Datasheet
Pressure Sensor series
Pressure Sensor IC
BM1390GLV-Z
General Description
Key Specifications
BM1390GLV-Z is piezo-resistive pressure sensor.
BM1390GLV-Z performs temperature compensation for
MEMS inside chip internally, so it’s very easy to get
pressure information. BM1390GLV-Z realizes waterproof
by potting gel inside to protect.
Package
Features
Pressure Range:
300 hPa to 1300 hPa
Relative Pressure Accuracy:
±0.06 hPa(Typ)
Absolute Pressure Accuracy:
±1 hPa(Typ)
Operating Temperature Range: -40 °C to +85 °C
RLGA10VG020T
Piezo-resistive pressure sensor
Pressure range is from 300 hPa to 1300 hPa
Built-in temperature compensation
function.
I2C bus interface (f/s mode support)
Built-in FIFO
Small package
Waterproof
W (Typ) x D (Typ) x H (Max)
2.0 mm x 2.0 mm x 1.0 mm
Applications
Smartphone, Healthcare, Mobile device (e.g. game).
Typical Application Circuit and Block Diagram
Regulator
(internal)
VREG
VDD
Memory
VSS
Pressure Sensor
Mux
ADC
signal
processing
Temperature
Sensor
I2 C
SDA
SCL
HOST
DRI
Clock
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit and Block Diagram ................................................................................................................................ 1
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 4
Electrical Characteristics................................................................................................................................................................. 5
I2C Bus Timing Characteristics ....................................................................................................................................................... 6
I2C Bus Communication .................................................................................................................................................................. 6
I2C bus Slave Address .................................................................................................................................................................... 7
Register Map .................................................................................................................................................................................. 7
FIFO ............................................................................................................................................................................................. 14
Interrupt function ........................................................................................................................................................................... 16
Typical Performance Curves......................................................................................................................................................... 17
Control Sequence..........................................................................................................................................................................18
Application Example ..................................................................................................................................................................... 23
I/O Equivalent Circuits .................................................................................................................................................................. 24
Operational Notes ......................................................................................................................................................................... 25
Ordering Information ..................................................................................................................................................................... 26
Marking Diagram ...........................................................................................................................................................................26
Physical Dimension and Packing Information ............................................................................................................................... 27
Revision History ............................................................................................................................................................................ 28
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Pin Configuration
Top View
2
1
SCL
VREG
3
10
N.C.
VDD
4
9
SDA
VSS
5
8
N.C.
6
7
N.C.
DRI
N.C.
Pin Description
Pin No.
Pin Name
1
VREG
Internal power supply pin(Note 1)
Function
2
SCL
I2C serial bus clock pin (Note 2)
3
N.C.
No connection (Set to open)
4
SDA
I2C serial bus data pin (Note 2)
5
N.C.
No connection (Set to open)
6
N.C.
No connection (Set to open)
7
DRI
Interrupt notice output pin(Note 2)
8
N.C.
No connection (Set to open)
9
VSS
Ground pin
10
VDD
Power voltage pin(Note3)
(Note 1) Dispose a bypass capacitor as close as possible to the IC.
Dispose a bypass capacitor of 0.1 µF between VREG and VSS.
Do not use this pin for external power source.
(Note 2) When there is other device which is connected to the SDA, the SCL or the DRI pins and its signal falls sharply,
that might generate undershoot and the pin voltage might go below ground. When such undershoot occurs,
a measure like disposing a capacitor near the pins of the device must be taken.
(Note 3) Dispose a bypass capacitor as close as possible to the IC.
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Power Supply
Symbol
Rating
Unit
VDD
4.5
V
Voltage1(Note 1)
VIN1
V
Input Voltage2(Note 2)
VIN2
Tstg
-0.3 to +4.5
-0.3 to (VDD+0.3) or +4.5
whichever is less
-40 to +125
°C
Tjmax
125
°C
POVR
20000
hPa
Input
Storage Temperature Range
Maximum Junction Temperature
Pressure
V
(Note 1) DRI, SCL, SDA pin
(Note 2) except DRI, SCL, SDA pin
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 3)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 5)
2s2p(Note 6)
θJA
289.5
151.4
°C/W
ΨJT
73
62
°C/W
RLGA10VG020T
Junction to Ambient
Junction to Top Characterization
Parameter(Note 4)
(Note 3) Based on JESD51-2A(Still-Air)
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 5) Using a PCB board based on JESD51-3.
