Datasheet
Magnetic Sensor series
3-Axis Digital Magnetometer IC
BM1422AGMV
General Description
Key Specifications
BM1422AGMV is a 3-axis magnetic sensor which
incorporates magneto-impedance (MI) elements to
detect magnetic field and a control IC in a small
package.
Features
3-axis Magnetic Sensor using MI Elements
2
I C Interface
12bit / 14bit Digital Output
Input Voltage Range (AVDD):
1.7V to 3.6V
Input Voltage Range (DVDD):
1.7V to 3.6V
Operating Current (100SPS):
0.15mA(Typ)
Magnetic Measurable Range:
±1200μT(Typ)
Magnetic Sensitivity:
0.042μT/LSB(Typ)
Maximum Exposed Field:
1000mT
Operating Temperature Range:
-40°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
2.00mm x 2.00mm x 1.00mm
MLGA010V020A
Applications
Wristwatch
Mobile phone, Smartphone
Typical Application Circuit
BM1422AGMV
AVDD
MI Sensor
X axis
MI Sensor
Z axis
AD Converter
MI Sensor
Y axis
Regulator
(Internal)
VREG
GND
ADDR
Logic
Serial
I/F
DVDD
SCL
SDA
DRDY
TEST1
TEST2
〇Product structure : Silicon monolithic integrated circuit
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OPEN
〇This product has no designed protection against radioactive rays
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 5
Electrical Characteristics................................................................................................................................................................. 6
Typical Performance Curves ........................................................................................................................................................... 7
Figure 1. AVDD PowerDown Current .......................................................................................................................................... 7
Figure 2. AVDD PowerDown Current .......................................................................................................................................... 7
Figure 3. DVDD PowerDown Current .......................................................................................................................................... 7
Figure 4. DVDD PowerDown Current .......................................................................................................................................... 7
Figure 5. Average Current during Measurement ......................................................................................................................... 8
Figure 6. Measurement Time ...................................................................................................................................................... 8
Figure 7. Output Characteristic ................................................................................................................................................... 8
2
I C bus Timing Characteristics ........................................................................................................................................................ 9
2
I C bus Communication .................................................................................................................................................................. 9
2
I C bus Slave address .................................................................................................................................................................. 10
Register Map ................................................................................................................................................................................ 10
Control Sequence ......................................................................................................................................................................... 15
Application Example ..................................................................................................................................................................... 19
I/O equivalent circuit ..................................................................................................................................................................... 20
Operational Notes ......................................................................................................................................................................... 21
Ordering Information ..................................................................................................................................................................... 23
Marking Diagrams ......................................................................................................................................................................... 23
Physical Dimension, Tape and Reel Information ........................................................................................................................... 24
Revision History ............................................................................................................................................................................ 25
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Pin Configuration
1PIN Mark
Bottom View
Top View
2
3
X-axis
10
4
9
5
8
7
Z-axis
Y-axis
1
6
Above arrows indicate North-pole as “+”.
Pin Description
Pin No.
Pin Name
1
AVDD
Analog circuit power supply
2
GND
Ground
3
VREG
Internal regulator output
4
TEST1
Test pin
5
SDA
6
TEST2
Function
(Note 1)
(Note 2)
(Note 3)
2
I C signal data I/O
Test pin
(Note 3)
2
7
SCL
I C signal clock input
8
DRDY
Data ready output pin
9
ADDR
I C programmable address bit
10
DVDD
2
(Note 4)
(Note 5)
Digital circuit power supply
(Note 1) Please place a bypass capacitor between AVDD and GND in the proximity of the terminals.
(Note 2) Please place a bypass capacitor between VREG and GND in the proximity of the terminals.
Please set a bypass capacitor of 1.0uF between VREG and GND
(Note 3) Use as Non-Connection (NC).
(Note 4) Please connect to DVDD or GND.
(Note 5) Please place a bypass capacitor between DVDD and GND in the proximity of the terminals.
