BH6260MWX-E2

USB Switch ICs SPST Type (Single Pole Single Throw) BH6260MWX No.11103EAT04 ●Description BH6260MWX is SPST x 2ch and Inverter x 2ch analog switches. Analog SW0 and SW1 pass USB 2.0 high-speed signal. Analog SW2 and SW3 pass UART signal. Moreover, this is guaranteed from 2.9V to 3.7V as for the range of the power-supply voltage. Enable signals ENB0, ENB1, EN2, and EN3 can control Analog SW0, SW1, SW2, and SW3. Furthermore, this is able to pass USB 2.0 high-speed signal without distortion, because of Analog SW0 and SW1 are low capacitance. The electrostatic discharge protection circuit is built-in in all terminals. ●Features 1) 5Ω switches connect inputs to outputs 2) Low Capacity Analog SW 2ch with clamp Diode 3) 1.8V Output Inverter 2ch 4) 16-Pin SON Package (3.3mm x 1.5mm, Height=0.6mm, 0.4mm pitch) 5) It contributes to the miniaturization because all external is built into. ●Applications Digital Still Cameras, Digital Video Camcorders, Portable Navigation Devices, TV, Portable DVD Players, Portable Game Systems, Personal computers, PDA, Mobile phones ●Line up matrix Parameter BH6260MWX BD11600NUX BD11603MWX BD11601NUX 0 μA 18 μA 18 μA 18 μA 2.9～3.7 V 2.5～5.5 V 2.5～5.5 V 2.5～5.5 V Switch ON Resistance ( VIN=0 V ) 5 Ω 3 Ω 3 Ω 2.5 Ω Switch ON Capacitance 10 pF 6 pF 7 pF 6 pF Configuration SPST x 2ch and Inverter x 2ch DPDT MUX x 2Lines DPST Package USON016X3315 VSON010X3020 USON016X3315 VSON008X2020 Supply Quiescent Current Input voltage range ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Input supply voltage1 Vmax1 -0.3～5.5 V VDD,VDD18,B2,ENB0 ENB1,EN2,EN3 Input supply voltage2 Vmax2 -0.3～VDD+0.3 V A0,B0,A1,B1,A3 Input supply voltage3 Vmax3 -0.3～VDD18+0.3 V B3 Input supply voltage4 Vmax4 -0.3～VDD+0.3 V A2 Input supply voltage5 Vmax5 -0.3～VDD18+0.3 V A2 *4 Pd 850 mW Operating temperature range Topr -40～+85 ℃ Storage temperature range Tstr -55～+125 ℃ Power dissipation *1 When using more than at Ta=25℃, it is reduced 8.5 mW per 1℃. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Conditions *3 *1 ROHM specification board 70mm× 70mm mounting. 1/9 2011.08 - Rev.A Technical Note BH6260MWX ●Operating conditions (Ta=-40～+85℃) Parameter Input voltage range (VDD) Input voltage range (VDD18) Symbol Ratings Unit VDD 2.9～3.7 V VDD18 1.7～3.6 V Conditions * This product does not especially designed to be protected from radioactivity ●Electrical characteristics (Unless otherwise noted, Ta = 25℃, VDD=3.3V, VDD18=1.8V) Limits Parameter Symbol Unit Min. Typ. Max. Conditions ●Total VDD=3.3V, ENB0/1:L, EN2/3:H VDD=3.3V, ENB0/1:H, EN2/3:L Supply Quiescent Current 1 ICC1 - 0 10 A Supply Quiescent Current 2 ICC2 - 0 10 A Switch ON Resistance 1 Ron1 - 5 10 Ω VIN=0V Switch ON Resistance 2 Ron2 - 8 13 Ω VIN=2.4V Switch OFF Capacitance (A2, A3) Coff - 5.0 - pF f=1MHz Switch ON Capacitance (A0, A1) Con - 10 - pF f=1MHz INV2 Input “L” level VILBUF2 - - 0.25× VDD18 V INV2 Input “H” level VIHBUF2 0.75× VDD18 - - V INV2 Output “L” level VOLBUF2 - 0.15 0.3 V Io=3mA INV2 Output “H” level VOHBUF2 1.50 1.65 - V Io=-3mA INV3 Input “L” level VILBUF3 - - 0.25× VDD18 V INV3 Input “H” level VIHBUF3 0.75× VDD18 - - V INV3 Output “L” level VOLBUF3 - 0.15 0.3 V Io=3mA INV3 Output “H” level VOHBUF3 1.50 1.65 - V Io=-3mA ENBn/ENn input “H” level VIHENB 0.75× VDD - - V ENBn/ENn input “L” level VILENB - - 0.25× VDD V INV3 Input Resister RININV3 50 100 150 kΩ Clamp Diode Voltage1 VIK1 -1.2 -0.73 - V Clamp Diode Voltage2 VIK2 - 0.73 1.2 V A0,B0,A1,B1,A2,A3 Propagation Delay (*1) tPLH, tPHL - - 0.25 ns CL=50pF,RL=500Ω BUS Enable Time (*1) tPZH, tPZL - - 200 ns CL=50pF,RL=500Ω BUS Disable Time (*1) tPHZ, tPLZ - - 200 ns CL=50pF,RL=500Ω www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/9 EN3:H 2011.08 - Rev.A Technical Note BH6260MWX ●Electrical characteristic curves (Reference data) 4.0 0.5 3.5 0.4 0.3 Differential Signals, V 3.0 D+, D- Signals, V 2.5 2.0 1.5 1.0 0.5 0.1 0.0 -0.1 -0.2 -0.3 0.0 -0.4 -0.5 -0.5 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Time (x10* -8) s Time (x10* -9) s Fig.1 Eye Pattern Full Speed Fig.2 