(Note 6) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply
VDD
1.7
1.8
3.6
V
Input Voltage(Note 7)
VIN1
0.0
-
3.6
V
I2 C
Clock Input Frequency
Operating Temperature
fSCL_I2C
-
-
400
kHz
Topr
-40
+25
+85
°C
(Note 7) DRI, SCL, SDA pin
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Electrical Characteristics (Unless otherwise specified VDD = 1.8 V Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
ISS
-
1
5
µA
PWR_DOWN = 0, RSTB = 0
L Input Voltage(Note 1)
VIL
-
-
0.3 x
VDD
V
H Input Voltage(Note 1)
VIH
-
-
V
Current Consumption
Power Down Mode Current
Logic
L Input Current(Note 1)
IIL
0.7 x
VDD
-10
-
-
μA
VIL = GND
H Input Current(Note 1)
IIH
-
-
μA
VIH = VDD
L Output Voltage 1(Note 2)
VOL1
-
-
V
IL = -0.3 mA
L Output Voltage 2(Note 3)
VOL2
-
-
10
0.2 x
VDD
0.2 x
VDD
V
IL = -3 mA
PR
300
-
1300
hPa
PREL
-
±0.06
-
hPa
Absolute Pressure Accuracy
PABS
-
±1
-
hPa
Temperature Accuracy
TABS
-
±2
-
°C
25 °C to 85 °C
tM
-
-
20
ms
AVE_NUM = 011
Pressure characteristics
Pressure Detection Range
Relative Pressure
Measurement
Accuracy(Note 4)
Time(Note 5)
0 °C to 65 °C
950 hPa to 1050 hPa
10 hPa step
1000 hPa
(Note 1) SDA, SCL pin
(Note 2) DRI pin
(Note 3) SDA pin
(Note 4) Target values
(Note 5) Measurement time is changed by average number of measurement data. It is written in Measurement time more detail.
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I2C Bus Timing Characteristics (Unless otherwise specified VDD = 1.8 V, Ta = 25 °C)
VIH
VIH
SDA
P: STOP
S: Repeated START
S: START
VIL
VIH
VIL
VIL
S: START
VIH
VIL
tBUF
tHD;STA
tSU;DAT
VIH
SCL
tLOW
tHD;STA
VIH
VIH
VIL
VIL
VIH
VIH
VIH
VIL
tHIGH
tHD;DAT
Parameter
Symbol
tSU;STA
tSU;STO
Min
Typ
Max
Unit
SCL Clock frequency
fSCL
0
-
400
kHz
‘L’ Period of the SCL Clock
tLOW
1.3
-
-
µs
‘H’ Period of the SCL Clock
tHIGH
0.6
-
-
µs
Setup Time for Repeated START
tSU;STA
0.6
-
-
µs
Hold Time for START
tHD;STA
0.6
-
-
µs
Data Setup Time
tSU;DAT
100
-
-
ns
Data Hold Time
tHD;DAT
0
-
-
µs
Setup Time for STOP
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
Bus Free Time between STOP and START
Conditions
I2C Bus Communication
1. Write Format
(1) Indicate register address
S
W
0
Slave Address
ACK
Register Address
ACK
ACK
Register Address
ACK
P
(2) Write data after indicating register address
S
W
0
Slave Address
Data specified at register
address field
ACK
・・・
ACK
Data specified at register
address field + N
ACK
P
NACK
P
NACK
P
2. Read Format
(1) Read data after indicating register address
S
Slave Address
W
0
ACK
Register Address
ACK
S
Slave Address
R
1
ACK
Data specified at register
address field
ACK
Data specified at register
address field + 1
ACK
・・・
ACK
Data specified at register
address field + N
(2) Read data from the specified register
S
Slave Address
Data specified at register
address field + 1
from master to slave
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R
1
ACK
ACK
・・・
Data specified at register
address field
ACK
ACK
Data specified at register
address field + N
from slave to master
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I2C bus Slave Address
The slave address is “1011101”.