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Block Diagram
BM1422AGMV
AVDD
MI Sensor
X axis
MI Sensor
Y axis
Regulator
(Internal)
Circuit for
MI Sensors
GND
PGA
MI Sensor
Z axis
VREG
Voltage
Adjustment
ADC
DVDD
Thermal
Sensor
Logic
ADDR
SCL
Serial
I/F
SDA
DRDY
TEST1
TEST2
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage (AVDD)
Vdd_a
4.5
V
Supply Voltage (DVDD)
Vdd_d
4.5
V
Input Voltage
Vin
-0.3 to +(Vdd_d+0.3)
V
Operating Temperature Range
Topr
-40 to +85
°C
Storage Temperature Range
Tstg
-40 to +125
°C
Maximum Exposed Field
Mef
-1000 to +1000
mT
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance
(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 3)
(Note 4)
2s2p
Unit
MLGA010V020A
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
θJA
317.3
191.5
°C/W
ΨJT
60
41
°C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Rating
Unit
Supply Voltage (AVDD)
Vdd_a
+1.7 to +3.6
V
Supply Voltage (DVDD)
Vdd_d
+1.7 to +3.6
V
fSCL
MAX 400
kHz
2
I C Clock Frequency
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Electrical Characteristics (Unless otherwise specified AVDD=1.8V, DVDD=1.8V, GND=0.0V, Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Idd
-
150
300
µA
Output Data Rate = 100SPS
Iss
-
1.5
5
µA
ALL Power Down
Low-level Input Voltage
VIL
GND
-
0.3 *
DVDD
V
High-level Input Voltage
VIH
-
DVDD
V
Low-level Input Current
IIL
0.7 *
DVDD
-10
-
0
µA
VIL = GND
High-level Input Current
IIH
0
-
µA
VIH = DVDD
Low-level Output Voltage
VOL
GND
-
10
0.2 *
DVDD
V
IL = -0.3mA
High-level Output Voltage
VOH
0.8 *
DVDD
-
DVDD
V
IL = 0.3mA
Low-level Input Current
IIL2
-10
-
0
µA
VIL = GND
High-level Input Current
IIH2
0
-
µA
At HiZ, VIH = DVDD
Low-level Output Voltage
VOL2
GND
-
10
0.2 *
DVDD
V
IL = -3mA
Rm
-
±300
-
µT
Current Consumption
Average Current during
Measurement
Stand-by-mode Current
Conditions
Logic
Serial Communication
Magnetic Sensor
Moving Range
(Note 1)
Measurable Range
Ra
-
±1200
-
µT
Lin1
-
0.5
2
%FS
Rm = ±200µT
Lin2
-
1.0
2.8
%FS
Rm = ±200µT
Vofs
-
0
-
Magnetic Field = 0µT
Magnetic Sensitivity
DeltaV
-
0.042
-
Measurement Time
Tms
-
0.5
-
LSB
µT/
LSB
msec
X,Y-axis Linearity
Z-axis Linearity
(Note 2)
(Note 2)
Output Offset
Average 4times
(Note1) Measurable Range: Overall measurable range within which preset operating range can be fit by adjusting appropriate offsets.