Eye Pattern High Speed 5 5 4.5 4.5 4 4 3.5 3.5 3 3 IVDD (uA) IVDD (uA) 0.2 2.5 2 1.5 1.5 1 Ta=105°C Ta=25°C Ta=-60°C 0.5 2.0 2.5 2 1 1.8 Ta=105°C Ta=25°C Ta=-60°C 0.5 0 0 0 0.5 1 1.5 2 2.5 3 3.5 VDD (V) 4 4.5 5 5.5 6 6.5 0 7 Fig.3 ICC vs Input Voltage (SW OFF) 0.5 1 1.5 2 2.5 3 3.5 VDD (V) 4 4.5 5 5.5 6 6.5 Fig.4 ICC vs Input Voltage (SW ON) 10 9.5 Ta=105°C 9 8.5 8 Ta=25°C 7.5 Ron (Ω) 7 6.5 Ta=-60°C 6 5.5 5 4.5 4 3.5 3 2.5 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 A0 (V) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 Fig.5 Ron vs Input Voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/9 2011.08 - Rev.A 7 Technical Note BH6260MWX ●Block diagram and pin configuration VDD A0 Analog SW0 VDD VDD ENB0 A1 Analog SW1 VDD B1 VDD 1 16 VDD ENB0 2 15 EN3 A0 3 14 A3 B0 4 13 B3 ENB1 5 12 EN2 A1 6 11 A2 B1 7 10 B2 GND 8 9 ENB1 VDD18 VDD18 A2 NC B0 VDD18 Analog SW2 VDD18 INV2 VDD B2 VDD VDD EN2 A3 VDD18 Analog SW3 VDD18 INV3 VDD 100k B3 VDD EN3 VDD18 GND Fig.6 Block diagram Fig.7 Pin configuration ●Package Dimensions B 2 H 6 6 0 LOT No. Fig.8 Package Dimensions www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/9 2011.08 - Rev.A Technical Note BH6260MWX ●Pin Description Pin NO. Terminal circuit Pin Name I/O 16 - VDD - Power supply. 9 - VDD18 - Power supply for INV2,3 8 Ground Pin Function - GND - 3,6 4,7 A A 0~1 B 0~1 I/O Analog SW0,1 terminal 11 B A2 O INV2 Output 14 C A3 I INV3 Input 10 D B2 I INV2 Input 13 E B3 O INV3 Output 2,5 F ENB 0-1 I Analog SW0-1 ON/OFF Pin. (ENBn is Low : Analog SW is ON.) 12,15 F EN 2-3 I Analog SW2-3 ON/OFF Pin. (ENn is High : Analog SW is ON.) ●Application Circuit Low Capacitance Switch USB/UART CONNECTOR VDD VDD18 VDD VDD18 B0 A0 USB USB Block Block VDD18 ENB0 B3 A3 100kΩ EN3 B1 A1 UART UART Block Block VDD18 ENB1 B2 A2 EN2 ENB0 ENB1 EN2 EN3 CNT CNT Block Block UART Signal GND Each Enable Signal www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/9 2011.08 - Rev.A Technical Note BH6260MWX ●Equivalent Circuit A B VDD VDD VDD VDD VDD A0,A1 B0,B1 PAD PAD 10k A2 10k C D VDD VDD VDD18 10k 10k B2 A3 10k 100k E F VDD VDD ENB0 ENB1 EN2 EN3 10k B3 PAD www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/9 2011.08 - Rev.A Technical Note BH6260MWX ●Notes for use (1) Absolute maximum ratings If applied voltage (VCC1, VCC2), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures. (2) Recommended operating range This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated. (3) Reverse connection of power supply connector There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the LSI. (4) Power supply lines In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) GND voltage Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential becomes less than a GND by actually including transition phenomena. (6) Shorts between pins and misinstallation When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND. (7) Operation in strong magnetic fields Be careful when using the LSI in a strong magnetic field, since it may malfunction. (8) Inspection in set board When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) Input pins Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics. (10) Ground wiring pattern When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change. (11) Externally attached capacitors When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature. (12) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/9 2011.08 - Rev.A Technical Note BH6260MWX ●Power Dissipation 1 Pd=0.85W Power dissipation :Pd [W] 0.9 0.8 -8.5mW/℃ 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Ta_max=85℃ 0 0 10 20 30 40 50 60 70 80 90 Ambient temperature :Ta [℃] 100 110 120 130 Fig.10 Power dissipation www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/9 2011.08 - Rev.A Technical Note BH6260MWX ●Ordering part number B H Part No. 6 2 Part No. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6 0 M W X パッケージ MWX:USON016X3315 9/9 - E 2 Packaging and forming specification E2: Embossed tape and reel 2011.08 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001