Datasheet
Ambient Light Sensor IC Series
Digital 16bit Serial Output Type
Ambient Light Sensor IC
BH1726NUC
General Description
Key Specifications
■
■
■
■
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BH1726NUC is a digital Ambient Light Sensor IC with I2C
bus interface. This IC is most suitable for obtaining
ambient light data for adjusting LCD and backlight power
of TV and mobile phone. It is capable of detecting a very
wide range of illuminance.
Features
VCC Voltage Range:
2.3V to 3.6V
Detection Range:
30klx (Typ)
Current Consumption:
75μA (Typ)
Power Down Current:
0.8μA (Typ)
Operating Temperature Range: -40°C to +85°C
Package(s)
Built-in Ircut filter
2 outputs with different spectral response
Correspond to dark window because of high sensitivity
Rejecting 50Hz/60Hz light noise
I2C bus interface (f/s mode support)
It is possible to select 2 type of I2C bus slave address.
Correspond to 1.8V logic interface
Resolution 0.0003lx/count (Typ)
(In highest gain and longest measurement time setting)
WSON008X2120
W(Typ) x D(Typ) x H(Max)
2.10mm x 2.00mm x 0.6mm
Applications
Mobile Phone, Tablet PC, Note PC, Portable Game
Machine, LCD TV, Digital Camera
WSON008X2120
Typical Application Circuits
0.1uF
IRCUT FILTER
VCC
AMP
ADC
PD0
AMP
ADC Logic
+
I2C Interface
+
INT Interface
SCL
SDA
or
INT
ADC
Micro
Controller
Baseband
Processor
PD1
OSC
ADDR
TEST
POR
GND
〇Product structure: Silicon monolithic integrated circuit.
〇This product has no designed protection against radioactive rays.
〇This product does not include laser transmitter.
〇This product does not include optical load.
〇This product includes Photo detector, ( Photo Diode ) inside of it.
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Pin Configuration
TOP VIEW
ADDR
1
8
NC
VCC
2
7
INT
GND
3
6
SDA
TEST
4
5
SCL
Pin Description
Pin No.
Pin Name
Function
2
1
ADDR
2
VCC
I C bus slave address selector
Power supply(Note 1)
3
GND
Ground
4
TEST
Test pin (Connect to GND)
5
SCL
I2C bus serial clock
6
SDA
I2C bus serial data
7
INT
Interrupt
8
NC
Non connect
(Note 1)Dispose a bypass capacitor as close as possible to the IC
Block Diagram
IRCUT FILTER
VC
C
AMP
ADC Logic
+
2
I C Interface
+
INT Interface
ADC
PD0
AMP
SCL
SDA
INT
ADC
PD1
OSC
ADDR
TEST
POR
GND
Description of Blocks
• PD0, PD1
Photodiode
• AMP
Integrated OPAMP for converting PD current to voltage.
• ADC
Analog-to-Digital Converter for obtaining 16bit digital data.
• ADC Logic + I2C Interface + INT Interface
ADC control logic and I/F logic
• OSC
Oscillator for clock of internal logic
• POR
Power ON Reset. All registers are reset after VCC is supplied.
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC_MR
4.5
V
Input Voltage 1 [INT,SCL,SDA]
VIN1_MR
V
Input Voltage 2 [ADDR]
VIN2_MR
Topr
-0.3 to +4.5
-0.3 to (VCC+0.3) or +4.5
whichever is less
-40 to +85
°C
Tstg
-40 to +100
°C
Tjmax
100
°C
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
V
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
384.2
54.2
°C/W
ΨJT
82
12
°C/W
WSON008X2120
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Thermal Via(Note 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
Pitch
1.20mm
2 Internal Layers
Diameter
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers..