(Note2) Linearity [%FS] = Output Error / Rm = (output – ideal output) / Rm
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Typical Performance Curves
5
5
4
4
Static Current [uA]
Static Current [uA]
(Unless otherwise specified, Ta25C, AVDD=1.8V, DVDD=1.8V, GND=0.0V)
3
2
1
3
2
1
0
0
1.6
2.1
2.6
AVDD [V]
3.1
3.6
-50
5
5
4
4
3
2
2
1
0
0
2.1
2.6
DVDD [V]
3.1
-50
3.6
Figure 3. DVDD PowerDown Current
Voltage Dependency
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100
3
1
1.6
0
25
50
75
Ambient Temperature [°C]
Figure 2. AVDD PowerDown Current
Temperature Dependency
Static Current [uA]
Static Current [uA]
Figure 1. AVDD PowerDown Current
Voltage Dependency
-25
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 4. DVDD PowerDown Current
Temperature Dependency
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Typical Performance Curves
- continued
0.5
3.0
0.4
2.5
Measurement Time [msec]
Active Current [mA]
(Unless otherwise specified, Ta25C, AVDD=1.8V, DVDD=1.8V, GND=0.0V)
0.3
0.2
0.1
2.0
1.5
1.0
0.5
0.0
0.0
0
2
4
6
8
10 12
Average Time
14
16
18
0
Figure 5. Average Current during Measurement
Averaging Dependency (100SPS)
2
4
6
8 10 12
Average Time
14
16
18
Figure 6. Measurement Time
Averaging Dependency
8000
6000
Output Code [LSB]
4000
2000
0
-2000
-4000
-6000
-8000
-300
-200 -100
0
100 200
Magnetic Field [uT]
300
Figure 7. Output Characteristic
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2
I C bus Timing Characteristics (Unless otherwise specified DVDD =1.8V, Ta = 25°C)
S : Restart
S : Start
VIH
SDA
S : Start
VIH
VIL
VIL
VIL
P : Stop
VIH
VIH
VIL
tBUF
tHD;STA
tSU;DAT
VIH
SCL
VIL
tLOW
tHD;STA
VIH
VIH
VIL
VIH
VIH
VIH
VIL
tHIGH
tHD;DAT
Parameter
tSU;STA
tSU;STO
Symbol
Min.
Typ.
Max.
Units
2
fSCL
0
-
400
kHz
2
tLOW
1.3
-
-
µs
2
tHIGH
0.6
-
-
µs
tSU;STA
0.6
-
-
µs
tHD;STA
0.6
-
-
µs
I C SCL Clock frequency
I C ‘L’ Period of the SCL Clock
I C ‘H’ Period of the SCL Clock
2
I C Setup Time for Repeated START
Condition
2
I C Hold Time (Repeated) START
Condition
2
I C Data Setup Time
tSU;DAT
100
-
-
ns
2
tHD;DAT
0
-
-
µs
2
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
I C Data Hold Time
I C Setup Time for STOP Condition
2
I C Bus Free Time between a STOP and
START Condition
Conditions
2
I C bus Communication
1. Main write format
(1) Indicate register address
S
Slave Address
W
0
ACK
Indicate register address
ACK
Indicate register address
ACK
P
(2) Write to data register after indicating register address
S
Slave Address
Data specified at register
address field
W
0
ACK
ACK
・・・
ACK
Data specified at register
address field + N
ACK
P
NACK
P
NACK
P
2. Main read format
(1) Read data after indicate register address (Master issues restart condition)
S
Slave Address
W
0
ACK
S
Slave Address
R
1
ACK
Data specified at register
address field + 1
ACK
・・・
Indicate register address
ACK
Data specified at register
address field
ACK
ACK
Data specified at register
address field + N
(2) Case of read data
S
Slave Address
Data specified at register
address field + 1
R
1
ACK
ACK
・・・
Data specified at register
address field
ACK
from master to slave
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ACK
Data specified at register
