BD9F800MUX-ZE2

Datasheet 4.5V to 28V Input, 8.0A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9F800MUX-Z Key Specifications General Description BD9F800MUX-Z is a synchronous buck DC/DC converter with built-in low on-resistance power MOSFETs. It is capable of providing current of up to 8 A. External phase compensation circuit is not necessary for it is a constant on-time control DC/DC converter with high speed response.        Input Voltage Range: 4.5V to 28 V Output Voltage Setting Range: 0.765V to 13.5V Output Current: 8 A (Max) Switching Frequency: 300kHz or 600kHz (Typ) High Side MOSFET On-Resistance: 23 m Ω (Typ) Low Side MOSFET On-Resistance: 11 m Ω (Typ) Shutdown Current: 2 μA (Typ) Features         Package Synchronous Single DC/DC Converter Constant On-time Control Over Current Protection Short Circuit Protection Thermal Shutdown Protection Under Voltage Lockout Protection Power Good Output VQFN11X3535A Package VQFN11X3535A W (Typ) × D (Typ) × H (Max) 3.50mm × 3.50mm × 0.60mm Applications      Step-down Power Supply for DSPs, Microprocessors, etc. Set-top Box LCD TVs DVD / Blu-ray Player / Recorder Entertainment Devices VQFN11X3535A Typical Application Circuit BD9F800MUX-Z VIN VIN CIN Enable EN BOOT CBOOT PGND VOUT SW FREQ VOUT RFREQ VREG CVREG PGD L R1 FB GND COUT R2 Figure 1. Typical Application Circuit ○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays. www.rohm.com TSZ02201-0F3F0AC00090-1-2 © 2017 ROHM Co., Ltd. All rights reserved. 1/47 27.Dec.2018 Rev.003 TSZ22111 • 14 • 001 BD9F800MUX-Z Pin Configuration 1. BOOT 2. PGD 3. VOUT 4. FREQ 5. FB 6. VREG (TOP VIEW) 7. GND 11. EN 8. VIN 9. SW 10. PGND Figure 2. Pin Configuration Pin Descriptions Terminal No. Symbol 1 BOOT 2 PGD Power Good terminal. It is necessary to connect a pull-up resistor due to an open drain output. See page 19 for how to specify the resistance. When the FB terminal voltage is within ±7% of 0.765V (Typ), the internal Nch MOSFET turns off and the output turns High. 3 VOUT Output voltage sense terminal. Connect a 10Ω resistor in series when output voltage setting is more than 3.3V. 4 FREQ Switching frequency setting terminal. Switching frequency is set to 300kHz when this terminal is set to Low (0.8V or lower). Setting this terminal to High (2.2V or higher) will make switching frequency set to 600kHz. This terminal needs to be pulled down to ground or pulled up to VREG by 10kΩ. 5 FB 6 VREG 7 GND Ground terminal for the control circuit. 8 VIN Power supply terminal for the switching regulator. Connecting 20µF(10µF×2) and 0.1µF ceramic capacitor to ground is recommended. 9 SW Switch terminal. The SW terminal is connected to the source of the High-Side MOSFET and drain of the Low-Side MOSFET. Connect a bootstrap capacitor of 0.1µF between BOOT and SW terminal. Also, connect an inductor considering the direct current superimposition characteristic. 10 PGND 11 EN Function Bootstrap terminal. Connect a ceramic capacitor of 0.1µF between BOOT and SW terminal. The voltage of this capacitor is the gate drive voltage of the High-Side MOSFET. An inverting input node for the error amplifier and main comparator. To calculate for the resistance value of the output voltage setting, refer to page 39. Internal power supply voltage terminal. A voltage of 5.25V (Typ) is outputted if there is more than 2.3V for EN terminal. Connect a ceramic capacitor of 2.2µF to ground. Ground terminal for the output stage of the switching regulator. Enable terminal. Turning this terminal signal Low (0.7V or lower) forces the device to enter in shutdown mode. Turning this terminal signal High (2.3V or higher) enables the device. This terminal must be properly terminated. