Setting Error AMP internal reference voltage is 1.0 V. Output voltage is determined by following formula. 𝑉𝑂𝑈𝑇 = 𝑅1+𝑅2 𝑅2 × 𝑉𝑅𝐸𝐹 FB (4) R2 (4) Bootstrap Capacitor Please connect ceramic capacitor from 0.047 µF to 0.47 µF between BST pin and LX pin. Because the rating between BST pin and LX pin becomes 7 V, it is recommended the proof pressure 10 V or more. VREF 1.0 V Figure 20. Output Voltage Setting (5) Soft Start Function BD9E151ANUX is not built in setting of soft start time. It is necessary to set it by external capacitor CSS between SS pin and GND to prevent rush current in the start-up. BD9E151ANUX has the internal current source of 2 μA as charging current. Soft start time (10 % to 90 %) is determined by following formula. The ISS current is 2 uA. 𝑇𝑆𝑆 = Error AMP R1 2 μA 2uA ERROR AMP SS Css 𝐶𝑆𝑆 ×0.8 (5) 𝐼𝑆𝑆 Figure 21. Soft Start Time Setting (6) Catch Diode BD9E151ANUX needs to connect an external catch diode between LX and GND. It is necessary for the diode to choose to satisfy absolute maximum ratings of the application. The reverse voltage must be higher than the maximum voltage (VINMAX + 0.5 V) of the LX pin. The peak current needs to be larger than IOUTMAX + ∆IL. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Selection of External Application Components – Continued (7) Input Capacitor BD9E151ANUX needs an input decoupling capacitor. It is recommended a low ESR ceramic capacitor of 10 uF or more. The capacitor is selected considering DC bias effect and temperature characteristic. Please place this capacitor as possible as close to the VIN pin. The input ripple voltage is estimated by following formula. ∆𝑉𝐼𝑁 = 𝑓 𝐼𝑂𝑈𝑇 𝑆𝑊 ×𝐶𝑉𝐼𝑁 × 𝑉𝑂𝑈𝑇 𝑉𝐼𝑁 × (1 − 𝑉𝑂𝑈𝑇 𝑉𝐼𝑁 ) (6) CVIN is input capacitor value It is necessary to confirm RMS ripple current. The RMS current is estimated by following formula. 𝑉 𝑂𝑈𝑇 𝐼𝐶𝑉𝐼𝑁 = 𝐼𝑂𝑈𝑇 × √ 𝑉𝐼𝑁 × (1 − 𝑉𝑂𝑈𝑇 𝑉𝐼𝑁 ) (7) ICVIN has maximum value when VIN = 2 × VOUT. The value is estimated by following formula. 𝐼𝐶𝑉𝐼𝑁𝑀𝐴𝑋 = 𝐼𝑂𝑈𝑇 (8) 2 (8) About Adjustment of DC/DC Converter Frequency Characteristic CBST 1 BST LX L 8 VOUT COUT D1 CVIN 2 VIN 3 ON/OFF control 4 VIN GND EN VC SS FB 7 6 5 C1 R1 C2 R3 CSS R2 Figure 22. Role of Phase Compensation element Stability and responsiveness of loop are controlled through the VC pin which is the output of Error AMP. The characteristic of zero and pole that determines stability and responsiveness is adjusted by the combination of resistor and capacitor that are connected in series to the VC pin. (C1, C2, R3) DC gain of voltage return loop can be calculated by following formula. 𝑉 𝐴𝑑𝑐 = 𝑅𝑙 × 𝐺𝐶𝑆 × 𝐴𝐸𝐴 × 𝑉 𝐹𝐵 (9) 𝑂𝑈𝑇 VFB is feedback voltage (Typ: 1.0 V). AEA is voltage gain of Error AMP (Typ: 60 dB). GCS is transconductance of current detect (Typ: 10 A/V). Rl is output load resistance value. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Selection of External Application Components – Continued There are 2 poles in the control loop of BD9E151ANUX. The first occurs with through the output resistance of phase compensation capacitor (C1). The other one occurs with through the output capacitor and load resistance. These poles appear at the following frequency. 