Recommended Operating Conditions (Ta = -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VCC
2.3
2.5
3.6
V
Input Voltage [INT,SCL,SDA]
VIN
0
-
3.6
V
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Electrical Characteristics (Unless otherwise specified VCC = 2.5V, Ta = 25°C, ADC_EN=1, WAIT_EN=1,
ITIME=0xDA, x1 gain mode) (Note 1)
Parameter
Symbol
Min
Typ
Max
Unit
Supply Current
Icc1
-
75
125
µA
Power Down Current
Icc2
-
0.8
1.5
µA
ADC Count Value in DATA0
D1k_0
3400
4000
4600
count
EV = 100 lx
No input Light
All registers are default.
EV = 1000 lx
ADC Count Value in DATA1
D1k_1
425
500
575
count
EV = 1000 lx
Dark ( 0 lx ) Sensor Out in DATA0
S0_0
-
0
2
count
No input Light
Dark ( 0 lx ) Sensor Out in DATA1
S0_1
-
0
2
count
No input Light
Measurement Time
Tmt1
123.3
137.0
150.7
ms
ITIME = 0xCE
Tint
-
2.8
4.0
µs
Internal Clock Period
Interval Time
Twt
-
300
430
ms
INT Output 'L' Voltage
VINTL
0
-
0.4
V
SCL SDA Input 'H' Voltage
VIH
1.26
-
-
V
SCL SDA Input 'L' Voltage
VIL
-
-
0.54
V
SDA Output 'L' Voltage
VOL
0
-
0.4
V
ADDR Input 'H' Voltage
VADDRH
0.7*VCC
-
-
V
ADDR Input 'L' Voltage
VADDRL
-
-
0.3*VCC
V
Conditions
IOL = 3mA
IOL = 3mA
(Note 1)White LED is used as optical source.
Typical Performance Curves
1.0
DATA0
0.8
Ratio
0.6
0.4
DATA1
0.2
0.0
400
500
600
700
800
900
1000 1100
Wavelength [nm]
Figure 1. Ratio vs Wavelength
(Spectral Response)
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I2C bus Timing Characteristics (Unless otherwise specified VCC = 2.5V, Ta = 25°C)
S : Repeated START
S : START
VIH
SDA
VIL
VIH
VIL
VIL
S : START
P : STOP
VIH
VIH
VIL
tBUF
tHD;STA
tSU;DAT
VIH
SCL
VIL
tLOW
tHD;STA
VIH
VIH
VIL
VIH
VIH
VIH
VIL
tHIGH
tHD;DAT
Parameter
tSU;STA
tSU;STO
Symbol
Min
Typ
Max
Unit
SCL Clock frequency
fSCL
0
-
400
kHz
‘L’ Period of the SCL Clock
tLOW
1.3
-
-
µs
‘H’ Period of the SCL Clock
tHIGH
0.6
-
-
µs
Setup Time for Repeated START
tSU;STA
0.6
-
-
µs
Hold Time for START
tHD;STA
0.6
-
-
µs
Data Setup Time
tSU;DAT
100
-
-
ns
Data Hold Time
tHD;DAT
0
-
-
µs
Setup Time for STOP
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
Bus Free Time between STOP and START
Conditions
I2C bus Communication
1. Write Format
(1) Indicate register address
S
W
0
Slave Address
ACK
Register Address or
Special Command
ACK
ACK
Register Address
ACK
P
(2) Write data after indicating register address
S
W
0
Slave Address
Data specified at register
address field
ACK
•••
ACK
Data specified at register
address field + N
ACK
P
NACK
P
NACK
P
2. Read Format
(1) Read data after indicating register address (Master issues restart condition)
S
Slave Address
W
0
ACK
S
Slave Address
R
1
ACK
Data specified at register
address field + 1
ACK
•••
Register Address
ACK
Data specified at register
address field
ACK
ACK
Data specified at register
address field + N
(2) Read data from the specified register
S
R
1
Slave Address
Data specified at register
address field + 1
ACK
ACK
•••
Data specified at register
address field
ACK
from master to slave
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ACK
Data specified at register
address field + N
from slave to master
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I2C bus Slave address
The slave address is selectable from 2 addresses by ADDR pin.