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Block Diagram EN 11 VREG 63 8 VIN VIN EN EN VREG VREG VREG REF VREF VREF 1 BOOT SW On Time Controller Block FREQ 4 VOUT 3 Error Amplifier R Q EN S SW Main Comparator REF SS OCPH Driver Circuit 9 SW VREG OCPL FB 5 10 PGND UVLO UVLO TSD UVLO 2 PGD SCP EN UVLO TSD SCP SCP Thermal Protection Soft Start TSD FB VREF PGOOD SS 7 GND Figure 3. Block Diagram www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Description of Blocks ● EN The device will shut down when EN falls to 0.7V (Max) or lower. When EN reaches 2.3V (Min), the internal circuit is activated and the device starts up. ● VREG The VREG block generates the internal power supply. ● VREF The VREF block generates the internal reference voltage. ● Error Amplifier Error Amplifier adjusts Main Comparator input to make internal reference voltage equal to FB terminal voltage. ● Main Comparator Main comparator compares Error Amplifier output and FB terminal voltage. When FB terminal voltage becomes low, it outputs High and reports to the On Time block that the output voltage has dropped below control voltage. ● ON Time Controller Block This block generates ON Time. The desired ON Time is generated when Main Comparator output becomes High. ON Time is adjusted to restrict frequency change even with Input / Output voltage change. ● Soft Start The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. The internal soft start time is set to 1ms typically. ● PGOOD When the FB terminal voltage reaches within ±7% of 0.765V(Typ), the built-in open drain output Nch MOSFET turns off and the output goes high. ● Driver Circuit This block is a DC/DC driver. A signal from ON Time Controller Block is applied to drive the MOSFETs. ● UVLO UVLO is a protection circuit that prevents low voltage malfunction. It prevents malfunction of the internal circuit from sudden rise and fall of power supply voltage. When VIN voltage is higher than 4.2V (Typ), UVLO is released and the soft-start circuit will be started. This threshold voltage has a hysteresis of 400mV (Typ). When VIN voltage is less than 3.8V (Typ), the device will shut down. ● TSD The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal temperature of device rises to 175°C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25°C (Typ). ● SCP After the soft start is completed and when the FB terminal voltage has fallen below 0.38V (Typ) for 250μs (Typ), the SCP stops the operation for 8ms (Typ) and subsequently initiates restart. ● OCPH When inductor current exceeds the current limit threshold value while High-Side MOSFET is ON, the High-Side MOSFET will turn OFF. ● OCPL The OCP function limits the current flowing through the Low-Side MOSFET for every switching period. If the inductor current exceeds the source current limit threshold value IOCP while Low-Side MOSFET is ON, the Low-Side MOSFET remains ON even with FB voltage is lower than the REF voltage. The Low-Side MOSFET keeps ON until inductor current becomes lower than IOCP and High-Side MOSFET will turn ON. The Low-Side MOSFET will turn OFF when inductor current exceeds the sink current limit threshold value while Low-Side MOSFET is ON. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Absolute Maximum Ratings (Ta = 25C) Parameter Symbol Rating Unit VIN -0.3 to +30 V VBOOT -0.3 to +35 V VBOOT - VSW -0.3 to +7 V SW Terminal Voltage VSW -0.3 to VIN + 0.3 V FB Terminal Voltage VFB -0.3 to VVREG V VREG Terminal Voltage VVREG -0.3 to +6 V FREQ Terminal Voltage VFREQ -0.3 to +7 V VOUT Terminal Voltage VVOUT -0.3 to +20 V PGD Terminal Voltage VPGD -0.3 to +35 V Input Voltage Voltage from GND to BOOT Voltage from SW to BOOT EN Terminal Voltage Maximum Junction Temperature VEN -0.3 to +30 V Tjmax 150 °C Tstg -55 to +150 °C Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit VQFN11X3535A Junction to Ambient θJA 232.1 48.0 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 44.2 8.2 °C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20mm Φ0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Recommended Operating Conditions Parameter Input Voltage Operating Temperature Range Output Current Output Voltage Range Symbol Min