Register Map(Note 1)
Register
Address
Register Name
R/W
0x0F
MANUFACTURER ID
R
MANUFACTURER ID [7:0]
0x10
PART ID
R
PART ID [7:0]
0x12
POWER_DOWN
RW
0
0
0
0
0x13
RESET
RW
0
0
0
0x14
MODE_CONTROL
RW
0x15
IIR, FIFO
CONTROL
RW
FIFO_
EN
WTM_
LEVEL
0x18
FIFO data
R
0
0x19
STATUS
R
0
0x1A
0x1B
PRESSURE
0x1C
0x1D
0x1E
D6
D5
D2
D1
D0
0
0
0
PWR_
DOWN
0
0
0
0
RSTB
DR_EN
FULL
_EN
WTM
_EN
MODE[1:0]
0
0
0
0
IIR_MODE[1:0]
0
0
0
0
0
0
0
0
AVE_NUM[2:0]
D4
D3
FIFO_LEV[2:0]
RD_
FULL
R
PRESS_OUT[15:8]
R
PRESS_OUT[7:0]
R
TEMPERATURE
D7
PRESS_OUT_XL[5:0]
R
TEMP_OUT[15:8]
R
TEMP_OUT[7:0]
RD_
WTM
RD_
DRDY
0
0
(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.
Address from 0x14 to 0x1E registers can be accessed only when PWR_DOWN = 1 and RSTB = 1. (In other case Write: Ignored, Read: 0xXX)
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Register Map – continued
(0x0F) MANUFACTURER ID
Fields
MANUFACTURER ID [7:0]
Function
Manufacturer ID: 0xE0
(0x10) PART ID
Fields
PART ID [7:0]
Function
Part ID: 0x34
(0x12) POWER_DOWN
Fields
Function
0: power down
1: active
PWR_DOWN
default value 0x00
(0x13) RESET
Fields
RSTB
Function
0: Measurement control block is reset
1: Measurement control block is active
default value 0x00
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Register Map – continued
(0x14) MODE_CONTROL
Fields
Function
AVE_NUM[2:0]
Seting of the averaging number of measurement data
011: 8 times, 100: 16 times, 101: 32 times, 110: 64 times, other: Prohibited
DR_EN
DRI pin Enable for Data Ready
Details are written in Interrupt.
0: DRI pin Disable, 1: DRI pin Enable
FULL_EN
DRI pin Enable for FULL
Details are written in Interrupt.
0: DRI pin Disable, 1: DRI pin Enable
WTM_EN
DRI pin Enable for Water Mark
Details are written in Interrupt.
0: DRI pin Disable, 1: DRI pin Enable
MODE[1:0]
Measurement mode setting (Pressure and Temperature are measured at one rate)
00: Standby, 01: One shot, 10: Continuous, 11: Prohibited
default value 0x00
(0x15) IIR, FIFO CONTROL
Fields
Function
FIFO_EN
FIFO mode setting
Details are written in FIFO.
0: Bypass mode, 1: FIFO mode
WTM_LEVEL
Water Mark level setting
Details are written in FIFO.
0: Water Mark interrupt occur when FIFO memory is 2 or above.
1: Water Mark interrupt occur when FIFO memory is 3 or above.
IIR_MODE[1:0]
IIR filter enable and coefficient setting
00: IIR OFF, 01: IIR ON (weak)
10: IIR ON (middle), 11: IIR ON (strong)
When using IIR filter, set 110 to “AVE_NUM” and 10 to “MODE”.
default value 0x00
Measurement time and RMS noise against number of average
Measurement
Measurement
AVE_NUM
IIR_MODE
time tM
cycle tI
max[ms]
max[ms]
011
00
20
25
RMS noise
[hPa]
0.032
100
00
40
50
0.023
101
00
76
100
0.016
110
00
152
200
0.011
110
01
152
200
0.0072
110
10
152
200
0.0034
110
11
152
200
0.0016
RMS noise is calculated as standard deviation of 32 data points (1σ).
RMS noise is a reference value and it’s not the value with guarantee.
Condition VDD = 1.8 V, Ta = 25 °C
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Register Map – continued
Measurement time
One shot mode performs one measurement. Measurement data is updated when measurement completed, so it
should be read more than tM after measurement start.