ADDR
Slave Address
L
0101001
H
0111001
Register MAP(Note 1)
Register
Address
[4:0]
--
Register Name
R/W
CONTROL
RW
0x01
TIMING
RW
0x02
INTERRUPT
RW
0x03
TH_LOW
0x05
0x06
TH_HIGH
0x07
GAIN
0x12
PART ID
DATA0
0x16
0x17
0x18
D5
DATA1
0
ADC_
INTR
D3
D2
D1
D0
0
ADC_
EN
POWER
COMMAND CODE [7:0]
0
ADC_
VALID
0
ITIME [7:0]
0
0
INT_
LATCH
INT_EN
PERSIST [3:0]
TH_LOW_data [7:0]
RW
TH_LOW_data [15:8]
RW
TH_HIGH_data [7:0]
RW
TH_HIGH_data [15:8]
0
0
0
0
DATA0_GAIN [1:0] DATA1_GAIN [1:0]
R
PART ID [7:0]
R
DATA0_data [7:0]
R
DATA0_data [15:8]
R
DATA1_data [7:0]
R
DATA1_data [15:8]
RW
WAIT
D4
RW
RW
0x14
0x15
D6
W
COMMAND
0x00
0x04
D7
0
0
0
0
0
0
0
WAIT_
EN
(Note1)Do not write any commands to other address except above. Do not write '1' to the field in which value is '0' in above table.
COMMAND
Fields
COMMAND CODE
Function
100_Register Address[4:0]: Command to indicate register address
111_00001: Interrupt reset (Special Command)
111_00100: Software reset (Special Command)
Don’t input the other command.
All registers are reset and this IC becomes power down state by software reset.
default value 0x00
( 0x00 ) CONTROL
Fields
Function
ADC_INTR
Interrupt status output (Read only register)
0 : Interrupt is inactive.
1 : Interrupt is active.
ADC_VALID
Data register(DATA0, DATA1) status output (Read only register)
0 : Data registers are not updated after last reading.
1 : Data registers are updated after last reading.
ADC_EN
0 : ADC measurement stop.
1 : ADC measurement start.
POWER
0 : ADC power down.
1 : ADC power on.
default value 0x00
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( 0x01 ) TIMING
Fields
ITIME
Function
Integration Time (ITIME_ms) = Tint * 964 * (256 - ITIME)
Measurement time (Tmt) = ITIME_ms + Tint * 714
ITIME determines integration time.
Regarding integration time and measurement result, please refer to "ALS Sensitivity
Adjustment Function"
default value 0xDA
( 0x02 ) INTERRUPT
Fields
Function
INT_LATCH
0 : LATCH mode
1 : UNLATCH mode
INT_EN
0 : Interrupt function is invalid.
1 : Interrupt function is valid.
Interrupt persistence function.
PERSIST
0000 : Interrupt becomes active at each measurement end.
0001 : Interrupt status is updated at each measurement end.
0010 : Interrupt status is updated if 2 consecutive threshold judgments are the same.
0011 : Interrupt status is updated if 3 consecutive threshold judgments are the same.
:
:
1110 : Interrupt status is updated if 14 consecutive threshold judgments are the same.
1111 : Interrupt status is updated if 15 consecutive threshold judgments are the same
default value 0x01
( 0x03 / 0x04 ) TH_LOW
Fields
TH_LOW_data [15:0]
Function
Interrupt threshold lower level
default value 0x0000
( 0x05 / 0x06 ) TH_HIGH
Fields
TH_HIGH_data [15:0]
Function
Interrupt threshold upper level
default value 0xFFFF
( 0x07 ) GAIN
Fields
Function
DATA0_GAIN
Gain setting of ADC DATA0
00 : x1 gain mode
01 : x2 gain mode
10 : x64 gain mode
11 : x128 gain mode
DATA1_GAIN
Gain setting of ADC DATA1
00 : x1 gain mode
01 : x2 gain mode
10 : x64 gain mode
11 : x128 gain mode
default value 0x00
( 0x12 ) PART ID
Fields
PART ID
Function
Part ID : 0x72
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( 0x14 / 0x15 ) DATA0
Fields
DATA0_data [15:0]
Function
DATA0 Measurement result
default value 0x0000
( 0x16 / 0x17 ) DATA1
Fields
DATA1_data [15:0]
Function
DATA1 Measurement result
default value 0x0000
( 0x18 ) WAIT
Fields
WAIT_EN
Function
0 : There is no interval.