address field + N
from slave to master
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2
I C bus Slave address
2
Selectable I C Slave Address
( ADDR=L: 0001110, ADDR=H: 0001111 )
Register Map
Address
(Note 1)
Register Name
0x0D
R/W
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
ODR [1:0]
0
FS1
0
R
INFO [7:0]
R
INFO [15:8]
R
WIA [7:0]
R
DATAX [7:0]
R
DATAX [15:8]
R
DATAY [7:0]
R
DATAY [15:8]
R
DATAZ [7:0]
R
DATAZ [15:8]
INFO
0x0E
0x0F
WIA
0x10
DATAX
0x11
0x12
DATAY
0x13
0x14
DATAZ
0x15
0x18
STA1
0x1B
RD_
DRDY
OUT_
BIT
RST_
LV
0
0
0
0
DREN
DRP
0
0
RW
0
FORC
E
0
0
0
0
0
0
RW
0
0
0
0
0
R
0
CNTL1
RW
PC1
0x1C
CNTL2
RW
0x1D
CNTL3
0x40
AVE_A
0x5C
0
0
AVE_A [2:0]
W
RSTB_LV [7:0]
W
RSTB_LV [15:8]
R
TEMP [7:0]
R
TEMP [15:8]
RW
OFF_X [7:0]
RW
OFF_X [15:8]
RW
OFF_Y [7:0]
RW
OFF_Y [15:8]
RW
OFF_Z [7:0]
RW
OFF_Z [15:8]
R
FINEOUTPUTX [7:0]
R
FINEOUTPUTX [15:8]
R
FINEOUTPUTY [7:0]
R
FINEOUTPUTY [15:8]
R
FINEOUTPUTZ [7:0]
R
FINEOUTPUTZ [15:8]
R
GAIN_PARA_X [7:0]
R
GAIN_PARA_X [15:8]
R
GAIN_PARA_Y [7:0]
R
GAIN_PARA_Y [15:8]
CNTL4
0x5D
0x60
TEMP
0x61
0x6C
OFF_X
0x6D
0x72
OFF_Y
0x73
0x78
OFF_Z
0x79
0x90
FINEOUTPUTX
0x91
0x92
FINEOUTPUTY
0x93
0x94
FINEOUTPUTZ
0x95
0x9C
GAIN_PARA_X
0x9D
0x9E
GAIN_PARA_Y
0x9F
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BM1422AGMV
0xA0
R
GAIN_PARA_Z [7:0]
R
GAIN_PARA_Z [15:8]
GAIN_PARA_Z
0xA1
(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.
It is the following conditions to be able to access each register.
Condition
Accessible Register
Supply Power
CNTL1
CNTL4
INFO
WIA
OFF_X,Y,Z
Supply Power
(CNTL1) PC1=1
(CNTL1) RST_LV=0
(CNTL4) RSTB_LV=1
STA1
CNTL2
CNTL3
AVE_A
OFF_X,Y,Z
Supply Power
(CNTL1) PC1=1
(CNTL1) RST_LV=0
(CNTL4) RSTB_LV=1
(CNTL3) FORCE=1 after first access
DATAX,Y,Z
TEMP
FINEOUTPUTX,Y,Z
Supply Power
(CNTL1) PC1=1, FS1=1
(CNTL1) RST_LV=0
(CNTL4) RSTB_LV=1
(CNTL3) FORCE=1 after first access
DATAX,Y,Z
TEMP
FINEOUTPUTX,Y,Z
GAIN_PARA_X,Y,Z
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( 0x0D/0x0E ) Information Register
Fields
Function
INFO [7:0]
Information LSB : 0x01
INFO [15:0]
Information MSB : 0x01
( 0x0F) WIA Register
Fields
Function
WIA [7:0]
Who I am : 0x41
( 0x10/0x11, 0x12/0x13, 0x14/0x15 ) Output Data Register
Fields
DATAX [7:0]
Xch Output value
LSB
DATAX [15:0]
Xch Output value
MSB
DATAY [7:0]
Ych Output value
LSB
DATAY [15:0]
Ych Output value
MSB
DATAZ [7:0]
Zch Output value
LSB
DATAZ [15:0]
Zch Output value
MSB
Function
default value 0xXXXX
signed 16bit
-2048d(0xF800) to +2047d(0x07FF) [Register OUT_BIT=0]
-8192d(0xE000) to +8191d(0x1FFF) [Register OUT_BIT=1]
( 0x18 ) Status Register
Fields
RD_DRDY
Function
This bit is output to the DRDY to inform the preparation status
of the measured data
0 : Not ready NG
1 : Ready OK
default value 0x00
( 0x1B ) Control setting1 Register
Fields
Function
PC1
Power Control
0 : PowerDown
OUT_BIT
Output Data bit setting
RST_LV
Logic reset control
0 : Reset release 1 : Reset
Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1
ODR [1:0]
Measurement output data rates
00 : 10Hz , 10 : 20Hz , 01 : 100Hz , 11 : 1kHz
FS1
Measurement mode setting
0 : Continuous mode , 1 : Single mode
1 : Active
0 : 12bit Output , 1 : 14bit Output