Typ Max Unit VIN 4.5 12 28 V Topr +85 (Note 1) -40 - °C IOUT 0 - 8 A VRANGE 0.765 (Note 2) - 13.5 (Note 3) V (Note 1) Tj must be lower than 150°C under actual operating environment. Life time is derated at junction temperature greater than125°C. (Note 2) Please use under the condition of VOUT≥VIN×0.033 [V] (300kHz), VOUT ≥VIN×0.067 [V] (600kHz). (Note 3) Please use under the condition of VOUT≤VIN×0.87-0.12×IOUT [V](300kHz), VOUT ≤VIN×0.77-0.13×IOUT [V](600kHz). (Refer to the page 39 for how to calculate the output voltage setting.) Electrical Characteristics (Ta = 25°C, VIN = 12V, VEN = 3V, FREQ=L unless otherwise specified) Parameter Symbol Min Typ Max Unit Shutdown Current ISD - 2 15 µA Operating Circuit Current IVIN - 0.85 1.6 mA Conditions VEN=GND IOUT=0mA when no switching EN Low Voltage VENL - - 0.7 V EN High Voltage VENH 2.3 - VIN V EN Input Current IEN - 2.5 10 µA FREQ Low Voltage VFREQL - - 0.8 V FREQ High Voltage VFREQH 2.2 - VVREG V FREQ Input Current IFREQ - 1.5 5 µA VFREQ=3V VVREG_SD - - 0.1 V VEN=GND VREG Output Voltage VVREG 5 5.25 5.5 V VREG Output Current IREG - 10 - mA UVLO Threshold Voltage VUVLO 3.9 4.2 4.5 V UVLO Hysteresis Voltage VUVLO_HYS 200 400 600 mV FB Terminal Voltage VFB 0.757 0.765 0.773 V FB Input Bias Current IFB - - 1 µA Soft Start Time tSS 0.5 1 2 ms On Time1 tON1 - 277 - ns On Time2 tON2 - 150 - ns tMINOFF - 250 - ns High Side FET ON Resistance RONH - 23 - mΩ Low Side FET ON Resistance RONL - 11 - mΩ Current Limit Threshold IOCP - 11.5 - A (Note 4) Power Good Falling (Fault) Voltage VPGDFF 87 90 93 % FB falling Power Good Rising (Good) Voltage VPGDRG 90 93 96 % FB rising Power Good Rising (Fault) Voltage VPGDRF 107 110 113 % FB rising Power Good Falling (Good) Voltage VPGDFG 104 107 110 % FB falling Power Good Output Leakage Current ILKPGD - 0 5 µA PGD= 5V Power Good ON Resistance RPGD - 500 1000 Ω VHCP 0.26 0.38 0.5 V tHCPDLY - 250 - µs VREG Shutdown Voltage Minimum Off Time Hiccup Threshold Voltage Hiccup Delay Time VEN=3V VIN:Sweep up VIN=12V, VOUT=1.0V VIN=12V, VOUT=1.0V, FREQ=L VIN=12V, VOUT=1.0V, FREQ=H FB Terminal (Note 4) No tested on outgoing inspection. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z 1600 [µA] VIN=12V VIN 15 14 VIN=12V 13 12 11 10 9 8 7 6 5 4 3 2 1 0 -40 -20 Operating Supply Current : I Shutdown Current : ISD [µA] Typical Performance Curves 0 20 40 60 1400 1200 1000 800 600 400 200 0 -40 80 -20 0 20 40 60 80 Temperature [°C] Temperature [°C] Figure 5. Operating Supply Current vs Temperature Figure 4. Shutdown Current vs Temperature 10 2.2 VIN=12V, VEN=3V 8 1.8 EN Input Current : I EN[μA] EN Threshold Voltage : VEN[V] 2 Sweep Up 1.6 1.4 Sweep Down 1.2 1 0.8 0.6 6 4 2 0.4 0.2 0 -40 -20 0 20 40 60 80 -20 0 20 40 60 80 Temperature [°C] Temperature [°C] Figure 6. EN Threshold Voltage vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 -40 Figure 7. EN Input Current vs Temperature 7/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 50 2.2 FREQ[V] VIN=12V FREQ Threshold Voltage : V EN Input Current : IEN[μA] 40 30 20 10 5 10 15 20 25 1.8 Sweep Up 1.6 Sweep Down 1.4 1.2 1 0.8 -40 0 0 2 30 -20 20 40 60 80 Temperature [°C] EN Voltage : VEN[V] Figure 9. FREQ Threshold Voltage vs Temperature Figure 8. EN Input Current vs EN Voltage 5 5.5 VIN=12V, VFREQ=3V VIN=12V 5.45 VREG Output Voltage : VVREG[V] 4.5 FREQ Input Current : I FREQ[µA] 0 4 3.5 3 2.5 2 1.5 1 5.4 5.35 5.3 5.25 5.2 5.15 5.1 5.05 0.5 0 -40 -20 0 20 40 60 80 -20 0 20 40 60 80 Temperature [°C] Temperature [°C] Figure 10. FREQ Input Current vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 -40 Figure 11. VREG Output Voltage vs Temperature 8/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 600 UVLO Hysteresis Voltage : V UVLO_HYS [mV] UVLO Threshold Voltage : V UVLO[V] 4.5 4.4 4.3 4.2 4.1 4 3.9 -40 -20 0 20 40 60 500 400 300 200 -40 80 -20 Temperature [°C] 0 20 40 60 80 Temperature [°C] Figure 13. UVLO Hysteresis Voltage vs Temperature Figure 