1 : There is interval (Twt) after each measurement
(Low current consumption mode)
default value 0x00
Measurement Procedure
Power Supply
Initial state is Power Down mode after VCC is supplied.
I2C bus communication is possible after t1 has passed.
Please refer to "Power supply sequence".
Power Down
Power bit = 'H' and ADC_EN bit = 'H'
Measurement start
State transition after measurement time(Tmt) has passed.
Please refer to "TIMING register" about Tmt.
Measurement completion
DATA0 register and DATA1 register are updated
after measurement completion.
No
WAIT_EN = 'H' ?
Yes
Measurement interval
State transition after Twt has passed.
Please refer to "Electrical Characteristics" about Twt.
State Transition by I2C write-command.
Automatic State Transition
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Interrupt Function
Interrupt function compares DATA0 measurement result to preset interrupt threshold level. This IC uses two threshold
levels (upper and lower). If measurement result is outside of the two thresholds, INT pin outputs ’L’. Interrupt function is
able to set at INTERRUPT register. And interrupt threshold is defined at TH_HIGH register and TH_LOW register.
INT pin is high impedance when VCC is supplied.
To clear interrupt
1) Interrupt output reset of special command
2) Master reads CONTROL register
3) Software reset of special command
EX) Interrupt behavior example
Master writes “Interrupt output reset” command.
or
Master reads CONTROL register
INT Pin
H
Persistence = 1 / UNLATCH MODE
L
H
Persistence = 2 / UNLATCH MODE
L
H
Persistence = 1 / LATCH MODE
L
DATA0
Interrupt threshold upper level
Sequential measurement results
Interrupt threshold lower level
time
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Power supply sequence
ALL register of this IC is reset when VCC powers up. There are some notes about power up and down sequence as
shown below.
1. Power ON Time: t1
More than 2ms is needed to activate this IC after VCC becomes more than 2.3V from less than 0.4V.
2. Power OFF time: t2
More than 1ms (VCC < 0.4V) is needed before supplying power to this IC.
2.3V
VCC
0.4V
t1
t1
t2
IC state
Active(Note 1)
Undefined Behavior
Undefined Behavior
Active
(Note1) ”Active” state is that this IC works and accept I2C bus access correctly.
ALS Sensitivity Adjustment Function
This IC is capable of changing its ALS sensitivity. This is used to compensate the effect of attenuation by the optical
window. Adjustment is done by changing the measurement time. For example, when transmission rate of optical window
is 1/n (measurement result becomes 1/n times if optical window is set), the effect of optical window is compensated by
changing sensor sensitivity from default to n times.
Optical design for the device
Top View
2mm
0.72mm
1.05mm
0.9mm
2.1mm
PD area 0.41 x 0.43mm
0.9mm
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Please design the optical window so that light can
cover at least this are.
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I/O Equivalent Circuit
Pin Name
ADDR
Equivalent Circuit
VCC
VCC
TEST
VCC
SCL
SDA
INT
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating..
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 2. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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Ordering Information
B
H
1
7
2
6
Part Number
N
U
C
-
Package
NUC : WSON008X2120
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
WSON008X2120(TOP VIEW)
Part Number Marking
A
D
1 PIN MARK
LOT Number
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Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
Revision
28.Apr.2016
05.Jun.2018
08.Aug.2018
001
002
003
Changes
New Release
Specified value modification (Electrical Characteristics)
Correction of error about Interrupt Function
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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TSZ02201-0M3M0F616020-1-2
08.Aug.2018 Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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