BH6717NUV

1/3 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT SERIES Three-Phase Full-Wave Motor Driver for Fan Motor TYPE FEATURES BH6717NUV Speed controllable by PWM input signal Sensorless drive Soft switched drive Power save function 〇ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Power dissipation Operating temperature Storage temperature Output current FG signal output voltage FG signal output current Junction temperature Symbol VCC Pd Topr Tstg Iomax VFG IFG Tjmax Limit -0.3～6.5 560＊ -25～+95 -55～+125 700＊＊ 6.5 6 125 Unit V mW ℃ ℃ mA V mA ℃ ＊ Reduce by 5.6mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) ＊＊ This value is not to exceed Pd. 〇OPERATING CONDITIONS Parameter Operating supply voltage range Symbol VCC Limit 1.8～5.5 Unit V ＊This product is not designed for production against radioactive rays. ＊This document may be strategic data subject to COCOM regulations. REV. A 2/3 〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,VCC=5V) Parameter Symbol ICST ICC VPH VPL IPH IPL FP VFRH VFRL TPO VLM VO VFGL LDT LRT RLT Min. 1.5 2.5 0 -50 20 4.5 0 500 0.2 2.5 9 Limit Typ. 20 4 0 -20 1000 0.25 0.25 0.5 5 10 Max. 50 6.5 VCC 0.7 1 50 VCC 0.5 2000 0.3 0.325 0.4 10 - Unit μA mA V V μA μA kHz V V μs V V V s s - Conditions Circuit current STB Circuit current PWM input H level PWM input L level PWM input current H PWM input current L Input frequency FR input H level FR input L level PWM off time Limit voltage Output voltage FG low voltage Lock protection det.time Lock protection rel.time Lock protection ratio PWM=VCC PWM=GND FR=H : Reverse drive FR=L : Forward drive Io＝250mA (H.L. total) IFG＝5mA rel.time/det.time ratio 〇PACKAGE OUTLINES BH6 717 LOT No. 〇BLOCK DIAGRAM VSON010V3030 (UNIT:mm ) 〇Terminal name Terminal name Pin No. TSD UVLO FG Det Level BEMF Det 1 2 COM VCC U 1uF FG COM VCC U RNF W V GND FR PWM OSC Logic 3 4 5 6 7 8 9 10 PWM Pre FR V W RNF GND REV. A 3/3 〇CAUTIONS 1) Absolute maximum ratings There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction, a failure mode can not be defined (short mode or open mode). Therefore when special mode is envisaged where absolute maximum rating may be exceeded, please take a physical safety measure such as fuse. 2) Reverse connection of power supply connector Reverse connection of power supply connector may break IC. Take a measure against reverse connection destruction such as inserting a diode between power supply and Vcc terminal. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current, and fully ensure that the capacitor characteristics have no problem before determine a capacitor value 4) GND potential Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Consider the power dissipation under actual use condition and apply thermal design with sufficient margin. 6) Mounting failures In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting failures may break IC. In addition, destruction is also possible when circuit is shorted by foreign substance brought between outputs or between output and power supply - GND. 7) Operation in strong electromagnetic field Use in strong electromagnetic field may cause malfunction, please be careful. 8) ASO Consider that the output Tr does not exceed the absolute maximum rating and ASO. 9) Thermal shut down circuit This IC has thermal shut down (TSD) circuit. Operation temperature is 150℃(typ.) and has a hysteresis width of 15℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is simply for the purpose of intercepting IC from overheating, and not for protecting and assuring IC. Therefore do not continue to use IC thereafter with this circuit operating and do not use IC assuming the operation of this circuit. 10) Inspection with a set board When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may possibly be applied to IC, therefore be sure to apply discharging in each process. In attaching to and detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off power before removing IC. In addition, apply grounding to assembling process as a measure of anti-static electricity, and use full caution in transporting and storing. 11) GND wiring pattern When there are small signal GND and large current GND, separate the large current GND pattern from small signal GND pattern. It is recommended to apply one-point grounding at the reference point of the set in order that resistance of wiring pattern and large current do not cause change of voltage of small signal GND. Please be cautious not to fluctuate the wiring pattern of GND of external mounted parts. 12) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 13) FR function Swiching H/L of FR terminal should not be done during the motor rotation. it should be done from once the motor stop. FR terminal should be connected to VCC or GND for reducing PWM noise. REV. 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