𝐺 𝐸𝐴 𝑓𝑃1 = 2𝜋×𝐶1×𝐴 (10) 𝐸𝐴 𝑓𝑃2 = 2𝜋×𝐶 1 (11) 𝑂𝑈𝑇 ×𝑅𝑙 where: GEA is the transconductance of Error AMP (Typ: 250 μA/V). This control loop has a zero. The zero which occurs by phase compensation capacitor C1 and phase compensation resistance R3 appears at the following frequency. 1 𝑓𝑍1 = 2𝜋×𝐶1×𝑅3 (12) Also, if output capacitor is large, and that ESR (RESR) is large, it has additional zero (ESR zero). This ESR zero occurs by ESR of output capacitor and capacitance, and exists at the following frequency. 1 𝑓𝑍𝐸𝑆𝑅 = 2𝜋×𝐶 (ESR Zero) 𝑂𝑈𝑇 ×𝑅𝐸𝑆𝑅 (13) In this case, the 3rd pole that determined with the 2nd phase compensation capacitor (C2 is the capacitor between VC and GND) and phase correction resistance (R3) is used to correct the effect of ESR zero in the loop gain. This pole exists at the following frequency. 1 𝑓𝑃3 = 2𝜋×𝐶2×𝑅3 (Pole that corrects ESR Zero) (14) The target of phase compensation design is to have the necessary band width and phase margin. Cross-over frequency (band width: fC) is set so that loop gain of return loop becomes zero. When cross-over frequency becomes low, power supply fluctuation response and load response become worse. When cross-over frequency becomes high, phase margin of the loop decreases. To have the phase margin, cross-over frequency needs to set 1/20 of switching frequency or less. Setting method of phase compensation value is shown below. 1. Phase compensation resistor (R3) matching the desired cross-over frequency is selected. R3 is calculated using the following formula. 𝑅3 = 2. 2𝜋×𝐶𝑂𝑈𝑇 ×𝑓𝐶 𝐺𝐸𝐴 ×𝐺𝐶𝑆 × 𝑉𝑂𝑈𝑇 (15) 𝑉𝐹𝐵 Phase compensation capacitor (C1) is selected. It has enough phase margin by matching zero of compensation to 1/4 or less of the cross-over frequency. C1 is calculated using the following formula. 4 𝐶1 > 2𝜋×𝑅3×𝑓 (16) 𝐶 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Selection of External Application Components – Continued 3. This is considered if the 2nd phase compensation capacitor C2 is need. If the ESR zero of output capacitor smaller than half of the switching frequency, the 2nd phase compensation capacitor is necessary. In other words, it is the case that the following formula holds. 1 2𝜋×𝐶𝑂𝑈𝑇 ×𝑅𝐸𝑆𝑅 < 𝑓𝑆𝑊 (17) 2 In this case, add the second phase compensation capacitor C2, and match the frequency of the third pole to the Frequency fp3 of ESR zero. 𝐶2 = 𝐶𝑂𝑈𝑇 ×𝑅𝐸𝑆𝑅 (18) 𝑅3 Output Voltage Restriction BD9E151ANUX have a function of BSTUVLO to prevent malfunction at low voltage between BST and LX. Therefore OUTPUT voltage is restricted by BSTUVLO and Max Duty Cycle (Min 85 %). 1. 5.5 V 5.5V Restriction by BSTUVLO When the voltage between BST and LX is lower than 2.5 V, High-Side FET will be made turned off and the charge will provide from VIN to BST directly to reset BSTUVLO (Path 1). The below formula is needed to be satisfied to reset BSTUVLO. 𝑉𝐼𝑁 ≥ 𝑉𝑂𝑈𝑇 + 𝑉𝐹𝐵𝑂𝑂𝑇 + 𝑉𝐵𝑆𝑇𝑈𝑉_𝑅𝑆𝑇 BST BSTUVLO (19) Here, BSTUVLO reset: BSTUVLO reset voltage, VF: the diode forward bias voltage between VIN and BST Considering the fluctuation of BSTUVLO reset voltage and VFBOOT, maximum voltage is less than 5 V. Therefore maximum output voltage is defined as VIN – 5 V. 2. Path 1 VIN LX Figure 23. BST charge pass Restriction by Max Duty Cycle Maximum output voltage is restricted by Max Duty Cycle (Min 85 %).In this time it is needed to consider the effect of NchFET Ron, OUTPUT current and forward voltage of SBD. OUTPUT voltage can be calculated using the following formula. 