Continuous mode repeats measurement in every measurement cycle tI. The latest measurement data which is
completed is read.
Measurement time tM and measurement cycle tI is determined by number of average.
Measurement
cycle tI
Pressure data of first time
measurement is read.
Measurement time tM
Measurement time tM
Measurement
First Measurement
Measurement
Start of
measurement
Second measurement
Start of
measurement
Start of
measurement
IIR filter
RMS noise can be reduced by setting IIR filter in addition to the setting of number of averaging. When IIR filter is ON
and pressure input fluctuates, a response time tR to reach a target value delays.
Pressure Value
Input
100%
Output
63%
0
tR
Time
Response time against IIR coefficient
AVE_NUM
IIR_MODE
Response time tR
[ms]
110
01
352
110
10
952
110
11
3352
Response time is a reference value and it’s not the value with guarantee.
Condition VDD = 1.8 V, Ta = 25 °C, MODE = 10
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Register Map – continued
Operation mode transition
Operation mode transition is like the chart below.
Power down mode is the smallest current consumption mode due to circuit is OFF. Set this mode when reducing
current consumption. Measurement is not available in this mode, so the measurement is performed after switching to
standby mode.
In reset mode, regulator for internal blocks is active and measurement control block is reset. Register is initialized in
Reset mode. Measurement command is acceptable when “1” is written in “RSTB”
There are 2 measurement modes. One shot mode and Continuous mode. They are transferred from standby mode.
Then, set “AVE_NUM” register at the same time.
Write “00” in “MODE” (address = 0x14) when transferring to standby mode again.
In one shot mode, a single measurement is performed when “01” is written in “MODE”. After the measurement
completes, it is transferred to standby mode automatically. When “00” is written in “MODE” before end of
measurement, mode is switched to standby immediately but pressure value is not updated.
Transition to the other measurement mode during measurement in one shot mode is forbidden.
In Continuous mode, when “10” is written in “MODE”, measurement starts and it continues until “00” is written in
“MODE”. Transition to the other measurement mode from Continuous mode is forbidden.
0xYYZZ (send command)
YY: Address
ZZ: Data
Power Down
Regulator ：OFF
Processing ：OFF
0x1200
0x1201
Reset
Regulator：ON
Processing ：OFF
0x1300
0x1301
0x14X0
Stand by
Regulator：ON
Processing：ON
0x14X1
0x14X2
After measurement
time tM
or
0x14X0
One Shot
0x14X0
Continuous
Prohibition
0x14X1
→Prohibited
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0x14X2
→Prohibited
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Register Map – continued
(0x18) FIFO data
Fields
Function
FIFO_LEV[2:0]
Number of sample in FIFO
default value 0x00
FIFO_LEV[2:0]
D2
D1
D0
Description
0
0
0
FIFO empty
0
0
1
Number of sample in FIFO = 1
0
1
0
Number of sample in FIFO = 2
0
1
1
Number of sample in FIFO = 3
1
0
0
FIFO FULL
(0x19) STATUS
Fields
RD_FULL
RD_WTM
RD_DRDY
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Function
FIFO overrun (FULL) status
This register is cleared when this is read.
RD_FULL is not updated unless data are read.
0: FIFO is not full;
1: FIFO is full.
FIFO threshold (Water Mark) status
This register is cleared when FIFO memory become less than threshold level.
0: Number of sample in FIFO is lower than threshold level.
1: Number of sample in FIFO is equal or higher than threshold level.
Pressure and temperature measurement data ready bit
This register is cleared when ‘1’ is read.
Do not care RD_DRDY in FIFO mode (FIFO_EN = 1).
0: data is not updated
1: data is updated
default value 0x00
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Register Map – continued
(0x1A / 0x1B / 0x1C) PRESSURE
Fields
PRESS_OUT[15:0]
PRESS_OUT_XL[5:0]
Function
pressure data
default value 0x000000
Conversion to pressure value is below.
Pressure counts = PRESS_OUT[15:8] x 214 + PRESS_OUT[7:0] x 26 + PRESS_OUT_XL[5:0] [counts] (dec)
Pressure value [hPa] = Pressure counts [counts] / 2048 [counts/hPa]
Data registers (0x1A, 0x1B, 0x1C) should be read by burst read.
