Datasheet
D/A Converters
Standard 8bit 4ch • 6ch Type
BH2227FV BH2228FV
General Description
Key Specifications
◼
◼
◼
◼
◼
◼
◼
◼
The BH2227FV and BH2228FV ICs are 8bit R-2R-type
D/A converters with 4 and 6 channels, respectively.
Optimized circuitry allows two output voltages to be
supplied (3V/5V). Furthermore, the built-in RESET
function ensures that the output voltage at all channels
is LOW during power up. A broad power supply voltage
range is available (2.7V to 5.5V), providing design
flexibility.
Power Source Voltage Range:
Current Consumption:
Differential Non Linearity Error:
Integral non Linearity Error:
Output current Performance:
Settling Time:
Data Transfer Frequency:
Action Temperature Range:
2.7V to 5.5V
0.8mA(Typ)
±1.0LSB
±1.5LSB
±1.0mA
100µs(Min)
10MHz(Max)
-20°C to +85°C
Features
■
■
■
■
Package
Suitable for 2 independent power sources (3V/5V)
Built-in RESET function
High speed output response characteristics
3-line serial interface
W(Typ) x D(Typ) x H(Max)
Applications
DVCs, DSCs, DVDs, CD-Rs, CD-RWs
SSOP-B14
5.00mm x 6.40mm x 1.35mm
Lineup
Number of channels
4ch
Input method
Data latch method
CMOS
CSB method
6ch
○Product structure：Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Package
SSOP-B14
SSOP-B14K
Reel of 2500
SSOP-B14
Orderable Part Number
BH2227FV-E2
BH2227FV-ZE2
BH2228FV-E2
○This product has no designed protection against radioactive rays
1/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Pin Descriptions and Block Diagrams
(BH2227FV)
Terminal Terminal Name
1
AO1
2
AO2
3
TESTMONI1
4
TESTMONI2
5
AO3
6
AO4
7
NC
8
NC
9
VDD
10
11
12
CSB
CLK
DI
13
VFS
14
VSS
TOP VIEW
Function
Analog output terminal
AO1
1
Test terminal
(OPEN at normal use)
AO2
2
Analog output terminal
TEST
MONI1
3
Internally not connected yet
TEST
MONI2
4
AO3
5
Power source terminal
(AO3, 4 full scale voltage
use in common)
Chip select signal input terminal
Serial clock input terminal
Serial data input terminal
AO1,2 full scale
Voltage setting terminal
Ground terminal
(BH2228FV)
Terminal Terminal Name
Function
1
AO1
2
AO2
3
AO3
Analog output terminal
4
AO4
5
AO5
6
AO6
7
NC
Internally not connected yet
8
NC
Power source terminal
(AO4 to AO6 full scale voltage use
9
VDD
in common)
Chip select signal input terminal
10
CSB
Serial clock input terminal
11
CLK
Serial data input terminal
12
DI
AO1,2,3 full scale
13
VFS
Voltage setting terminal
Ground terminal
14
VSS
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/14
AO4
6
NC
7
VDD
VDD
VFS
R2R
14 VSS
REG
VFS
R2R
13 VFS
REG
VDD
12 DI
Serial
Interface
VDD
VDD
V
F
S
11 CLK
VDD
R2R
REG
VDD
R2R
REG
VDD
10 CSB
Power ON
Reset
9 VDD
V
D
D
8 NC
Figure 1. BH2227FV
TOP VIEW
AO1 1
AO2
AO3
AO4
2
3
4
AO5 5
AO6 6
NC
VDD
VDD
VDD
VDD
VDD
VDD
VFS
R2R
14 VSS
REG
VFS
VFS
R2R
13 VFS
REG
VFS
R2R
REG
VDD
R2R
REG
VDD
VDD
R2R
REG
VDD
R2R
12
Serial
Interface
REG
7
DI
11 CLK
VDD
Power ON
Reset
V
F
S
10 CSB
VDD
9 VDD
8
Figure 2. BH2228FV
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
NC
V
D
D
BH2227FV
BH2228FV
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limit
Unit
Remark
Power Source Voltage
VDD
-0.3 to +7.0
V
-
Terminal Voltage
VIN
-0.3 to VCC
V
-
Storage Temperature Range
Tstg
-55 to +125
°C
-
W
-
Power Dissipation
Pd
0.40
(Note 1)
(Note 1) Derated at 4.0mW/°C at Ta>25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Remark
VDD Power Source Voltage
VDD
2.7
-
5.5
V
(Note 2)
VFS Voltage to be Impressed
VFS
2.7
-
VDD
V
(Note 2)
Terminal Input Voltage Range
VIN
0
-
VDD
V
-
Analog Output Current
IOUT
-1.0
-
+1.0
mA
-
Action Temperature Range
Topr
-20
-
+85
°C
-
Serial Clock Frequency
fCLK
-
1.0
10.0
MHz
-
Limit Load Capacitance
CL
-
-
0.1
µF
-
Unit
Conditions
(Note 2) Set the power source voltage so that VDD ≥ VFS.