𝑉𝑂𝑈𝑇_𝑀𝐴𝑋 = (𝑉𝐼𝑁 − 𝑅𝑂𝑁𝐻 × 𝐼𝑂𝑈𝑇 ) × 0.85 − 𝑉𝐹 × 0.15 (20) Therefore maximum output voltage is defined as VIN × 0.7. Considering above restriction, adopt the lower voltage as maximum output voltage. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Cautions on PCB Layout TOP side Ground Area OUTPUT Capacitor VOUT Catch Diode LX VCC SoftStart Capacitor Thermal VIA Signal VIA Figure 24. Reference PCB layout Layout is a critical portion of good power supply design. There are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help eliminate these problems, the VIN pin should be bypassed to ground with a low ESR ceramic bypass capacitor with B dielectric. Care should be taken to minimize the loop area formed by the bypass capacitor connections, the VIN pin, and the anode of the catch diode. In the BD9E151ANUX, since the LX connection is the switching node, the catch diode and output inductor should be located close to the LX pins, and the area of the PCB conductor minimized to prevent excessive capacitive coupling. And GND area should not be connected directly power GND, connected avoiding the high current switch paths. The additional external components can be placed approximately as shown. Power Dissipation Estimation The following formulas show how to estimate the device power dissipation under continuous mode operations. They should not be used if the device is working in the discontinuous conduction mode. 1) Conduction loss：𝑃𝑂𝑁 = 𝐼𝑂𝑈𝑇 2 × 𝑅𝑂𝑁𝐻 × 𝑉𝑂𝑈𝑇 ⁄ 𝑉𝐼𝑁 2) Switching loss：𝑃𝑆𝑊 = 0.25 × 10−9 × 𝑉𝐼𝑁 × 𝐼𝑂𝑈𝑇 × 𝑓𝑆𝑊 3) Gate charge loss：𝑃𝐺 = 22.8 × 10−9 × 𝑓𝑆𝑊 4) Quiescent current loss：𝑃𝐼𝐶 = 0.7 × 10−3 × 𝑉𝐼𝑁 IOUT is the output current (A), RONH is the on-resistance of the high-side MOSFET (Ω), VOUT is the output voltage (V), VIN is the input voltage (V), fsw is the switching frequency (Hz). Device power dissipation of IC (P) is the sum of above dissipation and estimated by following formula. 𝑃 = 𝑃𝑂𝑁 + 𝑃𝑆𝑊 + 𝑃𝐺 + 𝑃𝐼𝐶 Junction temperature (Tj) is estimated by following formula. 𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑃 θja is the thermal resistance of the package (℃). Please consider thermal design with sufficient margin not to over Tjmax = 150 °C. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX I/O Equivalence Circuits Pin No. Pin Name 1 BST 2 VIN 7 GND 8 LX 3 EN Pin Equivalent Circuit Pin No. Pin Name Pin Equivalent Circuit BST FB VIN 5 FB LX GND GND EN VC 6 VC GND GND SS 4 SS GND www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 25. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Ordering Information B D 9 E 1 5 1 A N U X - Package NUX: VSON008X2030 TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram VSON008X2030 (TOP VIEW) Part Number Marking 9 E 1 LOT Number 51 A Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VSON008X2030 21/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 BD9E151ANUX Revision History Date Revision 25.Mar.2020 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/22 TSZ02201-0Q2Q0AJ00750-1-2 25.Mar.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001