Data is updated at the timing of measurement completion.
If they are not read by burst read, data might be mixed up with the data of different measurement.
(0x1D / 0x1E) TEMPERATURE
Fields
TEMP_OUT[15:0]
Function
temperature data
default value 0x0000
Conversion to temperature value is below. Note that TEMP_OUT is data with sign (two’s complement).
Temp counts = TEMP_OUT[15:8] x 28 +TEMP_OUT[7:0] [counts] (dec)
Temperature value [°C] = Temp counts [counts] / 32 [counts/°C]
(in case of positive number)
Data registers (0x1D,0x1E) should be read by burst read.
Data is updated at the timing of measurement completion.
If they are not read by burst read, data might be mixed up with the data of different measurement.
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FIFO
This IC embeds a 4-slot FIFO to store the pressure and temperature output values.
FIFO has Bypass mode (FIFO_EN = 0) and FIFO mode (FIFO_EN = 1).
In FIFO mode, the pressure output data are stored in FIFO when measurement is completed.
The data is read from oldest data. Temperature output data are not stored in FIFO.
Interrupt for WTM and FULL is available in FIFO mode.
WTM interrupt is enable when WTM_EN is set to ‘1’. In this mode, when FIFO memory reach the number set in
WTM_LEVEL, RD_WTM goes to ‘1’.
FULL interrupt is enable when FULL_EN is set to ‘1’. In this mode, when 4 data are stored in FIFO, RD_FULL goes to ‘1’.
FIFO_LEV is the number of sample in FIFO.
FIFO is only available in Continuous mode.
FIFO is not operational in Bypass mode (FIFO_EN = 0).
New data is overwritten to old data due to only the first slot of FIFO is in use.
FIFO and FIFO_LEV are initialized in Bypass mode.
FIFO
Pressure data 0
Pressure data 1
Pressure data 2
Pressure data 3
FIFO is operational in FIFO mode (FIFO_EN = 1).
Pressure data is read from the address 0x1A, 0x1B and 0x1C.
The data is read from oldest data. FIFO stops storing data when FIFO is FULL.
The latest temperature data is read from the address 0x1D and 0x1E.
FIFO
Pressure data 0
Pressure data 1
Pressure data 2
Pressure data 3
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FIFO – continued
Water Mark interrupt
Water Mark interrupt occur when stored data in FIFO is equal to or more than the number set in WTM_LEVEL.
Water Mark level is selectable from 2 (WTM_LEVEL = 0) and 3 (WTM_LEVEL = 1).
RD_WTM goes to ‘1’ when Water Mark interrupt occur
Water Mark interrupt keep active state while FIFO_LEV is equal to or more than WTM_LEVEL. And it is released, when
FIFO_LEV go below WTM_LEVEL.
The DRI pin status is determined by Water Mark interrupt, when WTM_EN is ‘1’.
Case of Water Mark occurs at 2 of Water Mark level
FIFO
Pressure data 0
Pressure data 1
Pressure data 2
Pressure data 3
FULL interrupt
FULL interrupt occur when stored data in FIFO is 4. RD_FULL goes ‘1’.
RD_FULL goes ‘0’ when RD_FULL is read.
FIFO and RD_FULL are not updated by measurement after FULL interrupt occur. Then FIFO_LEV is fixed to 4.
The DRI pin status is determined by FULL interrupt, when FULL_EN is ‘1’.
Case of FULL occurs
FIFO
Pressure data 0
Pressure data 1
Pressure data 2
Pressure data 3
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Interrupt Function
Interrupt factor is Data Ready, FIFO FULL and FIFO WTM.
The condition is listed below.
The status register is always operational.
The status register goes ‘1’ when interrupt occur.
When the DRI pin enable register for each factor is ‘1’, the DRI pin status is determined by the interrupt state of factor.
When interrupt occur, the DRI pin output ‘L’.
The status register and the DRI pin keeps the state until the interrupt is cleared.
FIFO FULL and FIFO WTM are not available in Bypass mode (FIFO_EN = 0)
Do not care Data Ready in FIFO mode (FIFO_EN = 1).