Electrical Characteristics
(Unless otherwise specified, VDD=VFS=3.0V, RL=OPEN, CL=0pF, Ta=25°C)
Limit
Parameter
Symbol
Min
Typ
Max
VDD=5V，CLK=1MHZ
VDD System
IDD
-
0.5
1.5
mA
VFS System
IFS
-
0.3
0.9
mA
L Input Voltage
VIL
VSS
-
0.6
V
VDD=5.0V
H Input Voltage
VIH
2.4
-
VDD
V
VDD=5.0V
Input Current
IIN
-10
-
+10
µA
VZS1
VSS
-
0.1
V
00h setting, at no load
VZS2
VSS
-
0.3
V
00H setting, IOL=1.0mA
VFS1
VDD-0.1
-
VDD
V
FFH setting, at no load
VFS2
VDD-0.3
-
VDD
V
FFH setting, IOH=1.0mA
VFS3
VFS-0.1
-
VFS
V
FFH setting, at no load
VFS4
VFS-0.3
-
VFS
V
FFH setting, IOH=1.0mA
Differential Non Linearity Error
DNL
-1.0
-
+1.0
LSB
Input code 02H to FDH
Integral Non Linearity Error
INL
-1.5
-
+1.5
LSB
Input code 02H to FDH
VDD Power Source Voltage Rise Time
trVDD
100
-
-
µs
Power ON Reset Release Voltage
VPOR
-
1.9
-
V
Output Zero Scale Voltage
Output Full Scale Voltage
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TSZ22111・15・001
3/14
VDD=0V to 2.7V
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Timing Chart
(Unless otherwise specified, VDD = VFS = 3.0V, RL = OPEN, CL = 0pF, Ta = 25°C)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
CLK L Level Time
tCLKL
50
-
-
ns
CLK H Level Time
tCLKH
50
-
-
ns
DI Setup Time
tsDI
20
-
-
ns
DI Hold Time
thDI
40
-
-
ns
CSB Setup Time
tsCSB
50
-
-
ns
CSB Hold Time
thCSB
50
-
-
ns
CSB H Level Time
tCSBH
50
-
-
ns
D/A Output Settling Time
tOUT
-
-
100
µs
tCLKL
Conditions
CL=50pF,RL=10kΩ
tCLKH
2.4V
0.6V
CLK
tsDI
thDI
2.4V
0.6V
DI
tsCSB
thCSB
tCSBH
2.4V
0.6V
CSB
tOUT
90%
10%
Analog output
Figure 3
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TSZ22111・15・001
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TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
0.6
Circuit CURRENT:IFS[mA]
Current : IFS [mA]
CIRCUIT
Circuit CURRENT:IDD[mA]
Current : IDD [mA]
CIRCUIT
Typical Performance Curves
0.5
0.4
85°C
0.3
25°C
-20°C
0.2
0.1
0.6
0.5
0.4
85°C
0.3
25°C
-20°C
0.2
0.1
0.0
0.0
0.0
1.0
2.0
3.0
4.0
5.0
0.0
6.0
Differential Non Linearity Error : DNL [LSB]
VDD=3.0V
2.5
2.0
DNL [LSB]
Output Voltage
: VOUT [V]
OUTPUT
VOLTAGE:Vo[V]
3.0
1.5
1.0
0.5
0.0
128
192
256
4.0
5.0
6.0
0.4
VDD=3.0V
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
0
64
128
192
256
Input Code
[dec][dec]
INPUT
CODE
Input CODE
Code [dec]
INPUT
[dec]
Figure 7. Differential Non Linearity Error vs Input Code
Figure 6. Output Voltage vs Input Code
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TSZ22111・15・001
3.0
Figure 5. Circuit Current vs Supply Voltage
(VFS Current Consumption)
Figure 4. Circuit Current vs Supply Voltage
(VDD Current Consumption)
64
2.0
Supply
Voltage : VFS [V]
SUPPLY
VOLTAGE:VFS[V]
Supply
Voltage : VDD [V]
SUPPLY
VOLTAGE:VDD[V]
0
1.0
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TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Typical Performance Curves – continued
0.25
Differential Non Linearity Error : DNL [LSB]
VDD=3.0V
0.8
0.6
0.4
0.20
DNL [LSB]
INL [LSB]
Integral Non Linearity Error : INL [LSB]
1.0
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
64
128
192
256
0.15
0.10
0.05
0.00
0.0
Input Code
[dec]
INPUT
CODE
[dec]
3.0
4.0
5.0
6.0
Figure 9. Differential Non Linearity Error vs Supply Voltage
ZERO SCALE VOLTAGE:ZS[mV]
0.45
0.40
Zero Scale Voltage : VZS2 [mV]
INL [LSB]
2.0
SupplyVOLTAGE:VCC[V]
Voltage : VDD [V]
SUPPLY
Figure 8. Integral Non Linearity Error vs Input Code
Integral Non Linearity Error : INL [LSB]
1.0
0.35
0.30
0.25
0.20
0.15
0.10
0.05
80.0
IL=1.0mA
70.0
60.0
50.0
85°C
40.0
25°C
30.0
-20°C
20.0
10.0
0.0
0.00
0.0
1.0
2.0
3.0
4.0
5.0
0.0
6.0
2.0
3.0
4.0
5.0
6.0
SupplyVOLTAGE:VCC[V]
Voltage : VDD[V]
SUPPLY
SupplyVOLTAGE:VCC[V]
Voltage : VDD [V]
SUPPLY
Figure 10. Integral Non Linearity Error vs Supply Voltage
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TSZ22111・15・001
1.0
6/14
Figure 11. Output Zero Scale Voltage vs Supply Voltage
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
3.0
0
IL=1.0mA
ResetVOLTAGE:VPOR[V]
Voltage : VPOR [V]
RESET
FullSCALE
Scale Voltage
: VFS2 [mV]
FULL
VOLTAGE:FS[mV]
Typical Performance Curves – continued
-20
-40
-60
-80
-20°C
-100
25°C
-120
2.5
2.0
1.5
1.0
0.5
85°C
-140
0.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50
SUPPLY