default value 0x22
( 0x1C ) Control setting2 Register
Fields
Function
DREN
DRDY terminal enable setting
0 : Disable , 1 : Enable
DRP
DRDY terminal active setting
0 : Low active , 1 : High active
default value 0x04
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( 0x1D ) Control setting3 Register
Fields
Function
AD start measurement trigger at continuous mode (FS1=0)
and single mode (FS1=1)
1: Start measurement
※Register is automatic clear “0” after write data “1”
※Write data “0” is invalid
※If write data “1” on measurement way, restart measurement
FORCE
default value 0x00
( 0x40 ) Average time Register
Fields
Function
Average Time
000:4times, 001:1times, 010:2times, 011:8times,
AVE_A
100:16times
default value 0x00
( 0x5C/0x5D ) Control setting4 Register
Fields
Function
RSTB_LV [7:0]
Reserved
(ignore write data)
RSTB_LV [15:8]
RSTB_LV=1 by write access (ignore write data)
Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1
RSTB_LV=0 by write PC1(CNTL1)=0
default value 0x04
( 0x60/0x61 ) Temperature value Register
Fields
Function
TEMP [7:0]
Temperature value
LSB
TEMP [15:8]
Temperature value
MSB
default value 0xXXXX
unsigned 16bit
0d(0x0000) to +4095d(0x0FFF) [Register OUT_BIT=0]
0d(0x0000) to +16383d(0x3FFF) [Register OUT_BIT=1]
( 0x6C/0x6D, 0x72/0x73, 0x78/0x79 ) Output Data Register
Fields
Function
OFF_X [7:0]
Xch Offset value
OFF_X [15:8]
Reserved Write ”00000000”
OFF_Y [7:0]
Ych Offset value
OFF_Y [15:8]
Reserved Write ”00000000”
OFF_Z [7:0]
Zch Offset value
OFF_Z [15:8]
Reserved Write ”00000000”
default value 0x30
unsigned 8bit
1d(0x01)
to +95d(0x5F)
( 0x90/0x91, 0x92/0x93, 0x94/0x95 ) Fine output Register
Fields
Function
FINEOUTPUTX [7:0]
DATAX value per OFF_X LSB
FINEOUTPUTX [15:0]
DATAX value per OFF_X MSB
FINEOUTPUTY [7:0]
DATAY value per OFF_Y LSB
FINEOUTPUTY [15:0]
DATAY value per OFF_Y MSB
FINEOUTPUTZ [7:0]
DATAZ value per OFF_Z
LSB
FINEOUTPUTZ [15:0]
DATAZ value per OFF_Z
MSB
default value 0xXXXX
unsigned 16bit
0d(0x0000) to
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+16383d(0x3FFF)
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BM1422AGMV
( 0x9C/0x9D, 0x9E/0x9F, 0xA0/0xA1 ) Axis interference Register
Fields
GAIN_PARA_X [7:0]
Axis interference Xch to Zch
GAIN_PARA_X [15:0]
Axis interference Xch to Ych
GAIN_PARA_Y [7:0]
Axis interference Ych to Zch
GAIN_PARA_Y [15:0]
Axis interference Ych to Xch
GAIN_PARA_Z [7:0]
Axis interference Zch to Ych
GAIN_PARA_Z [15:0]
Axis interference Zch to Xch
Function
default value 0xXX
unsigned 8bit
0d(0x00)
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
to +255d(0xFF)
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Control Sequence
1.
Control Sequence
1.1 Power supply start-up sequence
The order of starting up the power supplies of AVDD and DVDD is arbitrary, when they are supplied from different
2
sources. Please do the command control by I C after all powers are supplied.
1.7V
AVDD, DVDD
> 0.1ms
I2C
command
Address：1Bh
Data[7] = 1
command
Address：5Ch, 5Dh
Data：00h
command
> 1ms
1.2 Power supply end sequence
1.7V
AVDD, DVDD
0.4V
> 0ms
I2C
> 1ms
command
Address：1Bh
Data[7] = 0
Data[5] = 1
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BM1422AGMV
2.