Interrupt factor
Factor
Data Ready
FIFO FULL
FIFO WTM
Status Register
RD_DRDY
RD_FULL
RD_WTM
Interrupt Condition
Measurement completion
FIFO is Full
FIFO_LEV ≥ WTM level
Interrupt Clear Condition
Read RD_RDRY
Read RD_FULL
FIFO_LEV < WTM level
Relation between factor and the DRI pin enable
Factor
DRI Pin Enable
Data Ready
DR_EN
FIFO FULL
FULL_EN
FIFO WTM
WTM_EN
The DRI pin is Nch open drain so this pin should be pull-up to voltage source by an external resister.
The DRI pin is high impedance just after VDD is supplied.
The DRI pin becomes inactive (High impedance) by reading RD_DRDY register or setting reset mode.
VDD current (approximately 6 µA at VDD = 1.8 V) is consumed during DRI is active.
When disabling interrupt function, it has to be done after clearing interrupt.
Operation mode
Stand by
One shot
Stand by
One shot
Stand by
One shot
Stand by
High
DRI pin
Low
Write
MODE = 01
data is
ready
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TSZ22111 • 15 • 001
Read
0x19
Write
MODE = 01
16/28
data is
ready
Write
MODE = 01
data is
ready
Read
0x19
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Typical Performance Curves
(Reference data)
(Unless otherwise specified VDD = 1.8 V Ta = 25 °C)
1000
Peak Current of Pressure Measurement [µA]
Power Down Mode Current:ISS[µA]
20
18
16
14
12
10
8
6
4
2
0
1.6
2.0
2.4
2.8
3.2
Supply Voltage:VDD[V]
3.6
800
700
600
500
400
300
200
100
0
1.6
Figure 1. Power Down Mode Current vs Supply Voltage
(PWR_DOWN = 0, RSTB = 0)
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900
2.0
2.4
2.8
3.2
Supply Voltage:VDD[V]
3.6
Figure 2. Peak Current of Pressure Measurement vs
Supply Voltage
(During measurement)
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Control Sequence
1. Power-on Sequence
VDD
VDD(Min)
0.4 V
tPSC
tSC1
tSC2
Command
POWER_DOWN
0x1201
I2 C
Parameter
Command
RESET
0x1301
Command
Acceptable
Symbol
Min
Typ
Max
Unit
Command input time after power-on
tPSC
100
-
-
µs
Reset cancel wait time
tSC1
1
-
-
ms
Measurement command wait time
tSC2
100
-
-
µs
Conditions
VREG: 0.1 µF
tPSC after VDD power-on, command can be input.
Send reset cancel command (RSTB = 1) more than tsc1 after regulator for internal blocks become active (PWR_DOWN = 1).
Send measurement command more than tsc2 after reset cancel command.
2. Power-off sequence
tPSL
VDD
VDD(Min)
tCPS
I2 C
Command
RESET
0x1300
Parameter
0.4 V 0.4 V
Command
POWER_DOWN
0x1200
Symbol
Min
Typ
Max
Unit
Wait time from power down
command
tCPS
0
-
-
µs
Power supply OFF time
tPSL
1
-
-
ms
Conditions
Send reset command (RSTB = 0) to turn regulator for internal blocks off (PWR_DOWN = 0) tCPS before the VDD power-off.
Keep VDD Low (VDD < 0.4 V) more than tPSL before VDD power-on
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Control sequence – continued
3. Starting sequence
power supply
wait for more
than 0.1 ms
POWER_DOWN setting
Write:0x1201
： release Power down
wait for more
than 1 ms
RESET setting
Write:0x1301
： release Reset mode
wait for more
than 0.1 ms
Completion of
starting sequence
： Completion of operation preperation
4. Measurement sequence: One Shot Mode
Starting
sequence
yes
MODE_CONTROL setting
Write:0x14XX
MODE_CONTROL setting
Write:0x14XX
(DR_EN = 0, MODE = 01)
(DR_EN = 1, MODE = 01)
H
no
Enable DRI？
wait for the end of
measurement
DRI pin
L
：
no
measurement mode setting. it starts pressure
and temperature measurement.
： wait interrupt(DRI = 'L') or measurement end
yes
read STATUS
Read:0x19
：
check interrupt status
The DRI pin is set to 'H' by reading.
read PRESSURE
Read:0x1A to 0x1C(Note 1)
Measurement
complestion
(Note 1) Data registers (0x1A, 0x1B, 0x1C) should be read by burst read.
