BH7606GU

1/4 Structure Product name Type Function Silicon Monolithic Integrated Circuit Low voltage operation wide band 3-outputs video driver with LPF BH7606GU ・ ・ ・ ・ ・ ・ Built in 3-output video drivers for Y, PB and PR signal B uilt in 6dB AMP B uilt in standby function (0µA TYP) B uilt in LPF (Y : fc=27MHz, PB/PR : fc=15MHz) N o output coupling capacitor required Small package 15-Bump WL-CSP(2.26x2.26x1.0[mm]) ※ Radiation resistance is not included in the design. ■Absolute Maximum Ratings Parameter CP_VCC Supply voltage V_VCC Supply voltage V_VCC to CP_VCC voltage V_GND to CP_GND voltage （Ta=25℃） Symbol Vcp Vv Vcc Vgg Vin1 Vin2 Pd Tstg Limits 3.55 3.55 -0.3～+0.3 0 -0.3~(V_VCC+0.3) (VEE_IN)-0.3 ~(V_VCC+0.3) 920 -55～+125 Unit Ｖ V V V V V ｍW ℃ Condition CP_VCC - (CP_GND or V_GND) V_VCC - ( CP_GND or V_GND) V_VCC - CP_VCC V_GND - CP_GND STBY Y_IN, PB_IN, PR_IN ＊ Input voltage 1 Input voltage 2 Power dissipation Storage temperature ＊ In case mounting on a (110mm × 100mm × 1.6mm) grass-epoxy PCB. ＊ Reduced by 9.2 mW/C at 25C or higher. ■Operating range （Ta=25℃） Parameter CP_VCC Supply voltage V_VCC Supply voltage Operating temperature Symbol Vcpo Vvo Topr Rating. 2.85 ~ 3.45 2.85 ~ 3.45 -40 ~ +85 Unit Ｖ Ｖ ℃ REV. A 2/4 ■Electrical characteristics 【Unless otherwise noted, Ta=25℃，CP_VCC=V_VCC=3V】 Limits Min. Typ. 70 0 6.0 4.0 -1.5 -1.0 -1.0 -26 -35 -35 -70 150 0 － － 150 Max. 90 2 6.5 － 1.0 1.0 1.0 -15 -28 -28 -50 200 100 V_VCC 0.45 200 mA μA dB Vp-p dB dB dB dB dB dB dB kΩ mV V V kΩ No signal Standby mode Vin=1.0Vpp , f=100kHz THD=1%, f=10kHz Vin=1.0Vpp , f=27M/100kHz Vin=1.0Vpp , f=15M/100kHz Vin=1.0Vpp , f=15M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=54M/100kHz Vin=1.0Vpp , f=4.43MHz Y/PB/PR_IN－V_GND Parameter Symbol Unit conditions ACTIVE Circuit current STANDBY Y/PB/PR_OUT Voltage gain Y/PB/PR_OUT Maximum output level Y_OUT Frequency characteristics 1 PB_OUT Frequency characteristics 1 PR_OUT Frequency characteristics 1 Y_OUT Frequency characteristics 2 PB_OUT Frequency characteristics 2 PR_OUT Frequency characteristics 2 Cross talk Y/PB/PR_IN Input impedance Y/PB/PR_OUT Output DC offset STBY Input voltage H STBY Input voltage L STBY Input impedance Icc1 Icc2 GV Vomv Gf1Y Gf1PB Gf1PR Gf2Y Gf2PB Gf2PR CT RinV Voff VthH VthL RinST 50 － 5.5 3.2 -4.5 -3.0 -3.0 － － － － 100 -100 V_VCC -1.2 0.0 100 Terminated 75Ω ACTIVE mode STANDBY mode STBY－V_GND ■Control pin settings Parameter Status Operational mode ACTIVE STANDBY H STANDBY (B3) L OPEN REV. A 3/4 ■Physical dimensions ・ Block diagram B3 STBY H606 D3 Y_IN Stby V_VCC C2 LOT No. 27MHz LPF 6dB Y_OUT D2 D4 PB_IN 15MHz LPF 6dB PB_OUT D1 C4 PR_IN 15MHz LPF 6dB PR_OUT C1 C3 V_GND A3 CP_GND NVCC VEE_IN B1 B4 CP_VCC C harge Pump C_PLUS C_MINUS VEE_OUT A1 A4 A2 （UNIT: mm） Fig.１. Physical dimensions（VCSP85H2） Fig.2. Block diagram ■Pin assignment Symbol A1 A2 A3 A4 B1 B3 B4 Pin name VEE_OUT C_MINUS CP_GND C_PLUS VEE_IN STBY CP_VCC Symbol C1 C2 C3 C4 D1 D2 D3 D4 Pin name PR_OUT V_VCC V_GND PR_IN PB_OUT Y_OUT Y_IN PB_IN Table. 1. Pin assignment REV. A 4/4 ■Cautions on use (1) Absolute maximum ratings If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you think of a case in which absolute maximum ratings are exceeded, enforce fuses or other physical safety measures and investigate how not to apply the conditions under which absolute maximum ratings are exceeded to LSI. (2) VEE line Connect VEE_IN(B1) and VEE_OUT(A1) as shortly as possible on a board. (3) GND line Connect CP_GND(A3) and V_GND(C3) to board’s GND layer with thick line as shortly as possible. When every GND line’s common impedance becomes large, the noise characteristic sometimes deteriorates. (4) VCC line Short CP_VCC(B4) and V_VCC(C2) on the board, and supply voltage from the identical power. At the same time, place decoupling capacitor near the VCC pins. (5) Cross talk Board layout affects the cross talk. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (6) The noise characteristic of video signal Board layout affects the noise characteristic of video signal. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (7) Thermal design Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in actual states of use. (8) Shorts between pins and miss-installation When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is miss-installed and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and GND. (9) Operation in strong magnetic fields Adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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