12. UVLO Threshold Voltage vs Temperature 1 0.773 VIN=12V VIN=12V FB [μA] 0.8 0.769 0.767 FB Input Current : I FB Terminal Voltage : VFB [V] 0.771 0.765 0.763 0.761 0.6 0.4 0.2 0.759 0.757 -40 -20 0 20 40 60 80 0 -40 -20 0 20 40 60 Temperature [°C] Temperature [°C] Figure 14. FB Terminal Voltage vs Temperature Figure 15. FB Input Current vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/47 80 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 2 320 VIN=12V, VOUT=1V 1.5 On Time I : t ON1 [ns] Soft Start Time : tSS [ms] VIN=12V 1 300 280 260 0.5 240 0 -40 -20 0 20 40 60 80 220 -40 -20 Temperature [°C] 40 60 80 Figure 17. On Time 1 vs Temperature 180 400 VIN=12V, VOUT=1V VIN=12V Minimum Off Time : t MINOFF [ns] 170 On Time 2 : t ON2 [ns] 20 Temperature [°C] Figure 16. Soft Start Time vs Temperature 160 150 140 130 120 -40 0 300 200 100 0 -20 0 20 40 60 80 Temperature [°C] -20 0 20 40 60 80 Temperature [°C] Figure 18. On Time 2 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 19. Minimum Off Time vs Temperature 10/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 25 Low Side FET ON Resistance : R ONL[mΩ] High Side FET ON Resistance : RONH [mΩ] 50 VIN=12V 40 30 20 10 0 -40 -20 0 20 40 60 VIN=12V 20 15 10 5 0 -40 80 -20 0 Figure 20. High Side FET ON Resistance vs Temperature 60 80 Figure 21. Low Side FET ON Resistance vs Temperature 96 113 VIN=12V Powe Good Threshold Voltage : VPGD : [%] Power Good Threshold Voltage : VPGD [%] 40 Temperature[°C] Temperature [°C] 95 94 Rising Good 93 92 91 90 Falling Fault 89 88 87 -40 20 -20 0 20 40 60 80 Temperature[°C] 111 Rising Fault 110 109 108 107 Falling Good 106 105 104 -40 -20 0 20 40 60 80 Temperature [°C] Figure 22. Power Good Threshold Voltage vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VIN=12V 112 11/47 Figure 23. Power Good Threshold Voltage vs Temperature TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 1000 PGD [Ω] VIN=12V, VPGD=5V 0.8 Power Good ON Resistance : R Power Good Output Leakage Current : I LKPGD [μA] 1 0.6 0.4 0.2 0 -40 -20 0 20 40 60 VIN=12V 900 800 700 600 500 400 300 200 100 0 -40 80 -20 Temperature [°C] 40 60 80 Figure 25. Power Good ON Resistance vs Temperature 0.5 500 VIN=12V VIN=12V 450 0.46 Hiccup Delay Time : tHCPDLY[μs] HCP [V] 20 Temperature[°C] Figure 24. Power Good Output Leakage Current vs Temperature Hiccup Threshold Voltage : V 0 0.42 0.38 0.34 0.3 400 350 300 250 200 150 100 50 0.26 -40 0 -20 0 20 40 60 80 -40 Temperature[°C] 0 20 40 60 80 Temperature [°C] Figure 26. Hiccup Threshold Voltage vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -20 12/47 Figure 27. Hiccup Delay Time vs Temperature TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Typical Performance Curves - continued 10 10 9 VOUT=1V, 3.3V, 5V 8 8 7 7 Output Current [A] Output Current [A] 9 6 5 4 3 6 5 4 3 2 2 1 1 0 -40 0 -40 -20 0 20 40 60 80 100 VOUT=3.3V, 5V -20 0 Temperature [°C] 20 40 60 80 100 Temperature[°C] Figure 28. Operational Range VIN=12V, FREQ=L(300kHz), (Tj Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 97. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 16. Disturbance Light In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 44/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Ordering Information B D 9 F 8 0 Part Number 0 M U X Package MUX: VQFN11X3535A - ZE2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN11X3535A (TOP VIEW) Part Number Marking BD9F8 LOT Number 00MUX Pin 1 Mark www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 45/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN11X3535A 46/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 BD9F800MUX-Z Revision History Date Revision 31.Jul.2017 19.Mar.2018 27.Dec.2018 001 002 003 Changes Created Revised Tape Quantity Revised Part Number www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 47/47 TSZ02201-0F3F0AC00090-1-2 27.Dec.2018 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001