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Control sequence – continued
5. Measurement sequence: Continuous Mode (25 ms/50 ms/100 ms/200 ms)
Starting
sequence
yes
H
no
Enable DRI？
MODE_CONTROL setting
Write:0x14XX
(DR_EN = 1,MODE = 10)
MODE_CONTROL setting
Write:0x14XX
(DR_EN = 0,MODE = 10)
DRI pin
wait for the end of
measurement
L
：
no
： wait interrupt(DRI = 'L') or measurement end
yes
read STATUS
Read:0x19
no
measurement mode setting. it starts
pressure and temperature measurement.
：
read PRESSURE
Read:0x1A to 0x1C(Note 1)
read PRESSURE
Read:0x1A to 0x1C(Note 1)
measurement
stop？
measurement
stop？
yes
check interrupt status
The DRI pin is set to 'H' by reading.
： read Pressure data
no
： end judgement of Continuous mode
yes
shift to Stand-by mode. At the timing of
： setting the command it stops measurement
and shifts to Stand-by mode.
MODE_CONTROL setting
Write:0x14X0
Measurement
complestion
(Note 1) Data registers (0x1A, 0x1B, 0x1C) should be read by burst read.
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Control sequence – continued
6. Measurement sequence: Use case of FIFO
Starting
sequence
FIFO setting
Write:0x15XX
(FIFO_EN = 1)
yes
MODE_CONTROL setting
Write:0x14XX
(WTM_EN = 1,MODE = 10)
H
no
Enable DRI？
MODE_CONTROL setting
Write:0x14XX
(WTM_EN = 0,MODE = 10)
wait for certain time
DRI pin
no
：
measurement mode setting. it starts pressure
and temperature measurement.
： wait interrupt(DRI = 'L') or certain time
yes
L
(Note 2)
no
no
read data
(Note1)
1)
Read:0x1A
0x1E(Note
Read:0x1A to
to 0x1C
read data
(Note 1)
1)
Read:0x1A
0x1E(Note
Read:0x1A to
to 0x1C
read stop?
read stop?
yes
yes
read FIFO_LEV
Read:0x18
read FIFO_LEV
Read:0x18
measurement
stop？
measurement
stop？
yes
： read measurement data
no
： check number of sample in FIFO
no
： end judgement of Continuous mode
yes
shift to Stand-by mode. At the timing of setting
： the command it stops measurement and shifts
to Stand-by mode.
MODE_CONTROL setting
Write:0x14X0
Measurement
complestion
(Note 1) Data registers (0x1A, 0x1B, 0x1C) should be read by burst read.
(Note 2) During a period form a start of FIFO reading (write to address 0x1A) to FIFO_LEV reading (write to address 0x18), do not communicate with this
device. When communicating with this device during FIFO reading, read FIFO_LEV and finish FIFO read sequence before other communication. If
don't read FIFO_LEV before other communication, there is a possibility to lose FIFO data.
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Control sequence – continued
7. Ending sequence
Measurement
complestion
RESET setting
Write:0x1300
POWER_DOWN setting
Write:0x1200
： Reset
： power down
VDD OFF
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Application Example
Regulator
(internal)
VREG
VDD
0.1 µF
0.1 µF
Memory
VSS
Pressure Sensor
Mux
ADC
signal
processing
I2 C
SDA
SCL
DRI
Temperature
Sensor
Clock
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BM1390GLV-Z
I/O Equivalent Circuits
Pin Name
Equivalent Circuit
SCL
DRI
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VDD
Pin Name
Equivalent Circuit
VDD
SDA
VREG
24/28
VDD
VDD
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BM1390GLV-Z
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
M
1
3
9
Part Number
0
G
L
V
-
Package
GLV: RLGA10VG020T
Z
TR
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
RLGA10VG020T
(TOP VIEW)
Pin 1 Mark
Part Number Marking
BM1390
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LOT Number
TSZ02201-0525AFB20020-1-2
30.Sep.2020 Rev.001
BM1390GLV-Z
Physical Dimension and Packing Information
Package Name
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RLGA10VG020T
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BM1390GLV-Z
Revision History
Date
Revision
30.Sep.2020
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