SupplyVOLTAGE:VCC[V]
Voltage : VDD [V]
25
50
75
100
Figure 13. Reset Release Voltage vs Temperature
Input Voltage : V ,V [V]
IL IH
INPUT VOLTAGE:VIL,VIH[V]
100
Settling Time
: tOUT [µs]
SETTLING
TIME:tOUT[µs]
0
Temperature : Ta [°C]℃]
TEMPARATURE:Ta[
Figure 12. Output Full Scale Voltage vs Supply Voltage
80
-20°C
60
-25
25°C
85°C
40
20
3.0
2.5
2.0
1.5
VIH
1.0
VIL
0.5
0.0
0
0.0
1.0
2.0
3.0
4.0
5.0
0.0
6.0
2.0
3.0
4.0
5.0
6.0
SupplyVOLTAGE:VCC[V]
Voltage : VDD [V]
SUPPLY
Supply VOLTAGE:VCC[V]
Voltage : VDD [V]
SUPPLY
Figure 14. Settling Time vs Supply Voltage
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1.0
Figure 15. Input Voltage vs Supply Voltage
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TSZ02201-0M2M0GZ15080-1-2
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BH2227FV
BH2228FV
Application Information
Operation Description
The Serial Control Interface is 3-line serial interface 1) CSB, 2) CLK and 3) DI.
Every command is composed of 12 bits data sent through DI line (MSB first).
DI data is read every rising edge of the CLK while CSB is LOW.
Last 12 bits of data are latched when CSB goes HIGH.
CSB
10
9
8
7
6
5
4
3
2
1
D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
12
11
CLK
X
DI
X
Figure 16
Data Settings
D0
D1
0
0
1
0
0
1
1
1
0
0
0
1
1
1
D2
0
0
0
0
1
D3
0
0
0
0
0
D4
0
0
0
0
0
D5
0
0
0
0
0
D6
0
0
0
0
0
D7
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
Setting
GND
(VDD or VFS-GND)/256x1
(VDD or VFS-GND)/256x2
(VDD or VFS-GND)/256x3
(VDD or VFS-GND)/256x4
(VDD or VFS-GND)/256x254
(VDD or VFS-GND)/256x255
(Note) Initial status D[7:0]=00h
Channel Settings
D8
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D9
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
D10
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
D11
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
8/14
BH2227FV
Not used
AO1
AO2
Not used
Not used
AO3
AO4
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used
BH2228FV
Not used
AO1
AO2
AO3
AO4
AO5
AO6
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Power Dissipation
・SSOP-B14
Power Dissipation : Pd [W]
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
Temperature : Ta [°C]
Board size : 70mm x 70mm x 1.6mm
Material : FR4 glass epoxy board (copper foil area less than 3%)
I/O Equivalent Circuit
Terminal
Equivalent Circuit
VDD
AO1
AO2
AO3
AO4
AO5
AO6
V
V
Equivalent Circuit
VDD
V
VDD
V
D
D
D
D
D
D
D
D
V
VSS
VDD
Terminal
VSS
V
S
S
S
S
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TSZ22111・15・001
DI
CLK
CSB
V
VSS
S
S
9/14
V
VSS
S
S
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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TSZ02201-0M2M0GZ15080-1-2
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BH2227FV
BH2228FV
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
avoided.
Figure 17. Example of monolithic IC structure
13. Reset Function
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.
Therefore, set the time constant so as to satisfy the power source rise time.
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11/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Ordering Information
B
H
2
2
2
x
Part Number
2227
2228
F
V
-
Package
FV: SSOP-B14
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B14 (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BH2227FV-E2
H2227
BH2228FV-E2
H2228
1PIN MARK
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12/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSOP-B14
13/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Revision History
Date
Revision
Changes
06.Nov.2015
001
New Release
26.May.2021
002
Updated packages and part numbers P.1, P.14-2, P.14-3
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Ordering Information
B
H
2
2
2
7
F
V
Pachage
FV: SSOP-B14K
-
Z
Production
site
Z:Added
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B14K (TOP VIEW)
Part Number Marking
H2227
LOT Number
1PIN MARK
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14-2/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
BH2227FV
BH2228FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSOP-B14K
14-3/14
TSZ02201-0M2M0GZ15080-1-2
26.May.2021 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