Measurement sequence
There are the following two kinds of measurement modes
Continuous Mode
BM1422AGMV is measured at specified cycle (ODR=10,20,100,1kHz) at the cycle.
Single Mode
BM1422AGMV is measured by the measurement request from the host.
(Power Off)
・Supply AVDD and DVDD voltage
Power Down
・Send “Logic OFF” command
・Send “Logic ON” command
Ready
・Finish Measurement @ Single mode
・Send “Select Single mode” command
@ continuous mode
・Send Setting Command
・Send “Measurement Start” Command
Measurment
2.1 Continuous Mode
(Send command example)
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
OFF_X
OFF_Y
OFF_Z
CNTL3
DATAX
Step5
DATAY
DATAZ
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x72
0x78
0x1D
0x10
0x11
0x12
0x13
0x14
0x15
BM1422AGMV
Host
Case of 12bit Output Data
Start
Data
0x80
0x00
0x00
0x0C
offx_dat
offy_dat
offz_dat
0x40
Start
Supply Power
POR
Power Down
Step1
Write CNTL1 : PC1=1, RST_LV=0
Write CNTL1 : ODR=00
Write CNTL1 : FS1=0
Write CNTL4 : RSTB_LV=1
Active
Read
Timer=10SPS
Read
Continuous Mode
Step2
Write CNTL2 : DREN=1
Read
DREN=1
Step3
Write OFF_X : offx_dat (*1)
Write OFF_Y : offy_dat (*1)
Write OFF_Z : offz_dat (*1)
Step4
(Send command example)
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
OFF_X
OFF_Y
OFF_Z
CNTL3
DATAX
Step5
Write CNTL3 : FORCE=1
Case of 14bit Output Data
DATAY
DATAZ
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TSZ22111 • 15 • 001
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x72
0x78
0x1D
0x10
0x11
0x12
0x13
0x14
0x15
Data
0xC0
0x00
0x00
0x0C
offx_dat
offy_dat
offz_dat
0x40
Measurement(x,y,z)
No
Does DRDY output
the rising edge?
DRDY High
Yes
Step5
Read DATAX, Y, Z
DRDY Low
Timer (wait)
Read
Read
(*1) The value is obtained at offset adjustment.
If not obtained yet, then skip.
Read
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2.2 Single Mode
(Send command example)
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
OFF_X
OFF_Y
OFF_Z
CNTL3
DATAX
Step5
DATAY
DATAZ
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x72
0x78
0x1D
0x10
0x11
0x12
0x13
0x14
0x15
BM1422AGMV
Host
Case of 12bit Output Data
Start
Data
0x82
0x00
0x00
0x0C
offx_dat
offy_dat
offz_dat
0x40
Start
Supply Power
POR
Power Down
Step1
Step2
Write CNTL1 : PC1=1, RST_LV=0
Write CNTL4 : RSTB_LV=1
Active
Write CNTL2 : DREN=1
DREN=1
Read
Read
Step3
Read
Step4
Write OFF_X : offx_dat (*1)
Write OFF_Y : offy_dat (*1)
Write OFF_Z : offz_dat (*1)
Write CNTL3 : FORCE=1
Measurement(x,y,z)
(Send command example)
Case of 14bit Output Data
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
OFF_X
OFF_Y
OFF_Z
CNTL3
DATAX
Step5
DATAY
DATAZ
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TSZ22111 • 15 • 001
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x72
0x78
0x1D
0x10
0x11
0x12
0x13
0x14
0x15
No
Data
0xC2
0x00
0x00
0x0C
offx_dat
offy_dat
offz_dat
0x40
Does DRDY output
the rising edge?
DRDY High
Yes
Step5
Read DATAX, Y, Z
DRDY Low
(*1) The value is obtained at offset adjustment.
If not obtained yet, then skip.
Read
Read
Read
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3.
Offset Adjustment
Offset adjustment sequence make the output value around zero under the normal magnetic environment.
After measuring the following parameter, HOST should save it in memory, and it needs to be set
after applying power supply to BM1422AGMV.
Parameter
offx_dat
offy_dat
offz_dat
Description
Adjusted value of Xch offset
Adjusted value of Ych offset
Adjusted value of Zch offset
BM1422AGMV
Host
Start
(Send command example)
Register Name
CNTL1
Step1
CNTL4
Step2
Step3
Step4
CNTL2
OFF_X
CNTL3
Step5
DATAX
Step6
OFF_X
Start
Case of 12bit Output Data
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x1D
0x10
0x11
0x6C
Supply Power
Data
0x82
0x00
0x00
0x0C
wk_dat
0x40
POR
Power Down
Step1
Step2
Read
Write CNTL1 : PC1=1, RST_LV=0
Write CNTL4 : RSTB_LV=1
Active
Write CNTL2 : DREN=1
DREN=1
offx_dat
diff_x = 9999
wk_dat = 1
(Send command example)
Case of 14bit Output Data
Register Name
CNTL1
Step1
CNTL4
Step2
Step3
Step4
CNTL2
OFF_X
CNTL3
Step5
DATAX
Step6
OFF_X
Address
0x1B
0x5C
0x5D
0x1C
0x6C
0x1D
0x10
0x11
0x6C
Data
0xC2
0x00
0x00
0x0C
wk_dat
0x40
Step3
Write OFF_X : wk_dat
Step4
Write CNTL3 : FORCE=1
Measurement(x,y,z)
DRDY rising edge
Step5
Read DATAX
If(diff_x > abs(DATAX)) then
offx_dat = wk_dat;
diff_x = abs(DATAX);
End if
Read
offx_dat
wk_dat = wk_dat + 1
Yes
wk_dat < 96
No
Step6
Write OFF_X : offx_dat
End
End
Write only Xch offset adjustment
Ych and Zch should also be performed
When OFF_X, OFF_Y, OFF_Z are changed in the same magnetic field environment, the change directions of
the output are as follows
OFF_X,Y,Z +
OFF_X,Y,Z -
X axis
-
+
Y axis
-
+
Z axis
-
+
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TSZ22111 • 15 • 001
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BM1422AGMV
Application Example
BM1422AGMV
1.0uF
AVDD
MI Sensor
X axis
MI Sensor
Z axis
AD Converter
MI Sensor
Y axis
Regulator
(Internal)
1.0uF
VREG
GND
ADDR
Logic
0.01uF
DVDD
Serial
I/F
SCL
SDA
DRDY
TEST1
TEST2
Host
OPEN
OPEN
(Note) Sensor property may change due to around magnetic parts. We recommend calibrating
the sensitivity and origin point of magnetic sensors after mounting.
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TSZ22111 • 15 • 001
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BM1422AGMV
I/O equivalent circuit
Pin name
Equivalent Circuit Diagram
SCL
Pin name
Equivalent Circuit Diagram
SDA
DVDD
DVDD
DRDY
DVDD
DVDD
ADDR
DVDD
DVDD
DVDD
TEST1
TEST2
DVDD
DVDD
DVDD
DVDD
VREG
AVDD
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
AVDD
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BM1422AGMV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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BM1422AGMV
Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Absolute Maximum Ratings
Operate the IC such that the output voltage, output current, and power dissipation are all within the Absolute
Maximum Ratings.
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BM1422AGMV
Ordering Information
B
M
1
4
2
Part Number
2
A
G
M
V
-
Package
GMV:MLGA010V020A
Z
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
MLGA010V020A
(TOP VIEW)
1PIN MARK
Part Number Marking
A D
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LOT Number
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BM1422AGMV
Physical Dimension, Tape and Reel Information
Package Name
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
MLGA010V020A
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BM1422AGMV
Revision History
Date
Revision
17.Oct.2016
001
Changes
New Release
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TSZ22111 • 15 • 001
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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